Robotic arm monitoring device and method, semiconductor process equipment

Abstract

The present invention provides a robot arm monitoring device and method, and semiconductor process equipment. The robot arm monitoring device includes a vibration detection unit and a distance measuring unit arranged on the robot arm. The vibration detection unit is used to detect the vibration value of the robot arm when taking and placing a wafer in real time, so as to judge whether the robot arm has vibration abnormality according to the vibration value; the distance measuring unit is used to detect the distance between the distance measuring unit and the inner wall of the transmission chamber in three mutually perpendicular directions before or after the robot arm takes and places the wafer, so as to judge whether the robot arm has point position offset according to the distance. In this way, it is possible to monitor whether the robot arm has vibration abnormality in real time when the robot arm takes and places the wafer, reduce or avoid shutdown without warning, and monitor whether the robot arm has point position offset, so as to correct the robot arm in time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a robot arm monitoring device and method, and semiconductor process equipment. Background Art

[0002] In the field of semiconductor technology, wafers need to be transferred in different chambers to implement different processing techniques on the wafers. Among them, the tool used to transfer the wafers is generally a robotic arm. Specifically, the robotic arm is used to pick up, place and transfer the wafers in the chamber to achieve the connection between the modules in the machine, thereby realizing the automation function in one machine. However, the robotic arm may be unstable when transferring wafers, for example, the robotic arm may experience abnormal vibration or point offset. However, in the prior art, it is impossible to monitor whether the robotic arm has abnormal vibration and point offset, and it can only be maintained manually at fixed periods and repaired after damage, that is, it is impossible to predict in advance whether the operation of the robotic arm is abnormal, which may cause unwarned shutdown, resulting in product scrapping and loss of production capacity. Summary of the invention

[0003] The object of the present invention is to provide a robot arm monitoring device and method, and semiconductor process equipment, which can monitor in real time whether there is abnormal vibration of the robot arm when the robot arm takes and places wafers, and can monitor whether there is point position deviation of the robot arm.

[0004] To achieve the above-mentioned purpose, the present invention provides a robot arm monitoring device, comprising: a robot arm, located in a transmission chamber, and used for taking and placing wafers; a vibration detection unit, arranged on the robot arm, and used for real-time detection of the vibration value of the robot arm when taking and placing the wafers; a distance measuring unit, arranged on the robot arm, and used for detecting the distance between the distance measuring unit and the inner wall of the transmission chamber in three mutually perpendicular directions before or after the robot arm takes and places the wafers; a first control unit, arranged outside the transmission chamber, and used for real-time reception of the vibration value detected by the vibration detection unit, so as to judge whether the robot arm has vibration abnormality according to the vibration value; a second control unit, arranged outside the transmission chamber, and used for real-time reception of the distance detected by the distance measuring unit, so as to judge whether the robot arm has point position deviation according to the distance.

[0005] Optionally, in the robotic arm monitoring device, the robotic arm includes a robotic arm body, a tooth fork and a rotating shaft, the robotic arm body and the tooth fork are connected via the rotating shaft, and the tooth fork is used to take and place the wafer.

[0006] Optionally, in the robotic arm monitoring device, the vibration detection unit and the distance measuring unit are both fixed on the tooth fork, and the vibration detection unit and the distance measuring unit are arranged at intervals.

[0007] Optionally, in the robotic arm monitoring device, the ranging unit includes three laser ranging sensors, which are used to emit laser pulses to the inner wall of the transmission chamber in three mutually perpendicular directions, and receive the laser pulses reflected from the inner wall of the transmission chamber to obtain the distance between the ranging unit and the inner wall of the transmission chamber in three mutually perpendicular directions.

[0008] Optionally, in the robot arm monitoring device, the second control unit is connected to the robot arm signal, and the second control unit is also used to send a control signal to move the robot arm to the origin position within a predetermined time period before or after the robot arm takes or places the wafer, so as to detect the distance between the robot arm and the inner wall of the transfer chamber.

[0009] Optionally, in the robotic arm monitoring device, the second control unit is further used to calculate the offset of the robotic arm when there is a point offset in the robotic arm, and send a correction signal to correct the robotic arm.

