Wafer stable lifting device

Abstract

The invention discloses a stable wafer lifting device which comprises a hollow lifting table, a hollow wafer carrying table used for carrying a wafer and adsorbing the wafer is arranged over the hollow lifting table, and a bottom plate is arranged under the hollow lifting table. The upper surface of the bottom plate is provided with a first piston assembly used for driving the hollow wafer carrying table to ascend and descend in the Y-axis direction and a second piston assembly used for driving the hollow lifting table to ascend and descend in the Y-axis direction, and the surface of the hollow wafer carrying table is provided with a first annular partition plate and air suction holes used for adsorbing wafers. The number of the first annular partition plates is four, the four first annular partition plates are distributed in an annular array, and the air suction holes are located in the inner sides of the first annular partition plates. According to the invention, stable jacking and descending of the wafer product are realized, and the situation that the wafer product collides with the manipulator due to horizontal displacement or sliding of the wafer product in the jacking or descending process is avoided.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular relates to a wafer stable lifting device. Background Art

[0002] The manufacture of integrated circuits involves depositing multiple layers of materials on semiconductor wafers in a processing chamber, specifically, the wafer is sent into the processing chamber by a robot, the support pin carrier pushes the support pins up, the wafer is lifted by the support pins, the robot withdraws, the wafer carrier rises, the wafer falls on the wafer carrier, and the wafer carrier drives the wafer to continue to rise to a predetermined position for deposition. The wafer carrier and the support pin carrier are respectively pushed up by the lifting blocks.

[0003] After searching, the patent announcement CN118073268B discloses a wafer lifting device and a wafer lifting method. The device includes: a first lifting block is located below the wafer carrier, the wafer carrier is fixedly connected to the first lifting block through a vertically arranged connecting shaft, the second lifting block is slidably sleeved on the outer periphery of the connecting shaft, the support pin carrier is connected to the second lifting block and surrounds the connecting shaft, and the support pin is located above the support pin carrier; the first fixed part is sleeved on the outer periphery of the connecting shaft and located below the second lifting block; the upper and lower ends of the first bellows are respectively connected to the first lifting block and the first fixed part and sleeved outside the connecting shaft; the upper and lower ends of the second bellows are respectively connected to the first fixed part and the second lifting block and sleeved outside the connecting shaft; the third bellows is sleeved outside the support pin carrier and is fixedly connected to the second lifting block and the bottom of the wafer processing chamber. When lifting the wafer, the horizontal height of the support pin can be stabilized to prevent the wafer from horizontal displacement or slipping.

[0004] In actual use, the existing wafer stable lifting devices generally use driving structures such as electric telescopic rods, hydraulic telescopic rods, and pneumatic telescopic rods to achieve the lifting and lowering of wafer products. However, during use, the telescopic structures such as electric telescopic rods that are driven by motors to achieve extension and retraction will generate certain vibrations due to the transmission process of the mechanical structure. The vibrations will affect the stability of the wafer products during the lifting and lowering process, and may easily cause the wafer products to produce horizontal displacement or sliding during the lifting and lowering process. In addition, during use, the telescopic structures such as hydraulic telescopic rods and pneumatic telescopic rods that are driven by pumps to drive liquid or gas will generate certain fluctuations due to the flow of gas or liquid driven by the pumps. The fluctuations will affect the stability of the wafer products during the lifting and lowering process, and may also easily cause the wafer products to produce horizontal displacement or sliding during the lifting and lowering process. Therefore, a wafer stable lifting device is designed. Summary of the invention

[0005] In view of the defects or shortcomings of the wafer stable lifting device, the purpose of the present invention is to provide a wafer stable lifting device, which realizes the stable lifting and lowering of the wafer product and avoids the horizontal displacement or sliding of the wafer product during the lifting or lowering process, which may cause the wafer product to collide with the robot.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A wafer stable lifting device provided by the present invention comprises a hollow lifting platform, a hollow wafer carrier for carrying and adsorbing wafers is arranged directly above the hollow lifting platform, and a bottom plate is arranged directly below the hollow lifting platform, and a first piston assembly for driving the hollow wafer carrier to lift in the Y-axis direction and a second piston assembly for driving the hollow lifting platform to lift in the Y-axis direction are installed on the upper surface of the bottom plate; The surface of the hollow wafer carrier is provided with a first annular partition and an air suction hole for adsorbing the wafer, the first annular partition is four, the four first annular partitions are distributed in an annular array, the air suction hole is located on the inner side of the first annular partition, and the inside of the air suction hole is connected to the inside of the hollow wafer carrier; A second annular partition is provided at the center of the surface of the hollow lifting platform, and a hollow support rod for supporting and adsorbing the wafer is provided on the upper surface of the hollow lifting platform. There are four hollow support rods, which are distributed in an annular array, and the interior of the hollow support rods is connected to the interior of the hollow lifting platform; A driving mechanism for driving the first piston assembly and the second piston assembly to perform piston movement and an air suction pump for suctioning the inside of the hollow wafer carrier and the hollow lifting platform are arranged on the outer side of the bottom plate.

