LED display device and manufacturing method thereof
By vertically stacking multi-layer light-emitting chips in LED display devices and laying lenses on their peripheral sides, the brightness loss problem caused by direct vertical stacking of three chips is solved, achieving high resolution and accurate color performance.
Patent Information
- Application Number
- CN202411742735.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-03-18
AI Technical Summary
The direct vertical stacking of three Micro-LED chips will result in brightness loss, making it difficult to achieve high resolution, lightweight design and accurate color performance.
An LED display device is designed, which is to improve light extraction efficiency by vertically stacking multi-layer light emitting chips on the substrate in the thickness direction, and to arrange a first lens on the peripheral side of each layer of light emitting chip, electrically connected to a common first electrode pad and a second electrode pad, and to provide a second lens above the topmost light emitting chip.
By adding lenses to improve light extraction efficiency, the brightness loss problem caused by direct vertical stacking of three chips is solved, achieving higher pixel density and more accurate color performance.
Smart Images
Figure CN119653966A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of LED display technology, and in particular to an LED display device and a manufacturing method thereof. Background Art
[0002] With the development of display technology, the demand for high resolution and color accuracy continues to increase. The traditional RGB three-color plane arrangement method cannot fully utilize the display space because each color occupies an independent pixel unit, limiting the further improvement of pixel density. In addition, miniaturized devices such as AR (Augmented Reality) glasses and smart watches have increasingly higher requirements for the compactness and color accuracy of displays, but due to the limitations of traditional planar structures, it is difficult to achieve high resolution, thin and light design and accurate color performance.
[0003] Therefore, the three-color vertical stacking solution came into being. In related technologies, three-color vertical stacking LED display devices are formed by vertically stacking red, green and blue Micro-LED chips on the same pixel point. This technology can significantly increase the pixel density without expanding the screen area. However, the direct vertical stacking of the three chips will cause brightness loss.
[0004] Therefore, it is necessary to design a new LED display device and a manufacturing method thereof to overcome the above problems. Summary of the invention
[0005] The present application provides an LED display device and a manufacturing method thereof, which can solve the technical problem in the related art that direct vertical stacking of three chips will cause brightness loss.
[0006] In a first aspect, an embodiment of the present application provides an LED display device, comprising: a substrate, the substrate being provided with a common first pole pad and a plurality of second pole pads, the polarity of the first pole being opposite to that of the second pole; a multilayer light-emitting chip, the multilayer light-emitting chip being vertically stacked on the substrate along the thickness direction of the substrate, and the multilayer light-emitting chip being electrically connected to the common first pole pad and the second pole pad, and a first lens being evenly arranged on the circumference of each layer of the light-emitting chip; and a second lens, the second lens being fixedly disposed above the topmost layer of the light-emitting chip.
[0007] In combination with the first aspect, in one implementation, the first lens has an inclined reflective surface facing the light emitting chip.
[0008] In combination with the first aspect, in one embodiment, the multiple layers of light-emitting chips all adopt flip-chips, and the first poles of all the light-emitting chips are electrically connected to the common first pole pad, and the second poles of the light-emitting chips in different layers are respectively electrically connected to different second pole pads.
[0009] In combination with the first aspect, in one embodiment, a conductive layer is arranged under each layer of the light-emitting chips, and a first pole conductive path and a second pole conductive path perpendicular to the substrate are arranged between two adjacent layers of the conductive layers; the light-emitting chips of the lowest layer are electrically connected to the common first pole pad and the second pole pad through the conductive layer where the light-emitting chips of this layer are located; the light-emitting chips of each remaining layer are connected to the common first pole pad through the conductive layer where the light-emitting chips of this layer are located and the first pole conductive path under the light-emitting chips of this layer, and are electrically connected to the second pole pad through the second pole conductive path thereunder.
[0010] In combination with the first aspect, in one implementation, the second-pole conductive paths electrically connected to the light-emitting chips at different layers are staggered.
