Display module and display device

Abstract

The invention relates to a display module and a display device. The display module comprises a substrate which is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the substrate; the plurality of light emitting diodes are arranged on the first surface at intervals and are electrically connected with the substrate; the airtight protection layer comprises a first airtight protection part, and the first airtight protection part is arranged on the side wall of the substrate. Therefore, according to the display module and the display device provided by the invention, the water and oxygen isolation effect of the display module can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] One of the packaging methods of integrated packaged display products of light emitting diodes (LEDs) is the application of COB (Chip On Board) packaging technology. LED display products using COB light sources have the advantages of saving space and being easy to achieve small pitches. Among them, the main method of COB packaging technology is: first fix the LED chip and related components on the circuit board by adhesive mounting; the LED chip and related components are electrically connected by metal wire bonding or welding with the help of circuit board wiring; finally, the LED chip on the circuit board is encapsulated and covered with a packaging colloid to provide waterproof and dustproof protection.

[0003] However, the water-oxygen isolation effect of the above-mentioned LED integrated package display products needs to be improved. Summary of the invention

[0004] Based on this, it is necessary to provide a display module and a display device, which can improve the water-oxygen isolation effect of the display module.

[0005] In a first aspect, an embodiment of the present application provides a display module, including:

[0006] A substrate having a first surface and a second surface arranged opposite to each other along a thickness direction of the substrate;

[0007] A plurality of light emitting diodes are disposed at intervals on the first surface and electrically connected to the substrate;

[0008] The airtight protection layer comprises a first airtight protection part, and the first airtight protection part is arranged on the side wall of the substrate.

[0009] The display module provided in the embodiment of the present application, the airtight protection layer may include a first airtight protection part, and the first airtight protection part is arranged on the side wall of the substrate, so as to alleviate the situation where water and oxygen invade the display module through the side wall of the substrate, thereby improving the isolation effect of the display module against water and oxygen, and improving the airtightness and reliability of the display module.

[0010] In one embodiment, the airtight protection layer further includes a second airtight protection portion, which is disposed on the first surface, and the orthographic projection of the second airtight protection portion on the plane where the first surface is located does not overlap with the orthographic projection of the light-emitting diode on the plane where the first surface is located.

[0011] In one embodiment, the airtight protection layer also includes a second airtight protection portion, which is arranged on the side of the light-emitting diode away from the substrate, and the orthographic projection of the first surface on the plane where the first surface is located is located within the orthographic projection of the second airtight protection portion on the plane where the first surface is located.

[0012] In one embodiment, the display module further includes a driving circuit, which is disposed on the second surface and electrically connected to the substrate;

[0013] The airtight protection layer also includes a third airtight protection part, which is arranged on the side of the driving circuit away from the substrate, and the orthographic projection of the second surface on the plane where the first surface is located is located within the orthographic projection of the third airtight protection part on the plane where the first surface is located.

[0014] In one embodiment, the display module further includes a light shielding layer, which is disposed on one side of the second airtight protection portion along the thickness direction of the substrate;

[0015] The light shielding layer is arranged between two adjacent light emitting diodes;

[0016] Alternatively, the display module includes a plurality of pixel units, each pixel unit includes at least one light emitting diode, and the light shielding layer is disposed between two adjacent pixel units.

[0017] In one embodiment, the ratio of the thickness of the light shielding layer to the thickness of the light emitting diode is less than or equal to 1 / 2.

[0018] In one embodiment, the thickness of the second airtight protection portion is smaller than the thickness of the remaining airtight protection layer; and / or,

[0019] The light transmittance of the second airtight protection portion is greater than the light transmittance of the remaining portion of the airtight protection layer.

[0020] In one embodiment, the display module further includes an encapsulation layer, which is disposed on the second airtight protection portion and a side of the light-emitting diode away from the substrate;

[0021] The refractive index of the encapsulation layer is greater than the refractive index of the second airtight protection portion;

[0022] And / or, the bonding force between the encapsulation layer and the airtight protection layer is greater than the bonding force between the encapsulation layer and the substrate.

[0023] In one embodiment, the thickness of the airtight protective layer ranges from 5 nm to 100 nm;

[0024] And / or, a metal wiring is disposed on a side wall of the substrate, and the first airtight protection portion is disposed on a side of the metal wiring facing away from the substrate;

[0025] and / or, the airtight protective layer is formed by an atomic deposition process;

[0026] and / or, the substrate comprises a glass substrate;

[0027] And / or, the material of the airtight protection layer includes at least one of silicon dioxide, aluminum oxide, silicon nitride, and silicon oxynitride.

