Chip transfer method, chip transfer device and display device

Abstract

The present application relates to a chip transfer method, a chip transfer device and a display device. The chip transfer method includes: providing a transfer substrate, on which a plurality of mounting grooves are provided, the plurality of mounting grooves including at least one first mounting groove; using a plurality of magnetic filling pieces to fill the plurality of mounting grooves respectively; moving the magnetic filling piece filling the first mounting groove out of the first mounting groove; using a first chip to fill the first mounting groove not filled by the magnetic filling piece to realize the transfer of the first chip to the transfer substrate, thereby being able to accurately transfer the chip to the corresponding position of the transfer substrate, thereby improving the transfer accuracy of the chip.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a chip transfer method, a chip transfer device and a display device. Background Art

[0002] Sub-millimeter light-emitting diodes (Mini LED) and micro light-emitting diodes (Micro LED) are regarded as the next-generation display technology, and their market prospects are highly promising.

[0003] However, how to transfer Mini LED / Micro LED chips to the driving backplane to obtain Mini LED / Micro LED products has become a key technical issue that needs to be solved urgently. Summary of the invention

[0004] The embodiments of the present application provide a chip transfer method, a chip transfer device and a display device to accurately transfer the chip to a corresponding position of a transfer substrate, thereby improving the transfer accuracy of the chip.

[0005] In order to solve the above problems, an embodiment of the present application provides a chip transfer method, which includes: providing a transfer substrate, on which a plurality of mounting grooves are provided, and the plurality of mounting grooves include at least one first mounting groove; using a plurality of magnetic filling pieces to fill the plurality of mounting grooves respectively; moving the magnetic filling piece filling the first mounting groove out of the first mounting groove; and using a first chip to fill the first mounting groove not filled with the magnetic filling piece, so as to realize the transfer of the first chip to the transfer substrate.

[0006] Among them, making the magnetic filling piece filling the first installation slot move out of the first installation slot specifically includes: providing an electromagnetic device, the electromagnetic device including a plurality of electromagnetic parts and a control circuit; correspondingly arranging the plurality of electromagnetic parts on one side of the plurality of installation slots; controlling the magnetism of the electromagnetic parts correspondingly arranged on one side of the first installation slot through the control circuit to generate a repulsive force on the magnetic filling piece filling the first installation slot, so that the magnetic filling piece filling the first installation slot moves out of the first installation slot under the action of the repulsive force.

[0007] The shape of the first mounting groove matches the shape of the first chip.

[0008] The cross-sectional area of ​​the first chip gradually decreases from the light-emitting surface of the first chip toward the backlight surface of the first chip, and the light-emitting surface is opposite to the backlight surface.

[0009] The magnetic filling piece has the same shape and size as the first chip.

[0010] Among them, the multiple mounting slots also include at least one second mounting slot. After the first mounting slot that is not filled with the magnetic filling piece is filled with the first chip, the chip transfer method also includes: moving the magnetic filling piece filling the second mounting slot out of the second mounting slot; and filling the second mounting slot that is not filled with the magnetic filling piece with the second chip to realize the transfer of the second chip to the transfer substrate.

[0011] Among them, using the first chip to fill the first installation slot that is not filled by the magnetic filling piece specifically includes: transferring a large amount of the first chip to the first installation slot through a fluid self-assembly process, so that the first chip fills the first installation slot that is not filled by the magnetic filling piece.

[0012] In order to solve the above problems, an embodiment of the present application also provides a chip transfer device, which is used to transfer the chip to a transfer substrate. The transfer substrate is provided with multiple mounting grooves, and the multiple mounting grooves include at least one first mounting groove. The chip transfer device includes: multiple magnetic filling pieces, used to fill the multiple mounting grooves respectively; an electromagnetic device, used to move the magnetic filling piece filling the first mounting groove out of the first mounting groove; a transfer unit, used to use the first chip to fill the first mounting groove that is not filled with the magnetic filling piece, so as to realize the transfer of the first chip to the transfer substrate.

[0013] Wherein, the electromagnetic device includes multiple electromagnetic components and a control circuit, and the control circuit is used to control the magnetism of each of the electromagnetic components; wherein, when the magnetic filling component filling the first installation slot is moved out of the first installation slot, the multiple electromagnetic components are correspondingly arranged on one side of the multiple installation slots, and the magnetism of the electromagnetic components correspondingly arranged on one side of the first installation slot generates a repulsive force on the magnetic filling component filling the first installation slot, thereby causing the magnetic filling component filling the first installation slot to move out of the first installation slot under the action of the repulsive force.

[0014] In order to solve the above problems, an embodiment of the present application also provides a display device, which includes: a transfer substrate, on which a plurality of mounting grooves are provided, and the plurality of mounting grooves include at least one first mounting groove; a first chip, which fills the first mounting groove, and the first chip is transferred to the transfer substrate by any of the above-mentioned chip transfer methods to fill the first mounting groove.

