A double feeder for wafer sandblasting

Abstract

The invention discloses a wafer sandblasting double feeder, which comprises a sandblasting machine, wherein the sandblasting machine comprises a sandblasting machine body and a crawler conveyor, wherein the sandblasting machine body is arranged at the upper end of the middle part of the crawler conveyor, and the two ends of the crawler conveyor extend out of the sandblasting machine body; two sandblasting machines are arranged, and the sandblasting machines are respectively arranged on the left and right sides of the double feeder, and the double feeder comprises a workbench, a double feeding mechanism, a handling mechanism, a conveying mechanism and a material discharging manipulator; the invention can feed materials to two sandblasting machines at the same time through the arrangement of the double feeding mechanism, thereby reducing the frequency of feeding; the wafers can be automatically transported through the handling mechanism, the conveying mechanism and the material discharging manipulator, thereby improving the automation degree of the equipment, avoiding manual handling, greatly improving the efficiency of wafer sandblasting, reducing the stacking rate of wafers through the arrangement of an air flotation separation module and a conveying mechanism, improving the stability of wafer sandblasting feeding, and ensuring the sandblasting quality.

Description

Technical Field

[0001] The invention relates to the technical field of wafer sandblasting, in particular to a wafer sandblasting double feeder. Background Art

[0002] During the wafer production process, after the silicon ingot is cut into wafers, some wafers may need to be sandblasted to facilitate subsequent processing of the wafers. Due to the impact and cutting effect of the abrasive on the workpiece surface, the sandblasting machine makes the surface of the workpiece obtain a certain degree of cleanliness and different roughness, so that the mechanical properties of the workpiece surface are improved, thereby improving the fatigue resistance of the workpiece, increasing the adhesion between it and the coating, and eliminating the residual stress of the workpiece and improving the surface hardness of the substrate.

[0003] The existing sandblasting machine has the problem of being unable to perform automatic loading operation during operation. The wafers that need to be sandblasted need to be manually placed on the conveyor belt inside the sandblasting machine. Manual loading takes a long time, resulting in low efficiency of the sandblasting machine. During the manual loading process, it is easy for the wafer to collide with the sandblasting machine or with each other, causing the wafer to have corners missing or broken, which will lead to an increase in the fragmentation rate. In addition, manual loading is unstable, which will not only cause the problem of stacking, but also cause the problem of overlapping placement positions, resulting in insufficient sandblasting and affecting the production yield of semiconductor wafers. To address the above problems, we propose a dual-feeder machine for wafer sandblasting. Summary of the invention

[0004] The object of the present invention is to provide a wafer sandblasting dual feeder to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A wafer sandblasting double feeder comprises a sandblasting machine, the sandblasting machine comprises a sandblasting machine body and a crawler conveyor, the sandblasting machine body is arranged at the upper end of the middle part of the crawler conveyor, and the two ends of the crawler conveyor extend out of the sandblasting machine body;

[0007] Two sandblasting machines are provided, and the sandblasting machines are respectively arranged on the left and right sides of the double feeder. The double feeder includes a workbench, a double feeding mechanism, a handling mechanism, a conveying mechanism and a discharge robot. The double feeding mechanism is arranged in the front of the workbench, and includes a left feeding mechanism and a right feeding mechanism with the same structure, which are used to store wafers. Two conveying mechanisms are provided and arranged in the middle of the workbench. The two conveying mechanisms are respectively arranged on the rear sides of the left feeding mechanism and the right feeding mechanism. The handling mechanism is used to transport the wafer from the double feeding mechanism to the conveying mechanism. There are two of them and they are respectively arranged on the outsides of the two conveying mechanisms. The conveying mechanism is provided with a sensor for detecting single and double wafers. When the wafer on the conveying mechanism is a single wafer, the wafer is transported to the crawler conveyor by the discharge robot. Two discharge robots are symmetrically provided on the left and right, and they are respectively arranged on the rear sides of the two conveying mechanisms.

