High-overload high-rotation high-precision attitude measurement system

Abstract

The invention discloses a high-overload high-rotation high-precision attitude measurement system which comprises a base, a top cover, an inertial measurement unit, a micro-hemisphere gyroscope, a support circuit, an inner base and a frame, and the inner base is mounted at the bottom of the base through a rubber damping pad; the bottom of the frame penetrates through a channel in the inner base to be fixedly bonded with a rubber anti-vibration pad. The disc edge of the upper end face of the frame is in lap joint with the upper end face of the inner base and connected with the inner base through a metal rubber shock absorber. A stepped hole is formed in the frame, the inertial measurement unit is installed below the stepped hole and fixed in a filling and sealing mode, and the micro-hemisphere gyroscope is installed above the stepped hole and is lower than the upper surface of the stepped hole. The support circuit is positioned above the micro hemispherical gyroscope and is fixedly mounted on the frame; the top cover is buckled on the base, and the supporting circuit, the frame and the inner base are pressed between the top cover and the base. The device can stably work under the high-overload and high-rotation conditions, and continuous and accurate attitude data are provided.

Description

Technical Field

[0001] The invention relates to attitude measurement, and in particular to a high-precision attitude measurement system used in a high-overload and high-rotation environment, belonging to the technical field of inertial navigation. Background Art

[0002] The performance of traditional inertial navigation systems is often affected when facing extreme acceleration and vibration environments, resulting in a decrease in the accuracy and precision of attitude information. This is particularly prominent in high-dynamic applications such as aerospace, deep-sea exploration, and military equipment. The acceleration in these application scenarios is often as high as 20,000g, and the rotation speed is as high as 30r / s. Traditional inertial navigation systems have been difficult to adapt. Therefore, it is of great practical significance to develop an attitude measurement system that can withstand high overload and high rotation while maintaining high precision. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a high-overload, high-rotation, and high-precision attitude measurement system, which can work stably under high-overload and high-rotation conditions and provide continuous and accurate attitude data.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is as follows: A high overload, high rotation, high precision attitude measurement system includes a base, a top cover, an inertial measurement unit, a micro-hemispherical gyroscope and a supporting circuit. The top cover is buckled on the base and forms a mounting cavity between the two. The inertial measurement unit, the micro-hemispherical gyroscope and the supporting circuit are mounted in the mounting cavity. It is characterized in that it also includes an inner base and a frame. The base is a box structure with an upper opening. The inner base is mounted on the bottom of the box structure through a rubber vibration-damping pad. A frame channel is provided in the middle of the inner base, which passes through the frame channel and is bonded and fixed to the rubber vibration-damping pad. The upper end surface of the frame has a disk edge extending to all sides. The disk edge overlaps the upper end surface of the inner base and is elastically connected to the inner base through a metal rubber vibration damper.

[0005] A step hole with an open upper end and a closed lower end is provided on the frame; the inertial measurement unit is installed under the step of the step hole and is fixed by potting with potting glue; the micro-hemispherical gyroscope is installed above the step hole through the step of the step hole and is lower than the upper surface of the step hole; the supporting circuit is located above the micro-hemispherical gyroscope and is fixedly installed on the frame; the top cover is buckled on the base from top to bottom and the supporting circuit, the frame and the inner base are pressed between the top cover and the base.

[0006] Furthermore, the inner base has a rectangular cross section and has an array of honeycomb structures around it, and the honeycomb structure is filled with highly elastic organic silicon gel material.

[0007] Similarly, the cross section of the frame is also rectangular, and has an array of honeycomb structures around it, and the honeycomb structure is filled with highly elastic organic silicon gel material.

[0008] Furthermore, a positioning pin is provided at the bottom of the frame step hole, and the bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by the cooperation between the positioning hole and the positioning pin.

[0009] Furthermore, the supporting circuit includes a control circuit, a signal circuit and a power supply; a power supply bracket is installed at the upper end of the frame, and the power supply is installed on the power supply bracket; a signal circuit bracket is installed on the power supply bracket, and the signal circuit is installed on the signal circuit bracket; the control circuit is installed on the power supply bracket through the control circuit bracket.

[0010] Furthermore, the power supply bracket has a flat bottom surface, and the bottom surface of the power supply bracket is fitted on the upper end surface of the frame and covers the micro-hemispherical gyroscope.

