Display panel and display device

Abstract

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a substrate, an auxiliary functional film layer, a plurality of connecting electrodes, a plurality of first areas and a plurality of second areas, the auxiliary functional film layer is located on the surface of one side of the substrate, and at least part of the structure of the connecting electrode is located on the surface of the side, away from the substrate, of the auxiliary functional film layer; the first areas are overlapped with the area where the connecting electrode is located, and the second area is located between at least two first areas; in the thickness direction of the substrate, the auxiliary function film layer corresponding to the first area and the auxiliary function film layer corresponding to the second area have a thickness difference. According to the display panel, the flowing path of the eutectic material between the adjacent connecting electrodes is prolonged, mutual contact of the eutectic material in the molten state in the flowing process is prevented, and the risk of short circuit / short circuit between the adjacent connecting electrodes caused by flowing and overflowing of the eutectic material in the molten state is reduced.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] At present, display technology has penetrated into every aspect of people's daily life. Accordingly, more and more materials and technologies are used in display screens, which has brought great convenience to people's daily life and work. Among them, Micro Light Emitting Diode (Micro-LED) display is considered to be the next generation display technology due to its physical characteristics such as ultra-high brightness, high resolution, high contrast, fast response time, low power consumption and high transparency.

[0003] In the prior art, the production of Micro-LED display panels generally requires a Micro-LED mass transfer operation to form a eutectic material on an array substrate. However, eutectic materials, such as silver paste, solder and other metals, will become molten after high temperatures, and the molten eutectic material is affected by gravity and pressure. The eutectic material has good fluidity and will flow toward the surface of the array substrate. At this time, for electrodes with a smaller spacing, the eutectic material may flow between adjacent electrodes and connect the electrodes, resulting in a short circuit / short-circuit at the electrodes, thereby affecting the normal operation of the corresponding electrodes and the preparation yield of the Micro-LED display panel. Summary of the invention

[0004] Embodiments of the present invention provide a display panel and a display device, which effectively reduce the risk of short circuit / short connection between adjacent connecting electrodes due to the flow and overflow of eutectic material in a molten state.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, including a base substrate, an auxiliary functional film layer, a plurality of connection electrodes, a plurality of first regions, and a plurality of second regions;

[0006] The auxiliary functional film layer is located on one side surface of the base substrate, and at least a part of the structure of the connecting electrode is located on one side surface of the auxiliary functional film layer away from the base substrate;

[0007] The first region overlaps with the region where the connecting electrode is located, and the second region is located between at least two of the first regions;

[0008] In the thickness direction of the base substrate, there is a thickness difference between the auxiliary functional film layer corresponding to the first region and the auxiliary functional film layer corresponding to the second region.

[0009] In a second aspect, an embodiment of the present invention further provides a display device, comprising a display panel as described in any one of the first aspects.

[0010] The embodiment of the present invention provides a display panel and a display device, the display panel includes a substrate, an auxiliary functional film layer, a plurality of connecting electrodes, a plurality of first regions and a plurality of second regions; the auxiliary functional film layer is located on a side surface of the substrate, and at least part of the structure of the connecting electrode is located on a side surface of the auxiliary functional film layer away from the substrate; the first region overlaps with the region where the connecting electrode is located, and the second region is located between at least two first regions; in the thickness direction of the substrate, there is a thickness difference between the auxiliary functional film layer corresponding to the first region and the auxiliary functional film layer corresponding to the second region. The display panel effectively increases the step difference between the connecting electrodes and extends the flow path of the eutectic material between the adjacent connecting electrodes by reasonably setting the difference between the thickness of the auxiliary functional film layer corresponding to the region where the connecting electrode is located and the thickness of the auxiliary functional film layer corresponding to the region between at least two adjacent connecting electrodes, thereby preventing the eutectic material in the molten state from contacting each other during the flow process, reducing the risk of short circuit / short-connection between the adjacent connecting electrodes due to the flow and overflow of the eutectic material in the molten state, ensuring the normal operation of the connecting electrodes and the normal display of the display panel, improving the product yield of the display panel, and further reducing the spacing between the connecting electrodes, which is conducive to realizing the narrow frame design of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic cross-sectional structure diagram of a connection electrode in a display panel in the related art;

[0012] Figure 2 is a schematic cross-sectional structure diagram of another connection electrode in a display panel in the related art;

[0013] Figure 3 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention;

[0014] Figure 4 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0015] Figure 5 and Figure 6 2 is a schematic cross-sectional view of two further display panels provided by embodiments of the present invention;

[0016] Figure 7 and Figure 8 2 is a schematic cross-sectional view of two further display panels provided by embodiments of the present invention;

[0017] Fig. 9 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0018] Fig.10 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0019] Fig.11 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0020] Fig.12 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0021] Fig.13 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0022] Fig.14 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0023] Fig.15 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0024] Fig.16 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0026] Figure 1 is a schematic diagram of a cross-sectional structure of a connecting electrode in a display panel in the related art, such as Figure 1As shown, the display panel includes a base substrate 10, an auxiliary functional film layer 20, a plurality of connecting electrodes 30 and a eutectic material layer 50. The auxiliary functional film layer 20 is located on one side surface of the base substrate 10, each connecting electrode 30 is respectively located on one side surface of the auxiliary functional film layer 20 away from the base substrate 10, and the eutectic material layer 50 is respectively located on one side surface of each connecting electrode 30 away from the auxiliary functional film layer 20. It should be noted that the connecting electrode 30 may be a test electrode in the non-display area, and in the process of forming the eutectic material before the anode and cathode electrodes in the display area are bonded to the corresponding display unit, part of the eutectic material will fall in the area where the test electrode is located. In addition, the inventors discovered during their research that in the non-display area of ​​the display panel there are also COG (IC mounted on a glass substrate) pad and IC (integrated circuit board) binding processes, and FOG (FPC mounted on a glass substrate) pad and FPC (flexible circuit board) binding processes. During these two binding processes, due to the heating of the relevant carrier and the pressure head, as well as the pressure head applying pressure, this will affect the connecting electrodes 30 next to the COG pads and the FOG pads. Figure 2 is a schematic cross-sectional structure diagram of another type of connecting electrode in a display panel in the related art, such as Figure 2 As shown, it can be clearly seen that due to the heating of the relevant carrier and the pressure head, as well as the pressurization of the pressure head, the corresponding eutectic material layer 50 in the area where the connecting electrode 30 is located will be in a molten state after high temperature / high pressure, and the eutectic material layer 50 in the molten state is affected by gravity and pressure. The eutectic material layer 50 has good fluidity and will flow toward the surface of the auxiliary functional film layer 20. The eutectic material layer 50 will flow between adjacent connecting electrodes 30, so that the two or even more adjacent connecting electrodes 30 will be short-circuited / short-circuited, thereby affecting the normal operation of the corresponding connecting electrode 30.

[0027] Based on the above technical problems, an embodiment of the present invention provides a display panel. The display panel includes a base substrate, an auxiliary functional film layer, a plurality of connecting electrodes, a plurality of first regions and a plurality of second regions; the auxiliary functional film layer is located on a side surface of the base substrate, and at least part of the structure of the connecting electrode is located on a side surface of the auxiliary functional film layer away from the base substrate; the first region overlaps with the region where the connecting electrode is located, and the second region is located between at least two first regions; in the thickness direction of the base substrate, there is a difference in thickness between the auxiliary functional film layer corresponding to the first region and the auxiliary functional film layer corresponding to the second region.

[0028] According to the technical solution in the embodiment of the present invention, the display panel effectively increases the step difference between the connecting electrodes and extends the flow path of the eutectic material between adjacent connecting electrodes by reasonably setting the difference between the thickness of the auxiliary functional film layer corresponding to the area where the connecting electrode is located and the thickness of the auxiliary functional film layer corresponding to the area between at least two adjacent connecting electrodes, thereby preventing the eutectic material in a molten state from contacting each other during the flow process, reducing the risk of short circuit / short connection between adjacent connecting electrodes due to the flow and overflow of the eutectic material in a molten state, ensuring the normal operation of the connecting electrodes and the normal display of the display panel, improving the product yield of the display panel, and further reducing the spacing between the connecting electrodes, which is conducive to realizing the narrow frame design of the display panel.