[0008] Preferably, the left feeding mechanism includes a first mounting plate, a lifting mechanism, a top plate, a lifting rod, a positioning seat and a positioning rod. The lifting mechanism is fixed below the first mounting plate, and its output end is fixedly connected to the lifting rod. The upper end of the lifting rod is fixedly mounted with a top plate. A positioning seat is arranged above the first mounting plate, and a plurality of positioning rods are arranged on the positioning seat in a circular array. An avoidance hole for passing the top plate is opened at the center of the positioning seat, and the wafer is placed in the middle of the positioning rod.

[0009] Preferably, the left feeding mechanism also includes a guide seat, a first cylinder and a support. A guide groove is provided on the guide seat. The rear side of the guide groove is a straight groove, and the front side is an arc groove. The left and right ends of the positioning seat are arranged in the guide groove through a pin shaft. The first cylinder is arranged at the rear of the positioning seat. The piston rod of the first cylinder is rotatably connected to the rear end of the positioning seat, and the rear end is rotatably mounted on the support.

[0010] Preferably, the lifting mechanism includes a second mounting plate, a first motor, a fixing rod, a screw and a threaded seat. The second mounting plate is arranged parallel to and below the first mounting plate. The fixing rod is fixed between the first mounting plate and the second mounting plate. The first motor is fixed to the lower end of the second mounting plate. The motor shaft of the first motor extends out of the second mounting plate and is fixedly connected to the screw. A threaded seat is installed on the screw, and the lower end of the lifting rod is installed on the threaded seat.

[0011] Preferably, the transport mechanism includes a third mounting plate, a second cylinder, a support block, a guide rail, a slider, a fourth mounting plate, a third cylinder and a first suction cup. The third mounting plate is fixed on the workbench, the second cylinder and the support block are mounted on the upper end of the third mounting plate, the guide rail is fixed to the upper end of the support block, the slider is mounted on the guide rail for forward and backward sliding, the piston rod of the second cylinder is connected to the slider, the fourth mounting plate is fixedly mounted on the upper end of the slider, the third cylinder is mounted on the fourth mounting plate, and the first suction cup is mounted on the lower end of the third cylinder.

[0012] Preferably, the conveying mechanism includes a conveyor, a second motor, a sensor and a material receiving box. The conveyor is arranged along the Y-axis and is transmission-connected to the second motor. The material receiving box is arranged at the tail of the conveyor away from the dual feeding mechanism and is tilted downward. Several sensors are provided and installed on the transmission path of the wafer.

[0013] Preferably, the unloading robot includes a first linear module arranged along the X-axis direction, a second linear module arranged along the Y-axis direction, a third linear module arranged along the Z-axis direction, an L-shaped block and a second suction cup. The second linear module is fixed on the moving end of the first linear module, the third linear module is fixed on the moving end of the second linear module, the L-shaped block is fixed on the moving end of the third linear module, and a second suction cup is installed at the lower end thereof.

[0014] Preferably, an air flotation separation module is provided on one side of the dual-feeding mechanism, and the air flotation separation module is used to blow air to separate a plurality of wafers on the top layer in the dual-feeding mechanism.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the present invention, unsandblasted wafers are placed in the left feeding mechanism and the right feeding mechanism of the double feeding mechanism, and the wafers are transported from the left feeding mechanism and the right feeding mechanism to the two conveying mechanisms by two transporting mechanisms. When the wafers on the conveying mechanism are single wafers, the wafers on the two conveying mechanisms are transported to the crawler conveyors of the sandblasting machines on the left and right sides by two unloading manipulators. The present invention can feed the two sandblasting machines at the same time through the setting of the double feeding mechanism, thereby reducing the frequency of loading. The wafers can be automatically transported by the transporting mechanism, the conveying mechanism and the unloading manipulator, thereby improving the automation degree of the equipment, avoiding manual transport, and greatly improving the efficiency of wafer sandblasting.