[0015] The beneficial effect of the present application is as follows: Different from the prior art, the chip transfer method, chip transfer device and display device provided by the present application provide a transfer substrate, on which a plurality of mounting grooves are provided, the plurality of mounting grooves including at least one first mounting groove, and then a plurality of magnetic filling members are used to fill the plurality of mounting grooves respectively, and the magnetic filling members filling the first mounting grooves are moved out of the first mounting grooves, and then the first chip is used to fill the first mounting grooves not filled by the magnetic filling members to realize the transfer of the first chip to the transfer substrate, so that the chip can be accurately transferred to the corresponding position of the transfer substrate, thereby improving the transfer accuracy of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the process of the chip transfer method provided in the embodiment of the present application;

[0018] Figure 2 is a schematic diagram of the cross-sectional structure after S11 is completed provided in an embodiment of the present application;

[0019] Figure 3 is a schematic diagram of the main structure of the chip provided in the embodiment of the present application;

[0020] Figure 4 is a schematic diagram of the structure of a chip provided in an embodiment of the present application from a bottom view;

[0021] Figure 5 is a schematic diagram of the cross-sectional structure after S12 is completed provided in an embodiment of the present application;

[0022] Figure 6 is a schematic diagram of the main structure of the magnetic filling member provided in an embodiment of the present application;

[0023] Figure 7 is a schematic diagram of the cross-sectional structure after S13 is completed provided in an embodiment of the present application;

[0024] Figure 8 is a structural schematic diagram of a magnetic filling member filling the first installation slot being moved out of the first installation slot by using an electromagnetic device provided in an embodiment of the present application;

[0025] Fig. 9 is a schematic diagram of the cross-sectional structure after S14 is completed provided in an embodiment of the present application;

[0026] Fig.10It is a structural schematic diagram of an embodiment of the present application after a first chip is used to fill a first mounting slot that is not filled with a magnetic filler and before an electromagnetic device is used to move the magnetic filler that fills a second mounting slot out of the second mounting slot;

[0027] Fig.11 is a schematic diagram of the cross-sectional structure after S15 is completed provided in an embodiment of the present application;

[0028] Fig.12 is a structural schematic diagram of a magnetic filling piece filling the second installation slot after being moved out of the second installation slot by using an electromagnetic device provided in an embodiment of the present application;

[0029] Fig.13 is a schematic diagram of the cross-sectional structure after S16 is completed provided in an embodiment of the present application;

[0030] Fig.14 is a schematic diagram of a structure after a second chip is used to fill a second mounting groove not filled with a magnetic filler, provided in an embodiment of the present application;

[0031] Fig.15 is a schematic diagram of the cross-sectional structure after S17 is completed provided in an embodiment of the present application;

[0032] Fig.16 is a schematic diagram of the cross-sectional structure after S18 is completed provided in an embodiment of the present application;

[0033] Fig.17 It is a structural schematic diagram of the embodiment of the present application after the third installation groove that is not filled with the magnetic filling member is filled with the third chip. DETAILED DESCRIPTION

[0034] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0035] See also Figure 1 , Figure 1 The schematic diagram of the chip transfer method provided in the embodiment of the present application is as follows. Figure 1 As shown, the specific process of the chip transfer method provided in the embodiment of the present application can be as follows:

[0036] S11: providing a transfer substrate, on which a plurality of mounting grooves are disposed, wherein the plurality of mounting grooves include at least one first mounting groove.

[0037] Among them, the cross-sectional structure diagram after S11 is completed can be as follows Figure 2 shown.

[0038] The chip transfer method provided in this embodiment can be used to transfer multiple chips to a transfer substrate 10. The chip can be a small-sized light-emitting diode such as a sub-millimeter light-emitting diode (Mini LED) or a micro light-emitting diode (Micro LED). Each mounting groove 11A / 11B / 11C on the transfer substrate 10 corresponds to a chip, and each mounting groove 11A / 11B / 11C can be used to at least partially accommodate a corresponding chip to locate the installation position of the corresponding chip on the transfer substrate 10. The above-mentioned transfer substrate 10 can be used to control the opening or closing of the chip installed thereon, and can be specifically an array substrate, a flexible circuit board (FPC) or a printed circuit board (PCB), etc.

[0039] In this embodiment, the shape of the mounting groove 11A / 11B / 11C on the transfer substrate 10 can be set according to the shape of the corresponding chip. Specifically, the shape of the mounting groove 11A / 11B / 11C on the transfer substrate 10 can match the shape of the corresponding chip to ensure that the mounting groove 11A / 11B / 11C can be completely filled with the corresponding chip. In one example, the depth, length and width of the mounting groove 11A / 11B / 11C can be equal to or slightly greater than the thickness, length and width of the corresponding chip, respectively, to ensure that the mounting groove 11A / 11B / 11C can not only be completely filled with the corresponding chip, but also can fully accommodate the corresponding chip, thereby facilitating the smooth self-assembly of the chip and the corresponding mounting groove 11A / 11B / 11C during the transfer process of the chip, reducing the difficulty of self-assembly.

