Piezoelectric ceramic module, key assembly and electronic equipment

Abstract

The invention provides a piezoelectric ceramic module, a key assembly and electronic equipment. The piezoelectric ceramic module comprises piezoelectric ceramic and a substrate, the substrate comprises a main body part and a first elastic structure, the main body part is connected with the piezoelectric ceramic, the main body part comprises a first support arm and a second support arm, a first gap is formed between the first support arm and the second support arm, and a second gap is formed between the first gap and the second support arm. And the first elastic structure is arranged in the first notch and is bent towards a plane far away from the main body part. According to the invention, the piezoelectric ceramic can be prevented from fracture failure caused by vibration.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more specifically, to a piezoelectric ceramic module, a key assembly and an electronic device. Background Art

[0002] When an electronic device falls, the interaction between the ground and the electronic device and the buttons, and the interaction between the electronic device frame and the piezoelectric ceramics and the substrate will produce large impact vibrations. The vibrations will be superimposed on each other, causing the piezoelectric ceramics to produce large stress. When the stress exceeds the limit that the piezoelectric ceramics can withstand, the piezoelectric ceramics are prone to breakage and failure.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] One purpose of the present application is to provide a new technical solution for a piezoelectric ceramic module, a key assembly and an electronic device.

[0005] According to a first aspect of the present application, a piezoelectric ceramic module is provided, wherein the piezoelectric ceramic module comprises:

[0006] Piezoelectric ceramics;

[0007] The substrate comprises a main body and a first elastic structure, the main body is connected to the piezoelectric ceramic, the main body comprises a first arm and a second arm, a first notch is formed between the first arm and the second arm, and the first elastic structure is arranged in the first notch and is bent towards a plane away from the main body.

[0008] Optionally, the main body includes a first connecting surface and a second connecting surface, the first connecting surface and the second connecting surface are two opposite surfaces of the substrate, and the first connecting surface is connected to the piezoelectric ceramic;

[0009] The piezoelectric ceramic module further includes a buffer pad connected to the second connecting surface.

[0010] Optionally, the first arm includes a first supporting portion and a first bending portion, and the second arm includes a second supporting portion and a second bending portion;

[0011] A first sub-gap is formed between the first supporting portion, the first bending portion and the first elastic structure; and a second sub-gap is formed between the second supporting portion, the second bending portion and the first elastic structure.

[0012] Optionally, a first recessed portion is formed between the first supporting portion and the first bending portion; and a second recessed portion is formed between the second supporting portion and the second bending portion.

[0013] According to a second aspect of the present application, a key assembly is provided, comprising a frame and a piezoelectric ceramic module as described in any one of the first aspects, wherein the piezoelectric ceramic module is arranged in the frame.

[0014] Optionally, the substrate further comprises a protruding step;

[0015] The button assembly also includes a bracket, and the bracket includes a flange, and the flange is snap-fitted with the protruding step.

[0016] Optionally, the flange includes a first protrusion and a second protrusion, a groove is formed between the first protrusion and the second protrusion, the groove is used to accommodate the protruding step, and the groove depth of the groove is greater than the thickness of the protruding step.

[0017] Optionally, the button assembly also includes a sensing assembly, the sensing assembly includes a connecting portion and a second elastic structure, the connecting portion is connected to the bracket, the connecting portion includes a third arm and a fourth arm, a second notch is formed between the third arm and the fourth arm, and the second elastic structure is arranged in the second notch and is bent toward a plane away from the connecting portion.

[0018] Optionally, the frame includes a first step portion and a second step portion, and the first step portion and the second step portion are arranged at intervals in the up-down direction;

[0019] The first support arm, the second support arm and the first elastic structure are arranged between the first step portion and the second step portion.

[0020] Optionally, the button assembly further includes a sensing assembly, the sensing assembly includes a connecting portion and a second elastic structure, the connecting portion includes a third arm and a fourth arm, a second notch is formed between the third arm and the fourth arm, and the second elastic structure is disposed in the second notch and is bent toward a plane away from the connecting portion;

[0021] The third support arm and the fourth support arm are arranged on the second step portion, and the second elastic structure is clamped by the second step portion and the outer frame of the frame body.

