Fingerprint sensor package and smart card including the same

Abstract

A fingerprint sensor package and a smart card including the same are provided. The fingerprint sensor package includes: a package substrate including an upper surface and a lower surface opposite to the upper surface, wherein a sensing area and a peripheral area surrounding the sensing area are defined in the upper surface; a plurality of first sensing patterns arranged in the sensing area, separated from each other in a first direction, and extending in a second direction intersecting the first direction; a plurality of second sensing patterns arranged in the sensing area, separated from each other in the second direction, and extending in the first direction; a coating member covering the sensing area; an upper ground pattern located in the peripheral area and separated from the coating member to surround the coating member in the first and second directions; and a controller chip located on the lower surface of the package substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based upon and claims the benefit of priority from Korean Patent Application No. 10-2020-0141450 filed on October 28, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] At least some example embodiments of the inventive concepts relate to a fingerprint sensor package and a smart card including the same, and more particularly, to a fingerprint sensor package including a ground pattern and a smart card including the same. Background Art

[0004] Fingerprint recognition technology is used to reduce or prevent several security incidents by providing a registration and verification procedure that recognizes the user's fingerprint. Specifically, fingerprint recognition technology is applied to network protection of individuals and organizations, protection of various content and data, secure access to financial information, etc. Fingerprint sensors obtain user fingerprint information by using optical methods, electrostatic capacitance methods, ultrasonic methods, thermal sensing methods, etc. The latest trend in the fingerprint sensor industry is to achieve compact size and thin thickness of products while being able to reduce costs. Therefore, a fingerprint sensor package is required to maintain the reliability and sensitivity of fingerprint information acquisition, reduce the overall size and height, and be economically feasible. Summary of the Invention

[0005] At least some example embodiments of the inventive concepts provide a fingerprint sensor package with high reliability for reducing or preventing financial accidents caused by theft or loss of a smart card and a smart card including the same.

[0006] Objects of exemplary embodiments of the inventive concept are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood from the following description by those skilled in the art.

[0007] According to at least one example embodiment of the present inventive concepts, a fingerprint sensor package includes: a packaging substrate including an upper surface and a lower surface opposite to the upper surface, wherein a sensing area and a peripheral area surrounding the sensing area are defined in the upper surface; a plurality of first sensing patterns arranged in the sensing area, separated from each other in a first direction, and extending in a second direction intersecting the first direction; a plurality of second sensing patterns arranged in the sensing area, separated from each other in the second direction, and extending in the first direction; a coating member covering the sensing area; an upper ground pattern located in the peripheral area and separated from the coating member to surround the coating member in the first and second directions; and a controller chip located on the lower surface of the packaging substrate; wherein the plurality of first sensing patterns and the plurality of second sensing patterns are separated from each other in a third direction perpendicular to the first and second directions, and the plurality of first sensing patterns and the plurality of second sensing patterns constitute a plurality of capacitors, wherein each of the plurality of capacitors includes a sensing pattern among the plurality of first sensing patterns as a first conductor and a sensing pattern among the plurality of second sensing patterns as a second conductor.

[0008] According to at least one example embodiment of the present inventive concept, a fingerprint sensor package includes: a packaging substrate on which a sensing area and a peripheral area surrounding the sensing area are defined, wherein the packaging substrate has a rounded rectangular planar shape; and a controller chip mounted on the packaging substrate and configured to determine whether a recognized fingerprint corresponds to a registered fingerprint, wherein the packaging substrate includes: a base layer; a coating member, an upper protective layer located between the coating member and an upper surface of the base layer, and an upper insulating layer located between the upper protective layer and the upper surface of the base layer; a molding member, a lower protective layer located between the molding member and a lower surface of the base layer, and a lower insulating layer located between the lower protective layer and the lower surface of the base layer; a first conductive pattern, at least some of the first conductive patterns being covered by the lower protective layer, the first conductive pattern including a first ground pattern, a power pattern, a signal pattern, and a first sensing pad; a second conductive pattern, the second conductive pattern being covered by the lower insulating layer and including a second ground pattern and a connecting pad connected to the first ground pattern. a second sensing pad connected to the first sensing pad; a third conductive pattern, the third conductive pattern being covered by the upper insulating layer and including a third ground pattern connected to the second ground pattern, a first sensing pattern connected to some of the second sensing pads, and a third sensing pad connected to other of the second sensing pads, the first sensing patterns being separated from each other in a first direction and extending in a second direction intersecting the first direction; and a fourth conductive pattern, at least some of the fourth conductive patterns being covered by the upper protective layer, the fourth conductive pattern including a fourth ground pattern connected to the third ground pattern and a second sensing pattern connected to the third sensing pad, the second sensing patterns being separated from each other in the second direction and extending in the first direction, wherein the first sensing pattern and the second sensing pattern are located in the sensing area, wherein the controller chip is located in the molding member, and wherein the fourth ground pattern is located in the peripheral area and is separated from the coating member to surround the coating member in the first direction and the second direction.

[0009] According to at least one example embodiment of the present invention, a smart card includes: a card body having a groove area; a security chip storing financial information; and a fingerprint sensor package configured to sense a user's fingerprint and transmit a signal about the sensing result to the security chip, wherein the fingerprint sensor package includes: a packaging substrate having an upper surface and a lower surface opposite to the upper surface, wherein a sensing area and a peripheral area surrounding the sensing area are defined in the upper surface; a plurality of first sensing patterns located in the sensing area, separated from each other in a first direction, and extending in a second direction intersecting the first direction; a plurality of second sensing patterns, wherein the plurality of second sensing patterns are located in the sensing area, separated from each other in a first direction, and extending in a second direction intersecting the first direction; and a plurality of second sensing patterns. located in the sensing area, separated from each other in the second direction, and extending in the first direction; a coating member, the coating member covering the sensing area; and an upper ground pattern, the upper ground pattern being located in the peripheral area and separated from the coating member to surround the coating member in the first direction and the second direction; wherein the plurality of first sensing patterns and the plurality of second sensing patterns are separated from each other in a third direction perpendicular to the first direction and the second direction, and the plurality of first sensing patterns and the plurality of second sensing patterns constitute a plurality of capacitors, wherein each of the plurality of capacitors includes a sensing pattern among the plurality of first sensing patterns as a first conductor and a sensing pattern among the plurality of second sensing patterns as a second conductor.

[0010] According to at least one example embodiment of the present invention, there is provided a smart card comprising: a card substrate; a security chip mounted on the card substrate and storing financial information; a fingerprint sensor package mounted on the card substrate and configured to sense a user's fingerprint and transmit a signal about the sensing result to the security chip; a controller chip mounted in the fingerprint sensor package and configured to determine whether the identified fingerprint corresponds to a registered fingerprint; and passive elements mounted in the fingerprint sensor package and arranged around the controller chip, wherein the fingerprint sensor package comprises: a sensing area configured to sense the user's fingerprint; a coating member covering the sensing area; and a peripheral area surrounding the coating member and including an upper ground pattern for removing sensing noise generated by the user, wherein the upper ground pattern comprises a closed line separated from the coating member and having a uniform width. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other features and advantages of the exemplary embodiments of the present invention will become more readily understood by describing in detail exemplary embodiments of the present invention with reference to the accompanying drawings. The accompanying drawings are intended to depict exemplary embodiments of the present invention and should not be construed as limiting the intended scope of the claims. Unless explicitly noted, the accompanying drawings should not be considered to be drawn to scale.

