Display panel and preparation method thereof

Abstract

The invention relates to the technical field of display panels, and provides a display panel and a preparation method thereof, and the preparation method of the display panel comprises the steps: providing a substrate, and fixing a plurality of chips on the substrate; manufacturing a first reflecting layer on one side, facing the chip, of the substrate, wherein the first reflecting layer is exposed out of the light emitting surface of the chip; manufacturing a plurality of transparent bodies arranged at intervals on the first reflecting layer, wherein the transparent bodies are in one-to-one correspondence with the chips and cover the light emitting surfaces of the chips; a peripheral side reflecting layer is manufactured on the peripheral side of the transparent body, a second reflecting layer is manufactured on the side, away from the first reflecting layer, of the transparent body, a black adhesive layer is manufactured on the side, away from the transparent body, of the second reflecting layer, and light outlet holes are formed in the positions, corresponding to the chip, of the second reflecting layer and the black adhesive layer. According to the preparation method of the display panel, the transparent body is surrounded by the first reflecting layer, the second reflecting layer and the peripheral reflecting layer, so that the light rays emitted by the chip are reflected in the transparent body, the light energy loss is reduced, the utilization rate of the light rays is improved, and the problem of color cast of the display panel is solved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display panel and a method for preparing the same. Background Art

[0002] With the continuous development of display technology, MLED (a general term for Mini LED and Micro LED) has gradually been used in the display field due to its advantages such as small size, high luminous efficiency, low power consumption and high stability.

[0003] For display panels integrated with MLED, light refraction, reflection and scattering between adjacent chips lead to light energy loss, which makes the display panel prone to color deviation due to unstable mixing ratio of three-color light at a wide viewing angle. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a display panel and a method for manufacturing the same to solve the problem that the display panel is prone to color shift.

[0005] The embodiment of the first aspect of the present application provides a method for preparing a display panel, comprising:

[0006] Providing a substrate, and placing a plurality of chips on the substrate;

[0007] A first reflective layer is formed on a side of the substrate facing the chip, wherein the first reflective layer exposes a light emitting surface of the chip;

[0008] Making a plurality of transparent bodies arranged at intervals on the first reflective layer, wherein the transparent bodies correspond to the chips one by one and cover the light emitting surface of the chip;

[0009] A peripheral reflective layer is made on the peripheral side of the transparent body, a second reflective layer is made on the side of the transparent body away from the first reflective layer, and a black glue layer is made on the side of the second reflective layer away from the transparent body. The second reflective layer and the black glue layer are provided with light exit holes at positions corresponding to the chip.

[0010] The display panel preparation method provided in the embodiment of the present application utilizes a first reflective layer, a second reflective layer and a peripheral reflective layer to surround a transparent body, so that the light emitted by the chip is reflected inside the transparent body, reducing the light energy loss caused by light refraction, reflection and scattering between adjacent chips, and improving the utilization rate of light; at the same time, each chip emits light through its corresponding light output hole, which can improve the mixing uniformity of the three-color chips after light output, thereby improving the color deviation problem of the display panel.

[0011] In some embodiments, the transparent body includes a main body and a convex portion convexly provided on the main body, and the convex portion is located in the light output hole; the chip includes a green chip, a red chip and a blue chip; the convex portion corresponding to the green chip and the blue chip is a concave lens structure, and / or the convex portion corresponding to the red chip is a convex lens structure.

[0012] Since the luminous efficiency of the green chip, the red chip and the blue chip are different, the convex parts corresponding to the green chip and the blue chip are designed as concave lens structures, so that the light is scattered to the periphery, reducing the brightness of the light; and / or the convex parts corresponding to the red chip are designed as convex lens structures, so that the light converges to the middle, increasing the brightness of the light. This design can further improve the mixing uniformity of the three-color chips after light is emitted, and further improve the color deviation problem of the display panel under a wide viewing angle.

[0013] In some embodiments, the first reflective layer is manufactured by cooperating with a first jig and a mold; the mold includes an upper mold and a lower mold, and the substrate and the first jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the first jig includes a plurality of accommodating cavities and a plurality of first injection holes, the accommodating cavities can accommodate the chip, and the first injection holes inject reflective material onto the substrate to form the first reflective layer.

[0014] The accommodating cavity can accommodate the chip so that the light-emitting surface of the chip is in the accommodating cavity, so that the injected reflective material is not easy to cover the light-emitting surface of the chip, thereby avoiding affecting the chip's luminescence; the reflective material is injected into the substrate through the first injection hole to form a first reflective layer; since a plurality of accommodating cavities and first injection holes are provided, the production efficiency of the first reflective layer can be improved.

[0015] In some embodiments, the first fixture includes a fixture body and a plurality of flexible sleeves, the fixture body is provided with a plurality of mounting holes, the flexible sleeves are installed in the mounting holes, and the flexible sleeves are provided with the accommodating cavity.

[0016] The fixture body is usually required to have a certain rigidity, while the flexible sleeve is relatively soft. By combining the fixture body and the flexible sleeve and setting the accommodating cavity on the flexible sleeve, the flexible sleeve can be closely attached to the side of the chip to prevent the injected reflective material from entering the accommodating cavity. At the same time, the flexible sleeve will not damage the chip when it is set on the chip, thereby ensuring the normal use of the chip.