[0011] In combination with the first aspect, in one embodiment, a transparent medium layer is provided under each conductive layer, and each transparent medium layer is provided with a conductive hole, the conductive hole electrically connects the corresponding conductive layer with the corresponding first-pole conductive path, and the conductive hole electrically connects the corresponding conductive layer with the corresponding second-pole conductive path.
[0012] In combination with the first aspect, in one embodiment, a light screening layer is provided between the transparent medium layer and the conductive layer, and the light screening layer is configured to block the light from the light emitting chip located in the upper layer from passing through and allow the light from the light emitting chip located in the lower layer to pass through.
[0013] In combination with the first aspect, in one implementation, a reinforcement structure is supported between two adjacent transparent medium layers, and the reinforcement structure is located outside the first lens, and a filling material is also provided between two adjacent transparent medium layers.
[0014] In combination with the first aspect, in one embodiment, three layers of the light-emitting chips are provided on the substrate, and the substrate is provided with three second-pole pads, and the three second-pole pads and the common first-pole pad are arranged at intervals.
[0015] In a second aspect, an embodiment of the present application provides a method for manufacturing an LED display device, which comprises the following steps:
[0016] A plurality of light-emitting chips are stacked vertically layer by layer on a substrate along a thickness direction of the substrate, and a first lens is arranged on the peripheral side of each layer of the light-emitting chips; wherein the substrate is provided with a common first pole pad and a plurality of second pole pads, the first pole and the second pole have opposite polarities, and the plurality of light-emitting chips are electrically connected to the common first pole pad and the second pole pad;
[0017] A second lens is disposed above the topmost light emitting chip.
[0018] The beneficial effects brought by the technical solution provided by the embodiments of the present application include:
[0019] By arranging a first lens on the periphery of each layer of light-emitting chip, the first lens can reflect light emitted from the side of the light-emitting chip upward, thereby improving the light extraction efficiency and the brightness of the light-emitting chip; at the same time, the second lens arranged above the top-layer light-emitting chip can further improve the light extraction efficiency, solving the technical problem in the related technology that direct vertical stacking of three chips will cause brightness loss. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 A front view of an LED display device provided in an embodiment of the present application;
[0022] Figure 2 A left view of the LED display device provided in an embodiment of the present application;
[0023] Figure 3 A top view of an LED display device provided in an embodiment of the present application;
[0024] Figure 4 A right side view of the LED display device provided in an embodiment of the present application;
[0025] Figure 5 A schematic diagram of the structure of a substrate provided in an embodiment of the present application;
[0026] Figure 6 A schematic diagram of a structure in which a transparent medium layer is covered on a substrate provided in an embodiment of the present application;
[0027] Figure 7 A schematic diagram of the structure after the first layer of light-emitting chips are transferred onto the substrate provided in an embodiment of the present application;
[0028] Figure 8 A schematic diagram of a structure in which a first lens is disposed on a first transparent medium layer provided in an embodiment of the present application;
[0029] Fig. 9 A schematic diagram of the structure of the second-layer light-emitting chip provided in an embodiment of the present application;
[0030] Fig.10 A schematic diagram of the structure of the third-layer light-emitting chip provided in the embodiment of the present application;
[0031] Fig.11 A schematic diagram of the structure of an LED display device provided in an embodiment of the present application using a colored filling material;
[0032] Fig.12 A front view of another LED display device provided in an embodiment of the present application.
[0033] In the figure:
[0034] 1. substrate; 11. common first electrode pad; 12. second electrode pad;
[0035] 2. Light-emitting chip;
[0036] 3. first lens; 31. inclined reflecting surface; 4. second lens;
[0037] 5. conductive layer; 61. first conductive path; 62. second conductive path;
[0038] 7. Transparent dielectric layer; 71. Conductive hole;
[0039] 8. Light screening layer; 9. Reinforcement structure; 10. Filling material. DETAILED DESCRIPTION
[0040] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0041] The embodiment of the present application provides an LED display device and a method for manufacturing the same, which can solve the technical problem in the related art that direct vertical stacking of three chips will cause brightness loss.
