Plating apparatus and plating solution discharge method

Abstract

The present invention suppresses generation of plating defects caused by bubbles generated from an anode, and simplifies a configuration related to supply of a plating solution. A plating module (400) includes: a plating bath (410) for housing a plating solution; an anode (430) disposed in the plating bath (410); a substrate holder (440) configured to hold a substrate (Wf) in a state in which a plating surface (Wf-a) faces downward; a diaphragm (420) that separates an anode region (424) in which the anode (430) is disposed and a cathode region (422) in which the substrate (Wf) is disposed at the time of a plating process, the diaphragm having an inclined surface (423a) that opposes the anode (430); a supply port (412) for supplying the plating solution to the anode region (424); and a gas-liquid pipe (470) having a first end portion (472) that opens near an upper end of the inclined surface (423a) of the diaphragm (420) and a second end portion (474) that opens above the plating surface of the substrate at the time of the plating process, the gas-liquid pipe being configured to supply the plating solution supplied from the supply port (412) to the anode region (424) to the cathode region (422) via the second end portion (474).

Description

TECHNICAL FIELD

[0001] The present application relates to a plating apparatus and a plating solution discharge method. BACKGROUND

[0002] As one example of a plating apparatus, a cup-type electrolytic plating apparatus is known. In the cup-type electrolytic plating apparatus, a substrate (for example, a semiconductor wafer) having a plating surface facing downward is held by a substrate holder, and the substrate is immersed in a plating solution. A voltage is applied between the substrate (cathode) and an anode, and thereby an electrically conductive film is deposited on the surface of the substrate.

[0003] A cup-type plating apparatus is disclosed in Patent Literature 1. The plating apparatus is configured to have a film having an inclination provided between the anode and the cathode. The film captures bubbles generated from the anode and discharges the bubbles, and thereby plating defects caused by the bubbles adhering to the plating surface of the substrate are suppressed.

[0004] Patent Literature 1: U.S. Patent No. 6126798

[0005] The plating apparatus disclosed in Patent Literature 1 is configured to suppress the generation of plating defects caused by bubbles adhering to the plating surface of the substrate. However, the plating apparatus does not consider simplifying the configuration related to the supply of the plating solution with respect to the plating bath.

[0006] That is, the plating apparatus disclosed in Patent Literature 1 is provided with a pipe for supplying the plating solution to the anode region and the cathode region, respectively. Therefore, the number of pipes increases, and as a result, the configuration of the plating apparatus is complicated. SUMMARY

[0007] Therefore, one object of the present application is to suppress the generation of plating defects caused by bubbles generated from the anode, and to simplify the configuration related to the supply of the plating solution.

[0008] According to one embodiment, a plating apparatus is disclosed, including: a plating bath for accommodating a plating solution; an anode disposed in the plating bath; a substrate holder configured to hold a substrate with a plating surface facing downward; a diaphragm separating an anode region in which the anode is disposed and a cathode region in which the substrate is disposed during a plating process, the diaphragm having an inclined surface opposite the anode; a supply port for supplying the plating solution to the anode region; and a gas-liquid pipe having a first end portion opening near an upper end of the inclined surface of the diaphragm and a second end portion opening above the plating surface of the substrate during the plating process, the gas-liquid pipe configured to supply the plating solution supplied from the supply port to the anode region to the cathode region via the second end portion. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1is a perspective view showing the overall structure of a plating device of one embodiment.

[0010] Figure 2 is a plan view showing the overall structure of a plating device of one embodiment.

[0011] Figure 3 is a longitudinal sectional view schematically showing the structure of a plating module of one embodiment.

[0012] Figure 4 is a longitudinal sectional view schematically showing the structure of a check valve of one embodiment.

[0013] Figure 5 is a longitudinal sectional view schematically showing the structure of a gas-liquid piping of one embodiment.

[0014] Figure 6 is a flowchart of a plating processing method including a plating solution discharging method of one embodiment. DETAILED DESCRIPTION

[0015] Hereinafter, an embodiment of the present application will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted with the same reference numerals, and repetitive description is omitted.

[0016] <Overall structure of plating device>

[0017] Figure 1 is a perspective view showing the overall structure of a plating device of one embodiment. Figure 2 is a plan view showing the overall structure of a plating device of one embodiment. As shown in Figure 1 2 , the plating device 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dip module 300, a plating module 400, a cleaning module 500, a spin-rinse-dry device 600, a transfer device 700, and a control module 800.