[0011] Furthermore, the surface of the power supply bracket has an accommodating cavity A, and the power supply is fixedly installed in the accommodating cavity A through a connecting piece; the power supply bracket has four signal circuit bracket connecting columns and four control circuit bracket connecting columns, the four signal circuit bracket connecting columns are located at the four corners of rectangle A, the four control circuit bracket connecting columns are located at the four corners of rectangle B, and rectangle A is centered in rectangle B; the signal circuit bracket is fixedly installed on the power supply bracket through four signal circuit bracket connecting columns; the control circuit bracket is located above the signal circuit bracket and is fixedly installed on the power supply bracket through four control circuit bracket connecting columns.

[0012] Furthermore, the signal circuit bracket has a containing cavity B, and the signal circuit is potted in the containing cavity B by potting glue.

[0013] Furthermore, the control circuit bracket is hollowed out in the middle; the control circuit is installed on the lower surface of the control circuit bracket.

[0014] Furthermore, a rubber vibration-damping pad is provided on the upper surface of the control circuit bracket, and the rubber vibration-damping pad is pressed tightly between the control circuit bracket and the inner top surface of the top cover.

[0015] Furthermore, the potting glue is silicone gel.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The rubber vibration damping pad of the present invention is made of highly elastic material and can effectively absorb external impact energy. The metal rubber vibration damper is installed on the inner base to reduce vibration of the frame. When the system is subjected to external impact, the rubber vibration damping pad first absorbs part of the energy, and part of it is dissipated through the honeycomb structure on the frame and the inner base, and the remaining energy is further attenuated by the metal rubber vibration damper. In addition, the present application also reduces vibration by encapsulation, that is, the inertial measurement unit is placed in the step hole of the frame and encapsulated with silicone gel, and the silicone gel is used to further reduce the impact of vibration shock on electronic components. Reliable vibration reduction is achieved by rubber vibration damping pads, honeycomb structures, metal rubber vibration dampers, and encapsulation vibration reduction multi-stage structures. Therefore, the present invention can work stably under high overload and high rotation conditions and provide continuous and accurate attitude data. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 -Schematic diagram of the structure of the posture measurement system of the present invention. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0019] See also Figure 1 As can be seen from the figure, the high overload, high rotation and high precision attitude measurement system of the present invention comprises a base 1, a top cover 2, an inner base 3 with a honeycomb structure, a frame 4 with a honeycomb structure, a power supply bracket 5, a signal circuit bracket 6, a control circuit bracket 7, a rubber vibration damping pad 8, an inertial measurement unit 9, a micro-hemispherical gyroscope 10, a control circuit 11, a signal circuit 12, a power supply 13, a metal rubber vibration damper 14 and a communication connector 15. Among them, the control circuit 11, the signal circuit 12 and the power supply 13 together constitute a support circuit.

[0020] In the present invention, the top cover 2 is buckled on the base 1 to form a mounting cavity between the two, and other components, such as the inertial measurement unit 9, the micro-hemispherical gyroscope 10, the inner base 3, the frame 4, the control circuit 11, the signal circuit 12 and the power supply 13 and their corresponding brackets are installed in the mounting cavity. The specific installation method is described as follows: The base 1 is a box structure with an opening at the top, and the inner base 3 is installed at the bottom of the box structure through the rubber vibration-damping pad 8; a frame channel 16 is provided in the middle of the inner base 3, which passes through the frame channel 16 and is bonded and fixed to the rubber vibration-damping pad 8. The upper end surface of the frame 4 has a plate edge 17 extending to all sides, and the plate edge 17 is overlapped on the upper end surface of the inner base 3 and elastically connected to the inner base 3 through the metal rubber vibration damper 14. There are four metal rubber vibration dampers 14, which are correspondingly installed on the four sides to elastically connect the frame 4 and the inner base 3.

[0021] The frame 4 is provided with a stepped hole 18 which is open at the upper end and closed at the lower end. The inertial measurement unit 9 is installed below the step of the stepped hole 18 and is fixed by potting with potting glue (silicone gel); the micro-hemispherical gyroscope 10 is installed above the stepped hole 18 through the step of the stepped hole and is lower than the upper surface of the stepped hole 18. The supporting circuit is located above the micro-hemispherical gyroscope 10 and is fixedly installed on the frame 4; the top cover 2 is buckled on the base 1 from top to bottom and the supporting circuit, frame 4, and inner base 3 are pressed between the top cover 2 and the base 1.