[0029] The above is the core idea of ​​the present invention. The technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Figure 3 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention, Figure 4 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Figure 3 and Figure 4 As shown, the display panel includes a base substrate 10, an auxiliary functional film layer 20, a plurality of connecting electrodes 30, a plurality of first regions 41 and a plurality of second regions 42; the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and the connecting electrode 30 is located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10; the first region 41 overlaps with the region where the connecting electrode 30 is located, and the second region 42 is located between at least two first regions 41; in the thickness direction of the base substrate 10, there is a thickness difference between the auxiliary functional film layer 20 corresponding to the first region 41 and the auxiliary functional film layer 20 corresponding to the second region 42.

[0031] Specifically, the display panel includes a plurality of connecting electrodes 30, a plurality of first regions 41 and a plurality of second regions 42. The present embodiment essentially divides the auxiliary functional film layer 20 into corresponding first regions 41 and second regions 42 according to the regions where the connecting electrodes 30 are located, and reasonably adjusts the difference between the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 and the thickness of the auxiliary functional film layer 20 corresponding to the second region 42, so as to reduce the risk of short circuit / short connection between the subsequent connecting electrodes 30 due to the flow and overflow of the eutectic material in the molten state. It can be understood that the difference between the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 and the thickness of the auxiliary functional film layer 20 corresponding to the second region 42 can be achieved in the process of manufacturing the auxiliary functional film layer 20, without the need to set up other film layer structures, and the manufacturing process can be simplified as much as possible. By way of example, the connecting electrodes 30 in the display panel can be arranged in an array or in an irregular arrangement, which is not limited in the present embodiment. The first region 41 overlaps with the region where the connecting electrode 30 is located, that is, the auxiliary functional film layer 20 corresponding to the region where the connecting electrode 30 is located can be divided into the corresponding first region 41, and the auxiliary functional film layer 20 corresponding to the region not including the connecting electrode 30 can be divided into the corresponding second region 42, and the second region 42 is located between at least two first regions 41. Figure 3 and Figure 4 Two adjacent first regions 41 (that is, two adjacent connection electrodes 30) and a second region 42 located between the two first regions 41 (there is a second region 42 between the two adjacent connection electrodes 30) are used as examples for drawing and description. In the thickness direction perpendicular to the base substrate 10, that is, in the first direction X, the first region 41 on the left, the second region 42 in the middle, and the first region 41 on the right are used as examples for description. In addition, the thickness of the base substrate 10 is only an example, and does not limit the actual thickness of the base substrate 10 and the thickness of the auxiliary functional film layer 20.

[0032] Furthermore, the auxiliary functional film layer 20 is located on one side surface of the base substrate 10 . The auxiliary functional film layer 20 can be understood as a stacked structure of an organic material layer and an inorganic material layer. The auxiliary functional film layer 20 can play the role of planarization, isolation, support, etc. Figure 3 and Figure 4 The connecting electrode 30 is shown to be located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10. In the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side may be D1, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle may be D2, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side may be D3. It can be clearly seen that Figure 3 and Figure 4As shown, D1≠D2 and D3≠D2, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is different from the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right is different from the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle. In addition, Figure 3 and Figure 4 As shown, D1=D3, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is the same as the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right. This is only an example. Of course, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left may be different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right.

[0033] So, contrast Figure 3 and Figure 2 , Figure 3 The eutectic material in a molten state corresponding to the connecting electrode 30 in the first area 41 on the left side needs to pass through a longer flow path during the flow process before it can contact the connecting electrode 30 in the first area 41 on the right side, and the eutectic material in a molten state corresponding to the connecting electrode 30 in the first area 41 on the right side needs to pass through a longer flow path during the flow process before it can contact the connecting electrode 30 in the first area 41 on the left side, which effectively reduces the possibility of the eutectic materials in a molten state corresponding to the two adjacent connecting electrodes 30 contacting each other during the flow process and increases the step difference between the connecting electrodes 30. Exemplarily, the eutectic material in a molten state corresponding to the connecting electrode 30 in the first area 41 on the left side can only flow to the left side wall of the recessed structure of the second area 42 in the middle and cannot continue to flow, and the eutectic material in a molten state corresponding to the connecting electrode 30 in the first area 41 on the right side can only flow to the right side wall of the recessed structure of the second area 42 in the middle and cannot continue to flow, so that no short circuit / short-connection will occur between the two adjacent connecting electrodes 30. Similarly, by comparison Figure 4 and Figure 2 , Figure 4The eutectic material in the molten state corresponding to the connection electrode 30 in the first region 41 on the left side needs to pass through a longer flow path during the flow process before it can contact the connection electrode 30 in the first region 41 on the right side, and the eutectic material in the molten state corresponding to the connection electrode 30 in the first region 41 on the right side needs to pass through a longer flow path during the flow process before it can contact the connection electrode 30 in the first region 41 on the left side, which effectively reduces the possibility of the eutectic materials in the molten state corresponding to the two adjacent connection electrodes 30 contacting each other during the flow process, and increases the step difference between the connection electrodes 30. Exemplarily, the eutectic material in the molten state corresponding to the connection electrode 30 in the first region 41 on the left side is blocked by the protruding structure of the second region 42 in the middle and cannot continue to flow, and the eutectic material in the molten state corresponding to the connection electrode 30 in the first region 41 on the right side is blocked by the protruding structure of the second region 42 in the middle and cannot continue to flow, so that a short circuit / short-connection will not occur between the two adjacent connection electrodes 30. In addition, illustratively, the sidewalls of the concave structure or convex structure of the middle second region 42 can be designed to increase the resistance to the flow of the eutectic material as much as possible. The presence of the larger resistance generated by the sidewalls of the concave structure or convex structure consumes the inertial force of the liquid flow inside the eutectic material, slows down the flow, and further improves the effect of preventing the flow of the eutectic material. Exemplarily, the cross-sectional shape of the concave structure or convex structure of the middle second region 42 can be rectangular, trapezoidal, etc.

[0034] Figure 5 and Figure 6 2 is a schematic cross-sectional view of two other display panels provided by embodiments of the present invention. Figure 5 and Figure 6 As shown, the display panel includes a base substrate 10, an auxiliary functional film layer 20, a plurality of connecting electrodes 30, a plurality of first regions 41 and a plurality of second regions 42; the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and a partial structure of the connecting electrode 30 is located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10; the first region 41 overlaps with the region where the connecting electrode 30 is located, and the second region 42 is located between at least two first regions 41; in the thickness direction of the base substrate 10, there is a thickness difference between the auxiliary functional film layer 20 corresponding to the first region 41 and the auxiliary functional film layer 20 corresponding to the second region 42.

[0035] In the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side may be D1, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle may be D2, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side may be D3. It can be clearly seen that Figure 5 and Figure 6As shown, D1≠D2 and D3≠D2, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is different from the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right is different from the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle. In addition, Figure 5 and Figure 6 As shown, D1=D3, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is the same as the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right. This is only an example. Of course, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left may be different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right.

[0036] contrast Figure 5 and Figure 3 , it can be clearly seen that Figure 3 The structure of the connecting electrode 30 is completely located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and Figure 5 Part of the structure of the connecting electrode 30 is located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and the remaining part of the structure of the connecting electrode 30 is located in the auxiliary functional film layer 20. Figure 6 and Figure 4 , it can be clearly seen that Figure 4 The structure of the connecting electrode 30 is completely located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and Figure 6 Part of the structure of the connecting electrode 30 is located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and the remaining part of the structure of the connecting electrode 30 is located in the auxiliary functional film layer 20. In this way, on the basis of ensuring the realization of the electrical connection relationship of the connecting electrode 30, the overall thickness of the display panel can be further compressed, which is conducive to the realization of the ultra-thin design of the display panel. In addition, illustratively, the structure of part of the connecting electrode 30 in the display panel can be completely located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and the structure of the other part of the connecting electrode 30 can be partially located on the side surface of the auxiliary functional film layer 20 away from the base substrate 10, and the part of the structure of the connecting electrode 30 located in the auxiliary functional film layer 20 can be half of the volume of the overall connecting electrode 30 or other proportions. This embodiment is only an example and is not limited here.

