Three-dimensional flow channel heat dissipation device for high-power small module

Abstract

The invention discloses a three-dimensional flow channel heat dissipation device for a high-power small module, which comprises a heat dissipation cavity heat sink and a heat dissipation flow channel arranged in the heat dissipation cavity heat sink, and the heat dissipation flow channel is distributed in a three-dimensional heat dissipation area of the heat dissipation cavity heat sink in a series-parallel mixed connection mode. The cooling medium in all the heat dissipation flow channels enters and exits through the same inlet and outlet, and the flow length of the cooling medium flowing through each flow line in the heat dissipation flow channels is uniform and consistent; a traditional plane flow channel is expanded into a three-dimensional flow channel to form a plurality of three-dimensional heat dissipation areas, so that the heat dissipation surface of equipment is increased, the heat dissipation space utilization rate of the equipment is improved, the flow length of each flow line in the heat dissipation flow channel from an inlet to an outlet is uniform and consistent, the flow resistance of each flow is consistent, and the heat dissipation efficiency of the equipment is improved. And uniform heat dissipation efficiency of all heat dissipation surfaces is ensured.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a three-dimensional flow channel heat dissipation device for a high-power small module. Background Art

[0002] In today's era of rapid technological development, semiconductor devices, as the core components of electronic devices, are constantly developing in the direction of high power and miniaturization. However, with the increase in power and the reduction in size, the heat generated by semiconductor chips also rises sharply. If the heat cannot be effectively conducted away in a timely manner, the chip performance will be reduced, the life span will be shortened, and even permanent damage will be caused. Therefore, the heat dissipation problem has become a key factor restricting the reliability and stability of semiconductor devices.

[0003] In the field of airborne electronic equipment, as its functions become more and more complex and its integration becomes higher and higher, the computing power requirements of chips are becoming more and more stringent, and accordingly, the power consumption of chips is also increasing. In order to meet the heat dissipation requirements of these high-power chips, the number of high-power chips used in modules in the chassis is increasing, which poses a higher challenge to the heat dissipation of individual modules in the chassis.

[0004] In existing airborne electronic equipment, the heat dissipation of modules mainly relies on liquid-cooled cold plate heat dissipation technology. Liquid-cooled cold plate heat dissipation is a heat dissipation method that uses indirect contact between the cooling medium and the device to be cooled to achieve heat exchange, and then the cooling medium transfers the heat away. This heat dissipation method can not only make up for the problem of insufficient efficiency of air-cooled heat dissipation equipment, but also effectively reduce cooling costs, and has high working stability, which can meet the heat dissipation requirements of long-term work.

[0005] However, the current module liquid-cooled cold plates have some obvious shortcomings. On the one hand, most liquid-cooled cold plates usually only design flow channels inside one wall of the cavity, and the other five walls are not fully utilized, which leads to a waste of heat dissipation area and limits the improvement of heat dissipation capacity. On the other hand, the flow channel design structure is relatively simple, and a simple series or parallel method is often used for heat dissipation. This design method makes it difficult for the flow rate on the flow channel to match the flow resistance well, resulting in the designed cold plate heat dissipation capacity failing to meet actual needs in some indicators. For example, in the series flow channel design, the flow resistance and pressure loss will be very large, which may cause the flow resistance to be greater than the design requirements; in the parallel flow channel design, if the flow distribution is unreasonable, it will cause the local temperature of the chips in some modules to be too high, while the heat dissipation flow of other heat dissipation surfaces will be redundant, making the heat dissipation design effect of the entire module unsatisfactory.

[0006] In order to solve the problems of insufficient heat dissipation capacity of the cold plate on the module and unreasonable flow channel design, an innovative heat dissipation design method is urgently needed to meet the heat dissipation needs of high-power small modules, improve their heat dissipation capacity, reduce flow resistance, and ensure the stability and reliability of electronic equipment under high-power operating conditions. Summary of the invention

[0007] In order to solve the problems of insufficient heat dissipation capacity of module liquid-cooled cold plates and unreasonable flow channel design, the present invention provides a three-dimensional flow channel heat dissipation device for high-power small modules. The device expands the traditional planar flow channel into a three-dimensional flow channel to form multiple three-dimensional heat dissipation areas, thereby increasing the heat dissipation surface of the equipment and improving the heat dissipation space utilization rate of the equipment. In addition, the flow length of each streamline in the heat dissipation flow channel from the inlet to the outlet is uniform, thereby ensuring that the flow resistance of each flow is consistent and uniform heat dissipation efficiency of all heat dissipation surfaces is ensured.

