Antenna module, method for manufacturing antenna module, and terminal

Abstract

The application provides an antenna module, a preparation method of the antenna module and a terminal. The antenna module comprises a first plate body, an antenna unit, a second plate body and a transceiver chip. The antenna unit is arranged on the first plate body and used for transmitting and receiving radio frequency signals. The second plate body is arranged on a side surface of the first plate body opposite to the antenna unit. The transceiver chip is arranged in the second plate body and used for amplifying, phase-shifting and attenuating the radio frequency signals. The antenna unit is connected with the transceiver chip. The antenna module effectively ensures the flatness of the bottom of the antenna module, and makes the layout and wiring design and processing of a mother board corresponding to the antenna module simpler.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and in particular to an antenna module, a method for manufacturing the antenna module, and a terminal. Background Technology

[0002] With the development of wireless communication technology, terminal devices such as mobile phones, tablets, and portable multimedia players have become indispensable necessities in daily life. These terminal devices typically have internal antenna modules for wireless signal transmission and reception to support their wireless communication functions.

[0003] Currently, see Figure 1 , Figure 1 This is a schematic diagram of the structure of an antenna module in the prior art. An antenna module generally includes a module body 11 and a transceiver chip 12 and an external solder pad 13 located at the bottom of the module body 11. However, due to the different heights of the transceiver chip 12 and the external solder pad 13, the bottom of the antenna module is not a flat shape, which is not conducive to the layout and wiring design and heat dissipation design of the motherboard when the antenna module is used. Summary of the Invention

[0004] The antenna module, antenna module fabrication method, and terminal provided in this application aim to solve the problem that the bottom of the existing antenna module is not flat due to the different heights of the transceiver chip and the external solder pad, which is not conducive to the layout, wiring design, and heat dissipation design of the motherboard when the antenna module is used.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted in this application is to provide an antenna module. The antenna module includes a first plate, an antenna element, a second plate, and a transceiver chip; wherein, the antenna element is disposed on the first plate and is used to transmit and receive radio frequency signals; the second plate is stacked on the surface of the first plate opposite to the antenna element; the transceiver chip is disposed in the second plate and is used to amplify, phase-shift, and attenuate radio frequency signals; wherein, the antenna element is connected to the transceiver chip.

[0006] The antenna module also includes a third board, which is stacked on the side of the second board that is opposite to the first board, and the third board is provided with external pins and traces; the external pins are located on the side of the third board that is opposite to the second board, and the traces are respectively connected to the external pins and the transceiver chip.

[0007] The antenna module further includes: a first dielectric layer and a second dielectric layer, the first dielectric layer having a first through hole and the second dielectric layer having a second through hole; a first conductive post and a second conductive post, the first conductive post being disposed in the first through hole and the second conductive post being disposed in the second through hole; wherein, a first plate has a first through hole connecting to the antenna unit, a second plate has a second through hole connecting to the transceiver chip, a third plate has a third through hole connecting to the trace and connected to the transceiver chip; the first dielectric layer is disposed between the first plate and the second plate, the first conductive post connecting between the first through hole and the second through hole, the second dielectric layer is disposed between the third plate and the second plate, and the second conductive post connecting between the third through hole and the second through hole.

[0008] The transceiver chip has a connection pin on the side facing the third board; the second board has a machining hole at the position corresponding to the connection pin; the machining hole is connected to the connection pin and leads the connection pin to the side surface of the second board facing away from the first board; the connection pin is connected to the second through hole through the machining hole.

[0009] A redistribution layer is also formed on the side of the second plate that faces away from the first plate, and the machining hole is connected to the second through hole through the redistribution layer.

[0010] The distance between the connecting pin and the side surface of the second board facing the third board is less than 0.2 mm.

[0011] The first conductive post and / or the second conductive post are formed by copper paste sintering process; the machined holes are laser holes.

[0012] The extension direction of the first conductive post / or the second conductive post and the processing hole is parallel to the stacking direction of the first plate and the second plate.

[0013] The second board has a groove inside, the depth of which is not less than the thickness of the transceiver chip, and the transceiver chip is embedded in the groove.

[0014] The first and third boards are multilayer printed circuit boards stacked together; the second board is a multilayer prepreg stacked together.