[0007] Preferably, the outer walls of the hollow wafer carrier and the hollow lifting platform are each provided with three first sliders, and the first sliders are distributed in a ring array, the other end of the first slider is installed on the first slide rail, the first slider and the first slide rail are slidably connected, and the first slide rail is installed on one side outer wall of the side panel, the side panel is installed at the upper surface edge of the bottom panel, there are three side panels, and the three side panels are distributed in a ring array.

[0008] Preferably, the outer walls of the hollow wafer carrier and the hollow lifting platform are both provided with ventilation pipes, the other end of the ventilation pipes is connected to the three-way pipe joint through a connecting pipe, the three-way pipe joint is installed on the suction end on the outer wall of one side of the suction pump, and an electromagnetic valve is provided on the ventilation pipe.

[0009] Preferably, a movable plate is provided on the driving mechanism, a threaded hole is provided on the surface of the movable plate, a rotating shaft is installed in the threaded hole, an external thread is provided on the outer wall of the rotating shaft, and the external thread on the outer wall of the rotating shaft is threadedly connected to the threaded hole, the top end of the rotating shaft passes through the bearing on the surface of the supporting plate and is connected to the reduction motor through a coupling, the supporting plate is installed above the rear end wall of the mounting plate, the reduction motor is installed on the upper surface of the mounting frame, the output shaft on the reduction motor passes through the surface of the mounting frame, the mounting frame is installed on the upper surface of the supporting plate, the bottom end of the rotating shaft is installed in the bearing seat, and the bearing seat and the mounting plate are both installed at the top of the mounting seat, and the bearing seat is located on one side of the mounting plate.

[0010] Preferably, a second slider is installed on the rear end wall of the movable plate, the other end of the second slider is installed on the second slide rail, the second slider and the second slide rail are slidably connected, and the second slide rail is installed on the rear end wall of the mounting plate, a pointer is installed on one side of the rear end wall of the movable plate, and scale marks are provided on one side outer wall of the mounting plate.

[0011] Preferably, a second connecting plate is installed on the rear end wall of the movable plate, the lower surface of the second connecting plate is connected to the first connecting plate through a shock absorbing assembly, and a third piston assembly is installed on the lower surface of the first connecting plate.

[0012] Preferably, the first piston assembly, the second piston assembly and the third piston assembly are all composed of a piston rod, a piston cylinder, a rubber piston and a liquid pipe. A rubber piston is arranged inside the piston cylinder, a piston rod is installed on the top of the rubber piston, and the other end of the piston rod extends to the outside. A liquid pipe is arranged below one side of the outer wall of the piston cylinder, and an electromagnetic valve is arranged on the liquid pipe.

[0013] Preferably, a four-way pipe joint is installed on the liquid pipe on the third piston assembly, and the four-way pipe joint is connected to the liquid pipes on one first piston assembly and two second piston assemblies respectively through three connecting pipes.

[0014] Preferably, the piston cylinder on the first piston assembly is installed on both sides of the upper surface of the base plate, and the other end of the piston rod on the first piston assembly is installed on the lower surface of the hollow lifting platform, the other end of the piston rod on the second piston assembly passes through the second annular partition and is installed on the lower surface of the hollow wafer carrier, and the other end of the hollow support rod passes through the first annular partition and extends to the outside.

