Method for preparing light emitting device and method for preparing display panel

Abstract

The present invention relates to a method for preparing a light-emitting device and a method for preparing a display panel. The method for preparing a light-emitting device forms a peeling layer on a surface of a first pixel defining layer away from a substrate, and then forms a functional layer in a pixel unit. After the functional layer is formed, the peeling layer is removed, and at this time, the height difference between the functional layer and the first pixel defining layer is very small or the functional layer can be made flush with the first pixel defining layer. Then, when an electrode layer is formed on the surface of the functional layer and the first pixel defining layer, the electrode layer does not need to cover the step formed by the large height difference, so that the electrode layer can be stably formed and each part of the electrode layer can maintain a uniform thickness, effectively improving the thickness uniformity of the electrode layer and improving the display performance of the display panel.

Description

Technical Field

[0001] The present invention relates to the technical field of display panels, and in particular to a method for preparing a light-emitting device and a method for preparing a display panel. Background Art

[0002] Organic light-emitting diodes are widely used in light-emitting devices because of their advantages of active light emission, light weight, low power consumption, and wide viewing angle. In the preparation process of the light-emitting device, ink can be printed into the pixel unit formed by the pixel definition layer by inkjet printing to obtain the corresponding functional layer, and then an electrode layer is formed on the surface of the functional layer. Through such a preparation method, a light-emitting device can be obtained more conveniently.

[0003] However, see Figure 1 , which shows a light-emitting device 100 obtained by a traditional method, the light-emitting device 100 includes a substrate 101, a pixel defining layer 102 located on the substrate 101, the pixel defining layer 102 forms a pixel unit 103, the pixel unit 103 has a functional layer 104, and the functional layer 104 and the pixel defining layer 102 have an electrode layer 105 on their surfaces. In the light-emitting device 100, there is a large height difference between the edges of the functional layer 104 and the pixel defining layer 102, so when the electrode layer 105 is manufactured, the electrode layer 105 needs to cover the step formed by the large height difference, and at this time, the electrode layer 105 is prone to defects such as discontinuity and thinning at the step, resulting in uneven thickness of the electrode layer 105, which may have an adverse effect on the display of the device. Summary of the invention

[0004] Based on this, it is necessary to provide a method for preparing a light emitting device and a method for preparing a display panel that can effectively improve the uniformity of the thickness of an electrode layer.

[0005] In order to solve the above technical problems, the technical solution of this application is:

[0006] A method for preparing a light emitting device comprises the following steps:

[0007] A first pixel defining layer having an opening is formed on a substrate, wherein a side wall of the opening and a surface of the substrate form a pixel unit;

[0008] forming a peeling layer on a surface of the first pixel defining layer away from the substrate;

[0009] forming a functional layer in the pixel unit, wherein the thickness of the functional layer is less than or equal to the thickness of the first pixel defining layer;

[0010] The release layer is removed.

[0011] In one embodiment, before forming the functional layer in the pixel unit, the method further includes the following steps:

[0012] The side wall of the opening is subjected to a hydrophilic treatment.

[0013] In one of the embodiments, before forming the functional layer in the pixel unit, the method further includes the following step: performing a hydrophobic treatment on the side wall of the release layer.

[0014] In one embodiment, the peeling layer is made of magnetic material.

[0015] In one embodiment, removing the peeling layer comprises the following steps:

[0016] The peeling layer is arranged toward the magnetic member, and the peeling layer is removed under the attraction of the magnetic member.

[0017] In one embodiment, when removing the peeling layer, before arranging the peeling layer toward the magnetic member, the following steps are also included:

[0018] The substrate is heated to control the temperature of the substrate to be 100°C to 300°C.

[0019] In one of the embodiments, the absolute value of the difference between the angle formed by the side wall of the lift-off layer and the surface of the substrate and the angle formed by the side wall of the first pixel defining layer and the surface of the substrate is less than or equal to 30°.

[0020] In one embodiment, before forming the functional layer in the pixel unit, the method further includes the following steps:

[0021] A second pixel defining layer is formed on a surface of the stripping layer away from the first pixel defining layer, and an absolute value of a difference between an angle formed by a side wall of the second pixel defining layer and the substrate surface and an angle formed by a side wall of the first pixel defining layer and the substrate surface is less than or equal to 30°.

[0022] In one embodiment, the thickness of the first pixel defining layer is 300nm-700nm, and the thickness of the release layer is 200nm-500nm.

