Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device, and relates to the technical field of display. The display panel has a frame area, the frame area includes a display area, a bending area and a dam area connected in sequence, the frame area is bent towards the backlight side of the display panel, and the bending position of the frame area is the bending area; wherein the display panel comprises: a substrate; an encapsulation layer located on one side of the substrate, the encapsulation layer comprises a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer are arranged along a direction parallel to the substrate, the second organic encapsulation layer is located in the bending area, and the elastic modulus of the second organic encapsulation layer is smaller than that of the first organic encapsulation layer; and a dam located in the dam area, the second organic encapsulation layer is located between the dam and the first organic encapsulation layer. The application can achieve the purpose of reducing the width of the frame area through bending.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] In an Organic Light-Emitting Diode (OLED) display panel, the panel can be composed of two parts: the display area AA and the bezel area NA. In pursuit of better visual effects, display panels are evolving towards smaller bezels. This necessitates both reducing the width of the bezel area and ensuring its encapsulation effect, which presents a significant challenge to packaging technology. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device, to reduce the size of the bezel area while ensuring the encapsulation effect of the bezel area.

[0004] This application provides a display panel having a border area, the border area including a near-display area, a bending area, and a dam area connected in sequence, the border area being bent toward the backlight side of the display panel, the bending position of the border area being the bending area; wherein, the display panel includes: a substrate; an encapsulation layer located on one side of the substrate, the encapsulation layer including a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer being arranged in a direction parallel to the substrate, the second organic encapsulation layer being located in the bending area, the elastic modulus of the second organic encapsulation layer being less than the film elastic modulus of the first organic layer; a dam located in the dam area, the second organic layer encapsulation being located between the dam and the first organic encapsulation layer.

[0005] According to one embodiment of this application, the border area includes an arc-shaped bend located at a corner of the display panel and a straight bend connecting adjacent arc-shaped bends, wherein the straight bend and the arc-shaped bend are located in the bend area and the embankment area; wherein the arc-shaped bend has at least one seam, and the arc-shaped bend is spliced ​​at the seam.

[0006] According to one embodiment of this application, the number of seams in the arc-angle bend is multiple, and the multiple seams are arranged at intervals around the arc-angle center of the arc-angle bend; preferably, the multiple seams are evenly distributed around the arc-angle center of the arc-angle bend; preferably, the number of seams in the multiple arc-angle bends is the same.

[0007] According to one embodiment of this application, the arc-shaped bend is bonded and fixed at the joint.

[0008] According to one embodiment of this application, the encapsulation layer further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, wherein the first organic encapsulation layer and the second organic encapsulation layer are located on the side of the first inorganic encapsulation layer opposite to the substrate, and the second inorganic encapsulation layer is located on the side of the first organic encapsulation layer, the second organic encapsulation layer and the first inorganic encapsulation layer opposite to the substrate; preferably, at least a portion of the first organic encapsulation layer is located in the near-display area; preferably, the dam includes a first dam arranged in a ring; preferably, the dam further includes a second dam, the second dam being arranged around the outside of the first dam; preferably, the portions of the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer, the second organic encapsulation layer and the dam located on both sides of the seam are spliced ​​at the seam position.

[0009] According to one embodiment of this application, a groove is provided on the side of the second organic encapsulation layer facing the first organic encapsulation layer, and the groove extends along the extension direction of the second organic encapsulation layer; preferably, the cross-sectional shape of the groove includes an arc shape.

[0010] According to one embodiment of this application, it further includes: an encapsulation deposition layer that covers and encapsulates the substrate, the encapsulation layer, and the dam.

[0011] This application also provides a method for manufacturing a display panel, comprising: providing a substrate; preparing a dam on one side of the substrate; preparing a second organic encapsulation layer on one side of the substrate; and bending the display panel at the location of the second organic encapsulation layer.

