Master disc, transfer material, and method for manufacturing master disc

Abstract

Provided are a master, a transfer object, and a method for manufacturing a master, particularly a master on which a more complex fine structure is formed, a transfer object using the master, and a method for manufacturing the master. A master in which a plurality of concave-convex assemblies composed of a plurality of concave portions or convex portions are disposed separately from each other on a substrate, the average width of the area occupied by the concave portions or convex portions on the surface of the substrate is below the wavelength of the visible light band, and each of the concave portions or convex portions within the concave-convex assembly is in any one of at least two or more groups in which the center value of the formation length from the surface of the substrate is different.

Description

[0001] This application is a divisional application of the PCT entering Chinese national phase application with international application date of December 18, 2018, entering Chinese national phase date of June 23, 2020, national application number of 201880083365.1, and invention name of "Master Disc, Transfer Material, and Method for Manufacturing Master Disc". TECHNICAL FIELD

[0002] The present application relates to a master disc, a transfer material, and a method for manufacturing a master disc. BACKGROUND

[0003] In recent years, development of an imprint technique, which is one of microfabrication techniques, is progressing. The imprint technique refers to a technique of transferring a concave-convex structure of a master disc to a resin sheet by pressing the master disc, on which a concave-convex structure is formed on a surface, to the resin sheet or the like.

[0004] The concave-convex structure of the master disc used in the imprint technique can be formed using a microfabrication technique shown below.

[0005] For example, in a case where the concave-convex structure is formed on a master disc in a flat plate shape, as described in Patent Document 1 below, a concave-convex structure corresponding to an interference pattern of laser light can be formed on one main surface of the master disc using a laser interference exposure method.

[0006] Further, in a case where the concave-convex structure is formed on a master disc in a cylindrical shape, for example, a concave-convex structure can be formed on an outer peripheral surface of the master disc in the cylindrical shape using a laser lithography technique. Specifically, by rotating the base material in the cylindrical shape around a rotation axis passing through the center of the bottom surface and the upper surface, and then scanning and irradiating laser light on the outer peripheral surface of the base material in the axial direction of the base material, a concave-convex structure can be continuously formed on the outer peripheral surface.

[0007] Patent Document

[0008] Patent Document 1: Japanese Patent Application Publication No. 2007-57622 SUMMARY

[0009] Problems to be Solved by the Invention

[0010] However, the above-described method for forming a concave-convex structure can form only a specific concave-convex structure based on the forming method, and it is difficult to form an arbitrary concave-convex structure. In particular, it is difficult to form a complex concave-convex structure such as further arranging a plurality of concave-convex assemblies each composed of a plurality of concave portions or convex portions. For this reason, there is a demand for a pattern forming method capable of freely forming a more complex concave-convex structure, and a master disc formed using the pattern forming method.

[0011] Therefore, the present application has been made in view of the above problems, and it is an object of the present application to provide a master disc on which a more complex concave-convex structure is formed, a transfer material using the master disc, and a method for manufacturing the master disc.

[0012] Means for solving the problems

[0013] To solve the above problems, one aspect of the present application provides a master disk in which a plurality of concave-convex assemblies composed of a plurality of concave portions or convex portions are disposed separately from each other on a substrate, the average width of the area occupied by the concave portions or convex portions on the surface of the substrate is below the wavelength of the visible light band, and each of the concave portions or convex portions in the concave-convex assembly is in any one of at least two groups having different center values in the length formed on the surface of the substrate.

[0014] The average width of the area occupied by each of the concave portions or convex portions in the concave-convex assembly on the surface of the substrate can be in any one of at least two groups having different center values.

[0015] The longer the length formed on the surface of the substrate of the concave portions or convex portions, the greater the average width of the area occupied by the concave portions or convex portions on the surface of the substrate can be.

[0016] The planar shape of the area occupied by each of the concave portions or convex portions on the surface of the substrate can be substantially circular.

[0017] The interval at which each of the concave-convex assemblies is disposed can be greater than the wavelength of the visible light band.

[0018] Each of the concave portions or convex portions in the concave-convex assembly can be disposed in a closest-packed configuration.

[0019] The length formed on the surface of the substrate of each of the concave portions or convex portions can vary periodically within the concave-convex assembly.

[0020] The length formed on the surface of the substrate of each of the concave portions or convex portions can vary irregularly within the concave-convex assembly.

[0021] Each of the concave-convex assemblies can be arranged regularly.

[0022] Each of the concave-convex assemblies can be arranged irregularly.

[0023] Further, to solve the above problems, another aspect of the present application provides a transfer object on which a concave-convex structure of a plurality of concave-convex assemblies disposed on the above master disk is transferred.

[0024] Further, in order to solve the above problems, another aspect of the present application provides a manufacturing method of a master disc, including: a step for forming a resist layer on a surface of a substrate; a step for arbitrarily controlling output intensity and irradiation timing of a laser light source and irradiating the resist layer with laser light from the laser light source; a step for removing the resist layer from a region that has been irradiated with the laser light or not irradiated with the laser light and forming a pattern provided with a plurality of concave-convex assemblies composed of a plurality of concave portions or convex portions on the resist layer; and a step for forming a concave-convex structure corresponding to the pattern on the surface of the substrate by etching with the resist layer on which the pattern is formed as a mask.

[0025] The substrate can be a cylinder or a cylindrical shape, and the laser light source can irradiate the resist layer on the substrate by rotating the substrate with a height direction of the cylinder or the cylindrical shape as a rotation axis and relatively moving in parallel with the rotation axis.

[0026] The control signal of the laser light source can be generated in synchronization with a control signal of the rotation of the substrate.

[0027] The laser light source can be a semiconductor laser light source.

[0028] Since the output of the laser light for forming the concave-convex structure on the master disc can be arbitrarily controlled, the arrangement and the formation length of the concave portions or the convex portions can be controlled with higher precision and higher reproducibility.