[0023] A method for preparing a display panel, the display panel comprising a light-emitting device, the method for preparing a display panel comprising the method for preparing a light-emitting device as described in any one of the above embodiments.

[0024] In the above-mentioned method for preparing a light-emitting device, a peeling layer is formed on the surface of the first pixel defining layer away from the substrate, and then a functional layer is formed in the pixel unit. In this process, the thickness of the first pixel defining layer can be set so that the thickness of the functional layer is equal to or slightly less than the thickness of the first pixel defining layer to ensure that the functional layer can be completely located in the pixel unit defined by the first pixel defining layer, effectively avoiding problems such as ink overflowing from the pixel unit during printing and causing color mixing, and ensuring the display performance of the light-emitting device. After the functional layer is formed, the peeling layer is removed, and at this time the height difference between the functional layer and the first pixel defining layer is very small or the functional layer can be flush with the first pixel defining layer. Then, when the electrode layer is formed on the surface of the functional layer and the first pixel defining layer, the electrode layer does not need to cover the steps formed by the large height difference, so that the electrode layer can be stably formed and the thickness of each part of the electrode layer can be kept uniform, effectively improving the thickness uniformity of the electrode layer and improving the display performance of the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of defects such as discontinuity and thinning of the electrode layer in the light-emitting device obtained by the traditional preparation method;

[0026] Figure 2 It is a schematic structural diagram of a light emitting device in one embodiment of the present invention;

[0027] Figure 3 for Figure 2 A schematic diagram of forming a first pixel defining layer in a corresponding method for preparing a light-emitting device;

[0028] Figure 4 For Figure 3 Schematic diagram of forming a peeling layer in the corresponding preparation method;

[0029] Figure 5 For Figure 4 Schematic diagram of forming a functional layer in the corresponding preparation method;

[0030] Figure 6 For Figure 3 A schematic diagram of forming a second pixel defining layer in a corresponding preparation method;

[0031] Figure 7 For Figure 6 Schematic diagram of forming a functional layer in the corresponding preparation method;

[0032] Figure 8 For Figure 6 Schematic diagram of removing the peeling layer in the corresponding preparation method;

[0033] Fig. 9 For Figure 6 Schematic diagram of the corresponding preparation method after removing the peeling layer.

[0034] Description of the markings in the figure:

[0035] 100, light-emitting device; 101, substrate; 102, pixel defining layer; 103, pixel unit; 104, functional layer; 105, electrode layer; 200, light-emitting device; 201, substrate; 202, first pixel defining layer; 203, opening; 204, peeling layer; 205, second pixel defining layer; 206, functional layer; 207, first electrode layer; 300, magnet. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purpose, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0037] In the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0039] See also Figure 2 , an embodiment of the present invention provides a light-emitting device 200. The light-emitting device 200 includes a substrate 201, a first pixel defining layer 202, a functional layer 206, and a first electrode layer 207. The first pixel defining layer 202 has an opening, and the sidewall of the opening and the surface of the substrate 201 form a pixel unit. The functional layer 206 is located in the pixel unit, and the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202. The first electrode layer 207 is located on the surface of the functional layer 206 and the first pixel defining layer 202. It can be understood that, Figure 2 The number of the first pixel defining layers 202 shown in FIG. 5 is 5. The number of the first pixel defining layers in the actual light emitting device is determined according to the design requirements of the panel.

[0040] In the light-emitting device 200 of this embodiment, the height difference between the functional layer 206 and the first pixel defining layer 202 is very small or the functional layer 206 is flush with the first pixel defining layer 202, so that when the first electrode layer 207 is formed, the first electrode layer 207 does not need to cover the steps formed by the large height difference, and the first electrode layer 207 has good thickness uniformity.

[0041] Furthermore, another embodiment of the present invention provides a method for preparing the above-mentioned light-emitting device 200. The preparation method comprises the following steps:

[0042] S101: A first pixel defining layer 202 having an opening 203 is formed on a substrate 201, and the sidewall of the opening 203 and the surface of the substrate 201 form a pixel unit. At this time, the structure of the light emitting device is as follows: Figure 3 shown.

[0043] S102: forming a peeling layer 204 on a surface of the first pixel defining layer 202 away from the substrate 201. Figure 4 shown.

[0044] S103: forming a functional layer 206 in the pixel unit, wherein the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202. At this time, the structure of the light emitting device is as follows: Figure 5 shown.

[0045] S104: Remove the peeling layer 204. At this time, the structure of the light emitting device is as follows Fig. 9 shown.