[0040] In a specific embodiment, Figure 3 As shown, the cross-sectional area of ​​each chip 20 can be gradually reduced from the light-emitting surface 201 of each chip 20 toward the backlight surface 202 of each chip 20, wherein the light-emitting surface 201 of each chip 20 is opposite to the backlight surface 202 of each chip 20. Correspondingly, the cross-sectional area of ​​each mounting groove 11A / 11B / 11C on the transfer substrate 10 can also be gradually reduced from the opening end of each mounting groove 11A / 11B / 11C toward the bottom end of each mounting groove 11A / 11B / 11C. Thus, during the transfer process of the chip 20, it can be ensured that the chip 20 falls stably and correctly into the corresponding mounting groove 11A / 11B / 11C in the expected posture (that is, the light-emitting surface 201 is away from the bottom end of the corresponding mounting groove 11A / 11B / 11C and the backlight surface 202 is toward the bottom end of the corresponding mounting groove 11A / 11B / 11C).

[0041] In one example, if Figure 3 and Figure 4As shown, the chip 20 may be a mesa structure, which may include a stacked n-type gallium nitride layer 23, a quantum well layer 24, and a p-type gallium nitride layer 25, and the width of the n-type gallium nitride layer 23 may be greater than the width of the quantum well layer 24 and the width of the p-type gallium nitride layer 25, so that a local area of ​​the n-type gallium nitride layer 23 located above the p-type gallium nitride layer 25 is exposed. Figure 3 and Figure 4 As shown, the chip 20 may further include a first electrode 21 and a second electrode 22, wherein the first electrode 21 may be located on the p-type gallium nitride layer 25, and the second electrode 22 may be located on the n-type gallium nitride layer 23. The first electrode 21 may be a chromium or aluminum metal layer, and the second electrode 22 may be a nickel or silver metal layer.

[0042] Specifically, the first electrode 21 may be circular, annular, rectangular or regular polygonal, etc. The second electrode 22 may be annular and surround the p-type gallium nitride layer 25 in the mesa structure when viewed from above. The second electrode may be circular, annular, rectangular or regular polygonal, etc.

[0043] In some specific embodiments, in order to achieve electrical connection between the chip 20 and the transfer substrate 10, as shown in FIG. Figure 2 As shown, the transfer substrate 10 may further include a first pad 12 and a second pad 13 provided on the inner wall of the mounting groove 11A / 11B / 11C. Furthermore, after the chip 20 is transferred to the corresponding mounting groove 11A / 11B / 11C on the transfer substrate 10 by the chip transfer method provided in this embodiment, the first electrode 21 and the second electrode 22 of the chip 20 may respectively contact the first pad 12 and the second pad 13 on the inner wall of the corresponding mounting groove 11A / 11B / 11C, so as to electrically connect the chip 20 to the transfer substrate 10.

[0044] S12: Use a plurality of magnetic filling pieces to fill the plurality of mounting grooves respectively.

[0045] Among them, the cross-sectional structure diagram after S12 is completed can be as follows Figure 5 shown.

[0046] Specifically, the plurality of magnetic fillers 30 may correspond one-to-one to the plurality of mounting grooves 11A / 11B / 11C on the transfer substrate 10, and each magnetic filler 30 may be at least partially accommodated in its corresponding mounting groove 11A / 11B / 11C. The magnetic filler 30 is magnetic, and its material may be specifically a magnetic oxide material such as barium ferrite or strontium ferrite, or a metal magnetic material such as carbon steel, tungsten steel, aluminum nickel cobalt alloy, etc.

[0047] In a specific embodiment, Figure 3 and Figure 6 As shown, the magnetic filler 30 and the chip 20 can have the same shape and size, so that the magnetic filler 30 and the chip 20 can be transferred to the transfer substrate 10 through the same transfer process (for example, fluid self-assembly process) to fill the corresponding mounting grooves 11A / 11B / 11C, which is beneficial to saving process costs.

[0048] S13: Move the magnetic filling member filling the first installation groove out of the first installation groove.

[0049] Among them, the cross-sectional structure diagram after S13 is completed can be as follows Figure 7 shown.

[0050] Specifically, when the magnetic filler 30 filling the first mounting slot 11A is moved out of the first mounting slot 11A, the magnetic filler 30 filling the other mounting slots 11B / 11C can be prevented from moving out of the other mounting slots 11B / 11C at the same time, thereby ensuring that after the magnetic filler 30 in the first mounting slot 11A is moved out, the other mounting slots 11B / 11C are still filled with the corresponding magnetic filler 30, thereby facilitating the selective transfer of the first chip to the above-mentioned first mounting slot 11A in the subsequent process steps.