[0037] In addition, it should be noted that the present embodiment does not make specific requirements and special restrictions on the specific type of the connecting electrode 30, the specific positions of the first area 41 and the second area 42 in the display panel, etc. In a specific embodiment, optionally, the display panel includes a display area and a non-display area, and the non-display area is at least partially arranged around the display area; the first area 41 and the second area 42 are both arranged in the non-display area. Optionally, the connecting electrode 30 includes a test electrode. Exemplarily, the test electrode can test whether the light-emitting unit in the display area of ​​the display panel emits light normally. It can be understood that the difference in thickness adjustment of the auxiliary functional film layer 20 in the first area 41 and the second area 42 in the present embodiment can effectively reduce the risk of short circuit / short-circuit between adjacent test electrodes due to the flow and overflow of the eutectic material in the molten state, so as to ensure that the test electrode can normally perform the test phase of the display panel. In another specific embodiment, optionally, the display panel includes a display area and a non-display area, and the non-display area is at least partially arranged around the display area; the first area 41 and the second area 42 are both arranged in the display area. Optionally, the connecting electrode 30 includes a bonding electrode. Exemplarily, the bonding electrode can be bonded to the corresponding light-emitting unit. It can be understood that the difference in thickness of the auxiliary functional film layer 20 in the first area 41 and the second area 42 in this embodiment can effectively reduce the risk of short circuit / short-circuit between adjacent bonding electrodes due to the flow and overflow of eutectic material in a molten state, so as to ensure that the bonding electrode can normally perform the mass transfer stage of the display panel.

[0038] Optionally, Figure 7 and Figure 8 2 is a schematic cross-sectional view of two other display panels provided by embodiments of the present invention. Figure 3-Figure 8 As shown, the side surface of the auxiliary functional film layer 20 corresponding to the second region 42 away from the base substrate 10 is located on the same side of the side surface of the auxiliary functional film layer 20 corresponding to at least two adjacent first regions 41 away from the base substrate 10 .

[0039] Specifically, Figure 3 , Figure 5 and Figure 7 The auxiliary functional film layer 20 corresponding to the second middle area 42 shown is located on a side surface away from the base substrate 10 and a side surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is located on a side close to the base substrate 10 away from the base substrate 10. In other words, the upper surface of the auxiliary functional film layer 20 corresponding to the second middle area 42 is located below the upper surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the left. Figure 3 , Figure 5 and Figure 7The side surface of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle shown is away from the base substrate 10 and is located on the side of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side and away from the base substrate 10, which is close to the base substrate 10. In other words, the upper surface of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle is located below the upper surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side. That is, the upper surface of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle is located on the same side of the upper surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the left and the upper surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the right. Similarly, Figure 4 , Figure 6 and Figure 8 The side surface of the auxiliary functional film layer 20 corresponding to the second middle area 42 shown is located on the side of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side, which is away from the substrate substrate 10. In other words, the upper surface of the auxiliary functional film layer 20 corresponding to the second middle area 42 is located above the upper surface of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side. Figure 4 , Figure 6 and Figure 8 The side surface of the auxiliary functional film layer 20 corresponding to the middle second region 42 shown is located on the side of the auxiliary functional film layer 20 corresponding to the first region 41 on the right side away from the substrate 10. In other words, the upper surface of the auxiliary functional film layer 20 corresponding to the middle second region 42 is located above the upper surface of the auxiliary functional film layer 20 corresponding to the right first region 41. That is, the upper surface of the auxiliary functional film layer 20 corresponding to the middle second region 42 is located on the same side of the upper surface of the auxiliary functional film layer 20 corresponding to the first region 41 on the left and the upper surface of the auxiliary functional film layer 20 corresponding to the first region 41 on the right.

[0040] It can be understood that if the auxiliary functional film layer 20 corresponding to the second area 42 is located on the different side of the auxiliary functional film layer 20 corresponding to at least two adjacent first areas 41, which is away from the side surface of the substrate 10, exemplarily, in the first direction X, the auxiliary functional film layer 20 corresponding to the first area 41 on the left is away from the side surface of the substrate 10, the auxiliary functional film layer 20 corresponding to the second area 42 in the middle is away from the side surface of the substrate 10, and the auxiliary functional film layer 20 corresponding to the first area 41 on the right is away from the side surface of the substrate 10, and the heights in the second direction Y are successively increased or decreased. Then, the auxiliary functional film layer 20 corresponding to the first area 41 on the left and the auxiliary functional film layer 20 corresponding to the first area 41 on the right have a larger thickness, and the corresponding eutectic material in the molten state is easily affected by gravity or pressure, and flows downward through the second area 42 in the middle to the connecting electrode 30 in the other first area 41. Therefore, the thickness in this embodiment further limits the thickness of the auxiliary functional film layer 20 corresponding to the adjacent first region 41 and the thickness of the auxiliary functional film layer 20 corresponding to the second region 42 .

[0041] In addition, compared Figure 7 and Figure 3 , it can be clearly seen that Figure 3 The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side is the same as the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side. Figure 7 The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side is different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side, that is, D1≠D3. Figure 8 and Figure 4 , it can be clearly seen that Figure 4 The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side is the same as the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side. Figure 8 The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side is different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side, that is, D1≠D3. In this way, on the basis of ensuring the realization of the electrical connection relationship of the connection electrode 30, the thickness of the corresponding auxiliary functional film layer 20 can be reasonably set according to the position setting of the connection electrode 30, the internal structure setting of the connection electrode 30, etc.

[0042] Optionally, continue to refer to Figure 3 , Figure 5 and Figure 7 In the thickness direction of the base substrate 10 , the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 is greater than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42 .

[0043] Specifically, in the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side may be D1, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle may be D2, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side may be D3. It can be clearly seen that Figure 3 , Figure 5 and Figure 7 As shown, D1>D2, D3>D2, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is greater than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right is greater than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle. The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right may be the same as or different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right. For realizing the difference in thickness of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, exemplarily, the auxiliary functional film layer 20 with uniform thickness can be first deposited on one side surface of the base substrate 10, and then according to the thickness requirements of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 can be made smaller than the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 by etching, digging or raising, or, exemplarily, according to the thickness requirements of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, a half-tone mask plate with precise thickness design can be performed during the deposition process to obtain a thickness of the auxiliary functional film layer 20 corresponding to the second area 42 that is smaller than the thickness of the auxiliary functional film layer 20 corresponding to the first area 41.

[0044] Optionally, continue to refer to Figure 3 , Figure 5 and Figure 7 The auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked together; the thickness of the organic material layer corresponding to the first area 41 is greater than the thickness of the organic material layer corresponding to the second area 42, and / or the thickness of the inorganic material layer corresponding to the first area 41 is greater than the thickness of the inorganic material layer corresponding to the second area 42.

[0045] Specifically, the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked. This embodiment does not specifically limit or make special requirements on the number of film layers of the organic material layer and the inorganic material layer, the thickness values ​​of each film layer of the organic material layer and the inorganic material layer, and the film layer stacking position relationship of the organic material layer and the inorganic material layer. Exemplarily, on one side surface of the base substrate 10, each inorganic material layer can be deposited in sequence first, and then each organic material layer can be deposited in sequence. Exemplarily, on one side surface of the base substrate 10, inorganic material layers and organic material layers can be alternately deposited in sequence, and the number of alternating inorganic material layers and organic material layers can be determined according to actual needs.

[0046] In the thickness direction of the base substrate 10, in order to achieve the purpose of making the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 greater than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42, for at least one organic material layer and at least one inorganic material layer in the auxiliary functional film layer 20, the total film thickness of the organic material layer and the inorganic material layer corresponding to the first region 41 is greater than the total film thickness of the organic material layer and the inorganic material layer corresponding to the second region 42. In a more specific way, there is at least one organic material layer in the auxiliary functional film layer 20, and the thickness of the organic material layer in the first region 41 is greater than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Alternatively, there is at least one inorganic material layer in the auxiliary functional film layer 20, and the thickness of the inorganic material layer in the first region 41 is greater than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Alternatively, there is at least one organic material layer and one inorganic material layer in the auxiliary functional film layer 20, the thickness of the organic material layer in the first region 41 is greater than the thickness in the second region 42, and the thickness of the inorganic material layer in the first region 41 is greater than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Of course, the thickness of each organic material layer and each inorganic material layer in the auxiliary functional film layer 20 is not limited in this embodiment, and the thickness of each organic material layer and each inorganic material layer in the auxiliary functional film layer 20 can be set as needed, so that the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 is greater than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42. In addition, illustratively, there may be at least another organic material layer in each organic material layer and each inorganic material layer of the auxiliary functional film layer 20, and the thickness of the organic material layer in the first region 41 is equal to the thickness in the second region 42. Alternatively, there is at least another inorganic material layer in the auxiliary functional film layer 20, and the thickness of the inorganic material layer in the first region 41 is equal to the thickness in the second region 42. Alternatively, at least another organic material layer and another inorganic material layer exist in the auxiliary functional film layer 20, the thickness of the organic material layer in the first region 41 is equal to the thickness in the second region 42, and the thickness of the inorganic material layer in the first region 41 is equal to the thickness in the second region 42. This embodiment will not be described one by one.

