A solder structure for laser soldering of optical assemblies and methods of use thereof

Abstract

The present application belongs to the technical field of laser brazing, and proposes a welding structure for laser brazing of optical assemblies and a method for using the same, which is used for welding and fixing of optical assemblies. The welding structure comprises optical elements, welding pins, optical element mounting plates, optical assembly welding bottom plates and solder structures. The optical assembly comprises the optical elements and the optical element mounting plates. In use, the solder structure is placed in the recessed structure of the optical element mounting plate, the welding pin is screwed into the threaded hole of the optical element mounting plate until the lower hemisphere structure of the welding pin coincides with the inner spherical surface structure of the solder structure, the welding laser is aligned with the laser irradiation surface of the solder structure, and the optical elements are welded and fixed in sequence. The present application has the advantages of simple structure and strong adaptability. The use of the welding pin can effectively reduce the distance by which the optical assembly deviates from the predetermined position due to the welding stress during the welding process. In addition, the optical assembly can be disassembled without damage by heating the solder structure and unscrewing the welding pin.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser brazing, in particular to a welding structure for laser brazing of optical assemblies and a method of using the same. BACKGROUND

[0002] With the development of optical technology, the design of various optical devices tends to be high-precision and compact in structure, which inevitably requires the internal optical system to gradually develop towards high precision and miniaturization, and further puts forward higher requirements for the assembly and fixation of optical assemblies in the optical system.

[0003] The brazing process is simple and easy to operate, and the components connected by the brazing process have good performance, high reliability and good product consistency, so it is widely used in the connection and assembly of various products. Laser brazing technology has the advantages of high energy density, fast welding speed and almost no welding deformation, which can greatly improve the welding quality.

[0004] At present, the fixation of optical assemblies in the optical system is mostly achieved by bolt connection or optical adjustment frame fixation, and the connection structure is relatively complex, and the fixed optical assembly is prone to displacement due to vibration and other reasons, which affects the accuracy of the optical system. SUMMARY

[0005] In view of the above analysis, the present application provides a welding structure for laser brazing of optical assemblies and a method of using the same, which is simple in structure and has strong adaptability.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0007] A welding structure for laser brazing of optical assemblies, comprising an optical assembly, a welding pin, an optical assembly welding bottom plate 5 and a solder structure 6; the optical assembly is located above the optical assembly welding bottom plate 5, and the two are welded by the welding pin and the solder structure 6 to complete the fixation of the optical assembly; the optical assembly welding bottom plate 5 is provided with a light transmission hole b10 in the center.

[0008] The optical assembly comprises an optical element 1 and an optical element mounting plate 3; the optical element mounting plate 3 is provided with a light transmission hole a9 in the center, and is provided with a threaded hole and a recess structure at each corner, the threaded hole being located in the recess structure.

[0009] The optical element 1 is bonded to the optical element mounting plate 3, and the center of the optical element 1 coincides with the center of the light transmission hole a9 on the optical element mounting plate 3 and the center of the light transmission hole b10 of the optical assembly welding bottom plate 5.

[0010] The upper part of the welding pin is a standard threaded structure connected with the threaded hole of the optical element mounting plate 3, and the lower part is a hemispherical structure connected with the solder structure 6.

[0011] The solder structure 6 is located between the optical element mounting plate 3 and the optical assembly welding base plate 5 at the position of the recessed structure of the optical element mounting plate 3; the solder structure 6 is an irregular polyhedral ring with a circular truncated cone shape, one end of which is smaller than the size of the recessed structure and is fixed in the recessed structure; the solder structure 6 comprises a closely combined heat-conducting ring 11 and a preformed solder ring 12; the heat-conducting ring 11 is made of pure copper and has a ring structure comprising a laser irradiation surface 13 and an inner edge surface; the laser irradiation surface 13 is an inclined surface with an inclination angle, which serves as the irradiation surface of the laser during laser soldering, and is used to irradiate the laser onto the heat-conducting ring 11 and transfer heat to the overall structure of the heat-conducting ring 11 to melt the preformed solder ring 12; the inner edge surface has a stepped hole structure, and the preformed solder ring 12 of the ring structure is installed on the inner edge surface; the inner side spherical surface 14 of the preformed solder ring 12 is matched in size with the spherical surface of the half-spherical structure of the welding pin, and the spherical surface 14 is in contact with the half-spherical structure of the welding pin during use; the thickness and diameter of the outer cylindrical structure of the preformed solder ring 12 are matched with the depth and diameter of the stepped hole of the inner edge surface of the heat-conducting ring 11.