[0012] Figure 1 is a schematic perspective view illustrating a smart card according to at least some example embodiments of the inventive concepts;

[0013] Figures 2A to 2D shows a fingerprint sensor package according to at least some example embodiments of the inventive concepts;

[0014] Figures 3 to 7 is a top view illustrating a fingerprint sensor package according to at least some example embodiments of the inventive concepts;

[0015] Figures 8 to 10 is a cross-sectional view illustrating a fingerprint sensor package according to at least some example embodiments of the inventive concepts;

[0016] Figures 11A to 11F A method of manufacturing a smart card according to at least some example embodiments of the inventive concepts is shown in process order; and

[0017] Figure 12 is a top plan view illustrating a mobile device including a fingerprint sensor package according to at least some example embodiments of the inventive concepts. DETAILED DESCRIPTION

[0018] In the field of the present invention, as a convention, in the accompanying drawings, embodiments are described and shown according to functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically realized by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, storage elements, wiring connections, etc., and these circuits can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case of blocks, units and / or modules implemented by microprocessors or other similar hardware, software (for example, microcode) can be used to program them to perform the various functions discussed herein, and they can be driven alternatively by firmware and / or software. Alternatively, each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs certain functions and a processor (for example, one or more programmed microprocessors and related circuits) that performs other functions. In addition, without departing from the scope of the present invention, each block, unit and / or module of the embodiment can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, without departing from the scope of the inventive concept, the blocks, units and / or modules of the embodiments may be physically combined into more complex blocks, units and / or modules.

[0019] Figure 1 is a schematic perspective view illustrating a smart card according to an example embodiment.

[0020] Reference Figure 1 , the smart card 1 may include a fingerprint sensor package 10 , a security chip 11 , a display unit 12 and a power button 13 .

[0021] The smart card 1 may also include information displayed on a credit card or debit card in the related art, such as a card number identifier, an expiration date identifier, a user name, etc. The smart card 1 may also include a radio frequency (RF) chip.

[0022] The fingerprint sensor package 10 can recognize a user's fingerprint when the user touches the fingerprint sensor. The fingerprint sensor package 10 can determine whether the recognized fingerprint corresponds to the registered fingerprint by comparing the recognized fingerprint with the registered fingerprint. After the smart card 1 is switched to the open state, the fingerprint sensor package 10 can operate.

[0023] The security chip 11 can store encoded financial information. When the recognized fingerprint matches the registered fingerprint, the security chip 11 can authorize the user of the smart card 1 to make a payment. For example, because the security chip 11 authorizes the user to make a payment based on the recognition result using the fingerprint sensor package 10, the smart card 1 can reduce or prevent financial accidents caused by theft or loss.

[0024] The display unit 12 can display whether the recognized fingerprint corresponds to the registered fingerprint, the on / off status, etc. The display unit 12 can display characters, numbers, special symbols, etc., and may also include a light-emitting portion if necessary. However, depending on the type of smart card 1, the display unit 12 may not be included.

[0025] The power button 13 can be used to turn the smart card 1 on or off. By controlling the power button 13, the smart card 1 can be turned on from the off state, and vice versa. Furthermore, the smart card 1 can automatically turn off after a set period of time has passed since it was turned on. However, depending on the type of smart card 1, the power button 13 may not be included.

[0026] In some example embodiments, the thickness TH of the smart card 1 may be in a range of about 0.5 mm to about 1 mm. In addition, according to international standards, the thickness TH of the smart card 1 may be about 0.84 mm or less. For example, the thickness TH of the smart card 1 may be about 0.76 mm or less.

[0027] The smart card 1 according to this example embodiment may include a fingerprint sensor package 10 and have a thickness similar to that of a credit card or debit card of the related art, thereby providing a high level of user experience. In addition, the cross-sectional view of the smart card 1 of this example embodiment may be similar to that in Figure 11F The cross-sectional views schematically shown in FIG. 1 are essentially the same.

[0028] Figures 2A to 2D A fingerprint sensor package according to an example embodiment is shown.

[0029] In detail, Figure 2A is a schematic top view of the layout of the fingerprint sensor package 10, Figure 2B It is along Figure 2A A cross-sectional view taken along line BB', Figure 2C It is along Figure 2A A cross-sectional view taken along line CC', and Figure 2D yes Figure 2A FIG. 1 is an enlarged partial top view of area DD.

[0030] Also refer to Figures 2A to 2D , the fingerprint sensor package 10 may include a package substrate 100 , a controller chip 210 , passive elements 220 , a molding member 230 , a coating member 300 , and various types of conductive layers.

[0031] The fingerprint sensor package 10 according to the present example embodiment may have a total thickness of approximately 0.76 mm or less. In some example embodiments, the total thickness of the fingerprint sensor package 10 may be approximately 0.5 mm or less. For example, the total thickness of the fingerprint sensor package 10 may be in the range of approximately 0.1 mm to approximately 0.4 mm. Therefore, the fingerprint sensor package 10 can be easily applied to various products that are flexible or require a small thickness (for example, the smart card described above).

[0032] The package substrate 100 may include a base layer 111, a lower insulating layer 113, an upper insulating layer 115, a lower protective layer 117, and an upper protective layer 119, each of which includes insulating materials. Furthermore, the package substrate 100 may include first conductive patterns 121G, 121P, 121R, 121S, and 121T, second conductive patterns 123G, 123R, and 123T, third conductive patterns 125G, 125R, and 125T, and fourth conductive patterns 127G and 127T, each of which includes conductive materials. Furthermore, the package substrate 100 may include first conductive pathways 131G, 131R, and 131T, second conductive pathways 133G, 133R, and 133T, third conductive pathways 135G, 135R, and 135T, and fourth conductive pathways 137G and 137T, each of which includes conductive materials.

[0033] The package substrate 100 may include a printed circuit board (PCB), for example, a flexible PCB (FPCB). In some example embodiments, the package substrate 100 may be a PCB including multiple conductive layers. The first conductive patterns 121G, 121P, 121R, 121S, and 121T may constitute a first conductive layer, the second conductive patterns 123G, 123R, and 123T may constitute a second conductive layer, the third conductive patterns 125G, 125R, and 125T may constitute a third conductive layer, and the fourth conductive patterns 127G and 127T may constitute a fourth conductive layer. However, the structure and number of conductive layers are not limited thereto.

[0034] The package substrate 100 may have a substantially rectangular planar shape or a square planar shape. A direction parallel to a pair of edges of the package substrate 100 is defined as a first direction (X direction), a direction parallel to the other pair of edges of the package substrate 100 is defined as a second direction (Y direction), and a direction perpendicular to the upper surface of the package substrate 100 is defined as a third direction (Z direction).

[0035] The first length LX of the package substrate 100 in the first direction (X direction) may be in the range of about 10 mm to about 15 mm. The second length LY of the package substrate 100 in the second direction (Y direction) may be in the range of about 10 mm to about 15 mm. For example, the first length LX of the package substrate 100 may be about 12.7 mm, and the second length LY thereof may be about 12.7 mm. However, the first length LX and the second length LY of the package substrate 100 are not limited to the above values.

[0036] In addition, each corner CN of the package substrate 100 may be rounded. In some example embodiments, the curvature radius of the corner CN may be in the range of about 1 mm to about 2 mm. For example, the curvature radius of the corner CN may be about 1.6 mm. The corner CN of the package substrate 100 is rounded, so that when using a stamping device (PM, see Figure 11D ) Cutting package panel (100P, see Figure 11D ) process to effectively reduce or prevent cracks that may form in the corner CN. This will be described in more detail later.