[0015] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects: In the present invention, through the coordination of a series of structures, when the manipulator moves the wafer product to the position directly above the hollow wafer carrier, the staff starts the reduction motor on the driving mechanism and opens the solenoid valves on the liquid pipes on the first piston assembly and the third piston assembly, and starts the suction pump and opens the solenoid valve on the ventilation pipe. The start-up of the reduction motor will drive the rotating shaft to rotate forward or reverse. Because the external thread on the outer wall of the rotating shaft and the threaded hole are threadedly connected, when the rotating shaft rotates forward or reversely, the moving plate will make a linear motion in the Y-axis direction. When the moving plate makes a linear motion in the Y-axis direction, the rubber piston on the third piston assembly will make a piston motion in the piston cylinder. When the staff makes the rubber piston on the third piston assembly move downward in the Y-axis direction, the rubber piston on the third piston assembly will move to The compression of the liquid in the piston cylinder will cause the fluid to flow into the piston cylinder on the first piston assembly. At this time, the piston rod on the first piston assembly moves upward in the Y-axis direction. When the piston rod on the first piston assembly moves upward in the Y-axis direction, it will drive the hollow support rod on the hollow lifting platform to move upward in the Y-axis direction. When the top of the hollow support rod contacts and supports the bottom of the wafer product, the hollow support rod absorbs the bottom of the wafer product. After the hollow support rod lifts the wafer product, the reduction motor is turned off, and structures such as the robot are moved away. After the hollow support rod lifts, supports and absorbs the wafer product, when structures such as the robot are moved away, the hollow support rod can stably support the wafer product, effectively avoiding horizontal displacement or slipping of the wafer product during the removal of structures such as the robot.

[0016] In the present invention, after the staff closes the solenoid valve on the liquid pipe on the first piston assembly and opens the solenoid valve on the liquid pipe on the second piston assembly, the staff starts the reduction motor again and makes the rubber piston on the third piston assembly move downward in the Y-axis direction. At this time, the piston rod on the second piston assembly moves upward in the Y-axis direction. When the piston rod on the second piston assembly moves upward in the Y-axis direction, it will drive the hollow wafer carrier to move upward in the Y-axis direction. When the top of the hollow wafer carrier contacts and supports the bottom of the wafer product, the hollow wafer carrier absorbs the bottom of the wafer product, and the staff closes the reduction motor and the first ventilation on the hollow lifting platform. The solenoid valve on the pipe, the staff starts the reduction motor again and makes the rubber piston on the third piston assembly move downward in the Y-axis direction. At this time, the piston rod on the second piston assembly moves upward in the Y-axis direction. When the piston rod on the second piston assembly moves upward in the Y-axis direction, it will drive the wafer product on the hollow wafer stage to move to the preset position for deposition. After the hollow wafer stage supports and adsorbs the wafer product, when the hollow wafer stage moves in the Y-axis direction, the hollow wafer stage can provide nearly stable support for the wafer product, further effectively avoiding horizontal displacement or slipping of the wafer product during the removal of structures such as the robot.

[0017] In the present invention, through a series of coordinated arrangements of structures, the movement of the movable plate in the Y-axis direction is realized by driving the rotating shaft to rotate forward or reversely by the reduction motor. The movement of the movable plate in the Y-axis direction will indirectly drive the rubber piston on the third piston assembly to make a piston movement in the Y-axis direction. When the rubber piston on the third piston assembly makes a piston movement in the Y-axis direction, the rubber piston on the first piston assembly or the second piston assembly will make a piston movement in the Y-axis direction. In this driving mode, the lifting or lowering of the wafer product is realized. Compared with the telescopic movement realized by the pump body driving the liquid or gas to flow in the piston assembly, the present invention improves the stability of the liquid flowing in the first piston assembly, the second piston assembly and the third piston assembly, avoids the situation that the pump body drives the liquid or gas to flow in the piston assembly so that the fluctuation of the liquid or gas in the piston assembly is large, which causes the wafer product to be horizontally displaced or slipped during the lifting or lowering process. Compared with the telescopic structure realized by the motor drive such as the electric telescopic rod, the present invention avoids the situation that the vibration generated by the mechanical structure transmission causes the wafer product to be horizontally displaced or slipped during the lifting or lowering process.

[0018] Therefore, it can be seen from the above that the present invention realizes the stable lifting and lowering of the wafer product, and avoids the wafer product from colliding with the robot due to horizontal displacement or sliding of the wafer product during the lifting or lowering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0020] Figure 1 The overall three-dimensional structure of the present invention is shown in FIG. Figure 1 .

[0021] Figure 2 The overall three-dimensional structure of the present invention is shown in FIG. Figure 2 .

[0022] Figure 3 It is a structural schematic diagram of the hollow lifting platform of the present invention.

[0023] Figure 4 It is a cross-sectional view of the hollow lifting platform of the present invention.