[0022] In order to achieve vibration reduction, the inner base 3 has a rectangular cross section, and has an array of honeycomb structures 19 around it, and the honeycomb structures 19 are filled with highly elastic organic silicone gel materials. Similarly, the frame 4 has a rectangular cross section, and also has an array of honeycomb structures 19 around it, and the honeycomb structures 19 are filled with highly elastic organic silicone gel materials. The honeycomb structures 19 on the two opposite surfaces of the inner base 3 and the frame 4 correspond to each other and are connected at both ends, and the honeycomb structures 19 on the two perpendicular surfaces are connected to each other. The honeycomb array of the present invention is composed of a plurality of honeycomb units arranged in sequence in the horizontal direction, and each honeycomb unit is composed of four honeycombs arranged in a cross shape, and the two honeycombs adjacent to each other in the horizontal direction of two adjacent honeycomb units are combined into one, that is, they share one honeycomb.

[0023] To facilitate the installation and positioning of the inertial measurement unit, a positioning pin is provided at the bottom of the frame step hole. The bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by cooperating with the positioning hole and the positioning pin.

[0024] The power supply bracket 5 of the present invention is installed on the upper end of the frame 4, and the power supply 13 is installed on the power supply bracket 5; a signal circuit bracket 6 is installed on the power supply bracket, and the signal circuit 12 is installed on the signal circuit bracket 6; the control circuit 11 is installed on the power supply bracket 5 through the control circuit bracket 7.

[0025] The power supply bracket 5 has a flat bottom surface, and the bottom surface of the power supply bracket 5 is fitted on the upper end surface of the frame 4 and covers the micro-hemispherical gyroscope 10 .

[0026] During specific installation, the surface of the power supply bracket 5 has a accommodating cavity A20, and the power supply 13 is fixedly installed in the accommodating cavity A20 through a connecting piece (screw); there are four signal circuit bracket connecting columns 21 and four control circuit bracket connecting columns 22 on the power supply bracket 5, the four signal circuit bracket connecting columns 21 are located at the four corners of rectangle A, the four control circuit bracket connecting columns 22 are located at the four corners of rectangle B, and rectangle A is centered in rectangle B; the signal circuit bracket 6 is fixedly installed on the power supply bracket 5 through four signal circuit bracket connecting columns 21; the control circuit bracket 7 is located above the signal circuit bracket 6 and is fixedly installed on the power supply bracket 5 through four control circuit bracket connecting columns 22.

[0027] During specific installation, the signal circuit bracket 6 has a housing cavity B23, and the signal circuit 12 is encapsulated in the housing cavity B23 by silicone gel. During actual processing, there is a through hole in the middle of the bottom of the housing cavity B23, which is convenient for the routing of the signal circuit and the placement of large components. Before encapsulating the signal circuit 12, 704 glue is used to fill and close the through hole. After encapsulation, the housing cavity B23 is not connected from top to bottom, and the signal circuit 12 is then encapsulated.

[0028] During actual installation, the control circuit 11 is installed on the lower surface of the control circuit bracket 7. Since the control circuit bracket is relatively thin, resonance may be caused in the middle, so the present invention removes the middle of the control circuit bracket 7 to form a hollow structure 24.

[0029] The above-mentioned specific installation method of the signal circuit, control circuit and power supply of the present invention is considered based on the high rotation speed application scenario of the present invention. The present invention overlaps the center of gravity of the circuit and large devices along the rotation axis, which can prevent the center of gravity shift from affecting the high rotation and high impact vibration reduction effect of the system.

[0030] Furthermore, a rubber vibration-damping pad is provided on the upper surface of the control circuit bracket 7 , and the rubber vibration-damping pad is pressed tightly between the control circuit bracket 7 and the inner top surface of the top cover 2 .

[0031] The base 1 also includes a communication connector 15 , which is mounted on the base 1 by screws. The communication connector 15 is connected to the user or the control system as a communication interface, and is connected to the signal circuit, the control circuit, and the power supply 13 .

[0032] After the system is started, the inertial measurement unit 9 and the micro-hemispherical gyroscope 10 start to collect acceleration and angular velocity data. After receiving the raw data, the data processing module calculates the current posture information through the fusion algorithm, and the posture information is transmitted to the user or the control system through the communication interface (i.e., the communication connector mentioned above). The present invention can provide more accurate and stable posture measurement results.

[0033] Since the rubber vibration damping pad 8 of the present invention is located at the bottom of the frame 4 and the inner base 3 and is made of a highly elastic material, it can effectively absorb external impact energy. The metal rubber vibration damper 14 is installed on the inner base 3 to reduce vibration of the frame 4. When the system is subjected to external impact, the rubber vibration damping pad 8 first absorbs part of the energy, and part of it is dissipated through the honeycomb structure 19 on the frame 4 and the inner base 3, and the remaining energy is further attenuated by the metal rubber vibration damper 14.