[0022] Optionally, the sensing component further includes a connecting hole, and the frame further includes a mounting groove;

[0023] The key assembly also includes a key cap, which includes a pressing portion, a protruding portion and a buckle. The pressing portion is arranged in the mounting groove, and the protruding portion can pass through the connecting hole and be connected with the buckle.

[0024] According to a third aspect of the present application, an electronic device is provided, comprising a key assembly as described in any one of the second aspects.

[0025] In the piezoelectric ceramic module in the embodiment of the present application, the substrate can play a structural reinforcement role for the piezoelectric ceramics. The design of the first elastic structure, the first arm and the second arm can ensure that the vibration generated by the drop of the electronic device is first absorbed by the substrate connected to the piezoelectric ceramics, and then transmitted to the piezoelectric ceramics, thereby effectively avoiding the problem of piezoelectric ceramics breaking and failing due to vibration.

[0026] Other features and advantages of the present application will become apparent from the following detailed description of exemplary implementations of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0028] Figure 1 It is a structural schematic diagram of a key assembly in one embodiment of the present application.

[0029] Figure 2 It is an exploded view of a button assembly in one embodiment of the present application.

[0030] Figure 3 It is a schematic diagram of the structure of a substrate in one embodiment of the present application.

[0031] Figure 4 It is a schematic diagram of the structure of a buffer pad in one embodiment of the present application.

[0032] Figure 5 It is a schematic diagram of the structure of a bracket in one embodiment of the present application.

[0033] Figure 6 It is a structural diagram of the perception component in one embodiment of the present application.

[0034] Description of reference numerals:

[0035] 1. Piezoelectric ceramics;

[0036] 2. substrate; 21. main body; 201. first connection surface; 202. second connection surface; 211. first arm; 2111. first support portion; 2112. first bending portion; 2113. first recessed portion; 212. second arm; 2121. second support portion; 2122. second bending portion; 2123. second recessed portion; 213. first notch; 2131. first sub-notch; 2132. second sub-notch; 22. first elastic structure; 23. protruding step;

[0037] 3. cushion; 31. gap;

[0038] 4. frame; 41. first step portion; 42. second step portion; 43. mounting groove; 44. first connecting hole; 45. outer frame;

[0039] 5. bracket; 51. flange; 511. first protrusion; 512. second protrusion; 513. groove;

[0040] 6. Sensing component; 61. Connecting part; 611. Third arm; 612. Fourth arm; 613. Second notch; 62. Second elastic structure; 63. Connecting hole; 64. Sensing part;

[0041] 7. key cap; 71. pressing portion; 72. raised portion; 73. buckle;

[0042] 8. baffle; 81. second connecting hole. DETAILED DESCRIPTION

[0043] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0044] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0045] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0046] According to one embodiment of the present application, a piezoelectric ceramic module is provided, which includes a piezoelectric ceramic 1 and a substrate 2, wherein the substrate 2 includes a main body 21 and a first elastic structure 22, wherein the main body 21 is connected to the piezoelectric ceramic 1, wherein the main body 21 includes a first arm 211 and a second arm 212, wherein a first notch 213 is formed between the first arm 211 and the second arm 212, and wherein the first elastic structure 22 is disposed in the first notch 213 and is bent toward a plane away from the main body 21.

[0047] Specifically, Figure 1 and Figure 2As shown, the piezoelectric ceramic 1 described in the embodiment of the present application is a vibration component, which can expand and contract in the left and right directions when subjected to a driving waveform. The piezoelectric ceramic 1 that expands and contracts in the left and right directions will be fixedly constrained by the substrate 2, so that both the piezoelectric ceramic 1 and the substrate 2 are deformed in the direction of the substrate 2 and generate continuous vibration. The vibration will be transmitted to the keycap 7 of the key assembly through the corresponding structure, so that the finger can feel the vibration of the piezoelectric ceramic 1, forming a tactile feedback action.

[0048] Among them, the piezoelectric ceramic 1 described in the embodiment of the present application has the characteristics of low energy consumption, short feedback time, large vibration acceleration and large feedback force, and can be widely used in mobile phones, tablet computers, personal digital assistants, televisions, smart wearable products, virtual reality terminal equipment, augmented reality terminal equipment, rechargeable small household appliances (such as soymilk machines, sweeping robots), drones, radars, aerospace equipment or vehicle-mounted equipment and other electronic devices.