[0008] The present invention is achieved through the following technical solutions:

[0009] A three-dimensional flow channel heat dissipation device for a high-power small module, comprising a heat dissipation cavity heat sink and a heat dissipation flow channel arranged in the heat dissipation cavity heat sink;

[0010] Among them, the heat dissipation channels are distributed in the three-dimensional heat dissipation area of ​​the heat sink of the heat dissipation cavity through a series-parallel mixed connection mode, the cooling medium in all the heat dissipation channels enters and exits through the same inlet and outlet, and the flow length of each streamline of the cooling medium flowing through the heat dissipation channels is uniform.

[0011] As a further technical solution for the three-dimensional flow channel heat dissipation device, the heat dissipation flow channel forms an H-type flow channel assembly through a series-parallel mixed connection method, which can achieve heat dissipation on four surfaces. The first heat dissipation surface, the second heat dissipation surface, the third heat dissipation surface and the fourth heat dissipation surface in the H-type flow channel assembly respectively exchange heat with the first heat dissipation area, the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area in the three-dimensional heat dissipation area, thereby increasing the heat dissipation area of ​​the module and improving the heat dissipation capacity of the module.

[0012] As a further technical solution for the three-dimensional flow channel heat dissipation device, the external dimensions of the three-dimensional flow channel heat dissipation device are 100mm×100mm×100mm, and it can handle 1000W of heat on the corresponding type heat sink, and the flow resistance inside the heat dissipation channel is less than 100kPa, which improves its heat dissipation capacity by improving the heat dissipation efficiency.

[0013] As a further technical solution for the three-dimensional flow channel heat dissipation device, a printed circuit board is arranged on the outside of each heat dissipation area in the three-dimensional heat dissipation area. The printed circuit board includes multiple chips. The chips exchange heat with the heat dissipation surface of the H-type flow channel component to meet the heat dissipation requirements of high-power small modules, improve their heat dissipation capacity, and ensure the stability and reliability of electronic equipment under high-power operating conditions.

[0014] As a further technical solution for the three-dimensional flow channel heat dissipation device, the heat dissipation flow channel forms a U-shaped flow channel assembly through a mixed series-parallel connection method, which can achieve heat dissipation on three surfaces. A heat exchange cavity for accommodating a microfluidic module assembly is arranged in the middle of the U-shaped flow channel assembly. The fifth heat dissipation surface, the sixth heat dissipation surface and the seventh heat dissipation surface arranged outside the U-shaped flow channel assembly respectively exchange heat with the fifth heat dissipation area, the sixth heat dissipation area and the seventh heat dissipation area in the three-dimensional heat dissipation area. Through the built-in microfluidic module assembly, the heat dissipation capacity of the entire device is further increased.

[0015] As a further technical solution for the three-dimensional flow channel heat dissipation device, the microfluidic module assembly includes a plurality of microfluidic modules connected in parallel. The cooling medium flows into the plurality of microfluidic modules, then flows out of the microfluidic modules and converges together before flowing into the U-shaped flow channel assembly, which will effectively reduce the flow resistance of the entire U-shaped flow channel assembly and enhance its heat dissipation capacity.

[0016] As a further technical solution for the three-dimensional flow channel heat dissipation device, heat dissipation areas are provided on both sides of the microfluidic module, and printed circuit boards are provided on the outside of the three-dimensional heat dissipation area and each heat dissipation area in the microfluidic module. The printed circuit board includes multiple chips, and the chips respectively exchange heat with the heat dissipation surfaces of the H-type flow channel assembly and the microfluidic module to improve their heat dissipation capacity and ensure the stability and reliability of the electronic equipment under high-power operating conditions.

