Camera including image sensor and electronic device including the same

Abstract

A camera module according to various embodiments may include: a first circuit board electrically connected to an image sensor or a circuit board including the image sensor; an actuator configured to control at least one of a position or an attitude of a first circuit board within the camera module; a flexible circuit board drawn out from at least one side surface of the first circuit board and extending; a plurality of slits provided between adjacent ones of the plurality of conductive lines mounted on the flexible circuit board; and a second circuit board electrically connected to one end of the flexible circuit board. The flexible circuit board may include a first section drawn from or extending from the first circuit board in a first direction. The flexible circuit board may include a second section extending from one end of the first section in a second direction different from the first direction or fixed to another component of the camera module. The flexible circuit board may be deformed as the actuator is driven.

Description

Technical Field

[0001] Various embodiments presented herein relate to a camera for capturing an image and an electronic device including the camera. Background Art

[0002] A camera applied to a mobile phone may be located on at least one of a front surface and a rear surface and may operate to provide a function of capturing photos and videos. For optical image stabilization (OIS) and auto focus (AF) functions when capturing images, the camera may include an actuator configured to at least partially move an optical system or an image sensor to obtain clear photos and videos.

[0003] The image sensor may be connected to be powered or to communicate with other components within the electronic device. A flexible printed circuit board may be used to electrically connect the image sensor to other components.

[0004] Types of optical systems included in a camera include a direct optical system, in which light passing through the optical axis of a camera lens from an object directly enters an image sensor without being refracted, and a refractive optical system, in which light passing through the optical axis of a lens from an object is refracted in the process of passing through components of the optical system and enters the image sensor. The refractive optical system may also be called a folded optical system. Summary of the invention

[0005] Technical issues

[0006] A camera actuator for optical image stabilization and autofocus in the form of a lens frame that moves an optical system including a camera lens drives the lens relative to a fixed image sensor, so a circuit (e.g., a printed circuit board (PCB)) interconnecting the image sensor and other components does not need to move. However, in the case of a sensor displacement type actuator that moves the image sensor to perform optical image stabilization or autofocus, when the image sensor moves in a driving direction (e.g., an x-axis, y-axis, or z-axis direction), a repulsive force of the circuit interconnecting the image sensor and other components acts as an obstacle to the movement of the image sensor. In order to reduce the repulsive force, a circuit connector configured on a metal surface in the form of a leaf spring that deforms in the moving direction of the image sensor may be used, or a flexible circuit board connected to the image sensor may be folded or deformed several times or may be increased in length of a deformable region to easily deform in the moving direction.

[0007] Alternatively, in the case of a camera including a refractive optical system, the flexible circuit board may be pulled out from a position corresponding to the central axis of the image sensor (e.g., a direction corresponding to the optical axis direction of the optical system), and in order to reduce the repulsive force, the flexible circuit board may be branched into two or more parts and placed on the bottom surface of an optical component (e.g., a lens barrel or a prism).

[0008] However, when using the circuit connector configured on the metal surface in the form of a leaf spring, the manufacturing cost of the components of the camera increases. In addition, for force balance, the circuit connector configured on the metal surface in the form of a leaf spring can be applied to only limited structures.

[0009] When a structure in which a flexible circuit board connecting an image sensor with other components is folded multiple times to correspond to the moving direction of the image sensor is applied, the manufacturing cost increases because a process for forming the folded structure is added. In addition, since the direction and magnitude of the repulsive force vary depending on the folding position of the flexible circuit board, the actuator may be inefficiently designed to ensure additional driving force of the actuator, and the current consumption of the actuator may increase. In addition, in order for the flexible circuit board to have a folded shape, the length of the flexible circuit board increases. Therefore, the noise of the signal transmitted through the conductive line mounted on the flexible circuit board and the resistance of the conductive line may increase.

[0010] In addition, a structure for reducing repulsive force by folding a flexible circuit board is easily applied to a structure for performing corrections on the x-axis and y-axis to perform displacement OIS, but it is difficult to form a structure for reducing the following repulsive force that acts as an obstacle to the z-axis drive for roll axis rotation correction and autofocus control.

[0011] In the case of a camera module including a refractive optical system, when the flexible circuit board is pulled out from the image sensor and bifurcated into two or more parts, the bifurcated flexible circuit board is placed on the central axis of the circuit board on which the image sensor is mounted to balance the repulsive force in the opposite side direction of the bifurcated area. In this case, there is a limitation that the flexible circuit board will be set on the bottom surface of an optical component (such as a lens barrel or a prism) so that the optical system can work. In addition, because the flexible circuit board cannot be set around the lens barrel facing the object due to the position where the flexible circuit board is pulled out, the light receiving surface of the image sensor is inevitably set in a direction substantially the same as the direction toward the object. Therefore, there is a limitation on the structure of the forming device.

[0012] The technical problems to be solved by the present disclosure are not limited to those described above, and other technical problems not described above may be clearly understood by those of ordinary skill in the relevant fields to which the present disclosure belongs.

[0013] Solution to the problem

[0014] A camera according to an embodiment or an electronic device including the camera may include a circuit connector between an image sensor and a circuit, in which repulsive force is reduced by separating a flexible circuit board portion between regions where conductive lines are mounted.

[0015] A camera module according to an embodiment may include: a first circuit board electrically connected to an image sensor or a circuit board including an image sensor; an actuator configured to control at least one of a position or a posture of the first circuit board within the camera module; a flexible circuit board drawn out and extended from at least one side surface of the first circuit board; a plurality of slits, the slits being arranged between adjacent conductive lines among a plurality of conductive lines mounted on the flexible circuit board; and a second circuit board electrically connected to one end of the flexible circuit board. The flexible circuit board may include a first section drawn out from the first circuit board or extending from the first circuit board in a first direction. The flexible circuit board may include a second section extending from one end of the first section in a second direction different from the first direction or fixed to another component of the camera module. The flexible circuit board may be configured to deform as the actuator is driven.

[0016] A camera module according to an embodiment may include: a first circuit board electrically connected to an image sensor or a circuit board including an image sensor; an actuator configured to control at least one of a position or a posture of the first circuit board in the camera module; a flexible circuit board drawn out and extended from at least one side surface of the first circuit board; a plurality of slits provided between adjacent conductive lines among a plurality of conductive lines mounted on the flexible circuit board; and a second circuit board connected to one end of the flexible circuit board. The flexible circuit board may include a first section and a second section, the first section being drawn out from a position deviated from a central axis of the first circuit board to one side and extending in a first direction, and the second section extending from one end of the first section in a second direction different from the first direction.

[0017] An electronic device according to an embodiment may include: a camera module; a circuit board electrically connected to an image sensor or a circuit board including an image sensor; an actuator configured to control at least one of a position or a posture of the circuit board in the camera module; a fixed portion fixed in the electronic device; and a flexible circuit board interconnecting the circuit board and the fixed portion and including an operating section configured to deform as the actuator is driven. A plurality of slits may be formed in the operating section.

[0018] Advantageous Effects of the Invention

[0019] According to various embodiments disclosed herein, a device can be provided in which a circuit connector between an image sensor and a circuit is configured using a flexible circuit board that can be manufactured cheaply, and the repulsive force on the movement of the image sensor due to the circuit connector can be reduced. In addition, a device can be provided in which components can be efficiently arranged without increasing the size of the camera module. In addition, a device can be provided that can easily implement roll rotation correction and autofocus functions (such as z shift) in addition to 2-axis (x-axis, y-axis) optical image stabilization (OIS). In addition, a device can be provided in which a flexible circuit board is arranged in a form that at least partially surrounds the position where the optical component is set in a camera module including a refractive optical system, while avoiding the position where the optical component is set, so that the efficiency of component arrangement can be improved.

[0020] Effects that can be obtained by the present disclosure are not limited to those described above, and other effects not described above may be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains based on the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a diagram showing a structure of a circuit connector configured to connect an image sensor according to an embodiment and a component other than the image sensor.

[0022] Figure 2 It is a diagram for explaining the structure of folding and bending a flexible circuit board.

[0023] Figure 3 This is a diagram for explaining a structure in which a flexible printed circuit board is bent in the direction in which it extends.

[0024] Figure 4 is an exploded view illustrating a configuration of a camera module including an image sensor according to an embodiment.

[0025] Figure 5 is a diagram showing a structure of a circuit connector configured to connect an image sensor according to an embodiment and a component other than the image sensor.

[0026] Figure 6 is a diagram showing a method according to an embodiment Figure 5 FIG. 1 is a diagram showing an example of a state in which a camera module is installed in an electronic device.

[0027] Figure 7 2 are diagrams respectively illustrating a direction in which light enters a camera module from an object through a lens and a direction in which an image sensor in the camera module receives the light according to various embodiments.

[0028] Figure 8is a diagram illustrating a direction in which a circuit connector may be deformed to allow movement of an image sensor when an optical image stabilization function or an auto focus function is performed according to an embodiment.

[0029] Fig. 9 is a diagram illustrating a circuit connector in which a bending area is included in an operating section of a flexible circuit board and a camera module including the circuit connector according to an embodiment.

[0030] Fig.10 is a diagram showing an example in which a camera module is mounted with a circuit connector according to an embodiment, wherein the circuit connector includes a slit section of a flexible circuit board arranged on substantially the same plane as an image sensor and does not include a bending area in an operating section.

[0031] Fig.11 is a diagram showing an example in which a camera module is mounted with a circuit connector according to an embodiment, wherein the circuit connector includes a slit section of a flexible circuit board configured on a plane different from a plane on which an image sensor is disposed, and includes a bending area in an operating section.

[0032] Fig.12 is a diagram showing a camera module according to an embodiment and an image sensor and a circuit connector installed in the camera module, wherein the image sensor is disposed on a rear surface of an optical system so that a direction in which light enters a lens from a subject and a direction in which the image sensor receives the light are substantially the same.

[0033] Fig.13 is a diagram illustrating a structure of a bending region of a flexible printed circuit board according to an embodiment.

[0034] Fig.14 is a block diagram of an electronic device according to various embodiments in a network environment.

[0035] Fig.15 is a block diagram of a camera module according to various embodiments.

[0036] Fig.16 is a diagram showing a structure of a circuit connector configured to connect an image sensor according to an embodiment and a component other than the image sensor.

[0037] Fig.17 is an exploded view illustrating a configuration of a camera module including an image sensor according to an embodiment.

[0038] Fig.18 is a diagram illustrating a camera module including a rhombus prism that allows an image sensor to receive light in a direction opposite to a direction in which the light enters the camera module according to an embodiment.

[0039] Fig.19 is a diagram illustrating an example of a camera module in which a circuit connector according to an embodiment does not include a slit.