[0024] Figure 5 It is a structural schematic diagram of the hollow wafer carrier of the present invention.

[0025] Figure 6 It is a cross-sectional view of the hollow wafer carrier of the present invention.

[0026] Figure 7 It is a structural schematic diagram of the driving mechanism of the present invention.

[0027] Figure 8 It is a cross-sectional view of the first piston assembly, the second piston assembly and the third piston assembly of the present invention.

[0028] Fig. 9 The present invention Figure 7 Schematic diagram of the local enlarged structure at point A in the figure.

[0029] In the figure: 100. Suction pump; 200, driving mechanism; 210, mounting seat; 211, bearing seat; 212, mounting plate; 213, second slide rail; 214, mounting frame; 215, support plate; 216, scale mark; 220, moving plate; 221, second connecting plate; 222, threaded hole; 223, pointer; 224, second slider; 230, rotating shaft; 240, reduction motor; 250, shock absorbing assembly; 260, first connecting plate; 270, third piston assembly; 271, piston rod; 272, piston cylinder; 273, rubber piston; 274, liquid pipe; 300, three-way pipe joint; 400, four-way pipe joint; 500, connecting pipe; 600, bottom plate; 610, first piston assembly; 620, second piston assembly; 630, side plate; 631, first slide rail; 700, hollow wafer stage; 710, first slider; 720, air suction hole; 730, first annular partition; 800, hollow lifting platform; 810, hollow supporting rod; 820, ventilation pipe; 830, second annular partition. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0031] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0032] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0033] like Figure 1-9 As shown, a wafer stable lifting device includes a hollow lifting platform 800, a hollow wafer carrier 700 for carrying and adsorbing wafers is arranged directly above the hollow lifting platform 800, and a bottom plate 600 is arranged directly below the hollow lifting platform 800, and a first piston assembly 610 for driving the hollow wafer carrier 700 to move up and down in the Y-axis direction and a second piston assembly 620 for driving the hollow lifting platform 800 to move up and down in the Y-axis direction are installed on the upper surface of the bottom plate 600; The surface of the hollow wafer carrier 700 is provided with a first annular partition plate 730 and an air suction hole 720 for adsorbing the wafer. There are four first annular partition plates 730, which are distributed in an annular array. The air suction hole 720 is located on the inner side of the first annular partition plate 730, and the interior of the air suction hole 720 is connected to the interior of the hollow wafer carrier 700. A second annular partition plate 830 is disposed at the center of the surface of the hollow lifting platform 800. A hollow support rod 810 for supporting and adsorbing the wafer is disposed on the upper surface of the hollow lifting platform 800. There are four hollow support rods 810, which are distributed in an annular array, and the interior of the hollow support rods 810 is connected to the interior of the hollow lifting platform 800. The outer side of the base plate 600 is provided with a driving mechanism 200 for driving the first piston assembly 610 and the second piston assembly 620 to perform piston movement and an air suction pump 100 for suctioning the interior of the hollow wafer carrier 700 and the hollow lifting platform 800. When the air suction pump 100 is started to suction the interior of the hollow wafer carrier 700 or the hollow lifting platform 800, the air suction hole 720 or the top opening of the hollow support rod 810 will have a certain suction force.

[0034] The outer walls of the hollow wafer carrier 700 and the hollow lifting platform 800 are both provided with three first sliders 710, and the first sliders 710 are distributed in a ring array, and the other end of the first slider 710 is installed on the first slide rail 631, and the first slider 710 and the first slide rail 631 are slidably connected, and the first slide rail 631 is installed on one side outer wall of the side plate 630, and the side plate 630 is installed at the edge of the upper surface of the bottom plate 600. There are three side plates 630, and the three side plates 630 are distributed in a ring array. The setting of the first slider 710 and the first slide rail 631 enhances the stability of the hollow wafer carrier 700 and the hollow lifting platform 800 when moving in the Y-axis direction, thereby enhancing the stability of the wafer product during lifting and lowering.

[0035] The outer walls of the hollow wafer carrier 700 and the hollow lifting platform 800 are both provided with ventilation pipes 820, and the other ends of the ventilation pipes 820 are connected to the three-way pipe joint 300 through the connecting pipe 500. The three-way pipe joint 300 is installed on the suction end on the outer wall of one side of the suction pump 100, and an electromagnetic valve is provided on the ventilation pipe 820. With the cooperation of the ventilation pipe 820, the three-way pipe joint 300, the connecting pipe 500 and other structures, when the suction pump 100 is started, the gas can circulate in the ventilation pipe 820, the three-way pipe joint 300, the connecting pipe 500 and other structures, so that the suction hole 720 or the top opening of the hollow support rod 810 has a certain suction force.