[0017] As a further technical solution for the three-dimensional flow channel heat dissipation device, the microfluidic module includes a microfluidic body and a microfluidic cavity, the microfluidic body is embedded in the microfluidic cavity, and the two sides of the microfluidic cavity form the heat dissipation area, wherein the inlet and outlet of the microfluidic body are respectively connected to the U-shaped flow channel assembly through a blind plug connector, thereby improving the thermal efficiency, reliability and maintainability of the entire system. The self-sealing function of the blind plug connector can ensure that the joint works efficiently when the cooling medium needs to be replaced without worrying about leakage and eccentricity problems.

[0018] As a further technical solution for the three-dimensional flow channel heat dissipation device, the microfluidic body includes a plurality of interconnected microfluidic groups, each of which includes a plurality of microfluidic channels arranged in an interval array, so that the cooling medium continuously forms an inlet section effect during the flow process, so as to enhance the heat dissipation of the microfluidic module.

[0019] As a further technical solution for the three-dimensional flow channel heat dissipation device, the flow channel spacing of the micro-channel is 0.5-1.1 mm and the height is 3-8 mm, which further enhances the heat dissipation capacity of the micro-channel module.

[0020] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0021] 1. The present invention expands the traditional planar flow channel into an H-shaped or U-shaped three-dimensional flow channel, allowing the fluid to flow through multiple liquid-cooled cold plates of the module, thereby increasing the heat dissipation surface of the equipment, improving the heat dissipation space utilization rate of the equipment, and optimizing the layout structure of the heat dissipation flow channel, so that the flow length of each streamline in the heat dissipation flow channel from the inlet to the outlet is uniform, thereby ensuring the consistency of the flow resistance of each process and ensuring uniform heat dissipation efficiency of all heat dissipation surfaces.

[0022] 2. The present invention adds a microfluidic module inside the U-shaped flow channel assembly, so that the heat dissipation surface of the cavity heat sink is expanded from 3 to at least 5 surfaces, and the heat dissipation surface is effectively increased. The increased heat dissipation surfaces are all on the microfluidic module inside the U-shaped module. Since a microfluidic channel with high heat dissipation efficiency is designed inside the microfluidic module, the heat dissipation capacity of the U-shaped flow channel is also greatly increased.

[0023] 3. When the present invention adopts a U-shaped three-dimensional flow channel, the cooling medium first flows into multiple microchannel modules in parallel, then flows out of the microchannel modules and converges together before flowing into the U-shaped flow channel assembly. After the cooling medium enters the U-shaped flow channel assembly, it still flows through the three heat dissipation surfaces of the U-shaped flow channel assembly in parallel, and then converges at the flow channel outlet. Using such a flow channel design will effectively reduce the flow resistance of the entire module and improve its heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0025] Figure 1 This is a schematic diagram of the appearance structure of Embodiment 1 of the present invention;

[0026] Figure 2 It is a perspective structural diagram of embodiment 1 of the present invention;

[0027] Figure 3 Schematic diagram of the distribution of printed circuit boards in Example 1 of the present invention;

[0028] Figure 4 This is a schematic diagram of the decomposed structure of Example 1 of the present invention;

[0029] Figure 5 This is a schematic structural diagram of an H-type flow channel assembly according to Embodiment 1 of the present invention;

[0030] Figure 6 is a temperature distribution diagram of an external heat sink according to Example 1 of the present invention;

[0031] Figure 7 This is a chip temperature distribution diagram of Example 1 of the present invention;

[0032] Figure 8 This is a flow velocity distribution diagram of an H-type flow channel assembly according to Example 1 of the present invention;

[0033] Fig. 9 This is a temperature distribution diagram of the H-type flow channel assembly of Example 1 of the present invention;

[0034] Fig.10 Schematic diagram of the heat sink structure of the external heat dissipation cavity according to Embodiment 2 of the present invention;

[0035] Fig.11 It is a schematic diagram of the distribution of printed circuit boards in the heat sink structure of the external heat dissipation cavity;