[0010] Optionally, in the robotic arm monitoring device, the robotic arm monitoring device also includes a signal receiving unit, which is arranged outside the transmission chamber, and the signal receiving unit is respectively connected to the vibration detection unit and the first control unit by signal, and the signal receiving unit is used to receive the electrical signal containing the vibration value sent by the vibration detection unit, and convert the electrical signal containing the vibration value into a data signal and transmit it to the first control unit in real time; the signal receiving unit is also respectively connected to the ranging unit and the second control unit by signal, and the signal receiving unit is also used to receive the electrical signal containing the distance sent by the ranging unit, and convert the electrical signal containing the distance into a data signal and transmit it to the second control unit in real time.

[0011] Optionally, in the robotic arm monitoring device, the robotic arm monitoring device also includes: a display unit, which is signal-connected to the first control unit, and the display unit is used to visualize the vibration value of the robotic arm when taking and placing the wafer; an alarm unit, which is signal-connected to the first control unit, and the first control unit is also used to control the alarm unit to issue an alarm when there is a vibration abnormality in the robotic arm, wherein if the vibration value of the robotic arm is greater than a preset threshold, it is judged that there is a vibration abnormality in the robotic arm.

[0012] Based on the same inventive concept, the present invention also provides a robot arm monitoring method, including: providing a robot arm, the robot arm is located in a transmission chamber to pick up and place wafers, and the robot arm is provided with a vibration detection unit and a ranging unit; using the vibration detection unit to detect in real time the vibration value of the robot arm when picking up and placing the wafer, so as to judge whether the robot arm has vibration abnormality according to the vibration value, and before or after the robot arm picks up and places the wafer, detecting the distance between the ranging unit and the inner wall of the transmission chamber in three mutually perpendicular directions, so as to judge whether the robot arm has point position deviation according to the distance.

[0013] Based on the same inventive concept, the present invention also provides a semiconductor process equipment, including the robot arm monitoring device as described above.

[0014] In the robot arm monitoring device provided by the present invention, the robot arm monitoring device includes: a robot arm, located in a transmission chamber, for taking and placing wafers; a vibration detection unit, arranged on the robot arm, for real-time detection of the vibration value when the robot arm takes and places the wafer; a distance measuring unit, arranged on the robot arm, for detecting the distance between the distance measuring unit and the inner wall of the transmission chamber in three mutually perpendicular directions before or after the robot arm takes and places the wafer; a first control unit, arranged outside the transmission chamber, for real-time receiving the vibration value detected by the vibration detection unit, so as to judge whether the robot arm has vibration abnormality according to the vibration value; a second control unit, arranged outside the transmission chamber, for real-time receiving the distance detected by the distance measuring unit, so as to judge whether the robot arm has point offset according to the distance. In this way, it is possible to monitor whether the robot arm has vibration abnormality in real time when the robot arm takes and places the wafer, thereby reducing or avoiding the occurrence of unwarned shutdown, improving the operating efficiency of the automation equipment, ensuring product quality, and being able to monitor whether the robot arm has point offset, so as to timely correct the robot arm, and at the same time, it is possible to reduce unnecessary excessive maintenance in the absence of point offset, thereby reducing the manpower and cost required for maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a block diagram of a robotic arm monitoring device according to an embodiment of the present invention.

[0016] Figure 2 Schematic diagram of the principle of a robotic arm monitoring device according to an embodiment of the present invention.

[0017] Figure 3 It is a schematic diagram of a visualized monitoring chart formed according to the vibration value when the robot arm takes and places a wafer in the robot arm monitoring device of an embodiment of the present invention.

[0018] Figure 4 It is a flow chart of a method for monitoring a robotic arm according to an embodiment of the present invention.

[0019] Among them, the figure numbers are explained as follows: 110-robotic arm; 111-robotic arm body; 112-rotating shaft; 113-tooth fork; 113a-front end; 113b-end; 120-vibration detection unit; 130-distance measuring unit; 140-first control unit; 150-second control unit; 160-signal receiving unit; 170-display unit; 180-alarm unit; 200-wafer. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the robot arm monitoring device and method and semiconductor process equipment proposed in the present invention in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0021] Figure 1 is a block diagram of a robotic arm monitoring device according to an embodiment of the present invention. Figure 2 Schematic diagram of the principle of the robot arm monitoring device according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, this embodiment provides a robot arm monitoring device, which includes a robot arm 110, a vibration detection unit 120, a distance measurement unit 130, a first control unit 140 and a second control unit 150.