[0042] See also Figure 1 As shown, an LED display device provided in an embodiment of the present application may include: a substrate 1, wherein the substrate 1 is provided with a common first pole pad 11 and a plurality of second pole pads 12, wherein the polarities of the first pole and the second pole are opposite; a multilayer light-emitting chip 2, wherein the multilayer light-emitting chip 2 is vertically stacked on the substrate 1 along the thickness direction of the substrate 1, and the multilayer light-emitting chip 2 is electrically connected to the common first pole pad 11 and the second pole pad 12, and a first lens 3 is uniformly arranged on the circumference of each layer of the light-emitting chip 2; and a second lens 4, wherein the second lens 4 is fixedly disposed above the topmost layer of the light-emitting chip 2.
[0043] See also Figure 1As shown, in this embodiment, three layers of light-emitting chips 2 are preferably provided, and the first layer of light-emitting chips 2 from bottom to top is set as a red light chip, the second layer of light-emitting chips 2 is set as a green light chip, and the third layer (i.e., the top layer) of light-emitting chips 2 is set as a blue light chip (of course, in other embodiments, the color of each layer of light-emitting chips 2 can also be set according to actual needs, and more layers of light-emitting chips 2 can also be set, not limited to three layers). The substrate 1 is provided with a common first pole pad 11 and three second pole pads 12. In this embodiment, the first pole is a cathode and the second pole is an anode. Of course, the first pole can also be set as an anode; the three second pole pads 12 and a common first pole pad 11 are arranged in a rectangle on the surface of the substrate 1. The first pole of each layer of light-emitting chips 2 is electrically connected to the same common first pole pad 11, so that all light-emitting chips 2 have a common cathode, and the second pole of each light-emitting chip 2 is electrically connected to the corresponding second pole pad 12.
[0044] See also Figure 1 As shown, when arranging the first lens 3, a first lens 3 can be arranged on the left and right sides of each layer of light-emitting chip 2, respectively. The first lens 3 is a convex lens, and the first lens 3 can be prepared by injection molding or other methods. At the same time, the surface of the first lens 3 can be roughened to further improve the light extraction efficiency. Figure 2 As shown, the second lens 4 in this embodiment is located above the top light-emitting chip 2, that is, the top light-emitting chip 2 is not only arranged with the first lens 3 on the circumference, but also arranged with the second lens 4 on the top, and the first lens 3 can be the same as or different from the second lens 4 in structure and shape. In this embodiment, the second lens 4 is preferably arranged in a hemispherical shape. The material of the second lens 4 is preferably matte transparent glue, and the first lens 3 is also matte transparent material.
[0045] In this embodiment, by arranging the first lens 3 on the peripheral side of each layer of light-emitting chip 2, the first lens 3 can reflect the light emitted from the side of the light-emitting chip 2 upward, thereby improving the light extraction efficiency of each layer of light-emitting chip 2 and improving the brightness of the light-emitting chip 2; at the same time, the second lens 4 arranged above the topmost layer of light-emitting chip 2 can further improve the extraction efficiency of the light emitted upward by the light-emitting chip 2 and the light reflected upward by the first lens 3, and the extraction efficiency is higher than the sum of the first lens 3 and the second lens 4 set separately, which solves the technical problem in the related art that the direct vertical stacking of three chips will cause brightness loss.
[0046] Preferably, see Figure 1As shown, the first lens 3 has an inclined reflective surface 31 facing the light-emitting chip 2. In this embodiment, the surface of each layer of the first lens 3 can be any shape, such as a hemispherical shape. However, considering the light extraction effect, the first lens 3 is set to be a wedge-shaped lens with an inclined reflective surface 31. The inclined reflective surfaces 31 of the first lenses 3 on the left and right sides of each layer of the light-emitting chip 2 are inclined and extend from bottom to top in a direction away from each other. In this embodiment, an inclined reflective surface 31 facing the light-emitting chip 2 is set on the first lens 3, so that the effect of the first lens 3 reflecting light upward is better than that of lenses of other shapes. Each layer of the first lens 3 can be surface-treated to achieve a better light extraction effect. The shape of the first lens 3 is not limited to the surface morphology and treatment method, and other shapes or light extraction schemes are also possible. For example Fig.12 As shown, the surface of the first lens 3 facing the light emitting chip 2 is arranged to be stepped or wavy.
