Air conditioner linkage air cooling heat dissipation device and vehicle-mounted semiconductor cooling and heating box

Abstract

The invention relates to an air conditioner linkage air cooling heat dissipation device and a vehicle-mounted semiconductor cooling and heating box. The technical problem that an existing thermoelectric semiconductor is prone to being affected by the environment temperature is solved. Comprising a fan wind scooper, a heat dissipation wind guide cavity is formed in the fan wind scooper, a hot end heat dissipation structure is arranged in the heat dissipation wind guide cavity, a semiconductor assembly is arranged on one side of the hot end heat dissipation structure, a cold end heat dissipation structure is arranged on the other side of the semiconductor assembly, and a wind guide assembly corresponding to the hot end heat dissipation structure is arranged in the fan wind scooper. An air conditioner air pipe communicated with the heat dissipation air guide cavity is arranged on the outer side of the fan air guide cover, and a pipeline valve body assembly is arranged between the air conditioner air pipe and the heat dissipation air guide cavity. The semiconductor assembly has the advantages that the air-conditioning air pipe can enable air-conditioning air to be communicated with the heat dissipation air guide cavity, and the refrigerating and heating effects of the semiconductor assembly are improved. The pipeline valve body assembly can control the connection relation between the air conditioner air pipe and the heat dissipation air guide cavity, a user can conveniently control the pipeline valve body assembly according to the use condition, and the heat exchange efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of vehicle-mounted cooling and heating boxes, and in particular relates to an air-conditioning linked air-cooling and heat dissipation device and a vehicle-mounted semiconductor cooling and heating box. Background Art

[0002] As the configuration rate of vehicle-mounted heating and cooling boxes in cars becomes higher and higher, people's requirements for vehicle-mounted heating and cooling boxes are also getting higher and higher; currently, most of the existing vehicle-mounted heating and cooling boxes use thermoelectric semiconductors for cooling and heating, but the existing thermoelectric semiconductor heating and cooling boxes are easily affected by the ambient temperature during the cooling and heating process, and when the ambient temperature is high, the heat exchange efficiency of the thermoelectric semiconductor is reduced, causing the cold end temperature to rise, affecting the cooling effect of the thermoelectric semiconductor; and when the ambient temperature is low, the cold exchange efficiency of the thermoelectric semiconductor is reduced, affecting the heating effect of the thermoelectric semiconductor and affecting the user experience. Summary of the invention

[0003] The object of the present invention is to provide an air-conditioning linked air-cooling heat dissipation device in view of the above-mentioned problems.

[0004] Another object of the present invention is to provide a vehicle-mounted semiconductor cooling and heating box to address the above-mentioned problems.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: an air-conditioning linked air-cooling heat dissipation device, comprising a fan air guide cover, a heat dissipation air guide cavity is provided in the fan air guide cover, a hot end heat dissipation structure is provided in the heat dissipation air guide cavity, a semiconductor component is provided on one side of the hot end heat dissipation structure, and a cold end heat dissipation structure is provided on the other side of the semiconductor component, an air guide component arranged corresponding to the hot end heat dissipation structure is provided in the fan air guide cover, and an air conditioning air duct connected to the heat dissipation air guide cavity is provided on the outside of the fan air guide cover, a pipeline valve body assembly capable of controlling the connection or closing of the air conditioning air duct and the heat dissipation air guide cavity is provided between the air conditioning air duct and the heat dissipation air guide cavity, the air conditioning air can be connected to the heat dissipation air guide cavity through the air conditioning air duct, and the connection between the air conditioning air duct and the heat dissipation air guide cavity can be opened or closed through the pipeline valve body assembly, and the pipeline valve body assembly can be opened or closed according to the use environment, so as to facilitate the user to perform control operation, and the air conditioning air can be fully exchanged with the hot end heat dissipation structure and then exported through the air guide assembly, so as to improve the heat dissipation effect and ensure the cooling or heating effect of the semiconductor component.