[0040] Fig. 20 is a diagram illustrating an example of a camera module in which a circuit connector according to an embodiment does not include a slit.

[0041] Fig.21 is a diagram illustrating a direction in which a circuit connector may be deformed to allow movement of an image sensor when an optical image stabilization function or an auto focus function is performed according to an embodiment.

[0042] Fig. 22 2 is a diagram illustrating a circuit connector including a bending area without a slit in an operating section according to an embodiment and a camera module including the same.

[0043] Fig.23 is a diagram showing an example in an embodiment in which a flexible circuit board is disposed on substantially the same plane as an image sensor, a circuit connector does not include a bending area and a slit in an operating section, and the circuit connector is mounted in a camera module.

[0044] Fig.24 The camera module is shown in an embodiment where the direction from which light enters and the direction from which light is received by the sensor are substantially the same.

[0045] Fig.25 is a configuration diagram showing an optical path within an optical system of an electronic device according to an embodiment. Specific embodiments

[0046] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. The following embodiments may be implemented individually or by combining one or more of the following embodiments. Therefore, the technical concept proposed in this specification is not to be interpreted as being limited to the embodiments.

[0047] In the present specification, a singular form of a component may be construed as including a plural form, unless the context clearly limits otherwise. In the present specification, the drawings may be exaggerated to more clearly describe various embodiments.

[0048] Figure 1 is a diagram showing a structure of a circuit connector 100 configured to interconnect an image sensor 110 according to an embodiment and a component other than the image sensor 110 .

[0049] Figure 1The image sensor 110 and the circuit connector 100 shown may be included in a camera module. The image sensor 110 according to an embodiment may be mounted on a circuit board 111. Alternatively, a separate circuit board on which the image sensor 110 is mounted may be electrically connected to the circuit board 111. In this specification, the circuit board 111 on which the image sensor 110 is mounted may be interpreted as including a case where the image sensor 110 is directly mounted on the circuit board 111 and a case where another board on which the image sensor 110 is mounted is mounted on the circuit board 111. In this specification, a component that interconnects the image sensor 110 or the circuit board 111 with another component (e.g., another circuit board included in a camera module including the image sensor 110 or an electronic device including the camera module) may be referred to as a circuit connector 100.

[0050] The circuit connector 100 according to an embodiment may include a flexible circuit board 120 including a section drawn out from the circuit board 111 and extending in the first direction 151. The flexible circuit board 120 may include a plurality of conductive lines 121 configured to electrically connect the image sensor 110 or the circuit board 111 to other components. In the flexible circuit board 120, some portions between regions in which the plurality of conductive lines 121 are disposed are separated. According to various embodiments, a gap may be provided in the flexible circuit board 120 to at least partially separate portions between regions in which the plurality of conductive lines 121 are disposed. According to some embodiments, in the circuit connector 100 included in the camera module, the gap may include a plurality of slits 122 disposed side by side at least partially along the region in which the plurality of conductive lines 121 are disposed.

[0051] At least one of the position or posture of the image sensor 110 according to an embodiment within the camera module may be controlled by the actuator. When the image sensor 110 is moved by the actuator, since the fixing portion 140 of the circuit connector 100 is fixed to the camera module or the electronic device, a repulsive force resisting the movement of the image sensor 110 will act on the circuit board 111 through the connection structure between the fixing portion 140 and the circuit board 111. In the flexible circuit board 120 according to an embodiment, the repulsive force can be reduced by at least partially separating the portion between the regions in which the plurality of conductive lines 121 are provided.

[0052] According to an embodiment, in order to manufacture the circuit connector 100 between the image sensor 110 and other components without using a metal component in the form of a leaf spring that requires a separate micro-manufacturing process (e.g., an etching process), the repulsive force due to the flexible circuit board 120 can be reduced by manufacturing a general flexible circuit board and removing the unused area between the conductive lines by a method of partially cutting (e.g., laser cutting) the flexible circuit board. When the circuit connector 100 according to an embodiment is applied to a camera module including a ball guide type actuator (in which the movement of the actuator is guided by a sphere included in the camera module), the horizontality of the image sensor can be maintained even if a force balancing structure is not included.

[0053] In order to reduce the repulsive force of the flexible circuit board, a structure in which the flexible circuit board is folded multiple times in a direction perpendicular to the direction in which the flexible circuit board moves may be applied. However, in order to form a folded structure on the flexible circuit board, the length of the flexible circuit board increases. Compared with a structure in which the flexible circuit board is folded multiple times to reduce the repulsive force in the direction in which the flexible circuit board moves, in an electronic device according to an embodiment, the repulsive force can be reduced while limiting the increase in the length of the flexible circuit board 120. In addition, it is possible to reduce the loss of the driving force of the actuator caused by the deviation occurring in the section in which the flexible circuit board 120 is folded in the operating section, in which the shape of the circuit connector 100 is deformed as the position of the image sensor 110 is offset.

[0054] According to an embodiment, since the repulsive force of the flexible circuit board 120 having a plurality of slits is very small, a structure for performing roll rotation correction around the optical axis on the xy plane of the image sensor and an autofocus function by varying the height of the lens in the z-axis direction can be easily implemented.

[0055] According to an embodiment, since the flexible circuit board 120 having the plurality of slits 122 has a low repulsive force, the flexible circuit board does not need to be withdrawn from the center of one side of the circuit board 111 configured to mount the image sensor 110 thereon in order to maintain force balance. Figure 1 , the flexible circuit board 120 according to an embodiment can be pulled out from a position deviating from the central axis 113 of the circuit board 111. Therefore, the flexible circuit board 120 is pulled out from a position deviating from the optical axis of the lens of the camera, and can be easily set away from the position where the optical component (lens barrel or prism) is set. Therefore, the direction in which the image sensor 110 receives light is not limited to the direction in which the lens barrel faces the object, and can be set in other directions.

[0056] The flexible circuit board 120 according to an embodiment may include a section extending in a second direction 152 different from the first direction 151 from one end of the section extending in the first direction 151. When a bending area exists between the section extending in the first direction 151 and the section extending in the second direction 152 due to folding of the flexible circuit board 120, the circuit connector 100 according to an embodiment may include a rigid area or a reinforcement 131 to maintain the shape of the bending area. Figure 1 , the flexible circuit board 120 may further include a section that is bent at one end of the section extending in the first direction 151 and then bent to extend in the second direction 152. The reinforcement 131 may be attached to a region on the flexible circuit board 120 including the bent region.

[0057] The flexible circuit board according to an embodiment may further include a segment extending in a third direction 153 different from the second direction 152 from one end of the segment extending in the second direction 152. When the region where the flexible circuit board 120 is bent also exists between the segment extending in the second direction 152 and the segment extending in the third direction 153, a rigid region or reinforcement 132 may be provided.

[0058] Figure 1 The flexible circuit board 120 shown is shown to include a section extending in a first direction 151, a section extending in a second direction 152, and a section extending in a third direction 153. However, the present disclosure is not limited thereto. It should be noted that Figure 1 The embodiment shown in is intended to describe a structure in which the flexible circuit board 120 configured such that a plurality of conductive lines are separated from each other extends in two or more directions, thereby reducing repulsive force caused by the flexible circuit board 120 and facilitating arrangement of other optical components.

[0059] In the flexible circuit board 120 according to an embodiment, in order to reduce the repulsive force generated when the image sensor 110 moves and transmitted to the circuit board 111 on which the image sensor 110 is mounted, a slit 122 may be formed between adjacent conductive wires in the conductive wires 121 so that the conductive wires 121 can be separated from each other. Each conductive wire 121 may have a structure including three layers. For example, polyimide PI may be provided on both sides of each of the conductors CU. The conductors CU may be provided on the polyimide PI again on both sides, respectively, and the area in which each conductive wire 121 is provided may be configured as a structure in which each of the conductors is covered with polyimide PI. For example, a polyimide layer having a thickness of 28.5 μm and a polyimide layer having a thickness of 25 μm may be provided on the two surfaces of the CU layer having a thickness of 6 μm and constituting the conductive wires, respectively. A CU conductive wire having a thickness of 18 μm may be provided on each of the two polyimide layers. Each CU conductive wire may be provided to be covered with polyimide having a thickness of 20.5 μm. However, the structure of the area in which the conductive wires are provided is not limited thereto. For example, Figure 1 The width of the conductive line shown is 100 μm, the thickness of the flexible circuit board is 136.5 μm, and the numerical values ​​described for each structure are only for explaining an example and are not limited thereto.

[0060] For example, the width d1 of the conductive line 121 may be about 100 μm, and the distance d2 between adjacent conductive lines 121 in the conductive line 121 may be 150 μm. The flexible circuit board 120 may include a plurality of (e.g., 12) conductive lines. However, the present disclosure is not limited thereto, and the width and gap of the conductive line and the number of the conductive lines may be changed according to the type of the image sensor 110 and the configuration of the circuit elements of the electronic device.

[0061] The flexible circuit board 120 including the conductive line 121 is connected to the central part of the area of ​​the circuit board 111 configured to mount the image sensor 110 thereon, and does not need to be drawn out from the central part of one side of the circuit board 111, but can be drawn out from an unrestricted position and can extend in a specific direction on the first plane. For example, the first plane may be a light receiving surface of the image sensor 110 or a surface substantially parallel to the light receiving surface. As another example, the first plane may be a plane substantially perpendicular to the light receiving surface of the image sensor 110. However, the arrangement of the first plane is not limited to the above example. The shape in which the flexible circuit board 120 extends is not limited to a single straight line. For example, the flexible circuit board 120 may have a shape that is drawn out from the circuit board 111, extends in a first direction 151, and then extends in a second direction 152 different from the first direction 151. With reference to the x-axis, y-axis, and z-axis orthogonal to each other, the flexible circuit board 120 may have a shape that extends in the z-axis direction, then extends in the x-axis direction, and extends in the y-axis direction from one end of the portion extending in the x-axis direction. For example, the first direction 151 may be the -x-axis direction, the second direction 152 may be the -y-axis direction, and the third direction may be the x-axis direction. The flexible circuit board 120 extending from the circuit board 111 may be attached to the fixed portion 140, and the fixed portion 140 includes a rigid area at a fixed position in the camera module or an area reinforced by a reinforcement. The flexible circuit board 120 fixed on one side may extend to be fixed to a camera module or an electronic device including a camera module, and a connector 141 may be configured. At each position where the flexible circuit board 120 is bent, the flexible circuit board 120 may be bent in a state where the conductive wires are combined together and the slits are not made between adjacent conductive wires in the conductive wires. A rigid reinforcement may be attached to the flexible circuit board 120 to maintain the bent shape at the bent position.

