High-density special-shaped probe circuit board structure

Abstract

The application relates to the technical field of in-pipe detection, in particular to a high-density special-shaped probe circuit board structure. The circuit board structure comprises a circuit board top plate and a magnetic field sensor; the circuit board top plate comprises a first mounting part and a second mounting part, a plurality of magnetic field sensors are horizontally arranged on the first mounting part and the second mounting part respectively, and the first mounting part and the second mounting part are arranged in a staggered mode on a horizontal projection plane and form a first gap and a second gap for connecting other circuit board top plates in a diagonal direction. The application can effectively improve the arrangement density of the magnetic field sensors, and further improve the sampling rate, accuracy and integrity of the magnetic field sensors in picking up a leakage magnetic field.

Description

Technical Field

[0001] This invention relates to the field of pipeline inspection technology, and in particular to a high-density irregular-shaped probe circuit board structure. Background Technology

[0002] Oil and gas pipeline transportation holds an extremely important strategic position in the national economy. Long-distance pipelines have become the lifeline of modern industry and the national economy. The basic requirements for oil and gas long-distance pipeline transportation are safety and efficiency.

[0003] Pipeline inspection technology is a reliable means of ensuring the safe operation of pipeline transportation. Magnetic flux leakage corrosion detection is a commonly used method in pipeline inspection. Its principle is that when a pipeline is saturated with magnetization, if a defect exists, the magnetic field will leak out of the pipe wall and into the air. This leaked magnetic field is detected by a magnetic field sensor, and the defect can be quantified and identified based on the strength of the magnetic field signal. The arrangement density and sampling rate of the magnetic field sensor are crucial to the accuracy and completeness of picking up the leakage magnetic field.

[0004] The density of magnetic field sensors depends not only on the spacing between sensors within a single probe circuit board, but also on the spacing between sensors on two circuit boards. Existing probe circuit boards are generally rectangular. Due to the margin between the sensors and the edge of the circuit board, as well as the mounting margin for the external mechanical housing, the spacing between adjacent magnetic field sensors on two probe circuit boards can exceed 6mm. This results in insufficient accuracy and completeness in picking up leakage magnetic fields. Summary of the Invention

[0005] The purpose of this invention is to provide a high-density irregular-shaped probe circuit board structure to alleviate the technical problems of insufficient accuracy and integrity in picking up leakage magnetic fields in the prior art.

[0006] To solve the above-mentioned technical problems, the technical solution provided by the present invention is as follows:

[0007] The present invention provides a high-density irregular probe circuit board structure, including: a circuit board top plate and a magnetic field sensor; the circuit board top plate includes a first mounting part and a second mounting part, and a plurality of magnetic field sensors are horizontally arranged on the first mounting part and the second mounting part, and the first mounting part and the second mounting part are staggered on the horizontal projection plane and form a first notch and a second notch in the diagonal direction for connecting other circuit board top plates.

[0008] Furthermore, several magnetic field sensors are divided into a first magnetic field sensor and a second magnetic field sensor.

[0009] The first magnetic field sensors are arranged horizontally on the first mounting part;

[0010] The second magnetic field sensor is arranged horizontally on the second mounting part.

[0011] Furthermore, the projections formed by the first magnetic field sensor and the second magnetic field sensor in the arrangement direction are spaced at equal intervals.

[0012] Furthermore, the distance between the first mounting part and the second mounting part, and the distance between the second mounting part and the first mounting part, should satisfy the following:

[0013]

[0014] Wherein, Y1 is the distance from the first mounting part protruding from the second mounting part, Y2 is the distance from the second mounting part protruding from the first mounting part, X1 is the minimum gap between the first magnetic field sensor and the edge of the protruding side of the first mounting part, X2 is the minimum gap between the second magnetic field sensor and the edge of the protruding side of the second mounting part, X3 is the distance between the top plates of the two circuit boards in the horizontal direction where the second magnetic field sensor is located after the external mechanical housing is installed, X4 is the distance between the top plates of the two circuit boards in the horizontal direction where the first magnetic field sensor is located after the external mechanical housing is installed, and D is the spacing between the first magnetic field sensors or the second magnetic field sensors horizontally arranged on the top plate of the same circuit board.