[0037] A sensing region SR, a first contact region CR1, a second contact region CR2, a third contact region CR3, a wiring region YR, and a peripheral region ER may be defined on the package substrate 100. Specifically, the sensing region SR may be an area where the first sensing pattern 125R and the second sensing pattern 127T used for fingerprint recognition are arranged. The first contact region CR1 and the third contact region CR3 may be areas where the first to third conductive paths 131R, 133R, and 135R used to connect the first sensing pattern 125R to the controller chip 210 are arranged. The second contact region CR2 may be an area where the first to fourth conductive paths 131T, 133T, 135T, and 137T used to connect the second sensing pattern 127T to the controller chip 210 are arranged. The wiring region YR may be an area where at least some of the first to fourth conductive paths 131G, 133G, 135G, and 137G used to connect the fourth ground pattern 127G to the controller chip 210 are arranged.

[0038] The sensing region SR may be the central portion of the package substrate 100, but is not limited thereto. In some example embodiments, the sensing region SR may have a square shape. A plurality of first sensing patterns 125R spaced apart from each other in the first direction (X direction) and having a linear shape extending in the second direction (Y direction) and a plurality of second sensing patterns 127T spaced apart from each other in the second direction (Y direction) and having a linear shape extending in the first direction (X direction) may be arranged in the sensing region SR. Therefore, as Figure 2A and Figure 2DAs shown, according to at least some example embodiments of the present inventive concepts, the direction in which the second sensing pattern 127T extends (i.e., the X direction) may be a direction that intersects the direction in which the first sensing pattern 125R extends (i.e., the Y direction). In this specification, directions that intersect each other may refer to directions that are not parallel to each other (e.g., directions that are perpendicular to each other, or directions that otherwise intersect each other). The first contact region CR1 may be formed at one end of the sensing region SR in the second direction (Y direction), and the third contact region CR3 may be formed at the other end thereof. In addition, the second contact region CR2 may be formed at one end of the sensing region SR in the first direction (X direction), and the wiring region YR may be formed at the other end thereof.

[0039] The peripheral region ER may horizontally (on the XY plane) surround the sensing region SR, the first contact region CR1, the second contact region CR2, the third contact region CR3, and the wiring region YR. Ground patterns 121G, 123G, 125G, and 127G for providing a reference potential and shielding sensing noise may be arranged in the peripheral region ER.

[0040] The first sensing pattern 125R may extend in the sensing region SR and the first and third contact regions CR1 and CR3 . The first sensing pattern 125R may be connected to the controller chip 210 via first to third conductive paths 131R, 133R, and 135R arranged in the first and third contact regions CR1 and CR3 .

[0041] Some of the first sensing patterns 125R may be connected to the first to third conductive paths 131R, 133R, and 135R arranged in the first contact region CR1, and other first sensing patterns 125R may be connected to the first to third conductive paths 131R, 133R, and 135R arranged in the third contact region CR3. The first to third conductive paths 131R, 133R, and 135R in the first contact region CR1 and the first to third conductive paths 131R, 133R, and 135R in the third contact region CR3 may all be arranged in a line in the first direction (X direction).

[0042] The first sensing patterns 125R adjacent to each other can be connected to different first to third conductive paths 131R, 133R, and 135R arranged in the first contact region CR1 and the third contact region CR3, respectively. For example, a first sensing pattern 125R can be connected to the first to third conductive paths 131R, 133R, and 135R of the first contact region CR1, and another first sensing pattern 125R next to the first sensing pattern 125R can be connected to the first to third conductive paths 131R, 133R, and 135R of the third contact region CR3. That is, the first sensing patterns 125R adjacent to each other can be electrically isolated from each other.

[0043] The second sensing patterns 127T may extend in the sensing region SR and the second contact region CR2. The second sensing patterns 127T may be connected to the controller chip 210 via the first to fourth conductive paths 131T, 133T, 135T, and 137T arranged in the second contact region CR2. The first to fourth conductive paths 131T, 133T, 135T, and 137T corresponding to adjacent second sensing patterns 127T may be arranged in an alternating zigzag pattern in the second direction (Y direction).

[0044] The first sensing pattern 125R may have a first width W1 as a width in the first direction (X direction), and the second sensing pattern 127T may have a second width W2 as a width in the second direction (Y direction). In some example embodiments, the first width W1 may be greater than the second width W2. For example, the first width W1 may be in a range of about two times to about four times the second width W2. In detail, the first width W1 may be in a range of about 40 μm to about 70 μm, and the second width W2 may be in a range of about 5 μm to about 25 μm. However, the first width W1 and the second width W2 are not limited to the above values.

[0045] The portions of the first sensing patterns 125R and the second sensing patterns 127T that overlap each other in the third direction (Z direction) constitute pixels PX. A first pitch PIX between centers PXC of the pixels PX in the first direction (X direction) may be substantially equal to a second pitch PIY between centers PXC of the pixels PX in the second direction (Y direction), but is not limited thereto. For example, the first pitch PIX and the second pitch PIY may both be within a range of approximately 50 μm to approximately 90 μm.

[0046] The pixel PX may have a combined capacitance value of an area capacitance AC according to the first and second sensing patterns 125R and 127T overlapping each other and a fringe capacitance (not shown) according to the first and second sensing patterns 125R and 127T.

[0047] When the user's fingerprint contacts the coating member 300, the capacitance values ​​corresponding to the pixels PX may change due to the capacitance induced between the second sensing pattern 127T and the user's fingerprint. The change in capacitance value is determined according to the pattern of the user's fingerprint. Therefore, the controller chip 210 can identify the user's fingerprint based on the change in capacitance value of the pixel PX. For example, the controller chip 210 may include: processing circuitry, such as hardware including logic circuitry; a hardware / software combination that executes software; or a combination thereof. For example, the processing circuitry may more specifically include, but is not limited to, one or more of a central processing unit (CPU), a processor core, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit, a microprocessor, an application-specific integrated circuit (ASIC), etc. The processing circuitry may be configured via hardware and / or software to execute and / or control any operations described in this specification performed by the controller chip (e.g., the controller chip 210).

[0048] However, the change in capacitance value may vary not only due to the pattern of the user's fingerprint, but also in part depending on the user's usage environment. That is, because sensing noise may occur depending on the user's usage environment, the change in capacitance value may include errors related to the sensing noise. Therefore, to reduce or minimize sensing noise, the fourth ground pattern 127G can be arranged to horizontally surround the sensing region SR. The fourth ground pattern 127G is arranged above the package substrate 100 and can therefore be referred to as an upper ground pattern.

[0049] The fourth ground pattern 127G may include a closed line pattern horizontally arranged along the outer circumference of the coating member 300 covering the sensing region SR and having a uniform width. As will be described later, the shape of the fourth ground pattern 127G is not limited thereto. From the edge of the coating member 300 to the fourth ground pattern 127G, there may be a first distance D1 in the first direction (X direction) and a second distance D2 in the second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 may be substantially equal to each other. In detail, the first distance D1 and the second distance D2 may both be equal to or greater than approximately 50 μm.

[0050] The base layer 111 may include an insulating material. The base layer 111 may include a resin and glass fiber. The resin included in the base layer 111 may include at least one of a phenolic resin, an epoxy resin, and a polyimide. In some example embodiments, the base layer 111 may include at least one material selected from flame retardant 4 (FR4), tetrafunctional epoxy, polyphenylene ether, epoxy / polyphenylene ether, Thermount, bismaleimide triazine (BT), cyanate ester, polyimide, prepreg, Ajinomoto built-up film (ABF), and a liquid crystal polymer. In other example embodiments, the base layer 111 may include silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof. The glass fiber included in the base layer 111 may be a reinforcing material and may be obtained by bundling glass filaments obtained by melt-spinning a glass material at high temperature. The glass filaments may be a product of ore processing containing silica as a main component.