[0028] In a second aspect, an embodiment of the present application provides a display device, comprising the display module in the above-mentioned first aspect.

[0029] The display device provided in the embodiment of the present application includes a display module, and the airtight protection layer may include a first airtight protection portion, and the first airtight protection portion is arranged on the side wall of the substrate, so as to alleviate the situation where water and oxygen invade the display module through the side wall of the substrate, thereby improving the isolation effect of the display module against water and oxygen, and improving the airtightness and reliability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A cross-sectional view of a display module provided in an embodiment of the present application.

[0031] Figure 2 Another cross-sectional view of the display module provided in an embodiment of the present application.

[0032] Figure 3 Another cross-sectional view of the display module provided in an embodiment of the present application.

[0033] Figure 4 A schematic diagram of the structure after a first silicon dioxide layer is formed on the first surface provided in an embodiment of the present application.

[0034] Figure 5 A schematic diagram of the structure after a second silicon dioxide layer is formed on the first surface provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100, display module; 110, substrate; 111, first surface; 112, second surface; 120, light emitting diode; 130, driving circuit; 140, airtight protection layer; 141, first airtight protection part; 142, second airtight protection part; 143, third airtight protection part; 150, light shielding layer; 160, packaging layer. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0041] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0043] In the related art, an LED integrated package display product may include a glass substrate, the glass substrate having a first surface and a second surface arranged opposite to each other along the thickness direction of the glass substrate, a plurality of light-emitting diodes are arranged on the first surface, a driving chip is arranged on the second surface, and the driving chip is electrically connected to the light-emitting diodes. An encapsulation layer is arranged on the side of the plurality of light-emitting diodes away from the glass substrate, and the encapsulation layer can protect the light-emitting diodes and alleviate the intrusion of water and oxygen into the light-emitting diodes.

[0044] However, since the packaging layer is only arranged on the side of the light-emitting diode away from the glass substrate, but not on the side wall of the glass substrate, water and oxygen may invade the LED integrated package display product from the side wall of the glass substrate, resulting in poor water and oxygen isolation effect of the LED integrated package display product.

[0045] In order to solve the above problems, the embodiments of the present application provide a display module and a display device, which can improve the isolation effect of the display module against water and oxygen.

[0046] The following will be combined Figure 1-Figure 5 The display module 100 and the display device provided in the embodiment of the present application are described.

[0047] See also Figure 1The embodiment of the present application provides a display module 100, which includes a substrate 110. The substrate 110 can be used to support materials subsequently disposed on the substrate 110. The substrate 110 can have a first surface 111 and a second surface 112 disposed opposite to each other along the thickness direction of the substrate 110. The sidewall of the substrate 110 is disposed between the first surface 111 and the second surface 112, and the sidewall of the substrate 110 connects the first surface 111 and the second surface 112. The sidewall of the substrate 110 extends along the thickness direction of the substrate 110.

[0048] See also Figure 1 The display module 100 may include a plurality of light emitting diodes 120, which are arranged at intervals on the first surface 111, with a spacing between two adjacent light emitting diodes 120, and the plurality of light emitting diodes 120 may be electrically connected to the substrate 110. For example, a first pad may be provided on the first surface 111 of the substrate 110, and the light emitting diodes 120 may be electrically connected to the first pad.

[0049] See also Figure 1 The display module 100 may include an airtight protective layer 140, which has an isolation effect on water and oxygen, and can prevent water and oxygen from invading the display module 100. The airtight protective layer 140 may include a first airtight protective portion 141, which is disposed on the side wall of the substrate 110, thereby alleviating the situation where water and oxygen invade the display module 100 from the side wall of the substrate 110, thereby improving the isolation effect of the display module 100 on water and oxygen, and improving the airtightness and reliability of the display module 100.

[0050] In some embodiments, metal wiring is provided on the side wall of the substrate 110, and the first airtight protection portion 141 is located on the side of the metal wiring facing away from the substrate 110. The first airtight protection portion 141 covers the metal wiring to prevent water and oxygen from corroding the metal wiring, thereby improving the reliability of the metal wiring on the side wall of the substrate 110.