[0036] The driving mechanism 200 is provided with a moving plate 220, a threaded hole 222 is provided on the surface of the moving plate 220, a rotating shaft 230 is installed in the threaded hole 222, an external thread is provided on the outer wall of the rotating shaft 230, and the external thread on the outer wall of the rotating shaft 230 is threadedly connected with the threaded hole 222, the top end of the rotating shaft 230 passes through the bearing on the surface of the supporting plate 215 and is connected to the reduction motor 240 through a coupling, the supporting plate 215 is installed above the rear end wall of the mounting plate 212, the reduction motor 240 is installed on the upper surface of the mounting frame 214, and the reduction motor The output shaft on the machine 240 passes through the surface of the mounting frame 214, the mounting frame 214 is installed on the upper surface of the support plate 215, the bottom end of the rotating shaft 230 is installed in the bearing seat 211, and the bearing seat 211 and the mounting plate 212 are both installed on the top of the mounting seat 210, and the bearing seat 211 is located on one side of the mounting plate 212. Because the external thread on the outer wall of the rotating shaft 230 is threadedly connected with the threaded hole 222, when the reduction motor 240 is started and drives the rotating shaft 230 to rotate forward or reverse, the moving plate 220 will make a linear motion in the Y-axis direction.

[0037] A second slider 224 is installed on the rear end wall of the movable plate 220, and the other end of the second slider 224 is installed on the second slide rail 213. The second slider 224 and the second slide rail 213 are slidably connected, and the second slide rail 213 is installed on the rear end wall of the mounting plate 212. The setting of the second slider 224 and the second slide rail 213 can play a role of limiting and guiding the movement of the movable plate 220, thereby avoiding the situation that the movable plate 220 rotates with the rotation of the rotating shaft 230. A pointer 223 is installed on one side of the rear end wall of the movable plate 220, and a scale mark 216 is set on the outer wall of one side of the mounting plate 212. With the setting of the pointer 223 and the scale mark 216, when the movable plate 220 moves in the Y-axis direction, the staff can control the distance moved by the hollow lifting platform 800 and the hollow wafer carrier 700 by observing the scale mark 216 pointed to by the pointer 223.

[0038] A second connecting plate 221 is installed on the rear end wall of the movable plate 220, and the lower surface of the second connecting plate 221 is connected to the first connecting plate 260 through a shock absorbing assembly 250, and a third piston assembly 270 is installed on the lower surface of the first connecting plate 260. The setting of the shock absorbing assembly 250 allows the shock absorbing assembly 250 to play a role in buffering and shock absorption in the Y-axis direction, thereby preventing the vibration generated during the movement of the reduction motor 240, the rotating shaft 230 and other structures from being transmitted to the third piston assembly 270, thereby causing large fluctuations in the flow of liquid in the third piston assembly 270.

[0039] The first piston assembly 610, the second piston assembly 620 and the third piston assembly 270 are all composed of a piston rod 271, a piston cylinder 272, a rubber piston 273 and a liquid pipe 274. The rubber piston 273 is arranged inside the piston cylinder 272, and the piston rod 271 is installed on the top of the rubber piston 273, and the other end of the piston rod 271 extends to the outside. A liquid pipe 274 is arranged below one side of the outer wall of the piston cylinder 272, and an electromagnetic valve is arranged on the liquid pipe 274.

[0040] A four-way pipe joint 400 is installed on the liquid pipe 274 on the third piston assembly 270 . The four-way pipe joint 400 is connected to the liquid pipes 274 on one first piston assembly 610 and two second piston assemblies 620 through three connecting pipes 500 .

[0041] The piston cylinder 272 on the first piston assembly 610 is installed on both sides of the upper surface of the base plate 600, and the other end of the piston rod 271 on the first piston assembly 610 is installed on the lower surface of the hollow lifting platform 800, the other end of the piston rod 271 on the second piston assembly 620 passes through the second annular partition 830 and is installed on the lower surface of the hollow wafer carrier 700, and the other end of the hollow support rod 810 passes through the first annular partition 730 and extends to the outside.