[0047] Furthermore, in one embodiment, the light emitting chips 2 of multiple layers are flip-chip, and the first electrodes of all the light emitting chips 2 are electrically connected to the common first electrode pad 11, and the second electrodes of the light emitting chips 2 of different layers are electrically connected to different second electrode pads 12. Figure 2 As shown, in this embodiment, each layer of light-emitting chips 2 adopts flip chips, and the first pole pins and the second pole pins of the flip chips are both located on the bottom surface of the light-emitting chips 2, so as to facilitate the pins of the chip to be led out from the bottom surface of the light-emitting chips 2 and electrically connected to the corresponding pads of the substrate 1. In this embodiment, the first poles of all light-emitting chips 2 are electrically connected to the common first pole pad 11, and the control of the first poles of all light-emitting chips 2 can be achieved by using one common pad; the second pole of each light-emitting chip 2 is electrically connected to an independent and different second pole pad 12, thereby achieving the individual control of each light-emitting chip 2.
[0048] At the same time, the light-emitting chips 2 of this embodiment all adopt flip chips, the upper surface of the flip chips is not blocked, the light output angle is larger than that of the front-mounted chips, and the double reflection effect of the first lens 3 and the second lens 4 makes the light output angle of the LED display device of this embodiment reach 150° to 175°, achieving a larger light output angle.
[0049] Based on the above technical solution, in some embodiments, see Figure 1As shown, a conductive layer 5 is provided under each layer of the light-emitting chips 2, and a first pole conductive path 61 and a second pole conductive path 62 perpendicular to the substrate 1 are provided between two adjacent layers of the conductive layers 5; the light-emitting chips 2 of the lowest layer are electrically connected to the common first pole pad 11 and the second pole pad 12 through the conductive layer 5 where the light-emitting chips 2 of this layer are located; the light-emitting chips 2 of each remaining layer are connected to the common first pole pad 11 through the conductive layer 5 where the light-emitting chips 2 of this layer are located and the first pole conductive path 61 under the light-emitting chips 2 of this layer, and are electrically connected to the second pole pad 12 through the second pole conductive path 62 thereunder.
[0050] In this embodiment, three layers of light-emitting chips 2 are used as an example for explanation. The entire LED display device is provided with three layers of conductive layers 5. Each layer of light-emitting chips 2 is directly fixed and electrically connected to the conductive layer 5. A first-pole conductive path 61 and a second-pole conductive path 62 are provided between the first conductive layer 5 and the second conductive layer 5. The first-pole conductive path 61 and the second-pole conductive path 62 are used to connect the upper and lower layers. The material is conductive metal, and conventionally, it can be a copper column. The first layer of light-emitting chips 2 is located at the bottom layer, and the distance to the substrate 1 is relatively close, so it does not need to be electrically connected to the pads on the substrate 1 through the conductive path. The second and third layers of light-emitting chips 2 are far away from the substrate 1, and need to be electrically connected to the corresponding pads on the substrate 1 through the conductive path.