[0022] The robot arm is located in the transfer chamber (not shown) and is used to take and place the wafer 200 to achieve the transfer of the wafer 200. For example, Figure 2 As shown, the robot arm 110 includes a robot arm body 111, a rotating shaft 112 and a tooth fork 113. The robot arm 110 and the tooth fork 113 are connected through the rotating shaft 112. The tooth fork 113 is used to take and place the wafer 200, and the wafer 200 can be placed on the surface of the tooth fork 113. The tooth fork 113 has a front end 113a and a rear end 113b that are arranged opposite to each other, and the front end 113a is closer to the rotating shaft 112 than the rear end 113b.

[0023] In this embodiment, the shapes and sizes of the robot arm body 111 and the tooth fork 113 can be selected and set according to actual needs.

[0024] like Figure 2As shown, the vibration detection unit 120 is arranged on the robot arm 110, and is used to detect the vibration value of the robot arm 110 in real time when the robot arm 110 takes and places the wafer 200. In the process of the robot arm 110 taking and placing the wafer 200, the vibration detection unit 120 can synchronously sense the vibration amplitude information of the robot arm 110, thereby obtaining the vibration value of the robot arm 110, and transmitting the vibration value to the first control unit 140 in real time, so that the vibration abnormality of the robot arm 110 can be detected in time to avoid shutdown without warning.

[0025] Specifically, the vibration detection unit 120 is disposed on the tooth fork 113. In this way, the distance between the vibration detection unit 120 and the wafer 200 is relatively close, so that the detection result is more sensitive and accurate.

[0026] In this embodiment, the vibration detection unit 120 can be fixedly mounted on the tooth fork 113 by bonding, clamping, welding or magnetic fixation, and can also be fixedly mounted on the tooth fork 113 by mounting parts such as screws, bolts, pins or rivets. The specific assembly method can be set according to actual conditions and is not limited here.

[0027] For example, Figure 2 As shown, the vibration detection unit 120 is installed at the end 113b of the tooth fork 113, that is, the vibration detection unit 120 is installed at the end of the tooth fork 113 away from the rotating shaft 112, but is not limited to this. The vibration detection unit 120 can also be installed at the front end 113a of the tooth fork 113, that is, the end close to the rotating shaft 112. This is not limited here and can be set according to actual conditions. Figure 2 In the description, an example is given in which the vibration detection unit 120 is installed at the end 113b of the tooth fork 113.

[0028] In this embodiment, the vibration detection unit 120 may be a vibration detector, such as a laser vibration detector.

[0029] In this embodiment, the monitoring device for the robot arm 110 further includes a signal receiving unit 160, which is disposed outside the transmission chamber and is signal-connected to the vibration detection unit 120 and the first control unit 140. The signal receiving unit 160 is used to receive the electrical signal containing the vibration value sent by the vibration detection unit 120, and convert the electrical signal into a data signal and transmit it to the first control unit 140 in real time.

[0030] Preferably, the connection between the signal receiving unit 160 and the vibration detection unit 120 can be a wireless signal connection, such as Bluetooth or wifi (wireless local area network, wireless fidelity). In this way, it is not necessary to change the action route of the robot arm 110, and there is no need to install a transmission line between the signal receiving unit 160 and the vibration detection unit 120, and the vibration value of the robot arm 110 when picking up and placing the wafer can be monitored.

[0031] In this embodiment, the first control unit 140 is disposed outside the transmission chamber, and is used to receive the vibration value detected by the vibration detection unit 120 in real time, so as to determine whether the mechanical arm 110 has abnormal vibration according to the vibration value. In this way, it is possible to monitor whether the mechanical arm 110 has abnormal vibration in real time when the mechanical arm 110 takes and places the wafer 200, thereby reducing or avoiding shutdown without warning, improving the operating efficiency of the automation equipment, and ensuring product quality.