[0062] The connector 141 of the circuit connector 100 may be fixed to a camera module or an electronic device including the camera module.

[0063] Figure 2 It is a diagram for explaining the structure of the flexible printed circuit 120 being folded and bent.

[0064] The description “the flexible circuit board 120 is bent” in this specification may refer to a structure obtained by folding the flexible circuit board 120, which causes the direction in which the flexible circuit board 120 extends to be changed. Figure 2, with reference to the folding point 210 of the flexible circuit board 120, at least some of the conductive lines 121 extending in the first direction 231 of the flexible circuit board 120 may be disposed in the first plane 221. With reference to the folding point 210 of the flexible circuit board 120, at least some of the conductive lines 121 extending in the second direction 232 of the flexible circuit board 120 may be disposed in a second plane 222 that is not parallel to the first plane 221. The region of the flexible circuit board 120 including the folding point 210 may be referred to as a bending region.

[0065] The shape of the Figure 2 In addition, Figure 2 The structure of the flexible circuit board 120 shown in the figure is merely an example for defining terms used to describe various embodiments, and the terms used in this specification are not limited to mean that the disclosure should be related to Figure 2 The shapes shown in are physically exactly the same.

[0066] Figure 3 This is a diagram for explaining a structure in which the direction in which the flexible printed circuit board 120 extends is bent.

[0067] The description “the flexible circuit board 120 is bent” in this specification may refer to a structure in which the conductive line 121 disposed on the flexible circuit board 120 is disposed to extend in a direction that changes about the bending point 310. As the conductive line 121 is disposed to extend in a direction that changes, the direction in which the flexible circuit board 120 extends may also change.

[0068] Conductive lines 121 extending in a first direction 331 about a bending point 310 included in the flexible circuit board 120 and conductive lines 121 extending in a second direction 332 included in the flexible circuit board 120 may be disposed on one plane 320. A region including the bending point 310 where the flexible circuit board 120 is bent may be referred to as a bending region.

[0069] The shape of the Figure 3 In addition, Figure 3 The structure of the flexible circuit board 120 shown in the figure is merely an example for defining terms used to describe various embodiments, and the terms used in this specification are not limited to mean that the disclosure should be related to Figure 3 The shapes shown in are physically exactly the same.

[0070] Figure 4 is an exploded view showing a configuration of a camera module 400 according to an embodiment.

[0071] The camera module 400 according to an embodiment may include an upper shielding cover 411 and a lower shielding cover 413. The components of the camera module 400 may be accommodated in a space defined between the upper shielding cover 411 and the lower shielding cover 413. The image sensor 110 of the camera module 400 may be connected to an external circuit of the camera module 400 via the circuit connector 100. The image sensor 110 may be disposed on a bracket (e.g., at least one of the OIS bracket 451 or the AF bracket 441). The OIS bracket 451 may be driven by an attractive force or a repulsive force (or a Lorentz force) generated between the OIS coils 453 and 454 and the OIS magnets 455 and 456. The AF bracket 441 may be driven by an attractive force or a repulsive force (or a Lorentz force) generated between the AF coil 443 and the AF magnet (not shown). The image sensor 110 may be fixed to the bracket by fixing a circuit board on which the image sensor 110 is disposed to the bracket. The image sensor 110 fixed to the bracket may move as the bracket is driven. The camera module 400 may further include a housing 420 configured to arrange other components included in the camera module 400 at appropriate positions within the camera module 400 .

[0072] The camera module 400 according to an embodiment may include an optical system including a lens 431 and a prism 433. The camera module 400 according to an embodiment may include a refractive optical system in which a light path extending from an object to the image sensor 110 via the lens 431 and the prism 433 is refracted one or more times.

[0073] The camera module 400 according to an embodiment may include an AF actuator configured to provide an auto focus function. Figure 4 , the AF actuator may include an AF bracket 441, an AF coil 443, an AF magnet (not shown), and an AF ball 447. The AF magnet (not shown) may be disposed on one surface of the AF bracket 441 facing the AF coil 443. The AF bracket 441 may be driven by an attractive force or a repulsive force between the AF magnet (not shown) and the AF coil 443. The moving path of the AF bracket 441 may be guided by a guide groove (e.g., a track disposed in the AF bracket 441) disposed to allow the AF ball 447 to roll therein. As the AF bracket 441 is driven, the image sensor 110 disposed on the AF bracket 441 moves, so that a focus control function can be performed.

[0074] The camera module 400 according to an embodiment may include an OIS actuator configured to provide an optical image stabilization function. Figure 4, the OIS actuator may include an OIS bracket 451, a y-axis OIS coil 453, a y-axis OIS magnet 455, an x-axis OIS coil 454, an x-axis OIS magnet 456, and an OIS ball 457. The y-axis OIS magnet 455 may be disposed on a surface of the OIS bracket 451 facing the y-axis OIS coil 453. The x-axis OIS magnet 456 may be disposed on a surface of the OIS bracket 451 facing the x-axis OIS coil 454. The OIS bracket 451 may be driven by an attractive force or a repulsive force between the y-axis OIS coil 453 and the y-axis OIS magnet 455 and / or an attractive force or a repulsive force between the x-axis OIS coil 454 and the x-axis OIS magnet 456. The movement of the OIS bracket 451 may be guided by a guide groove (e.g., a track disposed in the OIS bracket 451) disposed to allow the OIS ball 457 to roll therein. As the OIS bracket 451 is driven, the image sensor 110 disposed on the OIS bracket 451 moves, so that the optical image stabilization function can be performed.

[0075] The camera module 400 according to an embodiment may further include a z-axis stopper 460 and a circuit board 470. The z-axis stopper 460 may limit the range of movement of the OIS bracket 451 and / or the AF bracket 441 in the z-axis direction. The circuit board 470 may be connected to at least one of the AF coil 443, the y-axis OIS coil 453, or the x-axis OIS coil 454. The circuit board 470 may include a flexible printed circuit board (FPCB).

[0076] Figure 4 The components of the camera module 400 shown are for illustrating an embodiment, and the camera module 400 according to an embodiment may further include other components, or some of the components may be omitted. Alternatively, the camera module 400 may include the camera module 400 as a single component. Figure 4 For example, although Figure 4 , two y-axis OIS coils 453 and y-axis OIS magnets 455 are shown, but a camera module according to an embodiment may include a y-axis OIS actuator that may be configured with one y-axis OIS coil and one y-axis OIS magnet. According to an embodiment, the magnet and coil of the OIS actuator may be arranged in a solenoid method different from the Lorentz method. As another example, Figure 4 The camera module 400 is shown in which the OIS bracket 451 and the AF bracket 441 are guided using the OIS balls 457 and the AF balls 447 , but at least one of the OIS bracket 451 or the AF bracket 441 may be guided by using a wire.

[0077] Figure 5is a diagram showing a structure of a circuit connector 100 configured to interconnect an image sensor 110 according to an embodiment and a component other than the image sensor.

[0078] The flexible circuit board 120 according to an embodiment may include a bending section 510 that is bent so as to extend in the y-axis direction from a position where the flexible circuit board 120 is pulled out from the circuit board 111 on which the image sensor 110 is disposed. A rigid region or a reinforcing member may be disposed in the bending section 510 to maintain the shape of the flexible circuit board 120. The flexible circuit board 120 may include a section extending in the y-axis direction from the bending section 510. The flexible circuit board 120 may be bent in the bending section 510 and may then extend in the z-axis direction. Figure 5 , in a section where the flexible circuit board 120 extends along the z-axis direction, the surface on which the flexible circuit board 120 is disposed may not be parallel to the plane (eg, the xz plane) on which the light receiving surface of the image sensor 110 is disposed.

[0079] The flexible circuit board 120 may be bent to extend in the -x-axis direction from one end of the portion extending in the z-axis direction. The flexible circuit board 120 may further include a section extending in the -x-axis direction from the bending section 511. A rigid region or a reinforcing member configured to maintain the shape of the flexible circuit board 120 may be provided in the section 511, and the flexible circuit board 120 bent at one end of the portion extending in the z-axis direction is bent in the section 511.

[0080] The flexible circuit board 120 may be bent to extend in the -z-axis direction from one end of the portion extending in the -x-axis direction. The flexible circuit board 120 may further include a section extending in the -z-axis direction from the bending section 512. One end of the portion extending in the -z-axis direction of the flexible circuit board 120 may be connected to the fixing portion 140. Figure 5 , but the fixing portion 140 may include or be connected to a connector for connecting to another circuit. In one embodiment, a rigid region or a reinforcement member may be provided in the bending section 512 to maintain the shape of the flexible circuit board 120.

[0081] Since the flexible circuit board 120 is drawn out from one side of the circuit board 111 and disposed to surround the space 520 , an optical system (not shown) included in a camera module (not shown) may be disposed in the space 520 , which is at least partially surrounded by the flexible circuit board 120 .

[0082] Figure 6 is a diagram showing a method according to an embodiment Figure 5 FIG. 6 is a diagram showing an example of a state in which the camera module 400 is installed in the electronic device 600 .

[0083] The camera module 400 according to an embodiment may be disposed so that the lens 431 faces the outside of the electronic device 600. In addition to the opening through which the lens 431 of the camera module 400 is exposed, the electronic device 600 may further include other openings 610. The electronic device 600 may further include other components disposed at positions within the electronic device 600 corresponding to positions where the other openings 610 are formed. For example, the electronic device 600 may further include at least one of a camera, a proximity sensor, or a flash.

[0084] Figure 6 An example in which the camera module 400 is disposed in the electronic device 600 is shown, and the position of the camera module 400 in the electronic device 600 is not limited to Figure 6 For example, the camera module 400 may be an under display camera (UDC) provided on the rear surface of the display of the electronic device 600.

[0085] Figure 7 2 are diagrams respectively illustrating a direction in which light enters a camera module from an object through a lens and a direction in which an image sensor in the camera module receives the light according to various embodiments.

[0086] Reference Figure 7 (a), the circuit board 111-1 on which the image sensor 110-1 is mounted according to an embodiment may be disposed in the camera module on the side facing the lens 431-1. The flexible circuit board 120-1 may be drawn out and extended from the circuit board 111-1 on which the image sensor 110-1 is mounted, and may be disposed in a form that at least partially surrounds the periphery of an optical component (e.g., a lens barrel, a prism, or a reflective member including a reflector that reflects light in an internal space in which the lens 431-1 is disposed).

[0087] When the flexible circuit board 120-1, the optical components and the image sensor 110-1 are as Figure 7 When arranged as shown in (a), a first direction 701 in which light is incident on the lens 431-1 from a subject and a second direction 702 in which light is incident on the image sensor 110-1 may be substantially opposite to each other.