[0015] Furthermore, the first notch mates with the protruding side of the first mounting part, and the second notch mates with the protruding side of the second mounting part.

[0016] Furthermore, the high-density irregular probe circuit board structure also includes a circuit board base plate, which includes a first connecting part; the first connecting part is connected to the circuit board top plate.

[0017] Furthermore, the circuit board base plate is provided with several rows of pin headers, and the circuit board top plate is provided with several rows of through holes that cooperate with the pin headers; on the circuit board base plate, the two rows of pin headers on the outer side are composed of surface mount pin headers, and the pin headers on the inner side are composed of surface mount pin headers and through-hole pin headers.

[0018] Furthermore, a signal transmission circuit is also provided on the top plate of the circuit board, which is electrically connected between the magnetic field sensor and the through hole.

[0019] Furthermore, the circuit board base plate is also equipped with a control chip and a power module that are electrically connected to the pin headers, and the control chip and the power module are electrically connected.

[0020] Furthermore, the circuit board base plate also includes a second connecting part;

[0021] The second connection part is located on one side of the first connection part, and a cable electrically connected to the control chip is provided on the second connection part.

[0022] Based on the above technical solutions, the technical effects achievable by this invention can be analyzed as follows:

[0023] The high-density irregular probe circuit board structure includes: a circuit board top plate and a magnetic field sensor; the circuit board top plate includes a first mounting part and a second mounting part, on which a plurality of magnetic field sensors are arranged horizontally respectively, and the first mounting part and the second mounting part are staggered on the horizontal projection plane and form a first notch and a second notch in the diagonal direction for connecting other circuit board top plates.

[0024] The first and second notches formed by the staggered arrangement of the first and second mounting portions allow the first mounting portion of the circuit board top plate to extend into the first notch of the adjacent circuit board top plate when two circuit board top plates are connected. This allows the projection of the first magnetic field sensor pointing towards the second mounting portion on the horizontal plane to cover the gap between the second magnetic field sensors of the two adjacent circuit board top plates. Similarly, the second mounting portion of the circuit board top plate can extend into the second notch of the adjacent circuit board, allowing the projection of the second magnetic field sensor pointing towards the first mounting portion on the horizontal plane to cover the gap between the first magnetic field sensors of the two adjacent circuit board top plates. This effectively increases the arrangement density of the magnetic field sensors, thereby improving the sampling rate, accuracy, and completeness of its leakage magnetic field pickup. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the connection of the probe circuit board in the prior art;

[0028] Figure 3 This is a schematic diagram showing the connection between the top plates of the two circuit boards of the present invention;

[0029] Figure 4 This is a schematic diagram of the circuit board base plate of the present invention.

[0030] Icons: 1-Top plate of circuit board; 2-Magnetic field sensor; 3-First notch; 4-Second notch; 5-Bottom plate of circuit board; 6-Pin header; 7-Control chip; 8-Cable;

[0031] 11-First mounting part; 12-Second mounting part; 21-First magnetic field sensor; 22-Second magnetic field sensor; 51-First connecting part; 52-Second connecting part; 53-Third connecting part. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0037] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0038] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0039] In existing technologies, such as Figure 2 As shown, the probe circuit board structure is generally rectangular. Due to the margin between the sensor and the edge of the circuit board, as well as the installation margin of the external mechanical housing, the distance between two adjacent magnetic field sensors 2 between the two probe circuit boards is more than 6mm, which makes the accuracy and completeness of its pickup of leakage magnetic field relatively insufficient.