[0015] To solve the above-mentioned technical problems, the second technical solution adopted in this application is: to provide a method for fabricating an antenna module. The method includes: setting an antenna element on a first plate; embedding a transceiver chip in a second plate; and laminating the first plate and the second plate to obtain an antenna module; wherein the second plate is located on the surface of the first plate opposite to the antenna element.

[0016] The step of embedding the transceiver chip in the second board specifically includes: providing the transceiver chip and a multilayer laminate; wherein, at least one layer of the laminate has a through hole at a preset position; placing the transceiver chip in the through hole, and laminating several laminates on the upper and lower surfaces of the through hole respectively.

[0017] The steps of laminating the first and second plates to produce the antenna module specifically include:

[0018] The first plate, the second plate, and the third plate are stacked and laminated in sequence to obtain the antenna module; wherein, the third plate is located on the side of the second plate that is opposite to the first plate; the third plate is provided with external pins and traces; the external pins are located on the side of the third plate that is opposite to the second plate, and the traces are respectively connected to the external pins and the transceiver chip.

[0019] The method further includes: providing a first dielectric layer and a second dielectric layer, and forming a first conductive post penetrating the upper and lower surfaces of the first dielectric layer, and forming a second conductive post penetrating the upper and lower surfaces of the second dielectric layer; the step of sequentially stacking and laminating the first plate, the second plate, and the third plate to obtain an antenna module specifically includes: sequentially stacking and laminating the first plate, the first dielectric layer, the second plate, the second dielectric layer, and the third plate to obtain an antenna module; wherein the first conductive post connects the first plate and the second plate, and the second conductive post connects the second plate and the third plate.

[0020] The transceiver chip has connection pins on the side facing away from the first board. Before the step of stacking and laminating the first board, the second board, and the third board in sequence to obtain the antenna module, the method further includes: opening a machining hole at the position of the connection pin on the second board, and connecting the machining hole to the connection pin to lead the transceiver chip to the surface of the second board facing away from the first board.

[0021] The distance between the connecting pin and the side of the second board facing away from the first board is less than 0.2 mm; the first and / or second conductive pillars are formed using a copper paste sintering process; and the machining holes are formed using laser drilling.

[0022] The extension directions of the first conductive post, the second conductive post, and / or the machining hole are parallel to the stacking direction of the first plate and the second plate.

[0023] To solve the aforementioned technical problems, the third technical solution adopted in this application is to provide a terminal. This terminal includes the antenna module mentioned above.

[0024] The antenna module, its fabrication method, and terminal provided in this application embodiment are described below. The antenna module comprises a first board with antenna elements mounted on it for transmitting and receiving radio frequency (RF) signals. Simultaneously, a second board and a transceiver chip connected to the antenna elements are included, with the transceiver chip housed within the second board. This not only allows for the amplification, phase shifting, and attenuation of RF signals using the transceiver chip, but also avoids the problem of uneven bottoming of the antenna module caused by the transceiver chip and external pads being located at the bottom of the antenna module. This effectively ensures the flatness of the antenna module's bottom, simplifying the layout, wiring design, and fabrication of the motherboard corresponding to the antenna module. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an antenna module in the prior art;

[0026] Figure 2 This is a schematic diagram of the structure of an antenna module provided in one embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of an antenna module provided in another embodiment of this application;

[0028] Figure 4 A flowchart illustrating a method for fabricating an antenna module according to an embodiment of this application;

[0029] Figure 5 for Figure 4 Sub-flowchart of step S2;

[0030] Figure 6 Another embodiment of this application provides a method for fabricating an antenna module. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0032] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of an antenna module provided in one embodiment of this application. In this embodiment, an antenna module 20a is provided, which specifically relates to millimeter-wave antenna integration technology and can be widely used in phased array antenna products in the 5G and satellite communication fields. The antenna module 20a includes a first board 21, an antenna element 22, a second board 23, a transceiver chip 24, and external pins 25. The first board 21 can be a multilayer printed circuit board; the second board 23 can be a multilayer prepreg; of course, the second board 23 can also be a printed circuit board.