[0047] In a specific embodiment, further, continue to refer to Figure 3 , Figure 5 and Figure 7, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first organic material layer 21 away from the first inorganic material layer 22; the thickness of the first organic material layer 21 corresponding to the second region 42 is less than the thickness of the first organic material layer 21 corresponding to the first region 41, and the thickness of the first inorganic material layer 22 corresponding to the second region 42 is less than the thickness of the first inorganic material layer 22 corresponding to the first region 41. Or, Fig. 9 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig. 9 As shown, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on one side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on one side surface of the first organic material layer 21 away from the first inorganic material layer 22; the thickness of the first organic material layer 21 corresponding to the second region 42 is less than the thickness of the first organic material layer 21 corresponding to the first region 41, and the thickness of the first inorganic material layer 22 corresponding to the second region 42 is equal to the thickness of the first inorganic material layer 22 corresponding to the first region 41.

[0048] Specifically, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22. The first inorganic material layer 22 is located on one side surface of the base substrate 10, and the first inorganic material layer 22 can play an isolating role, separating the base substrate 10 from the first organic material layer 21, and also isolating the electrical connection relationship between the connecting electrode 30 and the base substrate 10. The first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first organic material layer 21 away from the first inorganic material layer 22. For example, Figure 3 and Figure 7 The structure of the connecting electrode 30 shown is completely located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. Figure 5 The structural part of the connecting electrode 30 shown is located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. And, Figure 5The partial structure of the connecting electrode 30 shown as being located in the first organic material layer 21 may be half of the volume of the entire connecting electrode 30 or other proportions. This embodiment is only an example and is not limited here. For example, the surface of the connecting electrode 30 on one side close to the base substrate 10 may fall on the film layer interface between the first organic material layer 21 and the first inorganic material layer 22. In addition, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left side may be the same as or different from the thickness of the first organic material layer 21 corresponding to the first area 41 on the right side, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left side may be the same as or different from the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right side.

[0049] In the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left side may be D4, the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left side may be D5, the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle may be D6, the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle may be D7, the thickness of the first organic material layer 21 corresponding to the first area 41 on the right side may be D8, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right side may be D9. It can be clearly seen that Figure 3 , Figure 5 and Figure 7 As shown, D4>D6, D8>D6, that is, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left is greater than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, and the thickness of the first organic material layer 21 corresponding to the first area 41 on the right is greater than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle. And, Figure 3 , Figure 5 and Figure 7 As shown, D5>D7 and D9>D7, that is, the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left is greater than the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right is greater than the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle.

[0050] contrast Fig. 9 and Figure 3 , it can be clearly seen that Figure 3 As shown, D5>D7, D9>D7, and Fig. 9As shown, D5=D7=D9, that is, the thickness of the first inorganic material layer 22 in the first region 41 and the thickness in the second region 42 are the same. It can be understood that, compared with the first inorganic material layer 22, the first organic material layer 21 is prepared with a larger thickness, and the thickness of the first organic material layer 21 can be more accurately controlled, while the first inorganic material layer 22 is prepared with a smaller thickness, which can reduce the design of different thicknesses of the first inorganic material layer 22 in the first region 41 and the second region 42, and further simplify the preparation steps.

[0051] Optionally, Fig.10 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.10 As shown, the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked together; the total number of film layers of the organic material layers and the inorganic material layers corresponding to the first area 41 is greater than the total number of film layers of the organic material layers and the inorganic material layers corresponding to the second area 42.

[0052] Specifically, the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked. This embodiment does not specifically limit or make special requirements on the number of film layers of the organic material layer and the inorganic material layer, the thickness values ​​of each film layer of the organic material layer and the inorganic material layer, and the film layer stacking position relationship of the organic material layer and the inorganic material layer. Exemplarily, on one side surface of the base substrate 10, each inorganic material layer can be deposited in sequence first, and then each organic material layer can be deposited in sequence. Exemplarily, on one side surface of the base substrate 10, inorganic material layers and organic material layers can be alternately deposited in sequence, and the number of alternating inorganic material layers and organic material layers can be determined according to actual needs.

[0053] In the thickness direction of the base substrate 10, in order to achieve the purpose of making the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 greater than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42, for at least one organic material layer and at least one inorganic material layer in the auxiliary functional film layer 20, the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region 41 is greater than the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region 42. In a more specific manner, the thickness of the organic material layer and the inorganic material layer in the auxiliary functional film layer 20 can be pre-set to be the same, then the more the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region 41 is, the greater the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 is, and the fewer the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region 42 is, the smaller the thickness of the auxiliary functional film layer 20 corresponding to the second region 42 is. In addition, of course, even if the thicknesses of the organic material layer and the inorganic material layer in the auxiliary functional film layer 20 are different, the difference between the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first area 41 and the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second area 42 can be increased so that the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 is greater than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42.

[0054] In a specific embodiment, further, continue to refer to Fig.10 , the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on one side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on one side surface of the first organic material layer 21 away from the first inorganic material layer 22. Among them, the total number of film layers of the first organic material layer 21 and the first inorganic material layer 22 corresponding to the first region 41 is greater than the total number of film layers of the first organic material layer 21 and the first inorganic material layer 22 corresponding to the second region 42. In other words, the first region 41 includes the first organic material layer 21 and the first inorganic material layer 22, while the second region 42 only includes the first inorganic material layer 22. Exemplarily, the first inorganic material layer 22 and the first organic material layer 21 can be deposited and formed on one side surface of the base substrate 10 in sequence, and then the first organic material layer 21 in the second region 42 is completely removed by etching or the like.

[0055] Specifically, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22. The first inorganic material layer 22 is located on one side surface of the base substrate 10, and the first inorganic material layer 22 can play an isolating role, separating the base substrate 10 from the first organic material layer 21, and also isolating the electrical connection relationship between the connecting electrode 30 and the base substrate 10. The first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first organic material layer 21 away from the first inorganic material layer 22. For example, Fig.10 The structure of the connecting electrode 30 shown is completely located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. Of course, the structure of the connecting electrode 30 may also be partially located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. Also, the thickness of the first organic material layer 21 corresponding to the first region 41 on the left side may be the same as or different from the thickness of the first organic material layer 21 corresponding to the first region 41 on the right side. The thickness of the first inorganic material layer 22 corresponding to the first region 41 on the left side may be the same as or different from the thickness of the first inorganic material layer 22 corresponding to the first region 41 on the right side. This embodiment is illustrated here only with the same thickness.

[0056] contrast Fig.10 and Fig. 9 , it can be clearly seen that Fig. 9 and Fig.10 The thickness of the first inorganic material layer 22 in the first region 41 and the thickness in the second region 42 are the same. Fig. 9 The thickness of the first organic material layer 21 corresponding to the first area 41 on the left is greater than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, and the thickness of the first organic material layer 21 corresponding to the first area 41 on the right is greater than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, that is, Fig. 9 The middle second region 42 shown includes the first organic material layer 21, and Fig.10 The second region 42 in the middle shown does not include the first organic material layer 21. In a simpler way, in order to achieve the difference in thickness between the auxiliary functional film layer 20 corresponding to the first region 41 and the auxiliary functional film layer 20 corresponding to the second region 42, the thickness of the first organic material layer 21 in the second region 42 can be etched to any thickness (the thickness of the first organic material layer 21 in the second region 42 is less than the thickness of the first organic material layer 21 in the left and right first regions 41), and the first organic material layer 21 can also be completely etched away. Fig.10On the basis of, the thickness of the first inorganic material layer 22 in the middle second region 42 can be etched to any thickness (the thickness of the first inorganic material layer 22 in the second region 42 is less than the thickness of the first inorganic material layer 22 in the left and right first regions 41), and the first inorganic material layer 22 can also be completely etched away. By way of example, in another embodiment, the first region 41 includes a first organic material layer 21 and a first inorganic material layer 22 stacked in sequence, while the second region 42 does not include the first organic material layer 21 and the first inorganic material layer 22. By way of example, the first inorganic material layer 22 and the first organic material layer 21 can be sequentially deposited on the surface of one side of the base substrate 10, and then the first organic material layer 21 and the first inorganic material layer 22 in the second region 42 can be completely removed by etching or the like. In this way, the flow path of the eutectic material between adjacent connecting electrodes 30 is further increased, and the risk of short circuit / short-circuit between adjacent connecting electrodes 30 due to the flow and overflow of the molten eutectic material is reduced. The complete etching of the first organic material layer 21 and / or the first inorganic material layer 22 can also further simplify the etching process.