[0040] In view of this, such as Figure 1 As shown, the present invention provides a high-density irregularly shaped probe circuit board structure, which includes: a circuit board top plate 1 and magnetic field sensors 2; the circuit board top plate 1 includes a first mounting portion 11 and a second mounting portion 12, on which a plurality of magnetic field sensors 2 are horizontally arranged respectively. The plurality of magnetic field sensors 2 are divided into first magnetic field sensors 21 and second magnetic field sensors 22; the first magnetic field sensors 21 are horizontally arranged on the first mounting portion 11; the second magnetic field sensors 22 are horizontally arranged on the second mounting portion 12. The first mounting portion 11 and the second mounting portion 12 are staggered on the horizontal projection plane and form a first notch 3 and a second notch 4 in the diagonal direction for connecting to other circuit board top plates 1.

[0041] In use, multiple circuit boards need to be connected to achieve complete detection of leakage magnetic fields. In this embodiment, based on the first notch 3 and the second notch 4 formed by the staggered arrangement of the first mounting part 11 and the second mounting part 12, when multiple circuit board top plates 1 are connected, the first mounting part 11 of each circuit board top plate 1 can extend into the first notch 3 of its adjacent circuit board top plate 1. This allows the projection of the first magnetic field sensor 21 onto the second mounting part 12 on the horizontal plane to cover the gap between the second magnetic field sensors 22 of two adjacent circuit board top plates 1. That is, in the same horizontal direction on the horizontal plane, the projection of the first magnetic field sensor 21 covers the gap between two adjacent circuit boards. The gap between the projections of the second magnetic field sensor 22 on the top plate 1; similarly, the second mounting part 12 of the top plate 1 can extend into the second notch 4 of its adjacent circuit board, so that the projection of the second magnetic field sensor 22 on the horizontal plane pointing to the first mounting part 11 covers the gap between the first magnetic field sensors 21 of the two adjacent top plates 1, that is, in the same horizontal direction on the horizontal plane, the projection of the second magnetic field sensor 22 covers the gap between the projections of the first magnetic field sensors 21 of the two adjacent top plates 1, thereby effectively improving the arrangement density of the magnetic field sensor 2, and thus improving its sampling rate, accuracy and integrity of picking up leakage magnetic field.

[0042] To achieve the effect of increasing the arrangement density of the magnetic field sensors 2, the specific structures of the first mounting part 11 and the second mounting part 12, as well as the arrangement of the first magnetic field sensor 21 and the second magnetic field sensor 22 on the top plate 1 of the circuit board, are described in detail below:

[0043] 1. Regarding the specific structure of the first mounting part 11 and the second mounting part 12, as follows: Figure 3 As shown

[0044] The distance by which the first mounting part 11 protrudes from the second mounting part 12 and the distance by which the second mounting part 12 protrudes from the first mounting part 11 should satisfy the following:

[0045]

[0046] Wherein, Y1 is the distance from the first mounting part 11 protruding from the second mounting part 12, Y2 is the distance from the second mounting part 12 protruding from the first mounting part 11, X1 is the minimum gap between the first magnetic field sensor 21 and the edge of the protruding side of the first mounting part 11, X2 is the minimum gap between the second magnetic field sensor 22 and the edge of the protruding side of the second mounting part 12, X3 is the distance between the two circuit board top plates 1 in the horizontal direction where the second magnetic field sensor 22 is located after the external mechanical housing is installed, X4 is the distance between the two circuit board top plates 1 in the horizontal direction where the first magnetic field sensor 21 is located after the external mechanical housing is installed, and D is the spacing between the first magnetic field sensors 21 or the second magnetic field sensors 22 horizontally arranged on the same circuit board top plate 1. The spacing between the first magnetic field sensors 21 and the spacing between the second magnetic field sensors 22 are equal, i.e., the same value. It should also be noted that when the edges of the adjacent sides of the two circuit board top plates 1 in the horizontal direction where the second magnetic field sensor 22 is located are not straight, the length of the longest horizontal line segment generated between the two circuit board top plates 1 in the horizontal direction where the second magnetic field sensor 22 is located is taken as X3; when the edges of the adjacent sides of the two circuit board top plates 1 in the horizontal direction where the first magnetic field sensor 21 is located are not straight, the length of the longest horizontal line segment generated between the two circuit board top plates 1 in the horizontal direction where the first magnetic field sensor 21 is located is taken as X4.