[0088] Reference Figure 7 (b), the circuit board 111-2 on which the image sensor 110-2 is mounted according to an embodiment may be disposed in the camera module on a side opposite to the direction in which the lens 431-2 faces. According to an embodiment, the flexible circuit board 120-2 may pass under the optical component and may extend to surround the periphery of the optical component.

[0089] When the flexible circuit board 120-2, the optical components and the image sensor 110-2 are Figure 7When arranged as shown in (b), a third direction 703 in which light is incident on the lens 431-2 from a subject and a fourth direction 704 in which light is incident on the image sensor 110-2 may be substantially identical to each other.

[0090] like Figure 7 As shown, by using the circuit connector according to various embodiments, the arrangement of components within the camera module can be configured more freely.

[0091] Figure 8 is a diagram illustrating a direction in which the circuit connector 100 may be deformed to allow movement of the image sensor 110 when an optical image stabilization function or an auto focus function is performed according to an embodiment.

[0092] When the electronic device detects at least one component of movement in the pitch axis direction, yaw axis direction or roll axis direction of the camera module, the electronic device can be configured so that the image sensor moves in at least one of the x-axis direction or the y-axis direction to perform optical image stabilization, or an actuator included in the camera module can be driven to change the posture of the image sensor.

[0093] The circuit connector 100 of the camera module according to an embodiment may include at least one operating section, the shape of which is deformable according to the movement of the image sensor 110. For the convenience of description, Figure 8 An embodiment is shown in which the circuit connector 100 includes a first operating section 711 extending from the image sensor 110 , a second operating section 712 extending from the first operating section 711 , and a third operating section 713 connected from the second operating section 712 to the fixing portion 140 .

[0094] The image sensor 110 may be moved by driving the actuator. When the image sensor 110 moves in the x-axis direction 720 with respect to the fixed portion 140, the movement of the image sensor 110 in the x-axis direction 720 may be allowed while the second section 712 is deformed. When the image sensor 110 moves in the y-axis direction 730 with respect to the fixed portion 140, the movement of the image sensor 110 in the y-axis direction 730 may be allowed while the third section 713 is deformed. The image sensor 110 may perform a roll rotation around the z-axis to perform optical image stabilization. When the image sensor 110 performs a roll rotation 740, the roll rotation 740 of the image sensor 110 may be allowed while the first section 711 and the third section 713 are deformed. According to the roll rotation 740 of the image sensor 110, the flexible circuit board including the first section 711 and the third section 713 may be deformed while being displaced and rotated on the xy plane.

[0095] In order to perform an auto focus (AF) function, the image sensor may move in the z-axis direction. When the image sensor 110 moves in the z-axis direction 750 with respect to the fixed portion 140, the movement of the image sensor 110 in the z-axis direction 750 may be allowed while the first section 711 is deformed. The flexible circuit board having a plurality of slits formed therein may minimize a repulsive force generated when the flexible circuit board is deformed.

[0096] Figure 8 The operation of the circuit connector 100 according to an embodiment is shown, and the description that "some segments are deformed" does not necessarily mean that the remaining segments are not deformed. In addition, in addition to the operation of the circuit connector 100 described above, at least one of the position or posture of the image sensor 110 can be changed by the operation of another segment.

[0097] like Figure 8 As shown, according to various embodiments, the operating direction of the flexible circuit board included in the circuit connector 100 may be changed according to the extending direction and the bending or curving position of the flexible circuit board. However, the concept that at least one of the position or posture of the image sensor is changed while the flexible circuit board is deformed in the operating direction and the low repulsive force is generated may be equally applicable.

[0098] The section of the circuit connector 100 that is deformable as the image sensor moves may be referred to as an operating section or an operating portion. The section of the circuit connector 100 that does not deform and maintains a fixed shape even when the image sensor 110 moves may be referred to as a fixed section or a fixed portion.

[0099] Fig. 9 1 is a diagram showing a circuit connector 100 in which a bending area 910 is included in operating sections 711, 712, and 713 of a flexible circuit board and a camera module 400 including the circuit connector 100 according to an embodiment. In other drawings, reference numerals for some components described above are omitted.

[0100] According to an embodiment, the bending region 910 may also be included in the operating sections 711, 712, and 713 of the circuit connector 100. In at least a portion of the bending region 910, the conductive wires disposed in the operating sections 711, 712, and 713 may be bonded together without separation gaps (e.g., slits) between the conductive wires, or a smaller number of gaps than the number of gaps formed in a region other than the bending region may be formed.

[0101] Reference Fig. 9, a folding area and a bending area may be formed between the first operating section 711 and the second operating section 712 to change the direction in which the flexible circuit board extends. In addition, the bending area may also be formed in the area where the fixing portion 140 is provided. In at least a portion of the bending area, the conductive wires may be combined together without separation gaps (e.g., slits) between adjacent conductive wires in the conductive wires, or a smaller number of gaps may be formed than the number of gaps formed in an area different from the bending area.

[0102] Even if the bending area 920 (eg Figure 1 The bending regions 131 and 132 or Figure 5 In the curved sections 511 and 512), the conductive lines can be combined together without separation gaps (e.g., slits) between adjacent conductive lines in the conductive lines, or a smaller number of gaps can be formed compared to the number of gaps formed in areas different from the curved area.

[0103] Fig.10 10 is a diagram showing an example in which a camera module 1000 is mounted with a circuit connector 1001 according to an embodiment, wherein the circuit connector 1001 includes a slit section of a flexible circuit board 1020 arranged on substantially the same plane as an image sensor 1010 and does not include a bending region in an operating section.

[0104] Reference Fig.10 , the circuit board 1011 on which the image sensor 1010 according to an embodiment is mounted may be disposed on the side of the camera module 1000 that faces the lens. Fig.10 In the illustrated embodiment, a first direction 1061 in which light is incident through the lens and a second direction 1062 in which the image sensor 1010 receives the light may be substantially opposite to each other.

[0105] For the sake of Fig.10 The image sensor 1010 is provided as shown, and the flexible circuit board 1020 can be drawn out from one side of the circuit board 1011 and can extend in the third direction 1051. The flexible circuit board 1020 can be bent from one end of the portion extending in the third direction 1051, and can extend in the fourth direction 1052. The flexible circuit board 1020 can be bent from one end of the portion extending in the fourth direction 1052, and can extend in the fifth direction 1053. The flexible circuit board 1020 can be connected to the fixed portion 1040 from one end of the portion extending in the fifth direction 1053. The region of the flexible circuit board 1020 connected to the fixed portion 1040 can be bent and connected to the fixed portion 1040 without being slit. The flexible circuit board 1020 may also include a bent region between one end of the portion extending in the fifth direction 1053 and the region connected to the fixed portion 1040.

[0106] like Fig.10 As shown, since the flexible circuit board 1020 according to an embodiment is arranged along the periphery of the optical components, even if the image sensor 1010 is arranged on the side facing the lens, the arrangement of the optical components may not be disturbed. In addition, the flexible circuit board 1020 according to an embodiment can ensure the length for the operating section while preventing the length of the flexible circuit board 1020 from being unnecessarily long, and the repulsive force applied to the circuit board 1011 can be kept at a low level.

[0107] Fig.11 1 is a diagram showing an example in which a camera module 1100 is mounted with a circuit connector 1101 according to an embodiment, wherein the circuit connector 1101 includes a slit section of a flexible circuit board 1120 configured on a plane different from a plane on which an image sensor 1110 is provided and includes a bending area in an operating section.

[0108] The flexible circuit board 1120 may be drawn out from the circuit board 1111 on which the image sensor 1110 is provided, and may extend from the bending section 1160 in the first direction 1151. The flexible circuit board 1120 may be bent in the bending section 1160 to extend in the first direction 1151. The flexible circuit board 1120 may be bent at one end of a portion extending in the first direction 1151, and may extend in the second direction 1152. The flexible circuit board 1120 may be bent at one end of a portion extending in the second direction 1152, and may extend in the third direction 1153. The flexible circuit board 1120 may be connected to the fixing portion 1140 at one end of a portion extending in the third direction 1153.

[0109] No slit may be formed in the bending section between the section extending in the first direction 1151 and the section extending in the second direction 1152, the bending section between the section extending in the second direction 1152 and the section extending in the third direction 1153, and the section 1160 drawn out to be bent from the circuit board 1111. As the slit section is deformed, the bending section between the section extending in the first direction 1151 and the section extending in the second direction 1152, the bending section between the section extending in the second direction 1152 and the section extending in the third direction 1153, and the section 1160 drawn out to be bent from the circuit board 1111 may flexibly move relative to the fixing portion 1140.

[0110] Fig.12is a diagram showing a camera module 1200 according to one embodiment and an image sensor 1210 and a circuit connector 1201 installed in the camera module 1200, wherein the image sensor 1210 is disposed on a rear surface of an optical system so that a direction 1261 in which light enters a lens 1231 from an object and a direction 1262 in which the image sensor receives the light are substantially the same.

[0111] In the camera module 1200 according to an embodiment, light incident on the lens 1231 in a first direction 1261 may be incident on the image sensor 1210 in a second direction 1262 substantially the same as the first direction 1261 through an optical path that is refracted two or more times by passing through the lens barrel and the prism 1233 .

[0112] The flexible circuit board 1220 pulled out from the circuit board 1211 on which the image sensor 1210 is mounted may extend in the third direction 1251. The flexible circuit board 1210 may be bent at one end of a portion extending in the third direction 1251, and may extend in the fourth direction 1252. The flexible circuit board 1220 may be connected to the fixing portion 1240 at one end of a portion extending in the fourth direction 1252.

[0113] The flexible circuit board 1220 may be arranged so that the image sensor 1210 can move without interfering with the arrangement of the optical system.

[0114] Fig.13 is a diagram illustrating a structure of a bending region 1310 of a flexible circuit board 1320 according to an embodiment.

[0115] The structure in which the direction in which the flexible circuit board 1320 extends is changed so that the surface on which the conductive wires mounted on the flexible circuit board 1320 are arranged is folded may be referred to as a structure in which the flexible circuit board is bent. The structure in which the direction in which the flexible circuit board 1320 extends is changed so that the surface on which the conductive wires mounted on the flexible circuit board 1320 are arranged is maintained may be referred to as a structure in which the direction of the flexible circuit board 1320 is bent. The description "the direction of the flexible circuit board 1320 is bent" may include not only a case in which a curve is formed but also a case in which the extending direction is changed to form an angle.