[0012] A method for using a welding structure for laser soldering of an optical assembly, specifically comprising the following steps:

[0013] Step 1: The optical element 1 and the optical element mounting plate 3 are bonded to form an optical assembly, the center of the optical element 1 is coincident with the center of the light transmission hole a9 on the optical element mounting plate 3, and the laser reflected by the optical element 1 continues to propagate through the light transmission hole a9;

[0014] Step 2: Place the optical assembly on the optical assembly welding base plate 5, adjust the position of the optical assembly so that the light transmission hole a9 is coaxial with the light transmission hole b10, and the laser reflected by the optical element 1 continues to propagate through the light transmission hole a9 and the light transmission hole b10;

[0015] Step 3: Place one end of the solder structure 6 in the groove on the bottom surface of the optical element mounting plate 3; screw the welding pin through the threaded hole around the optical element mounting plate 3, and make the spherical surface of the half-spherical structure of the welding pin coincide with the inner side spherical surface 14 of the preformed solder ring 12;

[0016] Step 4: Align the welding laser with the outer laser irradiation surface 13 of the heat-conducting ring 11 for welding, and sequentially complete the welding of the four solder structures 6 placed around the optical element mounting plate 3, and complete the fixation of the optical assembly.

[0017] The welding pins are respectively the welding pin a2, the welding pin b4, the welding pin c7 and the welding pin d8 which have consistent structures.

[0018] The laser reflected by the optical element 1 can continuously pass through the light transmission hole a9 and the light transmission hole b10, the optical assembly is placed on the surface of the optical assembly welding base plate 5, the optical assembly welding base plate 5 and the optical assembly are welded together by the welding pin and the solder structure 6, and the fixation of the optical assembly is completed.

[0019] Compared with the prior art, the present application has the advantages of:

[0020] (1) The welding structure for laser soldering of optical assemblies has the advantages of simple structure and strong adaptability, and does not require the shape of the optical element, and can realize the welding and fixation of optical assembly mounting plates of different materials.

[0021] (2) The present application connects the optical assembly and the optical assembly welding base plate through the welding pin, which can effectively reduce the distance of the optical assembly deviating from the predetermined position due to the welding stress during the welding process. In addition, the welding pin can be twisted out by reheating the solder structure, and the optical assembly can be removed without damage. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic diagram of a welding structure for laser soldering of optical assemblies.

[0023] Figure 2 is a schematic diagram of an optical assembly structure.

[0024] Figure 3 is a schematic diagram of the bottom surface structure of an optical element mounting plate.

[0025] Figure 4 is a schematic diagram of a welding pin structure.

[0026] Figure 5 is a schematic diagram of an optical assembly welding base plate structure.

[0027] Figure 6 is a schematic diagram of a solder structure.

[0028] Figure 7 is a schematic diagram of a heat-conducting ring structure.

[0029] Figure 8 is a schematic diagram of a pre-formed solder ring structure.

[0030] In the figure: 1-optical element; 2-welding pin a; 3-optical element mounting plate; 4-welding pin b; 5-optical assembly welding base plate; 6-solder structure; 7-welding pin c; 8-welding pin d; 9-light transmission hole a; 10-light transmission hole b; 11-heat-conducting ring; 12-pre-formed solder ring; 13-laser irradiation surface; 14-spherical surface. DETAILED DESCRIPTION

[0031] The technical solutions and Figures 1-8 specific embodiments of the present application will be described in detail below.

[0032] As Figure 1A welding structure for laser soldering of optical assembly is shown, which comprises an optical element 1, a welding pin a2, an optical element mounting plate 3, a welding pin b4, an optical assembly welding base plate 5, a solder structure 6, a welding pin c7 and a welding pin d8.