[0036] The first plate 21 has a first surface and a second surface facing away from each other. A first through-hole 211 is formed on the first plate 21, penetrating both the first and second surfaces. Multiple antenna elements 22 are spaced apart on the first surface of the first plate 21 and connected to the first through-hole 211 for transmitting and receiving radio frequency signals. A second plate 23 is stacked on the side of the first plate 21 facing away from the antenna elements 22 (i.e., the second surface). A second through-hole 231 is formed on the second plate 23, penetrating both the first and second surfaces, and connected to the first through-hole 211. A transceiver chip 24 is disposed within the second plate 23 and connected to the second through-hole 231. The transceiver chip 24 is specifically connected to the antenna elements 22 through the second through-hole 231 and the first through-hole 211 to amplify, phase-shift, and attenuate radio frequency signals. External pin 25 is located on the side of the second board 23 opposite to the first board 21 and is connected to the transceiver chip 24 to connect the transceiver chip 24 to an external device. External pin 25 can be a solder pad or a solder ball.

[0037] By placing the transceiver chip 24 inside the second board 23, it is possible to amplify, phase-shift, and attenuate the radio frequency signal using the transceiver chip 24. This also avoids the problem of uneven bottom of the antenna module 20a caused by placing the transceiver chip 24 at the bottom of the antenna module 20a, thus effectively ensuring the flatness of the bottom of the antenna module 20a. This makes the layout and wiring design and processing of the motherboard corresponding to the antenna module 20a simpler.

[0038] The second plate 23 has a groove formed within it. The depth of the groove is not less than the thickness of the transceiver chip 24, and the lateral dimension of the groove is not less than the lateral dimension of the transceiver chip 24. In a specific embodiment, the transceiver chip 24 is embedded in the groove, and the depth and lateral dimension of the groove are both greater than the thickness and lateral dimension of the transceiver chip 24 to facilitate the embedding of the transceiver chip 24. Specifically, the transceiver chip 24 has a plurality of connection pins 241 on the side surface opposite to the first plate 21. The plurality of connection pins 241 are disposed on the bottom wall of the groove, and the second plate 23 has a machining hole 233 corresponding to the position of the connection pins 241. The machining hole 233 penetrates the bottom wall of the groove and connects to the connection pins 241 to lead the connection pins 241 out to the side surface of the second plate 23 opposite to the first plate 21, and connect to the second through hole 231 and the external pin 25.

[0039] In one specific embodiment, a redistribution layer 232 is formed on the surface of the second board 23 facing away from the first board 21, and the processing hole 233 communicates with the second via 231 through the redistribution layer 232. The external pin 25 is disposed on the side of the redistribution layer 232 facing away from the second board 23, and is connected to the transceiver chip 24 through the redistribution layer 232 and the processing hole 233.

[0040] In a specific embodiment, the processing hole 233 can dissipate heat from the transceiver chip 24, thus simplifying the heat dissipation design on the motherboard. To improve the heat dissipation effect of the processing hole 233, its extension direction can be parallel to the stacking direction of the first board 21 and the second board 23, thereby shortening the heat dissipation path of the transceiver chip 24. Specifically, the processing hole 233 can be a laser-drilled hole for ease of processing. Further, during the specific processing of the laser-drilled hole, to ensure that the laser drilling can penetrate to the position of the connecting pin 241, the distance between the connecting pin 241 and the surface of the second board 23 facing away from the first board 21 can be less than 0.2 mm. Of course, the distance between the connecting pin 241 and the surface of the second board 23 facing away from the first board 21 can also be less than 0.15 mm, 0.25 mm, or 0.3 mm, etc. The connecting pin 241 can be a solder pad or a solder ball.

[0041] In one specific embodiment, a first dielectric layer 27 is further disposed between the first plate 21 and the second plate 23; the first dielectric layer 27 has a first through hole penetrating its upper and lower surfaces, and a first conductive post 29 is disposed within the first through hole, and the first through hole 211 and the second through hole 231 are specifically connected through the first conductive post 29. The first dielectric layer 27 may be a prepreg. The first conductive post 29 may be a copper post.

[0042] The antenna module 20a provided in this embodiment, by setting a first board 21, and setting an antenna unit 22 on the first board 21, can transmit and receive radio frequency signals using the antenna unit 22, while realizing the separation of the antenna unit 22 from power supply, control and other signals; in addition, by setting a second board 23 and a transceiver chip 24 connected to the antenna unit 22, and setting the transceiver chip 24 inside the second board 23, it can not only realize the integration of the antenna unit 22 and the transceiver chip 24, which is convenient for the application of large-scale array of phased array antennas, but also avoid the problem of uneven bottom of the antenna module 20a caused by the transceiver chip 24 and the external solder pad being located at the bottom of the antenna module 20a, effectively ensuring the flatness of the bottom of the antenna module 20a, making the layout and wiring design and processing of the motherboard corresponding to the antenna module 20a simpler.