[0036] Fig.12 It is a perspective structural diagram of embodiment 2 of the present invention;

[0037] Fig.13 It is a schematic diagram of the interconnection of the liquid cooling connector;

[0038] Fig.14 This is a schematic diagram of the decomposed structure of Example 2 of the present invention;

[0039] Fig.15 This is a schematic diagram of the structure of the microfluidic module according to Example 2 of the present invention;

[0040] Fig.16 Schematic diagram of the flow channel structure of the microfluidic module;

[0041] Fig.17 Schematic diagram of the flow channel structure of Example 2 of the present invention;

[0042] Fig.18 This is a flow channel temperature distribution diagram of the micro-channel module of Example 2 of the present invention;

[0043] Fig.19 is a flow velocity distribution diagram of the microfluidic channel module of Example 2 of the present invention;

[0044] Fig. 20 This is a chip temperature distribution diagram of the microfluidic module of Example 2 of the present invention;

[0045] Fig.21 is a temperature distribution diagram of an external heat sink according to Embodiment 2 of the present invention;

[0046] Fig. 22 This is a temperature distribution diagram of a U-shaped flow channel assembly according to Example 2 of the present invention;

[0047] Fig.23 This is a flow velocity distribution diagram of a U-shaped flow channel assembly according to Example 2 of the present invention;

[0048] Fig.24 This is a temperature distribution diagram of the external heat sink chip of Example 2 of the present invention;

[0049] Fig.25 is the thermal conductivity corresponding to each material of the present invention.

[0050] Marks and corresponding parts names in the attached drawings:

[0051] 1-first heat dissipation area, 1-1-first heat dissipation surface, 2-second heat dissipation area, 2-1-second heat dissipation surface, 3-third heat dissipation area, 3-1-third heat dissipation surface, 4-fourth heat dissipation area, 4-1-fourth heat dissipation surface, 5-first interface, 6-second interface, 7-H-type flow channel assembly, 8-first printed circuit board, 9-second printed circuit board, 10-third printed circuit board, 11-fourth printed circuit board, 12-chip, 13-heat sink of heat dissipation cavity, 14-first liquid inlet, 15-first liquid outlet, 16-fifth heat dissipation area, 16-1-fifth heat dissipation surface, 17-sixth heat dissipation area, 17-1-sixth heat dissipation surface, 18-seventh heat dissipation area, 18-1-seventh heat dissipation surface, 19-U-type flow channel assembly, 20-external heat sink Thermal cavity heat sink, 21-fifth printed board, 22-sixth printed board, 23-seventh printed board, 24-first microfluidic module, 25-second microfluidic module, 26-first socket, 27-first plug, 28-second plug, 29-second socket, 30-external liquid cooling connector, 31-eighth printed board, 32-ninth printed board, 33-tenth printed board, 34-eleventh printed board, 35-first cover plate, 36-second cover plate, 37-third cover plate, 37-1-fourth cover plate, 38-fifth cover plate, 39-microfluidic body, 40-microfluidic cavity, 41-sixth cover plate, 42-second liquid inlet, 43-second liquid outlet, 44-microfluidic channel, 45-third liquid inlet, 46-third liquid outlet. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0053] The present invention is aimed at the heat dissipation design in a small-volume, high-power module. The size of the module of the present invention is 100mm×100mm×100mm, and its surface area S=(10×10+10×10+10×10)×2=600cm 2 According to the module dimensions, its surface heat flux density can be obtained as ψ = Q / S = 1000W / 600cm2 = 1.67W / cm 2 , and the operating temperature of the module of the present invention is 70°C, and the temperature entering the module liquid cooling is 70°C. According to the GJBZ35-93 component derating criteria, the maximum temperature of analog circuit components shall not exceed 100°C, so the maximum temperature rise of the electronic components inside the module is 30°C. In order to solve the 1000W heat consumption inside the small volume module and ensure the limited temperature rise of the electronic components, the following implementation method is proposed:

[0054] Example 1

[0055] Based on the enhanced heat transfer theory, the traditional planar flow channel is extended to a three-dimensional flow channel, and a three-dimensional liquid cooling flow channel structure design is carried out in the device to increase the heat dissipation area inside the module as much as possible. At the same time, it is necessary to ensure that the flow resistance inside the module is less than 100kPa. Therefore, this embodiment 1 provides a three-dimensional flow channel heat dissipation device for high-power small modules, such as Figure 1-Figure 5 As shown, it includes a heat sink 13 in the heat sink 13 and a heat dissipation channel arranged in the heat sink 13 in the heat dissipation cavity. The heat dissipation channel forms an H-type channel assembly 7 by a series-parallel mixed connection mode. The cooling medium in all the heat dissipation channels enters and exits through the same inlet and outlet, and the flow length of each streamline of the cooling medium flowing through the heat dissipation channel is uniform and consistent;

[0056] Specifically, the H-type flow channel component 7 forms four heat dissipation surfaces, namely the first heat dissipation surface 1-1, the second heat dissipation surface 2-1, the third heat dissipation surface 3-1 and the fourth heat dissipation surface 4-1, and the three-dimensional heat dissipation area is provided with a first heat dissipation area 1, a second heat dissipation area 2, a third heat dissipation area 3 and a fourth heat dissipation area 4 corresponding to the above-mentioned heat dissipation surfaces respectively, and at the same time, a corresponding first printed board 8, a second printed board 9, a third printed board 10 and a fourth printed board 11 are arranged on the outer side of each heat dissipation area, and each printed board includes 5 high-power consumption chips 12, and the chips 12 respectively exchange heat with the heat dissipation surfaces of the H-type flow channel component 7.

[0057] When the cooling medium enters the H-type flow channel assembly 7 from the first liquid inlet 14, the cooling medium flows along the same length of the heat dissipation flow channel and exchanges heat with the heat generated by the chip 12. After the heat exchange is completed, the cooling medium is collected and flows out from the first liquid outlet 15, thereby completing a thermal cycle.

[0058] In order to optimize the three-dimensional flow channel flow and flow resistance distribution, increase the uniformity of the flow channel and reduce the pressure drop of the equipment, the following simulation calculations are performed: the working environment temperature is 70°C, the size of the module is 100mm×100mm×100mm, the total power consumption of heat dissipation is 1000W, and the flow resistance is less than 100kPa, the cooling medium used is 65# aviation coolant, the heat sink 13 of the heat dissipation cavity is 5A06 aluminum plate, the main material of the printed circuit board is FR4, and the power chip 12 on the printed circuit board is made of alumina. The thermal conductivity coefficients corresponding to each material are as follows: Fig.25 As shown, 20 50W chips are arranged on the H-type flow channel assembly 7, and the size of the chip is 50mm×50mm×2mm. The arrangement of the chips is as follows Figure 3 As shown, after simulation calculation, Figure 7 It can be seen that the highest temperature on the 20 chips is 94.7℃. Figure 8 It can be seen that the flow velocity distribution of the H-type flow channel component 7 is uniform. Figure 6 and Fig. 9 It can be seen that the temperature distribution on the entire flow channel is uniform. The maximum temperature rise of the chip is only 24.7°C, and the maximum temperature is less than 100°C. According to GJB / Z 35-1993 "Guidelines for Derating of Components", the chips on the entire module can operate normally under this working condition. According to simulation analysis, the flow resistance on the entire flow channel is 22.988kPa, which meets the requirement of flow resistance ≤100kPa. Therefore, the flow channel of the H-type flow channel assembly 7 of this embodiment is reasonably set, and the flow resistance meets the design requirements. The entire H-type flow channel assembly 7 can solve the heat consumption of 1000W and can ensure the normal operation of the chip under harsh conditions.

[0059] Example 2

[0060] In order to increase the available space of the device as much as possible, improve the heat dissipation capacity of the device, and realize the purpose of integrated multi-function and high integration of the device, this embodiment 2 provides a three-dimensional flow channel heat dissipation device for high-power small modules, such as Figure 10-15 and Fig.17 As shown, it includes an external heat sink 20 and a heat sink 20 disposed in the external heat sink 20. The heat sink 20 forms a U-shaped flow channel assembly 19 by a series-parallel mixed connection. The cooling medium in all the heat sinks enters and exits through the same inlet and outlet, and the flow length of each streamline of the cooling medium flowing through the heat sink 20 is uniform.