[0042] During use, when the robot moves the wafer product to the position directly above the hollow wafer carrier 700, the staff starts the reduction motor 240 on the driving mechanism 200 and opens the solenoid valves on the liquid pipes 274 on the first piston assembly 610 and the third piston assembly 270, and starts the suction pump 100 and opens the solenoid valve on the ventilation pipe 820. The reduction motor 240 starts to drive the shaft 230 to rotate forward or reverse. Because the external thread on the outer wall of the shaft 230 is threadedly connected to the threaded hole 222, when the shaft 230 rotates forward or reversely, the moving plate 220 will make a linear motion in the Y-axis direction. When the moving plate 220 makes a linear motion in the Y-axis direction, the rubber piston 273 on the third piston assembly 270 will be moved. When the piston moves in the piston cylinder 272 and the staff makes the rubber piston 273 on the third piston assembly 270 move downward in the Y-axis direction, the rubber piston 273 on the third piston assembly 270 compresses the liquid in the piston cylinder 272, causing the fluid to flow into the piston cylinder 272 on the first piston assembly 610. At this time, the piston rod 271 on the first piston assembly 610 moves upward in the Y-axis direction. When the piston rod 271 on the first piston assembly 610 moves upward in the Y-axis direction, it drives the hollow support rod 810 on the hollow lifting platform 800 to move upward in the Y-axis direction. When the top of the hollow support rod 810 contacts and supports the bottom of the wafer product, the hollow support rod 810 adsorbs the wafer. After the staff closes the solenoid valve on the liquid pipe 274 of the first piston assembly 610 and opens the solenoid valve on the liquid pipe 274 of the second piston assembly 620, the staff starts the reduction motor 240 again and makes the rubber piston 273 on the third piston assembly 270 move downward in the Y-axis direction. At this time, the second piston The piston rod 271 on the assembly 620 moves upward in the Y-axis direction. When the piston rod 271 on the second piston assembly 620 moves upward in the Y-axis direction, it will drive the hollow wafer carrier 700 to move upward in the Y-axis direction. When the top of the hollow wafer carrier 700 contacts and supports the bottom of the wafer product, the hollow wafer carrier 700 absorbs the bottom of the wafer product. The staff turns off the reduction motor 240 and the solenoid valve on the first ventilation pipe on the hollow lifting platform 800. The staff starts the reduction motor 240 again and makes the rubber piston 273 on the third piston assembly 270 move downward in the Y-axis direction. At this time, the piston rod 271 on the second piston assembly 620 moves upward in the Y-axis direction.When the piston rod 271 on the second piston assembly 620 moves upward in the Y-axis direction, it will drive the wafer product on the hollow wafer carrier 700 to move to the preset position for deposition. After the hollow wafer carrier 700 supports and adsorbs the wafer product, when the hollow wafer carrier 700 moves in the Y-axis direction, the hollow wafer carrier 700 can provide nearly stable support for the wafer product, further effectively avoiding the horizontal displacement or slipping of the wafer product during the removal of the robot and other structures.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer stable lifting device, comprising a hollow lifting platform (800), characterized in that: A hollow wafer carrier (700) for carrying and adsorbing wafers is arranged directly above the hollow lifting platform (800), and a bottom plate (600) is arranged directly below the hollow lifting platform (800), and a first piston assembly (610) for driving the hollow wafer carrier (700) to move up and down in the Y-axis direction and a second piston assembly (620) for driving the hollow lifting platform (800) to move up and down in the Y-axis direction are installed on the upper surface of the bottom plate (600); The surface of the hollow wafer carrier (700) is provided with a first annular partition (730) and an air suction hole (720) for adsorbing the wafer, there are four first annular partitions (730), the four first annular partitions (730) are distributed in an annular array, the air suction hole (720) is located on the inner side of the first annular partition (730), and the interior of the air suction hole (720) is connected to the interior of the hollow wafer carrier (700); A second annular partition plate (830) is arranged at the center of the surface of the hollow lifting platform (800), and a hollow support rod (810) for supporting and adsorbing the wafer is arranged on the upper surface of the hollow lifting platform (800), and there are four hollow support rods (810), which are distributed in an annular array, and the interior of the hollow support rods (810) is connected to the interior of the hollow lifting platform (800); The outer side of the base plate (600) is provided with a driving mechanism (200) for driving the first piston assembly (610) and the second piston assembly (620) to perform piston movement, and an air suction pump (100) for suctioning the inside of the hollow wafer carrier (700) and the hollow lifting platform (800).