[0051] In a specific embodiment, Figure 8 As shown, the magnetic filling member 30 filling the first installation slot 11A can be moved out of the first installation slot 11A by using an electromagnetic device 40. Specifically, the electromagnetic device 40 may include a plurality of electromagnetic members 41 and a control circuit (not shown in the figure), and may also include a base 42, and the plurality of electromagnetic members 41 may be disposed on the upper surface of the base 42 and may be arranged in an array, the control circuit may independently control the magnetism of each of the plurality of electromagnetic members 41, and may be integrated in the base 42, wherein the electromagnetic member 41 may be specifically an electromagnet.

[0052] Accordingly, the above S13 may specifically include:

[0053] S131: Provide an electromagnetic device 40.

[0054] S132: Dispose a plurality of electromagnetic components 41 correspondingly on one side of a plurality of mounting grooves 11A / 11B / 11C.

[0055] Specifically, the plurality of mounting grooves 11A / 11B / 11C can be provided on the upper surface of the transfer substrate 10, each mounting groove 11A / 11B / 11C corresponds to one of the electromagnetic components 41, and the plurality of electromagnetic components 41 can be provided correspondingly directly below the plurality of mounting grooves 11A / 11B / 11C. Furthermore, in a specific implementation, the electromagnetic device 40 can be placed below the transfer substrate 10, and the plurality of electromagnetic components 41 can be directed toward the lower surface of the transfer substrate 10, and the plurality of electromagnetic components 41 can be respectively located directly below the plurality of mounting grooves 11A / 11B / 11C. In a specific example, after the plurality of electromagnetic components 41 are provided correspondingly on one side of the plurality of mounting grooves 11A / 11B / 11C, the top end of the electromagnetic component 41 away from the base 42 can abut against the lower surface of the transfer substrate.

[0056] S133: The control circuit controls the magnetism of the electromagnetic member 41 corresponding to one side of the first installation slot 11A to generate a repulsive force on the magnetic filler 30 filling the first installation slot 11A, so that the magnetic filler 30 filling the first installation slot 11A moves out of the first installation slot 11A under the action of the repulsive force.

[0057] Specifically, after the above-mentioned multiple electromagnetic components 41 are correspondingly arranged on one side of the above-mentioned multiple installation slots 11A / 11B / 11C, for example, after the above-mentioned multiple electromagnetic components 41 are respectively arranged directly below the above-mentioned multiple installation slots 11A / 11B / 11C, the above-mentioned control circuit in the electromagnetic device 40 can be powered on to the electromagnetic component 41 located directly below the first installation slot 11A, so as to give the electromagnetic component 41 located directly below the first installation slot 11A a magnetic direction opposite to the magnetic direction of the magnetic filler 30 filled in the first installation slot 11A, so that the electromagnetic component 41 located directly below the first installation slot 11A will generate a repulsive force on the magnetic filler 30 filling the first installation slot 11A, so that the magnetic filler 30 filling the first installation slot 11A moves out of the first installation slot 11A under the action of the repulsive force.

[0058] In some specific embodiments, in order to ensure that the other installation slots 11B / 11C can still be filled with the corresponding magnetic filling pieces 30 after the magnetic filling piece 30 in the first installation slot 11A is removed, when the magnetic filling piece 30 filling the first installation slot 11A is removed from the first installation slot 11A by the electromagnetic device 40, the electromagnetic device 40 can also be used to prevent the magnetic filling piece 30 filling the other installation slots 11B / 11C from being removed from the other installation slots 11B / 11C. Accordingly, the above S13 can also include:

[0059] S134: The control circuit controls the magnetism of the electromagnetic member 41 corresponding to one side of the other mounting slot 11B / 11C to generate an adsorption force on the magnetic filler 30 filling the other mounting slot 11B / 11C, thereby preventing the magnetic filler 30 filling the other mounting slot 11B / 11C from moving out of the other mounting slot 11B / 11C.

[0060] Specifically, after the above-mentioned multiple electromagnetic components 41 are correspondingly arranged on one side of the above-mentioned multiple installation slots 11A / 11B / 11C, for example, after the above-mentioned multiple electromagnetic components 41 are respectively arranged directly below the above-mentioned multiple installation slots 11A / 11B / 11C, the above-mentioned control circuit in the electromagnetic device 40 can be powered on to give the electromagnetic components 41 located directly below other installation slots 11B / 11C a magnetic direction that is the same as the magnetic direction of the magnetic filling components 30 filled in other installation slots 11B / 11C, so that the electromagnetic components 41 located directly below other installation slots 11B / 11C will generate an adsorption force on the magnetic filling components 30 filling other installation slots 11B / 11C, and the magnetic filling components 30 filling other installation slots 11B / 11C cannot be moved out of other installation slots 11B / 11C under the action of the adsorption force.

[0061] S14: filling the first mounting groove that is not filled with the magnetic filling member with the first chip to achieve transfer of the first chip to the transfer substrate.

[0062] Among them, the cross-sectional structure diagram after S14 is completed can be as follows Fig. 9 shown.