[0017] 2. The present invention separates several wafers on the top layer of the double feeding mechanism by blowing air through an air flotation separation module, so that the transport mechanism only transports one wafer to the conveying mechanism at a time. The conveying mechanism reaches the detection area during the process of transporting the wafers, and detects whether the wafers overlap, whether they are single or double wafers through sensors. If there are double or multiple wafers, they are transported to a receiving box, and if there is a single wafer, they are transported to a sandblasting machine. Through the arrangement of the air flotation separation module and the conveying mechanism, the stacking rate of the wafers is reduced, the stability of the wafer sandblasting feeding is improved, and the sandblasting quality is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 The schematic diagram of the overall structure of the present invention omits the protective cover structure;

[0020] Figure 3It is a schematic diagram of the structure of the dual feeder of the present invention;

[0021] Figure 4 It is a structural schematic diagram of the sandblasting machine of the present invention;

[0022] Figure 5 It is a schematic structural diagram of the dual feeding mechanism of the present invention;

[0023] Figure 6 This is a schematic diagram of the double feeding mechanism structure from another angle of the present invention;

[0024] Figure 7 It is a schematic diagram of the structure of the transport mechanism of the present invention;

[0025] Figure 8 It is a schematic diagram of the structure of the conveying mechanism of the present invention;

[0026] Fig. 9 This is a schematic diagram of the structure of the material discharging robot of the present invention;

[0027] Fig.10 For the present invention Figure 3 Schematic diagram of the enlarged structure of area A in .

[0028] In the figure: 1 double feeder, 2 sandblasting machine, 21 sandblasting machine body, 22 crawler conveyor, 3 workbench, 4 double feeding mechanism, 41 first mounting plate, 42 lifting mechanism, 421 second mounting plate, 422 first motor, 423 fixing rod, 424 screw, 425 threaded seat, 43 top plate, 44 lifting rod, 45 positioning seat, 46 positioning rod, 47 guide seat, 471 guide groove, 48 first cylinder, 49 support, 5 transport mechanism, 51 third mounting plate, 52 second cylinder, 53 support block, 54 guide rail, 55 slider, 56 fourth mounting plate, 57 third cylinder, 58 first suction cup, 6 conveying mechanism, 61 conveyor, 62 second motor, 63 sensor, 64 receiving box, 7 unloading manipulator, 71 first linear module, 72 second linear module, 73 third linear module, 74 L-type block, 75 second suction cup, 8 wafer, 9 air flotation separation module. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] See also Figure 1 —10. The present invention provides a technical solution:

[0031] A wafer sandblasting double feeder includes a sandblasting machine 2, which includes a sandblasting machine body 21 and a crawler conveyor 22. The sandblasting machine body 21 is arranged at the upper end of the middle of the crawler conveyor 22, and both ends of the crawler conveyor 22 extend out of the sandblasting machine body 21.

[0032] There are two sandblasting machines 2, which are respectively arranged on the left and right sides of the double feeder 1. The double feeder 1 includes a workbench 3, a double feeding mechanism 4, a handling mechanism 5, a conveying mechanism 6 and a discharge robot 7. The double feeding mechanism 4 is arranged in the front of the workbench 3, and includes a left feeding mechanism and a right feeding mechanism with the same structure, which are used to store wafers 8. There are two conveying mechanisms 6 and they are arranged in the middle of the workbench 3. The two conveying mechanisms 6 are respectively arranged on the rear sides of the left feeding mechanism and the right feeding mechanism. The handling mechanism 5 is used to transport the wafer 8 from the double feeding mechanism 4 to the conveying mechanism 6. There are two of them and they are respectively arranged on the outsides of the two conveying mechanisms 6. The conveying mechanism 6 is provided with a sensor 63 for detecting single or double wafers. When the wafer 8 on the conveying mechanism 6 is a single wafer, the wafer 8 is transported to the crawler conveyor 22 by the discharge robot 7. There are two discharge robots 7 symmetrically arranged on the left and right, which are respectively arranged on the rear sides of the two conveying mechanisms 6.