[0057] Optionally, continue to refer to Figure 4 , Figure 6 and Figure 8 In the thickness direction of the base substrate 10 , the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 is smaller than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42 .

[0058] Specifically, in the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left side may be D1, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle may be D2, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right side may be D3. It can be clearly seen that Figure 4 , Figure 6 and Figure 8As shown, D1<D2, D3<D2, that is, the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left is less than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle, and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right is less than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 in the middle. The thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the left and the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right may be the same as or different from the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 on the right. For realizing the difference in thickness of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, exemplarily, the auxiliary functional film layer 20 with uniform thickness can be first deposited on the surface of one side of the base substrate 10, and then according to the thickness requirements of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, the thickness of the auxiliary functional film layer 20 corresponding to the second area 42 can be made greater than the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 by etching, digging or raising, or, exemplarily, according to the thickness requirements of the auxiliary functional film layer 20 in the first area 41 and in the second area 42, a half-tone mask plate with precise thickness design can be performed during the deposition process to obtain a thickness of the auxiliary functional film layer 20 corresponding to the second area 42 that is greater than the thickness of the auxiliary functional film layer 20 corresponding to the first area 41.

[0059] In addition, optionally, continue to refer to Figure 4 , Figure 6 and Figure 8 In the thickness direction of the base substrate 10, the height of the auxiliary functional film layer 20 corresponding to the second region 42 away from the side surface of the base substrate 10 is higher than the height of the connecting electrode 30 away from the side surface of the base substrate 10. In this way, the auxiliary functional film layer 20 corresponding to the second region 42 can achieve a blocking effect on the molten eutectic material.

[0060] Optionally, continue to refer to Figure 4 , Figure 6 and Figure 8 The auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked together; the thickness of the organic material layer corresponding to the first area 41 is less than the thickness of the organic material layer corresponding to the second area 42, and / or the thickness of the inorganic material layer corresponding to the first area 41 is less than the thickness of the inorganic material layer corresponding to the second area 42.

[0061] Specifically, the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked. This embodiment does not specifically limit or make special requirements on the number of film layers of the organic material layer and the inorganic material layer, the thickness values ​​of each film layer of the organic material layer and the inorganic material layer, and the film layer stacking position relationship of the organic material layer and the inorganic material layer. Exemplarily, on one side surface of the base substrate 10, each inorganic material layer can be deposited in sequence first, and then each organic material layer can be deposited in sequence. Exemplarily, on one side surface of the base substrate 10, inorganic material layers and organic material layers can be alternately deposited in sequence, and the number of alternating inorganic material layers and organic material layers can be determined according to actual needs.

[0062] In the thickness direction of the base substrate 10, in order to achieve the purpose of making the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 smaller than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42, for at least one organic material layer and at least one inorganic material layer in the auxiliary functional film layer 20, the total film thickness of the organic material layer and the inorganic material layer corresponding to the first region 41 is smaller than the total film thickness of the organic material layer and the inorganic material layer corresponding to the second region 42. In a more specific way, there is at least one organic material layer in the auxiliary functional film layer 20, and the thickness of the organic material layer in the first region 41 is smaller than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Alternatively, there is at least one inorganic material layer in the auxiliary functional film layer 20, and the thickness of the inorganic material layer in the first region 41 is smaller than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Alternatively, there is at least one organic material layer and one inorganic material layer in the auxiliary functional film layer 20, the thickness of the organic material layer in the first region 41 is less than the thickness in the second region 42, and the thickness of the inorganic material layer in the first region 41 is less than the thickness in the second region 42, and the thickness of other organic material layers and inorganic material layers can be set arbitrarily. Of course, the thickness of each organic material layer and each inorganic material layer in the auxiliary functional film layer 20 is not limited in this embodiment, and the thickness of each organic material layer and each inorganic material layer in the auxiliary functional film layer 20 can be set as needed, so that the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 is less than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42. In addition, illustratively, there may be at least another organic material layer in each organic material layer and each inorganic material layer of the auxiliary functional film layer 20, and the thickness of the organic material layer in the first region 41 is equal to the thickness in the second region 42. Alternatively, there is at least another inorganic material layer in the auxiliary functional film layer 20, and the thickness of the inorganic material layer in the first region 41 is equal to the thickness in the second region 42. Alternatively, at least another organic material layer and another inorganic material layer exist in the auxiliary functional film layer 20, the thickness of the organic material layer in the first region 41 is equal to the thickness in the second region 42, and the thickness of the inorganic material layer in the first region 41 is equal to the thickness in the second region 42. This embodiment will not be described one by one.

[0063] In a specific embodiment, further, continue to refer to Figure 4 , Figure 6 and Figure 8, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first organic material layer 21 away from the first inorganic material layer 22; the thickness of the first organic material layer 21 corresponding to the second region 42 is greater than the thickness of the first organic material layer 21 corresponding to the first region 41, and the thickness of the first inorganic material layer 22 corresponding to the second region 42 is greater than the thickness of the first inorganic material layer 22 corresponding to the first region 41. Or, Fig.11 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.11 As shown, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on one side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on one side surface of the first organic material layer 21 away from the first inorganic material layer 22; the thickness of the first organic material layer 21 corresponding to the second region 42 is greater than the thickness of the first organic material layer 21 corresponding to the first region 41, and the thickness of the first inorganic material layer 22 corresponding to the second region 42 is equal to the thickness of the first inorganic material layer 22 corresponding to the first region 41.

[0064] Specifically, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22. The first inorganic material layer 22 is located on one side surface of the base substrate 10, and the first inorganic material layer 22 can play an isolating role, separating the base substrate 10 from the first organic material layer 21, and also isolating the electrical connection relationship between the connecting electrode 30 and the base substrate 10. The first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first organic material layer 21 away from the first inorganic material layer 22. For example, Figure 4 and Figure 8 The structure of the connecting electrode 30 shown is completely located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. Figure 6 The structural part of the connecting electrode 30 shown is located on the surface of the first organic material layer 21 away from the first inorganic material layer 22. And, Figure 6The partial structure of the connecting electrode 30 shown as being located in the first organic material layer 21 may be half of the volume of the entire connecting electrode 30 or other proportions. This embodiment is only an example and is not limited here. For example, the surface of the connecting electrode 30 on one side close to the base substrate 10 may fall on the film layer interface between the first organic material layer 21 and the first inorganic material layer 22. In addition, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left side may be the same as or different from the thickness of the first organic material layer 21 corresponding to the first area 41 on the right side, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left side may be the same as or different from the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right side.

[0065] In the thickness direction of the base substrate 10, that is, in the second direction Y, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left side may be D4, the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left side may be D5, the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle may be D6, the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle may be D7, the thickness of the first organic material layer 21 corresponding to the first area 41 on the right side may be D8, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right side may be D9. It can be clearly seen that Figure 4 , Figure 6 and Figure 8 As shown, D4<D6 and D8<D6, that is, the thickness of the first organic material layer 21 corresponding to the first area 41 on the left is less than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, and the thickness of the first organic material layer 21 corresponding to the first area 41 on the right is less than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle. And, Figure 4 , Figure 6 and Figure 8 As shown, D5<D7, D9<D7, that is, the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the left is smaller than the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle, and the thickness of the first inorganic material layer 22 corresponding to the first area 41 on the right is smaller than the thickness of the first inorganic material layer 22 corresponding to the second area 42 in the middle.