[0043] In another embodiment, see Figure 3 , Figure 3This is a schematic diagram of the structure of an antenna module 20a provided in another embodiment of this application; another antenna module 20b is provided, which differs from the antenna module 20a provided in the first embodiment in that: the antenna module 20b further includes a third board 26 to facilitate wiring. The third board 26 is stacked on the side of the second board 23 opposite to the first board 21, and the third board 26 is provided with wiring; external pins 25 are specifically disposed on the side of the third board 26 opposite to the second board 23, and the wiring connects the external pins 25 and the transceiver chip 24 respectively. The third board 26 may be a multilayer printed circuit board stacked together.

[0044] Specifically, the third board 26 also has a through-hole 261, which connects to the external pin 25 and connects to the trace or redistribution layer 232 for connection to the transceiver chip 24. In one specific embodiment, as shown... Figure 3 As shown, the third via 261 penetrates the upper and lower surfaces of the third plate 26 and is connected to the external pin 25 and the redistribution layer 232, respectively.

[0045] Furthermore, in this embodiment, a second dielectric layer 28 is provided between the third plate 26 and the second plate 23. The second dielectric layer 28 has a second through hole penetrating its upper and lower surfaces, and a second conductive post 30 is provided in the second through hole. The third through hole 261 and / or the wiring are connected to the redistribution layer 232 through the second conductive post 30. The second dielectric layer 28 may be a prepreg. The second conductive post 30 may be a copper post.

[0046] In one embodiment, a terminal is also provided, which may be a mobile phone, computer, etc. The terminal includes the antenna module 20a / 20b designed in any of the above embodiments.

[0047] Specifically, the two antenna modules 20a / 20b described above can be manufactured using the method for preparing antenna module 20a provided in the following embodiment.

[0048] In one embodiment, see Figure 4 , Figure 4 This is a flowchart illustrating a method for fabricating an antenna module 20a according to an embodiment of this application. A method for fabricating an antenna module is provided, which can be used to fabricate the antenna module 20a described in the first embodiment above. The method specifically includes:

[0049] Step S1: Set the antenna unit on the first plate.

[0050] The first board 21 can be a multilayer printed circuit board stacked together. The first board 21 has a first surface and a second surface facing away from each other; a first through hole 211 is opened on the first board 21, penetrating its first surface and second surface, and the antenna unit 22 is connected to the first through hole 211.

[0051] Step S2: Embed the transceiver chip in the second board.

[0052] Steps S2 and S1 are not sequential. In one embodiment, see [link to embodiment]. Figure 5 , Figure 5 for Figure 4 The sub-flowchart of step S2; step S2 specifically includes:

[0053] Step S21: Provide transceiver chips and multilayer laminates.

[0054] The transceiver chip 24 has several connection pins 241. At least one laminate has through holes at predetermined positions.

[0055] Step S21: Place the transceiver chip inside the through hole, and laminate several laminates on the upper and lower surfaces of the through hole respectively.

[0056] In a specific embodiment, at least one layer of laminate without through holes is stacked, and then at least one layer of laminate with through holes is stacked, with the through holes on each laminate corresponding to each other, to form a groove; wherein the depth and lateral dimension of the groove are not less than the thickness and lateral dimension of the transceiver chip 24. The connection pins 241 of the transceiver chip 24 are placed in the groove with the bottom of the groove, and then several layers of laminate without through holes are stacked, followed by a first lamination to form a second board 23, and the transceiver chip 24 is embedded in the second board 23. In this way, by embedding the transceiver chip 24 in the second board 23, that is, embedding it inside the antenna module 20a, only the external pins 25 need to be provided at the bottom of the antenna module 20a, which can effectively avoid the problem of uneven bottom of the antenna module 20a due to the difference in height between the transceiver chip 24 and the external pins 25, and simplify the layout wiring and heat dissipation design of the motherboard.

[0057] Step S3: Laminate the first plate and the second plate to obtain the antenna module.