[0033] The left feeding mechanism includes a first mounting plate 41, a lifting mechanism 42, a top plate 43, a lifting rod 44, a positioning seat 45 and a positioning rod 46. The lifting mechanism 42 is fixed below the first mounting plate 41, and its output end is fixedly connected to the lifting rod 44. The top plate 43 is fixedly installed on the upper end of the lifting rod 44. A positioning seat 45 is arranged above the first mounting plate 41. A plurality of positioning rods 46 are arranged in a circular array on the positioning seat 45. An avoidance hole for passing the top plate 43 is opened at the center of the positioning seat 45. The wafer 8 is placed in the middle of the positioning rod 46, and the wafer 8 is pushed up by the lifting mechanism 42, the top plate 43 and the lifting rod 44, so that the top wafer 8 is always kept at the same height, which is convenient for the conveying mechanism 5 to carry out the conveying.

[0034] The left feeding mechanism also includes a guide seat 47, a first cylinder 48 and a support 49. A guide groove 471 is provided on the guide seat 47. The rear side of the guide groove 471 is a straight groove, and the front side thereof is an arc groove. The left and right ends of the positioning seat 45 are arranged in the guide groove 471 through a pin shaft. The rear of the positioning seat 45 is provided with a first cylinder 48. The piston rod of the first cylinder 48 is rotatably connected to the rear end of the positioning seat 45, and the rear end thereof is rotatably mounted on the support 49. When there is no wafer 8 in the double feeding mechanism 4, the first cylinder 48 is started to push the positioning seat 45 to move along the guide groove 471. Since the front side of the guide groove 471 is an arc groove, the positioning rod 46 changes from vertically upward to inclined, which is convenient for loading the wafer 8. After loading, the first cylinder 48 is reset to pull the positioning rod 46 back to the vertically upward position.

[0035] The lifting mechanism 42 includes a second mounting plate 421, a first motor 422, a fixing rod 423, a screw rod 424 and a threaded seat 425. The second mounting plate 421 is arranged parallel to the lower side of the first mounting plate 41. The fixing rod 423 is fixed between the first mounting plate 41 and the second mounting plate 421. The first motor 422 is fixed to the lower end of the second mounting plate 421. The motor shaft of the first motor 422 extends out of the second mounting plate 421 and is fixedly connected to the screw rod 424. The screw rod 424 is provided with a threaded seat 425. The lower end of the lifting rod 44 is provided with the threaded seat 425. The threaded seat 425 is driven to rise or fall by the rotation of the first motor 422 and the screw rod 424, thereby driving the lifting rod 44 and the top plate 43 to rise or fall.

[0036] The transport mechanism 5 includes a third mounting plate 51, a second cylinder 52, a support block 53, a guide rail 54, a slider 55, a fourth mounting plate 56, a third cylinder 57 and a first suction cup 58. The third mounting plate 51 is fixed on the workbench 3. The second cylinder 52 and the support block 53 are mounted on the upper end of the third mounting plate 51. The guide rail 54 is fixed on the upper end of the support block 53. The slider 55 is mounted on the guide rail 54 to slide forward and backward. The piston rod of the second cylinder 52 is connected to the slider 55. The fourth mounting plate 56 is fixedly mounted on the upper end of the slider 55. The third cylinder 57 is mounted on the fourth mounting plate 56. The first suction cup 58 is mounted on the lower end of the third cylinder 57. The slider 55 is driven by the second cylinder 52 to slide forward and backward along the guide rail 54, and the first suction cup 58 is driven by the fourth mounting plate 56 and the third cylinder 57 to move forward and backward.

[0037] The second cylinder 52 extends out, the first suction cup 58 reaches above the dual feeding mechanism 4, and after sucking the wafer 8 from the dual feeding mechanism 4, the second cylinder 52 is retracted, the first suction cup 58 reaches above the conveying mechanism 6, and then the piston rod of the third cylinder 57 extends downward, and the wafer 8 is placed on the conveyor 61 through the first suction cup 58. After placement, the third cylinder is reset and the above actions are repeated.

[0038] The conveying mechanism 6 includes a conveyor 61, a second motor 62, a sensor 63 and a material receiving box 64. The conveyor 61 is arranged along the Y-axis and is transmission-connected to the second motor 62. The material receiving box 64 is arranged at the tail of the conveyor 61 away from the dual feeding mechanism 4 and is tilted downward. Three sensors 63 are arranged and are installed on the conveying path of the wafer 8. One sensor 63 is arranged in the middle of the conveyor 61 and two sensors 63 are arranged at the rear of the conveyor 61.