[0051] In one example, see Figure 1 As shown, two first-pole conductive paths 61 are arranged directly above the corresponding common first-pole pad 11, wherein one of the first-pole conductive paths 61 is located between the first conductive layer 5 and the second conductive layer 5, and the other first-pole conductive path 61 is located between the second conductive layer 5 and the third conductive layer 5, and the two first-pole conductive paths 61 are directly opposite to each other up and down, and both are just directly opposite to the common first-pole pad 11 below; the first-pole conductive path 61 located below electrically connects the first and second conductive layers 5, thereby electrically connecting the first poles of the first and second light-emitting chips 2 together, and the first-pole conductive path 61 located above electrically connects the second and third conductive layers 5, thereby electrically connecting the first poles of the second and third light-emitting chips 2 together, and the first pole of the first-layer light-emitting chip 2 is also electrically connected to the common first-pole pad 11 below through the conductive layer 5 of this layer, thereby realizing that the first poles of the three layers of light-emitting chips 2 are all electrically connected to the same common first-pole pad 11.
[0052] See also Figure 2As shown, two second-pole conductive paths 62 are arranged between the first conductive layer 5 and the second conductive layer 5, and one second-pole conductive path 62 is arranged between the second conductive layer 5 and the third conductive layer 5. The second pole of the second-layer light-emitting chip 2 is electrically connected to one of the second-pole pads 12 through a second-pole conductive path 62 therebelow, and the second pole of the third-layer light-emitting chip 2 is electrically connected to another second-pole pad 12 through two second-pole conductive paths 62 located therebelow, and the two second-pole conductive paths 62 here are directly opposite each other up and down.
[0053] See also Figure 2 As shown, preferably, the second pole conductive paths 62 electrically connected to the light emitting chips 2 of different layers are staggered. In this embodiment, the second pole conductive path 62 electrically connected to the light emitting chips 2 of the second layer is arranged vertically opposite to one of the second pole pads 12, and the second pole conductive path 62 electrically connected to the light emitting chips 2 of the third layer is arranged vertically opposite to another second pole pad 12. Different second pole pads 12 are distributed at different positions on the substrate 1, and the second pole conductive paths 62 electrically connected to different layers are also staggered, so that the second poles of the light emitting chips 2 of different layers can be led out to different pads on the substrate 1 through the conductive layer 5 and the vertical second pole conductive paths 62, so as to realize the pin layout of the LED display device.
[0054] Furthermore, in one embodiment, a transparent medium layer 7 is provided under each conductive layer 5, and each transparent medium layer 7 is provided with a conductive hole 71, wherein the conductive hole 71 electrically connects the corresponding conductive layer 5 with the corresponding first-pole conductive path 61, and the conductive hole 71 electrically connects the corresponding conductive layer 5 with the corresponding second-pole conductive path 62.
[0055] See also Figure 1As shown, a first transparent medium layer 7 is arranged above the substrate 1, and the transparent medium layer 7 is provided with four conductive holes 71 for circuit conduction, and the four conductive holes 71 are located directly above the four pads (i.e., three second pole pads 12 and one first pole pad) of the substrate 1, and correspond one to one; the first conductive hole 71 electrically connects the first conductive layer 5 with the common first pole pad 11, so that the first pole of the first light-emitting chip 2 is electrically connected to the common first pole pad 11; the second conductive hole 71 electrically connects the first conductive layer 5 with one of the second pole pads 12, so that the second pole of the first light-emitting chip 2 is electrically connected to one of the second pole pads 12; a second transparent medium layer 7 is arranged below the second conductive layer 5, and the second transparent medium layer 7 is provided with three conductive holes 71; a third transparent medium layer 7 is arranged below the third conductive layer 5, and the third transparent medium layer 7 is provided with two conductive holes 71; each conductive layer 5 is electrically connected to the corresponding first pole conductive path 61 and second pole conductive path 62 through the conductive holes 71 below it. In this embodiment, by providing a transparent medium layer 7 on each layer, the conductive layer 5 and the light-emitting chip 2 can be supported, and at the same time, vertical electrical conduction can be achieved by drilling holes in the transparent medium layer 7. In this embodiment, the transparent medium layer 7 can transmit light, and the material can be transparent resin, etc.; the conductive layer 5 can be made of conductive material.