[0063] In this embodiment, the number of the above-mentioned first mounting grooves 11A can be multiple, and the multiple chips corresponding to the multiple first mounting grooves 11A can have the same luminous color, that is, they can be the same type of light-emitting chips, for example, the first chip 20A, wherein the first chip 20A can specifically be a blue light chip, a red light chip or a green light chip, etc.

[0064] Specifically, when a massive amount of the first chip 20A needs to be transferred to the transfer substrate 10, the first chip 20A can be transferred in massive amounts to the first mounting groove 11A through a self-assembly process (for example, a fluid self-assembly process), so that the first chip 20A fills the corresponding first mounting groove 11A that is not filled by the magnetic filling member 30, so as to achieve self-assembly alignment of the first chip 20A with the corresponding first mounting groove 11A, thereby achieving accurate positioning of the first chip 20A on the transfer substrate 10 when the massive amount of the first chip 20A is transferred.

[0065] In some specific embodiments, Figure 2As shown, the plurality of mounting grooves 11A / 11B / 11C on the transfer substrate 10 may further include at least one second mounting groove 11B, and after the above S14, the chip transfer method may further include:

[0066] S15: Move the magnetic filling piece filling the second installation groove out of the second installation groove.

[0067] Among them, the cross-sectional structure diagram after S15 is completed can be as follows Fig.11 shown.

[0068] Specifically, when the magnetic filler 30 filling the second mounting slot 11B is moved out of the second mounting slot 11B, the magnetic filler 30 filling other mounting slots 11C can be prevented from moving out of other mounting slots 11C at the same time, thereby ensuring that after the magnetic filler 30 in the second mounting slot 11B is moved out, the other mounting slots 11C are still filled with the corresponding magnetic filler 30, so as to facilitate the accurate positioning of the second chip on the above-mentioned transfer substrate 10 when the second chip is transferred in large quantities in the subsequent process steps.

[0069] In a specific embodiment, Fig.12 As shown, the electromagnetic device 40 can be used to move the magnetic filler 30 filling the second installation slot 11B out of the second installation slot 11B. Specifically, the electromagnetic member 41 located directly below the second installation slot 11B can be powered on by the control circuit in the electromagnetic device 40 to give the electromagnetic member 41 located directly below the second installation slot 11B a magnetic direction opposite to the magnetic direction of the magnetic filler 30 filled in the second installation slot 11B, so that the electromagnetic member 41 located directly below the second installation slot 11B will generate a repulsive force on the magnetic filler 30 filling the second installation slot 11B, and the magnetic filler 30 filling the second installation slot 11B will move out of the second installation slot 11B under the action of the repulsive force. Furthermore, the control circuit in the above-mentioned electromagnetic device 40 can also be used to power on the electromagnetic component 41 located directly below the other installation slots 11C, so as to give the electromagnetic component 41 located directly below the other installation slots 11C a magnetism with the same direction as the magnetic direction of the magnetic filler 30 filled in the other installation slots 11C, so that the electromagnetic component 41 located directly below the other installation slots 11C will generate an adsorption force on the magnetic filler 30 filling the other installation slots 11C, and the magnetic filler 30 filling the other installation slots 11C cannot be moved out of the other installation slots 11C under the action of the adsorption force.

[0070] S16: Filling the second mounting groove that is not filled with the magnetic filling member with the second chip to achieve transfer of the second chip to the transfer substrate.

[0071] Among them, the cross-sectional structure diagram after S16 is completed can be as follows Fig.13 shown.

[0072] In this embodiment, the number of the above-mentioned second mounting grooves 11B can be multiple, and the multiple chips corresponding to the multiple second mounting grooves 11B can have the same luminous color, that is, they can be the same type of light-emitting chips, for example, the second chip 20B, wherein the second chip 20B can be specifically a blue light chip, a red light chip or a green light chip, etc., and the luminous color of the second chip 20B and the above-mentioned first chip 20A can be different.

[0073] Specifically, when a massive amount of the second chip 20B needs to be transferred to the transfer substrate 10, the second chip 20B can be transferred in massive amounts to the second mounting groove 11B through a self-assembly process (for example, a fluid self-assembly process), so that the second chip 20B fills the corresponding second mounting groove 11B that is not filled by the magnetic filling member 30, so as to achieve self-assembly alignment of the second chip 20B with the corresponding second mounting groove 11B, thereby achieving accurate positioning of the second chip 20B on the transfer substrate 10 when the massive amount of the second chip 20B is transferred.

[0074] In some specific embodiments, Figure 2 As shown, the plurality of mounting grooves 11A / 11B / 11C on the transfer substrate 10 may further include at least one third mounting groove 11C, and, after the above S16, the above chip transfer method may further include:

[0075] S17: Move the magnetic filling piece filling the third installation groove out of the third installation groove.

[0076] Among them, the cross-sectional structure diagram after S17 is completed can be as follows Fig.15 shown.