[0049] like Figure 3 As shown, the enhanced damping plate of the embodiment of the present application includes a main body 21 and a first elastic structure 22. The main body 21 can be connected to the piezoelectric ceramic 1 in the up and down direction, which effectively improves the overall structural strength and bending strength of the piezoelectric ceramic module, improves the anti-falling ability of the piezoelectric ceramic module during the falling process, and reduces the risk of fracture of the piezoelectric ceramic 1. Moreover, after the main body 21 is connected to the piezoelectric ceramic 1, the piezoelectric ceramic 1 and the substrate 2 can also form a vibration coupling structure, so that the deformation of the piezoelectric ceramic 1 can be converted into vibration and transmitted, thereby further improving the anti-falling ability of the piezoelectric ceramic module during the falling process.

[0050] The first arm 211 and the second arm 212 are provided at both ends of the main body 21 in the left-right direction, and the first arm 211 and the second arm 212 at either end can form a hollow structure with a first notch 213 in the front-back direction. The first elastic structure 22 is provided in the first notch 213 of the hollow structure and is bent away from the plane where the main body 21 is located, and the plane where the main body 21 is located is the plane formed by the main body 21 in the front-back direction.

[0051] After the electronic device falls, since the piezoelectric ceramic 1 and the substrate 2 are connected together, the large impact vibration generated by the interaction between the ground and the electronic device and the button, and the interaction between the electronic device frame 4 and the piezoelectric ceramic 1 and the substrate can be first transmitted to the first arm 211, the second arm 212 and the first elastic structure 22 of the substrate 2. Then, since the first arm 211, the second arm 212 and the first notch 213 can form a hollow structure, the impact vibration received by the substrate 2 will be concentrated in the hollow part for absorption and attenuation, that is, the hollow structure formed by the first arm 211, the second arm 212 and the first notch 213 plays a vibration reduction role, thereby effectively reducing the stress received by the piezoelectric ceramic 1, and avoiding the problem that the piezoelectric ceramic 1 is prone to fracture and failure when the stress exceeds the limit that the piezoelectric ceramic 1 can withstand.

[0052] In addition, the first elastic structure 22 can also absorb and reduce impact vibration to achieve a vibration reduction effect. Moreover, since the first elastic structure 22 is also arranged in the hollow structure, the first elastic structure 22 can further ensure the tightness of the substrate 2 and the electronic device frame 4 during vibration feedback, thereby further improving the transmission efficiency of the piezoelectric ceramic 1 and further improving the feedback force output of the piezoelectric ceramic 1.

[0053] Moreover, through the setting of the first elastic structure 22, the present application can also enable the first elastic structure 22 to provide a certain buffer for the piezoelectric ceramic 1 when the electronic device falls, and realize the first elastic structure 22 to absorb the impact force of the piezoelectric ceramic 1 in the upper and lower directions, thereby further improving the anti-fall ability of the piezoelectric ceramic 1.

[0054] Furthermore, the length dimension of the main body 21 of the present application is greater than the length dimension of the piezoelectric ceramic 1, and the width dimension of the main body 21 is greater than or equal to the length dimension of the piezoelectric ceramic 1. The length dimension of the piezoelectric ceramic 1 can range from 10 to 30 mm, the width dimension can range from 2 to 5 mm, and the thickness dimension can range from 0.2 to 0.9 mm, so as to better meet the tactile feedback requirements of buttons in different electronic devices. The length dimension, width dimension and thickness dimension of the main body 21 can be adjusted according to the length dimension, width dimension and thickness dimension of the piezoelectric ceramic 1, as long as the transmission of vibration can be achieved.

[0055] In addition, the piezoelectric ceramic 1 and the main body 21 of the substrate 2 described in the present application can also be connected together by welding, bonding or mechanical clamping. Those skilled in the art can choose according to actual needs, and the present application does not make any specific restrictions here.

[0056] It should be noted that the length in this application refers to the size of each component along the left-right direction, the width refers to the size of each component along the front-back direction, and the thickness and groove depth refer to the size of each component along the up-down direction. The left-right direction, the front-back direction, and the up-down direction are directions that intersect each other.