[0012] According to one embodiment of this application, after the step of preparing the second organic encapsulation layer on one side of the substrate, the method further includes: etching a groove on the sidewall of the second organic encapsulation layer away from the dam; preferably, a portion of the first organic encapsulation layer is located in the groove; preferably, before the step of preparing the second organic encapsulation layer on one side of the substrate, the method further includes: preparing a first inorganic encapsulation layer on the substrate and the dam; preferably, preparing the second organic encapsulation layer on one side of the substrate includes: preparing the second organic encapsulation layer on the first inorganic encapsulation layer; preparing the first organic encapsulation layer on the side of the second organic encapsulation layer away from the dam includes: preparing the first organic encapsulation layer on the first inorganic encapsulation layer; preferably, before bending the display panel at the location of the second organic encapsulation layer, the method further includes: preparing the second inorganic encapsulation layer on the side of the first inorganic encapsulation layer, the first organic encapsulation layer, and the second organic encapsulation layer away from the substrate. The method further includes, preferably, before bending the display panel at the second organic encapsulation layer, etching a lateral groove at the curved corner bending portion of the display panel, the curved corner bending portion being located at the corner of the display panel, the lateral groove penetrating the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the dam in a direction perpendicular to the substrate; bending the display panel at the second organic encapsulation layer includes bending the display panel at the second organic encapsulation layer to splice the curved corner bending portion at the lateral groove to form a seam; preferably, it further includes: applying adhesive to fix the seam; preferably, it further includes: performing encapsulation deposition to form the encapsulation deposition layer, the encapsulation deposition layer covering part of the seam; preferably, the encapsulation deposition layer completely covers the seam; preferably, performing encapsulation deposition to form the encapsulation deposition layer includes: performing encapsulation deposition using atomic layer deposition to form the encapsulation deposition layer.

[0013] This application also provides a display device, including the display panel of the above embodiments; or, including a display panel prepared by the above-described display panel preparation method.

[0014] According to the display panel and its manufacturing method and display device provided in the embodiments of this application, a second organic encapsulation layer is provided in the bending area, and the elastic modulus of the second organic encapsulation layer is less than that of the first organic encapsulation layer. During the bending process of the bending area of ​​the display panel, the second organic encapsulation layer can undergo adaptive changes to ensure the encapsulation effect. It can be seen that this application can achieve the purpose of reducing the width of the bezel area by bending. Attached Figure Description

[0015] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0016] Figure 1 It is a top view of a display panel.

[0017] Figure 2 This is a schematic diagram of the cross-sectional structure of a display panel.

[0018] Figure 3 This is a schematic diagram of the cross-sectional structure of a display panel in an unbent state according to an embodiment of this application.

[0019] Figure 4 This is a top view of a display panel provided in an embodiment of this application in its unbent state.

[0020] Figure 5 This is a schematic diagram of the side groove structure of a display panel provided in an embodiment of this application.

[0021] Figure 6 This is a schematic diagram of the corner positions of a display panel in a bent state according to an embodiment of this application.

[0022] Figure 7 This is a schematic diagram of the side groove structure of a display panel provided in another embodiment of this application.

[0023] Figure 8 This is a schematic diagram of the cross-sectional structure of a display panel in an unbent state, provided in another embodiment of this application.

[0024] Figure 9 This is one of the flowcharts of a method for preparing a display panel according to an embodiment of this application.

[0025] Figure 10 This is a second flowchart of a method for preparing a display panel according to an embodiment of this application.

[0026] Figure label:

[0027] AA, Display area; NA, Bezel area; NA1, Near display area; NA2, Bending area; NA3, Dam area; NA4, Straight bending section; NA5, Arc-angle bending section; B, Backlight side; 100, Substrate; 200, Encapsulation layer; 210, First inorganic encapsulation layer; 220, First organic encapsulation layer; 230, Second organic encapsulation layer; 231, Barrier groove; 240, Second inorganic encapsulation layer; 300, Dam; 400, Side groove; 410, Seam. Detailed Implementation

[0028] In pursuit of better visual effects, mobile phone screens are evolving towards smaller bezels. With the development of narrow bezel technology, the need to balance a large aperture area for the screen display with a well-designed narrow bezel enclosure presents a significant challenge to packaging technology.

[0029] Combination Figure 1 and Figure 2 In an organic light-emitting diode (OLED) display panel, the panel can be composed of two parts: the display area AA and the bezel area NA. The current packaging structure adopts an inorganic / organic / inorganic stacked structure. The bezel area NA is mainly composed of the dam 300 (Dam) and the edge overlap area of ​​the inorganic layer. In order to pursue better visual effects, display panels are developing towards reducing the bezel size. Therefore, it is necessary to reduce the width of the bezel area NA while ensuring the packaging effect of the bezel area NA. This requirement makes the packaging technology face more severe challenges.