[0029] Effects of the Invention

[0030] As described above, the present application can provide a master disc formed with a more complex concave-convex structure, a transfer object using the master disc, and a manufacturing method of the master disc. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A perspective view for schematically showing an appearance of a master disc according to an embodiment of the present application.

[0032] Figure 2A A sectional view for showing an example of a concave-convex structure formed on an outer circumferential surface of a master disc.

[0033] Figure 2B A plan view for showing an example of a concave-convex structure formed on an outer circumferential surface of a master disc.

[0034] Figure 3 A schematic view for showing an example of an arrangement of concave portions in a case where opening sizes are the same or different.

[0035] Figure 4 A sectional view and a plan view for schematically showing an example of a transfer object on which a concave-convex structure provided on a master disc is transferred.

[0036] Figure 5 A cross-sectional view and a plan view for illustrating another example of a transfer object in which the concave-convex structure provided on the original disc is transferred.

[0037] Figure 6 A cross-sectional view and a plan view for illustrating another example of a transfer object in which the concave-convex structure provided on the original disc is transferred.

[0038] Figure 7 A cross-sectional view and a plan view for illustrating another example of a transfer object in which the concave-convex structure provided on the original disc is transferred.

[0039] Figure 8 A cross-sectional view and a plan view for illustrating another example of a transfer object in which the concave-convex structure provided on the original disc is transferred.

[0040] Figure 9 A schematic view for showing a configuration of a transfer device for manufacturing a transfer object using an original disc.

[0041] Figure 10 A block diagram for illustrating a detailed configuration of an exposure device for forming a concave-convex structure on an original disc.

[0042] Figure 11A A graph for showing a control signal for forming a concave-convex structure of an original disc related to Embodiment 1.

[0043] Figure 11B A graph for showing a control signal for forming a concave-convex structure of an original disc related to Embodiment 2.

[0044] Figure 12A A SEM image of a transfer object of an original disc related to Embodiment 1, taken at a magnification of 30,000 times.

[0045] Figure 12B A SEM image of a transfer object of an original disc related to Embodiment 2, taken at a magnification of 30,000 times.

[0046] Figure 13A A SEM image of a transfer object of an original disc related to Embodiment 1, taken at an inclination of 30° and a magnification of 10,000 times.

[0047] Figure 13B A SEM image of a transfer object of an original disc related to Embodiment 2, taken at an inclination of 30° and a magnification of 10,000 times. DETAILED DESCRIPTION

[0048] Next, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. In addition, in the present specification and the drawings, repetitive description will be omitted by denoting the same reference numerals to constituent elements having substantially the same function and configuration.

[0049] <1. Appearance of the master disk>

[0050] First, the appearance of the master disk according to the present embodiment will be described with reference to Figure 1 the appearance of the master disk according to the present embodiment will be described. Figure 1 is a perspective view for schematically showing the appearance of the master disk according to the present embodiment.

[0051] As shown in Figure 1 , the master disk 1 according to the present embodiment is composed of a base material 10 having a concavo-convex structure 20 formed on an outer peripheral surface, for example.

[0052] The master disk 1 is a master disk used for a roll-to-roll type imprint technique, for example. The roll-to-roll type imprint technique is capable of transferring the concavo-convex structure formed on the outer peripheral surface of the master disk 1 to a sheet-like base material or the like by rotating the master disk 1 and pressing the outer peripheral surface of the master disk 1 against the sheet-like base material or the like. Such an imprint technique is capable of efficiently manufacturing a transfer object having the concavo-convex structure 20 formed on the outer peripheral surface of the master disk 1 transferred thereto.

[0053] In addition, the transfer object having the concavo-convex structure 20 transferred thereto can be used for various uses. For example, the transfer object having the concavo-convex structure 20 transferred thereto can be used as an optical member such as a light guide plate, a light diffusion plate, a microlens array, a Fresnel lens array, a diffraction grating, or an antireflection film.

[0054] The base material 10 is a member having a cylindrical shape or a circular cylindrical shape, for example. The shape of the base material 10 can be either a hollow cylindrical shape having a hollow inside as shown in Figure 1 , or a solid cylindrical shape having no hollow inside. The base material 10 can be formed of a glass material having Si02as a main component such as fused quartz glass or synthetic quartz glass, or a metal such as stainless steel, for example. In addition, the outer peripheral surface of the base material 10 can be coated with Si02or the like.

[0055] It is preferable that at least the outer peripheral surface of the base material 10 be formed of a glass material having Si02as a main component, and it is more preferable that the entire base material 10 be formed of a glass material having Si02as a main component. This is because, in the case where the main component of the base material 10 is Si02, etching using a fluoride can easily process the base material 10. For example, by performing etching using a fluoride with an etching resist layer having a pattern corresponding to the concavo-convex structure 20 formed thereon as a mask, the concavo-convex structure 20 can be formed on the outer peripheral surface of the base material 10.

[0056] Further, in the case where the substrate 10 is in a cylindrical shape, for example, the height (axial length) of the cylindrical shape of the substrate 10 can be 100 mm or more, and the diameter of the bottom surface or the upper surface of the cylindrical shape (outer diameter in the diameter direction orthogonal to the axial direction) can be 50 mm or more and 300 mm or less. Also, in the case where the substrate 10 is in a cylindrical shape, the thickness of the outer circumferential surface of the cylinder can be 2 mm or more and 50 mm or less. However, the dimensions of the substrate 10 are not limited to the above.

[0057] The concave-convex structure 20 is a structure in which concave portions or convex portions are regularly or irregularly arranged on the outer circumferential surface of the substrate 10. Specifically, the concave-convex structure 20 can be a structure in which a plurality of concave portion assemblies each composed of a plurality of concave portions are arranged. The concave portions are arranged so that the average of the size and the interval of the openings thereof is below the wavelength of the visible light band, and the concave portion assemblies are arranged so as to be separated from each other at an interval greater than the wavelength of the visible light band. Further, the concave portion means a concave structure that is recessed in a direction substantially perpendicular to the outer circumferential surface of the substrate 10.

