Electronic component cycle test device and method

Abstract

The invention provides an electronic component testing device, which is adaptively designed for an electronic component with a two-way transmission characteristic, and is characterized in that at least two power supply interfaces are arranged and are connected with at least two power supply ports on a to-be-tested component in sequence; and the power input and output modes of the at least two power supply interfaces are switched according to the test requirement of the to-be-tested element, and the output voltage of the at least one power supply port is detected, so that the test of the electronic element with the bidirectional transmission characteristic is realized.

Description

Technical Field

[0001] The present application relates to the technical field, and in particular to an electronic component cycle testing device and method. Background Art

[0002] With the rapid development of the automotive semiconductor industry, more and more automotive-grade components are entering the market. Compared with traditional industrial-grade components, automotive-grade components have higher reliability requirements, especially for plastic-encapsulated power devices, which require cycle testing. On the basis of conventional cycles, the devices are periodically powered and repeatedly verified by periodic power on and off. This test is designed to examine the reliability of the device when it encounters the worst situation during typical applications, and is one of the key tests in automotive-grade certification.

[0003] At present, the domestic automotive-grade component certification standards and specifications have not yet formed a complete system. Many manufacturers claim that their automotive-grade products mean that their production lines meet automotive-grade requirements, rather than passing automotive-grade certification tests. In this industry context, there is little research on power cycle testing of domestic components, so in-depth research on power cycle testing systems and methods is needed. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide an electronic component cycle testing device and method.

[0005] Based on the above purpose, the present application provides an electronic component cycle test device, including: a test board and a component to be tested. The test board includes at least 2 power supply interfaces, the component to be tested includes at least 2 power ports, and the at least 2 power supply interfaces are connected to the at least 2 power ports in sequence. At least 2 power ports are configured to switch between power input and power output in response to the working mode of the component to be tested. The test board is configured to switch the power input and output modes of at least 2 power supply interfaces according to a preset test mode in response to the test requirements of the component to be tested, and detect the output voltage of at least 1 power port.

[0006] In some embodiments, the test board further comprises a power supply switching module, which is connected to at least two power supply interfaces. The power supply switching module is configured to supply power to at least one power supply interface in response to the test mode.

[0007] In some embodiments, the test board also includes a motherboard and a daughterboard. The daughterboard includes a component interface, and the component interface is adapted to the component to be tested. The power supply interface is arranged on the motherboard, and the power supply interface is detachably connected to the daughterboard.

[0008] In some embodiments, the motherboard further includes a main control chip, which is connected to the power supply switching module. The main control chip is configured to: in response to the working mode and the test mode, control at least one power supply interface, supply power to at least one power port according to the first voltage, and control at least one different power supply interface to receive the voltage output by at least one different power port.

[0009] In some embodiments, the main control chip includes a voltage recording module, which is configured to record the output voltage of at least one power port and draw a voltage curve.

[0010] In some embodiments, the motherboard further comprises a clock module, which is electrically connected to the main control chip. The clock module is configured to: in response to the test mode, switch the power input and output modes of at least two power supply interfaces according to a preset switching cycle.

[0011] In some embodiments, the test device further comprises a host computer connected to the test board and configured to: in response to a test requirement, convert the test requirement into a control signal, and adjust the power supply mode of at least two power supply interfaces according to the control signal.

[0012] In some embodiments, the test device further comprises a power supply module, which is connected to the test board and is configured to supply power to at least two power supply interfaces in response to a test requirement.

[0013] In some embodiments, the test device further comprises a temperature box, wherein the test board and the device under test are arranged inside the temperature box, and the temperature box is configured to adjust the temperature inside the temperature box according to a preset temperature curve in response to the test requirements of the device under test.

[0014] The present application also provides a method for cyclic testing of electronic components, including: the method uses any of the above-mentioned cyclic testing devices for electronic components to perform testing. The method includes: according to the test requirements of the component to be tested, switching the power input and output modes of at least two power supply interfaces according to a preset test mode, and detecting the output voltage of at least one power port.