[0057] In one embodiment, the main body 21 includes a first connecting surface 201 and a second connecting surface 202, the first connecting surface 201 and the second connecting surface 202 are two opposite surfaces of the substrate 2, and the first connecting surface 201 is connected to the piezoelectric ceramic 1; the piezoelectric ceramic module also includes a buffer pad 3, and the buffer pad 3 is connected to the second connecting surface 202.

[0058] Specifically, Figure 1 and Figure 2 As shown, in the embodiment of the present application, the first connecting surface 201 and the second connecting surface 202 are two surfaces of the main body 21 along the up and down directions, and the first elastic structure 22 is arranged in the first notch 213 and bent away from the first connecting surface 201, that is, the first elastic structure 22 protrudes from the first connecting surface 201 along the up and down directions.

[0059] The piezoelectric ceramic 1 can be arranged on the first connection surface 201 to generate continuous vibration when receiving a driving waveform and transmit it to the keycap 7 of the key assembly, so that the finger can feel the vibration of the piezoelectric ceramic 1 to form a tactile feedback action.

[0060] Of course, the piezoelectric ceramic 1 can also be arranged on the second connecting surface 202, and can also generate continuous vibration when subjected to a driving waveform, and transmit it to the keycap 7 of the key assembly, so that the finger can feel the vibration of the piezoelectric ceramic 1, forming a tactile feedback action.

[0061] Among them, when the piezoelectric ceramic 1 is arranged on the first connecting surface 201, the buffer pad 3 can also be arranged on the second connecting surface 202. The buffer pad 3 can absorb the impact force during the drop of the electronic device to achieve the absorption of the impact force in the up and down directions of the piezoelectric ceramic 1, thereby further improving the anti-drop ability of the piezoelectric ceramic 1.

[0062] In addition, when the piezoelectric ceramic 1 is disposed on the second connection surface 202 , the buffer pad 3 can be disposed on a side of the piezoelectric ceramic 1 away from the second connection surface 202 to prevent the piezoelectric ceramic 1 from being broken due to hard contact with the electronic device frame 4 .

[0063] The material of the buffer pad 3 can be at least one of soft materials such as foam, silicone or double-sided tape.

[0064] The thickness of the buffer pad 3 may range from 0.1 to 2 mm, and the length and width of the buffer pad 3 are greater than those of the piezoelectric ceramic 1 to more effectively absorb the impact force of the piezoelectric ceramic 1 in the vertical direction.

[0065] In addition, if Figure 4 As shown, the buffer pad 3 of the present application may also be provided with a plurality of gaps 31 to further improve the buffering effect of the buffer pad 3 .

[0066] In one embodiment, the first arm 211 includes a first supporting portion 2111 and a first bending portion 2112, and the second arm 212 includes a second supporting portion 2121 and a second bending portion 2122; a first sub-notch 2131 is formed between the first supporting portion 2111, the first bending portion 2112 and the first elastic structure 22; a second sub-notch 2132 is formed between the second supporting portion 2121, the second bending portion 2122 and the first elastic structure 22.

[0067] Specifically, Figure 3 As shown, the embodiment of the present application, through the provision of the first sub-notch 2131 and the second sub-notch 2132, can effectively absorb the impact force of the piezoelectric ceramic 1 in the front-to-back direction during the falling process of the electronic device, thereby more effectively preventing the piezoelectric ceramic 1 from cracking, crack initiation and crack propagation.

[0068] In one embodiment, a first recessed portion 2113 is formed between the first supporting portion 2111 and the first bending portion 2112 ; a second recessed portion 2123 is formed between the second supporting portion 2121 and the second bending portion 2122 .

[0069] Specifically, Figure 3 As shown, in the embodiment of the present application, the first recessed portion 2113 and the second recessed portion 2123 are engaged with the protrusion on the first step portion 41 of the frame 4, thereby effectively ensuring the stability and reliability of the piezoelectric ceramic module during use.

[0070] In addition, the embodiment of the present application can effectively absorb the impact force of the piezoelectric ceramic 1 in the left and right directions during the drop of the electronic device through the provision of the first recessed portion 2113 and the second recessed portion 2123.