[0017] In some embodiments, before the flexible sleeve is mounted on the fixture body, protective films are respectively provided on two opposite sides of the flexible sleeve in the light emitting direction.

[0018] By adopting the above technical solution, the protective film can effectively protect the flexible sleeve and prevent the flexible sleeve from being damaged. When in use, the protective film on the side facing the chip can be removed first, and then all the flexible sleeves can be installed in the mounting hole of the fixture body through the protective film on the other side, and finally the protective film on this side can be removed; because the flexible sleeve is installed in the mounting hole of the fixture body at one time through the protective film, the installation efficiency of the flexible sleeve is improved.

[0019] In some embodiments, a first gap is left between the cavity wall of the accommodating cavity and the light-emitting surface of the chip; and / or a second gap is left between the flexible sleeve and the hole wall of the mounting hole.

[0020] By designing the first gap, the flexible sleeve can be prevented from contacting the light-emitting surface of the chip and affecting the light emission of the chip; by designing the second gap, the flexible sleeve can have a certain displacement in the mounting hole. When there is an alignment deviation between the flexible sleeve and the mounting hole, it can also ensure that the flexible sleeve can be easily installed in the mounting hole.

[0021] In some embodiments, the transparent body is manufactured by cooperating between a second jig and a mold; the mold includes an upper mold and a lower mold, and the substrate and the second jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the second jig includes a plurality of partitions and a plurality of second injection holes, the partitions can separate two adjacent chips, and the second injection holes inject transparent material onto the first reflective layer to form the transparent body.

[0022] By adopting the above technical solution, the partition can separate two adjacent chips to separate the area where each chip is located into an independent area. After the transparent material is injected into the first reflective layer through the second injection hole, a transparent body covering the corresponding chip is formed above the first reflective layer. Since a plurality of partitions and second injection holes are provided, a plurality of transparent bodies can be formed at one time, thereby improving the production efficiency of the transparent body.

[0023] In some embodiments, each of the chips corresponds to at least two of the second injection holes.

[0024] Since the size of the transparent body is relatively large, each chip corresponds to at least two second injection holes, so that the transparent material can be injected into the area where the chip is located by using at least two second injection holes at the same time, so as to further improve the production efficiency of the transparent body.

[0025] In some embodiments, the peripheral reflective layer, the second reflective layer and the black glue layer are manufactured by cooperation of a third jig and a mold; the mold includes an upper mold and a lower mold, and the substrate and the third jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the third jig includes a plurality of third injection holes, and the third injection holes inject a mixture of white glue and black glue into the peripheral side of the transparent body and the side of the transparent body away from the first reflective layer, and the white glue sinks and solidifies to form the peripheral reflective layer and the second reflective layer, and the black glue floats on the surface of the white glue to form the black glue layer.

[0026] By adopting the above technical solution, a mixture of white glue and black glue is injected into the mold. First, the density of the black glue is lower than that of the white glue, so the black glue floats up and solidifies, while the white glue floats down and solidifies, and the black glue is on the surface of the white glue. That is, by injecting the mixed material once, the production of the peripheral reflective layer, the second reflective layer and the black glue layer can be completed, thereby improving efficiency.

[0027] The second aspect of the present application proposes a display panel, which includes a substrate, a plurality of chips, a first reflective layer, a plurality of transparent bodies, a second reflective layer, a peripheral reflective layer and a black glue layer, wherein the plurality of chips are arranged on the substrate, the first reflective layer is arranged on the side of the substrate facing the chip and exposing the light emitting surface of the chip; the plurality of transparent bodies are arranged at intervals on the first reflective layer, the transparent bodies correspond to the chips one by one and cover the light emitting surfaces of the chips; the peripheral reflective layer is arranged on the peripheral side of the transparent body, the second reflective layer is arranged on the side of the transparent body away from the first reflective layer, the black glue layer is arranged on the side of the second reflective layer away from the transparent body, and the second reflective layer and the black glue layer are provided with light emitting holes at positions corresponding to the chips.

[0028] The display panel provided in the embodiment of the present application utilizes a first reflective layer, a second reflective layer and a peripheral reflective layer to surround a transparent body, so that the light emitted by the chip is reflected inside the transparent body, reducing the light energy loss caused by light refraction, reflection and scattering between adjacent chips, and improving the utilization rate of light; at the same time, each chip emits light through its corresponding light output hole, which can improve the mixing uniformity of the three-color chips after light output at different viewing angles, thereby improving the color deviation problem of the display panel at a large viewing angle and improving the market competitiveness of the product.