[0066] contrast Fig.11 and Figure 4 , it can be clearly seen that Figure 4 As shown, D5<D7, D9<D7, and Fig.11As shown, D5=D7=D9, that is, the thickness of the first inorganic material layer 22 in the first region 41 and the thickness in the second region 42 are the same. It can be understood that, compared with the first inorganic material layer 22, the first organic material layer 21 is prepared with a larger thickness, and the thickness of the first organic material layer 21 can be more accurately controlled, while the first inorganic material layer 22 is prepared with a smaller thickness, which can reduce the design of different thicknesses of the first inorganic material layer 22 in the first region 41 and the second region 42, and further simplify the preparation steps.

[0067] Optionally, Fig.12 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.12 As shown, the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked together; the total number of film layers of the organic material layers and the inorganic material layers corresponding to the first area 41 is less than the total number of film layers of the organic material layers and the inorganic material layers corresponding to the second area 42.

[0068] Specifically, the auxiliary functional film layer 20 is located on one side surface of the base substrate 10, and the auxiliary functional film layer 20 includes at least one organic material layer and at least one inorganic material layer stacked. This embodiment does not specifically limit or make special requirements on the number of film layers of the organic material layer and the inorganic material layer, the thickness values ​​of each film layer of the organic material layer and the inorganic material layer, and the film layer stacking position relationship of the organic material layer and the inorganic material layer. Exemplarily, on one side surface of the base substrate 10, each inorganic material layer can be deposited in sequence first, and then each organic material layer can be deposited in sequence. Exemplarily, on one side surface of the base substrate 10, inorganic material layers and organic material layers can be alternately deposited in sequence, and the number of alternating inorganic material layers and organic material layers can be determined according to actual needs.

[0069] In the thickness direction of the base substrate 10, in order to achieve the purpose of making the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 smaller than the thickness of the auxiliary functional film layer 20 corresponding to the second region 42, for at least one organic material layer and at least one inorganic material layer in the auxiliary functional film layer 20, the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region 41 is smaller than the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region 42. In a more specific manner, the thickness of the organic material layer and the inorganic material layer in the auxiliary functional film layer 20 can be pre-set to be the same, then the smaller the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region 41, the smaller the thickness of the auxiliary functional film layer 20 corresponding to the first region 41, and the greater the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region 42, the greater the thickness of the auxiliary functional film layer 20 corresponding to the second region 42. In addition, of course, even if the thicknesses of the organic material layer and the inorganic material layer in the auxiliary functional film layer 20 are different, the difference between the total number of film layers of the organic material layer and the inorganic material layer corresponding to the first area 41 and the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second area 42 can be increased so that the thickness of the auxiliary functional film layer 20 corresponding to the first area 41 is smaller than the thickness of the auxiliary functional film layer 20 corresponding to the second area 42.

[0070] In a specific embodiment, further, continue to refer to Fig.12 , the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22; the first inorganic material layer 22 is located on one side surface of the base substrate 10, the first organic material layer 21 is located on one side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on one side surface of the first inorganic material layer 22 away from the base substrate 10. Among them, the total number of film layers of the first organic material layer 21 and the first inorganic material layer 22 corresponding to the first region 41 is greater than the total number of film layers of the first organic material layer 21 and the first inorganic material layer 22 corresponding to the second region 42. In other words, the second region 42 includes the first organic material layer 21 and the first inorganic material layer 22, while the first region 41 only includes the first inorganic material layer 22. Exemplarily, the first inorganic material layer 22 and the first organic material layer 21 can be deposited and formed on one side surface of the base substrate 10 in sequence, and then the first organic material layer 21 in the first region 41 is completely removed by etching or the like.

[0071] Specifically, the auxiliary functional film layer 20 includes a first organic material layer 21 and a first inorganic material layer 22. The first inorganic material layer 22 is located on one side surface of the base substrate 10, and the first inorganic material layer 22 can play an isolating role, separating the base substrate 10 from the first organic material layer 21, and also isolating the electrical connection relationship between the connecting electrode 30 and the base substrate 10. The first organic material layer 21 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10, and at least part of the structure of the connecting electrode 30 is located on the side surface of the first inorganic material layer 22 away from the base substrate 10. For example, Fig.12 The structure of the connecting electrode 30 shown is completely located on the surface of the first inorganic material layer 22 away from the base substrate 10. Of course, the structure of the connecting electrode 30 may also be partially located on the surface of the first inorganic material layer 22 away from the base substrate 10. Also, the thickness of the first inorganic material layer 22 corresponding to the first region 41 on the left side and the thickness of the first inorganic material layer 22 corresponding to the first region 41 on the right side may be the same or different. This embodiment is only illustrated with the same thickness.

[0072] contrast Fig.12 and Fig.11 , it can be clearly seen that Fig.11 and Fig.12 The thickness of the first inorganic material layer 22 in the first region 41 and the thickness in the second region 42 are the same. Fig.11 The thickness of the first organic material layer 21 corresponding to the first area 41 on the left is less than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, and the thickness of the first organic material layer 21 corresponding to the first area 41 on the right is less than the thickness of the first organic material layer 21 corresponding to the second area 42 in the middle, that is, Fig.11 The first region 41 on the left side includes the first organic material layer 21, and the first region 41 on the right side includes the first organic material layer 21. Fig.12 The first area 41 on the left side shown does not include the first organic material layer 21, and the first area 41 on the right side does not include the first organic material layer 21. In a simpler way, in order to achieve the thickness difference between the auxiliary functional film layer 20 corresponding to the first area 41 and the auxiliary functional film layer 20 corresponding to the second area 42, the thickness of the first organic material layer 21 in the first area 41 on the left side and the first area 41 on the right side can be etched to any thickness (the thickness of the first organic material layer 21 in the second area 42 is greater than the thickness of the first organic material layer 21 in the first area 41 on the left and the right), and the first organic material layer 21 can also be completely etched away. Furthermore, in Fig.12On the basis of, the thickness of the first inorganic material layer 22 in the first region 41 on the left and the first region 41 on the right can be etched to any thickness (the thickness of the first inorganic material layer 22 in the second region 42 is greater than the thickness of the first inorganic material layer 22 in the first region 41 on the left and the right), and the first inorganic material layer 22 can also be completely etched away. Exemplarily, in another embodiment, the first region 41 includes a first organic material layer 21 and a first inorganic material layer 22 stacked in sequence, and the second region 42 includes a first organic material layer 21, a first inorganic material layer 22 and a third padding material layer stacked in sequence. Exemplarily, the third padding material layer can be located on a side surface of the first organic material layer 21 away from the first inorganic material layer 22, or the third padding material layer can also be located on a side surface of the first inorganic material layer 22 close to the base substrate 10. For example, the first inorganic material layer 22, the first organic material layer 21, and the third padding material layer may be sequentially deposited on the surface of one side of the base substrate 10, and the thickness of the third padding material layer is used to increase the overall thickness of the auxiliary functional film layer 20 in the second region 42. In this way, the thickness of the third padding material layer can block the flowing eutectic material, further increasing the flow path of the eutectic material between adjacent connecting electrodes 30, and reducing the risk of short circuit / short-connection between adjacent connecting electrodes 30 due to the flow and overflow of the eutectic material in a molten state.

[0073] The above embodiments describe several possible forms of the thickness difference between the auxiliary functional film layer corresponding to the first area and the auxiliary functional film layer corresponding to the second area, and simply illustrate that at least part of the structure of the connecting electrode can be located on the surface of the auxiliary functional film layer away from the base substrate. The following embodiments will describe in detail the specific structure of the connecting electrode, as well as the positional relationship between the connecting electrode and each film layer in the auxiliary functional film layer, to further enrich the technical solution of this embodiment.

[0074] Optionally, Fig.13 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.13 As shown, the connecting electrode 30 includes at least two electrode divisions electrically connected in sequence, and the auxiliary functional film layer 20 includes at least two insulating film layers stacked in sequence; in the same area where the connecting electrode 30 is located, each electrode division is spaced apart from each insulating film layer.

[0075] Specifically, in the area where the same connecting electrode 30 is located, each electrode division is spaced apart from each insulating film layer, and adjacent electrode divisions are electrically connected to each other. The insulating film layers spaced apart from adjacent electrode divisions can also separate the corresponding electrode divisions to avoid short circuits / short-circuits between adjacent electrode divisions. Each electrode division is spaced apart from each insulating film layer, and the overall conductivity, stability, reliability and scalability of the connecting electrode 30 can also be ensured.

