A solid cooling target device for a cyclotron

Abstract

The present invention discloses a solid cooling target device for a cyclotron accelerator, comprising: a solid target base; a target substrate, mounted inside the solid target base and sealingly separating the upper and lower ends of the solid target base, wherein the upper surface forms a target material bearing surface and the lower surface forms a cooling surface; a cooling base, wherein the upper end of the cooling base is sealedly connected to the lower end of the solid target base, and the cooling base is formed with a liquid feed channel and a liquid return channel connected to an inner cavity; a jet nozzle, mounted inside the cooling base, wherein the inlet end of the jet nozzle is connected to the liquid feed channel, the outlet end of the jet nozzle is located below the target substrate, and a cooling liquid annulus is formed between the jet nozzle and the cooling base for supplying cooling liquid, wherein the cooling liquid annulus is connected to the liquid return channel. The present invention can effectively cope with the heat generated when high-energy particles interact with target materials, achieve efficient cooling of the target, improve the yield of radioactive nuclides, and ensure the safety and stability of equipment operation.

Description

Technical Field

[0001] The present invention relates to the field of particle accelerator radio frequency superconducting technology, and in particular to a solid cooling target device of a cyclotron accelerator. Background Art

[0002] As an important particle accelerator, cyclotrons are widely used in fields such as physics, chemistry, materials science, and medicine. In medicine, cyclotrons are primarily used to produce radioisotopes, which play a vital role in medical diagnosis and treatment. The solid target in a cyclotron is a key component in producing radionuclides. It interacts with the high-energy charged particles generated by the accelerator to produce radionuclides used in medical diagnosis and treatment.

[0003] When particles interact with the target material, a large amount of heat is generated. If this heat is not promptly and effectively managed, the target material can overheat or even melt, affecting the normal operation of the equipment and the accuracy of the experiment. To maintain the stability of the target material and extend its service life, the solid target must be cooled. Traditional cooling methods mainly rely on water cooling systems, which remove heat through the circulation of cooling water. However, traditional cooling systems have the following major problems:

[0004] 1) Complex pipeline design and maintenance: Traditional cooling systems require a complex pipeline network to ensure that the cooling water can cover the entire surface of the target material. This complex design not only increases the construction cost and maintenance difficulty of the system, but is also prone to blockage, leakage and other problems.

[0005] 2) Risks of extreme temperatures and high pressures: Under high-energy particle bombardment, the target material's surface temperature rises dramatically, forcing the cooling system to operate in these extreme temperatures and high pressures. Traditional cooling systems are prone to leaks under these conditions, reducing cooling efficiency and potentially causing safety incidents.

[0006] 3) Insufficient heat conduction efficiency: Due to the limited heat conduction efficiency between the solid target and the cooling water, the traditional cooling system is unable to quickly and effectively transfer the heat from the target material surface to the cooling water, resulting in local overheating of the target material, affecting the stability of the nuclear reaction and the yield of radioactive isotopes.

[0007] 4) In traditional cooling systems, the installation and disassembly process is complicated and time-consuming, involving the alignment of multiple precision components and manual operations, resulting in low work efficiency. The high-intensity and complex operations not only extend equipment downtime, but also increase maintenance difficulty and cost.

[0008] Furthermore, operators are exposed to radioactive environments while performing these tasks and face serious health risks, including long-term health problems and psychological stress caused by radiation exposure, which together affect production efficiency and safety. Summary of the Invention

[0009] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, the present invention provides a solid-cooled target device for a cyclotron accelerator. This device is designed to effectively handle the heat generated by the interaction between high-energy particles and the target material, achieving efficient target cooling and increasing the yield of radioactive nuclides while ensuring the safety and stability of the device's operation.

[0010] To achieve the above-mentioned object, the present invention adopts the following technical solution: a solid cooling target device for a cyclotron accelerator, comprising: a solid target base, which is an annular structure with open ends, and the upper end of the solid target base forms the incident end of the particle beam; a target substrate, which is installed inside the solid target base and seals and separates the upper and lower ends of the solid target base, the upper surface of the target substrate forms a target material bearing surface, and the lower surface of the target substrate forms a cooling surface; a cooling base, which is a tubular structure with an open upper end and a closed lower end, the upper end of the cooling base being sealed and connected to the lower end of the solid target base. A liquid feed channel and a liquid return channel connected to the inner cavity are formed on the cooling base; a jet nozzle is installed inside the cooling base, and the inlet end of the jet nozzle is connected to the liquid feed channel, and the outlet end of the jet nozzle is located below the target substrate to spray the coolant onto the cooling surface of the target substrate. A cooling liquid annular cavity for the flow of cooling liquid is formed between the jet nozzle and the cooling base, and the cooling liquid annular cavity is connected to the liquid return channel, so that the liquid feed channel, jet nozzle, cooling liquid annular cavity and liquid return channel together form a cooling liquid circulation loop.