[0061] Among them, Figure 12-14As shown, compared with the H-type flow channel component 7, the U-type flow channel component 19 cancels the middle partition and replaces the heat dissipation at the bottom of the cavity, so the printed circuit board cannot be arranged on both sides, but the depth of the U-type flow channel component 19 becomes deeper and the space becomes larger. A universal module with high heat flux density can be arranged in the extended space to solve the heat dissipation problem of multiple modules; specifically, a heat exchange cavity for accommodating a microfluidic module component is provided in the middle of the U-type flow channel component 19; the microfluidic module component includes two microfluidic modules connected in parallel, namely a first microfluidic module 24 and a second microfluidic module 25, and the first microfluidic module 24 and the second microfluidic module 25 have the same structure, as shown in FIG. Fig.15 As shown, the first microfluidic module 24 and the second microfluidic module 25 both include a microfluidic body 39 and a microfluidic cavity 40, the microfluidic body 39 is embedded in the microfluidic cavity 40, and heat dissipation areas are formed on both sides of the microfluidic cavity 40, wherein the second liquid inlet 42 and the second liquid outlet 43 of the microfluidic body 39 are respectively connected to the heat dissipation channel through blind plug connectors.

[0062] In this example, see Fig.12 As shown, the second liquid inlets 42 on the first microfluidic module 24 and the second microfluidic module 25 are respectively connected to the second sockets 29, and the second plugs 28 are respectively provided on the heat dissipation channel inlet section corresponding to the second sockets 29, and the two second plugs 28 are connected in parallel. The second liquid outlets 43 on the first microfluidic module 24 and the second microfluidic module 25 are respectively connected to the first sockets 26, and the first plugs 27 are respectively provided on the heat dissipation channel outlet section corresponding to the first sockets 26. The connection method is as shown in FIG. Fig.13 As shown; during operation, the cooling medium flows from the third liquid inlet 45 into the second plug 28 connected in parallel through the external liquid cooling connector 30, and then flows into the first microfluidic module 24 and the second microfluidic module 25 through the correspondingly connected second socket 29, completing heat exchange with the heat dissipation area formed on both sides of the microfluidic cavity 40, and then flows out of the microfluidic module and converges together and flows into the U-shaped flow channel assembly 19 from the second socket 29 and the second plug 28 connected in parallel, thereby completing the thermal cycle of the microfluidic module assembly.

[0063] In this embodiment, if Figure 10-15 and Fig.17As shown, after completing the thermal cycle of the microfluidic module assembly, the cooling medium flows from the U-shaped bottom heat dissipation channel of the U-shaped flow channel assembly 19 into each heat dissipation surface of the U-shaped flow channel assembly 19. The main part of the above-mentioned U-shaped flow channel assembly 19 forms three heat dissipation surfaces, namely the fifth heat dissipation surface 16-1, the sixth heat dissipation surface 17-1 and the seventh heat dissipation surface 18-1, and the external heat dissipation cavity heat sink 20 is provided with a fifth heat dissipation area 16, a sixth heat dissipation area 17 and a seventh heat dissipation area 18 corresponding to the above-mentioned heat dissipation surfaces. The outer side of each heat dissipation area on the external heat dissipation cavity heat sink 20 is provided with a corresponding seventh printed board 23, a fifth printed board 21 and a sixth printed board 22. The outer sides of the seventh printed board 23, the fifth printed board 21 and the sixth printed board 22 are sealed and fixed by the first cover plate 35, the fourth cover plate 37-1 and the second cover plate 36 respectively, and the opening of the heat exchange cavity is sealed and fixed by the third cover plate 37. At the same time, the sixth printed board 22 and the seventh printed board The boards 23 include 5 chips 12, the fifth printed board 21 includes 4 chips 12, and each chip 12 performs heat exchange with the corresponding heat dissipation surface of the U-shaped flow channel component 19; similarly, the heat dissipation areas formed on both sides of the microfluidic cavity 40 in the first microfluidic module 24 are respectively provided with the tenth printed board 33 and the eleventh printed board 34, and the heat dissipation areas formed on both sides of the microfluidic cavity 40 in the second microfluidic module 25 are respectively provided with the eighth printed board 31 and the ninth printed board 32, and the tenth printed board 33 and the eleventh printed board 34 are sealed and fixed to the outer sides of the eighth printed board 31 and the ninth printed board 32 by the fifth cover plate 38 and the sixth cover plate 41, respectively. At the same time, these four printed boards each include 1 chip 12, and each chip 12 performs heat exchange with the corresponding heat dissipation area of ​​the microfluidic cavity 40. When the U-shaped flow channel component 19 completes the thermal cycle, the cooling medium will flow out from the third liquid outlet 46 through the external liquid cooling connector 30.