[0051] For ease of description and understanding, the elements will be described in the order in which they are closer to the base layer 111 .

[0052] The second conductive patterns 123G, 123R, and 123T may be arranged on the lower surface of the base layer 111, and the third conductive patterns 125G, 125R, and 125T may be arranged on the upper surface of the base layer 111. The second conductive patterns 123G, 123R, and 123T and the third conductive patterns 125G, 125R, and 125T may include at least one selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), tin (Sn), lead (Pb), titanium (Ti), chromium (Cr), palladium (Pd), indium (In), zinc (Zn), carbon (C), and alloys thereof. The first conductive patterns 121G, 121P, 121R, 121S, and 121T and the fourth conductive patterns 127G and 127T, which will be described later, may also include the same or substantially the same material as the above.

[0053] The second conductive patterns 123G, 123R, and 123T may include a second ground pattern 123G to which a reference potential is applied, and second sensing pads 123R and 123T. The second ground pattern 123G may be arranged in the sensing region SR, the routing region YR, and the peripheral region ER. The second ground pattern 123G may be horizontally separated from the first to third contact regions CR1, CR2, and CR3. The second ground pattern 123G may overlap with the first sensing pattern 125R and the second sensing pattern 127T in the third direction (Z direction). The second ground pattern 123G may be located between the second sensing pattern 127T and the controller chip 210. Therefore, the second ground pattern 123G may protect the controller chip 210 from external sensing noise. The second sensing pad 123R may be arranged in the first contact region CR1 and the third contact region CR3, and the second sensing pad 123T may be arranged in the second contact region CR2. The second sensing pads 123R may provide a path for electrical connection between the first sensing patterns 125R and the controller chip 210 , and the second sensing pads 123T may provide a path for electrical connection between the second sensing patterns 127T and the controller chip 210 .

[0054] The lower insulating layer 113 may be arranged to surround the second conductive patterns 123G and 123R. The lower insulating layer 113 may cover the second conductive patterns 123G and 123R. The lower insulating layer 113 may electrically isolate the second conductive patterns 123G and 123R from each other.

[0055] The third conductive patterns 125G, 125R, and 125T may include a third ground pattern 125G to which a reference potential is applied, a first sensing pattern 125R for identifying a user's fingerprint, and a third sensing pad 125T. The first sensing pattern 125R may be arranged in the sensing region SR, the third ground pattern 125G may be arranged in the routing region YR and the peripheral region ER, and the third sensing pad 125T may be arranged in the second contact region CR2. The third sensing pad 125T may provide a path for electrical connection between the second sensing pattern 127T and the controller chip 210.

[0056] The upper insulating layer 115 may be arranged to surround the third conductive patterns 125G, 125R, and 125T. The upper insulating layer 115 may cover the third conductive patterns 125G, 125R, and 125T. The upper insulating layer 115 may electrically isolate the third conductive patterns 125G, 125R, and 125T from each other.

[0057] The lower insulating layer 113 and the upper insulating layer 115 may include materials different from each other. For example, the upper insulating layer 115 may include a material having a dielectric constant suitable for fingerprint recognition of the fingerprint sensor package 10. However, at least some example embodiments of the present inventive concepts are not limited thereto, and the lower insulating layer 113 and the upper insulating layer 115 may also include the same material as each other.

[0058] The lower insulating layer 113 and the upper insulating layer 115 may each include at least one selected from phenol resin, epoxy resin, and polyimide. In some example embodiments, the lower insulating layer 113 and the upper insulating layer 115 may each include at least one selected from prepreg, FR4, tetrafunctional epoxy resin, polyphenylene ether, epoxy / polyphenylene ether, Thermount, BT, cyanate ester, polyimide, and liquid crystal polymer.

[0059] The fourth conductive patterns 127G and 127T may be arranged on the upper surface of the upper insulating layer 115. The fourth conductive patterns 127G and 127T may include a fourth ground pattern 127G for removing sensing noise and a second sensing pattern 127T for identifying a user's fingerprint. The second sensing pattern 127T may be arranged in the sensing region SR, and the fourth ground pattern 127G may be arranged in the peripheral region ER.

[0060] The second sensing pattern 127T can be separated from the first sensing pattern 125R in the third direction (Z direction), with the upper insulating layer 115 located therebetween. That is, the second sensing pattern 127T can be electrically insulated from the first sensing pattern 125R by the upper insulating layer 115. Therefore, the first sensing pattern 125R can constitute the first electrode of a capacitor, the upper insulating layer 115 can constitute the dielectric layer of the capacitor, and the second sensing pattern 127T can constitute the second electrode of the capacitor. In other words, the capacitor constituting the fingerprint sensor can be included in the packaging substrate 100.

[0061] The upper protective layer 119 may be arranged to surround the second sensing pattern 127T. The upper protective layer 119 may cover the second sensing pattern 127T. However, the upper protective layer 119 may be formed to expose the fourth ground pattern 127G. That is, in order to effectively remove sensing noise by expanding the contact area between the user's fingerprint and the fourth ground pattern 127G, the fourth ground pattern 127G may be completely exposed from the upper protective layer 119. However, at least some example embodiments of the present inventive concepts are not limited to the above values.

[0062] The first conductive patterns 121G, 121P, 121R, 121S, and 121T may be arranged on the lower surface of the lower insulating layer 113. The first conductive patterns 121G, 121P, 121R, 121S, and 121T may include a first power pattern 121P for supplying external power, a first ground pattern 121G to which a reference potential is applied, a first signal pattern 121S, and first sensing pads 121R and 121T. The fingerprint recognition result of the fingerprint sensor package 10 is output to the outside (for example, to the display unit 12 described above) via the first signal pattern 121S. The first ground pattern 121G is arranged below the package substrate 100 and may therefore be referred to as a lower ground pattern.

[0063] At least some of the first conductive patterns 121G, 121P, 121R, 121S, and 121T may be connected to the controller chip 210. The first power pattern 121P may provide a power supply potential to the controller chip 210, the first ground pattern 121G may provide a reference potential to the controller chip 210, and the first sensing pads 121R and 121T may transmit signals recognized by the first sensing pattern 125R and the second sensing pattern 127T to the controller chip 210.

[0064] Although not shown, connection terminals (e.g., solder balls) for electrically connecting the controller chip 210 to the first conductive patterns 121G, 121P, 121R, 121S, and 121T may be provided between the controller chip 210 and the first conductive patterns 121G, 121P, 121R, 121S, and 121T. Because the first conductive patterns 121G, 121P, 121R, 121S, and 121T are contacted by the connection terminals, the first conductive patterns 121G, 121P, 121R, 121S, and 121T may be referred to as a plurality of connection pads.

[0065] The first sensing pad 121R may extend from the first contact region CR1 and the third contact region CR3 to a portion overlapping the controller chip 210 in the third direction (Z direction), and the first sensing pad 121T may extend from the second contact region CR2 to a portion overlapping the controller chip 210 in the third direction (Z direction). The first sensing pad 121R may provide a path for electrical connection between the first sensing pattern 125R and the controller chip 210, and the first sensing pad 121T may provide a path for electrical connection between the second sensing pattern 127T and the controller chip 210.