[0058] In a specific embodiment, before step S3, the method further includes: providing a first dielectric layer 27, and forming a first conductive post 29 penetrating its upper and lower surfaces on the first dielectric layer 27. The first conductive post 29 can be formed using a copper paste sintering process involving drilling and injecting copper paste, and the extension direction of the first conductive post 29 can be parallel to the stacking direction of the first plate 21 and the second plate 23. This simplifies the internal via design of the antenna module 20a and simplifies the manufacturing process. In this embodiment, step S3 specifically includes: sequentially stacking the first plate 21, the first dielectric layer 27, and the second plate 23, and performing a second lamination to obtain the antenna module 20a. The antenna element 22 is located on the surface of the first plate 21 facing away from the second plate 23. The first conductive post 29 connects the first through-hole 211 and the second through-hole 231.

[0059] In specific implementation, the method further includes: forming a machining hole 233 at the position corresponding to the connection pin 241 on the second board 23, the machining hole 233 being connected to the connection pin 241, so as to lead the transceiver chip 24 to the side surface of the second board 23 facing away from the first board 21, and communicating with the second through hole 231. This step can be performed after or after step S3.

[0060] In a specific embodiment, given the simplification of the laser drilling process and the elimination of the need for soldering to assemble the transceiver chip 24, the machining hole 233 can be formed by laser drilling and injection of a conductive medium. This conductive medium can be a metal such as copper or silver. Furthermore, to facilitate laser drilling and ensure effective connection between the machining hole 233 and the connecting pad, the distance between the connecting pin 241 and the surface of the second board 23 facing away from the first board 21 can be less than 0.2 mm; of course, the distance between the connecting pin 241 and the surface of the second board 23 facing away from the first board 21 can also be less than 0.15 mm, 0.25 mm, or 0.3 mm, etc.

[0061] Furthermore, in the specific implementation process, after forming the machining hole 233, a redistribution layer 232 can be formed on the surface of the second board 23 facing away from the first board 21, so that the second through hole 231 and the machining hole 233 are respectively connected to the redistribution layer 232; then, an external pin 25 is provided on the surface of the redistribution layer 232 facing away from the second board 23, so that the external pin 25 is connected to the transceiver chip 24 through the redistribution layer 232 and the machining hole 233. Of course, a redistribution layer 232 can also be provided on the surface of the second board 23 closer to the first board 21.

[0062] The antenna module fabrication method provided in this embodiment consists of a transceiver chip 24 and a printed circuit board. No soldering process is required, and the interconnection inside the antenna module 20a can be achieved solely through the printed circuit board process. The soldering process is eliminated, and the process flow is simple.

[0063] In another embodiment, see Figure 6 , Figure 6 This application provides a method for fabricating an antenna module according to another embodiment. Another method for fabricating an antenna module is also provided, which can be used to fabricate the antenna module 20b involved in the second embodiment described above. This method specifically includes:

[0064] Step S11: Set the antenna unit on the first plate.

[0065] Step S12: Embed the transceiver chip in the second board.

[0066] The specific implementation process of steps S11 and S12 is the same as or similar to the specific implementation process of steps S1 and S2 in the antenna module preparation method provided in the first embodiment above, and can achieve the same or similar technical effects. For details, please refer to the above.

[0067] Step S13: Stack the first plate, the second plate and the third plate in sequence and laminate them to obtain the antenna module.

[0068] The third board 26 is located on the side of the second board 23 opposite to the first board 21. The third board 26 is provided with external pins 25, traces, and a third via 261. The external pins 25 are located on the side of the third board 26 opposite to the second board 23, and the traces connect the external pins 25 and the transceiver chip 24 via the third via 261. In one embodiment, the third via 261 extends through the upper and lower surfaces of the third board 26 to directly connect the external pins 25 to the redistribution layer 232. It is understood that in this embodiment, the external pins 25 are specifically located on the surface of the third board 26 opposite to the second board 23.

[0069] In a specific embodiment, before step S13, the method further includes: providing a second dielectric layer 28, and forming a second conductive post 30 penetrating the upper and lower surfaces of the second dielectric layer 28. The second conductive post 30 can be formed using a copper paste sintering process involving drilling and injecting copper paste, and the extension direction of the second conductive post 30 can be parallel to the stacking direction of the second plate 23 and the third plate 26. This simplifies the internal via design of the antenna module 20a and simplifies the manufacturing process. In this embodiment, step S13 specifically includes: sequentially stacking the first plate 21, the first dielectric layer 27, the second plate 23, the second dielectric layer 28, and the third plate 26, and performing a second lamination to obtain the antenna module 20a. Step S13 simplifies the process by obtaining the final product through a single lamination. Specifically, the antenna element 22 is located on the side of the second plate 23 facing away from the second plate 23. The second conductive post 30 connects the second through hole 231 and the third through hole 261.