[0039] The unloading robot 7 includes a first linear module 71 arranged along the X-axis direction, a second linear module 72 arranged along the Y-axis direction, a third linear module 73 arranged along the Z-axis direction, an L-shaped block 74 and a second suction cup 75. The second linear module 72 is fixed on the moving end of the first linear module 71, the third linear module 73 is fixed on the moving end of the second linear module 72, the L-shaped block 74 is fixed on the moving end of the third linear module 73, and a second suction cup 75 is installed at the lower end.

[0040] The third linear module 73 drives the second suction cup 75 to move downward to absorb the wafer 8 on the conveyor 61. After absorbing the wafer 8, the second suction cup 75 rises; then the first linear module 71 moves the second suction cup 75 to the left or right to transfer the wafer 8 on the conveyor 61 to the top of the crawler conveyor 22, and the third linear module 73 drives the second suction cup 75 to move downward to place the wafer 8 on the crawler conveyor 22. After placement, the third linear module 73 and the first linear module 71 are reset and the above actions are repeated. In addition, the placement position of the wafer 8 can be adjusted by moving the second linear module 72 forward and backward, such as placing two rows forward and backward on the crawler conveyor 22, staggered to avoid overlapping of two wafers 8.

[0041] An air flotation separation module 9 is disposed on one side of the dual-feeding mechanism 4 . The air flotation separation module 9 is used to blow air to separate a plurality of wafers 8 on the top layer of the dual-feeding mechanism 4 , so as to facilitate the first suction cup 58 to suck them.

[0042] The working principle of the present invention is:

[0043] The unsandblasted wafers 8 are placed in the left and right feeding mechanisms of the double feeding mechanism 4, and the air flotation separation module 9 blows air to separate the five to six wafers 8 on the top layer in the double feeding mechanism 4, so that the transport mechanism 5 only transports one wafer 8 to the conveying mechanism 6 at a time, and the wafers 8 are transported from the left and right feeding mechanisms to the two conveying mechanisms 6 by the two transport mechanisms 5. The conveying mechanism 6 reaches the detection area during the process of transporting the wafers 8, and the sensor 63 detects whether the wafers 8 overlap, whether they are single or double wafers. If they are double or multiple wafers, they are transported to the receiving box 64. If they are single wafers, the two unloading manipulators 7 transport the wafers 8 on the two conveying mechanisms 6 to the crawler conveyors 22 of the sandblasting machine 2 on the left and right sides respectively, and then sandblasted by the sandblasting machine body 21.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer sandblasting dual feeder, comprising a sandblasting machine (2), the sandblasting machine (2) comprising a sandblasting machine body (21) and a crawler conveyor (22), the sandblasting machine body (21) being arranged at the upper end of the middle part of the crawler conveyor (22), and the two ends of the crawler conveyor (22) extending out of the sandblasting machine body (21), characterized in that: Two sandblasting machines (2) are provided. The sandblasting machines (2) are respectively arranged on the left and right sides of the double feeder (1). The double feeder (1) comprises a workbench (3), a double feeder mechanism (4), a handling mechanism (5), a conveying mechanism (6) and a material placing robot (7). The double feeder mechanism (4) is arranged in front of the workbench (3), and comprises a left feeder mechanism and a right feeder mechanism of the same structure, which are used to store wafers (8). Two conveying mechanisms (6) are provided and arranged in the middle of the workbench (3). The two conveying mechanisms (6) are respectively arranged on the left feeder mechanism and the right feeder mechanism. At the rear side of the right feeding mechanism, the transport mechanism (5) is used to transport the wafer (8) from the double feeding mechanism (4) to the conveying mechanism (6), and two of the transport mechanisms (5) are provided and are respectively arranged on the outside of the two conveying mechanisms (6). The conveying mechanism (6) is provided with a sensor (63) for detecting single or double wafers. When the wafer (8) on the conveying mechanism (6) is a single wafer, the wafer (8) is transported to the crawler conveyor (22) by a discharge manipulator (7). Two of the discharge manipulators (7) are symmetrically arranged on the left and right, and are respectively arranged at the rear sides of the two conveying mechanisms (6); The left feeding mechanism comprises a first mounting plate (41), a lifting mechanism (42), a top plate (43), a lifting rod (44), a positioning seat (45) and a positioning rod (46); the lifting mechanism (42) is fixed below the first mounting plate (41), and its output end is fixedly connected to the lifting rod (44); the top plate (43) is fixedly mounted on the upper end of the lifting rod (44); a positioning seat (45) is arranged above the first mounting plate (41); a plurality of positioning rods (46) are arranged in a circular array on the positioning seat (45); a avoidance hole for passing the top plate (43) is opened at the center of the positioning seat (45); and the wafer (8) is placed in the middle of the positioning rod (46); The left feeding mechanism also includes a guide seat (47), a first cylinder (48) and a support (49). The guide seat (47) is provided with a guide groove (471). The rear side of the guide groove (471) is a straight groove, and the front side is an arc groove. The left and right ends of the positioning seat (45) are arranged in the guide groove (471) through a pin shaft. The rear of the positioning seat (45) is provided with a first cylinder (48). The piston rod of the first cylinder (48) is rotatably connected to the rear end of the positioning seat (45), and the rear end is rotatably mounted on the support (49). The conveying mechanism (6) comprises a conveyor (61), a second motor (62), a sensor (63) and a material receiving box (64); the conveyor (61) is arranged along the Y-axis and is transmission-connected to the second motor (62); the material receiving box (64) is arranged at the tail of the conveyor (61) away from the dual feeding mechanism (4) and is tilted downward; a plurality of sensors (63) are arranged and are installed on the transmission path of the wafer (8).