[0030] Normally, to avoid organic layer overflow, two dams 300 are required, which results in a larger bezel width. If a narrow bezel is desired, the package edge size needs to be further reduced, which requires reducing the width of the dam area NA3. However, both reducing the package edge size and reducing the width of the dam area NA3 can easily lead to organic layer leakage.

[0031] In view of this, this application provides a display panel and its manufacturing method and display device. The bending area NA2 of the display panel is provided with a second organic encapsulation layer 230, and the material of the second organic encapsulation layer 230 is a flexible organic material. During the bending process of the bending area NA2 of the display panel, the second organic encapsulation layer 230 can undergo adaptive changes to ensure the encapsulation effect. It can be seen that this application can achieve the purpose of reducing the width of the bezel area NA by bending.

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0036] Figure 3 This is a schematic cross-sectional view of a display panel in an unbent state according to an embodiment of this application. Figure 4 This is a top view of a display panel provided in an embodiment of this application in its unbent state. The aforementioned unbent state refers to the state of the display panel in this embodiment before the bezel area NA bending process is performed during manufacturing.

[0037] like Figure 3 and Figure 4 As shown, the display panel in this embodiment has a display area AA and a bezel area NA surrounding the display area AA. The bezel area NA includes a near display area NA1, a bending area NA2, and a dam area NA3 connected in sequence. The near display area NA1 is located between the display area AA and the bending area NA2. The dam area NA3 connects to the side of the bending area NA2 away from the near display area NA1. The bezel area NA bends towards the backlight side B of the display panel, and the bending position of the bezel area NA is the bending area NA2. By arranging the bending area NA2 in the bezel area NA, a display panel structure in which the bezel area NA bends towards the backlight side B can be formed, which can meet the user's need for a small bezel.

[0038] The display panel includes a substrate 100, an encapsulation layer 200, and a dam 300. The encapsulation layer 200 is located on one side of the substrate 100 and includes a first organic encapsulation layer 220 and a second organic encapsulation layer 230. The first and second organic encapsulation layers 220 are arranged parallel to the substrate. At least a portion of the first organic encapsulation layer 220 is located near the display area NA1, and the elastic modulus of the second organic encapsulation layer 230 is less than that of the first organic encapsulation layer 220. The dam 300 is located in the dam area NA3, and the second organic encapsulation layer 230 is located on the side of the first organic encapsulation layer 220 facing the dam 300. In this embodiment, the second organic encapsulation layer 230 has a lower elastic modulus than the first organic encapsulation layer 220, and is located in the bending area NA2, which effectively reduces the stress in the bending area NA2, making the display panel easier to bend in the bending area NA2.

[0039] In some embodiments, the encapsulation layer 200 further includes a first inorganic encapsulation layer 210 and a second inorganic encapsulation layer 240, wherein the first organic encapsulation layer 220 and the second organic encapsulation layer 230 are located on the side of the first inorganic encapsulation layer 210 away from the substrate 100. The second inorganic encapsulation layer 240 is located on the side of the first organic encapsulation layer 220, the second organic encapsulation layer 230 and the first inorganic encapsulation layer 210 away from the substrate 100, and the dam 300 is located on the side of the first inorganic encapsulation layer 210 close to the substrate 100.

[0040] The elastic modulus of the second organic encapsulation layer 230 is less than that of the first organic encapsulation layer 220, which facilitates bending at the location of the second organic encapsulation layer 230. In addition, the second organic encapsulation layer 230 can also seal the first organic encapsulation layer 220, thereby ensuring the anti-overflow effect after the display panel is bent.

[0041] Optionally, the flexible organic material used in the second organic encapsulation layer 230 is a low-elasticity modulus organic encapsulation material. Low-elasticity modulus organic encapsulation materials mainly refer to low-elasticity modulus silicone sealant, a sealing material with characteristics such as high elasticity, low elasticity modulus, resistance to high and low temperatures, chemical corrosion, and ultraviolet radiation. Its main component is silicone resin. The low elasticity modulus characteristic of low-elasticity modulus silicone sealant means that it has a small deformation under stress and good resilience, maintaining a long-term stable sealing effect. At the same time, it also has good adhesion and wear resistance, effectively protecting the sealed object.