[0018] The load port 100 is a module for carrying in or out of the plating device 1000 a substrate housed in a cassette such as a FOUP, or the like. In this embodiment, four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer a substrate between the load port 100, the aligner 120, the pre-wetting module 200, and the spin-rinse-dry device 600. The transfer robot 110 and the transfer device 700 can transfer a substrate via an unillustrated temporary placement table when a substrate is transferred between the transfer robot 110 and the transfer device 700.

[0019] ​The aligner 120 is a module for aligning the orientation plane, notch, or the like of the substrate in a prescribed direction. In the present embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wetting module 200 wets the plating surface of the substrate before plating processing with a processing liquid such as pure water or degassed water, thereby replacing air inside the pattern formed on the surface of the substrate with the processing liquid. The pre-wetting module 200 is configured to perform a pre-wetting process that is a process for easily supplying plating liquid to the inside of the pattern by replacing the processing liquid inside the pattern with plating liquid at the time of plating. In the present embodiment, two pre-wetting modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are arbitrary.

[0020] The pre-dip module 300 is configured to perform a pre-dip process that is a process for cleaning or activating the plating substrate surface by etching and removing an oxidation film having a large resistance that exists on the surface of the seed layer formed on the plating surface of the substrate before plating processing, for example, with a processing liquid such as sulfuric acid or hydrochloric acid. In the present embodiment, two pre-dip modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-dip modules 300 are arbitrary. The plating module 400 performs plating processing on the substrate. In the present embodiment, there are two groups of twelve plating modules 400 arranged three in the vertical direction and four in the horizontal direction, and a total of twenty-four plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0021] The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove plating liquid or the like remaining on the substrate after plating processing. In the present embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin-rinse-dry device 600 is a module for rotating the substrate at high speed after the cleaning process and drying. In the present embodiment, two spin-rinse-dry devices are arranged side by side in the vertical direction, but the number and arrangement of the spin-rinse-dry devices are arbitrary. The conveyance device 700 is a device for conveying the substrate between the plurality of modules in the plating apparatus 1000. The control module 800 is configured to control the plurality of modules of the plating apparatus 1000, and for example, can be constituted by a general-purpose computer or a dedicated computer provided with an input-output interface with an operator.

[0022] An example of a series of plating processes based on the plating apparatus 1000 will be described. First, the substrate housed in the cassette is carried into the load port 100. Next, the substrate is taken out of the cassette of the load port 100 by the conveyance robot 110, and is carried to the aligner 120. The aligner 120 aligns the orientation plane, notch, or the like of the substrate in a prescribed direction. The conveyance robot 110 hands over the substrate whose direction has been aligned by the aligner 120 to the pre-wetting module 200.

[0023] The pre-wetting module 200 performs a pre-wetting process on the substrate. The handling device 700 carries the substrate on which the pre-wetting process has been performed to the pre-dipping module 300. The pre-dipping module 300 performs a pre-dipping process on the substrate. The handling device 700 carries the substrate on which the pre-dipping process has been performed to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0024] The handling device 700 carries the substrate on which the plating process has been performed to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The handling device 700 carries the substrate on which the cleaning process has been performed to the spin-rinse-dry device 600. The spin-rinse-dry device 600 performs a drying process on the substrate. The handling robot 110 receives the substrate from the spin-rinse-dry device 600 and carries the substrate on which the drying process has been performed to the cassette of the load port 100. Finally, the cassette in which the substrate is accommodated is carried out from the load port 100.

[0025] Structure of the plating module

[0026] Next, the structure of the plating module 400 will be described. Since the twenty-four plating modules 400 in the present embodiment are of the same structure, only one plating module 400 will be described. Figure 3 is a longitudinal sectional view schematically showing the structure of the plating module of one embodiment.

[0027] As shown in Figure 3 , the plating module 400 has a plating bath 410 for accommodating a plating solution. The plating bath 410 is configured to have a bottom wall 411 of a circular plate shape and a side wall 413 of a cylindrical shape surrounding a peripheral portion of the bottom wall 411, and an upper surface is open. The side wall 413 is configured to have a first side wall 413-1 of a cylindrical shape connected to the peripheral portion of the bottom wall 411 and having a first thickness, and a second side wall 413-2 of a cylindrical shape disposed at an upper portion of the first side wall 413-1 and having a second thickness thinner than the first thickness.