[0051] In some embodiments, see Figure 2 The airtight protection layer 140 may further include a second airtight protection portion 142, which is disposed on the first surface 111, thereby alleviating the situation where water and oxygen invade the display module 100 from the first surface 111 of the substrate 110, thereby improving the isolation effect of the display module 100 against water and oxygen. The orthographic projection of the second airtight protection portion 142 on the plane where the first surface 111 is located does not overlap with the orthographic projection of the light-emitting diode 120 on the plane where the first surface 111 is located, so that the light-emitting diode 120 is exposed outside the second airtight protection portion 142, which can prevent the second airtight protection portion 142 from affecting the light output of the light-emitting diode 120, and is conducive to improving the light output efficiency of the light-emitting diode 120.

[0052] In some embodiments, see Figure 1 The airtight protection layer 140 also includes a second airtight protection part 142, which is arranged on the side of the light-emitting diode 120 away from the substrate 110. The second airtight protection part 142 can cover the surface of the light-emitting diode 120 away from the substrate 110 and the side wall of the light-emitting diode 120. The second airtight protection part 142 can also cover the first surface 111 between two adjacent light-emitting diodes 120. The orthographic projection of the first surface 111 on the plane where the first surface 111 is located is located within the orthographic projection of the second airtight protection part 142 on the plane where the first surface 111 is located, so that the second airtight protection part 142 can form a good coverage for both the light-emitting diode 120 and the first surface 111, which can prevent water and oxygen from invading the light-emitting diode 120, and can also alleviate the situation where water and oxygen invade the display module 100 from the first surface 111 of the substrate 110, thereby improving the water and oxygen isolation effect of the display module 100.

[0053] In some embodiments, see Figure 1 The display module 100 may further include a driving circuit 130 (e.g., a driving chip), which is disposed on the second surface 112 and is electrically connected to the substrate 110. For example, the second surface 112 of the substrate 110 may be provided with a second pad, and the driving circuit 130 may be electrically connected to the second pad. The driving circuit 130 and the light-emitting diode 120 may be electrically connected through the substrate 110.

[0054] In some embodiments, see Figure 1 The airtight protection layer 140 may further include a third airtight protection portion 143, which is located on the side of the driving circuit 130 away from the substrate 110. The third airtight protection portion 143 may better cover the driving circuit 130. The third airtight protection portion 143 may also cover the second surface 112 where the driving circuit 130 is not provided. The orthographic projection of the second surface 112 on the plane where the first surface 111 is located is located within the orthographic projection of the third airtight protection portion 143 on the plane where the first surface 111 is located, so that the third airtight protection portion 143 may better cover both the driving circuit 130 and the second surface 112, thereby preventing water and oxygen from invading the driving circuit 130 and damaging the driving circuit 130, and also alleviating the situation where water and oxygen invade the display module 100 from the second surface 112 of the substrate 110, thereby improving the water and oxygen isolation effect of the display module 100.

[0055] Exemplarily, the material of the airtight protection layer 140 may include inorganic material and / or organic material. Taking the case where the material of the airtight protection layer 140 is inorganic material as an example, the water-oxygen isolation effect of the inorganic material is better.

[0056] For example, the material of the airtight protective layer 140 may include silicon, aluminum, or other metal oxides that have a high compatibility with the silicates in the glass substrate, thereby improving the compactness of the airtight protective layer 140 obtained by atomic layer deposition, which is beneficial to improving the water-oxygen isolation effect of the airtight protective layer 140 and improving the airtightness of the display module 100.

[0057] For example, the material of the airtight protection layer 140 may include at least one of silicon dioxide, aluminum oxide, silicon nitride, and silicon oxynitride. The present embodiment of the application takes silicon dioxide as an example for the material of the airtight protection layer 140 to be described.

[0058] Exemplarily, the substrate 110 may be a glass substrate, a silicon substrate or other substrates. The present application embodiment is described by taking the glass substrate 110 as an example. For example, the glass substrate may be prepared by a through glass via process (TGV for short) or a side wiring process.

[0059] Exemplarily, the light emitting diode 120 may be an LED chip.

[0060] In some embodiments, see Figure 1 The display module 100 further includes a light shielding layer 150, which is located between two adjacent light emitting diodes 120. The light shielding layer 150 may be formed of a material capable of blocking light, and may absorb light irradiated onto the light shielding layer 150. The light shielding layer 150 may have a relatively dark color (e.g., black). The light shielding layer 150 is conducive to achieving an integrated black effect of the display module 100, and may also alleviate the reflection phenomenon of the display module 100.