[0011] Preferably, a plurality of micro-channel structures arranged in parallel and at intervals are provided on the cooling surface of the target substrate.

[0012] Preferably, the target substrate is installed obliquely inside the solid target base to form an inclined surface of 5 to 30 degrees.

[0013] Preferably, the jet nozzle comprises a jet nozzle, a jet main pipe and a connecting portion integrally arranged from top to bottom, an external thread is formed on the connecting portion, an internal thread is formed in the cooling base, and a detachable threaded connection is formed between the connecting portion and the cooling base.

[0014] Preferably, a duckbill-shaped or conical fluid contraction section is formed inside the jet nozzle.

[0015] Preferably, the angle of the fluid contraction section of the jet nozzle is between 10° and 45°.

[0016] Preferably, the interior of the lower end of the solid target base is concave outward to form an arc-shaped turbulent flow area.

[0017] Preferably, the solid target base and the cooling base are fastened together by a flange and a clamp.

[0018] Preferably, a central support sealing ring is provided at the joint between the solid target base and the cooling base.

[0019] The present invention has the following advantages due to the adoption of the above technical solution:

[0020] 1. The present invention effectively increases the projected area of ​​the particle beam by designing the angle between the target substrate, the solid target base and the particle beam, and the interaction area between the particles and the target material is also increased, thereby significantly improving the yield of the target material, enhancing production efficiency and product quality, and having important practical value and broad application prospects.

[0021] 2. The present invention sets a microchannel structure on the cooling surface of the target substrate. The design of the microchannel structure significantly increases the contact area between the coolant and the target substrate, so that heat can be quickly transferred to the coolant, avoiding overheating and melting of the target material, ensuring the stability of the target material under high-energy particle bombardment, and extending the service life of the target material.

[0022] 3. The end of the jet nozzle of the present invention is provided with a duckbill-shaped or conical fluid contraction section, which can efficiently spray the coolant onto the cooling surface of the target substrate, ensuring the uniform distribution and efficient flow of the coolant, improving the utilization rate of the coolant, reducing the waste of the coolant, and maximizing the cooling efficiency.

[0023] 4. The cooling base and the jet nozzle of the present invention are fixed in a detachable manner. This design simplifies the installation and disassembly process of the device. The operator can quickly replace the nozzle and other components, which greatly improves the maintenance efficiency and operability of the equipment, reduces equipment downtime, and improves overall production efficiency.

[0024] 5. The cooling base of the present invention is connected to the solid target base through flanges and clamps, which not only ensures the stability and sealing of the entire device, but also reduces the time and manpower required for installation and disassembly, thereby improving work efficiency.

[0025] 6. The flange and clamp connection and separate jet nozzle design of the present invention make it easy to replace the target. The operator can quickly and remotely complete the installation and removal of the target through the operation of the robotic arm, avoiding the health risks of the operator being exposed to the radiation environment for a long time, reducing radiation exposure, and at the same time speeding up the target replacement speed and improving the operation continuity of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. Throughout the drawings, the same reference numerals are used to denote the same components. In the drawings:

[0027] Figure 1 A schematic diagram of the assembly of a solid cooling target device provided in an embodiment of the present invention;

[0028] Figure 2 An explosion diagram of a solid cooling target device provided by an embodiment of the present invention;

[0029] Figure 3 A schematic cross-sectional view of a solid cooling target device provided by an embodiment of the present invention;

[0030] Figure 4 A schematic structural diagram of a target substrate cooling surface provided by an embodiment of the present invention;

[0031] Figure 5 A schematic structural diagram of a jet nozzle provided in an embodiment of the present invention.

[0032] The reference numerals in the figures are as follows:

[0033] 1- solid target base; 2- target substrate; 3- cooling base; 4- liquid supply channel; 5- liquid return channel; 6- jet nozzle; 7- cooling liquid ring cavity; 8- flange and clamp; 9- center bracket sealing ring;

[0034] 2a-microchannel structure; 6a-jet nozzle; 6b-jet main pipe; 6c-connecting part. DETAILED DESCRIPTION

[0035] To make the objectives, technical solutions, and advantages of the present invention more apparent, specific embodiments of the present invention are further described below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means more than two, unless otherwise specifically defined.