[0006] In the above-mentioned air-conditioning linked air-cooled heat dissipation device, the fan air guide cover includes an air guide cover connecting part, an air guide cover air guide part is provided on one side of the air guide cover connecting part, the air guide assembly is arranged on the air guide cover air guide part, a pipe connecting part is provided on the lower end of the air guide cover air guide part away from the side of the air guide cover connecting part, the pipe connecting part is connected to the pipe valve body assembly, and can be conveniently connected to the pipe valve body assembly through the pipe connecting part, and the hot end heat dissipation structure can be conveniently installed through the air guide cover air guide part, and the air guide assembly can be arranged correspondingly to the hot end heat dissipation structure, thereby improving the heat dissipation effect.

[0007] In the above-mentioned air-conditioning linked air-cooled heat dissipation device, the air scoop connection part, the air scoop air guiding part and the pipe connection part are an integrated structure, and the length of the air scoop connection part is greater than the length of the air scoop air guiding part, and the width of the air scoop air guiding part is greater than the width of the air scoop connection part, which can facilitate the corresponding arrangement of the hot-end heat dissipation structure and the cold-end heat dissipation structure in the air scoop air guiding part, and the integrated structure can improve the overall structural strength and increase the service life.

[0008] In the above-mentioned air-conditioning linked air-cooling heat dissipation device, the air guide component includes an air outlet arranged on one side of the air guide part of the air guide cover, the air outlet is connected with the heat dissipation air guide cavity, and one end of the air-conditioning air duct is provided with an air inlet connected with the heat dissipation air guide cavity, the air-conditioning air can enter the heat dissipation air guide cavity through the air inlet, and the air-conditioning air is discharged through the air outlet after sufficient heat exchange with the hot end heat dissipation structure, thereby ensuring the heat exchange effect.

[0009] In the above-mentioned air-conditioning linked air-cooling heat dissipation device, the pipeline valve body assembly includes a valve body shell, a valve body connecting channel is provided in the valve body shell, the air-conditioning air duct is connected to the heat dissipation air guide cavity through the valve body connecting channel, a valve body control valve core which can movably close the valve body connecting channel is provided in the valve body connecting channel, and an electric actuator which can control the valve body control valve core is provided on the valve body shell, the heat dissipation air guide cavity can be connected to the air-conditioning air duct through the valve body connecting channel, and the valve body control valve core can be conveniently controlled by the electric actuator to movably block the valve body connecting channel according to the usage situation, which is convenient for user operation and ensures the heat dissipation effect.

[0010] In the above-mentioned air-conditioning linked air-cooling heat dissipation device, the valve body shell is a rectangular structure, and the size of the valve body shell is greater than or equal to the size of the pipe connecting part, and the valve body shell is fixedly arranged on the fan air guide cover through the pipe connecting part. The pipe connecting part can facilitate the installation and fixation of the valve body shell, thereby improving the installation efficiency of the valve body shell.

[0011] In the above-mentioned air-conditioning linked air-cooled heat dissipation device, the hot-end heat dissipation structure includes a hot-end radiator, a hot-end heat dissipation fan is provided on one side of the hot-end radiator, the hot-end heat dissipation fan and the hot-end radiator are both arranged in the air guide part of the air guide cover, and the air outlet is arranged corresponding to the hot-end heat dissipation fan, and the air inlet is arranged corresponding to the hot-end radiator, the air-conditioning air enters the hot-end radiator in the heat dissipation air guide cavity through the air inlet for heat exchange, and the air-conditioning air after heat exchange is extracted through the hot-end heat dissipation fan to improve the heat exchange effect.

[0012] In the above-mentioned air-conditioning linked air-cooled heat dissipation device, the cold-end heat dissipation structure includes a cold-end radiator, a cold-end convection fan is provided at one end of the cold-end radiator, the cold-end radiator is abutted against the semiconductor component, and the cold-end convection fan is arranged at the lower end of the cold-end radiator, which can improve the heat exchange efficiency. The cold-end radiator can receive the heat of the semiconductor component, and the cold-end convection fan can draw ambient air to exchange heat with the cold-end radiator, thereby improving the cooling and heating efficiency and ensuring the cooling and heating effect.