[0061] In the process of forming the light-shielding layer 150, a liquid or semi-solid initial light-shielding layer is first formed, and then the initial light-shielding layer is solidified to form the light-shielding layer 150. Since the initial light-shielding layer has a certain fluidity, when the thickness of the initial light-shielding layer is large, it may climb to the surface of the light-emitting diode 120 away from the substrate 110, thereby affecting the light output of the light-emitting diode 120.

[0062] For example, the material of the light shielding layer 150 may include an organic material.

[0063] For example, the material of the light shielding layer 150 may include ink.

[0064] In some embodiments, the display module 100 includes a plurality of pixel units, each pixel unit includes at least one light emitting diode 120, and the light shielding layer 150 may be disposed between two adjacent pixel units. The embodiment of the present application is described by taking the pixel unit including a plurality of light emitting diodes 120 as an example. The light emitting diode 120 may be an LED chip.

[0065] In some embodiments, the pixel unit includes at least two of a red LED chip, a green LED chip, and a blue LED chip.

[0066] In some embodiments, the pixel unit includes at least one red LED chip, at least one green LED chip, and at least one blue LED chip.

[0067] Specifically, the pixel unit may include a red LED chip, a green LED chip, and a blue LED chip, and the red LED chip, the blue LED chip, and the green LED chip are arranged in a straight line or in a triangle; the straight line may be a horizontal straight line or a vertical straight line; the triangle may be an equilateral triangle, an isosceles triangle, a right triangle, or other irregular triangles.

[0068] Specifically, the pixel unit may include four LED chips, and the four LED chips are arranged in a quadrilateral, and the quadrilateral may be a square, a rectangle, a rhombus or other irregular quadrilateral shapes; for example, each pixel unit includes two red LED chips, one green LED chip, and one blue LED chip, and the two red LED chips are respectively located at the diagonals of the quadrilateral, and the green LED chip and the blue LED chip are respectively located at the other diagonals of the quadrilateral; or, each pixel unit includes two green LED chips, one red LED chip, and one blue LED chip, and the two green LED chips are respectively located at the diagonals of the quadrilateral, and the red LED chip and the blue LED chip are respectively located at the other diagonals of the quadrilateral; or, each pixel unit includes two blue LED chips, one red LED chip, and one green LED chip, and the two blue LED chips are respectively located at the diagonals of the quadrilateral, and the red LED chip and the green LED chip are respectively located at the other diagonals of the quadrilateral.

[0069] In some embodiments, see Figure 3 The light-shielding layer 150 is arranged on one side of the second airtight protection part 142 along the thickness direction of the substrate 110. For example, the light-shielding layer 150 can be located on the side of the second airtight protection part 142 facing the substrate 110. Compared with setting the light-shielding layer 150 on the side of the second airtight protection part 142 away from the substrate 110, the light-shielding layer 150 can be closer to the substrate 110, so that the surface of the light-shielding layer 150 away from the substrate 110 is lower than the surface of the light-emitting diode 120 away from the substrate 110, which is beneficial to make the distance between the surface of the light-shielding layer 150 away from the substrate 110 and the substrate 110 smaller than the distance between the surface of the light-emitting diode 120 away from the substrate 110 and the substrate 110, which can reduce the risk of the initial light-shielding layer climbing to the surface of the light-emitting diode 120 away from the substrate 110, thereby facilitating the light output of the display module 100.

[0070] In some embodiments, see Figure 1 , the light shielding layer 150 is disposed on one side of the second airtight protection part 142 along the thickness direction of the substrate 110, for example, the light shielding layer 150 can be located on the side of the second airtight protection part 142 away from the substrate 110. In the embodiment where the light shielding layer 150 is an organic material, the substrate 110 is a glass substrate, and the material of the airtight protection layer 140 is an inorganic material, the second airtight protection part 142 and the substrate 110 can be in direct contact, and the adhesion and matching between the second airtight protection part 142 and the substrate 110 are higher than those between the second airtight protection part 142 and the light shielding layer 150, which is beneficial to improving the adhesion stability of the second airtight protection part 142 and also beneficial to improving the compactness of the airtight protection layer 140.

[0071] In some embodiments, the ratio of the thickness of the light shielding layer 150 to the thickness of the light emitting diode 120 is less than or equal to 1 / 2, so that the thickness of the light shielding layer 150 is relatively low, which is conducive to making the surface of the light shielding layer 150 facing away from the substrate 110 lower than the surface of the light emitting diode 120 facing away from the substrate 110, and can reduce the risk of the initial light shielding layer climbing to the surface of the light emitting diode 120 facing away from the substrate 110, which is conducive to the light output of the display module 100. For example, the ratio of the thickness of the light shielding layer 150 to the thickness of the light emitting diode 120 can be 1 / 6, 1 / 5, 1 / 4, 1 / 3, 1 / 2 or any value less than 1 / 2.