[0028] The plating module 400 has an anode 430 disposed at a bottom portion of the plating bath 410. The anode 430 can be a dissolving anode or a non-dissolving anode. The plating module 400 has a diaphragm 420 that separates an inside of the plating bath 410 in the vertical direction. The diaphragm 420 is a film that separates an anode region 424 in which the anode 430 is disposed and a cathode region 422 in which the substrate Wf is disposed at the time of the plating process. The electric resistor 450 is disposed in the cathode region 422 in opposition to the diaphragm 420. The electric resistor 450 is a member for achieving uniformity of the plating process of the plated surface Wf-a of the substrate Wf, and is configured by a plate-shaped member in which a plurality of holes are formed.

[0029] The plating module 400 has a substrate holder 440 for holding a substrate Wf (e.g., a circular plate-shaped substrate) in a state where a plating surface Wf-a is directed downward. The substrate holder 440 has a power supply contact for supplying power to the substrate Wf from a power source not shown. The substrate holder 440 has a seal ring holder 442 for supporting an outer edge portion of the plating surface Wf-a of the substrate Wf, and a frame 446 for holding the seal ring holder 442 to a substrate holder main body not shown. In addition, the substrate holder 440 has a back plate 444 for pressing a back surface of the plating surface Wf-a of the substrate Wf, and a shaft 448 mounted to a back surface of a substrate pressing surface of the back plate 444.

[0030] The plating module 400 has a lifting mechanism 443 for lifting the substrate holder 440, and a rotating mechanism 447 for rotating the substrate holder 440 so that the substrate Wf rotates around an imaginary axis of the shaft 448 (an imaginary rotating axis extending in the center of the plating surface Wf-a vertically). The lifting mechanism 443 and the rotating mechanism 447 can be implemented by known mechanisms such as a motor, for example. The plating module 400 is configured to immerse the substrate Wf in the plating solution in the cathode region 422 using the lifting mechanism 443, and to apply a voltage between the anode 430 and the substrate Wf, thereby performing a plating process on the plating surface Wf-a of the substrate Wf.

[0031] In addition, the plating module 400 has a paddle 460 disposed between the anode 430 and the substrate Wf, specifically between the resistor 450 and the substrate Wf. The paddle 460 is disposed opposite the plating surface Wf-a of the substrate Wf. The plating module 400 has a driving mechanism 462 for reciprocally moving the paddle 460 along the plating surface Wf-a of the substrate Wf. The driving mechanism 462 can be implemented by known mechanisms such as a motor, for example. The plating module 400 can stir the plating solution by reciprocally moving the paddle 460, thereby improving the uniformity of plating formed on the plating surface.

[0032] The plating module 400 has a supply port 412 for supplying the plating solution to the anode region 424. The supply port 412 is formed in the center of a bottom wall 411 of the plating bath 410. The plating module 400 has a common pipe 414 connected to the supply port 412, and a supply pipe 414-1 and a discharge pipe 414-2 branched from the common pipe 414. The supply pipe 414-1 is connected to a liquid storage tank 416 for storing the plating solution, a pump 417 for pressure feeding the plating solution stored in the liquid storage tank 416, and a supply valve 418 for opening and closing the supply pipe 414-1. The discharge pipe 414-2 is connected to a discharge valve 419 for opening and closing the discharge pipe 414-2.

[0033] The plating module 400 can supply the plating solution to the plating bath 410 by opening the supply valve 418, closing the discharge valve 419, and starting the pump 417. On the other hand, the plating module 400 can discharge the plating solution from the plating bath 410 by stopping the pump 417, closing the supply valve 418, and opening the discharge valve 419.

[0034] <Diaphragm>

[0035] The diaphragm 420 functions to trap the gas bubbles generated from the anode 430. The diaphragm 420 is formed to have an inclined shape in order to discharge the trapped gas bubbles to the outside of the plating module 400. Specifically, the diaphragm 420 is formed in a reverse conical shape having a central part 421 disposed at the center in the radial direction of the plating bath 410, and an inclined film 423 extending radially from the central part 421 toward the upper oblique direction. Thus, the diaphragm 420 has an inclined surface 423a facing the anode 430 at the bottom surface of the inclined film 423. In addition, in the present specification, the inclined surface refers to a surface inclined with respect to the horizontal surface. Further, the diaphragm 420 is not limited to the reverse conical shape, but can be any shape as long as the diaphragm 420 has the inclined surface 423a facing the anode 430. The inclined film 423 can be any film as long as the film is a material capable of trapping the gas bubbles generated from the anode 430.