[0116] Reference Fig.13In the flexible circuit board 1320 according to an embodiment, in at least a portion of the section 1310 bent in the direction in which the flexible circuit board 1320 extends, the regions on which the conductive lines are disposed may be combined together without slits between adjacent regions in the region, or a smaller number of slits may be formed compared to other sections. The flexible circuit board 1320 according to an embodiment may include a connection structure 1330 (e.g., a bridge structure) between regions on which the conductive lines are disposed adjacent to the bending region 1310. According to an embodiment, the connection structure 1330 may be configured to prevent or reduce excessive deformation of the flexible circuit board 1320 when the flexible circuit board 1320 moves. For example, the connection structure 1330 may prevent or reduce torsion of the flexible circuit board 1320. Fig.13 Only one example of the flexible circuit board 1320 is shown, and the number and / or position of the connection structures 1330 included in the flexible circuit board 1320 are not limited to the shown example.

[0117] Meanwhile, in the detailed description of the present disclosure, specific embodiments have been described, but various modifications are possible without departing from the scope of the present disclosure. For example, in the range where the flexible circuit board including a plurality of slits is pulled out from a circuit board on which an image sensor is mounted or a circuit board on which an image sensor is mounted is mounted and extends in at least two directions, the flexible circuit board may be configured in the form of a combination of a portion of one type and a portion of another type among the above-mentioned flexible circuit boards. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be determined based not only on the attached claims but also on the equivalents of the claims.

[0118] Fig.14 1 is a block diagram illustrating an electronic device 1401 in a network environment 1400 according to various embodiments. Fig.14, the electronic device 1401 in the network environment 1400 may communicate with the electronic device 1402 via the first network 1498 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 1404 or the server 1408 via the second network 1499 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1401 may communicate with the electronic device 1404 via the server 1408. According to an embodiment, the electronic device 1401 may include a processor 1420, a memory 1430, an input module 1450, a sound output module 1455, a display module 1460, an audio module 1470, a sensor module 1476, an interface 1477, a connection terminal 1478, a haptic module 1479, a camera module 1480, a power management module 1488, a battery 1489, a communication module 1490, a subscriber identification module (SIM) 1496, or an antenna module 1497. In some embodiments, at least one of the above components (e.g., the connection terminal 1478) may be omitted from the electronic device 1401, or one or more other components may be added to the electronic device 1401. In some embodiments, some of the above components (e.g., the sensor module 1476, the camera module 1480, or the antenna module 1497) may be implemented as a single integrated component (e.g., the display module 1460).

[0119] The processor 1420 may run, for example, software (e.g., program 1440) to control at least one other component (e.g., hardware component or software component) of the electronic device 1401 connected to the processor 1420, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1420 may store a command or data received from another component (e.g., sensor module 1476 or communication module 1490) in a volatile memory 1432, process the command or data stored in the volatile memory 1432, and store the resultant data in a non-volatile memory 1434. According to an embodiment, the processor 1420 may include a main processor 1421 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 1423 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1421 in operation. For example, when the electronic device 1401 includes a main processor 1421 and an auxiliary processor 1423, the auxiliary processor 1423 may be adapted to consume less power than the main processor 1421, or adapted to be dedicated to a specific function. The auxiliary processor 1423 may be implemented as a separate part from the main processor 1421, or as part of the main processor 1421.

[0120] When the main processor 1421 is in an inactive (e.g., sleep) state, the auxiliary processor 1423 (rather than the main processor 1421) may control at least some of the functions or states related to at least one component among the components of the electronic device 1401 (e.g., the display module 1460, the sensor module 1476, or the communication module 1490), or when the main processor 1421 is in an active state (e.g., running an application), the auxiliary processor 1423 may control at least some of the functions or states related to at least one component among the components of the electronic device 1401 (e.g., the display module 1460, the sensor module 1476, or the communication module 1490) together with the main processor 1421. According to an embodiment, the auxiliary processor 1423 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 1480 or a communication module 1490) that is functionally related to the auxiliary processor 1423. According to an embodiment, the auxiliary processor 1423 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated by machine learning. For example, such learning can be performed by the electronic device 1401 where the artificial intelligence is executed or via a separate server (e.g., server 1408). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN) or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0121] The memory 1430 may store various data used by at least one component of the electronic device 1401 (e.g., the processor 1420 or the sensor module 1476). The various data may include, for example, software (e.g., program 1440) and input data or output data for commands related thereto. The memory 1430 may include a volatile memory 1432 or a non-volatile memory 1434.

[0122] The program 1440 may be stored as software in the memory 1430 , and the program 1440 may include, for example, an operating system (OS) 1442 , middleware 1444 , or an application 1446 .

[0123] The input module 1450 may receive commands or data to be used by other components (e.g., the processor 1420) of the electronic device 1401 from outside (e.g., a user) of the electronic device 1401. The input module 1450 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0124] The sound output module 1455 can output sound signals to the outside of the electronic device 1401. The sound output module 1455 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0125] The display module 1460 may visually provide information to the outside of the electronic device 1401 (e.g., a user). The display device 1460 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 1460 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0126] The audio module 1470 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 1470 may obtain sound via the input module 1450, or output sound via the sound output module 1455 or an earphone of an external electronic device (e.g., electronic device 1402) directly (e.g., wired) connected to the electronic device 1401 or wirelessly connected thereto.

[0127] The sensor module 1476 may detect an operating state (e.g., power or temperature) of the electronic device 1401 or an environmental state (e.g., a state of a user) outside the electronic device 1401, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1476 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0128] The interface 1477 may support one or more specific protocols to be used to connect the electronic device 1401 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 1402). According to an embodiment, the interface 1477 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0129] The connection end 1478 may include a connector, wherein the electronic device 1401 can be physically connected to an external electronic device (e.g., the electronic device 1402) via the connector. According to an embodiment, the connection end 1478 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0130] The haptic module 1479 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1479 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0131] The camera module 1480 may capture a still image or a moving image. According to an embodiment, the camera module 1480 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0132] The power management module 1488 may manage power supply to the electronic device 1401. According to an embodiment, the power management module 1488 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0133] The battery 1489 may supply power to at least one component of the electronic device 1401. According to an embodiment, the battery 1489 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0134] The communication module 1490 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1401 and an external electronic device (e.g., electronic device 1402, electronic device 1404, or server 1408), and perform communication via the established communication channel. The communication module 1490 may include one or more communication processors capable of operating independently from the processor 1420 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1490 may include a wireless communication module 1492 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1494 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 1498 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 1499 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1492 can identify and authenticate the electronic device 1401 in a communication network (such as the first network 1498 or the second network 1499) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1496.

[0135] The wireless communication module 1492 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 1492 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 1492 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1492 can support various requirements specified in the electronic device 1401, an external electronic device (e.g., electronic device 1404), or a network system (e.g., a second network 1499). According to an embodiment, the wireless communication module 1492 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0136] The antenna module 1497 may transmit a signal or power to the outside of the electronic device 1401 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 1401 (e.g., an external electronic device). According to an embodiment, the antenna module 1497 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on a substrate. According to an embodiment, the antenna module 1497 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1498 or the second network 1499) may be selected from the plurality of antennas by, for example, the communication module 1490 (e.g., the wireless communication module 1492). Subsequently, a signal or power may be transmitted or received between the communication module 1490 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 1497.

[0137] According to various embodiments, the antenna module 1497 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0138] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0139] According to an embodiment, a command or data may be sent or received between the electronic device 1401 and the external electronic device 1404 via the server 1408 connected to the second network 1499. Each of the electronic device 1402 or the electronic device 1404 may be a device of the same type as the electronic device 1401, or a device of a different type from the electronic device 1401. According to an embodiment, all or some operations to be executed in the electronic device 1401 may be executed in one or more of the external electronic device 1402, the external electronic device 1404, or the server 1408. For example, if the electronic device 1401 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1401 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 1401 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 1401. The electronic device 1401 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 1401 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 1404 may include an Internet of Things (IoT) device. The server 1408 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 1404 or the server 1408 may be included in the second network 1499. The electronic device 1401 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0140] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0141] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0142] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0143] The various embodiments described herein may be implemented as software (e.g., program 1440) including one or more instructions stored in a storage medium (e.g., internal memory 1436 or external memory 1438) that can be read by a machine (e.g., electronic device 1401). For example, under the control of a processor, a processor (e.g., processor 1420) of the machine (e.g., electronic device 1401) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0144] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0145] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0146] Fig.15 1500 is a block diagram illustrating a camera module 1480 according to various embodiments. Fig.15 , the camera module 1480 may include a lens assembly 1510, a flash 1520, an image sensor 1530, an image stabilizer 1540, a memory 1550 (e.g., a buffer memory), or an image signal processor 1560. The lens assembly 1510 may collect light emitted or reflected from an object whose image is to be captured. The lens assembly 1510 may include one or more lenses. According to an embodiment, the camera module 1480 may include a plurality of lens assemblies 1510. In this case, the camera module 1480 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 1510 may have the same lens properties (e.g., viewing angle, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from those of another lens assembly. The lens assembly 1510 may include, for example, a wide-angle lens or a telephoto lens.

[0147] The flash 1520 may emit light, wherein the emitted light is used to enhance the light reflected from the object. According to an embodiment, the flash 1520 may include one or more light emitting diodes (LEDs) (e.g., red, green, blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or xenon lamps. The image sensor 1530 may acquire an image corresponding to the object by converting light emitted or reflected from the object and transmitted through the lens assembly 1510 into an electrical signal. According to an embodiment, the image sensor 1530 may include one image sensor selected from a plurality of image sensors having different properties (e.g., an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 1530 may be implemented using, for example, a charge coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

[0148] The image stabilizer 1540 may move the image sensor 1530 or at least one lens included in the lens assembly 1510 in a specific direction, or control an operational property of the image sensor 1530 (e.g., adjust the readout timing) in response to the movement of the camera module 1480 or the electronic device 1401 including the camera module 1480. In this way, at least a portion of the negative effects (e.g., image blur) generated due to the movement of the image being captured is allowed to be compensated. According to an embodiment, the image stabilizer 1540 may sense such movement of the camera module 1480 or the electronic device 1401 using a gyroscope sensor (not shown) or an acceleration sensor (not shown) arranged inside or outside the camera module 1480. According to an embodiment, the image stabilizer 1540 may be implemented as, for example, an optical image stabilizer. The memory 1550 may at least temporarily store at least a portion of the image acquired via the image sensor 1530 for subsequent image processing tasks. For example, if a plurality of images are captured quickly or image capture is delayed due to shutter lag, the acquired original image (e.g., Bayer pattern image, high-resolution image) may be stored in the memory 1550, and its corresponding copy image (e.g., low-resolution image) may be previewed via the display module 1460. Then, if a specified condition is satisfied (e.g., by a user's input or a system command), at least a portion of the original image stored in the memory 1550 may be acquired and processed by, for example, the image signal processor 1560. According to an embodiment, the memory 1550 may be configured as at least a portion of the memory 1430, or the memory 1550 may be configured as a separate memory that operates independently of the memory 1430.