[0058] Hereinafter, a case where the concave-convex structure 20 is a structure in which a plurality of concave portion assemblies each composed of a plurality of concave portions are arranged will be described by way of example. However, in the original disc 1 according to the present embodiment, the concave-convex structure 20 can be a structure in which a plurality of convex portion assemblies each composed of a plurality of convex portions are arranged.

[0059] <2. Configuration of the original disc>

[0060] Hereinafter, the more specific configuration of the concave-convex structure 20 formed on the outer circumferential surface of the original disc 1 according to the present embodiment will be described with reference to Figure 2A and Figure 2B Figure 2A is a cross-sectional view for illustrating one example of the concave-convex structure 20 formed on the outer circumferential surface of the original disc 1, Figure 2B is a plan view for illustrating one example of the concave-convex structure 20 formed on the outer circumferential surface of the original disc 1. Figure 2A is a cross-sectional view for illustrating a cross section taken in a direction perpendicular to the outer circumferential surface of the original disc 1, Figure 2B is a plan view for illustrating a plan view taken in a direction perpendicular to the outer circumferential surface of the original disc 1.

[0061] As shown in Figure 2A and Figure 2B , the concave-convex structure 20 is configured by arranging a plurality of concave portion assemblies 210 each composed of a plurality of concave portions 200.

[0062] The concave portion 200 is a concave structure that is recessed in a direction substantially perpendicular to one main surface of the substrate 10. The depth of each concave portion 200 is set to be different in at least two or more groups having different central values. For example, as shown in Figure 2A ​As shown, the recesses 200 can include a first recess 222 formed to have the shallowest depth, a third recess 226 formed to have the deepest depth, and a second recess 224 formed to have a depth intermediate the first recess 222 and the third recess 226. The first recess 222, the second recess 224, and the third recess 226 are arranged to have a difference in depth of formation of more than a formation deviation, and the recess aggregate 210 can be arranged to include a plurality of recesses 200 arranged to have different depths of formation. That is, the depths of formation of the respective recesses 200 are not random depths, but can be controlled to desired depths. Further, the recesses 200 can be arranged to have four or more depths of formation.

[0063] Here, the opening size of the recess 200 can be arranged to be larger as the depth of formation of the recess 200 is deeper. For example, the first recess 222, the second recess 224, and the third recess 226 can be formed to have the smallest opening size for the first recess 222, the largest opening size for the third recess 226, and an opening size intermediate the first recess 222 and the third recess 226 for the second recess 224. As will be described later, since the recess 200 is formed by etching the substrate 10, the recess 200 having a deeper depth of formation is not only easily etched in the thickness direction of the substrate 10, but also easily etched in the in-plane direction of the substrate 10. Therefore, the depth of formation and the opening size of the recess 200 vary in conjunction.

[0064] Further, it is sufficient that at least one or more of the plurality of recesses 200 (the first recess 222, the second recess 224, and the third recess 226) formed to have different depths of formation be arranged in one recess aggregate 210. Figure 2A For example, one recess aggregate 210 can be configured to include each of all the first recess 222, the second recess 224, and the third recess 226. Alternatively, one recess aggregate 210 can be configured from any one of the first recess 222, the second recess 224, and the third recess 226. The number and arrangement of the respective first recess 222, the second recess 224, and the third recess 226 arranged in the recess aggregate 210 can be appropriately controlled depending on the function to be achieved by the recess aggregate 210 or the concavo-convex structure 20.

[0065] For example, the recess aggregate 210 can be configured such that the depth of formation of the recess 200 changes in stages within the recess aggregate 210. That is, the recess aggregate 210 can be arranged such that the depth of formation of the recess 200 gradually changes along a prescribed direction. Specifically, the depth of formation of the recess 200 can change in a manner in which the entire recess aggregate 210 arcs along the prescribed direction or in a manner in which it becomes a straight line.

[0066] Alternatively, for example, the concave assembly 210 can be configured such that the formation depth of the concave 200 varies irregularly (randomly). Specifically, the formation depth of the concave 200 can vary in a way that is not apparent from the overall concave assembly 210.

[0067] A recess assembly 210 can be formed by aggregating multiple recesses 200, and the individual recess assemblies 210 can be separated from each other at intervals greater than the wavelength of visible light. For example, as... Figure 2B As shown, a recess assembly 210 can be constructed by arranging multiple recesses 200 with approximately circular openings in such a way that they are densely filled, and each recess assembly 210 can be separated from each other at an interval greater than the interval between the recesses 200.

[0068] As described above, although the opening shape of the recess 200 can be approximately circular, it can also be, for example, elliptical or polygonal. However, when the opening shape of the recess 200 is approximately circular or elliptical, the formation of the recess 200 becomes easier. Moreover, as described above, although the arrangement of the recesses 200 within the recess assembly 210 can be a densest filling configuration, it can also be a tetragonal lattice configuration, a hexagonal lattice configuration, or an interlaced grid configuration, etc. The opening shape of the recess 200 and the arrangement of the recesses 200 within the recess assembly 210 can be appropriately controlled according to the function achieved by the recess assembly 210 or the concave-convex structure 20.

[0069] Here, refer to Figure 3 The arrangement of the recesses 200 within the recessed assembly 210 will be described in more detail. Figure 3 A schematic diagram illustrating an example configuration of a recess 200 with the same or different opening sizes.

[0070] like Figure 3As shown, for example, when the opening size of the recess 200 is approximately constant (in the case of recess 200A), recess 200A can maintain the same spacing as the opening size and be configured as the densest filling configuration. For example, when the opening size of the recess 200 varies (in the case of recess 200B), recess 200B can maintain a certain spacing. In this case, although recess 200B will not be a densest filling configuration, it will facilitate the formation of recess 200B. Furthermore, when the opening size of the recess 200 varies (in the case of recess 200C), recess 200C can maintain a spacing controlled to correspond to the opening size of each recess 200C. In this case, recess 200C can achieve a densest filling configuration even when the opening size of the recess 200 varies. Since this embodiment can control the configuration and opening size of each recess 200 with high precision, even if the opening size of the recess 200 changes (in the case of recess 200C), the recess 200 can be formed in the most densely packed configuration.