[0071] Thus, the present application realizes absorption of impact force in the up-and-down direction of the piezoelectric ceramic 1 through the first elastic structure 22 and / or the buffer pad 3, absorption of impact force in the front-and-rear direction of the piezoelectric ceramic 1 through the first sub-notch 2131 and the second sub-notch 2132, and absorption of impact force in the left-and-right direction of the piezoelectric ceramic 1 through the first recessed portion 2113 and the second recessed portion 2123, thereby effectively realizing all-round protection for the piezoelectric ceramic 1 and greatly preventing the piezoelectric ceramic 1 from cracking, crack initiation, and crack propagation due to impact.

[0072] According to another embodiment of the present application, a key assembly is provided. The key assembly includes a frame 4 and the piezoelectric ceramic module described in the embodiment of the present application. The piezoelectric ceramic module is arranged in the frame 4.

[0073] Specifically, Figure 1 As shown, the piezoelectric ceramic module described in the embodiment of the present application is arranged in the frame 4 of the button assembly, and the button assembly is arranged in the electronic device, so that after the electronic device falls, the substrate 2 arranged in the frame 4 can effectively reduce the stress on the piezoelectric ceramic 1, thereby avoiding the problem that the piezoelectric ceramic 1 is prone to fracture and failure when the stress exceeds the limit that the piezoelectric ceramic 1 can withstand.

[0074] In one embodiment, the base plate 2 further includes a protruding step 23 ; the key assembly further includes a bracket 5 , the bracket 5 includes a flange 51 , and the flange 51 is snap-fitted with the protruding step 23 .

[0075] Specifically, Figure 3 and Figure 5 As shown, the bracket 5 of the embodiment of the present application is provided with flanges 51 on both sides along the front-to-back direction, and the flanges 51 extend from top to bottom. The main body 21 of the substrate 2 is provided with protruding steps 23 on both sides along the front-to-back direction, and the protruding steps 23 can be engaged with the flanges 51, so that the protruding steps 23 can serve as the support points of the bracket 5, so that the pressure on the bracket 5 can be transmitted to the substrate 2 through the protruding steps 23, avoiding the bracket 5 from directly pressing on the position where the piezoelectric ceramic 1 is located.

[0076] In one embodiment, the flange 51 includes a first protrusion 511 and a second protrusion 512 , and a groove 513 is formed between the first protrusion 511 and the second protrusion 512 , and the groove 513 is used to accommodate the protruding step 23 , and the groove depth of the groove 513 is greater than the thickness of the protruding step 23 .

[0077] Specifically, Figure 1As shown, the flanges 51 on both sides of the bracket 5 along the front-to-back direction in the embodiment of the present application are provided with a first protrusion 511 and a second protrusion 512 protruding downward, and a groove 513 is formed between the first protrusion 511 and the second protrusion 512, and the groove 513 can accommodate the protruding step 23 to achieve the snap-fitting between the bracket 5 and the substrate 2, so that the pressure of the bracket 5 can be transmitted to the substrate 2, and will not directly press on the piezoelectric ceramic 1 to cause it to break.

[0078] Among them, Figure 2 As shown, the groove depth dimension of the groove 513 of the present application is D, and the thickness dimension of the protruding step 23 is T. The groove depth dimension D of the groove 513 is greater than the thickness dimension T of the protruding step 23, so that after the groove 513 is snap-fitted with the protruding step 23, the first protrusion 511 and the second protrusion 512 can pass over the main body 21.

[0079] Therefore, when the bracket 5 moves downward to the limit position, the first protrusion 511 and the second protrusion 512 can abut against the frame 4, thereby effectively avoiding the problem of the piezoelectric ceramic 1 being fractured and failing due to excessive deformation of the substrate 2.

[0080] In one embodiment, the button assembly also includes a sensing assembly 6, the sensing assembly 6 includes a connecting portion 61 and a second elastic structure 62, the connecting portion 61 is connected to the bracket 5, the connecting portion 61 includes a third arm 611 and a fourth arm 612, a second notch 613 is formed between the third arm 611 and the fourth arm 612, the second elastic structure 62 is arranged in the second notch 613 and is bent toward a plane away from the connecting portion 61.