[0029] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or conventional technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0031] Figure 1 is a flow chart of a method for preparing a display panel provided in some embodiments of the present application;

[0032] Figure 2 is a schematic diagram of the structure of the cooperation between the first jig and the mold provided in some embodiments of the present application;

[0033] Figure 3 yes Figure 2 The enlarged view of point A in the middle;

[0034] Figure 4 is a schematic diagram of a structure for injecting a reflective material through a first injection hole provided in some embodiments of the present application;

[0035] Figure 5 yes Figure 2 Schematic diagram of the structure of the first fixture;

[0036] Figure 6 yes Figure 5 A schematic structural diagram of a fixture body of the first fixture shown;

[0037] Figure 7 yes Figure 5 A schematic structural diagram of the flexible cover and protective film of the first fixture shown;

[0038] Figure 8 is a schematic diagram of the structure of the cooperation between the second fixture and the mold provided in some embodiments of the present application;

[0039] Fig. 9 yes Figure 8 Schematic diagram of the structure of the second fixture;

[0040] Fig.10 is a schematic diagram of the structure of the third jig and the mold provided in some embodiments of the present application;

[0041] Fig.11 yes Fig.10 The structural diagram of the third fixture;

[0042] Fig.12 is a schematic diagram of the structure of a display panel provided in some embodiments of the present application;

[0043] Fig.13 is another structural schematic diagram of a display panel provided in some embodiments of the present application;

[0044] Fig.14 This is another structural schematic diagram of a display panel provided in some embodiments of the present application.

[0045] The meanings of the marks in the figure are:

[0046] 10. Display panel;

[0047] 11. substrate; 12. chip; 13. first reflective layer; 14. transparent body; 141. convex portion; 15. second reflective layer; 16. peripheral reflective layer; 17. black glue layer; 18. light exit hole; 19. protective layer;

[0048] 20. mold; 21. upper mold; 211. fixing screw; 212. mold injection hole; 22. lower mold; 221. positioning boss;

[0049] 30. first fixture; 31. fixture body; 311. first injection hole; 312. mounting hole; 32. flexible sleeve; 321. accommodating cavity; 322. overlap; 323. first protective film; 324. second protective film;

[0050] 40. second fixture; 41. second injection hole; 42. partition; 43. molding groove;

[0051] 50. The third jig; 51. The third injection hole; 52. The convex part matching part;

[0052] 60. a first molding cavity;

[0053] 70. second molding cavity;

[0054] 80. The third molding cavity. DETAILED DESCRIPTION

[0055] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0057] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0058] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0059] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0060] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0061] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.

[0062] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0063] With the continuous development of display technology, MLED (a general term for Mini LED and Micro LED) has gradually been used in the display field due to its advantages such as small size, high luminous efficiency, low power consumption and high stability.

[0064] For display panels integrated with MLED, light refraction, reflection and scattering between adjacent chips lead to light energy loss, which makes the display panel prone to color deviation due to unstable mixing ratio of three-color light at a wide viewing angle.

[0065] In order to solve the problem of color cast in display panels, the inventors have designed a display panel and a method for preparing the same after in-depth research.

[0066] A display panel manufacturing method provided in an embodiment of the present application is described in detail below.

[0067] First embodiment:

[0068] Please also refer to Figure 1 and Fig.12 , a display panel preparation method includes:

[0069] S1 . Provide a substrate 11 , and place a plurality of chips 12 on the substrate 11 .

[0070] The substrate 11 supports the chip 12, and the substrate 11 may be a glass substrate, a plastic substrate, etc. A circuit for supplying power to the chip 12 is provided on the substrate 11, and the circuit may be formed by, but not limited to, etching. Each chip 12 is connected to the circuit to emit light.

[0071] The chip 12 is an LED chip. Optionally, the plurality of chips 12 include a green chip, a red chip and a blue chip, and the three-color chips are arranged in rows and at intervals. The chip 12 can be fixed on the substrate 11 by soldering, but is not limited to it.

[0072] S2 . Form a first reflective layer 13 on the side of the substrate 11 facing the chip 12 . The first reflective layer 13 exposes the light emitting surface of the chip 12 .

[0073] The side of the substrate 11 facing the chip 12 refers to Fig.12 The upper side of the middle substrate 11.

[0074] The first reflective layer 13 exposes the light emitting surface of the chip 12, so that the chip 12 can emit light normally, but the light is reflected after hitting the first reflective layer 13, that is, the light cannot pass through the first reflective layer 13. The first reflective layer 13 can be made of, but not limited to, white ink.

[0075] S3 , manufacturing a plurality of transparent bodies 14 arranged at intervals on the first reflective layer 13 , wherein the transparent bodies 14 correspond to the chips 12 one by one and cover the light emitting surfaces of the chips 12 .

[0076] The plurality of transparent bodies 14 are arranged at intervals, which means that there is a gap between two adjacent transparent bodies 14 , and the gap is filled with a reflective material in a subsequent process to form a peripheral reflective layer 16 .

[0077] The transparent body 14 corresponds to the chip 12 one by one and covers the light-emitting surface of the chip 12, which means that each chip 12 has a light-emitting surface covered by a transparent body 14. Since there is a gap between two adjacent transparent bodies 14, the light emitted by the chip 12 through the light-emitting surface can only move in the corresponding transparent body 14, avoiding interference between the light of the two adjacent chips 12. Among them, the transparent body 14 can be made of, but not limited to, transparent glue.