[0071] For example, the average opening size of each recess 200 can be set to be below the wavelength of visible light. Furthermore, the spacing between the recesses 200 within the recess assembly 210 can also be set to be below the wavelength of visible light. Specifically, the opening size and spacing of the recesses 200 can be less than 1 μm, or preferably 100 nm to 350 nm. When the opening size and spacing of the recesses 200 are within the above range, the recess assembly 210 and the uneven structure 20 can function as a so-called moth-eye structure for suppressing the reflection of incident light in the visible light band.

[0072] Since forming the recess 200 becomes difficult when the opening size and spacing of the recess 200 are less than 100 nm, it is not preferred. Furthermore, since diffraction of visible light may occur when the opening size and spacing of the recess 200 exceed 350 nm, thus reducing the function of the moth-eye structure, it is also not preferred.

[0073] The various concave assemblies 210 can be arranged regularly. For example, as... Figure 2B As shown, each recess assembly 210 is a recess assembly 210 with the same structure and configuration as the recess 200, and the recess assemblies 210 can be arranged regularly at predetermined intervals. Alternatively, the recess assemblies 210 can be arranged irregularly. For example, the recess assemblies 210 can be arranged irregularly with random dimensional intervals between them. The arrangement of the recess assemblies 210 can be appropriately controlled according to the function achieved by the concave-convex structure 20.

[0074] As described above, the recesses 200 of the convex-concave structure 20 are formed by multiple different forming depths. That is, the forming depth of the recesses 200 is set to any one of multiple groups with different center values. Therefore, in the convex-concave structure 20, the forming depth of each recess 200 is controlled with high precision so that each recess 200 has a predetermined depth. Moreover, the recesses 200 of the convex-concave structure 20 are not continuously arranged at predetermined intervals, and the recess assembly 210 composed of multiple recesses 200 is arranged separately from each other. Therefore, in the convex-concave structure 20, the forming position of the recesses 200 is controlled with high precision so that they are arranged at different intervals within and between the recess assembly 210.

[0075] Therefore, since this embodiment can control the configuration and formation depth of the recess 200 with high precision and high reproducibility, the original disk 1 can have a more complex concave-convex structure 20.

[0076] <3. Specific examples of original discs>

[0077] Below, refer to Figures 4-8 A specific example of the uneven structure 20 formed on the outer peripheral surface of the original disk 1 according to this embodiment will be described. Figures 4-8 These are cross-sectional and top views illustrating an example of a transfer object having the raised and recessed features 20 provided on the original disk 1. Therefore, Figures 4-8 The uneven structure 20 shown is the reverse of the uneven structure 20 formed on the original disk 1. Furthermore, Figures 4-8 In the top view, the darker the shadow of a circle, the higher the convex part it corresponds to.

[0078] (First specific example)

[0079] like Figure 4 As shown, the concave-convex structure 21 can be a structure in which convex portions 201 (i.e., concave portions on the original disk 1) are arranged in a square grid pattern, forming an assembly 211 of convex portions 201 (i.e., an assembly of concave portions on the original disk 1) at predetermined intervals. In the concave-convex structure 21, the convex portion assembly 211 is configured such that the height of the convex portions 201 within the convex portion assembly 211 increases or decreases in stages in a first direction, while in a second direction orthogonal to the first direction, the height of the convex portions 201 is set to be approximately the same. Therefore, in Figure 4 In the convex-concave structure 21 shown, the convex assembly 211 can be integrally formed in the first direction as a structure representing a triangular wave shape (serrated). The transfer material having the convex-concave structure 21 can be used, for example, as a diffractive element with anti-reflective properties having a moth-eye structure.

[0080] (Second specific example)

[0081] like Figure 5As shown, the concave-convex structure 22 can be a structure in which convex portions 202 (i.e., concave portions on the original disk 1) are arranged in a square grid pattern, forming an assembly of convex portions 212 (i.e., an assembly of concave portions on the original disk 1) at predetermined intervals. In the concave-convex structure 22, the assembly of convex portions 212 is configured such that the height of the convex portions 202 within the assembly of convex portions 212 increases in stages towards the center of the assembly of convex portions 212. Therefore, in Figure 5 In the illustrated concave-convex structure 22, the convex assembly 212 as a whole can be formed into a structure representing a convex lens shape. The transfer material having the concave-convex structure 22 can, for example, be used as a microlens array with anti-reflective properties and a moth-eye structure.

[0082] (Third specific example)

[0083] like Figure 6 As shown, the concave-convex structure 23 can be a structure in which convex portions 203 (i.e., concave portions on the original disk 1) are arranged in a square grid pattern, forming an assembly 213 of convex portions 213 (i.e., an assembly of concave portions on the original disk 1) at predetermined intervals. In the concave-convex structure 23, the assembly 213 of convex portions is configured such that the height of the convex portions 203 within the assembly 213 increases in stages towards the center of the assembly 213, and is configured such that the height decreases in a concentric circle shape so that the height of the convex portions 203 falls within a predetermined range. Therefore, in Figure 6 In the convex-concave structure 23 shown, the convex assembly 213 as a whole can be formed into a structure representing a Fresnel lens array shape. The transfer material having the convex-concave structure 23 can, for example, be used as a Fresnel lens array with anti-reflective properties having a moth-eye structure.