[0047] This ensures that when multiple circuit boards are connected, there is always at least one arrangement of the first magnetic field sensor 21 and the second magnetic field sensor 22 that can achieve the effect of increasing the arrangement density of the magnetic field sensor 2.

[0048] Furthermore, the first notch 3 mates with the protruding side of the first mounting portion 11, and the second notch 4 mates with the protruding side of the second mounting portion 12. This ensures that when the external mechanical housing is installed and the multiple circuit board top plates 1 are connected, the distances X3 and X4 between adjacent circuit board top plates 1 are not affected by the shape of the circuit board top plates themselves, thereby ensuring the arrangement density of the magnetic field sensors 2.

[0049] 2. Regarding the arrangement of the first magnetic field sensor 21 and the second magnetic field sensor 22 on the top plate 1 of the circuit board, as follows: Figure 3 As shown

[0050] (1) Regarding the arrangement of the end of the first magnetic field sensor 21 near the first notch 3 and the end of the second magnetic field sensor 22 near the second notch 4

[0051] The projections of the first magnetic field sensor 21 and the second magnetic field sensor 22 in the arrangement direction are equally spaced. In this embodiment, on the same circuit board top plate 1, the spacing between adjacent first magnetic field sensors 21 and the spacing between adjacent second magnetic field sensors 22 are equal and both are 1.6 mm. When the first magnetic field sensor 21 and the second magnetic field sensor 22 are projected in the same horizontal direction on the horizontal plane, the projections of the first magnetic field sensor 21 and the second magnetic field sensor 22 do not overlap, and the spacing between the first magnetic field sensor 21 at the end and the second magnetic field sensor 22 adjacent to it is also 1.6 mm. In this way, the arrangement density of the magnetic field sensors 2 is ensured with fewer magnetic field sensors 2, reducing production costs.

[0052] In another embodiment of the present invention, the projections of the first magnetic field sensor 21 and the second magnetic field sensor 22 on the same horizontal direction of the horizontal plane are partially overlapped.

[0053] (1) Regarding the arrangement of the end of the first magnetic field sensor 21 away from the first notch 3 and the end of the second magnetic field sensor 22 away from the second notch 4

[0054] If the distance Y1 by which the first mounting part 11 protrudes beyond the second mounting part 12, or the distance Y2 by which the second mounting part 12 protrudes beyond the first mounting part 11, is:

[0055]

[0056] The first magnetic field sensor 21 should be arranged close to the side of the first mounting part 11 that protrudes from the second mounting part 12, and the second magnetic field sensor 22 should be arranged close to the side of the second mounting part 12 that protrudes from the first mounting part 11, so as to ensure that the gap between the first magnetic field sensor 21 and the edge of the protruding side of the first mounting part 11 is the minimum gap, and the gap between the second magnetic field sensor 22 and the edge of the protruding side of the second mounting part 12 is also the minimum gap.