[0078] It can be understood that the light emitting surface of the chip 12 can be Fig.12 Alternatively, the light emitting surface of the chip 12 may be Fig.12 Alternatively, the light emitting surface of the chip 12 may be Fig.12 The upper surface and side surfaces of the middle chip 12.

[0079] S4. A peripheral reflective layer 16 is made on the peripheral side of the transparent body 14, a second reflective layer 15 is made on the side of the transparent body 14 away from the first reflective layer 13, and a black glue layer 17 is made on the side of the second reflective layer 15 away from the transparent body 14. The second reflective layer 15 and the black glue layer 17 are provided with light emitting holes 18 at positions corresponding to the chip 12.

[0080] like Fig.12 As shown, the peripheral reflective layer 16 is located around the transparent body 14, the second reflective layer 15 is located on the upper side of the transparent body 14, and the first reflective layer 13 is located on the lower side of the transparent body 14. The peripheral reflective layer 16, the first reflective layer 13, and the second reflective layer 15 cooperate to surround the transparent body 14, so that the light emitted by the chip 12 will be reflected by the peripheral reflective layer 16, the first reflective layer 13, and the second reflective layer 15 after the transparent body 14 moves, that is, the light can only be emitted from the light emitting hole 18. In this way, not only the loss of light energy is reduced, but also the light emitted from the light emitting hole 18 is more concentrated, ensuring the brightness of the light. Among them, the peripheral reflective layer 16 and / or the second reflective layer 15 can be made of, but not limited to, white glue.

[0081] Black glue layer 17 Fig.12 As shown, the black glue layer 17 is located on the upper surface of the second reflective layer 15 and can improve the contrast, thereby improving the image quality.

[0082] It can be understood that the peripheral reflective layer 16 can be manufactured first, and then the second reflective layer 15 can be manufactured, and then the black glue layer 17 can be manufactured; or, the peripheral reflective layer 16 and the second reflective layer 15 can be manufactured together, and then the black glue layer 17 can be manufactured; or, the peripheral reflective layer 16, the second reflective layer 15 and the black glue layer 17 can be manufactured together.

[0083] The display panel preparation method provided in the embodiment of the present application utilizes the first reflective layer 13, the second reflective layer 15 and the peripheral reflective layer 16 to surround the transparent body 14, so that the light emitted by the chip 12 is reflected in the transparent body 14, thereby reducing the light energy loss caused by the refraction, reflection and scattering of light between adjacent chips 12, and improving the utilization rate of light; at the same time, each chip 12 emits light through its corresponding light output hole 18, which can improve the mixing uniformity of the three-color chips after light output, thereby improving the color deviation problem of the display panel 10.

[0084] Second embodiment:

[0085] The structure of the transparent body 14 in the embodiment of the present application is described in detail below.

[0086] Please refer to Fig.12 The transparent body 14 includes a main body and a convex portion 141 convexly provided on the main body, and the convex portion 141 is located in the light exit hole 18; the chip 12 includes a green chip, a red chip and a blue chip; the convex portion 141 corresponding to the green chip and the blue chip is a concave lens structure, and / or the convex portion 141 corresponding to the red chip is a convex lens structure.

[0087] Since the protrusion 141 is located in the light emitting hole 18 , the light emitted by the chip 12 is emitted outward through the protrusion 141 .

[0088] The chip 12 on the left is a green chip, the chip 12 in the middle is a red chip, and the chip 12 on the right is a blue chip. Correspondingly, the convex portion 141 on the left is a concave lens structure, the convex portion 141 in the middle is a convex lens structure, and the convex portion 141 on the right is a concave lens structure. The three-color chips 12 are arranged in a row.

[0089] It can be understood that the upper surfaces of the concave lens structure and the convex lens structure can be folded line surfaces; or, the upper surfaces of the concave lens structure and the convex lens structure can also be arc-shaped surfaces.

[0090] Since the luminous efficiency of the green chip, the red chip and the blue chip is different, the convex portion 141 corresponding to the green chip and the blue chip is designed as a concave lens structure, so that the light is scattered to the periphery, reducing the brightness of the light; and / or the convex portion 141 corresponding to the red chip is designed as a convex lens structure, so that the light converges to the middle, increasing the brightness of the light. This design can further improve the mixing uniformity of the three-color chips after light is emitted, and further improve the color deviation problem of the display panel 10 under a wide viewing angle.

[0091] It can be understood that in other embodiments, such as Fig.13 As shown, only the convex portion 141 corresponding to the red chip can be designed as a convex lens structure, and the upper surfaces of the convex portions 141 corresponding to the green chip and the blue chip are flat; or Fig.14 As shown, only the convex parts 141 corresponding to the green chip and the blue chip can be designed as concave lens structures, and the upper surface of the convex part 141 corresponding to the red chip is a plane.

[0092] Third embodiment:

[0093] The preparation process of the first reflective layer 13 in the embodiment of the present application is described in detail below.