[0072] In some embodiments, the thickness of the second airtight protection portion 142 is smaller than the thickness of the remaining airtight protection layer 140, which is beneficial to making the display module 100 lighter and thinner. In addition, in an embodiment where the second airtight protection portion 142 covers the light-emitting diode 120, it is beneficial to reduce the adverse effect of the second airtight protection portion 142 on the light output of the light-emitting diode 120, which is beneficial to improving the light output of the light-emitting diode 120.

[0073] In some embodiments, see Figure 1 The display module 100 further includes an encapsulation layer 160 (for example, the encapsulation layer 160 may be a film or glue material), and the encapsulation layer 160 is located on the side of the second airtight protection portion 142 and the light-emitting diode 120 away from the substrate 110. In this way, the encapsulation layer 160 can further reduce the invasion of water and oxygen into the light-emitting diode 120, and reduce the invasion of water and oxygen into the display module 100 from the first surface 111. In addition, since the second airtight protection portion 142 and the encapsulation layer 160 are provided at the same time to provide double-layer protection for the first surface 111, the thickness of the second airtight protection portion 142 can be set to be smaller.

[0074] Exemplarily, the bonding force between the encapsulation layer 160 and the airtight protective layer 140 may be greater than the bonding force between the encapsulation layer 160 and the substrate 110. By using the airtight protective layer 140 as an intermediate layer, the bonding force between the airtight protective layer 140 and the encapsulation layer 160 is stronger, so that the encapsulation layer 160 and the airtight protective layer 140 are more tightly bonded, which is beneficial to improving the overall moisture-proof and anti-oxidation capabilities of the display module 100.

[0075] In some embodiments, the light transmittance of the second airtight protection part 142 is greater than the light transmittance of the remaining airtight protection layer 140. In the implementation where the second airtight protection part 142 covers the light-emitting diode 120, it is beneficial to reduce the adverse effect of the second airtight protection part 142 on the light output of the light-emitting diode 120, and is beneficial to improve the light output of the light-emitting diode 120.

[0076] In some embodiments, the refractive index of the encapsulation layer 160 is greater than the refractive index of the second airtight protection portion 142. At a wide viewing angle, the light from the light-emitting diode 120 can be prevented from being totally reflected at the interface between the encapsulation layer 160 and the second airtight protection portion 142, thereby facilitating the light output of the display module 100 and improving the brightness of the display module 100.

[0077] For example, the refractive index of the encapsulation layer 160 may be 1.5, and the refractive index of the airtight protection layer 140 may be 1.45.

[0078] In some embodiments, the thickness of the airtight protective layer 140 ranges from 5 nm to 100 nm, so that the thickness of the airtight protective layer 140 can be prevented from being too thin, thereby improving the water-oxygen isolation effect of the airtight protective layer 140. In addition, the thickness of the airtight protective layer 140 can be prevented from being too thick, thereby facilitating the thinning of the display module 100 and reducing the preparation cost of the airtight protective layer 140. For example, the thickness of the airtight protective layer 140 can be 5 nm, 10 nm, 25 nm, 50 nm, 100 nm, or any value between 5 nm and 100 nm.

[0079] In some embodiments, the airtight protective layer 140 may be formed by an atomic deposition process, thereby making the airtight protective layer 140 denser, which is beneficial to improving the water-oxygen isolation effect of the airtight protective layer 140 and making the thickness of the airtight protective layer 140 more uniform and consistent.

[0080] In some embodiments, the preparation process of the display module 100 can be: attaching the electronic components such as the driving circuit 130 to the pads on the second surface 112 of the substrate 110 at the specified position, then transferring the light-emitting diode 120 to the pads on the first surface 111 of the substrate 110 through a transfer device to form an initial display module, then placing the initial display module in an atomic deposition device, adjusting the device parameters, using a silicon rod as a target, and depositing a silicon dioxide film (i.e., an airtight protective layer 140) on the surface and sidewalls on both sides of the thickness direction of the initial display module. Then, performing an underfill process on the initial display module, spraying black UV ink, and then placing the initial display module sprayed with black UV ink in a UV curing device to cure the ink and form a light-shielding layer 150, and then encapsulating the light-emitting diode 120 on the glass substrate with liquid glue or adhesive film.