[0077] Specifically, when the magnetic filler 30 filling the third mounting slot 11C is moved out of the third mounting slot 11C, if there are other mounting slots besides the first mounting slot 11A, the second mounting slot 11B and the third mounting slot 11C, the magnetic filler 30 filling other mounting slots can also be prevented from moving out of the other mounting slots at the same time, thereby ensuring that after the magnetic filler 30 in the third mounting slot 11C is moved out, the other mounting slots are still filled with the corresponding magnetic filler 30, so as to facilitate the accurate positioning of the third chip on the above-mentioned transfer substrate 10 when the third chip is transferred in large quantities in the subsequent process steps.

[0078] In a specific embodiment, Fig.14As shown, the electromagnetic device 40 can be used to move the magnetic filler 30 filling the third installation slot 11C out of the third installation slot 11C. Specifically, the electromagnetic member 41 located directly below the third installation slot 11C can be powered on by the control circuit in the electromagnetic device 40 to give the electromagnetic member 41 located directly below the third installation slot 11C a magnetic direction opposite to the magnetic direction of the magnetic filler 30 filled in the third installation slot 11C, so that the electromagnetic member 41 located directly below the third installation slot 11C will generate a repulsive force on the magnetic filler 30 filling the third installation slot 11C, and the magnetic filler 30 filling the third installation slot 11C will move out of the third installation slot 11C under the action of the repulsive force. Furthermore, if there are other mounting slots besides the first mounting slot 11A, the second mounting slot 11B and the third mounting slot 11C, the electromagnetic component 41 located directly below the other mounting slots can also be powered on by the control circuit in the above-mentioned electromagnetic device 40 to give the electromagnetic component 41 located directly below the other mounting slots a magnetism with the same magnetic direction as the magnetic filling component 30 filled in the other mounting slots, so that the electromagnetic component 41 located directly below the other mounting slots will generate an adsorption force on the magnetic filling component 30 filling the other mounting slots, and the magnetic filling component 30 filling the other mounting slots cannot be moved out of the other mounting slots under the action of the adsorption force.

[0079] S18: Filling the third mounting groove that is not filled with the magnetic filling member with a third chip to achieve transfer of the third chip to the transfer substrate.

[0080] Among them, the cross-sectional structure diagram after S18 is completed can be as follows Fig.16 shown.

[0081] In this embodiment, the number of the third mounting slots 11C can be multiple, and the multiple chips corresponding to the multiple third mounting slots 11C can have the same luminous color, that is, they can be the same type of luminous chips, for example, the third chip 20C, wherein the third chip 20C can be specifically a blue light chip, a red light chip or a green light chip, etc., and the luminous colors of the third chip 20C, the second chip 20B and the first chip 20A can be different from each other.

[0082] Specifically, when a massive amount of the third chip 20C needs to be transferred to the above-mentioned transfer substrate 10, the third chip 20C can be massively transferred to the above-mentioned third mounting groove 11C through a self-assembly process (for example, a fluid self-assembly process), so that the third chip 20C fills the corresponding third mounting groove 11C that is not filled by the magnetic filling member 30, so as to achieve self-assembly alignment of the above-mentioned third chip 20C with the corresponding third mounting groove 11C, thereby achieving accurate positioning of the above-mentioned third chip 20C on the above-mentioned transfer substrate 10 when the mass amount of the third chip 20C is transferred.

[0083] It can be understood that by sequentially executing the above S13 and S14, the selective transfer of the first type of chip (that is, the first chip 20A) to the first mounting groove 11A on the transfer substrate can be achieved; by sequentially executing the above S13, S14, S15 and S16, the selective transfer of the first type of chip (that is, the first chip 20A) to the first mounting groove 11A on the transfer substrate and the selective transfer of the second type of chip (that is, the second chip 20B) to the second mounting groove 11A on the transfer substrate can be achieved respectively. 1B; by sequentially executing the above S13, S14, S15, S16, S17 and S18, the first type of chip (that is, the first chip 20A) can be selectively transferred to the first mounting groove 11A on the transfer substrate, the second type of chip (that is, the second chip 20B) can be selectively transferred to the second mounting groove 11B on the transfer substrate, and the third type of chip (that is, the third chip 20C) can be selectively transferred to the third mounting groove 11C on the transfer substrate. In other words, the chip transfer method in this embodiment can realize the mass transfer of multiple types of chips to the same transfer substrate, simplify the process flow of mass transfer of multiple types of chips, and improve the chip transfer efficiency.

[0084] Moreover, compared with the prior art solution of using a robotic arm to pick up one Mini LED chip at a time and place it on the backplane to achieve the transfer of Mini LED to the backplane, the chip transfer method provided in this embodiment can transfer a huge number of Mini LEDs to the backplane at one time, greatly improving the transfer efficiency.

