Method for manufacturing piezoelectric vibration device, piezoelectric vibration device, and sheet-like substrate

Abstract

The invention provides a method for manufacturing a piezoelectric vibration device using a sheet-shaped substrate, and the method can independently measure the characteristics of each piezoelectric vibration piece. In the manufacturing method, a plurality of piezoelectric vibration devices are manufactured using a sheet-shaped substrate (1) in which a plurality of bases (10) in which piezoelectric vibration pieces are housed are connected in a matrix and integrally molded, external connection terminals (61-64) including a pair of first and second external connection terminals (61, 62) for the piezoelectric vibration pieces are formed on the outer bottom surfaces of the bases (10), and the external connection terminals (61-64) are formed on the outer bottom surfaces of the sheet-shaped substrate (1). A first external connection terminal (61) of the base (10) and a third external connection terminal (63) of the base (10) on the right side adjacent to the base (10) are electrically connected, and the manufacturing method includes a cutting step of cutting the electrical connection between the first external connection terminal (61) and the third external connection terminal (63) using an energy beam in the sheet-shaped substrate (1).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a piezoelectric vibration device for manufacturing a piezoelectric vibration device, a piezoelectric vibration device manufactured by the manufacturing method, and a sheet substrate used in the manufacturing method. Background Art

[0002] The piezoelectric vibration device includes, for example: a container-shaped base, which is made of an insulator and has an open top; a piezoelectric vibration piece, which is held in the internal space of the base by a conductive adhesive or the like; and a cover, which is bonded to the upper line portion of the base in a manner that covers the piezoelectric vibration piece and seals the internal space of the base. In addition, a mounting pad electrically connected to the piezoelectric vibration piece is provided on the inner bottom surface of the base, and an external connection terminal connected to the mounting pad is provided on the outer bottom surface of the base. A sealing metal for welding the cover is provided on the upper line portion of the base (for example, refer to Patent Document 1). In addition, the mounting pad, the external connection terminal, and the sealing metal are usually plated with gold or the like to prevent oxidation.

[0003] In addition, as an example of a method for manufacturing such a piezoelectric vibration device, there is a method of sequentially mounting piezoelectric vibration pieces on each independent base and then bonding a cover to the upper line portion of each base. However, in this manufacturing method, the number of crystal oscillators that can be manufactured per unit time is limited, making it difficult to achieve high production efficiency.

[0004] As a method to solve this technical problem, a plurality of recesses are formed in a matrix on the upper surface of a sheet substrate, and a piezoelectric vibrator device is simultaneously mounted in each recess (for example, see Patent Document 2). That is, by obtaining a plurality of bases on a sheet substrate, production efficiency is improved.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 6-90135

[0008] Patent Document 2: Japanese Patent Application Publication No. 2001-217334 Summary of the invention

[0009] Technical problem to be solved by the invention

[0010] However, in the method of manufacturing a plurality of bases on a sheet substrate, gold plating is applied to electrodes and the like. In addition, as a plating method for obtaining an appropriate film thickness of the plating, an electroplating method can be cited, but when the electroplating method is used, all metal parts (base metal) of the area where the plating is applied need to be electrically conductive. Therefore, when the frequency measurement device is connected to each piezoelectric vibrating piece to perform frequency measurement, other piezoelectric vibrating pieces electrically connected to the piezoelectric vibrating piece to be measured are conductive and affect the piezoelectric vibrating piece to be measured, and it is impossible to perform frequency measurement only on the piezoelectric vibrating piece to be measured.

[0011] In view of the above-mentioned technical problems, the present invention aims to provide a method for manufacturing a piezoelectric vibration device, a piezoelectric vibration device manufactured by the manufacturing method, and a sheet substrate used by the manufacturing method. The manufacturing method of the piezoelectric vibration device is a method for manufacturing a piezoelectric vibration device in which at least a plurality of bases for accommodating piezoelectric vibration pieces are obtained on a sheet substrate, and the characteristics of each piezoelectric vibration piece can be measured individually.