[0081] Specifically, Figure 6 As shown, the sensing component 6 described in the embodiment of the present application includes a connecting portion 61 and a first elastic structure 22, the connecting portion 61 includes two side surfaces along the up and down directions, the upper side surface of the connecting portion 61 is provided with a sensing portion 64, the sensing portion 64 is used to sense the pressing force and the size of the displacement, and the bracket 5 can be connected to the lower side surface of the connecting portion 61 by bonding or welding.

[0082] The connecting portion 61 is provided with a third arm 611 and a fourth arm 612 at both ends in the left-right direction, and the third arm 611 and the fourth arm 612 at either end can form a hollow structure with a second notch 613 in the front-back direction. The second elastic structure 62 is provided in the second notch 613 of the hollow structure and is bent away from the plane where the connecting portion 61 is located, and the plane where the connecting portion 61 is located is the plane formed by the connecting portion 61 in the front-back direction.

[0083] Therefore, the present application uses the hollow structure of the connecting part 61, so that when the sensing component 6 is subjected to impact vibration, the impact vibration can be concentrated to the hollow part formed by the connecting part 61 for absorption and weakening, thereby effectively reducing the stress on the sensing component 6 and avoiding the problem of the sensing component 6 being prone to breakage and failure when the stress exceeds the limit that the sensing component 6 can withstand.

[0084] In addition, since the hollow structure is also provided with the second elastic structure 62, the tightness of the sensing component 6 and the electronic device frame 4 during vibration feedback is further ensured, thereby further improving the sensing efficiency of the sensing component 6. Moreover, the second elastic structure 62 can also provide a certain buffer for the sensing component 6 when the electronic device falls, and absorb the impact force of the sensing component 6 in the up and down directions, thereby further improving the anti-falling ability of the sensing component 6.

[0085] In addition, the structures of the third arm 611 and the fourth arm 612 may be the same as those of the first arm 211 and the second arm 212, so that the third arm 611 and the fourth arm 612 can provide all-round protection for the sensing component 6 and prevent the sensing component 6 from cracking, cracking and crack propagation due to impact.

[0086] Furthermore, when the electronic device falls, since the third arm 611, the fourth arm 612 and the second elastic structure 62 absorb part of the impact force, the remaining impact force is weakened after being transmitted to the substrate 2 through the bracket 5, thereby further reducing the risk of the piezoelectric ceramic 1 being broken by the impact.

[0087] In one embodiment, the frame body 4 includes a first step portion 41 and a second step portion 42, and the first step portion 41 and the second step portion 42 are spaced apart in the up and down directions; the first support arm 211, the second support arm 212 and the first elastic structure 22 are arranged between the first step portion 41 and the second step portion 42.

[0088] Specifically, Figure 1 and Figure 2As shown, the frame body 4 of the embodiment of the present application is provided with a first step portion 41 and a second step portion 42, and the first step portion 41 and the second step portion 42 are arranged at intervals in the up-down direction. Two first step portions 41 are arranged at intervals in the left-right direction, and the main body 21 of the substrate 2 can be arranged across the two first step portions 41 to achieve the support of the substrate 2 by the first step portion 41, thereby ensuring the stability and reliability of the use of the substrate 2. Two second step portions 42 are arranged in the left-right direction, and the connection portion 61 of the sensing component 6 can be arranged across the two second step portions 42 to achieve the support of the sensing component 6 by the second step portion 42, thereby ensuring the stability and reliability of the use of the sensing component 6.

[0089] The first arm 211, the second arm 212 and the first elastic structure 22 are located between the first step portion 41 and the second step portion 42. The first step portion 41 and the second step portion 42 clamp the first elastic structure 22. The first elastic structure 22 can stably position the substrate 2 in the frame 4 by its elastic force. The first arm 211, the second arm 212 and the first elastic structure 22 can play a buffering role together.

[0090] Among them, when the main body 21 of the substrate 2 is arranged on two first step portions 41, the first elastic structure 22 of the substrate 2 can abut against the frame 4 to achieve a close fit between the substrate 2 and the frame 4, so that when the electronic device falls, the first elastic structure 22 can provide a certain buffer for the piezoelectric ceramic 1 and absorb the impact force of the piezoelectric ceramic 1 in the upper and lower directions, thereby effectively improving the anti-fall ability of the piezoelectric ceramic 1.