[0042] Combination Figure 4 and Figure 5 In one embodiment of this application, the border area NA includes an arc-shaped bend NA5 located at the corner of the display panel and a straight bend NA4 connecting adjacent arc-shaped bends NA5. The straight bend NA4 and the arc-shaped bend NA5 are located in the bend area NA2 and the embankment area NA3. The aforementioned corner location refers to the corner position, that is, the position where adjacent sides of the display panel meet. For example, if the display panel is a near-rectangular panel with four rounded corners, then the corner locations of the display panel are the four rounded corner positions. If the border area NA of the display panel is generally annular, then the display panel includes four straight bends NA4 located at the four sides and arc-shaped bends NA5 located at the four corner locations.

[0043] Combination Figure 6 The curved bend NA5 has at least one seam 410, at which the curved bend NA5 is spliced.

[0044] During the manufacturing process of the display panel, at least one side groove 400 can be etched in the arc-angle bend NA5. The opening of the side groove 400 faces the outer edge of the arc-angle bend NA5 (the side away from the display area AA). In the stacking direction of the first inorganic encapsulation layer 210, the second inorganic encapsulation layer 240 and the substrate 100, the side groove 400 penetrates the frame area NA. After the arc-angle bend NA5 is bent, the two side walls of the side groove 400 abut against each other, thereby forming a seam 410.

[0045] When bending the display panel, the straight bending portion NA4 can be bent directly without wrinkles, thus not affecting the encapsulation effect or aesthetics. However, the curved bending portion NA5 will wrinkle during bending, which can easily lead to encapsulation failure and overflow. In this embodiment, by setting a seam 410 structure in the curved bending portion NA5, the necessary shortening space for bending can be provided for the curved bending portion NA5, avoiding wrinkles and ensuring the encapsulation effect after bending.

[0046] Optionally, in one embodiment, the number of seams 410 in the arc-angle bend NA5 is multiple, and the multiple seams 410 are arranged at intervals. Setting multiple seams 410 means etching multiple corresponding side grooves 400 during the fabrication process, which has the following advantages: First, by having multiple side grooves 400 collectively provide the space required for shortening, the width of a single side groove 400 can be reduced, thereby reducing the impact of a single side groove 400 structure on the encapsulation effect at its location; second, the sequential and spaced arrangement of multiple side grooves 400 makes it easy to bend the arc-angle bend NA5 at different locations, avoiding stress concentration and preventing problems such as unsatisfactory bending effects at some locations.

[0047] Preferably, multiple seams 410 are evenly distributed on the arc-angle bend NA5. For example, before bending the display panel, in the same arc-angle bend NA5, a lateral groove 400 is provided every 20° with the center of the arc angle of the bend as the center, thereby forming a structure in which multiple seams 410 are evenly distributed on the arc-angle bend NA5 after bending. This makes it easy to bend at different positions of the arc-angle bend NA5, and the resulting bending structure is neater and smoother after bending.

[0048] Preferably, the number of seams 410 in the multiple curved corner bends NA5 is the same, so that the four corner positions formed by the bending of the display panel have better symmetry, which is beneficial to the subsequent display device design and production.

[0049] Optionally, in one embodiment, the lateral slot 400 is a fan-shaped slot structure, with the width of the fan-shaped slot gradually decreasing from one end near the edge of the arc-angle bend NA5 to the end away from the edge of the arc-angle bend NA5. When the arc-angle bend NA5 bends towards the backlight side B of the display panel, the dimensional change is larger near the edge of the arc-angle bend NA5 and smaller away from the edge of the arc-angle bend NA5. By setting the lateral slot 400 as a fan-shaped slot structure, it can better accommodate the difference in dimensional change at different positions of the arc-angle bend NA5 in the direction from near the edge of the arc-angle bend NA5 to away from the edge of the arc-angle bend NA5.

[0050] Optionally, the substrate 100, the first inorganic encapsulation layer 210, the second inorganic encapsulation layer 240, the second organic encapsulation layer 230, and the dam 300 are spliced ​​at the joint 410. This avoids gaps at the joint 410 and allows the dams 300 on both sides of the side groove 400 to connect, thereby achieving a better overflow prevention effect.