[0066] The lower protective layer 117 may be arranged to surround the first conductive patterns 121G, 121P, 121R, 121S, and 121T. The lower protective layer 117 may cover the first conductive patterns 121G, 121P, 121R, 121S, and 121T. The lower protective layer 117 may expose at least some of the first power pattern 121P, the first ground pattern 121G, and the first signal pattern 121S. In some example embodiments, the first power pattern 121P may contact an external terminal providing a power supply potential via its exposed surface, and the first ground pattern 121G may contact an external terminal providing a reference potential via its exposed surface. In other example embodiments, the external terminals may be replaced with an anisotropic conductive film (ACF) attached to the first conductive patterns 121G, 121P, 121R, 121S, and 121T.

[0067] The lower protective layer 117 and the upper protective layer 119 may each be an insulating coating layer. In some example embodiments, the lower protective layer 117 and the upper protective layer 119 may be solder resist. In other example embodiments, the lower protective layer 117 and the upper protective layer 119 may include a polymer material having excellent heat resistance, insulation properties, and mechanical strength. For example, the lower protective layer 117 and the upper protective layer 119 may each include polyimide, polyamide, polyacetal, polycarbonate, etc.

[0068] Conductive paths in the package substrate 100 that electrically connect the conductive layers of the multilayer structure will now be described.

[0069] The first conductive paths 131G, 131R, and 131T may be located between the first conductive patterns 121G, 121R, and 121T and the second conductive patterns 123G, 123R, and 123T to provide electrical connection.

[0070] Specifically, the first conductive path 131G may provide an electrical connection between the first ground pattern 121G and the second ground pattern 123G, the first conductive path 131R may provide an electrical connection between the first sensing pad 121R and the second sensing pad 123R, and the first conductive path 131T may provide an electrical connection between the first sensing pads 121T and 121T and the second sensing pad 123T. For example, the first conductive path 131R may be arranged in the first contact region CR1 and the third contact region CR3, the first conductive path 131T may be arranged in the second contact region CR2, and the first conductive path 131G may be arranged in the wiring region YR.

[0071] The second conductive paths 133G, 133R, and 133T and the third conductive paths 135G, 135R, and 135T may be located between the second conductive patterns 123G, 123R, and 123T and the third conductive patterns 125G, 125R, and 125T to provide electrical connections. The second conductive paths 133G, 133R, and 133T and the third conductive paths 135G, 135R, and 135T may each have a structure that tapers toward the center of the base layer 111. In some example embodiments, the second conductive paths 133G, 133R, and 133T and the third conductive paths 135G, 135R, and 135T may have a minimum horizontal width in the contact surface therebetween.

[0072] The second conductive pathways 133G, 133R, and 133T may contact the second conductive patterns 123G, 123R, and 123T, and the third conductive pathways 135G, 135R, and 135T may contact the third conductive patterns 125G, 125R, and 125T, and the second conductive pathways 133G, 133R, and 133T and the third conductive pathways 135G, 135R, and 135T may contact each other.

[0073] Specifically, the second conductive path 133G may contact the second ground pattern 123G and the third conductive path 135G, and the third conductive path 135G may contact the third ground pattern 125G. The second conductive path 133R may contact the second sensing pad 123R and the third conductive path 135R, and the third conductive path 135R may contact the first sensing pattern 125R. The second conductive path 133T may contact the second sensing pad 123T and the third conductive path 135T, and the third conductive path 135T may contact the third sensing pad 125T.

[0074] The fourth conductive vias 137G and 137T may be located between the third conductive patterns 125G, 125R, and 125T and the fourth conductive patterns 127G and 127T to provide electrical connection. The fourth conductive vias 137G and 137T may have a structure that tapers toward the base layer 111 .

[0075] In detail, the fourth conductive path 137G may provide an electrical connection between the third ground pattern 125G and the fourth ground pattern 127G, and the fourth conductive path 137T may provide an electrical connection between the third sensing pad 125T and the second sensing pattern 127T. The fourth conductive path 137T may be arranged in the second contact region CR2, while the fourth conductive path 137G may not be arranged in the second contact region CR2.

[0076] The controller chip 210 and the passive components 220 may be arranged on the lower protective layer 117. In some example embodiments, the controller chip 210 may be arranged entirely or partially in the sensing region SR. In other example embodiments, the entire controller chip 210 may be arranged outside the sensing region SR. Like a memory chip and / or a processor chip, the controller chip 210 may include components configured to perform computing operations to identify a user's fingerprint based on changes in the capacitance value of the pixel PX. In addition, the passive components 220 may include, for example, multilayer ceramic capacitors (MLCCs), but are not limited thereto.

[0077] Molding member 230 may be disposed over lower protective layer 117, controller chip 210, and passive components 220. Molding member 230 may protect controller chip 210 and passive components 220 from external influences such as contaminants or shock. To perform this function, the thickness of molding member 230 may be set so that molding member 230 completely covers controller chip 210 and passive components 220. Molding member 230 may include an epoxy molding compound. Alternatively, molding member 230 may include an epoxy-based material, a thermosetting material, a thermoplastic material, an ultraviolet (UV) curable material, or the like.

[0078] The coating member 300 may be provided on the upper protective layer 119. The coating member 300 may cover and protect the sensing region SR of the package substrate 100. The coating member 300 may perform the function of protecting the sensing region SR from external influences such as contaminants, impact, scratches, etc. Therefore, the coating member 300 may include high-strength glass and / or plastic, but is not limited thereto. In some example embodiments, the coating member 300 may include a material having a dielectric constant suitable for fingerprint recognition (e.g., a high-k dielectric material).

[0079] The coating member 300 may protrude from the package substrate 100 in the third direction (Z direction) and, considering sensing sensitivity, may have a thickness H1 equal to or less than approximately 50 μm. In some example embodiments, the thickness H1 of the coating member 300 may be in a range of approximately 5 μm to approximately 50 μm. In addition, as described above, a distance of approximately 50 μm or greater may be provided from the edge of the coating member 300 to the fourth ground pattern 127G.

[0080] Finally, because the fingerprint sensor package 10 according to at least some example embodiments of the inventive concepts includes the fourth ground pattern 127G horizontally surrounding the sensing region SR to reduce or minimize sensing noise, fingerprint recognition performance with higher reliability may be provided.

[0081] In addition, the fingerprint sensor package 10 according to at least some example embodiments of the present invention only includes a sensing area SR corresponding to the fingerprint recognition sensor in the packaging substrate 100, and therefore, the total thickness of the fingerprint sensor package 10 can be reduced, and the fingerprint sensor package 10 can be used in manufacturing a smart card having a thickness similar to that of a credit card or debit card in the related art.

[0082] Figures 3 to 7 is a top view illustrating a fingerprint sensor package according to other example embodiments.

[0083] Most of the components and materials of the fingerprint sensor packages 20, 30, 40, 50 and 60 described below are similar to those described above with reference to Figures 2A to 2D The components and materials of the components described are substantially the same or similar. Therefore, for ease of description, the description will focus on the differences based on the top view of the fingerprint sensor package 10 described above.

[0084] Reference Figure 3 , the fingerprint sensor package 20 may include a coating member 300 located on the package substrate 100 covering the sensing region SR and a fourth ground pattern 127G2 surrounding the coating member 300 .

