A signal transmission line and a product with signal transmission function

Abstract

This invention provides a signal transmission line and a product with signal transmission function, including a transmission line, a heat insulation structure, and a connector. The port of the transmission line is connected to the heat insulation structure. The heat insulation structure has at least three solder pads for soldering and through holes with beryllium copper cladding on the inner wall. Each solder pad communicates with at least one through hole. The connector is soldered to the solder pads and communicates with the transmission line through the through holes. The signal transmission line provided by this invention significantly improves heat leakage of the signal transmission line by adding a heat insulation structure between the connector and the transmission line and connecting the connector and the transmission line through the solder pads and through holes on the heat insulation structure, with minimal impact on signal transmission performance. It also features a simple structure and low cost.

Description

Technical Field

[0001] This invention relates to the field of signal transmission technology, specifically to a signal transmission line and a product with signal transmission function. Background Technology

[0002] Currently, signal transmission at low temperatures mainly relies on cryogenic coaxial cables. Both the inner and outer conductors of cryogenic coaxial cables use beryllium copper, which provides excellent thermal insulation. However, cryogenic coaxial cables are space-consuming, lack flexibility, and are expensive due to their reliance on imports. Therefore, researchers are considering using microstrip lines or striplines as flexible transmission lines to replace cryogenic coaxial cables. Using microstrip lines or striplines as flexible transmission lines offers advantages such as smaller footprint, better flexibility, and lower cost. However, ordinary microstrip lines and striplines, with their copper-based metal components, exhibit relatively high heat leakage even when electrical performance requirements are met. Summary of the Invention

[0003] To address the technical problems in the background art, the present invention provides a signal transmission line that greatly improves heat leakage and has minimal impact on electrical performance.

[0004] This invention is achieved through the following technical solution:

[0005] A signal transmission line includes a transmission line, a heat insulation structure, and a connector; the port of the transmission line is connected to the heat insulation structure; the heat insulation structure has at least three solder pads for soldering, and the heat insulation structure also has through holes, the inner walls of which are clad with beryllium copper; each solder pad communicates with at least one through hole. The connector is soldered to the solder pads, and the connector communicates with the transmission line through the through holes.

[0006] Furthermore, the heat insulation structure includes a heat insulation board, and the material of the heat insulation board is epoxy resin board FR4.

[0007] Furthermore, the thickness of the heat insulation board is 0.6 mm to 2 mm.

[0008] Furthermore, there are three solder pads and three vias, and the three vias are through holes evenly distributed on the heat insulation plate.

[0009] Furthermore, the pads are formed by copper plating on the upper surface of the thermal insulation structure.

[0010] Furthermore, the shape of the pad is rectangular.

[0011] Furthermore, the transmission line includes a transmission line dielectric layer and a transmission line conductor layer, wherein the material of the transmission line dielectric layer is polyimide; and the transmission line conductor layer is a layer of copper attached to the transmission line dielectric layer.

[0012] Furthermore, the thickness of the transmission line dielectric layer is 50 micrometers to 100 micrometers.

[0013] Furthermore, the connector includes a connector conductor layer and a connector dielectric layer, both of which are columnar. The connector conductor layer is concentrically disposed inside the dielectric layer, and the connector conductor layer is soldered to the pad.

[0014] The present invention also provides a product with signal transmission function, which uses any of the signal transmission lines described above.

[0015] By adopting the above technical solution, the signal transmission line and the product with signal transmission function provided by the present invention have the following beneficial effects: The present invention greatly improves the heat leakage of the signal transmission line by adding a heat insulation structure between the connector and the transmission line and connecting the connector and the transmission line through the solder pads and through holes on the heat insulation structure, and has very little impact on the signal transmission performance. The structure is simple and the cost is low. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a signal transmission line according to an embodiment of the present invention;

[0017] Figure 2 for Figure 1 Schematic diagram of the intermediate connector;

[0018] Figure 3 for Figure 1 Schematic diagram of the thermal insulation structure;

[0019] Figure 4 for Figure 1 A schematic diagram of the structure of a transmission line;

[0020] Figure 5 This is a schematic diagram of a microstrip line structure without thermal insulation, with a length of 100mm.

[0021] Figure 6 This is a schematic diagram of the transmission characteristics of a 100mm long microstrip line without thermal insulation within a 20GHz bandwidth.

[0022] Figure 7 This is a schematic diagram of a 100mm long microstrip line with added thermal insulation.

[0023] Figure 8 This is a schematic diagram of the transmission characteristics of a 100mm long microstrip line with a heat-insulated structure within a 20GHz bandwidth.