[0051] Preferably, the curved bend NA5 is bonded and fixed at the seam 410. This achieves the purpose of protecting the edge and shaping. Furthermore, in actual use, if the first organic encapsulation layer 220 flows through the second organic encapsulation layer 230 to the seam 410, there will be no overflow from the seam 410.

[0052] In one embodiment, the second organic encapsulation layer 230 has a groove 231 on the side facing the first organic encapsulation layer 220, and the groove 231 extends along the extending direction of the second organic encapsulation layer 230. During printing of the first organic encapsulation layer 220, the groove 231 on the second organic encapsulation layer 230 can buffer the first organic encapsulation layer 220, blocking it and preventing overflow. Preferably, the cross-sectional shape of the groove 231 includes an arc shape that curves away from the first organic encapsulation layer 220 to achieve better buffering and overflow prevention effects.

[0053] Optionally, the dam 300 includes a first dam arranged in a ring. By using the second organic encapsulation layer 230 to block the first organic encapsulation layer 220, a good encapsulation effect can be achieved, meeting bending requirements and preventing overflow after bending. Therefore, with the second organic encapsulation layer 230 provided, only one ring of dam 300 needs to be provided (e.g., Figure 5 As shown in the figure, the packaging requirements can be met.

[0054] However, for better sealing, you can also choose to set multiple 300-ring dams, such as... Figure 7 and Figure 8As shown, the dam 300 also includes a second dam, which is ring-shaped and is located on the outside of the first dam. That is, the second dam is located on the side of the first dam away from the second organic encapsulation layer 230. This scheme should also be within the scope of protection of this application.

[0055] In one embodiment, the display panel further includes an encapsulation deposition layer, which covers and encapsulates the substrate 100, the encapsulation layer 200, and the dam 300. The encapsulation deposition layer is a layer structure formed by atomic layer deposition after the bend and fixation of the bezel area NA. Its main purpose is to protect the encapsulation structure after the arc corner patterning. Since the patterned arc corner edges are prone to encapsulation failure and water and oxygen erosion, the encapsulation deposition layer can effectively encapsulate the edge morphology and achieve the purpose of effectively blocking water and oxygen.

[0056] This application also provides a display device in one embodiment, which includes the display panel provided in the above embodiment. The display device has image display capabilities and can be widely used in various scenarios. Optionally, the display device can display static images, such as pictures or photographs, to provide users with visual information. Simultaneously, it can also play dynamic images, such as video content, to bring users a more vivid and richer visual experience.

[0057] In practical applications, display devices can take many forms, including but not limited to laptops, mobile phones, handheld or portable computers, cameras, camcorders, and other portable devices. Furthermore, display devices can serve as core display components for in-vehicle smart control screens, calculators, smartwatches, GPS navigators, and other devices. In the advertising and commercial sectors, they can also be used as electronic billboards or signs. When combined with a projector, they can display content on the screen.

[0058] It's worth noting that, in addition to basic image display functions, the display device can also possess a variety of other practical features. For example, it can integrate photo and video recording capabilities. Furthermore, to enhance security and convenience, it can be equipped with biometric technologies such as fingerprint and facial recognition, providing users with a safer and more convenient experience. To achieve these functions, the display device can integrate corresponding functional modules, such as under-display cameras and under-display fingerprint sensors.

[0059] The display device provided according to any embodiment of this application and the display panel provided in the embodiments of this application belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display device can be found in the embodiments of the display panel, and will not be repeated here.

[0060] This embodiment also provides a method for manufacturing a display panel, which can be referred to in conjunction with the display panel of the above embodiment.

[0061] Combination Figure 9 The method for manufacturing the display panel includes the following steps:

[0062] S100: Provides substrate 100.

[0063] S200: A dam 300 is fabricated on one side of the substrate 100.

[0064] Alternatively, in one embodiment, the material of the dam 300 may be an organic material.

[0065] S300: A second organic encapsulation layer 230 is prepared on one side of the substrate 100;

[0066] S320. A first organic encapsulation layer 220 is prepared on the side of the second organic encapsulation layer 230 away from the dam 300, wherein the elastic modulus of the second organic encapsulation layer 230 is less than the elastic modulus of the first organic encapsulation layer 220.