[0094] like Figures 2 to 4 As shown, the first reflective layer 13 is manufactured by the cooperation of the first fixture 30 and the mold 20; the mold 20 includes an upper mold 21 and a lower mold 22, and the substrate 11 and the first fixture 30 are both installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22; the first fixture 30 includes a plurality of accommodating cavities 321 and a plurality of first injection holes 311, the accommodating cavities 321 can accommodate the chip 12, and the first injection holes 311 inject reflective material onto the substrate 11 to form the first reflective layer 13.

[0095] Optionally, a positioning boss 221 is provided on the lower mold 22, and a positioning groove is provided on the upper mold 21, and the positioning boss 221 and the positioning groove are positioned and matched to ensure the position accuracy of the upper mold 21 and the lower mold 22. In other embodiments, the positioning boss 221 can be provided on the upper mold 21, and the positioning groove can be provided on the lower mold 22.

[0096] The mold cavity surrounded by the upper mold 21 and the lower mold 22 is used to install the substrate 11, and the cavity wall of the mold cavity can position the substrate 11.

[0097] The first fixture 30 is installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22 , and the first fixture 30 is located above the substrate 11 .

[0098] Optionally, the first fixture 30 can be, but is not limited to, detachably fixed to the upper mold 21 by fixing screws 211, so that different processes can be completed without replacing the mold 20, and only different fixtures need to be replaced, thereby reducing production costs.

[0099] like Figure 2 As shown, the first fixture 30, the upper mold 21 and the substrate 11 together form a first molding cavity 60, and the first molding cavity 60 is connected to the first injection hole 311; during molding, as shown in FIG. Figure 4 As shown, the reflective material is sequentially injected into the first molding cavity 60 through the mold injection hole 212 and the first injection hole 311 to form the first reflective layer 13 .

[0100] Optionally, a first injection hole 311 is provided between any two adjacent chips 12 to facilitate the injection of the reflective material into the first molding cavity 60. In other embodiments, the number and positions of the first injection holes 311 can be set as required.

[0101] The accommodating cavity 321 can accommodate the chip 12, so that the light-emitting surface of the chip 12 is in the accommodating cavity 321, so that the injected reflective material is not easy to cover the light-emitting surface of the chip 12, thereby avoiding affecting the light emission of the chip 12. It can be understood that each accommodating cavity 321 can accommodate one chip 12; or each accommodating cavity 321 can accommodate two or more chips 12.

[0102] By the cooperation between the first fixture 30 and the mold 20 , the first reflective layer 13 can be manufactured at one time, thereby improving the manufacturing efficiency of the first reflective layer 13 .

[0103] It is understandable that in other embodiments, a protective film for protecting the light-emitting surface may be made on each chip 12, and then a reflective material may be directly applied on the substrate 11 to form the first reflective layer 13, and finally the protective film may be torn off.

[0104] like Figures 5 to 7 As shown, the first fixture 30 includes a fixture body 31 and a plurality of flexible sleeves 32 . The fixture body 31 is provided with a plurality of mounting holes 312 . The flexible sleeves 32 are installed in the mounting holes 312 . The flexible sleeves 32 are provided with a receiving cavity 321 .

[0105] The first fixture 30 is fixed on the upper mold 21 through the fixture body 31 .

[0106] Optionally, a lap 322 is provided on the outer peripheral wall of the flexible sleeve 32, and the mounting hole 312 is a stepped hole, and the lap 322 is bonded and fixed to the step of the stepped hole, so that the flexible sleeve 32 is installed in the mounting hole 312. In other embodiments, the lap 322 is not bonded and fixed to the step of the stepped hole, and the upper surface of the flexible sleeve 32 can be abutted against the upper mold 21, and the upper mold 21 presses the flexible sleeve 32 into the mounting hole 312.

[0107] It can be understood that the flexible sleeve 32 can be made of a material with good flexibility such as silicone, rubber, etc.

[0108] The jig body 31 is usually required to have a certain rigidity, while the flexible sleeve 32 is relatively soft. By combining the jig body 31 and the flexible sleeve 32 and setting the accommodating cavity 321 on the flexible sleeve 32, the flexible sleeve 32 can be tightly attached to the side (non-luminous area) of the chip 12 to prevent the reflective material injected through the first injection hole 311 from entering the accommodating cavity 321. At the same time, the flexible sleeve 32 will not damage the chip 12 when it is set on the chip 12, thereby ensuring the normal use of the chip 12.

[0109] It can be understood that in other embodiments, the first fixture 30 can be an integrated structure. In this case, higher processing accuracy requirements are placed on the accommodating cavity 321. While ensuring that the chip 12 can normally enter the flexible sleeve 32, the gap between the accommodating cavity 321 and the side of the chip 12 is required to be small so that the reflective material will not enter the accommodating cavity 321.

[0110] like Figure 6 As shown, in some embodiments, before the flexible sleeve 32 is mounted on the fixture body 31 , protective films are respectively provided on two opposite sides of the flexible sleeve 32 in the light emitting direction.

[0111] The protective film on the upper side of the flexible cover 32 is a first protective film 323 , and the protective film on the lower side of the flexible cover 32 is a second protective film 324 .