[0024] In the figure, the corresponding reference numerals are: 1-transmission line, 11-transmission line dielectric layer, 12-transmission line conductor layer, 2-thermal insulation structure, 21-pad, 22-via, 23-thermal insulation plate, 3-connector, 31-connector conductor layer, 32-connector dielectric layer. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0026] like Figures 1 to 4 As shown, this embodiment of the invention provides a signal transmission line, including a transmission line 1, a heat insulation structure 2, and a connector 3. The port of the transmission line 1 is connected to the heat insulation structure 2. The heat insulation structure 2 has at least three solder pads 21 for soldering, and through holes 22 with beryllium copper cladding on their inner walls. Each solder pad 21 communicates with at least one through hole 22. The connector 3 is soldered to the solder pads 21 and communicates with the transmission line 1 through the through holes 22.

[0027] The signal transmission line provided in this embodiment of the invention improves heat leakage of the signal transmission line by adding a heat insulation structure 2 between the connector 3 and the transmission line 1, and connecting the connector 3 and the transmission line 1 through the solder pad 21 and the through hole 22 on the heat insulation structure 2. This has a very small impact on the signal transmission performance, and the structure is simple and the cost is low.

[0028] In another embodiment of the present invention, in order to achieve a better heat leakage prevention effect, the heat insulation structure 2 includes a heat insulation board 23, and the material of the heat insulation board 23 can be epoxy resin board FR4.

[0029] In another embodiment of the present invention, the thickness of the heat insulation plate 23 is 0.6 mm to 2 mm.

[0030] In another embodiment of the present invention, the number of the pads 21 and the vias 22 is three, and the three vias 22 are through holes evenly distributed on the heat insulation plate 23.

[0031] The number of solder pads 21 and the number of vias 22 are both three, and the three vias 22 are through holes evenly distributed on the heat insulation plate 23. It should be noted that the embodiments of the present invention do not limit the number or distribution of the vias 22. In other embodiments of the present invention, each solder pad 21 may also be connected to multiple vias 22.

[0032] In another embodiment of the present invention, the pad 21 is formed by copper plating on the upper surface of the heat insulation structure 2. It should be noted that the embodiments of the present invention do not limit the type of surface plating material of the heat insulation structure 2; in other embodiments of the present invention, the surface plating material of the heat insulation structure 2 may also be gold, silver, or other conductors.

[0033] In another embodiment of the present invention, the shape of the pad 21 is rectangular. It should be noted that the embodiments of the present invention do not limit the shape of the pad 21; in other embodiments of the present invention, the shape of the pad 21 may also be circular, triangular, or other shapes.

[0034] In another embodiment of the present invention, the transmission line 1 includes a transmission line dielectric layer 11 and a transmission line conductor layer 12, wherein the material of the transmission line dielectric layer 11 is a polyimide (PI) sheet; and the transmission line conductor layer 12 is a layer of copper attached to the transmission line dielectric layer 11. Figure 4 As shown in the embodiment of the present invention, the transmission line 1 can be a transmission line conductor layer 12 attached to both sides of the transmission line dielectric layer 11. It should be noted that the embodiment of the present invention does not limit the material of the transmission line conductor layer 12. In other embodiments of the present invention, the material of the transmission line conductor layer 12 can also be other conductors such as gold or silver.

[0035] In another embodiment of the present invention, the thickness of the transmission line dielectric layer 11 is 50 micrometers to 100 micrometers.

[0036] In another embodiment of the invention, such as Figure 2 As shown, the connector 3 includes a connector conductor layer 31 and a connector dielectric layer 32. Both the connector conductor layer 31 and the connector dielectric layer 32 are columnar in shape. The connector conductor layer 31 is concentrically disposed inside the connector dielectric layer 32. The connector conductor layer 31 is soldered to the pad 21 and is connected to the transmission line 1 through the via 22.

[0037] In conjunction with the above embodiments, the present invention will be described in more detail below with reference to a specific implementation method.

[0038] like Figures 1 to 4As shown in the figure, a specific embodiment of the present invention provides a signal transmission line, including a transmission line 1, a heat insulation structure 2, and a connector 3; wherein, the heat insulation structure 2 includes a heat insulation plate 23 with a thickness of 0.6 mm to 2 mm, and the heat insulation plate 23 is made of a rigid PCB board with single-sided copper plating (such as epoxy resin board FR4). The two ends of the transmission line 1 are connected to the heat insulation structure 2; the heat insulation structure 2 is provided with three rectangular pads 21 for soldering, and the pads 21 are formed by copper plating on the upper surface of the heat insulation structure 2. The heat insulation plate 23 has a number of through holes 22 evenly distributed on it, the same number as the number of pads 21. The inner wall of the through holes 22 is clad with beryllium copper. Each through hole 22 is connected to each pad 21. The connector 3 is soldered to the pad 21 located in the middle. Specifically, the connector 3 includes a connector conductor layer 31 and a connector dielectric layer 32. Both the connector conductor layer 31 and the connector dielectric layer 32 are columnar. The connector conductor layer 31 is concentrically disposed inside the connector dielectric layer 32. The connector conductor layer 31 is soldered to the pad 21 and is connected to the transmission line 1 through the through holes 22. The transmission line includes a transmission line dielectric layer 11 with a thickness of 50 micrometers to 100 micrometers and a transmission line conductor layer 12. The transmission line 1 may have the transmission line conductor layer 12 attached to both sides of the transmission line dielectric layer 11. The material of the transmission line dielectric layer 11 is a polyimide (PI) sheet. The transmission line conductor layer 12 is a layer of copper attached to the transmission line dielectric layer 11. In a specific embodiment of the present invention, the connection between the connector 3 and the transmission line 1 is achieved through a through-hole 22 penetrating the heat insulation plate 23. This specific embodiment of the present invention can achieve good impedance matching and meet the required transmission performance while reducing heat conduction. It can greatly improve heat leakage at low temperatures with minimal impact on signal transmission performance.