[0034] In addition to vibration reduction through vibration pads, honeycomb structures and metal rubber vibration dampers, this application also reduces vibration through potting, that is, the inertial measurement unit IMU is placed in the step hole of the frame and potted with 502 silicone gel. The cross-linking point structure of silicone gel makes it soft and elastic, which can effectively absorb and disperse impact force, effectively absorb the energy of vibration impact, and further reduce the impact of vibration impact on electronic components.

[0035] The above embodiments of the present invention are merely examples for illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes and modifications can be made based on the above description. It is impossible to list all the embodiments here. Any obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A high-overload, high-rotation, high-precision attitude measurement system, comprising a base, a top cover, an inertial measurement unit, a micro-hemispherical gyroscope and a supporting circuit, wherein the top cover is buckled on the base to form a mounting cavity between the two, and the inertial measurement unit, the micro-hemispherical gyroscope and the supporting circuit are mounted in the mounting cavity; characterized in that: It also includes an inner base and a frame, the base is a box structure with an upper opening, the inner base is installed at the bottom of the box structure through a rubber vibration-damping pad; a frame channel is provided in the middle of the inner base and passes through the frame channel and is bonded and fixed to the rubber vibration-damping pad; the upper end surface of the frame has a plate edge extending in all directions, the plate edge is overlapped on the upper end surface of the inner base and is elastically connected to the inner base through a metal rubber vibration damper; A step hole with an open upper end and a closed lower end is provided on the frame; the inertial measurement unit is installed under the step of the step hole and is fixed by potting with potting glue; the micro-hemispherical gyroscope is installed above the step hole through the step of the step hole and is lower than the upper surface of the step hole; the supporting circuit is located above the micro-hemispherical gyroscope and is fixedly installed on the frame; the top cover is buckled on the base from top to bottom and the supporting circuit, the frame and the inner base are pressed between the top cover and the base.

2. The high overload, high rotation, high precision attitude measurement system according to claim 1 is characterized in that: The inner base has a rectangular cross section and has an array of honeycomb structures around it, and the honeycomb structure is filled with highly elastic organic silicon gel material; The frame has a rectangular cross section and is surrounded by an array of honeycomb structures, which are filled with highly elastic organic silicon gel material.

3. The high overload, high rotation and high precision attitude measurement system according to claim 1 is characterized in that: A positioning pin is provided at the bottom of the frame step hole, and the bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by the cooperation between the positioning hole and the positioning pin.

4. The high overload, high rotation, high precision attitude measurement system according to claim 1, characterized in that: The supporting circuit includes a control circuit, a signal circuit and a power supply; a power supply bracket is installed at the upper end of the frame, and the power supply is installed on the power supply bracket; a signal circuit bracket is installed on the power supply bracket, and the signal circuit is installed on the signal circuit bracket; the control circuit is installed on the power supply bracket through the control circuit bracket.

5. The high overload, high rotation, high precision attitude measurement system according to claim 4, characterized in that: The power supply bracket has a flat bottom surface, and the bottom surface of the power supply bracket is fitted on the upper end surface of the frame and covers the micro-hemispherical gyroscope.

6. The high overload, high rotation, high precision attitude measurement system according to claim 4, characterized in that: The surface of the power supply bracket is provided with a accommodating cavity A, and the power supply is fixedly installed in the accommodating cavity A through a connecting piece; the power supply bracket is provided with four signal circuit bracket connecting columns and four control circuit bracket connecting columns, the four signal circuit bracket connecting columns are located at the four corners of rectangle A, the four control circuit bracket connecting columns are located at the four corners of rectangle B, and rectangle A is centered in rectangle B; the signal circuit bracket is fixedly installed on the power supply bracket through the four signal circuit bracket connecting columns; the control circuit bracket is located above the signal circuit bracket and is fixedly installed on the power supply bracket through the four control circuit bracket connecting columns.

7. The high overload, high rotation, high precision attitude measurement system according to claim 4, characterized in that: The signal circuit bracket has a containing cavity B, and the signal circuit is potted in the containing cavity B by potting glue.

8. The high-overload, high-rotation, high-precision attitude measurement system according to claim 4, characterized in that: The control circuit bracket is hollowed out in the middle; the control circuit is installed on the lower surface of the control circuit bracket.

9. The high overload, high rotation, high precision attitude measurement system according to claim 4, characterized in that: A rubber vibration-damping pad is arranged on the upper surface of the control circuit bracket, and the rubber vibration-damping pad is pressed tightly between the control circuit bracket and the inner top surface of the top cover.

10. The high overload, high rotation, high precision attitude measurement system according to claim 4, characterized in that: The potting glue is silicone gel.

Images