[0056] exist Figure 3 In the top view shown, the three pads at the upper left, lower left and upper right are all second pole pads 12, and the pad at the lower right position is a common first pole pad 11. Figure 2 The pad on the left side of the left view is Figure 3 A second pole pad 12 at the upper left corner, the second pole pad 12 is electrically connected to the second pole of the second layer of light emitting chips 2; Figure 2 The pad on the right side is Figure 3 The second electrode pad 12 at the lower left corner, the second electrode pad 12 is electrically connected to the second electrode of the third layer light emitting chip 2; Figure 4 The pad on the left side of the right view is Figure 3 The common first electrode pad 11 at the lower right corner is electrically connected to the first electrode of the three-layer light-emitting chip 2; Figure 4 The pad on the right side is Figure 3 The second pole pad 12 is located at the upper right corner, and the second pole pad 12 is electrically connected to the second pole of the first layer of light emitting chips 2 .
[0057] Further, in some optional embodiments, a light screening layer 8 is provided between the transparent medium layer 7 and the conductive layer 5, and the light screening layer 8 is configured to block the light of the light emitting chip 2 located in the upper layer from passing through, and allow the light of the light emitting chip 2 located in the lower layer to pass through. Figure 1As shown, a light screening layer 8 is arranged between the second transparent medium layer 7 and the conductive layer 5, and a light screening layer 8 is arranged between the third transparent medium layer 7 and the conductive layer 5. The two light screening layers 8 are made of different materials. The light screening layer 8 located in the second layer has the characteristics of being able to transmit red light upward with a transmittance of 90%-100%, and blocking green light downward with a blocking rate of 90%-100%; the light screening layer 8 located in the third layer has the characteristics of being able to transmit green light upward with a transmittance of 90%-100%, and blocking blue light downward with a blocking rate of 90%-100%. In this embodiment, by arranging the light screening layer 8 between the conductive layer 5 and the transparent medium layer 7, the light screening layer 8 can allow light of a specific color to pass through and block light of a certain color, thereby solving the light interference problem between each layer of light-emitting chips 2.
[0058] See also Figure 1 As shown, in one embodiment, a reinforcement structure 9 is supported between two adjacent transparent medium layers 7, and the reinforcement structure 9 is located outside the first lens 3, and a filling material 10 is also arranged between the two adjacent transparent medium layers 7. In this embodiment, it is preferred to arrange the reinforcement structure 9 at the four corners of the transparent medium layer 7 (see Figure 3 As shown in FIG. 1 , the reinforcement structure 9 is located at the outermost side of the transparent medium layer 7, and the first lens 3 is relatively located at the inner side of the reinforcement structure 9. The reinforcement structure 9 does not block the light emitted by the light emitting chip 2. The material of the reinforcement structure 9 is preferably an insulating material, which can be a resin or the like. The empty space between the two transparent medium layers 7 can be filled with a filling material 10, which can be a transparent material, and can be any kind of glue. The filling material 10 is not necessarily completely transparent, but can also have a certain color (see FIG. 1 ). Fig.11 As shown), the contrast can be improved without losing brightness.
[0059] Further, in some embodiments, see Figure 1 As shown, the substrate 1 is provided with three layers of the light emitting chips 2, and the substrate 1 is provided with three second electrode pads 12 ( Figure 3As shown), the three second-pole pads 12 and the common first-pole pad 11 are arranged at intervals. In this embodiment, the three second-pole pads 12 and the one common first-pole pad 11 are symmetrically and evenly distributed on the surface of the substrate 1, and the four pads are distributed in a rectangular shape. The first poles of the three-layer light-emitting chips 2 are electrically connected to the common first-pole pad 11, the second poles of the first-layer light-emitting chips 2 are electrically connected to one of the second-pole pads 12, the second pole of the second-layer light-emitting chips 2 is electrically connected to another second-pole pad 12, and the second pole of the third-layer light-emitting chips 2 is electrically connected to the third second-pole pad 12. In this embodiment, the pins of the three-layer light-emitting chips 2 are led out to the four pads of the substrate 1, so that the three-layer light-emitting chips 2 can be individually controlled. At the same time, by setting four pads on the substrate 1, a pad with a larger area can be obtained, and the manufacturing plan of the light-emitting chips 2 with smaller sizes can be met.