[0039] The following example uses FR4 board with single-sided copper plating for insulation panel 23 and PI board with double-sided copper plating for transmission line 11 as an example to provide experimental data to further illustrate the insulation effect of the added insulation design and its impact on the transmission performance of the transmission line. The FR4 board is 1mm thick, the PI board is 50µm thick, both have 1 / 2 oz (ounce) copper plating, and the inner wall of the through-hole 22 is plated with beryllium copper. Figure 5 and Figure 8 As can be seen, taking a microstrip line as an example, a 100mm long microstrip line without thermal insulation has a transmission loss of approximately 1.5dB at 10GHz and approximately 2.5dB at 20GHz; while a 100mm long microstrip line with thermal insulation has a transmission loss of approximately 1.6dB at 10GHz and approximately 2.8dB at 20GHz. This demonstrates that adding thermal insulation has a very small impact on the transmission performance of the microstrip line.

[0040] Table 1 compares the heat leakage results of a 100mm long transmission line without insulation and a 100mm long transmission line with insulation under a temperature variation of 4.2K-40K. The embodiments of the present invention further compare the effects of different insulation plate 23 thicknesses, different through-hole sizes 22, and different beryllium copper plating thicknesses on heat leakage. After adding the four insulation designs shown in Table 1, the heat leakage decreased from 15.2mW to 1.3-2.7mW, showing a significant improvement. Furthermore, the following conclusions can be drawn from the table: increasing the thickness of the insulation plate 23 reduces heat leakage; decreasing the diameter of the through-hole 22 on the insulation plate 23 reduces heat leakage; decreasing the thickness of the beryllium copper plating on the inner wall of the through-hole 22 reduces heat leakage.

[0041] Table 1

[0042]

[0043] In summary, the specific embodiment of this invention, by adding a heat insulation structure 2 between the connector 3 and the transmission line 1, significantly improves heat leakage (from 15.2mW to 1.3-2.7mW) with minimal impact on the transmission performance of the transmission line 1. This specific embodiment of the invention is particularly suitable for interconnection transmission at low temperatures and interconnection transmission between low and room temperature.

[0044] Furthermore, this invention also provides a product with signal transmission function, which utilizes the signal transmission line described in any of the above embodiments and implementation methods.

[0045] The above description discloses only preferred embodiments and implementation methods of the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A signal transmission line, characterized in that: Includes transmission lines, insulation structures, and connectors; The port of the transmission line is connected to the heat insulation structure; The heat insulation structure has at least three solder pads for welding, and the heat insulation structure has through holes with beryllium copper lining the inner wall of the through holes; each solder pad is connected to at least one through hole; the heat insulation structure includes a heat insulation plate with a thickness of 0.6 mm to 2 mm; the heat insulation plate has through holes evenly distributed in the same number as the solder pads; The connector is soldered onto the pad and is connected to the transmission line through the via; the connector includes a connector conductor layer and a connector dielectric layer, both of which are columnar.

2. The signal transmission line according to claim 1, characterized in that: The insulation board is made of epoxy resin board FR4.

3. The signal transmission line according to claim 2, characterized in that: The number of the solder pads and the number of the vias are both three, and the three vias are through holes evenly distributed on the heat insulation plate.

4. The signal transmission line according to claim 3, characterized in that: The pads are formed by copper plating on the upper surface of the insulation structure.

5. The signal transmission line according to claim 4, characterized in that: The pads are rectangular in shape.

6. The signal transmission line according to claim 1, characterized in that: The transmission line includes a transmission line dielectric layer and a transmission line conductor layer. The material of the transmission line dielectric layer is polyimide. The transmission line conductor layer is a layer of copper attached to the transmission line dielectric layer.

7. The signal transmission line according to claim 6, characterized in that: The thickness of the transmission line dielectric layer is 50 micrometers to 100 micrometers.

8. The signal transmission line according to claim 1, characterized in that: The connector conductor layer is concentrically disposed inside the dielectric layer, and the connector conductor layer is soldered to the pad.

9. A product with signal transmission function, characterized in that, The signal transmission line as described in any one of claims 1 to 8 is used.

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