[0032] After receiving the vibration value detected by the vibration detection unit 120, the first control unit 140 compares the vibration value with a preset threshold value, and if the vibration value is greater than the preset threshold value, it is determined that there is a vibration abnormality in the robot arm 110. The vibration value may include at least one of vibration amplitude, vibration frequency and vibration speed.

[0033] Exemplarily, the first control unit 140 may be a MES (Manufacturing Execution System).

[0034] like Figure 2 As shown, the monitoring device of the robot arm 110 also includes a display unit 170, and the display unit 170 is signal-connected to the first control unit 140. The display unit 170 is used to visualize the vibration value when the robot arm 110 takes and places the wafer 200, thereby generating a corresponding monitoring chart to facilitate real-time monitoring of the operating status of the robot arm 110 when taking and placing the wafer 200.

[0035] Figure 3 1 is a schematic diagram of a visualized monitoring chart formed according to the vibration value when the robot arm takes and places a wafer in the robot arm monitoring device of an embodiment of the present invention. Figure 3 As shown, in a further solution, the first control unit 140 can determine the operating state of the robot arm 110 according to the vibration value when the robot arm 110 takes and places the wafer 200, and display the operating state of the robot arm 110 through the display unit 170. Figure 3 Curve a in FIG. 1 represents the variation trend of the vibration value when the robot arm 110 takes and places the wafer 200 .

[0036] In this embodiment, the operating state of the robot arm 110 when placing the wafer 200 includes a normal state, a warning state, or a dangerous state. The normal state of the robot arm 110 means that the robot arm 110 operates normally, the warning state means that the robot arm 110 has abnormal vibration but does not affect the operation, and the dangerous state means that the robot arm 110 has abnormal vibration (or failure) that causes shutdown or product damage.

[0037] like Figure 2 As shown, the detection device for the robot arm 110 further includes an alarm unit 180, which is connected to the first control unit 140 by signal. When the first control unit 140 determines that the robot arm 110 has abnormal vibration, it controls the alarm unit 180 to sound an alarm, thereby timely reminding the staff to stop the machine for maintenance and material preparation, etc. The alarm unit 180 includes a light emitting diode and / or a buzzer, but is not limited thereto and can be set according to actual needs.

[0038] In this embodiment, Figure 2 As shown, the distance measuring unit 130 is arranged on the robot arm 110, and is used to detect the distance between the distance measuring unit 130 and the inner wall of the transfer chamber in three mutually perpendicular directions before or after the robot arm 110 takes and places the wafer 200, so that the actual position of the robot arm 110 can be obtained.

[0039] Preferably, the distance measuring unit 130 is disposed on the tooth fork 113, for example, it can be installed at the end 113b of the tooth fork 113, and the distance measuring unit 130 can be spaced apart from the vibration detection unit 120. In this way, the distance measuring unit 130 can be installed on the robot arm 110 more stably. In addition, the distance between the distance measuring unit 130 and the wafer 200 is closer, so that the accuracy of the detection result is higher.

[0040] In this embodiment, the ranging unit 130 can be fixedly mounted on the tooth fork 113 by bonding, clamping, welding or magnetic fixation, or it can be fixedly mounted on the tooth fork 113 by mounting parts such as screws, bolts, pins or rivets. The specific assembly method can be set according to actual conditions and is not limited here.

[0041] Specifically, the distance measuring unit 130 includes three laser distance measuring sensors (not shown), which emit laser pulses to the inner wall of the transmission chamber in three mutually perpendicular directions, and receive the laser pulses reflected from the inner wall of the transmission chamber to obtain the distance between the distance measuring unit 130 and the inner wall of the transmission chamber in the three mutually perpendicular directions. The distance between the robot arm 110 and the inner wall of the transmission chamber in the three mutually perpendicular directions can be represented, and the detection result is relatively accurate, and the detection result can be accurate to millimeters.

[0042] Exemplarily, the three laser ranging sensors may include a first laser ranging sensor, a second laser ranging sensor and a third ranging laser sensor, and the three mutually perpendicular directions may be a first direction X, a second direction Y and a third direction Z.