[0057] If the distance Y1 by which the first mounting part 11 protrudes beyond the second mounting part 12, or the distance Y2 by which the second mounting part 12 protrudes beyond the first mounting part 11, is:

[0058]

[0059] Therefore, the first magnetic field sensor 21 or the second magnetic field sensor 22 does not need to be arranged close to the protruding side of the first mounting part 11 or the second magnetic field sensor 22, but only needs to satisfy:

[0060]

[0061] Wherein, X3 is the distance between the two circuit board top plates 1 in the horizontal direction where the second magnetic field sensor 22 is located after the external mechanical housing is installed; X4 is the distance between the two circuit board top plates 1 in the horizontal direction where the first magnetic field sensor 21 is located after the external mechanical housing is installed; X5 is the gap between the first magnetic field sensor 21 and the edge of the protruding side of the first mounting part 11 where it is located; X6 is the gap between the second magnetic field sensor 22 and the edge of the protruding side of the second mounting part 12 where it is located; D is the spacing between the first magnetic field sensors 21 or the second magnetic field sensors 22 horizontally arranged on the same circuit board top plate 1; Y1 is the distance of the first mounting part 11 protruding from the second mounting part 12; and Y2 is the distance of the second mounting part 12 protruding from the first mounting part 11.

[0062] This ensures that when multiple circuit board top plates 1 are connected, the maximum spacing between the projections of each magnetic field sensor 2 in the same horizontal direction on the horizontal plane is always 1.6mm, thereby achieving the effect of increasing the arrangement density.

[0063] To achieve the desired detection effect, the high-density irregularly shaped probe circuit board structure also includes a circuit board base plate 5. The structure of the circuit board base plate 5 is described in detail below:

[0064] like Figure 4 As shown, the circuit board base plate 5 includes a first connecting portion 51; the first connecting portion 51 is connected to the circuit board top plate 1. On the horizontal projection plane, the first connecting portion 51 and the circuit board top plate 1 are of equal length, and the circuit board top plate 1 completely covers the first connecting portion 51. This ensures that when multiple circuit boards are connected, the circuit board base plate 5 will not affect the spacing of the circuit board top plate 1.

[0065] Furthermore, the circuit board base plate 5 is provided with several rows of pin headers 6, and the circuit board top plate 1 is provided with several rows of through holes that cooperate with the pin headers 6; on the circuit board base plate 5, the two rows of pin headers 6 on the outer side are composed of surface mount pin headers, and the pin headers 6 on the inner side are composed of surface mount pin headers and through-hole pin headers.

[0066] In this embodiment, the top plate 1 of the circuit board is provided with four rows of through holes, and the bottom plate 5 of the circuit board is provided with four rows of pin headers 6. The two rows of pin headers 6 on the outer side are composed of surface mount pin headers 6 to reduce the area occupied on the surface of the bottom plate 5 of the circuit board. The pin headers 6 on the inner side are composed of surface mount pin headers 6 and through-hole pin headers 6 to ensure the stability of the connection between the bottom plate 5 of the circuit board and the top plate 1 of the circuit board.

[0067] Furthermore, the top plate 1 of the circuit board is also provided with a signal transmission circuit electrically connected between the magnetic field sensor 2 and the through hole; the bottom plate 5 of the circuit board is also provided with a control chip 7 and a power module electrically connected to the pin header 6, and the control chip 7 and the power module are electrically connected. By setting the bottom plate 5 to form a double-layer circuit board structure, the bottom plate 5 can effectively share some components with the top plate 1, thereby allowing the top plate 1 to install more magnetic field sensors 2, thus increasing the arrangement density of the magnetic field sensors 2.

[0068] Furthermore, the circuit board base plate 5 also includes a second connecting portion 52;

[0069] The second connecting part 52 is disposed on one side of the first connecting part 51, and a cable 8 electrically connected to the control chip 7 is disposed on the second connecting part 52. It should be noted that the shape of the second connecting part 52 should ensure that when multiple circuit boards are connected, adjacent second connecting parts 52 are either separated or just abutted, so as not to affect the spacing of the top plate 1 of the circuit board.