[0046] Furthermore, after removing the peeling layer 204, the following steps are also included:

[0047] S105: forming a first electrode layer 207 on the surface of the functional layer 206 and the first pixel defining layer 202. At this time, the structure of the light emitting device is as follows: Figure 2 shown.

[0048] It is understood that in the light-emitting device 200, the thickness of the functional layer 206 is generally 200nm to 700nm. The functional layer 206 refers to a functional layer that does not include an electrode layer. Specifically, the functional layer 206 includes but is not limited to a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, and a light extraction layer. The thickness of the functional layer 206 refers to the thickness after removing the electrode layer, and the thickness includes but is not limited to the thickness of the hole injection layer, the thickness of the hole transport layer, the thickness of the electron blocking layer, the thickness of the light-emitting layer, the thickness of the hole blocking layer, the thickness of the electron transport layer, the thickness of the electron injection layer, and the thickness of the light extraction layer. In the inkjet printing process, the functional layer 206 that meets the requirements is obtained by injecting the corresponding functional ink into the pixel unit. It can also be understood that the functional layers in different pixel units may have different thicknesses. For example, in red pixel units, green pixel units and blue pixel units, functional layers of appropriate thicknesses may be independently selected according to design requirements, so that the functional layers in the red pixel units, green pixel units and blue pixel units have the same or different thicknesses.

[0049] In the method for preparing the light-emitting device 200 in this embodiment, a peeling layer 204 is formed on the surface of the first pixel defining layer 202 away from the substrate 201, and then a functional layer 206 is formed in the pixel unit. In this process, the thickness of the first pixel defining layer 202 can be set so that the thickness of the functional layer 206 is equal to or slightly less than the thickness of the first pixel defining layer 202 to ensure that the functional layer 206 can be completely located in the pixel unit defined by the first pixel defining layer 202, so as to avoid problems such as color mixing caused by ink overflowing from the pixel unit during printing, and ensure the display performance of the light-emitting device 200. After the functional layer 206 is formed, the peeling layer 204 is removed, and at this time, the height difference between the functional layer 206 and the first pixel defining layer 202 is very small or the functional layer 206 can be made flush with the first pixel defining layer 202. Then, a first electrode layer 207 is formed on the surfaces of the functional layer 206 and the first pixel defining layer 202. At this time, the first electrode layer 207 does not need to cover the steps formed due to the large height difference. This allows the first electrode layer 207 to be formed stably and the thickness of each part of the first electrode layer 207 to be uniform, thereby effectively improving the thickness uniformity of the first electrode layer 207 and improving the display performance of the light-emitting device 200.

[0050] In a specific example, before forming the first pixel defining layer 202 having the opening 203 on the substrate 201, the following steps are also included: forming a second electrode layer (not shown in the figure) on the substrate 201, so that the functional layer 206 can be located on the surface of the second electrode. During the preparation of the light-emitting device 200, the second electrode layer is formed on the substrate 201, and a conductive circuit is formed by the cooperation of the second electrode layer and the first electrode layer 207, so that the light-emitting device 200 can play a normal display function.

[0051] It is understandable that in some specific light-emitting devices, the first electrode is a cathode and the corresponding second electrode is an anode. Optionally, the cathode material is one or more of indium zinc oxide, indium tin oxide and zinc oxide. The anode is indium tin oxide. Optionally, the first electrode is a transparent electrode.

[0052] As a preferred solution, before forming the functional layer 206 in the pixel unit, the following step is also included: hydrophilizing the sidewalls of the opening 203. Hydrophilizing the sidewalls of the opening 203 is beneficial to reducing the diffusion effect of the ink along the sidewalls of the opening 203, making the ink more stable in the pixel unit, improving the stability of the ink in the pixel unit, making the amount of ink in the pixel unit more consistent with the theoretical value, and thus improving the accuracy of inkjet printing. It is understandable that after the hydrophilizing treatment, the contact angle of the sidewalls of the opening 203 is less than 90°.

[0053] Further preferably, before forming the functional layer 206 in the pixel unit, the following step is also included: hydrophobic treatment is performed on the side wall of the peeling layer 204. Hydrophobic treatment of the side wall of the peeling layer 204 can effectively prevent the ink from adhering to the side wall of the peeling layer 204, and can further confine the ink to the pixel unit formed by the first pixel defining layer 202, further improve the stability of the ink in the pixel unit, make the amount of ink in the pixel unit more consistent with the theoretical value, and further improve the accuracy of inkjet printing. It is understandable that after the hydrophobic treatment, the contact angle of the side wall of the peeling layer 204 is greater than 90°.