[0043] Specifically, the first laser ranging sensor can detect the distance between the inner wall of the transmission chamber in the first direction X and the first laser ranging sensor, thereby obtaining the distance between the ranging unit 130 in the first direction X and the inner wall of the transmission chamber, wherein the first direction can be the X direction, that is, the first laser ranging sensor can emit a laser pulse to the inner wall of the transmission chamber in front of the end 113b of the tooth fork 113 to obtain the distance between the ranging unit 130 in the first direction X and the inner wall of the transmission chamber.

[0044] The second laser ranging sensor can detect the distance between the inner wall of the transmission chamber in the second direction Y and the second laser ranging sensor, thereby obtaining the distance between the ranging unit 130 in the second direction Y and the inner wall of the transmission chamber, wherein the second direction can be the Y direction, that is, the second laser ranging sensor can emit laser pulses to the inner wall of the transmission chamber above the tooth fork 113 (that is, the top of the transmission chamber) to obtain the distance between the ranging unit 130 in the second direction Y and the inner wall of the transmission chamber.

[0045] The third laser ranging sensor can detect the distance between the inner wall of the transmission chamber in the third direction Z and the third laser ranging sensor, so as to obtain the distance between the ranging unit 130 in the third direction Z and the inner wall of the transmission chamber, wherein the third direction can be the Z direction, that is, the third laser ranging sensor can emit laser pulses to the inner wall of the transmission chamber on the side of the tooth fork 113 to obtain the distance between the ranging unit 130 in the third direction Z and the inner wall of the transmission chamber.

[0046] The second control unit 150 is connected to the robot arm 110 by signal, and the second control unit 150 is used to send a control signal to move the robot arm 110 to the origin position before or after the robot arm 110 takes and places the wafer 200, so as to detect the distance between the robot arm 110 and the inner wall of the transfer chamber. In other words, the robot arm 110 is first moved to the origin position, and then the distance between itself and the inner wall of the transfer chamber in three mutually perpendicular directions is detected by the distance measuring unit 130.

[0047] like Figure 2 As shown, the distance measuring unit 130 is signal-connected to the signal receiving unit 160, and the signal receiving unit 160 is also used to receive the electrical signal containing the distance sent by the distance measuring unit 130, and convert the electrical signal containing the distance into a data signal and transmit it to the second control unit 150 in real time.

[0048] Preferably, the ranging unit 130 and the signal receiving unit 160 are connected by a wireless signal, such as a Bluetooth connection or a WiFi connection. In this way, the ranging unit 130 can transmit the detection result to the signal receiving unit 160 by wireless transmission, and there is no need to install a transmission line between the ranging unit 130 and the signal receiving unit 160.

[0049] In this embodiment, the second control unit 150 is disposed outside the transmission chamber, and is used to receive the distance detected by the distance measuring unit 130 in real time, so as to determine whether the position of the robot arm 110 is offset according to the distance. In this way, it is possible to monitor whether the position of the robot arm is offset, so as to correct the robot arm in time, and at the same time, it is possible to reduce unnecessary excessive maintenance when there is no position offset, thereby reducing the manpower and cost required for maintenance.

[0050] Specifically, when there is a point offset in the robotic arm 110, the second control unit 150 calculates the offset of the robotic arm and sends a correction signal to correct the robotic arm 110, that is, the second control unit calculates an offset (Offset) according to the distance detected by the distance measuring unit 130 and the predetermined distance, and adjusts the robotic arm 110 according to the offset to correct the position (point position) of the robotic arm to ensure that the robotic arm can accurately perform tasks according to the predetermined path or position. In this way, there is no need for manual confirmation of points and teaching programming (Teaching), and manpower hours can be saved. In addition, the points of the robotic arm can be monitored and automatically corrected in real time, effectively reducing the probability of errors due to manual correction and improving the utilization rate of equipment. In addition, after the robotic arm is repaired, the point accuracy confirmation can be automated, which is conducive to the control of maintenance quality.