[0013] In the above-mentioned air-conditioning linked air-cooling heat dissipation device, the semiconductor component includes a plurality of thermoelectric semiconductors, one side of the thermoelectric semiconductor is against the hot-end heat sink, and the other side of the thermoelectric semiconductor is against the cold-end heat sink. The thermoelectric semiconductor can perform cooling and heating, and the heat is dissipated from the thermoelectric semiconductor through the hot-end heat sink, and the heat is exported through the cold-end heat sink.

[0014] A vehicle-mounted semiconductor cold and warm box of an air-conditioning linked air-cooling heat dissipation device comprises a cold and warm box body, one side of the cold and warm box body is provided with a cold and warm box mounting groove which is connected with the inner cavity of the cold and warm box body, the cold end radiator is arranged in the cold and warm box mounting groove, the cold end convection fan is arranged at the lower end of the cold end radiator, one end of the cold and warm box mounting groove is provided with a cold end air outlet which is arranged corresponding to the cold end radiator, and the other end of the cold and warm box mounting groove is provided with a cold end air inlet which is arranged corresponding to the cold end convection fan, and one side of the cold end radiator is provided with a rear cover insulation block which can block the cold and warm box mounting groove, and the rear cover insulation block A semiconductor mounting hole connected to the heating and cooling box mounting groove is provided on the block. The thermoelectric semiconductor is arranged in the semiconductor mounting hole and the two sides are respectively abutted against the cold-end radiator and the hot-end radiator. The air guide cover connecting part cover is arranged on the heating and cooling box mounting groove and is fixedly connected to the heating and cooling box body. The heating and cooling box mounting groove can facilitate the installation of the cold-end radiator and the cold-end convection fan. The cold-end convection fan can draw air in the inner cavity of the heating and cooling box through the cold-end air inlet and exchange heat with the air through the cold-end radiator. The air after heat exchange is discharged toward the inner cavity of the heating and cooling box through the cold-end air outlet to ensure the cooling and heating effect.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] 1. The air conditioning duct can connect the air conditioning wind with the heat dissipation air guide cavity, thereby improving the heat exchange efficiency and the cooling and heating effects of the semiconductor components.

[0017] 2. The pipeline valve body assembly can control the connection relationship between the air duct of the air conditioner and the heat dissipation air guide cavity, so that users can control the pipeline valve body assembly according to the usage conditions and improve the heat exchange efficiency.

[0018] 3. The air-conditioning air can be sucked through the air-guiding component to improve the heat exchange efficiency between the air-conditioning air and the hot end radiator, thereby improving the heat exchange effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention.

[0020] Figure 2 It is a structural explosion diagram of the present invention.

[0021] Figure 3 It is a structural schematic diagram of the air guide assembly in the present invention.

[0022] Figure 4 It is a structural schematic diagram of the pipeline valve body assembly in the present invention.