[0054] Optionally, when the sidewall of the opening 203 is subjected to a hydrophilic treatment, the sidewall of the opening 203 may be subjected to a hydrophilic treatment by UV irradiation, ozone activation, or hydrophilic material attachment, etc., according to the material of the first pixel defining layer 202. Optionally, when the sidewall of the stripping layer 204 is subjected to a hydrophobic treatment, the sidewall of the stripping layer 204 may be subjected to a hydrophobic treatment by UV irradiation, ozone activation, or hydrophobic material attachment, etc., according to the material of the stripping layer 204.

[0055] As one example of the peeling layer 204, the material of the peeling layer 204 is a magnetic material. It is understood that the magnetic material refers to a material that can be attracted by a magnetic member. Specifically, the material of the peeling layer 204 can be at least one of iron, an iron-containing alloy, cobalt, a cobalt-containing alloy, nickel, and a nickel-containing alloy. At this time, please refer to Figure 8 , removing the peeling layer 204 includes the following steps: placing the peeling layer 204 toward the magnetic member, and removing the peeling layer 204 under the attraction of the magnetic member. The magnetic member may be a magnet 300. Under the attraction of the magnet 300, the peeling layer 204 is attracted by the magnet 300, so that the peeling layer 204 moves toward the magnet 300, and then the peeling layer 204 can be removed, and the peeling layer 204 can be separated from the first pixel defining layer 202. Preferably, when removing the peeling layer 204, before placing the peeling layer toward the magnetic member, the following steps are also included: heating the substrate 201, and controlling the temperature of the substrate 201 to be 100°C to 300°C. By heating the substrate 201, the bonding force between the peeling layer 204 and the first pixel defining layer 202 can be reduced, so that the peeling layer 204 can be more easily separated from the first pixel defining layer 202. Specifically, the temperature of the substrate 201 cannot exceed the withstand temperature of the functional layer 206, the first pixel defining layer 202 and the substrate 201. More specifically, when removing the peeling layer 204 , the movement of the substrate is controlled, and the peeling layer 204 is removed during the movement of the substrate, thereby improving the removal efficiency of the peeling layer 204 .

[0056] It is understandable that when removing the peeling layer 204, the peeling layer 204 can be removed by a corresponding method according to the material of the peeling layer 204. For example, the peeling layer 204 can be removed by sublimation, cracking, liquefaction, dissolution, etc. according to the material of the peeling layer 204.

[0057] In a specific example, the absolute value of the difference between the angle formed by the side wall of the peeling layer 204 and the surface of the substrate 201 and the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 30°. Preferably, the angle formed by the side wall of the peeling layer 204 and the surface of the substrate 201 is equal to the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201. Please refer to Figure 4, the angle formed by the side wall of the peeling layer 204 and the surface of the substrate 201 is β, the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201 is α, and the absolute value of the difference between β and α is less than or equal to 30°. Optionally, the absolute value of the difference between β and α is 0, 2°, 5°, 10°, 15°, 20° or 25°. When β is equal to α, the side wall of the peeling layer 204 has the same inclination angle as the side wall of the first pixel defining layer 202, and the side wall of the first pixel defining layer 202 is located on the same plane as the side wall of the peeling layer 204. In this way, the ink can enter the pixel unit more smoothly during printing, and the consistency of solvent volatilization is improved in the subsequent drying process, which is conducive to maintaining the stability of the functional layer 206 in the pixel unit.

[0058] It is understood that the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 90°. Preferably, the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is 70° to 90°. For example, the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 can be, but is not limited to, 70°, 71°, 72°, 73°, 74°, 75°, 76°, 77°, 78°, 79°, 80°, 81°, 82°, 83°, 84°, 85°, 86°, 87°, 88°, 89° or 90°.

[0059] See also Figure 6 In a specific example, before forming the functional layer 206 in the pixel unit, the following step is further included: forming a second pixel defining layer 205 on the surface of the peeling layer 204 away from the first pixel defining layer 202. In the case of being limited by the manufacturing process or the manufacturing cost, the thickness of the peeling layer 204 may be difficult to reach the actual required thickness. At this time, by forming the second pixel defining layer 205 on the surface of the peeling layer 204 away from the first pixel defining layer 202, the thickness of the peeling layer 204 can be effectively compensated, so as to achieve the effect of preventing ink from overflowing during the printing process.