[0051] In this embodiment, the second control unit 150 can control the robot arm 110 to move to the origin position, that is, the preset position, and detect the distance between itself and the inner wall of the transfer chamber in three mutually perpendicular directions through the distance measuring unit 130, and use the detection result as the reference data (that is, the predetermined distance); then, before or after the robot arm 110 takes and places the wafer 200, the robot arm 110 is moved to the origin position, and the distance between the distance measuring unit 130 and the inner wall of the transfer chamber in three mutually perpendicular directions is detected, so as to judge whether the robot arm 110 has a point offset according to the distance, that is, the actual data of the point position of the robot arm 110 is obtained through the distance detected by the distance measuring unit 130, and the actual data is compared with the reference data. If there is a deviation between the actual data and the reference data, it is judged whether the robot arm 110 has a point offset. In this way, there is no need for manual confirmation of the point position and teaching programming (Teaching), thereby saving manpower hours.

[0052] In a further solution, the second control unit 150 can control the robot arm 110 to move to the origin position in a predetermined time period. For example, when the robot arm 110 is idle (not taking or placing the wafer 200), it moves to the origin position on a daily or weekly basis to perform a distance detection to determine whether the robot arm 110 has a point offset. The second control unit 150 may include, but is not limited to, a programmable logic controller.

[0053] Figure 4 FIG. 1 is a flow chart of a method for monitoring a robotic arm according to an embodiment of the present invention. Figure 4 As shown, this embodiment also provides a method for monitoring a robot arm, including: step S1: providing a robot arm, the robot arm is located in a transmission chamber to pick up and place wafers, and a vibration detection unit and a distance measuring unit are arranged on the robot arm; step S2: using the vibration detection unit to detect the vibration value of the robot arm when picking up and placing the wafer in real time, so as to judge whether the robot arm has vibration abnormality according to the vibration value, and before or after the robot arm picks up and places the wafer, the distance between the distance measuring unit and the inner wall of the transmission chamber in three mutually perpendicular directions is detected, so as to judge whether the robot arm has point position offset according to the distance. In this way, it is possible to monitor whether the robot arm has vibration abnormality in real time when the robot arm picks up and places the wafer, thereby reducing or avoiding shutdown without warning, improving the operating efficiency of the automation equipment, and ensuring product quality, and it is possible to monitor whether the point position of the robot arm is offset, so as to timely correct the robot arm, and at the same time, it is possible to reduce unnecessary excessive maintenance in the absence of point position offset, thereby reducing the manpower and cost required for maintenance.

[0054] This embodiment further provides a semiconductor process equipment, the semiconductor process equipment includes the robot arm monitoring device provided in this embodiment. The semiconductor process equipment also includes a transfer chamber. The semiconductor process equipment may be a dry etching equipment, but is not limited thereto.

[0055] In summary, in the robot arm monitoring device and method, and semiconductor process equipment provided by the embodiments of the present invention, the robot arm monitoring device includes: a robot arm, located in a transmission chamber, and used for taking and placing wafers; a vibration detection unit, arranged on the robot arm, and used for real-time detection of the vibration value when the robot arm takes and places wafers; a ranging unit, arranged on the robot arm, and used for detecting the distance between the ranging unit and the inner wall of the transmission chamber in three mutually perpendicular directions before or after the robot arm takes and places the wafers; a first control unit, arranged outside the transmission chamber, and used for real-time reception of the vibration value detected by the vibration detection unit, so as to determine whether the robot arm has vibration abnormalities according to the vibration value; a second control unit, arranged outside the transmission chamber, and used for real-time reception of the distance detected by the ranging unit, so as to determine whether the robot arm has point position offset according to the distance. In this way, it is possible to monitor in real time whether the robotic arm has abnormal vibration when it takes and places wafers, thereby reducing or avoiding unexpected shutdowns, improving the operating efficiency of automated equipment, and ensuring product quality. It is also possible to monitor whether the robotic arm has point offsets, so that the robotic arm can be corrected in a timely manner. At the same time, unnecessary excessive maintenance can be reduced when there is no point offset, thereby reducing the manpower and costs required for maintenance.

[0056] The above description is only a description of the preferred embodiment of the present invention, and is not any limitation on the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the claims. In addition, it should be recognized that although the present invention has been disclosed as above with preferred embodiments, the above embodiments are not used to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the technical content disclosed above can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of protection of the technical solution of the present invention.