[0038] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0039] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0040] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0041] The present invention provides a solid cooling target device for a cyclotron, comprising: a solid target base 1; a target substrate 2, mounted within the solid target base 1 and sealingly separating the upper and lower ends of the solid target base 1, with the upper surface forming a target material bearing surface and the lower surface forming a cooling surface; a cooling base 3, the upper end of the cooling base 3 being sealedly connected to the lower end of the solid target base 1, and the cooling base 3 being formed with a liquid supply channel 4 and a liquid return channel 5 communicating with an inner cavity; a jet nozzle 6, mounted within the cooling base 3, with the inlet end of the jet nozzle 6 communicating with the liquid supply channel 4, the outlet end of the jet nozzle 6 being located below the target substrate 2, and a cooling liquid annular cavity 7 for coolant flow formed between the jet nozzle 6 and the cooling base 3, the cooling liquid annular cavity 7 being connected to the liquid return channel 5. The present invention can effectively cope with the heat generated when high-energy particles interact with the target material, achieve efficient cooling of the target, improve the yield of radioactive nuclides, and ensure the safety and stability of the equipment operation.

[0042] The solid cooling target device for a cyclotron provided by an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0043] See also Figures 1 to 3The present embodiment provides a solid cooling target device for a cyclotron, comprising: a solid target base 1, which is an annular structure with open ends, and the upper end of the solid target base 1 forms the incident end of the particle beam; a target substrate 2, which is installed inside the solid target base 1 and seals and separates the upper and lower ends of the solid target base 1, the upper surface of the target substrate 2 forms the target material bearing surface, and the lower surface of the target substrate 2 forms the cooling surface; a cooling base 3, which is a tubular structure with an open upper end and a closed lower end, the upper end of the cooling base 3 is sealedly connected to the lower end of the solid target base 1, and the cooling base 3 is formed with a liquid supply channel 4 and a liquid return channel 5 connected to the inner cavity; The jet nozzle 6 is installed inside the cooling base 3, and the inlet end of the jet nozzle 6 is connected to the liquid supply channel 4. The outlet end of the jet nozzle 6 is located below the target substrate 2 to spray the coolant onto the cooling surface of the target substrate 2. A coolant annular cavity 7 for the coolant to flow is formed between the jet nozzle 6 and the cooling base 3. The coolant annular cavity 7 is connected to the liquid return channel 5, thereby making the liquid supply channel 4, the jet nozzle 6, the coolant annular cavity 7 and the liquid return channel 5 together form a coolant circulation loop, which not only ensures the efficient circulation of the coolant, but also realizes the effective separation of the liquid supply and the return liquid, thereby avoiding the additional pressure loss caused by the mixed flow.

[0044] In the above embodiment, preferably, please refer to Figure 4 The cooling surface of the target substrate 2 is provided with a plurality of parallel and spaced microchannel structures 2a. This design can increase the contact area between the coolant and the target substrate 2, thereby improving the flow efficiency and cooling effect.

[0045] In the above embodiment, preferably, please refer to Figure 3 The target substrate 2 is installed obliquely inside the solid target base 1 to form an inclined surface of 5 to 30 degrees. This design can make the target substrate 2 form a certain angle with the incident particle beam, effectively increasing the projected area of ​​the positive direction particle beam on the target substrate 2, thereby significantly improving the yield of radioactive nuclides.

[0046] In the above embodiment, preferably, please refer to Figure 3 、 Figure 5 The jet nozzle 6 includes a jet nozzle 6a, a jet main pipe 6b and a connecting portion 6c which are integrally arranged from top to bottom, and an external thread is formed on the connecting portion 6c, and an internal thread is formed in the cooling base 3. A detachable threaded connection is formed between the connecting portion 6c and the cooling base 3. The separate design of the jet nozzle 6 and the cooling base 3 not only ensures the efficient flow of the coolant, but also optimizes the compatibility and replaceability of the cooling target device.

[0047] In the above embodiment, the jet nozzle 6a preferably has a duckbill-shaped or conical fluid converging section formed within it. This not only optimizes the flow characteristics of the coolant within the jet nozzle 6, but also improves the operating efficiency of the jet nozzle 6 and the coolant spraying performance. Furthermore, the angle of the fluid converging section of the jet nozzle 6a is between 10 and 45 degrees to accommodate different cooling requirements.