[0060] The present application also provides a method for manufacturing an LED display device, which comprises the following steps:
[0061] S1: A plurality of light-emitting chips 2 are vertically stacked layer by layer on a substrate 1 along the thickness direction of the substrate 1, and a first lens 3 is arranged on the peripheral side of each layer of the light-emitting chip 2; wherein the substrate 1 is provided with a common first pole pad 11 and a plurality of second pole pads 12, the polarities of the first pole and the second pole are opposite, and the plurality of light-emitting chips 2 are electrically connected to the common first pole pad 11 and the second pole pad 12.
[0062] S2: a second lens 4 is arranged above the topmost light emitting chip 2 .
[0063] Wherein, step S1 may include the following steps:
[0064] S11: Select a substrate 1 on which a bottom circuit has been fabricated, wherein the substrate 1 has a common first electrode pad 11 and a plurality of second electrode pads 12 ( Figure 5 In this embodiment, three second electrode pads 12 and one common first electrode pad 11 are arranged on the substrate 1, and the substrate 1 is used to drive the light emitting chip 2.
[0065] S12: Covering the substrate 1 with a transparent dielectric layer 7, and simultaneously opening a plurality of conductive holes 71 in the transparent dielectric layer 7 ( Figure 6 In this embodiment, preferably 4 holes are drilled, and the drilling method is arbitrary; the transparent medium layer 7 is used for the propagation of light.
[0066] S13: Covering a conductive layer 5 on the transparent medium layer 7, and at the same time placing the first layer of light emitting chips 2 by mass transfer ( Figure 7 In this embodiment, the first layer of light emitting chips 2 are red light chips, and the conductive layer 5 is used to lead out the first electrode pin and the second electrode pin of the light emitting chip 2.
[0067] S14: two first lenses 3 are placed on both sides of the first light emitting chip 2, and then two reinforcing structures 9 are fixed on both ends of the transparent medium layer 7. At the same time, a first conductive path 61 and a second conductive path 62 are arranged on the conductive layer 5, and finally a filling material 10 is filled in the empty space above the transparent medium layer 7 ( Figure 8 In this step, in order to further improve the light extraction efficiency and the brightness of the chip, the surface of the first lens 3 is roughened. The reinforcing structure 9 in this step is used to support the upper and lower transparent medium layers 7, and the first conductive path 61 and the second conductive path 62 are used to electrically connect the upper and lower layers.
[0068] S15: The second layer of light emitting chips 2 is transferred in the same manner as steps S12 to S14. The difference from the operation of the first layer of light emitting chips 2 is that a light screening layer 8 is first placed on the second layer of transparent medium layer 7, and then a conductive layer 5, a first lens 3 and a reinforcing structure 9 are arranged ( Fig. 9 As shown). In this embodiment, the second light emitting chip 2 is preferably a green light chip, and the light filter layer 8 can transmit red light upwards but cannot transmit green light downwards.
[0069] S16: Transfer the third layer of light emitting chips 2 in the same manner as the second layer of light emitting chips 2. The third layer of light emitting chips 2 in this embodiment are preferably blue light chips, which are different from the operation in S15 in that the light screening layer 8 below the third layer of light emitting chips 2 can transmit green light upwards but cannot transmit blue light downwards ( Fig.10 shown).
[0070] In step S2, the second lens 4 can be obtained by dispensing, and the specific form of the second lens 4 is not limited to a circle, and can be other shapes. The second lens 4 can further improve the light extraction efficiency.
[0071] The LED display device and the manufacturing method thereof provided in the embodiments of the present application can improve the light extraction efficiency of each light-emitting chip 2 and solve the problem of color noise by adding a unique light screening layer 8.
[0072] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0073] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
[0074] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.