[0084] (Fourth specific example)

[0085] like Figure 7 As shown, the concave-convex structure 24 can be a structure in which convex portions 204 (i.e., concave portions on the original disk 1) are arranged in a square grid pattern, forming an assembly 214 of convex portions 214 (i.e., an assembly of concave portions on the original disk 1) at predetermined intervals. In the concave-convex structure 24, the assembly 214 of convex portions is configured such that the heights of the convex portions 204 within the assembly 214 are irregular (random). However, since the height of the convex portions 204 is set to any one of multiple groups with different center values, strictly speaking, the arrangement of convex portions 204 with different heights within the assembly 214 is irregular (random). Therefore, in Figure 7 In the convex-concave structure 24 shown, the convex assembly 214 as a whole can be formed into a moth-eye structure with irregularly shaped convex portions 204. The transfer material having the convex-concave structure 24 can, for example, be used as an anti-reflective film or light diffuser with less interference and diffraction of light.

[0086] (Fifth specific example)

[0087] As Figure 8 shown, the concave-convex structure 25 can be a structure in which a convex portion 205 (i.e., a concave portion on the original disc 1) collective 215 (i.e., a concave portion collective on the original disc 1) of convex portions 205 arranged in an irregular (random) configuration is provided at a prescribed interval. As Figure 8 shown in the concave-convex structure 24, in the concave-convex structure 25, the convex portion collective 215 is provided so that the configuration of the convex portions 205 having different heights is irregular (random) within the convex portion collective 215. Thus, in the concave-convex structure 25 shown, the convex portion collective 215 as a whole can be formed as a moth-eye structure in which the heights of the convex portions 205 and the configuration are irregular. Figure 8 As Figure 8 shown, the regularity of the concave-convex structure 25 is lower than that of the concave-convex structure 24 shown, and thus the occurrence of unwanted diffracted light or interference light can be more suppressed. Figure 7

[0088] <4. Use example of original disc>

[0089] Next, a use example of the original disc 1 according to the present embodiment will be described with reference to Figure 9 The use of the original disc 1 according to the present embodiment enables the manufacture of a transfer object on which the concave-convex structure 20 of the original disc 1 is transferred. Figure 9 is a schematic view of a transfer device 5 configured to manufacture a transfer object using the original disc 1 according to the present embodiment.

[0090] As Figure 9 shown, the transfer device 5 is provided with the original disc 1, a base material supply roller 51, a take-up roller 52, guide rollers 53, 54, a nip roller 55, a separation roller 56, a coating device 57, and a light source 58. That is, Figure 9 The transfer device 5 shown is a roll-to-roll process type transfer device.

[0091] The base material supply roller 51 is, for example, a roller in which a sheet-shaped base material 61 is wound in a roll shape, and the take-up roller 52 is a roller for taking up a transfer object in which a resin layer 62 on which the concave-convex structure 20 is transferred is laminated. Further, the guide rollers 53, 54 are rollers for transporting the sheet-shaped base material 61 before and after transfer. The nip roller 55 is a roller for pressing the sheet-shaped base material 61 on which the resin layer 62 is laminated against the original disc 1, and the separation roller 56 is a roller for peeling the sheet-shaped base material 61 on which the resin layer 62 is laminated from the original disc 1 after the concave-convex structure 20 is transferred to the resin layer 62.

[0092] ​The coating device 57 has a coating unit such as a coater, and is used to coat the photocurable resin composition on the sheet-shaped base material 61 to form the resin layer 62. The coating device 57 can be, for example, a gravure coater, a wire bar coater, or a die coater. In addition, the light source 58 is a light source for emitting light of a wavelength that can cure the photocurable resin composition, and can be, for example, an ultraviolet lamp.

[0093] In addition, the photocurable resin composition is a resin that is cured by irradiation of light of a prescribed wavelength band. Specifically, the photocurable resin composition can be an acrylic-acrylate resin, an epoxy-acrylate resin, or the like, which is an ultraviolet-curable resin. Furthermore, the photocurable resin composition can contain, as necessary, a polymerization initiator, a filler, a functional additive, a solvent, an inorganic material, a pigment, an antistatic agent, a sensitizing dye, or the like.

[0094] In addition, the resin layer 62 can be formed from a thermosetting resin composition. In this case, the transfer device 5 has a heater instead of the light source 58, and the resin layer 62 is cured by heating with the heater, thereby transferring the concave-convex structure 20. The thermosetting resin composition can be, for example, a phenol resin, an epoxy resin, a melamine resin, a urea resin, or the like.

[0095] The transfer device 5 first continuously feeds the sheet-shaped base material 61 from the base material supply roller 51 and via the guide roller 53. The coating device 57 coats the photocurable resin composition on the sheet-shaped base material 61 that is being fed, and laminates the resin layer 62 on the sheet-shaped base material 61. Furthermore, the sheet-shaped base material 61 on which the resin layer 62 is laminated is pressed against the stamper 1 by the nip roller 55. The concave-convex structure 20 formed on the outer circumferential surface of the stamper 1 is thereby transferred to the resin layer 62. The resin layer 62 on which the concave-convex structure 20 is transferred is cured by irradiation of light from the light source 58. As a result, the inverted structure of the concave-convex structure 20 is formed on the resin layer 62. The sheet-shaped base material 61 on which the concave-convex structure 20 is transferred is peeled from the stamper 1 by the peeling roller 56, and is then fed to the take-up roller 52 via the guide roller 54 and is taken up.

[0096] This transfer device 5 is capable of efficiently transferring the concave-convex structure 20 formed on the outer circumferential surface of the stamper 1 to the sheet-shaped base material 61. Thus, the stamper 1 according to the present embodiment is capable of efficiently manufacturing a transfer object on which the concave-convex structure 20 is transferred.

[0097] <5. Method of manufacturing a stamper>

[0098] (Overall process of the manufacturing method)

[0099] Next, the method of manufacturing the stamper 1 according to the present embodiment will be described.

[0100] The original disc 1 according to the present embodiment can be manufactured by forming a resist pattern corresponding to the concave-convex structure 20 on the outer circumferential surface of the substrate 10 using laser-induced thermal etching, and then etching the substrate 10 using the resist pattern as a mask.