[0060] It is understood that the absolute value of the difference between the angle formed by the side wall of the second pixel defining layer 205 and the surface of the substrate 201 and the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 30°. Preferably, the angle formed by the side wall of the second pixel defining layer 205 and the surface of the substrate 201 is equal to the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201. Figure 6, the angle formed by the side wall of the second pixel defining layer 205 and the surface of the substrate 201 is γ, the angle formed by the side wall of the first pixel defining layer 202 and the surface of the substrate 201 is α, and the absolute value of the difference between γ and α is less than or equal to 30°. Optionally, the absolute value of the difference between γ and α is 0, 2°, 5°, 10°, 15°, 20° or 25°. When γ is equal to α. At this time, the side wall of the second pixel defining layer 205 has the same inclination angle as the side wall of the first pixel defining layer 202, and the side wall of the second pixel defining layer 205 and the side wall of the first pixel defining layer 202 are located on the same plane, which is conducive to maintaining the stability of the functional layer 206 in the pixel unit.

[0061] It can also be understood that before forming the functional layer 206 in the pixel unit, the following step is also included: hydrophobic treatment is performed on the side wall of the second pixel defining layer 205. Hydrophobic treatment of the side wall of the second pixel defining layer 205 can effectively prevent the ink from adhering to the side wall of the second pixel defining layer 205, and can further confine the ink to the pixel unit formed by the first pixel defining layer 202, thereby improving the stability of the ink in the pixel unit, making the amount of ink in the pixel unit more consistent with the theoretical value, and further improving the accuracy of inkjet printing. It can be understood that after the hydrophobic treatment, the contact angle of the side wall of the second pixel defining layer 205 is greater than 90°.

[0062] Optionally, when the sidewall of the second pixel defining layer 205 is subjected to hydrophobic treatment, the sidewall of the release layer 204 may be subjected to hydrophobic treatment by UV irradiation, ozone activation, hydrophobic material attachment, etc. according to the material of the second pixel defining layer 205 .

[0063] It is understood that when the second pixel defining layer 205 exists, the second pixel defining layer 205 needs to be removed when the peeling layer 204 is removed. Preferably, when the peeling layer 204 is removed, the second pixel defining layer 205 is removed at the same time. For example, when the peeling layer 204 is made of a magnetic material and is Figure 8 When the lift-off layer 204 is removed in the manner shown, the second pixel defining layer 205 can be removed along with the separation of the lift-off layer 204 from the first pixel defining layer 202 .

[0064] Furthermore, the material of the first pixel defining layer 202 is the same as that of the second pixel defining layer 205. At this time, the sidewall of the first pixel defining layer 202 may be hydrophilized, and the sidewall of the second pixel defining layer 205 may be hydrophobicized in different ways.

[0065] It should be noted that, regarding the method for forming the first pixel defining layer 202 and the peeling layer 204, the first pixel defining layer 202 and the peeling layer 204 may be stacked on the substrate 201, and then the pixel unit may be formed by etching. Alternatively, the pixel unit may be formed on the first pixel defining layer 202 by etching, and then the peeling layer 204 may be obtained by processing the first pixel defining layer 202.

[0066] When the second pixel defining layer 205 is present, the first pixel defining layer 202, the peeling layer 204 and the second pixel defining layer 205 may be sequentially stacked on the substrate 201, and then the pixel unit may be formed by etching. Alternatively, the pixel unit may be first formed on the first pixel defining layer 202 by etching, and then the peeling layer 204 and the second pixel defining layer 205 may be sequentially processed on the first pixel defining layer 202.

[0067] In a specific example, when the second pixel defining layer 205 exists, the method for preparing the light emitting device 200 includes the following steps:

[0068] S201: forming a first pixel defining layer 202 having an opening 203 on a substrate 201; the sidewall of the opening 203 and the surface of the substrate 201 form a pixel unit. At this time, the structure of the light emitting device 200 is as follows: Figure 3 shown.

[0069] S202: forming a peeling layer 204 on the surface of the first pixel defining layer 202 away from the substrate 201. At this time, the structure of the light emitting device 200 is as follows: Figure 4 shown.

[0070] S203: forming a second pixel defining layer 205 on the surface of the peeling layer 204 away from the first pixel defining layer 202. At this time, the structure of the light emitting device 200 is as follows: Figure 6 shown.

[0071] S204: forming a functional layer 206 in the pixel unit, wherein the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202. At this time, the structure of the light emitting device 200 is as follows: Figure 7 shown.