[0036] According to the plating module 400 of the present embodiment, since the diaphragm 420 has the inclined surface 423a, the diaphragm 420 can move the gas bubbles trapped thereby along the inclined surface 423a toward the upper oblique direction. As a result, the diaphragm 420 can move the gas bubbles trapped thereby toward the upper end of the inclined surface 423a.

[0037] <Check Valve>

[0038] The plating module 400 has a check valve 425 disposed at the central part 421 of the diaphragm 420. Figure 4 is a longitudinal sectional view schematically showing the structure of the check valve. Figure 4 The region α in Figure 3 is shown in an enlarged manner, and shows the state in which the check valve 425 is "closed" (left side) and the state in which the check valve 425 is "open" (right side), respectively.

[0039] As shown in Figure 4 , the check valve 425 has a valve case 426 forming a flow path 426a that communicates the anode region 424 with the cathode region 422, a valve seat 426b provided at the flow path 426a, and a float-type valve core 427 disposed below the valve seat 426b of the flow path 426a and formed so as to be able to abut against the valve seat 426b. The valve core 427 is formed of a substance having a specific gravity less than 1.

[0040] At the start of plating processing, plating solution is supplied from the supply port 412 to the anode region 424, and if the liquid level rises to the valve core 427, the valve core 427 rises to abut against the valve seat 426b. Thus, the check valve 425 becomes "closed", and therefore plating solution and bubbles are not supplied from the anode region 424 to the cathode region 422 through the flow path 426a. On the other hand, if plating solution is discharged after plating processing, the liquid level of the plating solution in the anode region 424 falls to the valve core 427, and the valve core 427 falls away from the valve seat 426b. Thus, the check valve 425 becomes "open", and therefore plating solution flows from the cathode region 422 to the anode region 424 through the flow path 426a.

[0041] <Gas-liquid pipe>

[0042] As shown in Figure 3 , the plating module 400 is provided with a gas-liquid pipe 470 for discharging bubbles captured by the diaphragm 420 and supplying plating solution to the cathode region 422. Further, in the present embodiment, although an example is shown in which the plating module 400 is provided with two gas-liquid pipes 470 facing each other across the center of the plating bath 410, it is not limited thereto. The plating module 400 can be provided with one gas-liquid pipe 470, or three or more gas-liquid pipes 470 can be provided at equal or unequal intervals along the circumference of the plating bath 410.

[0043] Figure 5 is a longitudinal sectional view schematically showing the structure of the gas-liquid pipe of one embodiment. Figure 5 The region β in Figure 3 is shown enlarged, and components are omitted as appropriate to depict. The two gas-liquid pipes 470 have the same structure except for the different arrangement positions, and therefore in Figure 5 , only one gas-liquid pipe 470 is described. As shown in Figure 5 , the gas-liquid pipe 470 has a first end portion 472 that opens near the upper end of the inclined surface 423a of the diaphragm 420 in the anode region 424.

[0044] In the present embodiment, a bubble storage region BA in which bubbles captured by the diaphragm 420 are aggregated is formed near the upper end of the inclined surface 423a. That is, the end portion 423b of the inclined film 423 on the side opposite the central member 421 is connected to the peripheral portion of the bottom surface of the resistor 450 at a prescribed distance from the inner surface of the first side wall 413-1. Thus, a ring-shaped flow path is formed that is surrounded by the end portion 423b of the inclined film 423, the peripheral portion of the bottom surface of the resistor 450, and the inner surface of the first side wall 413-1. The ring-shaped flow path is formed by these three surfaces, and therefore a certain amount of bubbles can be aggregated in the bubble storage region BA. The first end portion 472 opens toward the bubble storage region BA at the bottom surface of the resistor 450.