[0149] The image signal processor 1560 may perform one or more image processing on an image acquired via the image sensor 1530 or an image stored in the memory 1550. The one or more image processing may include, for example, depth map generation, three-dimensional (3D) modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 1560 may perform control (e.g., exposure time control or readout timing control) on at least one of the components included in the camera module 1480 (e.g., image sensor 1530). The image processed by the image signal processor 1560 may be stored back to the memory 1550 for further processing, or the image may be provided to an external component outside the camera module 1480 (e.g., memory 1430, display module 1460, electronic device 1402, electronic device 1404, or server 1408). According to an embodiment, the image signal processor 1560 may be configured as at least a part of the processor 1420, or may be configured as a separate processor that operates independently of the processor 1420. If the image signal processor 1560 is configured as a separate processor from the processor 1420, at least one image processed by the image signal processor 1560 may be displayed as it is by the processor 1420 via the display module 1460, or the at least one image may be displayed after being further processed.

[0150] According to an embodiment, the electronic device 1401 may include a plurality of camera modules 1480 having different properties or functions. In this case, at least one camera module 1480 of the plurality of camera modules 1480 may form, for example, a wide-angle camera, and at least another camera module 1480 of the plurality of camera modules 1480 may form a telephoto camera. Similarly, at least one camera module 1480 of the plurality of camera modules 1480 may form, for example, a front camera, and at least another camera module 1480 of the plurality of camera modules 1480 may form a rear camera.

[0151] Fig.16 16 is a diagram showing a structure of a circuit connector 100 configured to interconnect an image sensor 1610 according to an embodiment with a component other than the image sensor 1610 .

[0152] Fig.16 The image sensor 1610 and the circuit connector 100 shown may be included in a camera module. The image sensor 1610 according to an embodiment may be mounted on a circuit board. Alternatively, a separate circuit board on which the image sensor 1610 is mounted may be electrically connected to another circuit board.

[0153] In one embodiment, the circuit connector 100 may include a flexible circuit board 1620 including a section that is drawn out from a circuit board on which the image sensor 1610 is mounted and extends in a first direction 1651. The flexible circuit board 1620 may include conductive wires (e.g., Figure 1 The flexible circuit board 1620 may be manufactured without slits.

[0154] At least one of the position or posture of the image sensor 1610 according to an embodiment within the camera module may be controlled by the actuator. The flexible circuit board 1620 may be withdrawn from a position deviated from a position corresponding to the center 1613 of the image sensor 1610 .

[0155] The flexible circuit board 1620 according to an embodiment may include a section extending from one end of the section extending in the first direction 1651 in a second direction 1652 different from the first direction 1651. When a bending area exists between the section extending in the first direction 1651 and the section extending in the second direction 1652 due to folding of the flexible circuit board 1620, the circuit connector 100 according to an embodiment may include a rigid area or a reinforcing member 1631 to maintain the shape of the bending area. The flexible circuit board 1620 may further include a section that is bent at one end of the section extending in the first direction 1651 and then bent to extend in the second direction 1652. The reinforcing member 1631 may be attached to a region including the bending area on the flexible circuit board 1620.

[0156] In one embodiment, the flexible circuit board 1620 may include a segment extending from one end of the segment extending along the second direction 1652 along a third direction 1653 different from the second direction 1652. When the region where the flexible circuit board 1620 is bent also exists between the segment extending along the second direction 1652 and the segment extending along the third direction 1653, a rigid region or reinforcement 1632 may be provided.

[0157] Fig.16 The illustrated flexible circuit board 1620 is shown to include a segment extending in a first direction 1651, a segment extending in a second direction 1652, and a segment extending in a third direction 1653. However, the present disclosure is not limited thereto.

[0158] Fig.17 is an exploded view illustrating a configuration of a camera module 400 including an image sensor according to an embodiment.

[0159] In one embodiment, the camera module 400 may include at least one of the upper shielding cover 1711 and the lower shielding cover 1713. The components of the camera module 400 may be accommodated in a space defined by at least one of the upper shielding cover 1711 and the lower shielding cover 1713. The image sensor of the camera module 400 may be connected to an external circuit of the camera module 400 via the circuit connector 100. The circuit connector 100 may be made of a flexible material so that the image sensor is movable. In one embodiment, the circuit connector 100 may include a flexible circuit board without a slit or a flexible circuit board with a slit. The image sensor connected to the circuit connector 100 may be provided on a bracket (e.g., at least one of the OIS bracket 1751 and the AF bracket 1741). The OIS bracket 1751 may be driven by an attractive force or a repulsive force (or Lorentz force) generated between the OIS coils 1753 and 1754 and the OIS magnets 1755 and 1756. Since the circuit board on which the image sensor is disposed is disposed on the bracket, the image sensor is movable according to the movement of the bracket within the camera module 400. The camera module 400 may further include a housing 1720 configured to arrange other components included in the camera module 400 at appropriate positions within the camera module 400. The housing 1720 may include a frame for fixing at least some of the components.

[0160] The camera module 400 according to an embodiment may include an optical system including a lens 1731 and a prism 1733. The optical system included in the camera module 400 according to an embodiment may include a refractive optical system in which a light path extending from an object to an image sensor via the lens 1731 and the prism 1733 is refracted one or more times. For example, the prism 1733 may include a rhombus prism configured in a parallelogram shape. For example, the prism 1733 may include a dove prism configured in a trapezoidal shape. When the prism 1733 includes a dove prism, the arrangement of the lens 1731 and the image sensor may be the same as that of the lens 1731. Fig.17 The arrangement shown is configured differently. For example, prism 1733 may include a prism having two reflective members.

[0161] In one embodiment, the camera module 400 according to one embodiment may include an AF actuator configured to provide an auto focus function. Fig.17, the AF actuator may include an AF bracket 1741, an AF coil 1743, an AF magnet, and an AF ball 1747. The AF magnet may be disposed on a side of the AF bracket 1741 facing the AF coil 1743. The AF bracket 1741 may be driven by an attractive force or a repulsive force (or a Lorentz force) between the AF magnet and the AF coil. The moving path of the AF bracket 1741 may be guided by a guide groove (e.g., a track disposed in the AF bracket 1741) configured to guide the AF ball 1747 movable therein. When the AF bracket 1741 moves, the image sensor disposed on the AF bracket 1741 moves, so that a focus control function can be performed.

[0162] The camera module 400 according to an embodiment may include an OIS actuator configured to provide an optical image stabilization function. Fig.17 , the OIS actuator may include an OIS bracket 1751, a y-axis OIS coil 1753, a y-axis OIS magnet 1755, an x-axis OIS coil 1754, an x-axis OIS magnet 1756, and an OIS ball 1757. The y-axis OIS magnet 1755 may be disposed on a side of the OIS bracket 1751 facing the y-axis OIS coil 1753. The x-axis OIS magnet 1756 may be disposed on a side of the OIS bracket 1751 facing the x-axis OIS coil 1754. The OIS bracket 1751 may be driven by an attractive force, a repulsive force, or a Lorentz force acting between the y-axis OIS coil 1753 and the y-axis OIS magnet 1755 and / or an attractive force, a repulsive force, or a Lorentz force acting between the x-axis OIS coil 1754 and the x-axis OIS magnet 1755. The movement of the OIS bracket 1751 may be guided by a guide groove (e.g., a track provided in the OIS bracket 1751) provided to allow the OIS ball 1757 to move therein. As the OIS bracket 1751 is driven, the image sensor provided on the OIS bracket 1751 moves, so that the optical image stabilization function can be performed.

[0163] The camera module 400 according to an embodiment may further include a z-axis stopper 1760 and a circuit board 1770. The z-axis stopper 1760 may limit the range of movement of the OIS bracket 1751 and / or the AF bracket 1741 in the z-axis direction. The circuit board 1770 may be connected to at least one of the AF coil 1743, the y-axis OIS coil 1753, or the x-axis OIS coil 1754. The circuit board 1770 may include a flexible printed circuit board.

[0164] Fig.17 The components of the camera module 400 shown are for illustrating an embodiment, and the camera module 400 according to an embodiment may further include other components, or some of the components may be omitted. Alternatively, the camera module 400 may include Fig.17According to one embodiment, as Fig.17 The magnets and coils of the OIS actuator or AF actuator shown may be replaced with solenoid types other than the Lorentz type. For example, Fig.17 The camera module 400 is shown in which the OIS bracket 1751 and the AF bracket 1741 are guided by using the OIS ball 1757 and the AF ball 1747, but at least one of the OIS bracket 1751 and the AF bracket 1741 may be replaced with a type guided by using a wire.

[0165] Fig.18 is a diagram illustrating a camera module including a dove prism 1733 according to an embodiment, which allows an image sensor to receive light in a direction opposite to a direction in which the light enters the camera module.

[0166] In an embodiment, the camera module may include an image sensor 110 disposed on a circuit board 111, a flexible circuit board 120 connected to the circuit board 111, a lens 431, and a dove prism 1733. The dove prism 1733 may be configured to guide a path of light so that light entering in a first direction 1801 is incident on the image sensor 110 in a second direction 1802 substantially opposite to the first direction 1801. The flexible circuit board 120 may include a slit disposed between regions where the conductive lines are arranged.

[0167] Fig.19 is a diagram illustrating an example of a camera module in which a circuit connector according to an embodiment does not include a slit.

[0168] In one embodiment, the camera module may include an image sensor 110 disposed on a circuit board 111, a flexible circuit board 120 connected to the circuit board 111, a lens 431, and a dove prism 1733. The dove prism 1733 may be configured to guide a path of light so that light entering in a first direction 1801 is incident on the image sensor 110 in a second direction 1802 substantially opposite to the first direction 1801. The flexible circuit board 120 may not include Fig.18 The slit shown in FIG.

[0169] Fig. 20 is a diagram illustrating an example of a camera module in which a circuit connector according to an embodiment does not include a slit.

[0170] Fig. 20 The illustrated example shows a camera module including a flexible circuit board 120 without slits, instead of Figure 7In one embodiment, the camera module may include a rhombus 1433 configured to allow light entering through the lens 431 in a first direction 2001 to be incident on an image sensor mounted on the circuit board in a second direction 2002 substantially parallel to the first direction 2001.