[0101] In the present embodiment, a more complex concave-convex structure 20 can be formed by arbitrarily controlling the laser intensity and irradiation timing for thermal etching. This is because the intensity and irradiation position of the laser can be controlled with high precision by modulating the control signal. Therefore, the manufacturing method of the original disc 1 according to the present embodiment can control the arrangement of the concave portion aggregate 210 and the concave portion 200 of the concave-convex structure 20 with high precision and reproducibility.

[0102] Specifically, the manufacturing method of the original disc 1 according to the present embodiment includes a film formation step for forming a resist layer on the outer circumferential surface of the substrate 10, an exposure step for irradiating the resist layer with a laser to form a latent image, a development step for developing the resist layer on which the latent image is formed to form a pattern on the resist layer, and an etching step for etching the substrate 10 using the resist layer on which the pattern is formed as a mask to form the concave-convex structure 20 on the outer circumferential surface of the substrate 10.

[0103] The film formation step is for forming a resist layer on the outer circumferential surface of the substrate 10. The resist layer is formed of an inorganic material or an organic material capable of forming a latent image with a laser. As the inorganic material, for example, a metal oxide containing one or two or more transition metals such as tungsten (W) or molybdenum (Mo) can be used. The inorganic material can be used to form the resist layer by, for example, a sputtering method or the like. As the organic material, for example, a linear phenol novolak resist or a chemically amplified resist or the like can be used. The organic material can be used to form the resist layer by, for example, a spin coating method or the like.

[0104] The exposure step is for forming a latent image corresponding to the concave-convex structure 20 on the resist layer formed on the outer circumferential surface of the substrate 10 by irradiating the resist layer with a laser. Although the wavelength of the laser used for the irradiation is not particularly limited, it can be a wavelength in the blue light band of 400 nm to 500 nm. The exposure step controls the opening size and position of the concave portion 200 formed on the resist layer by modulating the control signal of the laser irradiated to the outer circumferential surface of the substrate 10 to control the output intensity and irradiation position of the laser. Therefore, the light source for emitting the laser can be, for example, a semiconductor laser light source that is easy to modulate the output. In addition, the wave light device used in the exposure step will be described later.

[0105] The developing process forms a pattern corresponding to the latent image on the resist layer by using laser irradiation to develop the resist layer containing the latent image. For example, when the resist layer is an inorganic material, an alkaline solution such as an aqueous solution of TMAH (Tetramethylammonium Hydroxide) can be used for developing the resist layer. Furthermore, when the resist layer is an organic material, various organic solvents such as esters or ethanol can be used for developing the resist layer.

[0106] The etching process forms a textured surface 20 corresponding to a latent image on the outer peripheral surface of the substrate 10 by etching a patterned resist layer as a mask. The substrate 10 can be etched using either dry etching or wet etching. When the substrate 10 is a glass material with SiO2 as its main component (e.g., quartz glass), the substrate 10 can be etched using dry etching with fluorinated carbon gas or wet etching with hydrofluoric acid.

[0107] (Exposure device)

[0108] Below, refer to Figure 10 The specific configuration of the exposure apparatus 3 used to irradiate the cylindrical or cylindrical substrate 10 with laser in the above-described exposure process will be described. Figure 10 This is a block diagram used to illustrate the specific structure of the exposure apparatus 3.

[0109] like Figure 10 As shown, the exposure apparatus 3 includes a laser light source 31, a first reflector 33, a photodiode (PD) 34, a condenser lens 36, an electro-optic deflector (EOD) 39, a collimator lens 38, a second reflector 41, a beam expander (BEX) 43, and an objective lens 44.

[0110] The laser source 31 is controlled by an exposure signal generated by the control mechanism 47, and the laser 30 emitted from the laser source 31 is irradiated onto the substrate 10 placed on the turntable 46. Moreover, the spindle motor 45, controlled by a rotation control signal synchronized with the exposure signal, rotates the turntable 46 on which the substrate 10 is placed.

[0111] As described above, the laser source 31 is a light source that emits laser 30 for exposing a resist layer formed on the outer peripheral surface of the substrate 10. The laser source 31 can be, for example, a semiconductor laser source for emitting laser light with a wavelength in the blue light band of 400 nm to 500 nm. The laser 30 emitted from the laser source 31 maintains a parallel beam and travels straight before being reflected by the first reflecting mirror 33.

[0112] The laser light 30 reflected by the first mirror 33 is focused by a condenser lens 36 to an electro-optical deflector 39, and is again parallelized by a collimator lens 38. The laser light 30 that has been parallelized again is reflected by a second mirror 41 and guided horizontally by a beam expander 43.

[0113] The first mirror 33 is composed of a polarizing beam splitter and has a function of reflecting one of the polarized components and transmitting the other. The polarized component that has been transmitted through the first mirror 33 is photoelectrically converted by a photodiode 34, and the received signal after photoelectric conversion is input to the laser light source 31. In this way, the laser light source 31 can adjust the output of the laser light 30 and the like in accordance with the feedback of the input received signal.

[0114] The electro-optical deflector 39 is an element that can control the irradiation position of the laser light 30 by a distance of the order of nanometers. The exposure apparatus 3 can finely adjust the irradiation position of the laser light 30 irradiated to the substrate 10 by using the electro-optical deflector 39.

[0115] The beam expander 43 shapes the laser light 30 guided by the second mirror 41 into a desired beam shape, and then irradiates the laser light 30 to the resist layer formed on the outer peripheral surface of the substrate 10 via an objective lens 44.

[0116] The turntable 46 supports the substrate 10 and rotates the substrate 10 by rotating with the spindle motor 45. The turntable 46 can rotate the substrate 10 and can move the irradiation position of the laser light 30 in the axial direction of the substrate 10 (i.e., the direction of the arrow R). In this way, exposure is performed in a spiral shape on the outer peripheral surface of the substrate 10. In addition, the movement of the irradiation position of the laser light 30 can also be performed by moving the laser head including the laser light source 31 along the slide block.

[0117] The control mechanism 47 has a formatter 48 and a driver 49, and controls the output intensity and the irradiation position of the laser light 30 by controlling the laser light source 31.