[0091] In addition, when the connection portion 61 of the sensing component 6 is arranged across the two second step portions 42, the second elastic structure 62 of the sensing component 6 can abut against the frame body 4. Specifically, the second elastic structure 62 is clamped by the second step portion 42 and the outer frame 45 to achieve a close fit between the sensing component 6 and the frame body 4, so that when the electronic device falls, the second elastic structure 62 can provide a certain buffer for the sensing component 6 and absorb the impact force of the sensing component 6 in the up and down directions, thereby effectively improving the anti-fall ability of the sensing component 6.

[0092] It should be noted that the outer frame 45 described in the present application refers to the frame of the frame body 4 of the electronic device facing the user, and the side facing the various electronic components inside the electronic device is the inner frame.

[0093] In one embodiment, the sensing component 6 also includes a connecting hole 63, and the frame 4 also includes a mounting groove 43; the button assembly also includes a keycap 7, and the keycap 7 includes a pressing portion 71, a protruding portion 72 and a buckle 73, the pressing portion 71 is arranged in the mounting groove 43, and the protruding portion 72 can pass through the connecting hole 63 and connect with the buckle 73.

[0094] Specifically, Figure 1 and Figure 2 As shown, the frame body 4 of the embodiment of the present application also includes a mounting groove 43, which is generally provided on the outer frame 45. The keycap 7 of the key assembly can be installed in the mounting groove 43 to realize the assembly of the keycap 7 from the outside to the inside of the frame body 4. The keycap 7 includes a pressing portion 71 and a protruding portion 72, wherein the pressing portion 71 is arranged in the mounting groove 43 and protrudes from the plane where the upper surface of the mounting groove 43 is located, and the protruding portion 72 is a cylindrical protrusion extending along the assembly direction of the keycap 7 on the pressing portion 71, and the protruding portion 72 can be connected to other structures in the frame body 4 by means of pins, straight surface contact or arc surface contact, so that when the user presses the pressing portion 71 of the keycap 7, the vibration can be transmitted to the piezoelectric ceramic 1 through the protruding portion 72 to form a tactile feedback action.

[0095] The keycap 7 further includes a buckle 73, which can be connected to the protrusion 72 to prevent the keycap 7 from falling off the frame 4. The buckle 73 can be arranged on a side of the sensing component 6 away from the pressing portion 71, and the sensing component 6 is provided with a connecting hole 63, and the protrusion 72 can pass through the connecting hole 63 to connect with the buckle 73.

[0096] In addition, the buckle 73 can also be configured as a pin buckle 73, so that the pin buckle 73 can form an integrated structure with the piezoelectric ceramic module, and can feed back the tactile sensation formed by the piezoelectric ceramic module to the user.

[0097] Furthermore, the present application assembles the keycap 7 from the outside to the inside of the frame 4, so that the keycap 7 and the frame 4 can form a blocking structure to block the piezoelectric ceramic module, thereby effectively reducing the impact of the keycap 7 on the internal structure of the frame 4 and improving the safety of the internal structure of the frame 4.

[0098] In addition, when the keycap 7 is subjected to external pressure, the pressure is transmitted to the sensing component 6, the sensing component 6 transmits the pressure to the bracket 5, the bracket 5 transmits the pressure to the substrate 2, and the substrate 2 transmits the pressure to the piezoelectric ceramic 1. In the process of pressure transmission, multiple levels of buffering will be passed through the sensing component 6, the substrate 2 and the buffer pad 3.

[0099] In one embodiment, the frame 4 further includes a first connecting hole 44 ; the button assembly further includes a baffle 8 , the baffle 8 includes a second connecting hole 81 , and the button assembly and the baffle 8 are assembled together through the first connecting hole 44 and the second connecting hole 81 .

[0100] Specifically, Figure 1 and Figure 2 As shown, the present application provides the baffle 8 so that the piezoelectric ceramic module as a whole can be assembled in the frame 4, thereby effectively preventing external impurities from entering the frame 4 and affecting the performance of the piezoelectric ceramic module.

[0101] According to another embodiment of the present application, an electronic device is provided, and the electronic device includes the key assembly described in the embodiment of the present application.