[0012] Solutions for solving the above technical problems

[0013] In order to achieve the above-mentioned object, a method for manufacturing a piezoelectric vibration device of the present invention is a method for manufacturing a piezoelectric vibration device using a sheet substrate formed by connecting a plurality of rectangular bases in a matrix shape and accommodating at least piezoelectric vibration pieces in a plan view. A plurality of external connection terminals are formed on the outer bottom surface of each of the bases, and the plurality of external connection terminals include a pair of piezoelectric vibration piece external connection terminals for electrically connecting the piezoelectric vibration piece accommodated in the base to the outside of the base. On the outer bottom surface of the sheet substrate, one of the pair of piezoelectric vibration piece external connection terminals of a specified base among the plurality of bases is electrically connected to a first external connection terminal among the plurality of external connection terminals of a first base, and the first base is a base adjacent to the specified base among the plurality of bases. The manufacturing method of the piezoelectric vibration device is characterized by having a cutting step, in which, in the sheet substrate, the electrical connection between the external connection terminal for the one piezoelectric vibration piece and the first external connection terminal is cut off by using a cutting device, thereby making the external connection terminal for the one piezoelectric vibration piece electrically independent from the first external connection terminal.

[0014] According to this configuration, in order to implement plating, an external connection terminal for a piezoelectric vibrating piece of a specified base is electrically connected to a first external connection terminal of a first base adjacent to the specified base. Furthermore, in the cutting step, by using a cutting device to cut off the electrical connection between the external connection terminal for the piezoelectric vibrating piece and the first external connection terminal, the external connection terminal for the piezoelectric vibrating piece can be made electrically independent. Thus, even if a sheet substrate is formed by integrally connecting a plurality of bases, the characteristics of the piezoelectric vibrating device can be measured by bringing the measurement probe into contact with a pair of external connection terminals for the piezoelectric vibrating piece electrically connected to the piezoelectric vibrating piece in each base, thereby suppressing the influence of other bases.

[0015] Furthermore, on the outer bottom surface of the sheet substrate, the other of the pair of piezoelectric vibrating piece external connection terminals of the predetermined mount is not electrically connected to any of the plurality of external connection terminals of any mount adjacent to the predetermined mount among the plurality of mounts.

[0016] According to this configuration, only one external connection terminal for the piezoelectric vibrating reed is electrically connected to the first external connection terminal of the adjacent first mount, so that the target region to be cut by the cutting device in the cutting step can be minimized.

[0017] Furthermore, on the outer bottom surface of the sheet substrate, the other piezoelectric vibrating piece external connection terminal of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the plurality of bases is electrically connected to a second external connection terminal of the plurality of external connection terminals of a second base, the second base being a base adjacent to the specified base among the plurality of bases. In the cutting step, in the sheet substrate, the electrical connection between the other piezoelectric vibrating piece external connection terminal and the second external connection terminal is cut off by using a cutting device, so that the other piezoelectric vibrating piece external connection terminal is electrically independent of the second external connection terminal.

[0018] According to this configuration, in order to implement plating, another piezoelectric vibration piece of a specified base is electrically connected to the second external connection terminal of the second base adjacent to the specified base. Furthermore, in the cutting process, by using a cutting device to cut off the electrical connection between the other piezoelectric vibration piece external connection terminal and the second external connection terminal, the other piezoelectric vibration piece external connection terminal can be electrically independent. Thus, electroplating can be efficiently performed on a pair of piezoelectric vibration piece external connection terminals and a plurality of external connection terminals that are electrically connected. Furthermore, in the cutting process, the electrical connection between the external connection terminals is cut off, so that by making the measurement probes contact the pair of piezoelectric vibration piece external connection terminals that are electrically connected to the piezoelectric vibration piece in the base of the sheet substrate in which the plurality of bases are connected in a matrix, the characteristics of the piezoelectric vibration device can be measured while suppressing the influence of other bases.

[0019] In addition, the plurality of external connection terminals of each of the bases are formed separately toward the inner side of the base relative to the outer peripheral edge of the outer bottom surface of the base in a plan view, and a connecting portion is formed on the outer bottom surface of the sheet substrate. The connecting portion physically and electrically connects one of the pair of piezoelectric vibration piece external connection terminals of the specified base to the first external connection terminal of the first base by crossing the boundary between the specified base and the first base.

[0020] In addition, the plurality of external connection terminals of each of the bases are formed separately toward the inner side of the base relative to the outer peripheral edge of the outer bottom surface of the base in a plan view. A first connection portion is formed on the outer bottom surface of the sheet substrate as one connection portion, and the first connection portion physically connects one of the pair of piezoelectric vibration piece external connection terminals of the specified base to the first external connection terminal of the first base by crossing the boundary between the specified base and the first base, thereby electrically connecting. A second connection portion is formed as the other connection portion, and the second connection portion physically connects the other of the pair of piezoelectric vibration piece external connection terminals of the specified base to the second external connection terminal of the second base by crossing the boundary between the specified base and the second base, thereby electrically connecting.