[0085] In the fingerprint sensor package 20 according to the present exemplary embodiment, the fourth ground pattern 127G2 may include a plurality of circular patterns arranged along the planar shape of the coating member 300 covering the sensing region SR and spaced apart from each other at uniform distances. The diameters of the circles constituting the plurality of circular patterns may be equal to each other. In some exemplary embodiments, the circles constituting the plurality of circular patterns may be elliptical.

[0086] From the edge of the coating member 300 to the fourth ground pattern 127G2, there may be a first distance D1 in the first direction (X direction) and a second distance D2 in the second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 may be substantially equal to each other. Specifically, the first distance D1 and the second distance D2 may each be equal to or greater than approximately 50 μm.

[0087] Reference Figure 4 The fingerprint sensor package 30 may include a coating member 300 located on the package substrate 100 and covering the sensing region SR, and a fourth ground pattern 127G3 surrounding the coating member 300 .

[0088] In the fingerprint sensor package 30 according to the present example embodiment, the fourth ground pattern 127G3 may include a plurality of quadrilateral patterns arranged along the planar shape of the coating member 300 covering the sensing region SR and spaced apart from each other at a uniform distance. In some example embodiments, each quadrilateral constituting the plurality of quadrilateral patterns may be a rectangle, a square, or a diamond.

[0089] From the edge of the coating member 300 to the fourth ground pattern 127G3, there may be a first distance D1 in the first direction (X direction) and a second distance D2 in the second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 may be substantially equal to each other. Specifically, the first distance D1 and the second distance D2 may each be equal to or greater than approximately 50 μm.

[0090] Reference Figure 5 , the fingerprint sensor package 40 may include a coating member 300 located on the package substrate 100 covering the sensing region SR and a fourth ground pattern 127G4 surrounding the coating member 300 .

[0091] In the fingerprint sensor package 40 according to the present example embodiment, the fourth ground pattern 127G4 may include a plurality of closed line patterns arranged along the plane shape of the coating member 300 covering the sensing region SR and spaced apart from each other at a uniform distance and having a uniform width. In some example embodiments, the plurality of closed line patterns constituting the plurality of closed line patterns is not limited to two as shown, and may be three or more.

[0092] From the edge of the coating member 300 to the fourth ground pattern 127G4, there may be a first distance D1 in the first direction (X direction) and a second distance D2 in the second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 may be substantially equal to each other. Specifically, the first distance D1 and the second distance D2 may each be equal to or greater than approximately 50 μm.

[0093] Reference Figure 6 In the fingerprint sensor package 50 , a sensing region SR, a first contact region CR1 , a second contact region CR2 , a fourth contact region CR4 , a wiring region YR, and a peripheral region ER may be defined on the package substrate 105 .

[0094] In the fingerprint sensor package 50 according to the present exemplary embodiment, the first contact region CR1 may be formed at one end of the sensing region SR in the second direction (Y direction), and the wiring region YR may be formed at the other end thereof. The second contact region CR2 may be formed at one end of the sensing region SR in the first direction (X direction), and the fourth contact region CR4 may be formed at the other end thereof.

[0095] The first to third conductive paths 131R, 133R, and 135R of the first contact region CR1 (see Figure 2B ) can be arranged in an alternating zigzag pattern in the first direction (X direction). The first to fourth conductive paths 131T, 133T, 135T and 137T of the second contact region CR2 and the fourth contact region CR4 (see Figure 2C ) can be arranged in lines in the second direction (Y direction).

[0096] Reference Figure 7 The fingerprint sensor package 60 may include a coating member 300 located on the package substrate 106 and covering the sensing region SR, and a fourth ground pattern 127G surrounding the coating member 300 .

[0097] In the fingerprint sensor package 60 according to this example embodiment, each corner CN6 of the package substrate 106 may be angular. For example, when the edge of the corner CN6 in the first direction (X direction) intersects with the edge of the corner CN6 in the second direction (Y direction), the corner CN6 may be a right angle. Figure 11D ) The shape of the corner CN6 of the packaging substrate 106 is reflected in the process of cutting the packaging substrate 106.

[0098] Figures 8 to 10 is a cross-sectional view illustrating a fingerprint sensor package according to other example embodiments.

[0099] Most of the components and materials of the fingerprint sensor packages 70, 80, and 90 described below are similar to those described above with reference to Figures 2A to 2D The components and materials of the components described are substantially the same or similar. Therefore, for ease of description, the description will focus on the differences based on the cross-sectional view of the fingerprint sensor package 10.

[0100] Reference Figure 8 , the fingerprint sensor package 70 may include a package substrate 107 , a controller chip 210 , passive elements 220 , a molding member 230 , and a coating member 300 .

[0101] In the fingerprint sensor package 70 according to the present exemplary embodiment, an upper protective layer 119' may be disposed on the fourth conductive patterns 127G and 127T. The upper protective layer 119' may cover the fourth conductive patterns 127G and 127T. The upper protective layer 119' may include an upper opening UOP exposing a portion of the fourth ground pattern 127G.

[0102] The lower protective layer 117' may be disposed on the first conductive patterns 121G, 121P, 121R, 121S, and 121T. The lower protective layer 117' may cover the first conductive patterns 121G, 121P, 121R, 121S, and 121T. The lower protective layer 117' may include a lower opening LOP that exposes some of the first power pattern 121P, the first ground pattern 121G, and the first signal pattern 121S.

[0103] Reference Figure 9 , the fingerprint sensor package 80 may include a package substrate 108 , a controller chip 210 , passive elements 220 , a molding member 230 , and a coating member 300 .

[0104] In the fingerprint sensor package 80 according to this example embodiment, the package substrate 108 may not include a base layer. The package substrate 108 may include first to third insulating layers 112, 114, and 116, each comprising an insulating material. The package substrate 108 may include first conductive paths 132G, 132R, and 132T, second conductive paths 134G, 134R, and 134T, and third conductive paths 136G, 136R, and 136T, each having a structure that tapers toward the controller chip 210.

[0105] The first insulating layer 112 may be disposed on the lower protective layer 117. The first conductive vias 132G, 132R, and 132T may pass through the first insulating layer 112 to contact the first conductive patterns 121G, 121R, and 121T.

[0106] The second insulating layer 114 may be disposed on the first insulating layer 112. The second conductive patterns 123G, 123R, and 123T may be covered by the second insulating layer 114. The second conductive vias 134G, 134R, and 134T may pass through at least a portion of the second insulating layer 114 to contact the second conductive patterns 123G, 123R, and 123T.

[0107] The third insulating layer 116 may be disposed on the second insulating layer 114. The third conductive patterns 125G, 125R, and 125T may be covered by the third insulating layer 116. The third conductive vias 136G and 136T may pass through at least a portion of the third insulating layer 116 to contact the third conductive patterns 125G and 125T.

[0108] Reference Figure 10 , the fingerprint sensor package 90 may include a package substrate 109 , a controller chip 210 , passive elements 220 , a molding member 240 , and a coating member 300 .

[0109] The fingerprint sensor package 90 according to the present example embodiment may have a fan-out wafer level packaging (FO-WLP) structure. In addition, in the fingerprint sensor package 90 according to the present example embodiment, the package substrate 109 may not include a base layer.

[0110] The package substrate 109 may include first to third insulating layers 112, 114, and 116 and a wiring structure. The wiring structure may include first conductive patterns 121G, 121P, 121S, and 121T, second conductive patterns 123G and 123T, third conductive patterns 125G, 125R, and 125T, fourth conductive patterns 127G and 127T, fifth conductive patterns 128G, and sixth conductive patterns 129P and 129S. The wiring structure may include first conductive paths 132G and 132T, second conductive paths 134G and 134T, and third conductive paths 136G and 136T having a structure that tapers toward the controller chip 210. In some example embodiments, the wiring structure may be formed using a dual damascene process.