[0085] In addition, compared with the prior art solutions for transferring a mass of Micro LEDs to a backplane through mass transfer methods such as precise picking, laser transfer, roller transfer and self-assembly, the chip transfer method provided in this embodiment eliminates the need for pre-arrangement of Micro LED chips, and is easier to achieve self-assembly transfer positioning of three-color mass chips. It does not require the preparation of magnetic Micro LED chips, nor does it require high-precision equipment, thereby achieving low-cost, high-precision and high-yield mass chip transfer.

[0086] As can be seen from the above, the chip transfer method in this embodiment provides a transfer substrate, on which a plurality of mounting grooves are provided, the plurality of mounting grooves including at least one first mounting groove, and then a plurality of magnetic filling members are used to fill the plurality of mounting grooves respectively, and the magnetic filling members filling the first mounting grooves are moved out of the first mounting grooves, and then the first chip is used to fill the first mounting grooves not filled with the magnetic filling members to realize the transfer of the first chip to the transfer substrate, so that the chip can be accurately transferred to the corresponding position of the transfer substrate, thereby improving the transfer accuracy of the chip.

[0087] Based on the method described in the above embodiment, this embodiment will be further described from the perspective of the device. Figures 2 to 17 The chip transfer device provided in the embodiment of the present application is used to transfer the chip 20 to the transfer substrate 10. The transfer substrate 10 is provided with a plurality of mounting grooves 11A / 11B / 11C, and the plurality of mounting grooves 11A / 11B / 11C include at least one first mounting groove 11A. In addition, the chip transfer device may include a plurality of magnetic filling members 30, an electromagnetic device 40 and a transfer unit (not shown in the figure). Among them, the plurality of magnetic filling members 30 can be used to fill the plurality of mounting grooves 11A / 11B / 11C on the transfer substrate 10 respectively, the electromagnetic device 40 can be used to move the magnetic filling member 30 filling the first mounting groove 11A out of the first mounting groove 11A, and the transfer unit can be used to use the first chip 20A to fill the first mounting groove 11A that is not filled by the magnetic filling member 30, so as to realize the transfer of the first chip 20A to the transfer substrate 10.

[0088] In a specific embodiment, the electromagnetic device 40 may specifically include a plurality of electromagnetic components 41 and a control circuit (not shown in the figure), wherein the control circuit may be used to control the magnetism of each of the electromagnetic components 41. Furthermore, when the magnetic filling component 30 filling the first installation slot 11A is moved out of the first installation slot 11A, the plurality of electromagnetic components 41 may be correspondingly arranged on one side of the plurality of installation slots 11A / 11B / 11C, and the magnetism of the electromagnetic component 41 correspondingly arranged on one side of the first installation slot 11A generates a repulsive force on the magnetic filling component 30 filling the first installation slot 11A, thereby causing the magnetic filling component 30 filling the first installation slot 11A to move out of the first installation slot 11A under the action of the repulsive force.

[0089] In some embodiments, the multiple mounting grooves 11A / 11B / 11C on the above-mentioned transfer substrate 10 may also include at least one second mounting groove 11B. Accordingly, the above-mentioned electromagnetic device 40 can also be used to move the magnetic filling piece 30 filling the second mounting groove 11B out of the second mounting groove 11B, and the above-mentioned transfer unit can also be used to use the second chip 20B to fill the second mounting groove 11B not filled with the magnetic filling piece 30 to realize the transfer of the second chip 20B to the transfer substrate 10.

[0090] In some specific embodiments, the multiple mounting grooves 11A / 11B / 11C on the above-mentioned transfer substrate 10 may also include at least one third mounting groove 11C. Accordingly, the above-mentioned electromagnetic device 40 may also be used to move the magnetic filling piece 30 filling the third mounting groove 11C out of the third mounting groove 11C, and the above-mentioned transfer unit may also be used to use the third chip 20C to fill the third mounting groove 11C that is not filled with the magnetic filling piece 30, so as to realize the transfer of the third chip 20C to the transfer substrate 10.

[0091] It should be noted that the specific implementation of the structures involved in this embodiment (such as the transfer substrate 10, the chip 20, the magnetic filling member 30 and the electromagnetic device 40, etc.) can refer to the specific implementation of the corresponding structures in the above method embodiment, so it will not be repeated here.

[0092] As can be seen from the above, the chip transfer device in this embodiment is used to transfer the chip to a transfer substrate. The transfer substrate is provided with multiple mounting grooves, and the multiple mounting grooves include at least one first mounting groove. The chip transfer device includes: multiple magnetic filling pieces, used to fill the multiple mounting grooves respectively; an electromagnetic device, used to move the magnetic filling piece filling the first mounting groove out of the first mounting groove; a transfer unit, used to use the first chip to fill the first mounting groove that is not filled with the magnetic filling piece, so as to realize the transfer of the first chip to the transfer substrate, so that the chip can be accurately transferred to the corresponding position of the transfer substrate, thereby improving the transfer accuracy of the chip.