[0023] In the figure: fan air guide cover 1, heat dissipation air guide cavity 11, air conditioning duct 12, air guide cover connection part 13, air guide cover air guide part 14, pipeline connection part 15, hot end heat dissipation structure 2, hot end radiator 21, hot end heat dissipation fan 22, semiconductor component 3, thermoelectric semiconductor 31, cold end heat dissipation structure 4, cold end radiator 41, cold end convection fan 42, air guide component 5, air outlet 51, air inlet 52, pipeline valve body assembly 6, valve body shell 61, valve body connecting channel 62, valve body control valve core 63, electric actuator 64, heating and cooling box body 7, heating and cooling box mounting groove 71, cold end air outlet 711, cold end air inlet 712, rear cover insulation block 72, semiconductor mounting hole 721. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1 , Figure 2As shown, an air-conditioning linked air-cooling heat dissipation device comprises a fan air guide cover 1, a heat dissipation air guide cavity 11 is arranged in the fan air guide cover 1, a hot end heat dissipation structure 2 is arranged in the heat dissipation air guide cavity 11, the hot end heat dissipation structure 2 can be conveniently installed in the fan air guide cover 1 through the heat dissipation air guide cavity 11, a semiconductor component 3 is arranged on one side of the hot end heat dissipation structure 2, and a cold end heat dissipation structure 4 is arranged on the other side of the semiconductor component 3, cooling or heating can be performed through the semiconductor component 3, and the cooling efficiency and heating efficiency can be improved through the cold end heat dissipation structure 4, and the semiconductor component 3 can be dissipated through the hot end heat dissipation structure 2 to improve the cooling effect or heating effect, and the fan air guide cover 1 is provided with an air guide component arranged corresponding to the hot end heat dissipation structure 2 5, and an air-conditioning duct 12 connected with the heat dissipation air guide cavity 11 is arranged on the outside of the fan air guide cover 1, and a pipe valve body assembly 6 capable of controlling the connection or closing of the air-conditioning duct 12 and the heat dissipation air guide cavity 11 is arranged between the air-conditioning duct 12 and the heat dissipation air guide cavity 11, the air-conditioning air can be connected with the heat dissipation air guide cavity 11 through the air-conditioning duct 12, and the connection between the air-conditioning duct 12 and the heat dissipation air guide cavity 11 can be opened or closed through the pipe valve body assembly 6, and the pipe valve body assembly 6 can be opened or closed according to the use environment, so that the user can perform control operation conveniently, and the air-conditioning air can be fully exchanged with the hot end heat dissipation structure 2 through the air guide assembly 5, so as to improve the heat dissipation effect and ensure the cooling or heating effect of the semiconductor component 3.

[0026] Specifically, the fan air guide cover 1 includes an air guide cover connection part 13, an air guide cover air guide part 14 is provided on one side of the air guide cover connection part 13, and the air guide assembly 5 is arranged on the air guide cover air guide part 14. A pipe connection part 15 is provided on the lower end of the air guide cover air guide part 14 away from the side of the air guide cover connection part 13, and the pipe connection part 15 is connected to the pipe valve body assembly 6. The pipe connection part 15 can be conveniently connected to the pipe valve body assembly 6, and the hot end heat dissipation structure 2 can be conveniently installed through the air guide cover air guide part 14, and the air guide assembly 5 can be arranged corresponding to the hot end heat dissipation structure 2 to improve the heat dissipation effect.

[0027] Among them, the air scoop connection part 13, the air scoop air guiding part 14 and the pipe connection part 15 are an integrated structure, and the length of the air scoop connection part 13 is greater than the length of the air scoop air guiding part 14, and the width of the air scoop air guiding part 14 is greater than the width of the air scoop connection part 13, which can facilitate the corresponding arrangement of the hot-end heat dissipation structure 2 and the cold-end heat dissipation structure 4 in the air scoop air guiding part 14, and the integrated structure can improve the overall structural strength and increase the service life.

[0028] like Figure 2 , Figure 3 , Figure 4As shown, the air guide component 5 includes an air outlet 51 arranged on one side of the air guide part 14 of the air guide cover, the air outlet 51 is connected with the heat dissipation air guide cavity 11, and one end of the air conditioning air duct 12 is provided with an air inlet 52 connected with the heat dissipation air guide cavity 11, and the air conditioning air can enter the heat dissipation air guide cavity 11 through the air inlet 52. After the air conditioning air is fully exchanged with the hot end heat dissipation structure 2, it is discharged through the air outlet 51 to ensure the heat exchange effect.

[0029] Furthermore, the pipeline valve body assembly 6 includes a valve body shell 61, a valve body connecting channel 62 is provided in the valve body shell 61, the air conditioning duct 12 is connected to the heat dissipation air guide cavity 11 through the valve body connecting channel 62, a valve body control valve core 63 capable of movably closing the valve body connecting channel 62 is provided in the valve body connecting channel 62, and an electric actuator 64 capable of controlling the valve body control valve core 63 is provided on the valve body shell 61, the heat dissipation air guide cavity 11 can be connected to the air conditioning duct 12 through the valve body connecting channel 62, and the valve body control valve core 63 can be conveniently controlled by the electric actuator 64 to movably block the valve body connecting channel 62 according to the usage situation, which is convenient for user operation and ensures the heat dissipation effect.