[0072] S205: Remove the peeling layer 204 and the second pixel defining layer 205. At this time, the structure of the light emitting device 200 is as follows: Fig. 9 shown.

[0073] S206: forming a first electrode layer 207 on the surface of the functional layer 206 and the first pixel defining layer 202. At this time, the structure of the light emitting device 200 is as follows: Figure 2 shown.

[0074] It is understood that the thickness of the first pixel defining layer 202 is 300nm to 700nm. For example, the thickness of the first pixel defining layer 202 may be, but is not limited to, 300nm, 350nm, 400nm, 450nm, 500nm, 550nm, 600nm, 650nm, or 700nm. The thickness of the peeling layer 204 is 200nm to 500nm. For example, the thickness of the peeling layer 204 may be, but is not limited to, 300nm, 250nm, 300nm, 350nm, 400nm, 450nm, or 500nm. The thickness of the second pixel defining layer 205 is 100nm to 500nm. For example, the thickness of the second pixel defining layer 205 may be, but is not limited to, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, 450nm, or 500nm. The thickness of the first electrode layer 207 is 15 nm to 25 nm. For example, the thickness of the first electrode layer 207 may be, but is not limited to, 15 nm, 18 nm, 20 nm, 22 nm, or 25 nm. It is also understood that in the actual preparation process, the thickness of the first pixel defining layer 202, the thickness of the peeling layer 204, the thickness of the second pixel defining layer 205, and the thickness of the first electrode layer 207 may be selected according to the thickness of the functional layer 206.

[0075] Another embodiment of the present invention provides a method for preparing a display panel, wherein the display panel includes a light-emitting device, and the method for preparing a display panel includes the above-mentioned method for preparing a light-emitting device.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims, and the description and drawings can be used to interpret the content of the claims.

Claims

1. A method for preparing a light emitting device, characterized in that: The steps include: A first pixel defining layer having an opening is formed on a substrate, wherein a side wall of the opening and a surface of the substrate form a pixel unit; forming a peeling layer on a surface of the first pixel defining layer away from the substrate; a side wall of the first pixel defining layer and a side wall of the peeling layer are located on the same plane; Arranging functional ink in the pixel unit to form a functional layer, wherein the thickness of the functional layer is less than or equal to the thickness of the first pixel defining layer; removing the peeling layer; A first electrode layer is formed on the surfaces of the functional layer and the first pixel defining layer; the thickness of the functional layer is 200nm-700nm; the thickness of the first pixel defining layer is 300nm-700nm.

2. The method for preparing a light emitting device according to claim 1, characterized in that: Before forming the functional layer in the pixel unit, the method further includes the following steps: The side wall of the opening is subjected to a hydrophilic treatment.

3. The method for preparing a light emitting device according to claim 1, characterized in that: Before forming the functional layer in the pixel unit, the method further includes the following steps: The side wall of the release layer is subjected to a hydrophobic treatment.

4. The method for preparing a light emitting device according to claim 1, characterized in that: The material of the peeling layer is magnetic material.

5. The method for preparing a light emitting device according to claim 4, characterized in that: Removing the peeling layer comprises the following steps: The peeling layer is arranged toward the magnetic member, and the peeling layer is removed under the attraction of the magnetic member.

6. The method for preparing a light emitting device according to claim 5, characterized in that: When removing the peeling layer, the following steps are also included before arranging the peeling layer toward the magnetic member: The substrate is heated to control the temperature of the substrate to be 100°C to 300°C.

7. The method for preparing a light emitting device according to any one of claims 1 to 6, characterized in that: An absolute value of a difference between an angle formed by a side wall of the lift-off layer and the substrate surface and an angle formed by a side wall of the first pixel defining layer and the substrate surface is less than or equal to 30°.

8. The method for preparing a light emitting device according to any one of claims 1 to 6, characterized in that: Before forming the functional layer in the pixel unit, the method further includes the following steps: A second pixel defining layer is formed on a surface of the stripping layer away from the first pixel defining layer, and an absolute value of a difference between an angle formed by a side wall of the second pixel defining layer and the substrate surface and an angle formed by a side wall of the first pixel defining layer and the substrate surface is less than or equal to 30°.

9. The method for preparing a light emitting device according to any one of claims 1 to 6, characterized in that: The thickness of the peeling layer is 200nm~500nm.

10. A method for preparing a display panel, characterized in that: The display panel includes a light-emitting device, and the method for preparing the display panel includes the method for preparing a light-emitting device according to any one of claims 1 to 9.

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