[0111] The package substrate 109 may include a fifth conductive pattern 128G formed thereon and sixth conductive patterns 129P and 129S formed thereunder. The fifth conductive pattern 128G may be arranged to horizontally surround the sensing region SR. The fifth conductive pattern 128G may be a ground pattern arranged above the package substrate 109 and may be referred to as an upper ground pattern.

[0112] The sixth conductive patterns 129P and 129S may include a sixth power pattern 129P through which external power is received and a sixth signal pattern 129S through which signals are transmitted to the outside. In addition, the sixth conductive patterns 129P and 129S may include additional patterns for receiving a reference potential from the outside.

[0113] The molding member 240 may have a step formed by partially removing a flat molding layer. The molding member 240 may include a first molding portion 241 that protects the controller chip 210 and the passive element 220, and a second molding portion 243 that surrounds the first molding portion 241. A portion of each of the sixth conductive patterns 129P and 129S may be exposed via the second molding portion 243. That is, the package substrate 109 may not include a lower protective layer.

[0114] Figures 11A to 11F A method of manufacturing a smart card according to an example embodiment is illustrated in process order.

[0115] Reference Figure 11A, a fingerprint sensor module 10P including a package panel 100P, a controller chip 210 , a passive element 220 , a molding member 230 , and a coating member 300 is prepared.

[0116] Most of the components and materials of the fingerprint sensor module 10P are the same as those mentioned above. Figures 2A to 2D The components and materials of the components of the described fingerprint sensor package 10 are substantially the same or similar. However, the fingerprint sensor module 10P includes a package panel 100P instead of a package substrate 100 (see FIG. Figure 2B ). and the package substrate 100 (see Figure 2B ), the encapsulation panel 100P may have a larger horizontal width in the first direction (X direction) and the second direction (Y direction).

[0117] Reference Figure 11B , on which the fingerprint sensor module 10P will be installed (see Figure 11A ) base film 400.

[0118] The base film 400 may include an opening area 410 located at a central portion thereof, an adhesive area 420 surrounding the opening area 410, and a plurality of through-holes (PF) 430 arranged in both side ends of the opening area 410. The pitch of the plurality of PF holes 430 is uniform, and therefore, the length of the base film 400 may be defined by the number of PF holes 430. At the same time, the width and length of the base film 400 may be determined by the fingerprint sensor module 10P mounted thereon (see Figure 11A ) and the size of the fingerprint sensor module 10P. The winding and releasing of the base film 400 may be controlled through the plurality of PF holes 430 by using a roll-type winding device.

[0119] Reference Figure 11C , the fingerprint sensor module 10P is aligned and arranged on the base film 400 .

[0120] A specific pressure may be applied to the fingerprint sensor module 10P so that the package panel 100P of the fingerprint sensor module 10P is attached to the adhesive region 420 of the base film 400. In some example embodiments, the fingerprint sensor module 10P is placed on the base film 400 so that the coating member 300 faces the base film 400 and the controller chip 210 faces away from the base film 400.

[0121] Reference Figure 11D , the fingerprint sensor module 10P is adhered to the base film 400 and mounted on the base film 400 .

[0122] The upper insulating layer 115 of the package panel 100P may be adhered to the adhesive region 420 of the base film 400. A plurality of fingerprint sensor modules 10P may be mounted on one base film 400. In this manner, a plurality of fingerprint sensor modules 10P adhered to the base film 400 may be provided to an assembly line, thereby allowing the use of a roll-to-roll device of the related art without any modification thereto.

[0123] Next, by using the punching device PM, the package panel 100P is cut to separate the fingerprint sensor package 10 (see FIG. Figure 11E ) is separated from the base film 400. In order to effectively reduce or prevent cracks that may be generated in the process of cutting the package panel 100P by using the punching equipment PM, the package substrate 100 (see Figure 11E ) has a rounded shape after cutting the package substrate 100.

[0124] Reference Figure 11E , a card body 500 including a groove area 510 , a card substrate 520 , a connection area 530 and a security chip 11 is prepared.

[0125] The card substrate 520 and the security chip 11 storing financial information can be arranged in the card body 500, and a groove area 510 for mounting the fingerprint sensor package 10 can be included in the card body 500. The security chip 11 can be arranged in the card body 500 so that the surface of the security chip 11 is exposed to the outside. As the card substrate 520, an FPCB can be used. In addition, a connection area 530 for electrically connecting the fingerprint sensor package 10 to other components in the card body 500 can be arranged in the card substrate 520. The fingerprint sensor package 10 is aligned with the groove area 510 of the card body 500 in a direction in which the coating member 300 and the fourth ground pattern 127G are exposed to the outside.

[0126] Reference Figure 11F , the fingerprint sensor package 10 is installed in the groove area 510 of the card body 500.

[0127] The first conductive patterns 121G, 121P, 121R, 121S, and 121T of the fingerprint sensor package 10 and the connection region 530 of the card substrate 520 can be electrically contacted with each other. In some example embodiments, an empty space 510P can be formed between the fingerprint sensor package 10 and the card body 500. The empty space 510P provides a space in which the fingerprint sensor package 10 can flexibly respond to the degree of bending of the smart card 1. In other example embodiments, the empty space 510P can be filled with an adhesive by applying an adhesive to the empty space 510P.

[0128] Also refer to Figure 1 , the smart card 1 may include a fingerprint sensor package 10, a security chip 11, a display unit 12, and a power button 13. When a user has touched the fingerprint sensor package 10 of the smart card 1 with his or her fingerprint, the touched fingerprint may be recognized. When the recognized fingerprint corresponds to the registered fingerprint, the security chip 11 may authorize the user of the smart card 1 to make a payment.

[0129] Figure 12 is a top plan view illustrating a mobile device including a fingerprint sensor package according to example embodiments.

[0130] Reference Figure 12 , the mobile device 1000 may include a touch screen display 1010 and a fingerprint sensor package 1020 .

[0131] The mobile device 1000 may further include a camera, a speaker, a temperature sensor, a motion sensor, and the like. As an example of the mobile device 1000, a smartphone is given, but it is not limited thereto. For example, the mobile device 1000 may be a laptop computer, a tablet computer, or a wearable device such as a smartwatch on which the fingerprint sensor package 1020 may be mounted. The fingerprint sensor package 1020 may be arranged on the display 1010 in the mobile device 1000. The fingerprint sensor package 1020 may be the one described above with reference to FIG. Figures 2A to 10 One of the fingerprint sensor packages 10, 20, 30, 40, 50, 60, 70, 80, and 90 described.

[0132] Having thus described the exemplary embodiments of the present invention, it will be apparent that they may be modified in many ways. Such modifications should not be regarded as departing from the intended spirit and scope of the exemplary embodiments of the present invention, and it will be apparent to those skilled in the art that all such modifications are intended to be included within the scope of the appended claims.