[0030] Among them, the valve body shell 61 is a rectangular structure, and the size of the valve body shell 61 is greater than or equal to the size of the pipe connecting part 15, and the valve body shell 61 is fixed on the fan air guide cover 1 through the pipe connecting part 15. The pipe connecting part 15 can facilitate the installation and fixation of the valve body shell 61, thereby improving the installation efficiency of the valve body shell 61.

[0031] Combination Figure 1 , Figure 2 , Figure 3 As shown, the hot-end heat dissipation structure 2 includes a hot-end radiator 21, and a hot-end heat dissipation fan 22 is provided on one side of the hot-end radiator 21. The hot-end heat dissipation fan 22 and the hot-end heat dissipation fan 22 are both arranged in the air guide part 14 of the air guide cover, and the air outlet 51 is arranged corresponding to the hot-end heat dissipation fan 22, and the air inlet 52 is arranged corresponding to the hot-end radiator 21. The air-conditioning wind enters the hot-end radiator 21 in the heat dissipation air guide cavity 11 through the air inlet 52 for heat exchange, and the air-conditioning wind after heat exchange is extracted through the hot-end heat dissipation fan 22 to improve the heat exchange effect.

[0032] Among them, the cold end heat dissipation structure 4 includes a cold end radiator 41, a cold end convection fan 42 is provided at one end of the cold end radiator 41, the cold end radiator 41 is abutted against the semiconductor component 3, and the cold end convection fan 42 is arranged at the lower end of the cold end radiator 41, which can improve the heat exchange efficiency. The cold end radiator 41 can receive the heat of the semiconductor component 3, and the cold end convection fan 42 can draw ambient air to exchange heat with the cold end radiator 41, thereby improving the cooling and heating efficiency and ensuring the cooling and heating effect.

[0033] Specifically, the semiconductor component 3 includes a plurality of thermoelectric semiconductors 31, one side of the thermoelectric semiconductor 31 is against the hot-end heat sink 21, and the other side of the thermoelectric semiconductor 31 is against the cold-end heat sink 41. The thermoelectric semiconductor 31 can perform cooling and heating. The heat is dissipated from the thermoelectric semiconductor 31 through the hot-end heat sink 21, and the heat is exported through the cold-end heat sink 41.

[0034] like Figure 1 , Figure 2 As shown, a vehicle-mounted semiconductor cold and warm box of an air-conditioning linked air-cooling heat dissipation device comprises a cold and warm box body 7, a cold and warm box mounting groove 71 communicating with the inner cavity of the cold and warm box body 7 is provided on one side of the cold and warm box body 7, a cold end radiator 41 is arranged in the cold and warm box mounting groove 71, a cold end convection fan 42 is arranged at the lower end of the cold end radiator 41, a cold end air outlet 711 corresponding to the cold end radiator 41 is provided at one end of the cold and warm box mounting groove 71, and a cold end air inlet 712 corresponding to the cold end convection fan 42 is provided at the other end of the cold and warm box mounting groove 71, and a rear cover insulation block 72 capable of blocking the cold and warm box mounting groove 71 is provided on one side of the cold end radiator 41, and a semiconductor mounting hole 721 communicating with the cold and warm box mounting groove 71 is provided on the rear cover insulation block 72, and a semiconductor mounting hole 721 communicating with the cold and warm box mounting groove 71 is provided through the semiconductor mounting hole 72 1 can facilitate the installation of the thermoelectric semiconductor 31, and the thermoelectric semiconductor 31 can be insulated by the rear cover insulation block 72 to improve the cooling and heating effect. The thermoelectric semiconductor 31 is arranged in the semiconductor installation hole 721 and the two sides are respectively against the cold end radiator 41 and the hot end radiator 21. The air guide cover connection part 13 is covered on the cold and warm box installation groove 71 and is fixedly connected to the cold and warm box body 7. The cold end radiator 41 and the cold end convection fan 42 can be easily installed through the cold and warm box installation groove 71. The cold end convection fan 42 can draw air in the inner cavity of the cold and warm box through the cold end air inlet 712, and heat the air through the cold end radiator 41. The air after heat exchange is discharged toward the inner cavity of the cold and warm box through the cold end air outlet 711 to ensure the cooling and heating effect.