[0118] The driver 49 controls the emission of the laser light source 31 in accordance with the exposure signal generated by the formatter 48. Specifically, the driver 49 can control the laser light source 31 such that the greater the amplitude of the waveform of the exposure signal, the greater the output intensity of the laser light 30. Furthermore, the driver 49 can control the irradiation position of the laser light 30 in accordance with the waveform shape of the exposure signal and by controlling the emission timing of the laser light 30. Since it is possible to make the output intensity of the laser light 30 greater, the size and the depth of the latent image formed on the resist layer become greater, and thus it is ultimately possible to make the opening size and the formation depth of the recess formed on the substrate 10 larger.

[0119] The spindle motor 45 rotates the turntable 46 according to a rotation control signal. In a case where a fixed number of pulses are input according to the rotation control signal, the spindle motor 45 can control the rotation to rotate the turntable 46 once. Further, the rotation control signal can be generated in a manner synchronized with an exposure signal generated by a standard block common to the exposure signal.

[0120] The exposure apparatus 3 described above can irradiate the laser light 30 to the substrate 10. Such an exposure apparatus 3 can form a latent image of an arbitrary pattern on the outer peripheral surface of the substrate 10 with high accuracy and high reproducibility.

[0121] The original disc 1 and the method of manufacturing the original disc 1 according to the present embodiment are described in detail above. Since the present embodiment can control the arrangement and the depth of the concave portions 200 with higher accuracy and higher reproducibility, the original disc 1 having a more complex concave-convex structure 20 can be provided.

[0122] Example

[0123] The original disc according to the present embodiment is described more specifically below with reference to examples and comparative examples. Further, the examples shown below are conditional examples for showing the possibility of implementation and effects of the original disc and the method of manufacturing the original disc according to the present embodiment, and the original disc and the method of manufacturing the original disc according to the present embodiment are not limited to the examples below.

[0124] (Example 1)

[0125] The original disc according to Example 1 was manufactured by the following procedure. First, a tungsten oxide film having a film thickness of 55 nm was formed on the outer peripheral surface of a substrate (cylindrical quartz glass having an axial length of 100 mm and a wall thickness of 4.5 mm on the outer peripheral surface) by a sputtering method, and a resist layer was formed. Next, a latent image was formed on the resist layer by thermal etching using laser light from a semiconductor laser light source having a wavelength of 405 nm using the exposure apparatus shown in FIG. 1. Further, the number of revolutions of the substrate was 900 rpm. Figure 10

[0126] Here, an arbitrary latent image was formed on the resist layer by arbitrarily modulating a control signal for controlling the output of the laser light. In Example 1, the control signal shown in FIG. 2 was used as the control signal for controlling the output of the laser light. Specifically, as shown in FIG. 2, a control signal having a constant period and a gradually increasing amplitude was used to control the output of the laser light. Further, the control signal shown in FIG. 3 represents a control signal for forming one concave portion group in the concave-convex structure of the original disc according to Example 1. Figure 11A Figure 11A Figure 11A

[0127] ​​​​Next, the exposed substrate was developed using a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) (manufactured by Tokyo Ohka Kogyo) at 27°C for 900 seconds to dissolve the resist layer in the latent image area, thereby forming a textured structure with varying depths and opening sizes of recesses on the resist layer. Then, using the developed resist layer as a mask, reactive ion etching (RIE) was performed on the substrate for 30 minutes using CHF3 gas (30 sccm) at a pressure of 0.5 Pa and a power supply of 150 W. Afterward, the remaining resist layer was removed.

[0128] A master disc with an uneven texture formed on its outer surface was manufactured following the above procedures. A transfer print was then created using the manufactured master disc. Specifically, using… Figure 9 The transfer apparatus shown transfers the uneven structure formed on the outer periphery of the original disk onto a UV-curable resin. Furthermore, a polyethylene terephthalate (PET) film is used as the sheet substrate for the transfer, and the substrate is irradiated with a metal halide lamp at 1000 mJ / cm² for 1 minute. 2 UV light causes UV-curing resins to cure.

[0129] (Example 2)

[0130] Remove from use Figure 11B Apart from the control signals shown, which are used to control the laser output, the original disc involved in Example 2 was manufactured using the same method as in Example 1. Specifically, as Figure 11B As shown, the laser output is controlled using a control signal with a fixed period and an irregular (random) amplitude variation. Furthermore, Figure 11B The control signals shown represent control signals used to form the embossed structure of the master disc involved in Example 2. Furthermore, a transfer print was manufactured using the manufactured master disc and employing the same method as in Example 1.

[0131] (Evaluation Results)

[0132] Figures 12A-13B Images of transfers produced using the original discs described in Examples 1 and 2, observed using a scanning electron microscope (SEM). Figure 12A The image shown is a SEM image of the transfer material from the original disc involved in Example 1, taken at a magnification of 30,000x. Figure 12B The image shows a SEM image of the transfer material from the original disc involved in Example 2, taken at a magnification of 30,000x. Figure 13AA SEM image of the transfer of the stamper relating to Example 1, taken at an inclination of 30° and a magnification of 10,000 times, Figure 13B A SEM image of the transfer of the stamper relating to Example 2, taken at an inclination of 30° and a magnification of 10,000 times. Further, Figures 12A-13B The X direction in FIG. 10 corresponds to the circumferential direction of the substrate, and the Y direction corresponds to the axial direction of the substrate.

[0133] Referring to FIG. 10, Figure 12A and Figure 13A it is known that the transfer relating to Example 1 is formed with convex portions (i.e., concave portions on the stamper) in the circumferential direction of the substrate, which are phase- wise increased in height and width. It is also known that the stamper and the transfer relating to Example 1 are formed with a convex portion aggregate (i.e., a concave portion aggregate on the stamper) in a plurality of convex portions which are phase- wise increased in height and width.