[0070] Furthermore, in this embodiment, before step S13, the method further includes: forming a machining hole 233 at the position corresponding to the connection pin 241 on the second board 23, and forming a redistribution layer 232 on the surface of the second board 23 facing away from the first board 21; the specific implementation process can be found in the above-mentioned textual description, and will not be repeated here. In this embodiment, the second conductive post 30 is connected to the third through hole 261 and the redistribution layer 232 respectively, so as to realize the connection between the external pin 25 and the transceiver chip 24.

[0071] The antenna module fabrication method provided in this embodiment involves setting an antenna unit 22 on a first plate 21 and embedding a transceiver chip 24 within a second plate 23; then laminating the first plate 21 and the second plate 23 to obtain the antenna module 20a / 20b. This method not only simplifies the process flow but also ensures the flatness of the bottom of the antenna module 20a / 20b by embedding the transceiver chip 24 within the second plate 23, simplifying the layout, wiring, and heat dissipation design of the motherboard. Furthermore, laser drilling is used to form machining holes 233 for assembling the transceiver chip 24, reducing welding-related processes compared to welding, further simplifying the process. Additionally, copper paste sintering is used to achieve vertical interconnection of the first plate 21, the second plate 23, and the third plate 26, simplifying the design and fabrication of internal vias in the antenna module 20a / 20b.

[0072] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A method for manufacturing an antenna module, characterized in that, include: An antenna unit is mounted on the first plate. A transceiver chip and a multilayer laminate are provided. The multilayer laminate constitutes a second plate, which is stacked on the side surface of the first plate opposite to the antenna unit. At least one of the laminates has a through hole at a predetermined position. The through hole of the multilayer laminate forms a groove. The transceiver chip is placed inside the through hole, and several laminates are respectively laminated on the upper and lower surfaces of the through hole; The third board is stacked on the side of the second board that is opposite to the first board, and the third board is provided with external pins and traces; the external pins are located on the side of the third board that is opposite to the second board, and the traces are respectively connected to the external pins and the transceiver chip; The first plate, the second plate, and the third plate are stacked and laminated in sequence to obtain an antenna module; wherein, during the lamination of multiple layers of the laminate, the transceiver chip is housed in the groove, and the depth and lateral dimension of the groove are not less than the thickness and lateral dimension of the transceiver chip. A first dielectric layer and a second dielectric layer are provided, and a first conductive post penetrating the upper and lower surfaces of the first dielectric layer is formed therethrough, and a second conductive post penetrating the upper and lower surfaces of the second dielectric layer is formed therethrough. The step of sequentially stacking and laminating the first plate, the second plate, and the third plate to obtain the antenna module specifically includes: An antenna module is fabricated by sequentially stacking and laminating the first plate, the first dielectric layer, the second plate, the second dielectric layer, and the third plate; wherein, the first conductive post connects the first plate and the second plate, and the second conductive post connects the second plate and the third plate; wherein, the second plate is located on the surface of the first plate opposite to the antenna element. The transceiver chip has connection pins on the side facing away from the first board; a machining hole is made on the second board at the position corresponding to the connection pins, and the machining hole is connected to the connection pins to lead the transceiver chip to the surface of the second board facing away from the first board. The first board and the third board are multilayer printed circuit boards stacked together; the second board is a multilayer prepreg stacked together. The first board, the second board and the third board are stacked in sequence and laminated once to obtain the antenna module.

2. The method for manufacturing an antenna module according to claim 1, characterized in that, The distance between the connection pin and the side surface of the second plate opposite to the first plate is less than 0.2 mm; the first conductive post and / or the second conductive post are formed by copper paste sintering process; the machining hole is formed by laser drilling.

3. The method for manufacturing an antenna module according to claim 2, characterized in that, The extension direction of the first conductive post, the second conductive post, and / or the processing hole is parallel to the stacking direction of the first plate and the second plate.

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