[0015] From the above, it can be seen that the electronic component cycle test device provided in the present application is adaptively designed for electronic components with bidirectional transmission characteristics. By setting at least two power supply interfaces, they are connected in sequence to at least two power ports on the component to be tested, and are configured to switch the power input and output modes of at least two power supply interfaces according to the test requirements of the component to be tested, and simultaneously detect the output voltage of at least one power port, thereby realizing the test of electronic components with bidirectional transmission characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A schematic diagram of the structure of an electronic component cycle test device provided in an embodiment of the present application;

[0018] Figure 2 A schematic structural diagram of an electronic component cycle testing device provided for an optional embodiment of the present application;

[0019] Figure 3 A schematic flow chart of a method for cyclic testing of electronic components provided as an optional embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0021] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] like Figure 1 As shown, the present application provides an electronic component cycle test device, including: a test board 100 and a component to be tested 200.

[0023] The test board 100 includes at least two power supply interfaces 101 , the DUT 200 includes at least two power supply ports 201 , and the at least two power supply interfaces 101 are connected to the at least two power supply ports 201 in sequence.

[0024] At least two power ports 201 are configured to switch between power input and power output in response to the working mode of the DUT 200 .

[0025] The test board 100 is configured to: in response to the test requirements of the DUT 200 , switch the power input and output modes of at least two power supply interfaces 101 according to a preset test mode, and detect the output voltage of at least one power port 201 .

[0026] In this embodiment, to achieve compatibility with different types of DUTs, the number of power supply interfaces on the test board can be set to be greater than the number of power ports, so that each power port can be connected to at least one power supply interface.

[0027] Since some electronic components have bidirectional input and output and different input and output voltages, in order to avoid repeated disassembly and assembly, the cycle test equipment for such electronic components needs to be designed to be able to freely switch input and output according to test requirements during the test process.

[0028] The test board can switch the input and output modes of at least two power supply interfaces set on the test board according to a preset test mode. When at least one of the power supply interfaces is in output mode, the other power supply interfaces connected to the power port are set to input mode. The test board supplies power to the power port connected to the power supply interface through the power supply interface set to output mode, and detects the output voltage of the component to be tested through the power supply interface set to input mode.

[0029] In some embodiments, the test board also includes a power supply switching module, and the power supply switching module is connected to at least two power supply interfaces.

[0030] The power supply switching module is configured to supply power to at least one power supply interface in response to a test mode.

[0031] In this embodiment, by setting up a power supply switching module, different power supply interfaces can be powered according to the test mode settings. At the same time, the power supply interface without output power is adjusted to the input mode, and the power supply interface is switched using the power supply switching module, thereby realizing cyclic testing of the components under test.

[0032] Preferably, the power supply switching module may be a relay, the number of the relays being the same as the number of the power supply interfaces, and a single power supply interface is switched between the input mode and the output mode by controlling the switching of the relays.

[0033] In some embodiments, the test board also includes a motherboard and a daughterboard.

[0034] The daughter board includes a component interface, and the component interface is adapted to the component to be tested.

[0035] The power supply interface is arranged on the motherboard, and the power supply interface is detachably connected to the daughterboard.

[0036] In this embodiment, a component interface that is compatible with the interface of the component to be tested is provided on the daughter board, a power supply interface is provided on the mother board, and the power supply interface and the daughter board are detachably connected. Thus, when testing different types of components to be tested, the same mother board can be used. Only the corresponding daughter board needs to be replaced to achieve compatibility with different types of components to be tested, thereby saving development costs.

[0037] In some embodiments, the motherboard further includes a main control chip, and the main control chip is connected to the power supply switching module.

[0038] The main control chip is configured to: in response to the working mode and the test mode, control at least one power supply interface, supply power to at least one power port according to a first voltage, and control at least one different power supply interface to receive the voltage output by at least one different power port.

[0039] In this embodiment, the power supply interface is controlled by the main control chip to adjust the input and output modes of the power supply interface, thereby preventing multiple power supply interfaces from outputting voltage at the same time, thereby preventing the component under test from being damaged.

[0040] In some embodiments, the main control chip includes a voltage recording module.

[0041] The voltage recording module is configured to record the output voltage of at least one power port and draw a voltage curve.

[0042] In this embodiment, a voltage recording module is set to record the output voltage of the power port and draw a voltage curve, so that the quality of the component to be tested can be judged based on the voltage curve. The degree to which the voltage curve deviates from the standard voltage can be screened by setting a deviation threshold, so as to select the component to be tested that meets the design requirements.