[0033] As shown in the optical assembly comprises an optical element 1 and an optical element mounting plate 3, the optical element 1 is bonded with the optical element mounting plate 3, and the center of the optical element 1 coincides with the center of the light passing hole a9 on the optical element mounting plate 3. Figure 2

[0034] As shown in the optical element mounting plate 3, the center of the optical element mounting plate 3 is the light passing hole a9, which can reflect the laser through the optical element 1, and the optical element mounting plate 3 has threaded holes at the four corners, which are connected with the threaded structure of the upper part of the welding pin, in addition, the optical element mounting plate 3 has recessed structures at the four corners of the bottom surface, and the size of the recessed structures is slightly larger than the solder structure 6, and the solder structure 6 is placed in the recessed structure during use. Figure 3

[0035] As shown in the welding pin structure diagram, the welding pin a2, the welding pin b4, the welding pin c7 and the welding pin d8 have the same structure, the upper part is a standard threaded structure, which is connected with the threaded holes at the four corners of the optical element mounting plate 3, and the lower part is a hemispherical structure, the size of which is consistent with the spherical surface 14 on the inside of the preformed solder ring 12, and the two can be tightly combined during use. Figure 4

[0036] As shown in the optical assembly welding base plate 5, the center of the optical assembly welding base plate 5 is a light passing hole b10, which is coaxial with the light passing hole a9, and the laser reflected by the optical element 1 can pass through the light passing hole a9 and the light passing hole b10 continuously, the optical assembly is placed on the surface of the optical assembly welding base plate 5, and the optical assembly welding base plate 5 and the optical assembly are welded together through the welding pin and the solder structure 6, and the fixation of the optical assembly is completed. Figure 5

[0037] As shown in the solder structure 6, it comprises a heat conducting ring 11 and a preformed solder ring 12. The stepped hole structure of the inner edge of the heat conducting ring 11 and the outer cylindrical surface of the preformed solder ring 12 are tightly combined during the solder preforming process, which improves the speed and efficiency of heat conduction during welding. Figure 6

[0038] As shown in the heat conducting ring 11, the material is pure copper, and the structure is ring-shaped, which comprises a laser irradiation surface 13 and an inner edge surface. The laser irradiation surface 13 is an inclined surface with a certain inclination angle, which serves as the irradiation surface of the laser during laser soldering, facilitating the irradiation of the laser on the heat conducting ring 11 and the transmission of heat to the whole structure of the heat conducting ring 11, melting the preformed solder ring 12; the inner edge surface of the heat conducting ring 11 is in a stepped hole structure. Figure 7

[0039] As shown in the heat conducting ring 11, the material is pure copper, and the structure is ring-shaped, which comprises a laser irradiation surface 13 and an inner edge surface. The laser irradiation surface 13 is an inclined surface with a certain inclination angle, which serves as the irradiation surface of the laser during laser soldering, facilitating the irradiation of the laser on the heat conducting ring 11 and the transmission of heat to the whole structure of the heat conducting ring 11, melting the preformed solder ring 12; the inner edge surface of the heat conducting ring 11 is in a stepped hole structure. Figure 8 ​​​​​​The preformed solder ring 12 shown is in a ring structure, the inner side spherical surface 14 is sized depending on the spherical surface size of the lower hemispherical structure of the soldering pin, and in use is in direct contact with the bottom spherical surface structure of the soldering pin; the thickness and diameter of the outer side cylindrical structure depends on the depth and diameter of the stepped hole of the inner edge surface of the heat conducting ring 11.

[0040] The basic flow of the present application to perform the laser soldering operation of the optical assembly is as follows:

[0041] (1) First, the optical element 1 and the optical element mounting plate 3 are bonded together to form an optical assembly, the center of the optical element 1 is coincident with the center of the light passing hole a9 on the optical element mounting plate 3, so that the laser reflected by the optical element 1 can continue to propagate through the light passing hole a9;

[0042] (2) Then place the optical assembly on the optical assembly soldering base plate 5, adjust the pose of the optical assembly so that the light passing hole a9 is coaxial with the light passing hole b10, the laser reflected by the optical element 1 can continue to propagate through the light passing hole a9 and the light passing hole b10;

[0043] (3) Place the solder structure 6 in the recessed structure on the bottom surface of the optical element mounting plate 3, then screw in the soldering pin through the threaded hole at the four corners of the optical element mounting plate 3, and make the lower hemispherical structure of the soldering pin coincide with the inner side spherical surface 14 of the preformed solder ring 12;

[0044] (4) Align the soldering laser with the outer laser irradiation surface 13 of the heat conducting ring 11, and sequentially complete the soldering of the four solder structures around the optical element mounting plate 3, and complete the fixation of the optical assembly.