[0048] In the above embodiment, preferably, please refer to Figure 3 The inner wall of the solid target base 1 located below the target substrate 2 is concave outward to form an arc-shaped turbulence zone. This geometric shape can effectively reduce the turbulence generated by the coolant flowing through this area.

[0049] In the above embodiment, preferably, please refer to Figure 1 、 Figure 3 The solid target base 1 and the cooling base 3 are fastened together by a flange and a clamp 8, and a center bracket sealing ring 9 is provided at the joint between the solid target base 1 and the cooling base 3, thereby ensuring the sealing and stability of the overall structural connection, preventing leakage of the coolant, and realizing the rapid disassembly function of the solid target base 1 and the cooling base 3.

[0050] The solid cooling target device of the cyclotron provided in the above embodiment operates as follows when in use:

[0051] The cooling liquid (e.g., water) enters the jet nozzle 6 through the liquid supply channel 4 of the cooling base 3. The cooling liquid is ejected from the jet nozzle 6a of the jet nozzle 6 and sprayed at high pressure onto the microchannel structure 2a on the cooling surface of the target substrate 2.

[0052] The heat generated by high-energy particles bombarding the target material is transferred to the coolant through the target substrate 2. The microchannel structure 2a increases the contact area between the coolant and the target substrate 2, ensuring that the heat is quickly removed, preventing the target material from overheating and ensuring that the target material is continuously maintained within a safe temperature range.

[0053] The heated coolant flows back through the coolant annular cavity 7 formed between the jet nozzle 6 and the cooling base 3, forming an efficient coolant circulation loop. The design of this return path not only improves the cooling efficiency, but also helps to maintain the continuity and uniformity of the coolant flow.

[0054] Finally, the coolant is discharged from the device through the liquid return channel 5 to facilitate the recovery and recycling of the coolant, further optimizing the efficiency and sustainability of the entire solid cooling target device.

[0055] In addition, the pressure and flow rate of the liquid supply channel 4 can be controlled to adjust the cooling water flow generated by the jet nozzle 6 to achieve precise cooling of the target substrate 2.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A solid cooling target device for a cyclotron, characterized in that: include: The solid target base is a ring-shaped structure with two open ends, and the upper end of the solid target base forms the incident end of the particle beam; A target substrate is installed inside the solid target base and seals and separates the upper and lower ends of the solid target base, wherein the upper surface of the target substrate forms a target material bearing surface, and the lower surface of the target substrate forms a cooling surface; The cooling base is a tubular structure with an open upper end and a closed lower end. The upper end of the cooling base is sealed to the lower end of the solid target base, and a liquid supply channel and a liquid return channel are formed on the cooling base and communicate with the inner cavity. a jet nozzle installed inside the cooling base, with an inlet end of the jet nozzle communicating with the liquid supply channel, and an outlet end of the jet nozzle located below the target substrate to spray coolant onto the cooling surface of the target substrate, a coolant annular cavity for coolant flow formed between the jet nozzle and the cooling base, the coolant annular cavity communicating with the liquid return channel, so that the liquid supply channel, the jet nozzle, the coolant annular cavity, and the liquid return channel together form a coolant circulation loop; A plurality of parallel and spaced microchannel structures are provided on the cooling surface of the target substrate; The jet nozzle comprises a jet nozzle, a jet main pipe and a connecting portion which are integrally arranged from top to bottom. A duckbill-shaped or conical fluid contraction section is formed inside the jet nozzle.

2. The solid cooling target device according to claim 1, characterized in that The target substrate is installed obliquely inside the solid target base to form an inclined surface of 5 to 30 degrees.

3. The solid cooling target device according to claim 1, characterized in that An external thread is formed on the connecting portion, an internal thread is formed in the cooling base, and a detachable threaded connection is formed between the connecting portion and the cooling base.

4. The solid cooling target device according to claim 1, wherein The angle of the fluid contraction section of the jet nozzle is between 10 and 45 degrees.

5. The solid cooling target device according to claim 1, wherein The interior of the lower end of the solid target base is concave outward to form an arc-shaped turbulent flow area.

6. The solid cooling target device according to claim 1, characterized in that The solid target base and the cooling base are tightly connected via a flange and a clamp.

7. The solid cooling target device according to claim 6, characterized in that: A central support sealing ring is provided at the joint between the solid target base and the cooling base.

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