[0112] The protective film can effectively protect the flexible sleeve 32 and prevent the flexible sleeve 32 from being damaged. When in use, the second protective film 324 can be removed first, and then all the flexible sleeves 32 are installed in the installation hole 312 of the fixture body 31 through the first protective film 323, and finally the first protective film 323 is also removed; because multiple flexible sleeves 32 are installed in the installation hole 312 of the fixture body 31 at one time through the first protective film 323, the installation efficiency of the flexible sleeve 32 is improved.

[0113] It is understandable that in other embodiments, the flexible sleeves 32 may be installed in the mounting holes 312 one by one manually or by a robot.

[0114] like Figure 3 As shown, in some embodiments, a first gap a is left between the cavity wall of the accommodating cavity 321 and the light-emitting surface of the chip 12 ; and / or a second gap b is left between the flexible sleeve 32 and the hole wall of the mounting hole 312 .

[0115] It can be understood that when the light-emitting surface of the chip 12 is the upper surface, a first gap a is left between the top cavity wall of the accommodating cavity 321 and the upper surface of the chip 12; or, when the light-emitting surface of the chip 12 is the side surface, a first gap a is left between the side cavity wall of the accommodating cavity 321 and the side surface of the chip 12.

[0116] By designing the first gap a, the flexible sleeve 32 can be prevented from contacting the light-emitting surface of the chip 12 and affecting the light emission of the chip 12; by designing the second gap b, the flexible sleeve 32 can have a certain displacement in the mounting hole 312. When there is a positioning deviation between the flexible sleeve 32 and the mounting hole 312, it can also be ensured that the flexible sleeve 32 can be easily installed in the mounting hole 312.

[0117] Fourth embodiment:

[0118] The preparation process of the transparent body 14 in the embodiment of the present application is described in detail below.

[0119] Please also refer to Figure 8 and Fig. 9 The transparent body 14 is manufactured by the cooperation of the second fixture 40 and the mold 20; the mold 20 includes an upper mold 21 and a lower mold 22, and the substrate 11 and the second fixture 40 are both installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22; the second fixture 40 includes a plurality of partitions 42 and a plurality of second injection holes 41, the partitions 42 can separate two adjacent chips 12, and the second injection holes 41 inject transparent material onto the first reflective layer 13 to form the transparent body 14.

[0120] Optionally, a positioning boss 221 is provided on the lower mold 22, and a positioning groove is provided on the upper mold 21, and the positioning boss 221 and the positioning groove are positioned and matched to ensure the position accuracy of the upper mold 21 and the lower mold 22. In other embodiments, the positioning boss 221 can be provided on the upper mold 21, and the positioning groove can be provided on the lower mold 22.

[0121] The mold cavity surrounded by the upper mold 21 and the lower mold 22 is used to install the substrate 11, and the cavity wall of the mold cavity can position the substrate 11.

[0122] The second fixture 40 is installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22 , and the second fixture 40 is located above the first reflective layer 13 .

[0123] Optionally, the second fixture 40 can be, but is not limited to, detachably fixed to the upper mold 21 by fixing screws 211. In this way, different processes can be completed by replacing different fixtures without replacing the mold 20, thereby reducing production costs.

[0124] The partition 42 is located on the inner side of the second fixture 40 , that is, the partition 42 is located on the side of the second fixture 40 facing the chip 12 .

[0125] The partition 42 can separate two adjacent chips 12, that is, the two adjacent chips 12 are separated into two independent areas. Figure 8As shown, the second fixture 40 and the first reflective layer 13 can together form a plurality of independent second molding cavities 70, and the second molding cavities 70 are connected to the corresponding second injection holes 41; during molding, the transparent material is injected into the second molding cavity 70 through the mold injection hole 212 and the second injection hole 41 in sequence to form an independent transparent body 14.

[0126] Alternatively, if Fig. 9 As shown, the second fixture 40 is further provided with a molding groove 43 on one side facing the chip 12. The molding groove 43 is arranged corresponding to the chip 12, and the molding groove 43 can form a convex portion 141 when the transparent body 14 is molded. By changing the shape of the molding groove 43, convex portions 141 of different shapes can be formed.

[0127] By adopting the above technical solution, the partition 42 can separate two adjacent chips 12 to separate the area where each chip 12 is located into an independent area, and after the transparent material is injected into the first reflective layer 13 through the second injection hole 41, a transparent body 14 covering the corresponding chip 12 is formed above the first reflective layer 13. Since a plurality of partitions 42 and a plurality of second injection holes 41 are provided, a plurality of transparent bodies 14 can be formed at one time, thereby improving the manufacturing efficiency of the transparent body 14.

[0128] like Fig. 9 As shown, in some embodiments, each chip 12 corresponds to at least two second injection holes 41 .

[0129] Optionally, each chip 12 corresponds to two second injection holes 41, and the positions of the two second injection holes 41 can be set arbitrarily, for example, the two second injection holes 41 can be respectively close to two oppositely arranged partitions 42. In other embodiments, each chip 12 can correspond to three or more second injection holes 41.