[0043] In some embodiments, the motherboard further includes a clock module, and the clock module is electrically connected to the main control chip.

[0044] The clock module is configured to: in response to the test mode, switch the power input and output modes of at least two power supply interfaces according to a preset switching cycle.

[0045] In this embodiment, the clock module is used to provide a clock cycle for the main control chip, so that the main control chip can switch the input and output modes of the power supply interface according to the accurate switching cycle. Among them, the type of clock module is not limited, and can be reasonably selected according to actual application needs. For example, it can be one of a crystal oscillator, a network clock, and a gated clock.

[0046] In some embodiments, the testing device further includes a host computer, and the host computer is connected to the testing board.

[0047] The host computer is configured to: respond to the test requirements, convert the test requirements into control signals, and adjust the power supply modes of at least two power supply interfaces according to the control signals.

[0048] In this embodiment, the test requirements are converted into control signals by the host computer, and the control of the input and output mode switching of the power supply interface is realized. Preferably, the host computer may include a graphical interface for human-computer interaction, so as to facilitate the staff to formulate the test process. Further preferably, the test programs for different types and / or specifications of components to be tested can be stored in the host computer, which is convenient for calling the test programs.

[0049] In some embodiments, the testing device further includes a power module, and the power module is connected to the testing board.

[0050] The power supply module is configured to supply power to at least two power supply interfaces in response to a test requirement.

[0051] In this embodiment, an independent power supply module is provided to supply power to the power port, thereby reducing the power supply pressure of the test board and making the test process more stable.

[0052] In some embodiments, the testing device further includes an incubator, and the testing board and the device to be tested are arranged inside the incubator.

[0053] The temperature chamber is configured to adjust the temperature inside the temperature chamber according to a preset temperature curve in response to the test requirements of the component under test.

[0054] In this embodiment, a temperature box is provided to control the temperature inside the temperature box, so that power cycle tests can be performed on the component to be tested at different temperatures.

[0055] The present application is adaptively designed for electronic components with bidirectional transmission characteristics. At least two power supply interfaces are set up, which are connected to at least two power ports on the component to be tested in sequence, and are configured to switch the power input and output modes of at least two power supply interfaces according to the test requirements of the component to be tested, and simultaneously detect the output voltage of at least one power port, thereby realizing the test of electronic components with bidirectional transmission characteristics.

[0056] As an optional implementation, Figure 2As shown in the figure, taking the bidirectional bus driver as the component to be tested as an example, the test device consists of a test board, a programmable power supply, a temperature chamber and a host computer. Among them, the test board includes a control motherboard and a test daughter board. The control motherboard uses the MCU as the core device, is equipped with a power interface to power the board, and a clock module to provide timing for data transmission. The power supply interface of the test daughter board is switched by a relay to realize the control of the device power supply voltage and signal direction. RS232 and RJ-45 buses are used to realize the communication between the host computer and the motherboard and the programmable power supply, respectively, to realize power control and signal monitoring.

[0057] The software design consists of an interface layer, a module layer, and a control layer. The interface layer completes RS232 and RJ-45 bus data reading and writing, the module layer implements serial communication data processing, and the control layer implements the MCU chip's control of the device under test function. The host computer develops user test software, including three parts of the program: power control, serial communication control, and signal flow switching control. In the test software interface, the bidirectional voltage conversion of the device can be controlled in real time, and the device output port signal can be monitored.

[0058] like Figure 3 As shown, the test method is as follows:

[0059] Step S100, setting temperature cycle conditions according to the operating temperature of the bidirectional bus driver;

[0060] Step S200, setting power supply conditions according to the recommended operating voltage of the bidirectional bus driver;

[0061] Step S300, setting a temperature cycle scheme and an alternating power supply scheme according to test requirements;

[0062] Step S400, inputting temperature cycle conditions, power supply conditions, temperature cycle scheme and alternating power supply scheme into a host computer to test the bidirectional bus driver;

[0063] Step S500, reading the test results, and marking the bidirectional bus drivers that do not meet the parameter requirements as defective products.