2. The wafer stable lifting device according to claim 1, characterized in that: The outer walls of the hollow wafer carrier (700) and the hollow lifting platform (800) are both provided with three first sliders (710), and the first sliders (710) are distributed in a ring array, and the other end of the first slider (710) is installed on the first slide rail (631), the first slider (710) and the first slide rail (631) are slidably connected, and the first slide rail (631) is installed on one side outer wall of the side plate (630), the side plate (630) is installed at the edge of the upper surface of the bottom plate (600), there are three side plates (630), and the three side plates (630) are distributed in a ring array.

3. The wafer stable lifting device according to claim 1, characterized in that: The outer walls of the hollow wafer carrier (700) and the hollow lifting platform (800) are both provided with a ventilation pipe (820), the other end of the ventilation pipe (820) is connected to a three-way pipe joint (300) via a connecting pipe (500), the three-way pipe joint (300) is installed on the suction end on the outer wall of one side of the suction pump (100), and a solenoid valve is provided on the ventilation pipe (820).

4. The wafer stable lifting device according to claim 1, characterized in that: The driving mechanism (200) is provided with a movable plate (220), a threaded hole (222) is provided on the surface of the movable plate (220), a rotating shaft (230) is installed in the threaded hole (222), an external thread is provided on the outer wall of the rotating shaft (230), and the external thread on the outer wall of the rotating shaft (230) and the threaded hole (222) are threadedly connected, the top end of the rotating shaft (230) passes through the bearing on the surface of the support plate (215) and is connected to the reduction motor (240) through a coupling, and the support plate (21 5) is mounted above the rear end wall of the mounting plate (212), the reduction motor (240) is mounted on the upper surface of the mounting frame (214), the output shaft of the reduction motor (240) passes through the surface of the mounting frame (214), the mounting frame (214) is mounted on the upper surface of the support plate (215), the bottom end of the rotating shaft (230) is mounted in the bearing seat (211), and the bearing seat (211) and the mounting plate (212) are both mounted on the top of the mounting seat (210), and the bearing seat (211) is located on one side of the mounting plate (212).

5. The wafer stable lifting device according to claim 4, characterized in that: A second slider (224) is mounted on the rear end wall of the movable plate (220), the other end of the second slider (224) is mounted on the second slide rail (213), the second slider (224) and the second slide rail (213) are slidably connected, and the second slide rail (213) is mounted on the rear end wall of the mounting plate (212), a pointer (223) is mounted on one side of the rear end wall of the movable plate (220), and a scale mark (216) is provided on one side outer wall of the mounting plate (212).

6. The wafer stable lifting device according to claim 5, characterized in that: A second connecting plate (221) is mounted on the rear end wall of the movable plate (220); the lower surface of the second connecting plate (221) is connected to the first connecting plate (260) via a shock absorbing assembly (250); and a third piston assembly (270) is mounted on the lower surface of the first connecting plate (260).

7. The wafer stable lifting device according to claim 6, characterized in that: The first piston assembly (610), the second piston assembly (620) and the third piston assembly (270) are all composed of a piston rod (271), a piston cylinder (272), a rubber piston (273) and a liquid passage tube (274); a rubber piston (273) is arranged inside the piston cylinder (272); a piston rod (271) is installed on the top end of the rubber piston (273); the other end of the piston rod (271) extends to the outside; a liquid passage tube (274) is arranged below one side of the outer wall of the piston cylinder (272); and a solenoid valve is arranged on the liquid passage tube (274).

8. The wafer stable lifting device according to claim 7, characterized in that: A four-way pipe joint (400) is installed on the liquid passage pipe (274) on the third piston assembly (270), and the four-way pipe joint (400) is respectively connected to the liquid passage pipes (274) on one first piston assembly (610) and two second piston assemblies (620) through three connecting pipes (500).

9. The wafer stable lifting device according to claim 8, characterized in that: The piston cylinder (272) on the first piston assembly (610) is installed on both sides of the upper surface of the base plate (600), and the other end of the piston rod (271) on the first piston assembly (610) is installed on the lower surface of the hollow lifting platform (800), the other end of the piston rod (271) on the second piston assembly (620) passes through the second annular partition (830) and is installed on the lower surface of the hollow wafer carrier (700), and the other end of the hollow support rod (810) passes through the first annular partition (730) and extends to the outside.

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