[0045] Reheating the solder structure and unscrewing the soldering pin can also achieve non-destructive disassembly of the optical assembly.

[0046] Of course, the present application is not limited to the above examples, and the technical features not described in the present application can be realized by or using existing technology, which will not be described here; the above examples are only used to illustrate the technical solutions of the present application, and are not a limitation on the present application, and the preferred embodiments of the present application have been described in detail, and those skilled in the art should understand that changes, modifications, additions or substitutions made by those skilled in the art within the essential scope of the present application do not deviate from the purpose of the present application, and should also belong to the protection scope of the claims of the present application.

Claims

1. A welding structure for laser brazing of optical components, characterized in that, The welding structure for laser brazing of optical components includes an optical component, welding pins, an optical component welding base plate (5), and a solder structure (6); the optical component is located above the optical component welding base plate (5), and the two are welded together by the welding pins and the solder structure (6) to fix the optical component; the optical component welding base plate (5) has a light-transmitting hole b (10) in the center. The optical assembly includes an optical element (1) and an optical element mounting plate (3); the optical element mounting plate (3) has a light-transmitting hole a (9) at the center and threaded holes and recessed structures at the four corners, with the threaded holes located in the recessed structures; The optical element (1) is bonded to the optical element mounting plate (3), and the center of the optical element (1) coincides with the center of the light-transmitting hole a (9) on the optical element mounting plate (3) and the center of the light-transmitting hole b (10) on the optical component welding base plate (5); The upper part of the welding nail is a standard threaded structure, which is connected to the threaded hole of the optical element mounting plate (3), and the lower part is a hemispherical structure, which is connected to the solder structure (6). The solder structure (6) is located between the optical component mounting plate (3) and the optical component welding base plate (5), at the recessed structure position of the optical component mounting plate (3); the solder structure (6) is an irregular polyhedral ring in the shape of a frustum, one end of which is smaller than the size of the recessed structure and fixed in the recessed structure; the solder structure (6) includes a tightly bonded heat-conducting ring (11) and a pre-formed solder ring (12); the heat-conducting ring (11) is made of pure copper and has a ring structure, including a laser irradiation surface (13) and an inner edge surface; the laser irradiation surface (13) is an inclined surface with an angle, which serves as the laser irradiation surface during laser brazing. The light irradiation surface is used to irradiate the heat-conducting ring (11) with laser light and transfer heat to the overall structure of the heat-conducting ring (11) to melt the pre-formed solder ring (12); the inner edge surface has a stepped hole structure, and the ring-shaped pre-formed solder ring (12) is installed on the inner edge surface; the size of the inner spherical surface (14) of the pre-formed solder ring (12) matches the size of the spherical surface of the welding nail hemispherical structure, and the spherical surface (14) contacts the welding nail hemispherical structure during use; the thickness and diameter of the outer cylindrical structure of the pre-formed solder ring (12) match the depth and diameter of the stepped hole on the inner edge surface of the heat-conducting ring (11).

2. The method of using the welding structure for laser brazing of optical components according to claim 1, characterized in that, The specific steps are as follows: Step 1: The optical element (1) and the optical element mounting plate (3) are glued together to form an optical assembly. The center of the optical element (1) coincides with the center of the light-transmitting hole a (9) on the optical element mounting plate (3). The laser reflected by the optical element (1) continues to propagate through the light-transmitting hole a (9). Step 2: Place the optical component on the optical component welding base plate (5), adjust the position of the optical component so that the light-transmitting hole a (9) and the light-transmitting hole b (10) are coaxial, and the laser reflected by the optical element (1) continues to propagate through the light-transmitting hole a (9) and the light-transmitting hole b (10); Step 3: Place one end of the solder structure (6) in the groove on the bottom surface of the optical element mounting plate (3); screw the solder nail into the threaded holes around the optical element mounting plate (3) and make the spherical surface of the solder nail hemispherical structure coincide with the inner spherical surface (14) of the pre-formed solder ring (12); Step 4: Align the welding laser with the laser irradiation surface (13) outside the heat conduction ring (11) and weld it. Then, weld the four solder structures (6) placed around the optical component mounting plate (3) in sequence to complete the fixation of the optical component.

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