[0035] The principle of this embodiment is that when the air conditioner is not working, the pipe valve body assembly 6 is closed; when the automobile air conditioner blows cold air and the semiconductor component 3 is also cooling, the pipe valve body assembly 6 opens the air conditioning duct 12 to communicate with the heat dissipation air guide cavity 11, and the air conditioning air is introduced into the heat dissipation air guide cavity 11 to exchange heat with the hot end heat dissipation structure 2, thereby improving the heat dissipation efficiency and the cooling effect; and when the automobile air conditioner blows hot air and the semiconductor component 3 is also heating, the pipe valve body assembly 6 is opened, and the air conditioning hot air enters the heat dissipation air guide cavity 11 through the air conditioning duct 12, and the air conditioning hot air is introduced into the hot end heat dissipation structure 2, thereby improving the cold exchange efficiency and the heating effect of the semiconductor component 3; when the automobile air conditioner blows hot air but the semiconductor component 3 is cooling, the pipe valve body assembly 6 is closed to prevent the hot air from entering the heat dissipation air guide cavity 11 and affecting the heat dissipation efficiency; when the automobile air conditioner blows cold air but the semiconductor component 4 is heating, the pipe valve body assembly 6 is closed to prevent the cold air from being introduced into the heat dissipation air guide cavity 11 and reducing the cold exchange efficiency.

[0036] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0037] Although the present invention uses more terms such as fan air guide cover 1, heat dissipation air guide cavity 11, air conditioning duct 12, air guide cover connection part 13, air guide cover air guide part 14, pipeline connection part 15, hot end heat dissipation structure 2, hot end radiator 21, hot end heat dissipation fan 22, semiconductor assembly 3, thermoelectric semiconductor 31, cold end heat dissipation structure 4, cold end radiator 41, cold end convection fan 42, air guide assembly 5, air outlet 51, air inlet 52, pipeline valve body assembly 6, valve body shell 61, valve body connection channel 62, valve body control valve core 63, electric actuator 64, cold and warm box 7, cold and warm box installation groove 71, cold end air outlet 711, cold end air inlet 712, rear cover insulation block 72, semiconductor installation hole 721, etc., the possibility of using other terms is not excluded. The use of these terms is only for the purpose of more conveniently describing and explaining the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. An air-conditioning linked air-cooling heat dissipation device, comprising a fan air guide cover (1), wherein the fan air guide cover (1) is provided with a heat dissipation air guide cavity (11), characterized in that: A hot end heat dissipation structure (2) is provided in the heat dissipation air guide cavity (11), a semiconductor component (3) is provided on one side of the hot end heat dissipation structure (2), and a cold end heat dissipation structure (4) is provided on the other side of the semiconductor component (3); an air guide component (5) corresponding to the hot end heat dissipation structure (2) is provided in the fan air guide cover (1), and an air conditioning duct (12) connected to the heat dissipation air guide cavity (11) is provided on the outside of the fan air guide cover (1); and a pipeline valve body assembly (6) capable of controlling the air conditioning duct (12) to be connected or closed to the heat dissipation air guide cavity (11) is provided between the air conditioning duct (12) and the heat dissipation air guide cavity (11).

2. The air-conditioning linked air-cooling heat dissipation device according to claim 1, characterized in that: The fan air guide cover (1) comprises an air guide cover connecting portion (13), a side of the air guide cover connecting portion (13) is provided with an air guide cover air guide portion (14), the air guide assembly (5) is arranged on the air guide cover air guide portion (14), a lower end of the air guide cover air guide portion (14) is provided with a pipeline connecting portion (15) away from the air guide cover connecting portion (13), and the pipeline connecting portion (15) is connected to the pipeline valve body assembly (6).