[0102] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0103] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A piezoelectric ceramic module, characterized in that: include: Piezoelectric ceramics (1); A substrate (2), the substrate (2) comprising a main body (21) and a first elastic structure (22), the main body (21) being connected to the piezoelectric ceramic (1), the main body (21) comprising a first arm (211) and a second arm (212), a first notch (213) being formed between the first arm (211) and the second arm (212), the first elastic structure (22) being arranged in the first notch (213) and being bent towards a plane away from the main body (21).

2. The piezoelectric ceramic module according to claim 1, characterized in that: The main body (21) comprises a first connecting surface (201) and a second connecting surface (202), the first connecting surface (201) and the second connecting surface (202) being two opposite surfaces of the substrate (2), and the first connecting surface (201) is connected to the piezoelectric ceramic (1); The piezoelectric ceramic module also includes a buffer pad (3), and the buffer pad (3) is connected to the second connecting surface (202).

3. The piezoelectric ceramic module according to claim 1, characterized in that: The first support arm (211) comprises a first supporting portion (2111) and a first bending portion (2112), and the second support arm (212) comprises a second supporting portion (2121) and a second bending portion (2122); A first sub-notch (2131) is formed between the first supporting portion (2111), the first bending portion (2112) and the first elastic structure (22); and a second sub-notch (2132) is formed between the second supporting portion (2121), the second bending portion (2122) and the first elastic structure (22).

4. The piezoelectric ceramic module according to claim 3, characterized in that: A first recessed portion (2113) is formed between the first supporting portion (2111) and the first bending portion (2112); and a second recessed portion (2123) is formed between the second supporting portion (2121) and the second bending portion (2122).

5. A key assembly, characterized in that: It comprises a frame (4) and the piezoelectric ceramic module according to any one of claims 1 to 4, wherein the piezoelectric ceramic module is arranged in the frame (4).

6. The key assembly according to claim 5, characterized in that: The base plate (2) further comprises a protruding step (23); The key assembly further comprises a bracket (5), the bracket (5) comprises a flange (51), and the flange (51) is snap-fitted with the protruding step (25).

7. The key assembly according to claim 6, characterized in that: The flange (51) comprises a first protruding portion (511) and a second protruding portion (512), a groove (513) is formed between the first protruding portion (511) and the second protruding portion (512), the groove (513) is used to accommodate the protruding step (25), and the groove depth of the groove (513) is greater than the thickness of the protruding step (25).

8. The key assembly according to claim 6, characterized in that: The key assembly also includes a sensing assembly (6), the sensing assembly (6) includes a connecting portion (61) and a second elastic structure (62), the connecting portion (61) is connected to the bracket (5), the connecting portion (61) includes a third arm (611) and a fourth arm (612), a second notch (613) is formed between the third arm (611) and the fourth arm (612), and the second elastic structure (63) is arranged in the second notch (613) and is bent toward a plane away from the connecting portion (61).

9. The key assembly according to claim 5, characterized in that: The frame (4) comprises a first step portion (41) and a second step portion (42), wherein the first step portion (41) and the second step portion (42) are arranged at intervals in the up-down direction; The first support arm (211), the second support arm (212) and the first elastic structure (22) are arranged between the first step portion (41) and the second step portion (42).

10. The key assembly according to claim 9, characterized in that: The key assembly further comprises a sensing assembly (6), the sensing assembly (6) comprising a connecting portion (61) and a second elastic structure (62), the connecting portion (61) comprising a third arm (611) and a fourth arm (612), a second notch (613) being formed between the third arm (611) and the fourth arm (612), the second elastic structure (63) being arranged in the second notch (613) and being bent away from the plane where the connecting portion (61) is located; The third support arm (611) and the fourth support arm (612) are arranged on the second step portion (42), and the second elastic structure (62) is clamped by the second step portion (42) and the outer frame (45) of the frame body (4).

11. The key assembly according to claim 10, characterized in that: The sensing component (6) further includes a connecting hole (65), and the frame (4) further includes a mounting groove (43); The key assembly further comprises a key cap (7), wherein the key cap (7) comprises a pressing portion (71), a protruding portion (72) and a buckle (73), wherein the pressing portion (71) is arranged in the mounting groove (43), and the protruding portion (72) can pass through the connecting hole (65) to be connected to the buckle (73).

12. An electronic device, characterized in that: A key assembly comprising any one of claims 5-11.

Images