[0067] Optionally, the material of the first organic encapsulation layer 220 may be a fiber material, a resin material, or a material used in multilayer boards. The first organic encapsulation layer 220 may be a single layer, a multilayer, or a composite layer.

[0068] Optionally, the first organic encapsulation layer 220 is printed.

[0069] S400: The display panel is bent at the position of the second organic encapsulation layer 230.

[0070] Combination Figure 10 In some embodiments, prior to step S320, the method further includes:

[0071] S310, a groove 231 is formed by etching the sidewall of the second organic encapsulation layer 230 away from the dam 300.

[0072] Preferably, step S320, which involves preparing the first organic encapsulation layer 220 on the side of the second organic encapsulation layer 230 facing away from the dam 300, includes:

[0073] A first organic encapsulation layer 220 is prepared on the side of the second organic encapsulation layer 230 away from the dam 300, and at least a portion of the first organic encapsulation layer 220 is located within the groove 231.

[0074] In some embodiments, prior to step S300, the method further includes:

[0075] S210. A first inorganic encapsulation layer 210 is prepared on the substrate 100 and the dam 300. Optionally, the material of the first inorganic encapsulation layer 210 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The first inorganic encapsulation layer 210 can be a single layer, a multilayer, a composite layer, etc.

[0076] Step S300, which involves fabricating a second organic encapsulation layer 230 on one side of the substrate 100, includes:

[0077] S301. Prepare a second organic encapsulation layer 230 on the first inorganic encapsulation layer 210;

[0078] Step S320, which involves preparing the first organic encapsulation layer 220 on the side of the second organic encapsulation layer 230 facing away from the dam 300, includes:

[0079] A first organic encapsulation layer 220 is prepared on the first inorganic encapsulation layer 210;

[0080] In some embodiments, prior to step S400, the method further includes:

[0081] S330, a second inorganic encapsulation layer 240 is formed on the side of the first inorganic encapsulation layer 210, the first organic encapsulation layer 220, and the second organic encapsulation layer 230 that is away from the substrate 100. Optionally, the material of the second inorganic encapsulation layer 240 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The second inorganic encapsulation layer 240 can be a single layer, multiple layers, composite layers, etc.

[0082] In some embodiments, prior to step S300, the method for manufacturing the display panel further includes:

[0083] S340, a lateral groove 400 is etched at the curved corner bend NA5 of the display panel, the curved corner bend NA5 being located at the corner of the display panel. The lateral groove 400 penetrates the substrate 100, the first inorganic encapsulation layer 210, the second organic encapsulation layer 230, the dam 300, and the second inorganic encapsulation layer 240 in a direction perpendicular to the substrate 100.

[0084] Step S400, bending the display panel at the second organic encapsulation layer 230, includes:

[0085] S401, the display panel is bent at the position of the second organic encapsulation layer 230 so that the arc-angle bent part NA5 is spliced ​​at the position of the side groove 400 to form a seam 410.

[0086] Because the gap between the dam 300 at the side groove 400 position is small, under the action of surface tension, the organic encapsulation material of the second organic encapsulation layer 230 can be confined within the dam 300, thus preventing the overflow of the organic encapsulation material of the second organic encapsulation layer 230 during the preparation process.

[0087] In some embodiments, the method for manufacturing the display panel further includes:

[0088] S500, apply adhesive to fix the joint at position 410.

[0089] In some embodiments, the method for manufacturing the display panel further includes:

[0090] S600, Perform encapsulation deposition to form an encapsulation deposition layer, which covers part of the seam 410.

[0091] Optionally, the encapsulation deposition layer completely covers the seam 410.

[0092] Optionally, encapsulation deposition is performed to form an encapsulation deposition layer, including:

[0093] Atomic layer encapsulation deposition is used to form an encapsulation deposition layer.

[0094] Specifically, an atomic layer deposition process is performed on the substrate 100, encapsulation layer 200, and dam 300 after glue injection and fixation to form an encapsulation deposit layer.