Claims
1. An LED display device, characterized in that: It includes: A substrate (1), wherein the substrate (1) is provided with a common first pole pad (11) and a plurality of second pole pads (12), wherein the polarities of the first pole and the second pole are opposite; A multilayer light-emitting chip (2), wherein the multilayer light-emitting chips (2) are vertically stacked on the substrate (1) along the thickness direction of the substrate (1), and the multilayer light-emitting chips (2) are electrically connected to the common first electrode pad (11) and the second electrode pad (12), and a first lens (3) is uniformly arranged on the circumference of each layer of the light-emitting chips (2); A second lens (4), wherein the second lens (4) is fixedly arranged above the light-emitting chip (2) at the top layer.
2. The LED display device according to claim 1, characterized in that: The first lens (3) has an inclined reflective surface (31) facing the light-emitting chip (2).
3. The LED display device according to claim 1, characterized in that: The multiple layers of light-emitting chips (2) are all flip-chips, and the first electrodes of all the light-emitting chips (2) are electrically connected to the common first electrode pad (11), and the second electrodes of the light-emitting chips (2) in different layers are respectively electrically connected to different second electrode pads (12).
4. The LED display device according to claim 3, characterized in that: A conductive layer (5) is provided below each layer of the light-emitting chip (2), and a first-pole conductive path (61) and a second-pole conductive path (62) perpendicular to the substrate (1) are provided between two adjacent layers of the conductive layers (5); The light-emitting chip (2) of the lowest layer is electrically connected to the common first electrode pad (11) and the second electrode pad (12) through the conductive layer (5) where the light-emitting chip (2) of this layer is located; Each of the remaining layers of the light-emitting chips (2) is connected to the common first-pole pad (11) via the conductive layer (5) where the light-emitting chips (2) of the layer are located and the first-pole conductive path (61) below the light-emitting chips (2) of the layer, and is electrically connected to the second-pole pad (12) via the second-pole conductive path (62) below it.
5. The LED display device according to claim 4, characterized in that: The second-electrode conductive paths (62) electrically connected to the light-emitting chips (2) at different layers are staggered.
6. The LED display device according to claim 4, characterized in that: A transparent medium layer (7) is provided below each conductive layer (5), and each transparent medium layer (7) is provided with a conductive hole (71), wherein the conductive hole (71) electrically connects the corresponding conductive layer (5) with the corresponding first-pole conductive path (61), and the conductive hole (71) electrically connects the corresponding conductive layer (5) with the corresponding second-pole conductive path (62).
7. The LED display device according to claim 6, characterized in that: A light screening layer (8) is provided between the transparent medium layer (7) and the conductive layer (5), and the light screening layer (8) is configured to block the light from the light-emitting chip (2) located in the upper layer from passing through, and to allow the light from the light-emitting chip (2) located in the lower layer to pass through.
8. The LED display device according to claim 6, characterized in that: A reinforcing structure (9) is supported between two adjacent transparent medium layers (7), and the reinforcing structure (9) is located outside the first lens (3). A filling material (10) is also provided between two adjacent transparent medium layers (7).
9. The LED display device according to claim 1, characterized in that: The substrate (1) is provided with three layers of the light-emitting chips (2), and the substrate (1) is provided with three second-pole pads (12), and the three second-pole pads (12) and the common first-pole pad (11) are arranged at intervals.
10. A method for manufacturing an LED display device, characterized in that: It includes the following steps: A plurality of light-emitting chips (2) are stacked vertically layer by layer on a substrate (1) along the thickness direction of the substrate (1), and a first lens (3) is arranged on the peripheral side of each layer of the light-emitting chips (2); wherein the substrate (1) is provided with a common first pole pad (11) and a plurality of second pole pads (12), the first pole and the second pole have opposite polarities, and the plurality of light-emitting chips (2) are electrically connected to the common first pole pad (11) and the second pole pad (12); A second lens (4) is arranged above the topmost light-emitting chip (2).