[0021] In addition, the metal film forming the external connection terminal is usually composed of a plating layer stacked on a metallization layer as a base metal layer. Assuming that the plurality of external connection terminals are not separated inwardly relative to the outer periphery of the outer bottom surface of the base when viewed from above, when the boundary between the specified base and the first base is cut by a cutting device (laser beam device, cutting blade device, etc.), the plating layer in the portion of the boundary of the external connection terminal will be scraped off. If the plating layer is scraped off, the base metal layer covered by the plating layer is exposed to the outside, so depending on the type of the base metal layer, it is sometimes not preferred in terms of environmental resistance.

[0022] According to this configuration, the plurality of external connection terminals are formed to be separated inward from the outer peripheral edge of the outer bottom surface in a plan view, so that interference between the cutting device and the external connection terminals can be eliminated, thereby preventing the above-mentioned problem from occurring.

[0023] In addition, it can also be configured as follows: a connecting portion is not formed on the outer bottom surface of the sheet substrate, and the connecting portion physically connects the other piezoelectric vibration piece external connection terminal of the pair of piezoelectric vibration piece external connection terminals of the specified base to any one of the multiple external connection terminals of the any one base by crossing the boundary between the specified base and any one of the multiple external connection terminals adjacent to the specified base, thereby electrically connecting the other piezoelectric vibration piece external connection terminal of the specified base.

[0024] According to this configuration, only one piezoelectric vibrating piece external connection terminal is provided with a connection portion for electrically connecting the piezoelectric vibrating piece external connection terminal to the adjacent first external connection terminal of the first mount. Therefore, the target area to be cut by the cutting device in the cutting step can be minimized.

[0025] In addition, the sheet substrate is a stacked body having a plurality of layers, the plurality of layers including a layer having the plurality of external connection terminals of each of the bases formed on its outer bottom surface, and one or more layers stacked on the surface opposite to the outer bottom surface of the layer, and a wiring pattern spanning the boundary between the specified base and a base adjacent to the specified base among the plurality of bases is formed between the stacked layers in the plurality of layers.

[0026] According to this configuration, since a wiring pattern straddling a boundary between a predetermined base and a base adjacent to the predetermined base among the plurality of bases is formed between the stacked layers among the plurality of layers, a plurality of external connection terminals can be formed at once by electroplating.

[0027] In addition, it can also be set that: the sheet substrate is a stacked body having multiple layers, the multiple layers include a layer on which the multiple external connection terminals of each of the bases are formed on the outer bottom surface, and one or more layers stacked on the surface on the side opposite to the outer bottom surface of the layer, and a wiring pattern spanning the boundary between the specified base and the base adjacent to the specified base among the multiple bases is formed between the stacked layers in the multiple layers, one of the pair of piezoelectric vibration piece external connection terminals of the specified base is electrically connected to the first external connection terminal of the first base through the connecting portion, and the other of the pair of piezoelectric vibration piece external connection terminals of the specified base is electrically connected to the second external connection terminal of the multiple external connection terminals of the second base adjacent to the specified base among the multiple bases through the wiring pattern.

[0028] According to this configuration, one piezoelectric vibrating piece external connection terminal is connected to the first external connection terminal via the connection portion, and another piezoelectric vibrating piece external connection terminal is electrically connected to the second external connection terminal via the wiring pattern. Therefore, a plurality of external connection terminals can be formed at once by electroplating.

[0029] Furthermore, the cutting step may be performed by physically cutting at least the connecting portion along a boundary between the predetermined base and the first base.

[0030] According to this configuration, since at least the connection portion is physically cut along the boundary between the predetermined base and the first base, it is possible to reliably cut off the connection between the external connection terminal for a piezoelectric vibrating piece of the predetermined base and the first external connection terminal of the first base. In addition, by thinning or cutting the boundary portion including the connection portion along the boundary between the predetermined base and the first base, it is possible to simultaneously perform segmentation and electrical cutting of a plurality of piezoelectric vibrating devices from the sheet substrate.

[0031] Furthermore, the cutting device may also be configured as an energy beam generating device.