[0171] Fig.21 is a diagram illustrating a direction in which a circuit connector may be deformed to allow movement of an image sensor when an optical image stabilization function or an auto focus function is performed according to an embodiment.

[0172] In one embodiment, even when no slits are provided in the operating sections 711 , 712 , and 713 of the flexible circuit board, the position of the image sensor 110 may be shifted because the flexible circuit board is made of a flexible material.

[0173] When the electronic device detects at least one component of movement in the pitch axis direction, yaw axis direction or roll axis direction of the camera module, the electronic device can drive the actuator included in the camera module so that the image sensor moves in at least one of the x-axis direction or the y-axis direction or changes its posture to perform optical image stabilization.

[0174] The circuit connector 100 of the camera module according to an embodiment may include at least one operating section, the shape of which may be deformed according to the movement of the image sensor 110. For the convenience of description, Figure 8 An embodiment is shown in which the circuit connector 100 includes a first operating section 711 extending from the image sensor 110 , a second operating section 712 extending from the first operating section 711 , and a third operating section 713 connected from the second operating section 712 to the fixing portion 140 .

[0175] The image sensor 110 may be moved by driving the actuator. When the image sensor 110 moves in the x-axis direction 720 with respect to the fixed portion 140, the movement of the image sensor 110 in the x-axis direction 720 may be allowed while the second section 712 is deformed. When the image sensor 110 moves in the y-axis direction 730 with respect to the fixed portion 140, the movement of the image sensor 110 in the y-axis direction 730 may be allowed while the third section 713 is deformed. The image sensor 110 may perform a roll rotation around the z-axis to perform optical image stabilization. When the image sensor 110 performs a roll rotation 740, the roll rotation 740 of the image sensor 110 may be allowed while the first section 711 and the third section 713 are deformed. According to the roll rotation 740 of the image sensor 110, the flexible circuit board including the first section 711 and the third section 713 may be deformed while being displaced and rotated on the xy plane.

[0176] For an auto focus (AF) function, the image sensor may move in the z-axis direction. When the image sensor 110 moves in the z-axis direction 750 with respect to the fixed portion 140 , the movement of the image sensor 110 in the z-axis direction 750 may be allowed while the first section 711 is deformed.

[0177] Fig.21 The operation of the circuit connector 100 according to an embodiment is shown, and the description that "some segments are deformed" does not necessarily mean that the remaining segments are not deformed. In addition, in addition to the operation of the circuit connector 100 described above, the movement of at least one of the position or posture of the image sensor 110 can also be performed by the operation of another segment.

[0178] like Fig.21 As shown, according to various embodiments, the operation direction of the flexible circuit board included in the circuit connector 100 may be changed according to the extension direction and the bending or curving position of the flexible circuit board. However, the concept that at least one of the position or posture of the image sensor is changed while the flexible circuit board is deformed in the operation direction and the low repulsive force is generated may be equally applicable.

[0179] A section of the circuit connector 100 that is deformable as the image sensor is moved may be referred to as an operating section or operating portion. A section of the circuit connector 100 that is not deformed and maintains a fixed shape even when the image sensor 110 is moved may be referred to as a fixed section or fixed portion.

[0180] Fig. 22 2 is a diagram illustrating a circuit connector 100 and a camera module 400 including the circuit connector 100 according to an embodiment, in which a region 2210 that is bent without a slit is included in operating sections 711 , 712 , and 713 of a flexible circuit board.

[0181] The circuit connector 100 of the camera module 400 according to an embodiment may include a flexible circuit board 2220 in which there is no slit. The bending area 2210 may be included in the operating sections 711, 712, and 713 of the flexible circuit board 2220. The bending area 2210 may be configured to shift the position of the first operating section 711 so that one end of the first operating section 711 is connected to one end of the second operating section 712.

[0182] The camera module 400 according to an embodiment may further include a rhombus prism 1733 .

[0183] Fig.23An example in an embodiment is shown, in which the flexible circuit board is disposed on substantially the same plane as the image sensor, the circuit connector includes a bending area in the operating section, and the circuit connector is installed in a camera module including a rhombus prism.

[0184] In an embodiment, the camera module 400 may include a diamond prism 1733 arranged so that light entering through the lens 431 in a first direction 2361 is incident on the image sensor 110 in a second direction 2362 substantially parallel to the first direction 2361 .

[0185] Fig.24 The camera module 400 is shown in an embodiment where the direction from which light enters and the direction from which light is received by the sensor are substantially the same.

[0186] In an embodiment, the camera module 400 may include a diamond prism 1733 arranged so that light entering through the lens 431 in a first direction 2361 is incident on the image sensor 110 in a second direction 2362 substantially parallel to the first direction 2361 .

[0187] In one embodiment, the camera module 400 may include a flexible printed circuit board extending from the substrate 111 on which the image sensor 110 is mounted in the third direction 2451 without a slit and extending in the fourth direction 2452 from one end extending in the third direction 2451. The flexible printed circuit board extending in the fourth direction 2452 may be connected to the fixing portion 2440.

[0188] Fig.25 FIG. 1 is a diagram showing a camera module (eg Figure 4 or Fig.17 Configuration diagram of the optical path in the optical system of the camera module 400). Fig.25 An example of an optical system including a rhombus prism is shown.

[0189] In one embodiment, the optical system (eg Figure 4 The prism 433 in the lens 431 and the prism included in the lens 431, Fig.15 The lens assembly 1510, Fig.17 The lens 1731 and the prism 1733 in the embodiment may provide a first optical path by refracting or reflecting light at least twice. Fig.25 , the first light path may be indicated by a dotted line, and light traveling along the first light path may follow the Fig.25, "IL", "RL1", "RL2", "RL3" and "RL4" indicated in . In one embodiment, the first optical path may be an optical path that passes through the center of a lens included in the optical system and is substantially vertically incident on the image sensor. According to one embodiment, the first optical path may be provided by at least one reflective member included in the optical system and at least one lens that may be additionally provided to the at least one reflective member. For example, the optical system may include a reflective member 2513. The reflective member 2513 may include, for example, a trapezoidal prism or a reflective mirror structure. When the reflective member 2513 has a parallel trapezoidal prism or a reflective mirror structure, the reflective member 2513 may include, for example, a first reflective surface 2513a, a second reflective surface 2513b, a third reflective surface 2513c and a fourth reflective surface 2513d. In Fig.25 In the embodiment shown in , the first reflective surface 2513a and the fourth reflective surface 2513d may be parallel to each other, and the second reflective surface 2513b and the third reflective surface 2513c may be parallel to each other. Fig.25 In the embodiment shown in , the reflective member 2513 may include a parallelogram prism or a reflector structure. However, the optical system in the embodiments of the present disclosure is not limited thereto. For example, the first reflective surface 2413a and the fourth reflective surface 2513d may form an equilateral trapezoid having the second reflective surface 2513b or the third reflective surface 2513c as a base and having two equal internal angles (base angles). In one embodiment, the reflective member 2513 included in the optical system of the camera module may include an integrated trapezoidal prism or a reflector structure. Alternatively, the reflective member 2513 having a trapezoidal prism or a reflector structure may be provided by combining and / or joining a plurality of prisms or reflector pieces.

[0190] In one embodiment, the optical system of the camera module may include a plurality of reflective components. For example, the optical system may provide a first light path by including at least two reflective components to refract or reflect light at least twice. When the optical system includes a plurality of reflective components, at least one lens system may be further included among the plurality of reflective components.

[0191] In one embodiment, the optical system may further include an infrared blocking filter (not shown). The optical system of the camera module may further include a lens system (e.g., a lens system 2531 including lenses 2531a and 2531b) configured to guide or focus light IL incident from the outside to at least one reflective member 2513. In one embodiment, the first lens (e.g., the first lens 2531a) disposed on the object side of the lens group 2531 or the optical system may have a refractive power. For example, since the first lens 2531a is configured to focus or align light IL incident from the outside to at least one reflective member 2513, the optical system from the lens 2531 to the image sensor 110 can be miniaturized. A camera including an optical system including the lens group 2531 may be referred to as a "lens lead-type camera". According to one embodiment, the lens group 2531 may further include an additional lens 2531b to focus or align light incident from the outside.

[0192] In one embodiment, the camera module 400 may include a dove-type prism having a trapezoidal shape instead of Fig.25 The rhombus-shaped prism shown in FIG. Fig.25 , the trapezoidal prism or reflector structure (or parallelogram prism or reflector structure) and the refractive optical system including the same can be designed so that only the light refracted or reflected by each of the first reflective surface 2513a, the second reflective surface 2513b, the third reflective surface 2513c and the fourth reflective surface 2513d, that is, only the light refracted or reflected four times is incident on the image sensor. In one embodiment, as Fig.25 As shown, at least some of the light refracted or reflected by the reflective member 2513 may enter the image sensor 110 through a second light path different from the first light path. The second light path may be a path indicated by a single dotted line. The light traveling along the second light path may follow Fig.25 Paths indicated by "IL", "RL1" and "RL2'" in FIG. For example, in a trapezoidal prism or mirror structure (or a parallelogram prism or mirror structure) and a refractive optical system including the same, light refracted or reflected by the first reflective surface 2513a and the second reflective surface 2513b, that is, light refracted or reflected twice can be incident on the image sensor 110. An image obtained by such light may be output as foggy due to the occurrence of flare.

[0193] In one embodiment of the present disclosure, the prism included in the camera module 400 may be a prism having Figure 4 The prism 433 of the shape shown in FIG. The prism included in the camera module 400 may be a prism having Fig.17The prism 1733 of the shape shown in FIG. The components included in the embodiments described in the present disclosure can be used in combination with each other. For example, Figures 17 to 20 as well as Figure 22 to Figure 25 The rhombus-shaped or dove-shaped (parallelogram or trapezoidal) prism 1733 shown in FIG. 1 may be included in a configuration including a Figures 1 to 13 The slits in the flexible circuit board of the camera module 400 are shown.

[0194] According to an embodiment of the camera module (eg Figure 4 Camera module 400 or Fig.14 The camera 1480 may include: a first circuit board (eg Figure 5 111), which is electrically connected to the image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 1210) or includes an image sensor (e.g. Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 an image sensor 1210); an actuator configured to control a camera module (eg Figure 4 Camera module 400 or Fig.14 at least one of the position or posture of the first circuit board within the camera module 1480); a flexible circuit board (e.g., a flexible circuit board extending from at least one side surface of the first circuit board) Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 Flexible circuit board 1220); multiple slits (e.g. Figure 1 The slits 122 are provided on a plurality of conductive lines (eg Figure 1The flexible circuit board may include a first section (e.g., a first section) drawn out or extended from the first circuit board in a first direction. Figure 8 The flexible circuit board may include a second section (eg, Figure 8 The second operating section 712 in the embodiment of the present invention is provided in the embodiment of the present invention, wherein the second section extends from one end of the first section along a second direction different from the first direction or is fixed to the camera module (eg, Figure 4 Camera module 400 or Fig.14 The flexible circuit board may be deformed as the actuator is driven.