[0130] Since the size of the transparent body 14 is relatively large, each chip 12 corresponds to at least two second injection holes 41 , so that transparent material can be injected into the area where the chip 12 is located by using at least two second injection holes 41 at the same time, so as to further improve the manufacturing efficiency of the transparent body 14 .

[0131] It can be understood that in other embodiments, each chip 12 may correspond to a second injection hole 41 . In order to improve the manufacturing efficiency of the transparent body 14 , the aperture of the second injection hole 41 may be made larger.

[0132] Fifth embodiment:

[0133] The following is a detailed description of the preparation process of the peripheral reflective layer 16, the second reflective layer 15 and the black glue layer 17 in the embodiment of the present application.

[0134] Please also refer to Fig.10 and Fig.11In some embodiments, the peripheral reflective layer 16, the second reflective layer 15 and the black glue layer 17 are manufactured by the cooperation of the third fixture 50 and the mold 20; the mold 20 includes an upper mold 21 and a lower mold 22, and the substrate 11 and the third fixture 50 are both installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22; the third fixture 50 includes a plurality of third injection holes 51, and the third injection holes 51 inject a mixture of white glue and black glue into the peripheral side of the transparent body 14 and the side of the transparent body 14 away from the first reflective layer 13. The white glue sinks and solidifies to form the peripheral reflective layer 16 and the second reflective layer 15, and the black glue floats on the surface of the white glue to form the black glue layer 17.

[0135] Optionally, a positioning boss 221 is provided on the lower mold 22, and a positioning groove is provided on the upper mold 21, and the positioning boss 221 and the positioning groove are positioned and matched to ensure the position accuracy of the upper mold 21 and the lower mold 22. In other embodiments, the positioning boss 221 can be provided on the upper mold 21, and the positioning groove can be provided on the lower mold 22.

[0136] The mold cavity surrounded by the upper mold 21 and the lower mold 22 is used to install the substrate 11, and the cavity wall of the mold cavity can position the substrate 11.

[0137] The third fixture 50 is installed in the mold cavity surrounded by the upper mold 21 and the lower mold 22 , and the third fixture 50 is located above the transparent body 14 .

[0138] Optionally, the third fixture 50 can be, but is not limited to, detachably fixed to the upper mold 21 by fixing screws 211. In this way, different processes can be completed without replacing the mold 20, only different fixtures need to be replaced, thereby reducing production costs.

[0139] like Fig.10 As shown, the third fixture 50, the upper mold 21 and the transparent body 14 together form a third molding cavity 80, and the third molding cavity 80 is connected to the third injection hole 51; during molding, the mixed material of white glue and black glue is injected into the third molding cavity 80 through the mold injection hole 212 and the third injection hole 51 in sequence to form the peripheral reflective layer 16, the second reflective layer 15 and the black glue layer 17.

[0140] Optionally, a third injection hole 51 is provided between any two adjacent chips 12, and the third injection hole 51 is arranged corresponding to the gap between the two transparent bodies 14, so as to facilitate the injection of the reflective material into the first molding cavity 60 and fill the first molding cavity 60. In other embodiments, the number and position of the third injection holes 51 can be set as needed.

[0141] Alternatively, if Fig.11 As shown, a convex matching portion 52 is further provided on the side of the third fixture 50 facing the chip 12 , and the convex matching portion 52 is arranged and matched with the convex portion 141 to avoid forming a second reflective layer 15 on the convex portion 141 and affecting light emission.

[0142] By adopting the above technical solution, the mixed material of white glue and black glue is injected into the mold 20. First, the density of the black glue is lower than that of the white glue, the black glue floats up and solidifies, and the white glue floats down and solidifies, and the black glue is on the surface of the white glue; that is, by injecting the mixed material once, the production of the peripheral side reflective layer 16, the second reflective layer 15 and the black glue layer 17 can be completed, thereby improving efficiency.

[0143] It can be understood that in other embodiments, the peripheral reflective layer 16 can be manufactured first, then the second reflective layer 15 can be manufactured, and then the black glue layer 17 can be manufactured; or, the peripheral reflective layer 16 and the second reflective layer 15 can be manufactured together first, and then the black glue layer 17 can be manufactured.

[0144] like Fig.12 As shown, the embodiment of the present application also provides a display panel 10, which includes a substrate 11, a plurality of chips 12, a first reflective layer 13, a plurality of transparent bodies 14, a second reflective layer 15, a peripheral reflective layer 16 and a black glue layer 17. The plurality of chips 12 are arranged on the substrate 11, and the first reflective layer 13 is arranged on the side of the substrate 11 facing the chip 12 and exposing the light emitting surface of the chip 12; the plurality of transparent bodies 14 are arranged at intervals on the first reflective layer 13, and the transparent bodies 14 correspond to the chips 12 one by one and cover the light emitting surfaces of the chips 12; the peripheral reflective layer 16 is arranged on the peripheral side of the transparent body 14, the second reflective layer 15 is arranged on the side of the transparent body 14 away from the first reflective layer 13, and the black glue layer 17 is arranged on the side of the second reflective layer 15 away from the transparent body 14, and the second reflective layer 15 and the black glue layer 17 are provided with light emitting holes 18 at positions corresponding to the chips 12.