[0076] In a specific embodiment, optionally, continue to refer to Fig.13 The electrode portion includes a first portion 31 and a second portion 32; the insulating film layer includes a first organic layer 23 and a second organic layer 24; the first organic layer 23 is located on one side surface of the base substrate 10, the first portion 31 is located on one side surface of the first organic layer 23 away from the base substrate 10, the second organic layer 24 is located on one side surface of the first portion 31 away from the first organic layer 23, the second portion 32 is located on one side surface of the second organic layer 24 away from the first portion 31, and the second portion 32 is in contact with and electrically connected to the first portion 31.

[0077] Specifically, the first organic layer 23 is located on one side surface of the base substrate 10, and the first part 31 is located on one side surface of the first organic layer 23 away from the base substrate 10. By way of example, in the area where the connecting electrode 30 is to be prepared, the first organic layer 23 can be first deposited on one side surface of the base substrate 10, and then the first organic layer 23 is etched and grooved, and finally the first part 31 is formed in the grooved area. By way of example, a partial area of ​​the first part 31 may also be located on one side surface of the first organic layer 23 near the grooved area. The second organic layer 24 is located on the side surface of the first part 31 away from the first organic layer 23, and the second part 32 is located on the side surface of the second organic layer 24 away from the first part 31. For example, in the area where the first part 31 is formed, the second organic layer 24 can be first deposited on the side surface of the first part 31 away from the first organic layer 23, and then the second organic layer 24 is etched and grooved, and finally the second part 32 is formed in the grooved area. For example, the grooved area can completely remove the second organic layer 24 above the first part 31, so that the second part 32 is in contact with the first part 31 and electrically connected. In addition, for example, the grooved area can partially remove the second organic layer 24 above the first part 31, and the second part 32 can be electrically connected to the first part 31 through other connecting parts, and the connecting part is located in the second organic layer 24 that is not removed, and one end of the connecting part is electrically connected to the second part 32, and the other end of the connecting part is electrically connected to the first part 31. This embodiment is only an example and is not limited here.

[0078] Further, continue to refer to Fig.13The electrode portion also includes a third portion 33; the insulating film layer also includes a first inorganic layer 25; the third portion 33 is located on one side surface of the base substrate 10, the first inorganic layer 25 is located on one side surface of the third portion 33 away from the base substrate 10, the first organic layer 23 is located on one side surface of the first inorganic layer 25 away from the third portion 33, and the third portion 33 is electrically connected to the first portion 31.

[0079] Specifically, the third portion 33 is located on one side surface of the substrate 10, and the first inorganic layer 25 is located on one side surface of the third portion 33 away from the substrate 10. For example, in the area where the connecting electrode 30 is to be prepared, the third portion 33 can be first formed on one side surface of the substrate 10, and then the first inorganic layer 25 is deposited on one side surface of the third portion 33 away from the substrate 10. The third portion 33 can also be understood as being wrapped in the first inorganic layer 25. The first organic layer 23 is located on one side surface of the first inorganic layer 25 away from the third portion 33. For example, the first organic layer 23 is deposited on one side surface of the first inorganic layer 25 away from the third portion 33, and the third portion 33 is electrically connected to the first portion 31. The setting of the third portion 33 can relatively raise the position height of the entire connecting electrode 30, so that at least part of the structure of the second portion 32 can be located on one side surface of the auxiliary functional film layer 20 away from the substrate 10.

[0080] In a specific embodiment, optionally, continue to refer to Fig.13 The electrode portion further includes a connecting portion 34 ; the connecting portion 34 is located in the first inorganic layer 25 , and the third portion 33 is electrically connected to the first portion 31 via the connecting portion 34 .

[0081] Specifically, one end of the connection part 34 is electrically connected to the third part 33, and the other end of the connection part 34 is electrically connected to the first part 31. The setting of the connection part 34 can realize the electrical connection relationship between the third part 33 and the first part 31 in a non-contact state. Further, the connection part 34 includes a plurality of connection sub-parts 341. The third part 33 and the first part 31 can be electrically connected through any one of the connection sub-parts 341. The setting of the plurality of connection sub-parts 341 can be conducive to the stability of the electrical connection between the third part 33 and the first part 31. Even if one of the connection sub-parts 341 is abnormal, the third part 33 and the first part 31 can still establish an electrical connection relationship through other connection sub-parts 341.

[0082] Optionally, continue to refer to Fig.13 The insulating film layer further includes a second inorganic layer 26 ; the second inorganic layer 26 is located between the base substrate 10 and the first inorganic layer 25 , and the third portion 33 is located on a surface of the second inorganic layer 26 away from the base substrate 10 .

[0083] Specifically, the second inorganic layer 26 is located between the base substrate 10 and the first inorganic layer 25 . The second inorganic layer 26 can separate the third portion 33 from the base substrate 10 to avoid contact interference between the two and ensure the normal operation of the third portion 33 .

[0084] Optionally, continue to refer to Fig.13 The second portion 32 includes a groove structure 321 ; the display panel further includes a eutectic material layer 50 , and the eutectic material layer 50 is disposed in the groove structure 321 .

[0085] Specifically, the second portion 32 includes a groove structure 321, and the groove structure 321 can effectively collect and block the eutectic material layer 50, effectively reducing the flow and overflow of the eutectic material in the molten state. Exemplarily, the material of the eutectic material layer 50 can be a metal such as tin (Sn). Exemplarily, the material of the second portion 32 can be a metal such as gold (Au), silver (Ag), etc.

[0086] Fig.13It can be understood as a specific embodiment that combines the specific structure of the connecting electrode 30, the positional relationship between the connecting electrode 30 and each film layer in the auxiliary functional film layer 20, and the difference in the thickness of the auxiliary functional film layer 20 corresponding to the first region 41 and the thickness of the auxiliary functional film layer 20 corresponding to the second region 42. Among them, the electrode division of the connecting electrode 30 includes the first part 31, the second part 32, the third part 33 and the connecting part 34, and the insulating film layer of the auxiliary functional film layer 20 includes the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26. In this embodiment, the position setting of each electrode division and each insulating film layer is not further described. It can be clearly seen that the first region 41 includes the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26, while the second region 42 only includes the first inorganic layer 25 and the second inorganic layer 26. In other words, the total number of film layers of the insulating film layer corresponding to the first region 41 is greater than the total number of film layers of the insulating film layer corresponding to the second region 42. In this embodiment, it is pre-set that the thickness of the first inorganic layer 25 corresponding to the first region 41 and the thickness of the first inorganic layer 25 corresponding to the second region 42 are the same, and the thickness of the second inorganic layer 26 corresponding to the first region 41 and the thickness of the second inorganic layer 26 corresponding to the second region 42 are the same, then the total film thickness of the insulating film layer corresponding to the first region 41 is greater than the total film thickness of the insulating film layer corresponding to the second region 42. From another perspective, it can also be understood that the first region 41 and the second region 42 both include the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26, but the thickness of the first organic layer 23 corresponding to the second region 42 is 0, and the thickness of the second organic layer 24 corresponding to the second region 42 is 0, which also achieves the purpose of the total film thickness of the insulating film layer corresponding to the first region 41 being greater than the total film thickness of the insulating film layer corresponding to the second region 42.

[0087] same, Fig.14 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.14As shown, it can be clearly seen that the first region 41 includes the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26, while the second region 42 does not include any insulating film layer. In other words, the total number of film layers of the insulating film layers corresponding to the first region 41 is greater than the total number of film layers of the insulating film layers corresponding to the second region 42, and the total film layer thickness of the insulating film layers corresponding to the first region 41 is greater than the total film layer thickness of the insulating film layers corresponding to the second region 42. From another perspective, it can also be understood that the first region 41 and the second region 42 both include the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26, but the thickness of the first organic layer 23 corresponding to the second region 42 is 0, the thickness of the second organic layer 24 corresponding to the second region 42 is 0, the thickness of the first inorganic layer 25 corresponding to the second region 42 is 0, and the thickness of the second inorganic layer 26 corresponding to the second region 42 is 0, which also achieves the purpose of the total film thickness of the insulating film layer corresponding to the first region 41 being greater than the total film thickness of the insulating film layer corresponding to the second region 42.