[0195] According to an embodiment of the present invention, a flexible circuit board (eg Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 The flexible circuit board 1220 may include a curved section between the first section and the second section, in which the direction in which the flexible circuit board extends changes. A smaller number of slits may be formed in the curved section than in the first section, or no slits may be formed.

[0196] According to an embodiment of the camera module (eg Figure 4 Camera module 400 or Fig.14 The camera 1480) may further include an optical system (e.g. Figure 4 Lens 431, Figure 4 Prism 433, Figure 7 The lens barrels 431-1 and 431-2 or Fig.12 1231), which is configured to guide light incident from a subject to an image sensor (eg, Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The flexible circuit board is pulled out at a position deviated from the central axis on at least one side surface of the first circuit board, and the central axis corresponds to the optical axis of the optical system (eg Figure 1 The central axis 113).

[0197] According to an embodiment of the camera module (eg Figure 4 Camera module 400 or Fig.14 The camera module 1480 may include a housing (eg, Figure 4 The flexible circuit board may be arranged around the optical system along at least one surface of the housing.

[0198] According to an embodiment, the optical system may include a refractive optical system, through which light incident from an object reaches an image sensor (eg, Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The light path of the image sensor 1210) is refracted at least twice.

[0199] According to one embodiment, an image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The image sensor 1210) is arranged so that the light detection surface is oriented in a direction opposite to the direction in which light is incident from the object to the optical system.

[0200] According to one embodiment, an image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The image sensor 1210) is arranged so that the light detection surface is oriented in the same direction as the direction in which light is incident from the object to the optical system.

[0201] According to an embodiment, the flexible circuit board may further include a third section extending along a third direction different from the second direction (eg Figure 3 The third operating section 713).

[0202] According to an embodiment, the flexible circuit board may be configured such that when the first circuit board is moved in the first direction by operation of the actuator, the second section is deformed.

[0203] According to an embodiment, the flexible circuit board may be configured such that when the first circuit board is moved in the second direction by operation of the actuator, the third section is deformed.

[0204] According to an embodiment, the flexible circuit board may be configured such that when the first circuit board is rotated by operation of the actuator, the first section and the third section are deformed.

[0205] According to an embodiment, the actuator may include an autofocus actuator configured to provide an autofocus function. The flexible circuit board may be configured such that the first section deforms as the autofocus actuator is driven.

[0206] According to an embodiment, the flexible circuit board may include a folded and bent section between the first section and the second section in which the flexible circuit board is folded, and the reinforcement may be attached to the bent section.

[0207] According to an embodiment of the camera module (eg Figure 4 Camera module 400 or Fig.14 The camera 1480 may include: a first circuit board electrically connected to the image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 1210) or includes an image sensor (e.g. Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12an image sensor 1210); an actuator configured to control a camera module (eg Figure 4 Camera module 400 or Fig.14 The camera module 1480 of the embodiment of the present invention comprises at least one of the position or posture of the first circuit board in the camera module 1480 of the embodiment of the present invention; a flexible circuit board drawn out and extended from at least one side surface of the first circuit board; a plurality of slits provided between adjacent conductive lines among a plurality of conductive lines mounted on the flexible circuit board; and a second circuit board connected to one end of the flexible circuit board. The flexible circuit board may include a first section and a second section, the first section being drawn out from a position deviated from the central axis of the first circuit board to one side and extending in a first direction, and the second section extending from one end of the first section in a second direction different from the first direction.

[0208] According to an embodiment, the optical system may include a refractive optical system, wherein light incident from an object passes through the refractive optical system to reach an image sensor (eg, Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The light path of the image sensor 1210) is refracted at least twice.

[0209] According to one embodiment, an image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The image sensor 1210) is arranged so that the light detection surface is oriented in a direction opposite to the direction in which light is incident from the object to the optical system.

[0210] According to one embodiment, an image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 The image sensor 1210) is arranged so that the light detection surface is oriented in the same direction as the direction in which light is incident from the object to the optical system.

[0211] According to an electronic device (eg Figure 6 Electronic equipment 600 or Fig.14 The electronic device 1400 may include: a camera module; a circuit board electrically connected to an image sensor (eg Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 1210) or includes an image sensor (e.g. Figure 1 The image sensor 110, Figure 4 The image sensor 110, Figure 5 The image sensor 110, Figure 7 The image sensors 110 - 1 and 110 - 2, Figure 8 The image sensor 110, Figure 4 Image sensor 1010, Fig.11 The image sensor 1110 or Fig.12 an image sensor 1210); an actuator configured to control a camera module (eg Figure 4 Camera module 400 or Fig.14 at least one of the position or posture of the circuit board within the camera module 1480); a fixed portion, which is fixed within the electronic device; and a flexible circuit board (eg Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 A flexible circuit board 1220) interconnects the circuit board and the fixed part and deforms as the actuator is driven. A plurality of slits may be formed in the operating section.

[0212] According to one embodiment, a flexible circuit board (eg Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 The flexible circuit board 1220 may include a plurality of conductive lines. A plurality of slits may be arranged parallel to the conductive lines.

[0213] According to one embodiment, a flexible circuit board (eg Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 The flexible circuit board 1220 can be used in the operating section (e.g. Figure 8 The operating sections 711, 712 and 713 in the embodiment include a bending section in which a flexible circuit board (eg Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 The direction in which the flexible circuit board 1220 extends is changed. Figure 1 Flexible circuit board 120, Figure 5 Flexible circuit board 120, Figure 7 Flexible circuit boards 120 - 1 and 120 - 2, Fig.10 Flexible circuit board 1020, Fig.11 Flexible circuit board 1120 or Fig.12 The flexible circuit board 1220) can be configured so that within the bending section, the conductive lines are bonded together without gaps between adjacent conductive lines.

[0214] The method according to the embodiment described in the claims or the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0215] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors in an electronic device. The one or more programs include instructions that cause an electronic device to execute a method according to an embodiment described in a claim or specification of the present disclosure.

[0216] These programs (software modules or software) may be stored in non-volatile memory including random access memory (RAM) and flash memory, read-only memory (ROM), electrically erasable programmable ROM (EEPROM), magnetic disk storage, compact disk ROM (CD-ROM), digital versatile disk (DVD), other types of optical storage, or magnetic tape cassettes. Alternatively, the program may be stored in a memory configured with a combination of some or all of these devices. In addition, each configuration memory may be included in multiple quantities.

[0217] In addition, the program can be stored in an attachable storage device that can be accessed through a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a communication network configured with a combination of the above communication networks. Such a storage device can be connected to the device for executing the embodiments of the present disclosure via an external port. In addition, a separate storage device on a communication network can be connected to the device for executing the embodiments of the present disclosure.

[0218] In the above-mentioned specific embodiments of the present disclosure, the components included in the present disclosure have been described in singular or plural terms according to the specific embodiments introduced. However, the singular or plural expressions are appropriately selected for the situation introduced to facilitate the description, and the present disclosure is not limited to singular constituent elements or plural constituent elements. The constituent elements described in plural form can be configured with singular elements, or the constituent elements described in singular form can be configured with multiple elements.

[0219] Meanwhile, in the detailed description of the present disclosure, specific embodiments have been described, but various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be determined based not only on the attached claims but also on the equivalents of the claims.

Claims

1. A camera module, comprising: A first circuit board electrically connected to the image sensor or a circuit board including the image sensor; an actuator configured to control at least one of a position or a posture of the first circuit board within the camera module; A flexible circuit board, drawn out from at least one side surface of the first circuit board and extending; a plurality of slits disposed between adjacent conductive lines among a plurality of conductive lines mounted on the flexible circuit board; as well as a second circuit board, electrically connected to one end of the flexible circuit board, wherein the flexible circuit board comprises a first section extending from the first circuit board along a first direction and a second section extending from one end of the first section along a second direction different from the first direction, and The flexible circuit board is configured to deform as the actuator is driven.

2. The camera module according to claim 1, wherein the flexible circuit board further comprises a bent section between the first section and the second section, in which a direction in which the flexible circuit board extends is changed, and The curved section comprises a smaller number of slits than the first section or comprises no slits.

3. The camera module according to claim 1, further comprising an optical system configured to guide light incident from a subject to the image sensor, The flexible circuit board is pulled out at a position deviated from a central axis on the at least one side surface of the first circuit board, and the central axis corresponds to an optical axis of the optical system.

4. The camera module according to claim 3, further comprising a housing accommodating the first circuit board and the optical system, The flexible circuit board is arranged around the optical system along at least one surface of the housing. 5 . The camera module of claim 3 , wherein the optical system comprises a refractive optical system in which an optical path through which light incident from the object reaches the image sensor is refracted at least twice. 6 . The camera module of claim 5 , wherein the image sensor is arranged such that a light detection surface is oriented in a direction opposite to a direction in which light is incident from the object to the optical system. 7 . The camera module of claim 5 , wherein the image sensor is disposed such that a light detection surface is oriented in the same direction as a direction in which light is incident from the object to the optical system. 8 . The camera module of claim 1 , wherein the flexible circuit board further comprises a third section extending in a third direction different from the second direction. 9 . The camera module of claim 8 , wherein the second section is deformed as the first circuit board moves in the first direction as the actuator is driven. 10 . The camera module of claim 8 , wherein the third section is deformed as the first circuit board moves in the second direction as the actuator is driven. 11 . The camera module of claim 8 , wherein as the first circuit board rotates as the actuator is driven, the first section and the third section are deformed.

12. The camera module of claim 8, wherein the actuator comprises an autofocus actuator configured to provide an autofocus function, and As the autofocus actuator is driven, the first segment deforms. 13 . The camera module of claim 1 , wherein the flexible circuit board includes a folded and bent section between the first section and the second section, and a reinforcement member is attached to the bent section.

14. An electronic device comprising a camera module, the electronic device comprising: a circuit board electrically connected to the image sensor or a circuit board including the image sensor; an actuator configured to control at least one of a position or a posture of the circuit board within the camera module; A fixed part, fixed in the electronic device; as well as a flexible circuit board interconnecting the circuit board and the fixed portion and including an operating section that is deformed as the actuator is driven, A plurality of slits are formed in the operating section.

15. The electronic device according to claim 14, wherein the flexible circuit board comprises a plurality of conductive lines, and The plurality of slits are disposed parallel to the conductive wires.

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