[0032] According to this configuration, for example, by using a device that uses an energy beam such as a laser beam as a cutting unit, the following advantages are achieved compared to a case where a tool is used such as a blade cutting. The production efficiency is excellent because there is no need to replace parts corresponding to the replacement of the tool due to the wear of the blade, etc. In addition, compared to blade cutting, the cutting tolerance can be reduced, and as a result, the number of piezoelectric vibrator devices that can be obtained from one sheet substrate increases. In addition, by using a device that uses an energy beam such as a laser beam for cutting as a cutting device, even a small area can be reliably cut.

[0033] Furthermore, a piezoelectric vibration device according to the present invention is characterized by being manufactured by the above-mentioned method for manufacturing a piezoelectric vibration device.

[0034] According to this configuration, the characteristics of each piezoelectric vibration device can be measured in a state where a plurality of piezoelectric vibration devices are connected, and thus a piezoelectric vibration device having excellent characteristics can be obtained.

[0035] In addition, the sheet substrate of the present invention is a sheet substrate formed integrally by connecting a plurality of bases that are rectangular in plan view and at least accommodate piezoelectric vibration pieces in a matrix shape, and is characterized in that a plurality of external connection terminals are formed on the outer bottom surface of each of the bases, the plurality of external connection terminals including a pair of external connection terminals for piezoelectric vibration pieces for electrically connecting the piezoelectric vibration pieces accommodated in the base to the outside of the base, and in the outer bottom surface of the sheet substrate, one of the pair of external connection terminals for piezoelectric vibration pieces of a specified base among the plurality of bases is electrically connected to a first external connection terminal among the plurality of external connection terminals of a first base, and the first base is a base adjacent to the specified base among the plurality of bases.

[0036] According to this configuration, a piezoelectric vibrating piece external connection terminal is electrically connected to a first external connection terminal among a plurality of external connection terminals of a first base adjacent to a predetermined base among a plurality of bases, so that the plurality of external connection terminals can be plated efficiently. In addition, by cutting off the electrical connection between a piezoelectric vibrating piece external connection terminal and the first external connection terminal, a pair of piezoelectric vibrating piece external connection terminals are electrically independent in a sheet substrate formed by connecting a plurality of bases, so that the characteristics of each piezoelectric vibrating device can be measured.

[0037] Furthermore, in the sheet substrate of the present invention, on the outer bottom surface of the sheet substrate, the other piezoelectric vibrating piece external connection terminal of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the plurality of bases is electrically connected to the second external connection terminal of the plurality of external connection terminals of the second base, which is a base adjacent to the specified base among the plurality of bases.

[0038] According to this configuration, the other piezoelectric vibrating piece external connection terminal is electrically connected to the second external connection terminal among the plurality of external connection terminals of the second base adjacent to the specified base among the plurality of bases, so that the plurality of external connection terminals can be efficiently plated. In addition, by cutting off the electrical connection between the other piezoelectric vibrating piece external connection terminal and the second external connection terminal, a pair of piezoelectric vibrating piece external connection terminals are electrically independent in the sheet substrate formed by connecting the plurality of bases, so that the characteristics of each piezoelectric vibrating device can be measured.

[0039] Effects of the Invention

[0040] According to the present invention, in the cutting process, by using a cutting device to cut off the electrical connection between one piezoelectric vibrating piece external connection terminal of a predetermined base and the first external connection terminal of a first base adjacent to the predetermined base, the one piezoelectric vibrating piece external connection terminal can be made electrically independent. Thus, even if a sheet substrate is formed by integrally connecting a plurality of bases, it is possible to measure the characteristics of a piezoelectric vibrating device while suppressing the influence of other bases by bringing the measurement probe into contact with a pair of piezoelectric vibrating piece external connection terminals electrically connected to the piezoelectric vibrating piece in each base. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic plan view of the upper surface side of the sheet substrate according to the first embodiment of the present invention.

[0042] Figure 2 yes Figure 1 Schematic top view (perspective view) of the lower surface side of the sheet substrate.

[0043] Figure 3 yes Figure 1 A schematic cross-sectional view of a sheet substrate.

[0044] Figure 4 It is composed Figure 1 Schematic top view of the upper surface side of the first ceramic layer of the sheet substrate.

[0045] Figure 5 It is composed Figure 1 Schematic top view of the upper surface side of the second ceramic layer of the sheet substrate.

[0046] Figure 6 It is composed Figure 1 A schematic top view (perspective view) of the lower surface side of the second ceramic layer of the sheet substrate.

[0047] Figure 7 It is composed Figure 1 Schematic top view of the upper surface side of the third ceramic layer of the sheet substrate.