Claims

1. A fingerprint sensor package, comprising: a packaging substrate comprising an upper surface and a lower surface opposite to the upper surface, wherein a sensing area and a peripheral area surrounding the sensing area are defined in the upper surface; a plurality of first sensing patterns arranged in the sensing area, spaced apart from each other in a first direction, and extending in a second direction intersecting the first direction; a plurality of second sensing patterns, the plurality of second sensing patterns being arranged in the sensing area, being separated from each other in the second direction, and extending in the first direction; a coating member covering the sensing area; an upper ground pattern located in the peripheral region and spaced apart from the coating member to surround the coating member in the first direction and the second direction; as well as A controller chip is located on the lower surface of the packaging substrate; wherein the plurality of first sensing patterns and the plurality of second sensing patterns are separated from each other in a third direction perpendicular to the first direction and the second direction, and the plurality of first sensing patterns and the plurality of second sensing patterns constitute a plurality of capacitors, wherein each of the plurality of capacitors includes a sensing pattern among the plurality of first sensing patterns as a first conductor and a sensing pattern among the plurality of second sensing patterns as a second conductor.

2. The fingerprint sensor package according to claim 1, further comprising: a plurality of connection pads, the plurality of connection pads being located on the lower surface of the package substrate, Wherein, some of the plurality of connection pads are lower ground patterns.

3. The fingerprint sensor package according to claim 2, in, The upper ground pattern is configured to remove sensing noise generated by a user, and Wherein, a reference potential is applied to the lower ground pattern.

4. The fingerprint sensor package according to claim 1, in, The upper ground pattern is positioned along the planar shape of the coating member, and The upper ground pattern includes at least one of a closed line pattern having a uniform width, a plurality of circular patterns separated from each other, or a plurality of quadrilateral patterns separated from each other.

5. The fingerprint sensor package according to claim 1, in, The plurality of second sensing patterns are positioned farther from the controller chip than the plurality of first sensing patterns in the third direction, and The first width of each of the plurality of first sensing patterns is greater than the second width of each of the plurality of second sensing patterns.

6. The fingerprint sensor package according to claim 5, further comprising: an upper protective layer, the upper protective layer covering the plurality of second sensing patterns, The upper protection layer exposes the upper ground pattern.

7. The fingerprint sensor package according to claim 1 , further comprising: a passive component, the passive component being located on the lower surface of the package substrate and adjacent to the controller chip; as well as A molding member covers the controller chip and the passive elements.

8. The fingerprint sensor package according to claim 1, further comprising: a plurality of conductive paths passing through the package substrate and electrically connecting the plurality of first sensing patterns and the plurality of second sensing patterns to the controller chip, The plurality of conductive paths gradually narrow toward a central portion of the packaging substrate.

9. The fingerprint sensor package according to claim 1, in, The coating member protrudes from the packaging substrate in the third direction, and wherein a minimum distance from an edge of the coating member to the upper ground pattern is substantially equal in the first direction and the second direction.

10. The fingerprint sensor package according to claim 1, wherein: The package substrate has a rounded rectangular planar shape.

11. A fingerprint sensor package, comprising: a packaging substrate on which a sensing area and a peripheral area surrounding the sensing area are defined, wherein the packaging substrate has a rounded rectangular planar shape; and a controller chip mounted on the package substrate and configured to determine whether the recognized fingerprint corresponds to a registered fingerprint, Wherein, the packaging substrate includes: base layer; a coating member, an upper protective layer located between the coating member and an upper surface of the base layer, and an upper insulating layer located between the upper protective layer and the upper surface of the base layer; a molding member, a lower protective layer located between the molding member and a lower surface of the base layer, and a lower insulating layer located between the lower protective layer and the lower surface of the base layer; first conductive patterns, at least some of which are covered by the lower protective layer, the first conductive patterns including a first ground pattern, a power pattern, a signal pattern, and a first sensing pad; a second conductive pattern covered by the lower insulating layer and including a second ground pattern connected to the first ground pattern and a second sensing pad connected to the first sensing pad; a third conductive pattern covered by the upper insulating layer and including a third ground pattern connected to the second ground pattern, first sensing patterns connected to some of the second sensing pads, and third sensing pads connected to other of the second sensing pads, the first sensing patterns being separated from each other in a first direction and extending in a second direction intersecting the first direction; and fourth conductive patterns, at least some of the fourth conductive patterns being covered by the upper protective layer, the fourth conductive patterns including a fourth ground pattern connected to the third ground pattern and a second sensing pattern connected to the third sensing pad, the second sensing patterns being separated from each other in the second direction and extending in the first direction, Wherein, the first sensing pattern and the second sensing pattern are located in the sensing area, Wherein, the controller chip is located in the molding member, and The fourth ground pattern is located in the peripheral region and is separated from the coating member to surround the coating member in the first direction and the second direction.

12. The fingerprint sensor package according to claim 11, further comprising: a first conductive path connected to the first conductive pattern and the second conductive pattern and extending in a third direction perpendicular to the first direction and the second direction; a second conductive path connected to the second conductive pattern and extending in the third direction; a third conductive path connected to the second conductive path and the third conductive pattern and extending in the third direction; as well as a fourth conductive path connected to the third conductive pattern and the fourth conductive pattern and extending in the third direction, The first conductive path, the second conductive path, the third conductive path, and the fourth conductive path gradually narrow toward the center of the base layer in the thickness direction of the base layer.

13. The fingerprint sensor package according to claim 11, wherein: The fourth ground pattern is configured to remove sensing noise generated by a user and includes a closed line pattern having a uniform width.

14. The fingerprint sensor package according to claim 13, in, The coating member has a thickness of 5 μm to 50 μm, and Here, a minimum distance from an edge of the coating member to the fourth ground pattern is 50 μm or greater.

15. The fingerprint sensor package according to claim 11, wherein The curvature radius of each corner of the packaging substrate is 1.6 mm.

16. A smart card, comprising: a card body having a recessed area; a security chip storing financial information; as well as a fingerprint sensor package configured to sense a user's fingerprint and transmit a signal regarding the sensing result to the security chip, Wherein, the fingerprint sensor package includes: a packaging substrate having an upper surface and a lower surface opposite to the upper surface, wherein a sensing area and a peripheral area surrounding the sensing area are defined in the upper surface; a plurality of first sensing patterns, the plurality of first sensing patterns being located in the sensing area, being separated from each other in a first direction, and extending in a second direction intersecting the first direction; a plurality of second sensing patterns, the plurality of second sensing patterns being located in the sensing area, being separated from each other in the second direction, and extending in the first direction; a coating member covering the sensing area; and an upper ground pattern located in the peripheral region and spaced apart from the coating member to surround the coating member in the first direction and the second direction; wherein the plurality of first sensing patterns and the plurality of second sensing patterns are separated from each other in a third direction perpendicular to the first direction and the second direction, and the plurality of first sensing patterns and the plurality of second sensing patterns constitute a plurality of capacitors, wherein each of the plurality of capacitors includes a sensing pattern among the plurality of first sensing patterns as a first conductor and a sensing pattern among the plurality of second sensing patterns as a second conductor.

17. The smart card according to claim 16, further comprising: a plurality of connection pads, the plurality of connection pads being located on the lower surface of the packaging substrate; as well as A controller chip is connected to some of the plurality of connection pads and is configured to determine whether the recognized fingerprint corresponds to a registered fingerprint.

18. The smart card according to claim 17, in, The fingerprint sensor package is mounted in the card body so that the coating member and the upper ground pattern are exposed to the outside, and Wherein, the controller chip is located in the groove area.

19. The smart card according to claim 18, wherein: The package substrate has a rounded rectangular planar shape.

20. The smart card according to claim 18, in, The upper ground pattern is configured to remove sensing noise generated by a user, wherein the upper ground pattern is positioned along the planar shape of the coating member, and The upper ground pattern includes at least one of a closed line pattern having a uniform width, a plurality of circular patterns separated from each other, or a plurality of quadrilateral patterns separated from each other.

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