[0045] Further, the gas-liquid pipe 470 has a second end portion 474 that is opened upward of the plated surface Wf-a of the substrate Wf at the time of plating treatment and inside the plating bath 410. The gas-liquid pipe 470 extends upward from the first end portion 472 through the inside of the resistor 450, extends radially outward through the inside of the resistor 450 and the first side wall 413-1, further extends upward inside the second side wall 413-2, and reaches the second end portion 474. The gas bubbles accumulated in the gas bubble accumulation region BA are discharged from the second end portion 474 through the gas-liquid pipe 470. The second end portion 474 is opened upward of the plated surface Wf-a, and thus the gas bubbles discharged from the second end portion 474 can be prevented from adhering to the plated surface Wf-a.

[0046] The gas-liquid pipe 470 not only discharges the gas bubbles but also supplies the plating liquid supplied from the supply port 412 to the anode region 424 to the cathode region 422 through the second end portion 474. That is, if the plating liquid supplied from the supply port 412 fills the anode region 424 and the plating liquid is further pressure-fed to the anode region 424 from the pump 417, the plating liquid flows from the first end portion 472 to the gas-liquid pipe 470. This is because the flow resistance of the plating liquid through the diaphragm 420 is large and the flow resistance of the plating liquid through the first end portion 472 is small. If the plating liquid is further pressure-fed to the anode region 424 from the pump 417, the plating liquid flowing to the gas-liquid pipe 470 is supplied to the cathode region 422 through the second end portion 474. Thus, the cathode region 422 is filled with the plating liquid.

[0047] In the present embodiment, the second end portion 474 of the gas-liquid pipe 470 is opened downward of the plating liquid surface OF of the plating liquid accommodated in the plating bath 410 at the time of plating treatment. That is, the plating module 400 is configured to perform plating treatment while the plating liquid supplied to the cathode region 422 overflows from the second side wall 413-2. Thus, the plating liquid surface OF becomes a height position corresponding to the upper end of the second side wall 413-2. By opening the second end portion 474 downward of the plating liquid surface OF, the additives contained in the plating liquid supplied from the second end portion 474 can contribute to the plating treatment.

[0048] However, not limited thereto, the second end portion 474 of the gas-liquid pipe 470 can also be opened above the plating liquid surface OF housed in the plating bath 410 at the time of plating processing. That is, in the present specification, "opened inside the plating bath 410" means that the second end portion 474 is located inside the second side wall 413-2 of the plating bath 410 when the plating module 400 is viewed from above. Thus, the second end portion 474 can be opened in a region lower than the upper end portion of the second side wall 413-2 (plating liquid surface OF), or can be opened in a region higher than the upper end portion of the second side wall 413-2 (plating liquid surface OF). In any case, as long as the second end portion 474 is opened inside the plating bath 410, the plating liquid flowing from the second end portion 474 is supplied to the cathode region 422.

[0049] According to the plating module 400 of the present embodiment, generation of plating defects due to gas bubbles generated from the anode can be suppressed, and the configuration relating to the supply of the plating liquid can be simplified. That is, the gas bubbles generated from the anode 430 can be captured by the diaphragm 420 and discharged to a region higher than the plated surface of the substrate by the gas-liquid pipe 470, so that the gas bubbles can be suppressed from adhering to the plated surface to cause plating defects. In addition, the plating liquid can be supplied from the anode region 424 to the cathode region 422 via the gas-liquid pipe 470, so that supply pipes do not need to be separately provided in the anode region 424 and the cathode region 422, and the configuration relating to the supply of the plating liquid can be simplified.

[0050] In addition, according to the plating module 400 of the present embodiment, the plating liquid can be transported from the cathode region 422 to the anode region 424 via the check valve 425 and discharged from the discharge pipe 414-2, so that discharge pipes do not need to be separately provided in the anode region 424 and the cathode region 422, and the configuration relating to the discharge of the plating liquid can be simplified. In addition, according to the plating module 400 of the present embodiment, the plating liquid is caused to fall from the cathode region 422 to the anode region 424 via the check valve 425 and discharged, so that more by-products (sludge) adhering to the surface of the anode 430 can be washed away.

[0051] <Plating processing method>

[0052] Figure 6 is a flowchart of a plating processing method including the plating liquid discharge method of one embodiment. The following plating processing method starts in a state where the plating bath 410 is not filled with the plating liquid, and the supply valve 418 and the discharge valve 419 are closed.