[0048] Figure 8 (a) is composed of Figure 1 Schematic top view (perspective view) of the lower surface side of the third ceramic layer of the sheet substrate. (b) is a partial enlarged view.

[0049] Fig. 9 This is a schematic cross-sectional view of the piezoelectric vibration device according to the first embodiment of the present invention.

[0050] Fig.10 It is a schematic plan view of the upper surface side of the second ceramic layer constituting the sheet substrate in a modification of the first embodiment of the present invention.

[0051] Fig.11 It is a schematic plan view (perspective view) of the lower surface side of the second ceramic layer constituting the sheet substrate in a modified example of the first embodiment of the present invention.

[0052] Fig.12 It is a schematic plan view (perspective view) of the lower surface side of the third ceramic layer constituting the sheet substrate in a modification of the first embodiment of the present invention.

[0053] Fig.13 It is a schematic cross-sectional view of a piezoelectric vibration device according to a modified example of the first embodiment of the present invention. DETAILED DESCRIPTION

[0054] [Implementation Method 1]

[0055] Hereinafter, a method for manufacturing a piezoelectric vibration device according to Embodiment 1 of the present invention, a piezoelectric vibration device manufactured by the manufacturing method, and a sheet substrate used in the manufacturing method will be described with reference to the drawings.

[0056] First, refer to Figures 1 to 8 The structure of the sheet substrate 1 will be described. Figure 1 It is a schematic plan view of the upper surface side of sheet substrate 1 according to the present embodiment. Figure 2 yes Figure 1 Schematic top view (perspective view) of the lower surface side of the sheet substrate 1. Figure 3 yes Figure 1 Schematic cross-sectional view of a sheet substrate 1. Figure 4 It is composed Figure 1 FIG. 1 is a schematic plan view of the upper surface side of the first ceramic layer 11 of the sheet substrate 1 . Figure 5 It is composed Figure 1 A schematic plan view of the upper surface side of the second ceramic layer 12 of the sheet substrate 1 is shown in FIG. Figure 6 It is composed Figure 1 FIG. 1 is a schematic plan view (perspective view) of the lower surface side of the second ceramic layer 12 of the sheet substrate 1 . Figure 7 It is composed Figure 1 A schematic plan view of the upper surface side of the third ceramic layer 13 of the sheet substrate 1 is shown in FIG. Figure 8 It is composed Figure 1 A schematic top view (perspective view) of the lower surface side of the third ceramic layer 13 of the sheet substrate 1 is shown. Figure 1 to Figure 2 and Figures 4 to 8 The same English letters [A], [B], [C], and [D] are used for easy understanding. Figures 4 to 8 The corresponding position of Figure 1 to Figure 2 and Figures 4 to 8 Each [A] of is shown in the corresponding position in the top view. Figure 1 to Figure 2 and Figures 4 to 8 Each [B] of is shown in the corresponding position in the top view. Figure 1 to Figure 2 and Figures 4 to 8 Each [C] of is shown in the corresponding position in the top view. Figure 1 to Figure 2 and Figures 4 to 8 Each [D] of is shown in the corresponding position in the top view. Figures 1 to 8 In the embodiment, the plurality of bases 10 formed in a matrix on the sheet substrate 1 have the same structure. Figures 1 to 8 Some of the reference numerals are omitted.

[0057] The sheet substrate 1 is a sheet substrate formed by connecting a plurality of rectangular bases 10 in a matrix shape. Figure 3 As shown, the sheet substrate 1 is a ceramic laminate composed of three layers, including a first ceramic layer 11, a second ceramic layer 12, and a third ceramic layer 13 made of a ceramic material such as alumina. The sheet substrate 1 is stacked in the order of the third ceramic layer 13, the second ceramic layer 12, and the first ceramic layer 11.

[0058] The second ceramic layer 12 is in a rectangular flat plate shape when viewed from above. The first ceramic layer 11 is in a rectangular outer periphery when viewed from above, and rectangular through holes 16 are formed in a matrix shape when viewed from above. Figure 1 , Figure 4 The through holes 16 are arranged in a matrix of 3 rows and 3 columns, but the matrix may be another matrix. The third ceramic layer 13 has a rectangular outer periphery in a plan view, and the rectangular through holes 17 in a plan view are formed in a matrix. Figure 2 , Figure 7 , Figure 8 , etc., the through holes 17 are arranged in a matrix of 3 rows and 3 columns, but the matrix may be another matrix. In a plan view, the center of the through hole 16 formed in the first ceramic layer 11 and the center of the through hole 17 formed in the third ceramic layer are roughly overlapped. In addition, in a plan view, the formation area of ​​the through hole 16 is larger than the formation area of ​​the through hole 17, and the formation area of ​​the through hole 17 is completely included in the formation area of ​​the through hole 16.