[0134] Referring to FIG. 11, Figure 12B and Figure 13B it is known that the transfer relating to Example 2 is formed with convex portions (i.e., concave portions on the stamper) which are equal- intervalled in the circumferential and axial directions of the substrate, and which are different in height. It is also known that the stamper and the transfer relating to Example 2 are formed with convex portions which are irregularly (randomly) changed in height.

[0135] Further, although not shown, it is known from observation of the convex portion heights (depths of the concave portions on the stamper) of the transfers relating to Example 1 and Example 2 using an Atomic Force Microscope (AFM) that the convex portion heights of the transfers relating to Example 1 and Example 2 can be classified into at least two groups or more which are different in central value.

[0136] As described above, since the present embodiment can control the arrangement and the formation depth of the concave portions with higher precision and higher reproducibility, it is possible to provide a stamper having a more complex concave-convex structure and a transfer formed using the stamper.

[0137] Although the preferred embodiment of the present application has been described in detail above with reference to the accompanying drawings, the present application is not limited to this example. It is obvious that those having ordinary knowledge in the technical field to which the present application pertains can conceive various modifications or changes within the technical scope of the present application recited in the claims, and it is understood that these examples also belong to the technical scope of the present application.

[0138] For example, in the above-described embodiment, although the concave-convex structure 20 is constituted by the concave portion aggregate 210 of the concave portion aggregate 210, the present application is not limited to this example. For example, the concave-convex structure 20 can be constituted by a convex portion aggregate of convex portions which protrude in a direction substantially perpendicular to the outer circumferential surface of the substrate 10, instead of the concave portion aggregate 210.

[0139] Symbol Explanation

[0140] 1 Harahi

[0141] 3 Light exposure device

[0142] 5 Marking device

[0143] 10 Base material

[0144] 20, 21, 22, 23, 24, 25 uneven structure

[0145] 200 recess

[0146] 201, 202, 203, 204, 205 Convex parts

[0147] 210 Recessed Assembly

[0148] 211, 212, 213, 214, 215 Convex aggregate

[0149] 222 First recess

[0150] 224 Second recess

[0151] 226 Third recess

Claims

1. A type of original disc, characterized in that, Multiple concave-convex assemblies, each consisting of multiple recesses or protrusions, are separately disposed on the substrate. The average width of the area occupied by the recess or protrusion on the substrate surface is below the wavelength of visible light. The formation length of each of the recesses or protrusions within the concave-convex assembly from the surface of the substrate is any one of at least three groups with different center values. The length of each of the recesses or protrusions formed from the surface of the substrate varies in stages along a predetermined direction within the recess-protrusion assembly, based on the function performed by the assembly.

2. The original disc according to claim 1, characterized in that, The average width of the area occupied by each of the recesses or protrusions in the concave-convex assembly on the surface of the substrate is any one of at least two groups with different center values.

3. The original disc according to claim 2, characterized in that, The longer the recess or protrusion extends from the surface of the substrate, the greater the average width of the area occupied by the recess or protrusion on the surface of the substrate.

4. The original disc according to claim 1 or 2, characterized in that, The planar shape of the area occupied by each of the recesses or protrusions on the surface of the substrate is circular.

5. The original disc according to claim 1 or 2, characterized in that, The spacing between each of the aforementioned concave and convex assemblies is greater than the wavelength of the visible light band.

6. The original disc according to claim 1 or 2, characterized in that, The recesses or protrusions within the concave-convex assembly are configured in a densest filling configuration.

7. The original disc according to claim 1 or 2, characterized in that, The recesses or protrusions are arranged in a square grid pattern at predetermined intervals in the concave-convex assembly. The formation length of each recess or protrusion from the surface of the substrate is arranged to increase or decrease in stages along a first direction within the concave-convex assembly, based on the function of the diffraction element realized by the concave-convex assembly. In a second direction perpendicular to the first direction, they are arranged with approximately the same height.

8. The original disc according to claim 1 or 2, characterized in that, The recesses or protrusions are arranged in a square grid pattern at predetermined intervals in the concave-convex assembly. The length of each recess or protrusion formed from the surface of the substrate is arranged in a manner that increases in stages towards the center of the concave-convex assembly, based on the microlens function realized by the concave-convex assembly.

9. The original disc according to claim 1 or 2, characterized in that, The concave and convex portions are arranged in a square grid pattern at predetermined intervals. The formation length of each concave or convex portion from the surface of the substrate is based on the Fresnel lens function implemented by the concave and convex assembly. In the central region of the concave and convex assembly, the length increases in stages towards the center of the assembly, and decreases concentrically in the peripheral region of the central region so as to fall within a predetermined range.

10. The original disc according to claim 1 or 2, characterized in that, The various concave and convex aggregates are arranged in a regular pattern.

11. The original disc according to claim 1 or 2, characterized in that, The various concave and convex aggregates are arranged irregularly.

12. A transfer material having an uneven structure of a plurality of said uneven assemblies disposed on a base plate according to any one of claims 1 to 11.

13. A method for manufacturing an original disc, characterized in that, The method for manufacturing the original disc according to any one of claims 1 to 11, comprising: The process used to form a resist layer on the surface of a substrate; A process for arbitrarily controlling the output intensity and irradiation timing of a laser source and irradiating the resist layer with laser light from the laser source; A process for removing the resist layer from areas irradiated or unirradiated by the laser, and forming a pattern on the resist layer consisting of multiple concave and convex aggregates; and A process for etching on the surface of a substrate to form a textured surface corresponding to the pattern, using the resist layer with the pattern formed thereon as a mask.

14. The method for manufacturing the original disc according to claim 13, characterized in that, The substrate is cylindrical or cylindrical. The laser source irradiates the resist layer on the substrate by rotating the substrate with the height direction of the cylinder or cylindrical shape as the rotation axis and moving it parallel to the rotation axis.

15. The method for manufacturing the original disc according to claim 14, characterized in that, The control signal for the laser light source is generated in a manner synchronized with the control signal for the rotation of the substrate.

16. The method for manufacturing the original disc according to claim 13 or 14, characterized in that, The laser source is a semiconductor laser source.

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