[0093] See also Fig.16 and Figure 2 , Fig.16 is a schematic diagram of the structure of a display device provided in an embodiment of the present application, Figure 2 yes Fig.16 Schematic diagram of the structure of the transfer substrate. Fig.16 and Figure 2 As shown, the display device may include a transfer substrate 10 and a first chip 20A, wherein a plurality of mounting grooves 11A / 11B / 11C are provided on the transfer substrate 10, the plurality of mounting grooves 11A / 11B / 11C include at least one first mounting groove 11A, the first chip 20A fills the first mounting groove 11A, and is transferred to the transfer substrate 10 by the chip transfer method of any of the above-mentioned embodiments to achieve filling of the first mounting groove 11A.

[0094] Specifically, the transfer substrate 10 and the first chip 20A may be used to provide a backlight source in the display device, or may be used to provide light-emitting pixels in the display device.

[0095] It should be noted that the display device in the embodiment of the present application has the same beneficial effects as the above-mentioned chip transfer method because the chip is transferred to the transfer substrate through the chip transfer method provided in this embodiment.

[0096] The embodiments of the present application do not impose any specific restrictions on the applicability of the display device, which can be a television, a laptop computer, a tablet computer, a wearable display device (such as a smart bracelet, a smart watch, etc.), a mobile phone, a virtual reality device, an augmented reality device, a car display, an advertising light box, or any other product or component with a display function.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A chip transfer method, characterized in that: include: Providing a transfer substrate, wherein a plurality of mounting grooves are provided on the transfer substrate, and the plurality of mounting grooves include at least one first mounting groove; Using a plurality of magnetic filling pieces to fill the plurality of mounting grooves respectively; An electromagnetic device is provided, the electromagnetic device comprising a plurality of electromagnetic components and a control circuit, the plurality of electromagnetic components are correspondingly arranged on one side of the plurality of mounting slots, and the magnetism of the electromagnetic component correspondingly arranged on one side of the first mounting slot is controlled by the control circuit to generate a repulsive force on the magnetic filling component filling the first mounting slot, so that the magnetic filling component filling the first mounting slot moves out of the first mounting slot under the action of the repulsive force; The first mounting groove that is not filled by the magnetic filling member is filled with a first chip to achieve transfer of the first chip to the transfer substrate.

2. The chip transfer method according to claim 1, characterized in that: The shape of the first mounting groove matches the shape of the first chip.

3. The chip transfer method according to claim 2, characterized in that: The cross-sectional area of ​​the first chip gradually decreases from the light emitting surface of the first chip toward the backlight surface of the first chip, and the light emitting surface is opposite to the backlight surface.

4. The chip transfer method according to claim 1, characterized in that: The magnetic filler has the same shape and size as the first chip.

5. The chip transfer method according to claim 1, characterized in that: The plurality of mounting slots further include at least one second mounting slot, and after the first mounting slot that is not filled with the magnetic filler is filled with the first chip, the chip transfer method further includes: Move the magnetic filling member filling the second installation slot out of the second installation slot; The second mounting groove not filled by the magnetic filling member is filled with a second chip to achieve transfer of the second chip to the transfer substrate.

6. The chip transfer method according to claim 1, characterized in that: The step of filling the first mounting groove not filled by the magnetic filling member with the first chip specifically includes: The first chip is transferred in bulk to the first mounting groove by a fluid self-assembly process, so that the first chip fills the first mounting groove that is not filled by the magnetic filling member.

7. A chip transfer device, characterized in that: Used to transfer the chip to a transfer substrate, the transfer substrate is provided with a plurality of mounting grooves, the plurality of mounting grooves include at least one first mounting groove, the chip transfer device comprises: A plurality of magnetic filling pieces, used to fill the plurality of mounting slots respectively; an electromagnetic device, used to move the magnetic filling piece filling the first mounting slot out of the first mounting slot, the electromagnetic device comprising a plurality of electromagnetic pieces and a control circuit, the control circuit being used to control the magnetism of each of the electromagnetic pieces, wherein when moving the magnetic filling piece filling the first mounting slot out of the first mounting slot, the plurality of electromagnetic pieces are correspondingly arranged on one side of the plurality of mounting slots, and the magnetism of the electromagnetic piece correspondingly arranged on one side of the first mounting slot generates a repulsive force on the magnetic filling piece filling the first mounting slot, so that the magnetic filling piece filling the first mounting slot moves out of the first mounting slot under the action of the repulsive force; The transfer unit is used to fill the first mounting groove that is not filled by the magnetic filling member with a first chip, so as to realize the transfer of the first chip to the transfer substrate.

8. A display device, characterized in that: include: A transfer substrate, wherein a plurality of mounting grooves are provided on the transfer substrate, and the plurality of mounting grooves include at least one first mounting groove; A first chip, wherein the first chip fills the first mounting groove, and the first chip is transferred to the transfer substrate by the chip transfer method according to any one of claims 1 to 6 to achieve filling of the first mounting groove.

Images