[0070] In the optional embodiments of this invention, the circuit board base plate 5 further includes a third connecting portion 53. The third connecting portion 53 is disposed on the side of the first connecting portion 51 away from the second connecting portion 52. The third connecting portion 53 is provided with some components for realizing the detection function of the present invention. The shape requirements of the third connecting portion 53 are the same as those of the second connecting portion 52, so they will not be described in detail here.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-density irregularly shaped probe circuit board structure, characterized in that, include: The circuit board top plate (1) and magnetic field sensor (2); the circuit board top plate (1) includes a first mounting part (11) and a second mounting part (12), on which a plurality of magnetic field sensors (2) are arranged horizontally respectively, and the first mounting part (11) and the second mounting part (12) are staggered on the horizontal projection plane and form a first notch (3) and a second notch (4) in the diagonal direction for connecting other circuit board top plates (1); The magnetic field sensors (2) are divided into a first magnetic field sensor (21) and a second magnetic field sensor (22). The first magnetic field sensor (21) is arranged horizontally on the first mounting part (11); The second magnetic field sensor (22) is horizontally arranged on the second mounting part (12); The first notch (3) mates with the protruding side of the first mounting part (11), and the second notch (4) mates with the protruding side of the second mounting part (12); The high-density irregular probe circuit board structure also includes a circuit board base plate (5), which includes a first connecting part (51); the first connecting part (51) is connected to the circuit board top plate (1); The circuit board base plate (5) is provided with several rows of pins (6), and the circuit board top plate (1) is provided with several rows of through holes that cooperate with the pins (6); The top plate (1) of the circuit board is also provided with a signal transmission circuit electrically connected between the magnetic field sensor (2) and the through hole; The circuit board base plate (5) is also provided with a control chip (7) and a power module that are electrically connected to the pin header (6), and the control chip (7) and the power module are electrically connected. The distance by which the first mounting part (11) protrudes from the second mounting part (12) and the distance by which the second mounting part (12) protrudes from the first mounting part (11) should satisfy the following: ； Wherein, Y1 is the distance from the first mounting part (11) protruding from the second mounting part (12), Y2 is the distance from the second mounting part (12) protruding from the first mounting part (11), X1 is the minimum gap between the first magnetic field sensor (21) and the edge of the protruding side of the first mounting part (11), X2 is the minimum gap between the second magnetic field sensor (22) and the edge of the protruding side of the second mounting part (12), X3 is the distance between the two circuit board top plates (1) in the horizontal direction where the second magnetic field sensor (22) is located after the external mechanical housing is installed, X4 is the distance between the two circuit board top plates (1) in the horizontal direction where the first magnetic field sensor (21) is located after the external mechanical housing is installed, and D is the spacing between the first magnetic field sensors (21) or the second magnetic field sensors (22) arranged horizontally on the same circuit board top plate (1); The first magnetic field sensor (21) or the second magnetic field sensor (22) does not need to be arranged close to the protruding side of the first mounting part 11 or the second magnetic field sensor (22), as long as the following conditions are met: ； Wherein, X4 is the distance between the top plates (1) of the two circuit boards in the horizontal direction where the first magnetic field sensor (21) is located after the external mechanical housing is installed, X5 is the gap between the first magnetic field sensor (21) and the edge of the protruding side of the first mounting part 11, and X6 is the gap between the second magnetic field sensor (22) and the edge of the protruding side of the second mounting part (12).

2. The high-density irregular-shaped probe circuit board structure according to claim 1, characterized in that, The distance between the projections formed by the first magnetic field sensor (21) and the second magnetic field sensor (22) in the arrangement direction is equal.

3. The high-density irregular-shaped probe circuit board structure according to claim 1, characterized in that, On the circuit board base plate (5), the two rows of pin headers (6) on the outer side are composed of surface mount pin headers, and the pin headers (6) on the inner side are composed of surface mount pin headers and through-hole pin headers.

4. The high-density irregular-shaped probe circuit board structure according to claim 1, characterized in that, The circuit board base plate (5) also includes a second connecting part (52); The second connection part (52) is disposed on one side of the first connection part (51), and a cable (8) electrically connected to the control chip (7) is disposed on the second connection part (52).

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