[0081] The process of forming a silicon dioxide film by atomic layer deposition may include: Figure 4 , a first silicon dioxide layer is deposited on the surface and sidewalls on both sides of the thickness direction of the initial display module ( Figure 4 Only the substrate 110 is shown), the silicon dioxide layer and the silicon element in the substrate 110 easily form chemical bonds or van der Waals attractive bonds, making the first silicon dioxide layer relatively dense. Figure 5 Then, a second silicon dioxide layer is formed on the side of the first silicon dioxide layer facing away from the substrate 110. Then, a third silicon dioxide layer, a fourth silicon dioxide layer, and so on may be deposited in sequence until the silicon dioxide film reaches a desired thickness.

[0082] The display device provided in the embodiment of the present application is described below.

[0083] The embodiment of the present application provides a display device, which includes the display module 100 in the above embodiment. The display device may include a mobile phone, a television, a laptop, a desktop display, a tablet computer, a digital camera, a smart bracelet, smart glasses, a car display, an industrial control device, a medical display, a touch interactive terminal, or other devices with display functions, etc., which are not limited in the embodiment of the present application.

[0084] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display module, characterized in that: include: A substrate having a first surface and a second surface arranged opposite to each other along a thickness direction of the substrate; A plurality of light emitting diodes are arranged at intervals on the first surface and are electrically connected to the substrate; The airtight protection layer includes a first airtight protection portion, and the first airtight protection portion is arranged on the side wall of the substrate.

2. The display module according to claim 1, characterized in that: The airtight protection layer also includes a second airtight protection portion, which is arranged on the first surface, and the orthographic projection of the second airtight protection portion on the plane where the first surface is located does not overlap with the orthographic projection of the light-emitting diode on the plane where the first surface is located.

3. The display module according to claim 1, characterized in that: The airtight protection layer also includes a second airtight protection part, which is arranged on the side of the light-emitting diode away from the substrate, and the orthographic projection of the first surface on the plane where the first surface is located is located within the orthographic projection of the second airtight protection part on the plane where the first surface is located.

4. The display module according to any one of claims 1 to 3, characterized in that: The display module further includes a driving circuit, which is disposed on the second surface and electrically connected to the substrate; The airtight protection layer also includes a third airtight protection part, which is arranged on the side of the driving circuit away from the substrate, and the orthographic projection of the second surface on the plane where the first surface is located is located within the orthographic projection of the third airtight protection part on the plane where the first surface is located.

5. The display module according to claim 2 or 3, characterized in that: The display module further includes a light shielding layer, and the light shielding layer is arranged on one side of the second airtight protection portion along the thickness direction of the substrate; The light shielding layer is arranged between two adjacent light emitting diodes; Alternatively, the display module includes a plurality of pixel units, each pixel unit includes at least one light emitting diode, and the light shielding layer is disposed between two adjacent pixel units.

6. The display module according to claim 5, characterized in that: The ratio of the thickness of the light shielding layer to the thickness of the light emitting diode is less than or equal to 1 / 2.

7. The display module according to claim 2 or 3, characterized in that: The thickness of the second airtight protection portion is smaller than the thickness of the remaining portion of the airtight protection layer; and / or, The light transmittance of the second airtight protection portion is greater than the light transmittance of the remaining portion of the airtight protection layer.

8. The display module according to claim 2 or 3, characterized in that: The display module further comprises an encapsulation layer, and the encapsulation layer is arranged on a side of the second airtight protection portion and the light-emitting diode away from the substrate; The refractive index of the encapsulation layer is greater than the refractive index of the second airtight protection portion; And / or, the bonding force between the encapsulation layer and the airtight protection layer is greater than the bonding force between the encapsulation layer and the substrate.

9. The display module according to any one of claims 1 to 3, characterized in that: The thickness of the airtight protective layer is in the range of 5nm-100nm; And / or, a metal wiring is disposed on a side wall of the substrate, and the first airtight protection portion is disposed on a side of the metal wiring facing away from the substrate; and / or, the airtight protective layer is formed by an atomic deposition process; And / or, the substrate comprises a glass substrate; And / or, the material of the airtight protection layer includes at least one of silicon dioxide, aluminum oxide, silicon nitride, and silicon oxynitride.

10. A display device, characterized in that: A display module comprising any one of claims 1 to 9.

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