[0064] Among them, as a preferred implementation, the test parameters for the bidirectional bus driver model SN74ALVC164245DL are specifically:

[0065] The temperature cycle program is set as follows: the temperature box is set at -40℃~85℃ for high and low temperature cycling, the switching time does not exceed 20 minutes, and the holding time is at least 10 minutes.

[0066] The alternating power supply scheme is set to: cycle for 5 minutes on and 5 minutes off according to the four power supply conditions of "B terminal (5V) → A terminal (3.3V)", "A terminal (3.3V) → B terminal (5V)", "B terminal (3.3V) → A terminal (2.5V)", and "A terminal (2.5V) → B terminal (3.3V)", with one cycle of 40 minutes.

[0067] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments, the present application also provides an electronic component cycle testing method, including:

[0068] The method is tested by using the electronic component cycle testing device according to any one of claims 1 to 9.

[0069] Methods include:

[0070] According to the test requirements of the component to be tested, the power input and output modes of at least two power supply interfaces are switched according to a preset test mode, and the output voltage of at least one power port is detected.

[0071] The electronic component cycle testing method of the above embodiment is applied to the corresponding electronic component cycle testing device in any of the above embodiments, and has the beneficial effects of the corresponding device embodiment, which will not be described in detail here.

[0072] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0073] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0074] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0075] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic component cycle test device, comprising: Test boards and components under test; The test board includes at least two power supply interfaces, the DUT includes at least two power supply ports, and the at least two power supply interfaces are connected to the at least two power supply ports in sequence; The at least two power ports are configured to: switch between power input and power output in response to the working mode of the DUT; The test board is configured to: in response to the test requirements of the component under test, switch the power input and output modes of the at least two power supply interfaces according to a preset test mode, and detect the output voltage of at least one of the power ports.

2. The electronic component cycle testing device according to claim 1, wherein: The test board also includes a power supply switching module, and the power supply switching module is connected to the at least two power supply interfaces; The power supply switching module is configured to supply power to at least one of the power supply interfaces in response to the test mode.

3. The electronic component cycle testing device according to claim 2, wherein: The test board also includes a motherboard and a daughterboard; The daughter board comprises a component interface, and the component interface is adapted to the component to be tested; The power supply interface is arranged on the motherboard, and the power supply interface is detachably connected to the daughterboard.

4. The electronic component cycle testing device according to claim 3, wherein: The motherboard further includes a main control chip, and the main control chip is connected to the power supply switching module; The main control chip is configured to: in response to the working mode and the test mode, control at least one of the power supply interfaces to supply power to at least one of the power ports according to a first voltage, and control at least one different power supply interface to receive the voltage output by at least one different power port.

5. The electronic component cycle testing device according to claim 4, wherein: The main control chip includes a voltage recording module; The voltage recording module is configured to record the output voltage of at least one of the power ports and draw a voltage curve.

6. The electronic component cycle testing device according to claim 4, wherein: The motherboard further comprises a clock module, and the clock module is electrically connected to the main control chip; The clock module is configured to: in response to the test mode, switch the power input and output modes of the at least two power supply interfaces according to a preset switching cycle.

7. The electronic component cycle testing device according to claim 1, wherein: The testing device also includes a host computer, which is connected to the testing board; The host computer is configured to: in response to the test requirement, convert the test requirement into a control signal, and adjust the power supply mode of the at least two power supply interfaces according to the control signal.

8. The electronic component cycle testing device according to claim 1, wherein: The testing device also includes a power supply module, and the power supply module is connected to the testing board; The power supply module is configured to supply power to the at least two power supply interfaces in response to the test requirement.

9. The electronic component cycle testing device according to claim 1, wherein: The testing device further comprises a temperature box, wherein the testing board and the component to be tested are arranged inside the temperature box; The temperature box is configured to adjust the temperature inside the temperature box according to a preset temperature curve in response to a test requirement of the device under test.

10. A method for cyclic testing of electronic components, comprising: The method uses the electronic component cycle testing device as described in any one of claims 1 to 9 to perform testing; The method comprises: According to the test requirements of the component under test, the power input and output modes of the at least two power supply interfaces are switched according to a preset test mode, and the output voltage of at least one of the power ports is detected.

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