[0088] as well as, Fig.15 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, such as Fig.15As shown, the electrode portion of the connecting electrode 30 includes a first portion 31, a second portion 32, a third portion 33 and a connecting portion 34, and the insulating film layer of the auxiliary functional film layer 20 includes a first organic layer 23, a second organic layer 24, a first inorganic layer 25 and a second inorganic layer 26. In this embodiment, the position settings of each electrode portion and each insulating film layer are not further described. It can be clearly seen that both the first region 41 and the second region 42 include a first organic layer 23, a second organic layer 24, a first inorganic layer 25 and a second inorganic layer 26, and the thickness of the first organic layer 23 corresponding to the first region 41 is less than the thickness of the first organic layer 23 corresponding to the second region 42, the thickness of the second organic layer 24 corresponding to the first region 41 is less than the thickness of the second organic layer 24 corresponding to the second region 42, the thickness of the first inorganic layer 25 corresponding to the first region 41 is less than the thickness of the first inorganic layer 25 corresponding to the second region 42, the thickness of the second inorganic layer 26 corresponding to the first region 41 is less than the thickness of the second inorganic layer 26 corresponding to the second region 42, then the total film thickness of the insulating film layer corresponding to the first region 41 is greater than the total film thickness of the insulating film layer corresponding to the second region 42. In addition, it can be understood that the thickness of any one of the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26 corresponding to the first region 41 is less than the corresponding thickness in the second region 42, so that the total film thickness of the insulating film layer corresponding to the first region 41 is greater than the total film thickness of the insulating film layer corresponding to the second region 42. This embodiment is only an example and is not limited here. For example, in another specific embodiment, the first region 41 and the second region 42 both include the first organic layer 23, the second organic layer 24, the first inorganic layer 25 and the second inorganic layer 26, and the thickness of the first organic layer 23 corresponding to the first region 41 is less than the thickness of the first organic layer 23 corresponding to the second region 42, the thickness of the second organic layer 24 corresponding to the first region 41 is equal to the thickness of the second organic layer 24 corresponding to the second region 42, the thickness of the first inorganic layer 25 corresponding to the first region 41 is equal to the thickness of the first inorganic layer 25 corresponding to the second region 42, and the thickness of the second inorganic layer 26 corresponding to the first region 41 is equal to the thickness of the second inorganic layer 26 corresponding to the second region 42.

[0089] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Fig.16 is a schematic diagram of the structure of a display device provided by an embodiment of the present invention, such as Fig.16 As shown, the display device includes a display panel 1 as provided in any one of the embodiments of the present invention. Therefore, the display device provided in the embodiment of the present invention has the corresponding beneficial effects of the display panel 1 provided in the embodiment of the present invention, which will not be described in detail here. Exemplarily, the display device can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, which is not limited in the embodiment of the present invention.

[0090] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: It includes a substrate, an auxiliary functional film layer, a plurality of connecting electrodes, a plurality of first regions and a plurality of second regions; The auxiliary functional film layer is located on one side surface of the base substrate, and at least a part of the structure of the connecting electrode is located on one side surface of the auxiliary functional film layer away from the base substrate; The first region overlaps with the region where the connecting electrode is located, and the second region is located between at least two of the first regions; In the thickness direction of the base substrate, there is a thickness difference between the auxiliary functional film layer corresponding to the first region and the auxiliary functional film layer corresponding to the second region.

2. The display panel according to claim 1, characterized in that: A surface of the auxiliary functional film layer corresponding to the second region that is away from the base substrate is located on the same side of the surfaces of the auxiliary functional film layer corresponding to at least two adjacent first regions that are away from the base substrate.

3. The display panel according to claim 1, characterized in that: In the thickness direction of the base substrate, the thickness of the auxiliary functional film layer corresponding to the first region is greater than the thickness of the auxiliary functional film layer corresponding to the second region.

4. The display panel according to claim 3, characterized in that: The auxiliary functional film layer includes at least one organic material layer and at least one inorganic material layer stacked; The thickness of the organic material layer corresponding to the first region is greater than the thickness of the organic material layer corresponding to the second region, and / or the thickness of the inorganic material layer corresponding to the first region is greater than the thickness of the inorganic material layer corresponding to the second region.

5. The display panel according to claim 4, characterized in that: The auxiliary functional film layer includes a first organic material layer and a first inorganic material layer; The first inorganic material layer is located on one side surface of the base substrate, the first organic material layer is located on one side surface of the first inorganic material layer away from the base substrate, and at least part of the structure of the connecting electrode is located on one side surface of the first organic material layer away from the first inorganic material layer; The thickness of the first organic material layer corresponding to the second region is less than the thickness of the first organic material layer corresponding to the first region, and the thickness of the first inorganic material layer corresponding to the second region is less than or equal to the thickness of the first inorganic material layer corresponding to the first region.

6. The display panel according to claim 3, characterized in that: The auxiliary functional film layer comprises at least one organic material layer and at least one inorganic material layer stacked; The total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region is greater than the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region.

7. The display panel according to claim 1, characterized in that: In the thickness direction of the base substrate, the thickness of the auxiliary functional film layer corresponding to the first region is smaller than the thickness of the auxiliary functional film layer corresponding to the second region.

8. The display panel according to claim 7, characterized in that: The auxiliary functional film layer includes at least one organic material layer and at least one inorganic material layer stacked; The thickness of the organic material layer corresponding to the first region is smaller than the thickness of the organic material layer corresponding to the second region, and / or the thickness of the inorganic material layer corresponding to the first region is smaller than the thickness of the inorganic material layer corresponding to the second region.

9. The display panel according to claim 8, characterized in that: The auxiliary functional film layer includes a first organic material layer and a first inorganic material layer; The first inorganic material layer is located on one side surface of the base substrate, the first organic material layer is located on one side surface of the first inorganic material layer away from the base substrate, and at least part of the structure of the connecting electrode is located on one side surface of the first organic material layer away from the first inorganic material layer; The thickness of the first organic material layer corresponding to the second region is greater than the thickness of the first organic material layer corresponding to the first region, and the thickness of the first inorganic material layer corresponding to the second region is greater than or equal to the thickness of the first inorganic material layer corresponding to the first region.

10. The display panel according to claim 7, characterized in that: The auxiliary functional film layer includes at least one organic material layer and at least one inorganic material layer stacked; The total number of film layers of the organic material layer and the inorganic material layer corresponding to the first region is less than the total number of film layers of the organic material layer and the inorganic material layer corresponding to the second region.

11. The display panel according to claim 1, characterized in that: The connecting electrode comprises at least two electrode parts electrically connected in sequence, and the auxiliary functional film layer comprises at least two insulating film layers stacked in sequence; In the same area where the connecting electrode is located, each of the electrode sections is spaced apart from each of the insulating film layers.

12. The display panel according to claim 11, characterized in that: The electrode portion includes a first portion and a second portion; the insulating film layer includes a first organic layer and a second organic layer; The first organic layer is located on one side surface of the base substrate, the first portion is located on one side surface of the first organic layer away from the base substrate, the second organic layer is located on one side surface of the first portion away from the first organic layer, the second portion is located on one side surface of the second organic layer away from the first portion, and the second portion is in contact and electrically connected with the first portion.

13. The display panel according to claim 12, characterized in that: The electrode sub-section further includes a third section; the insulating film layer further includes a first inorganic layer; The third part is located on one side surface of the base substrate, the first inorganic layer is located on one side surface of the third part away from the base substrate, the first organic layer is located on one side surface of the first inorganic layer away from the third part, and the third part is electrically connected to the first part.

14. The display panel according to claim 13, characterized in that: The electrode subdivision also includes a connecting portion; The connecting portion is located in the first inorganic layer, and the third portion is electrically connected to the first portion through the connecting portion.

15. The display panel according to claim 13, characterized in that: The insulating film layer further includes a second inorganic layer; The second inorganic layer is located between the base substrate and the first inorganic layer, and the third portion is located on a surface of the second inorganic layer that is away from the base substrate.

16. The display panel according to claim 12, characterized in that: The second portion includes a groove structure; The display panel further includes a eutectic material layer, and the eutectic material layer is disposed in the groove structure.

17. The display panel according to claim 1, characterized in that: The display panel comprises a display area and a non-display area, wherein the non-display area is at least partially arranged around the display area; The first area and the second area are both disposed in the non-display area.

18. The display panel according to claim 1, characterized in that: The connecting electrodes include test electrodes.

19. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1-18.

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