3. The air-conditioning linked air-cooling heat dissipation device according to claim 2, characterized in that: The air scoop connection part (13), the air scoop air guiding part (14) and the pipe connection part (15) are an integrated structure, and the length of the air scoop connection part (13) is greater than the length of the air scoop air guiding part (14), and the width of the air scoop air guiding part (14) is greater than the width of the air scoop connection part (13).

4. The air-conditioning linked air-cooling heat dissipation device according to claim 2, characterized in that: The air guide assembly (5) comprises an air outlet (51) arranged on one side of the air guide portion (14) of the air guide cover, the air outlet (51) being connected to the heat dissipation air guide cavity (11), and one end of the air conditioning air duct (12) is provided with an air inlet (52) connected to the heat dissipation air guide cavity (11).

5. The air-conditioning linked air-cooling heat dissipation device according to claim 2, characterized in that: The pipeline valve body assembly (6) comprises a valve body shell (61), a valve body connecting channel (62) is provided in the valve body shell (61), the air conditioning duct (12) is connected to the heat dissipation air guide cavity (11) via the valve body connecting channel (62), a valve body control valve core (63) capable of movably closing the valve body connecting channel (62) is provided in the valve body connecting channel (62), and an electric actuator (64) capable of controlling the valve body control valve core (63) is provided on the valve body shell (61).

6. The air-conditioning linked air-cooling heat dissipation device according to claim 5, characterized in that: The valve body shell (61) is of a rectangular structure, and the size of the valve body shell (61) is greater than or equal to the size of the pipeline connecting portion (15), and the valve body shell (61) is fixedly arranged on the fan air guide cover (1) through the pipeline connecting portion (15).

7. The air-conditioning linked air-cooling heat dissipation device according to claim 4, characterized in that: The hot end heat dissipation structure (2) comprises a hot end radiator (21), a hot end heat dissipation fan (22) is provided on one side of the hot end radiator (21), the hot end heat dissipation fan (22) and the hot end radiator (21) are both arranged in the air guide portion (14) of the air guide cover, and the air intake port (51) is arranged corresponding to the hot end heat dissipation fan (22), and the air outlet port (52) is arranged corresponding to the hot end radiator (21).

8. The air-conditioning linked air-cooling heat dissipation device according to claim 7, characterized in that: The cold end heat dissipation structure (4) comprises a cold end radiator (41), one end of the cold end radiator (41) is provided with a cold end convection fan (42), and the cold end radiator (41) is in contact with the semiconductor component (3).

9. The air-conditioning linked air-cooling heat dissipation device according to claim 8, characterized in that: The semiconductor component (3) comprises a plurality of thermoelectric semiconductors (31), one side of the thermoelectric semiconductor (31) abuts against a hot-end heat sink (21), and the other side of the thermoelectric semiconductor (31) abuts against a cold-end heat sink (41).

10. A vehicle-mounted semiconductor cooling and heating box using an air-conditioning linked air-cooling and heat dissipation device as claimed in any one of claims 1 to 9, comprising a cooling and heating box body (7), characterized in that: A heating and cooling box installation groove (71) communicating with the inner cavity of the heating and cooling box is provided on one side of the heating and cooling box body (7); the cold end radiator (41) is arranged in the heating and cooling box installation groove (71); the cold end convection fan (42) is arranged at the lower end of the cold end radiator (41); a cold end air outlet (711) corresponding to the cold end radiator (41) is provided at one end of the heating and cooling box installation groove (71); and a cold end air inlet (712) corresponding to the cold end convection fan (42) is provided at the other end of the heating and cooling box installation groove (71). A rear cover insulation block (72) capable of sealing the cold-heating box installation groove (71) is provided on one side of the cold-end radiator (41); a semiconductor installation hole (721) communicating with the cold-heating box installation groove (71) is provided on the rear cover insulation block (72); the thermoelectric semiconductor (31) is arranged in the semiconductor installation hole (721) and abuts against the cold-end radiator (41) and the hot-end radiator (21) on both sides; the air guide cover connection part (13) is covered on the cold-heating box installation groove (71) and is fixedly connected to the cold-heating box body (7).

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