[0145] Optionally, the display panel 10 further includes a transparent protective layer 19, and the protective layer 19 is used to protect the entire panel to prevent impurities such as dust and water vapor from entering the interior of the panel.

[0146] Optionally, the display panel 10 can be obtained by the above-mentioned display panel manufacturing method.

[0147] The display panel 10 provided in the embodiment of the present application utilizes the first reflective layer 13, the second reflective layer 15 and the peripheral reflective layer 16 to surround the transparent body 14, so that the light emitted by the chip 12 is reflected in the transparent body 14, thereby reducing the light energy loss caused by the refraction, reflection and scattering of light between adjacent chips 12, and improving the utilization rate of light; at the same time, each chip 12 emits light through its corresponding light output hole 18, which can improve the mixing uniformity of the three-color chips 12 after light output at different viewing angles, thereby improving the color deviation problem of the display panel 10 at a large viewing angle and improving the market competitiveness of the product.

[0148] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for preparing a display panel, It is characterized in that include: Providing a substrate, and placing a plurality of chips on the substrate; A first reflective layer is formed on a side of the substrate facing the chip, wherein the first reflective layer exposes a light emitting surface of the chip; Making a plurality of transparent bodies arranged at intervals on the first reflective layer, wherein the transparent bodies correspond to the chips one by one and cover the light emitting surface of the chip; A peripheral reflective layer is made on the peripheral side of the transparent body, a second reflective layer is made on the side of the transparent body away from the first reflective layer, and a black glue layer is made on the side of the second reflective layer away from the transparent body. The second reflective layer and the black glue layer are provided with light exit holes at positions corresponding to the chip.

2. The method for preparing a display panel according to claim 1, It is characterized in that The transparent body includes a main body and a convex portion convexly arranged on the main body, and the convex portion is located in the light output hole; the chip includes a green chip, a red chip and a blue chip; the convex portion corresponding to the green chip and the blue chip is a concave lens structure, and / or the convex portion corresponding to the red chip is a convex lens structure.

3. The method for preparing a display panel according to claim 1, It is characterized in that The first reflective layer is manufactured by cooperating with a first jig and a mold; the mold comprises an upper mold and a lower mold, and the substrate and the first jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the first jig comprises a plurality of accommodating cavities and a plurality of first injection holes, the accommodating cavities can accommodate the chip, and the first injection holes inject reflective material onto the substrate to form the first reflective layer.

4. The method for preparing a display panel according to claim 3, It is characterized in that The first fixture comprises a fixture body and a plurality of flexible sleeves. The fixture body is provided with a plurality of mounting holes. The flexible sleeves are installed in the mounting holes. The flexible sleeves are provided with the accommodating cavity.

5. The method for preparing a display panel according to claim 4, It is characterized in that Before the flexible sleeve is mounted on the fixture body, protective films are respectively provided on two opposite sides of the flexible sleeve in the light emitting direction.

6. The method for preparing a display panel according to claim 4, It is characterized in that A first gap is left between the cavity wall of the accommodating cavity and the light-emitting surface of the chip; and / or a second gap is left between the flexible sleeve and the hole wall of the mounting hole.

7. The method for preparing a display panel according to claim 1, It is characterized in that The transparent body is manufactured by the cooperation of a second jig and a mold; the mold includes an upper mold and a lower mold, and the substrate and the second jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the second jig includes a plurality of partitions and a plurality of second injection holes, the partitions can separate two adjacent chips, and the second injection holes inject transparent material onto the first reflective layer to form the transparent body.

8. The method for preparing a display panel according to claim 7, It is characterized in that Each of the chips corresponds to at least two of the second injection holes.

9. The method for preparing a display panel according to claim 1, It is characterized in that The peripheral reflective layer, the second reflective layer and the black glue layer are manufactured by cooperation of a third jig and a mold; the mold comprises an upper mold and a lower mold, and the substrate and the third jig are both installed in a mold cavity surrounded by the upper mold and the lower mold; the third jig comprises a plurality of third injection holes, and the third injection holes inject a mixed material of white glue and black glue into the peripheral side of the transparent body and the side of the transparent body away from the first reflective layer, and the white glue sinks and solidifies to form the peripheral reflective layer and the second reflective layer, and the black glue floats on the surface of the white glue to form the black glue layer.

10. A display panel, It is characterized in that The invention comprises a substrate, a plurality of chips, a first reflective layer, a plurality of transparent bodies, a second reflective layer, a peripheral reflective layer and a black glue layer, wherein the plurality of chips are arranged on the substrate, the first reflective layer is arranged on the side of the substrate facing the chips and exposing the light emitting surface of the chips; the plurality of transparent bodies are arranged at intervals on the first reflective layer, the transparent bodies correspond to the chips one by one and cover the light emitting surfaces of the chips; the peripheral reflective layer is arranged on the peripheral side of the transparent body, the second reflective layer is arranged on the side of the transparent body away from the first reflective layer, the black glue layer is arranged on the side of the second reflective layer away from the transparent body, and the second reflective layer and the black glue layer are provided with light emitting holes at positions corresponding to the chips.

Images