[0053] The plating processing method first performs a step of opening the supply valve 418 and starting the pump 417 (S101). Thus, the supply pipe 414-1 is opened, and the plating liquid accumulated in the liquid reservoir 416 is supplied from the supply port 412 to the anode region 424.

[0054] Next, the plating processing method executes a step (S102) of raising the plating liquid level of the anode region 424 to close the check valve 425 by supplying the plating liquid to the anode region 424. Specifically, S102 is executed by the following manner: if the plating liquid level of the anode region 424 rises to the spool 427, the spool 427 rises along with the rise of the plating liquid level to abut against the valve seat 426b, thereby closing the flow path 426a.

[0055] Next, the plating processing method executes a step (S103) of raising the flow resistance of the entire diaphragm 420 including the flow path 426a by closing the check valve 425, thereby supplying the plating liquid from the gas-liquid pipe 470 to the cathode region 422.

[0056] The plating processing method executes a step (S104) of capturing the gas bubbles generated from the anode 430 by the diaphragm 420, and discharging the captured gas bubbles to the upper side of the plated surface Wf-a of the substrate Wf via the gas-liquid pipe 470. Specifically, the gas bubbles captured by the diaphragm 420 move in the upward direction along the inclined surface 423a, and the gas bubbles accumulated in the gas bubble storage region BA near the upper end of the inclined surface 423a are discharged to the upper side of the plated surface Wf-a of the substrate Wf via the gas-liquid pipe 470.

[0057] If the plating liquid fills the plating bath 410, the plating processing method executes a plating process by applying a voltage between the substrate Wf (cathode) and the anode (step S105). If the plating process ends, the plating processing method executes a step (S106) of stopping the pump 417 and closing the supply valve 418.

[0058] Next, the plating processing method executes a step (S107) of discharging the plating liquid from the anode region 424 by opening the discharge valve 419 and opening the discharge pipe 414-2.

[0059] Next, the plating processing method executes a step (S108) of lowering the plating liquid level of the anode region 424 by discharging the plating liquid from the anode region 424, thereby opening the check valve 425 provided to the diaphragm 420 that separates the anode region 424 and the cathode region 422. Specifically, S108 is executed by the following manner: if the plating liquid level of the anode region 424 falls to the spool 427, the spool 427 falls along with the fall of the plating liquid level to depart from the valve seat 426b, thereby opening the flow path 426a.

[0060] Next, the plating processing method executes a step (S109) of supplying the plating liquid of the cathode region 422 to the anode region 424 via the flow path 426a and discharging from the discharge pipe 414-2 by opening the check valve 425.

[0061] According to the plating processing method of the present embodiment, the bubbles generated from the anode 430 can be captured and discharged upward from the plated surface of the substrate, and thus plating defects due to the bubbles adhering to the plated surface can be suppressed. Further, according to the plating processing method of the present embodiment, the plating solution can be supplied from the anode region 424 to the cathode region 422 via the gas-liquid pipe 470, and thus the supply pipe does not need to be separately provided in the anode region 424 and the cathode region 422, and the configuration related to the supply of the plating solution can be simplified. Further, according to the plating processing method of the present embodiment, the plating solution can be transported from the cathode region 422 to the anode region 424 via the check valve 425 and discharged from the discharge pipe 414-2, and thus the discharge pipe does not need to be separately provided in the anode region 424 and the cathode region 422, and the configuration related to the discharge of the plating solution can be simplified. Further, according to the plating processing method of the present embodiment, the plating solution falls from the cathode region 422 to the anode region 424 via the check valve 425 and is discharged, and thus more by-products (sludge) adhering to the surface of the anode 430 can be washed away.

[0062] The above-described embodiments of the application are for easy understanding of the application, and are not intended to limit the application. The application can be changed and modified without departing from the spirit thereof, and the application naturally includes equivalents thereof. Further, any combination or omission of the respective components described in the claims and the specification can be made within the range in which at least a part of the above-described problems can be solved or at least a part of the effects can be exerted.

[0063] As one embodiment, the present application discloses a plating device including: a plating bath for housing a plating solution; an anode disposed in the plating bath; a substrate holder configured to hold a substrate in a state in which a plated surface faces downward; a diaphragm that separates an anode region in which the anode is disposed and a cathode region in which the substrate is disposed during plating processing, the diaphragm having an inclined surface opposite the anode; a supply port for supplying the plating solution to the anode region; and a gas-liquid pipe having a first end portion that opens near an upper end of the inclined surface of the diaphragm and a second end portion that opens upward from the plated surface of the substrate during plating processing, the gas-liquid pipe being configured to supply the plating solution supplied from the supply port to the anode region to the cathode region via the second end portion.