[0064] This embodiment uses a blind-plug connector to achieve interconnection between different heat dissipation templates. The blind-plug connector can be quickly disassembled and leak-proof, so that the flow channel of the equipment can be stacked with other integrated modules. The blind-plug connector adopts the blind-plug fluid connector of AVIC Optronics, which has a double sealing function: that is, the plug and the socket do not leak in the plugged state, and in the disconnected state, the end faces of the plug and the socket do not leak. The external liquid cooling connector 30 adopts TSAX-5Z07BMAJM-01 of AVIC Optronics Technology Co., Ltd., the first plug 27 and the second plug 28 adopt TSF-B-2Z0TiJM of AVIC Optronics Technology Co., Ltd., and the first socket 26 and the second socket 29 adopt TSF-B-2T02TiJM of AVIC Optronics Technology Co., Ltd.

[0065] In order to optimize the three-dimensional flow channel flow and flow resistance distribution, increase the uniformity of the flow channel and reduce the pressure drop of the equipment, the following simulation calculations are performed: the working environment temperature is 70°C, the size of the module is 100mm×100mm×100mm, the total power consumption of heat dissipation is 1000W, and the flow resistance is less than 100kPa, the cooling medium used is 65# aviation coolant, the heat sink 13 of the heat dissipation cavity is 5A06 aluminum plate, the main material of the printed circuit board is FR4, and the power chip 12 on the printed circuit board is made of alumina. The thermal conductivity coefficients corresponding to each material are as follows: Fig.25 As shown; and the U-shaped flow channel component 19 is divided into two parts, one is the two internal micro-channel modules, and the other is the external heat dissipation cavity heat sink 20. Two chips with a volume of 80mm×80mm×2mm are arranged on each micro-channel module, a total of four chips, each with a volume of 80W, a total of 320W. Ten chips with a volume of 50mm×50mm×2mm are symmetrically arranged on the left and right sides of the external heat dissipation cavity heat sink 20, and four chips with a volume of 50mm×50mm×2mm are arranged on the other side, a total of 14 chips, each with a volume of 50W, a total of 700W, and the entire U-shaped flow channel component 19 has a total of 1020W. After simulation calculation, Figure 18-Figure 24 It can be seen that the maximum temperature of the chip on the internal microfluidic module is 81.7℃, which meets the design requirements, and the maximum temperature of the chip on the external heat sink is 97.5℃<100℃, which meets the design requirements, and the flow resistance of the entire flow channel is 88.865kPa<100kPa. Therefore, the total power consumption of the U-shaped flow channel component 19 is 1020W, and the maximum temperature rise is 27.5℃. According to GJB / Z 35-1993 "Guidelines for Derating of Components", the chips on the entire module can work normally under harsh conditions.

[0066] Example 3

[0067] In order to enhance the heat dissipation effect of the microchannel module, this embodiment 3 provides another three-dimensional flow channel heat dissipation device for high-power small modules based on the technical solution of embodiment 2, such as 10- Fig.17 As shown, the microfluidic body 39 includes a plurality of interconnected microfluidic groups, each of which includes a plurality of microfluidic channels 44 arranged in an interval array. The channel spacing of the microfluidic channels 44 is 0.8 mm and the height is 5 mm, so that the cooling medium continuously forms an inlet section effect during the flow process, so as to enhance the heat dissipation of the microfluidic module.