Claims

1. A robot arm monitoring device, characterized in that: include: A robotic arm, located in the transfer chamber, is used to pick up and place wafers; A vibration detection unit, disposed on the robotic arm, for detecting in real time the vibration value when the robotic arm takes and places the wafer; A distance measuring unit is arranged on the robot arm, and is used to detect the distance between the distance measuring unit and the inner wall of the transfer chamber in three mutually perpendicular directions respectively before or after the robot arm takes or places the wafer and when the robot arm is at the origin position; A first control unit is disposed outside the transmission chamber and is used to receive the vibration value detected by the vibration detection unit in real time, so as to determine whether the mechanical arm has abnormal vibration according to the vibration value; A second control unit is disposed outside the transmission chamber and is used for receiving the distance detected by the distance measuring unit in real time, so as to determine whether the position of the robot arm is offset according to the distance.

2. The robot arm monitoring device according to claim 1, characterized in that: The robotic arm comprises a robotic arm body, a tooth fork and a rotating shaft. The robotic arm body is connected to the tooth fork via the rotating shaft, and the tooth fork is used to take and place the wafer.

3. The robot arm monitoring device according to claim 2, characterized in that: The vibration detection unit and the distance measuring unit are both fixed on the tooth fork, and the vibration detection unit and the distance measuring unit are arranged at an interval.

4. The robot arm monitoring device according to claim 1, characterized in that: The ranging unit includes three laser ranging sensors, which are used to emit laser pulses to the inner wall of the transmission chamber in three mutually perpendicular directions, and receive the laser pulses reflected from the inner wall of the transmission chamber, so as to obtain the distance between the ranging unit and the inner wall of the transmission chamber in the three mutually perpendicular directions.

5. The robot arm monitoring device according to claim 1, characterized in that: The second control unit is connected to the robot arm signal, and the second control unit is also used to send a control signal to move the robot arm to the origin position within a predetermined time period before or after the robot arm takes and places the wafer, so as to detect the distance between the robot arm and the inner wall of the transfer chamber.

6. The robot arm monitoring device according to claim 5, characterized in that: The second control unit is also used to calculate the offset of the robotic arm when there is a point offset of the robotic arm, and send a correction signal to correct the robotic arm.

7. The robot arm monitoring device according to claim 1, characterized in that: The robot arm monitoring device further includes a signal receiving unit, which is disposed outside the transmission chamber, and is respectively connected to the vibration detection unit and the first control unit by signal, and is used to receive the electrical signal containing the vibration value sent by the vibration detection unit, and convert the electrical signal containing the vibration value into a data signal and transmit it to the first control unit in real time; The signal receiving unit is also signal-connected to the distance measuring unit and the second control unit respectively. The signal receiving unit is also used to receive the electrical signal containing the distance sent by the distance measuring unit, and convert the electrical signal containing the distance into a data signal and transmit it to the second control unit in real time.

8. The robot arm monitoring device according to claim 1, characterized in that: The robotic arm monitoring device also includes: A display unit, the display unit being connected to the first control unit by signal, and the display unit being used to visualize the vibration value when the robotic arm takes and places the wafer; An alarm unit is signal-connected to the first control unit, and the first control unit is further used to control the alarm unit to sound an alarm when there is abnormal vibration of the robotic arm, wherein if the vibration value of the robotic arm is greater than a preset threshold, it is determined that there is abnormal vibration of the robotic arm.

9. A method for monitoring a robotic arm, characterized in that: include: Providing a robotic arm, the robotic arm is located in the transfer chamber to pick up and place the wafer, and the robotic arm is provided with a vibration detection unit and a distance measurement unit; The vibration detection unit is used to detect in real time the vibration value of the robot arm when taking and placing the wafer, so as to determine whether the robot arm has vibration abnormality according to the vibration value, and before or after the robot arm takes and places the wafer and when the robot arm is at the origin, the distance between the ranging unit and the inner wall of the transfer chamber in three mutually perpendicular directions is detected, so as to determine whether the robot arm has point position deviation according to the distance.

10. A semiconductor process equipment, characterized in that: The semiconductor process equipment includes a robot arm monitoring device as described in any one of claims 1 to 8.

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