2. A wafer sandblasting dual feeder according to claim 1, characterized in that: The lifting mechanism (42) comprises a second mounting plate (421), a first motor (422), a fixing rod (423), a screw rod (424) and a threaded seat (425); the second mounting plate (421) is arranged parallel to the lower side of the first mounting plate (41); the fixing rod (423) is fixed between the first mounting plate (41) and the second mounting plate (421); the first motor (422) is fixed at the lower end of the second mounting plate (421); the motor shaft of the first motor (422) extends out of the second mounting plate (421) and is fixedly connected to the screw rod (424); a threaded seat (425) is installed on the screw rod (424); and the lower end of the lifting rod (44) is installed on the threaded seat (425).

3. A wafer sandblasting dual feeder according to claim 1, characterized in that: The transport mechanism (5) comprises a third mounting plate (51), a second cylinder (52), a support block (53), a guide rail (54), a slider (55), a fourth mounting plate (56), a third cylinder (57) and a first suction cup (58); the third mounting plate (51) is fixed on the workbench (3); the second cylinder (52) and the support block (53) are mounted on the upper end of the third mounting plate (51); the guide rail (54) is fixed on the upper end of the support block (53); the slider (55) is mounted on the guide rail (54) for forward and backward sliding; the piston rod of the second cylinder (52) is connected to the slider (55); the fourth mounting plate (56) is fixedly mounted on the upper end of the slider (55); the third cylinder (57) is mounted on the fourth mounting plate (56); and the first suction cup (58) is mounted on the lower end of the third cylinder (57).

4. The wafer sandblasting dual feeder according to claim 1, characterized in that: The material discharging robot (7) comprises a first linear module (71) arranged along the X-axis direction, a second linear module (72) arranged along the Y-axis direction, a third linear module (73) arranged along the Z-axis direction, an L-shaped block (74) and a second suction cup (75), wherein the second linear module (72) is fixed on the moving end of the first linear module (71), the third linear module (73) is fixed on the moving end of the second linear module (72), the L-shaped block (74) is fixed on the moving end of the third linear module (73), and the second suction cup (75) is installed at the lower end.

5. The wafer sandblasting dual feeder according to claim 1, characterized in that: An air flotation separation module (9) is provided on one side of the dual-feeding mechanism (4), and the air flotation separation module (9) is used to blow air to separate a plurality of wafers (8) on the top layer of the dual-feeding mechanism (4).

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