[0068] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A three-dimensional flow channel heat dissipation device for high-power small modules, characterized in that: It comprises a heat sink (13) for the heat dissipation cavity and a heat dissipation channel arranged in the heat sink (13) for the heat dissipation cavity; The heat dissipation channels are distributed in the three-dimensional heat dissipation area of ​​the heat sink (13) of the heat dissipation cavity through a series-parallel mixed connection mode, the cooling medium in all the heat dissipation channels enters and exits through the same inlet and outlet, and the flow length of each streamline of the cooling medium flowing through the heat dissipation channels is uniform.

2. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 1, characterized in that: The heat dissipation flow channel forms an H-type flow channel assembly (7) by means of a series-parallel mixed connection mode, and the first heat dissipation surface (1-1), the second heat dissipation surface (2-1), the third heat dissipation surface (3-1) and the fourth heat dissipation surface (4-1) in the H-type flow channel assembly (7) respectively perform heat exchange with the first heat dissipation area (1), the second heat dissipation area (2), the third heat dissipation area (3) and the fourth heat dissipation area (4) in the three-dimensional heat dissipation area.

3. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 1, characterized in that: The external dimensions of the three-dimensional flow channel heat dissipation device are 100mm×100mm×100mm, and it can handle 1000W of heat consumption under this volume, and the flow resistance inside the heat dissipation flow channel is less than 100kPa.

4. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 2, characterized in that: A printed circuit board is arranged outside each of the three-dimensional heat dissipation areas, the printed circuit board comprising a plurality of chips (12), and the chips (12) perform heat exchange with the heat dissipation surface of the H-shaped flow channel component (7).

5. The three-dimensional flow channel heat dissipation device for high-power small modules according to claim 1, characterized in that: The heat dissipation channel forms a U-shaped channel assembly (19) by a series-parallel mixed connection mode, a heat exchange cavity for accommodating a microchannel module assembly is arranged in the middle of the U-shaped channel assembly (19), and a fifth heat dissipation surface (16-1), a sixth heat dissipation surface (17-1) and a seventh heat dissipation surface (18-1) arranged outside the U-shaped channel assembly (19) respectively exchange heat with the fifth heat dissipation area (16), the sixth heat dissipation area (17) and the seventh heat dissipation area (18) in the three-dimensional heat dissipation area.

6. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 5, characterized in that: The microfluidic module assembly comprises a plurality of microfluidic modules connected in parallel, and the cooling medium flows into the plurality of microfluidic modules, then flows out of the microfluidic modules and converges together before flowing into the U-shaped flow channel assembly (19).

7. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 6, characterized in that: Heat dissipation areas are provided on both sides of the microfluidic module, and printed circuit boards are provided outside the three-dimensional heat dissipation area and each heat dissipation area in the microfluidic module, the printed circuit board comprising a plurality of chips (12), and the chips (12) respectively perform heat exchange with the heat dissipation surfaces of the H-type flow channel component (7) and the microfluidic module.

8. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 6 or 7, characterized in that: The microfluidic module includes a microfluidic body (39) and a microfluidic cavity (40), wherein the microfluidic body (39) is embedded in the microfluidic cavity (40), and the heat dissipation area is formed on both sides of the microfluidic cavity (40), wherein the inlet and outlet of the microfluidic body (39) are respectively connected to the U-shaped flow channel component (19) through blind plug connectors.

9. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 8, characterized in that: The microfluidic channel body (39) comprises a plurality of microfluidic channel groups that are interconnected, and each of the microfluidic channel groups comprises a plurality of microfluidic channels (44) arranged in an interval array.

10. A three-dimensional flow channel heat dissipation device for high-power small modules according to claim 9, characterized in that: The microchannel (44) has a channel spacing of 0.5 to 1.1 mm and a height of 3 to 8 mm.

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