[0095] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0096] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, The display panel has a bezel area, which includes a near-display area, a bending area, and a dam area connected in sequence. The bezel area bends toward the backlight side of the display panel, and the bending position of the bezel area is the bending area. The bezel area includes an arc-shaped bending portion located at the corner of the display panel, and the arc-shaped bending portion has at least one seam. The display panel includes: substrate; An encapsulation layer, located on one side of the substrate, includes a first organic encapsulation layer and a second organic encapsulation layer, which are arranged parallel to the substrate. The second organic encapsulation layer is located in the bending region, and its elastic modulus is less than that of the first organic encapsulation layer. The encapsulation layer also includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, located on the side of the first inorganic encapsulation layer facing away from the substrate, and the second inorganic encapsulation layer is located on the side of the first organic encapsulation layer, the second organic encapsulation layer, and the first inorganic encapsulation layer facing away from the substrate. A groove is provided on the side of the second organic encapsulation layer facing the first organic encapsulation layer, and the groove extends along the extension direction of the second organic encapsulation layer. A dam is located in the dam area, and the second organic encapsulation layer is located between the dam and the first organic encapsulation layer; The substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer, the second organic encapsulation layer, and the portions of the dam located on both sides of the joint are spliced ​​at the joint position.

2. The display panel according to claim 1, characterized in that, The border area also includes a straight bend that connects adjacent arc-angle bends, and the straight bend and the arc-angle bend are located in the bend area and the embankment area; The curved section is spliced ​​at the joint.

3. The display panel of claim 2, wherein, The number of seams in the arc-angle bend is multiple, and the multiple seams are arranged at intervals around the center of the arc angle of the arc-angle bend.

4. The display panel according to claim 3, characterized in that, The multiple seams are evenly arranged around the center of the arc angle of the arc angle bend.

5. The display panel according to claim 3, characterized in that, The number of seams in the plurality of said arc-angle bends is the same.

6. The display panel according to any one of claims 2 to 5, characterized in that, The curved section is bonded at the joint.

7. The display panel of any one of claims 2 to 5, wherein, At least a portion of the first organic encapsulation layer is located in the near-display area.

8. The display panel according to claim 1, characterized in that, The dam includes a first dam arranged in a ring.

9. The display panel according to claim 8, characterized in that, The dam also includes a second dam, which is arranged around the outside of the first dam.

10. The display panel according to claim 1, characterized in that, The cross-sectional shape of the retaining groove includes an arc shape.

11. The display panel according to any one of claims 1 to 5, characterized in that, Also includes: An encapsulation deposition layer covers and encapsulates the substrate, the encapsulation layer, and the dam.

12. A method for manufacturing a display panel, characterized in that, include: Provide substrate; A dam is fabricated on one side of the substrate; A first inorganic encapsulation layer is prepared on the substrate and the dam; A second organic encapsulation layer is prepared on the side of the first inorganic encapsulation layer that is away from the substrate; A retaining groove is etched into the sidewall of the second organic encapsulation layer away from the dam; A first organic encapsulation layer is prepared on the side of the second organic encapsulation layer away from the dam and on the first inorganic encapsulation layer, with a portion of the first organic encapsulation layer located in the retaining groove; The elastic modulus of the second organic encapsulation layer is less than that of the first organic encapsulation layer; A second inorganic encapsulation layer is prepared on the side of the first inorganic encapsulation layer, the first organic encapsulation layer, and the second organic encapsulation layer that is away from the substrate; Lateral grooves are etched at the curved corner bend of the display panel, the curved corner bend is located at the corner of the display panel, and the lateral grooves penetrate the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer and the dam in a direction perpendicular to the substrate. The display panel is bent at the location of the second organic encapsulation layer, so that the arc-shaped bent portion is spliced ​​at the location of the lateral groove to form a seam.

13. The method for manufacturing a display panel according to claim 12, characterized in that, Also includes: Apply adhesive to the joint to fix it in place.

14. The method for manufacturing a display panel according to claim 12, characterized in that, Also includes: An encapsulation deposition is performed to form the encapsulation deposition layer, which covers a portion of the seam.

15. The method for manufacturing a display panel according to claim 14, characterized in that, The encapsulation deposition layer completely covers the seam.

16. The method for manufacturing a display panel according to claim 14, characterized in that, Performing encapsulation deposition to form the encapsulation deposition layer includes: The encapsulation deposition layer is formed by using atomic layer encapsulation deposition.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11; Alternatively, it may include a display panel prepared by the method for preparing a display panel according to any one of claims 12-16.

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