[0064] Further, as one embodiment, the present application discloses a plating device, wherein the second end portion of the gas-liquid pipe is configured to open downward from the surface of the plating solution housed in the plating bath.

[0065] Further, as one embodiment, the present application discloses a plating device in which the diaphragm has a central member disposed at the center in the radial direction of the plating bath, and an inclined film extending obliquely upward from the central member.

[0066] Further, as one embodiment, the present application discloses a plating device in which a check valve is disposed at the central member of the diaphragm, the check valve being configured to allow the plating solution to flow only in the direction from the cathode region to the anode region.

[0067] Further, as one embodiment, the present application discloses a plating device in which the check valve has a valve case forming a flow path that communicates the anode region with the cathode region, a valve seat provided in the flow path, and a valve core of a float type disposed below the valve seat in the flow path and configured to be able to abut against the valve seat.

[0068] Further, as one embodiment, the present application discloses a plating solution discharge method for discharging a plating solution housed in a plating bath of a cup-type plating device, the plating solution discharge method including a step of opening a discharge pipe that communicates with an anode region of the plating bath to discharge the plating solution from the anode region, a step of discharging the plating solution from the anode region to lower the plating solution level of the anode region, thereby opening a check valve of a diaphragm that separates the anode region from a cathode region, and a step of opening the check valve, thereby transporting the plating solution of the cathode region to the anode region and discharging the plating solution from the discharge pipe.

[0069] BRIEF DESCRIPTION OF DRAWINGS

[0070] 400… plating module; 410… plating bath; 412… supply port; 420… diaphragm; 421… central member; 422… cathode region; 423… inclined film; 423a… inclined surface; 424… anode region; 425… check valve; 426… valve case; 426a… flow path; 426b… valve seat; 427… valve core; 430… anode; 440… substrate holder; 470… gas-liquid pipe; 472… first end portion; 474… second end portion; Wf… substrate; Wf-a… plated surface.

Claims

1. A plating apparatus characterized by comprising: Comprise: a plating bath for housing a plating solution; an anode disposed in the plating bath; a substrate holder configured to hold a substrate in a state in which a plating surface faces downward; a diaphragm that separates an anode region in which the anode is disposed and a cathode region in which a substrate is disposed during a plating process, the diaphragm having an inclined surface opposite the anode; a supply port for supplying the plating solution to the anode region; and a gas-liquid pipe having a first end portion that opens near an upper end of the inclined surface of the diaphragm and a second end portion that opens above the plating surface of a substrate during the plating process, the gas-liquid pipe configured to supply the plating solution supplied from the supply port to the anode region to the cathode region via the second end portion.

2. The plating apparatus according to claim 1, wherein the second end portion of the gas-liquid pipe is configured to open below a plating solution surface housed in the plating bath.

3. The plating apparatus according to claim 2, wherein the diaphragm has a central member disposed at a center in a radial direction of the plating bath and an inclined film that extends radially from the central member toward an obliquely upper direction.

4. The plating apparatus according to claim 3, wherein a check valve is disposed at the central member of the diaphragm, the check valve configured to allow the plating solution to flow only in a direction from the cathode region to the anode region.

5. The plating apparatus according to claim 4, wherein the check valve has a valve box that forms a flow path that communicates the anode region and the cathode region, a valve seat that is provided to the flow path, and a valve core that is disposed below the valve seat of the flow path and is configured to be able to abut against the valve seat.

6. A plating solution discharge method for discharging a plating solution housed in a plating bath of the plating apparatus according to any one of claims 1 to 5, the plating solution discharge method characterized by comprising: a step of opening a discharge pipe that communicates with an anode region of the plating bath to discharge the plating solution from the anode region; a step of discharging the plating solution from the anode region to lower a plating solution surface of the anode region, thereby opening a check valve provided to a diaphragm that separates the anode region and a cathode region; and a step of opening the check valve, thereby transporting the plating solution of the cathode region to the anode region and discharging the plating solution from the discharge pipe. ​

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