[0059] A groove 11A parallel to the long side along [A]-[B] is formed on the upper surface of the first ceramic layer 11, and a groove 11B parallel to the short side along [B]-[C] is formed. In addition, a groove 13B parallel to the long side along [A]-[B] is formed on the lower surface of the third ceramic layer 13. In a plan view, the groove 11A formed on the upper surface of the first ceramic layer 11 overlaps with the groove 13B formed on the third ceramic layer 13. The rectangular area portion of the sheet substrate 1 separated by the groove 11A and the groove 11B in a plan view corresponds to one base 10. In addition, no groove parallel to the short side along [B]-[C] is formed on the lower surface of the sheet substrate 1 (the lower surface of the third ceramic layer 13), but in order to easily understand each base 10, a dotted line is drawn at the position overlapping with the groove 11B formed on the upper surface of the first ceramic layer 11 in a plan view.

[0060] In the base 10, the upper surface of the second ceramic layer 12 is set as the bottom surface, and the first cavity 18 is formed by the portion of the through hole 16 of the first ceramic layer 11. In the base 10, the lower surface of the second ceramic layer 12 is set as the bottom surface, and the second cavity 19 is formed by the portion of the through hole 17 of the third ceramic layer 13. In this embodiment, the piezoelectric vibrating piece 101 is accommodated in the first cavity 18, and the thermistor 102 is accommodated in the second cavity 19 (see Fig. 9 ).

[0061] like Figure 4 As shown, a metal layer 21 is formed on the upper surface of the first ceramic layer 11 over the entire circumference of the through hole 16 in each base 10. The metal layer 21 is used when the cover 103 constituting the piezoelectric vibration device 100 is bonded to the upper surface of the base 10 constituting the piezoelectric vibration device 100 (the upper surface of the first ceramic layer 11).

[0062] In the first ceramic layer 11, a first through-hole electrode 22 penetrating the first ceramic layer 11 is formed at a position overlapping with the metal layer 21 in a plan view for each base 10. The metal layer 21 and the first through-hole electrode 22 are bonded and electrically connected.

[0063] like Figure 5 As shown, a pair of first electrode pads 25 and second electrode pads 26 are formed on the upper surface of the second ceramic layer 12 in each base 10. The pair of first electrode pads 25 and second electrode pads 26 are located on one short side of the base 10 which is rectangular in a plan view in such a manner that a portion of the pair of first electrode pads 25 and second electrode pads 26 are exposed from the through hole 16 formed in the first ceramic layer 11 in a plan view. In the present embodiment, the piezoelectric vibrating piece 101 is mounted on the pair of first electrode pads 25 and second electrode pads 26.

[0064] On the upper surface of the second ceramic layer 12, the first to fourth through-hole connection electrodes 27a to 30a are formed near the four corners of each base 10. The fourth through-hole connection electrode 30a is connected to the second electrode pad 26 and electrically connected. In addition, on the upper surface of the second ceramic layer 12, an electrode pad wiring pattern 31 is formed for each base 10. The electrode pad wiring pattern 31 is connected to the first electrode pad 25 and electrically connected. The electrode pad wiring pattern 31 is connected to the second through-hole connection electrode 28a and electrically connected.

[0065] In the second ceramic layer 12, for each base 10, the first through-hole electrode 27b penetrating the second ceramic layer 12 is formed at a position overlapping with the first through-hole connection electrode 27a in a plan view. The first through-hole connection electrode 27a is joined to the first through-hole electrode 27b and electrically connected. In addition, in the second ceramic layer 12, for each base 10, the second through-hole electrode 28b penetrating the second ceramic layer 12 is formed at a position overlapping with the second through-hole connection electrode 28a in a plan view. The second through-hole connection electrode 28a is joined to the second through-hole electrode 28b and electrically connected. In addition, in the second ceramic layer 12, for each base 10, the third through-hole electrode 29b penetrating the second ceramic layer 12 is formed at a position overlapping with the third through-hole connection electrode 29a in a plan view. The third through-hole connection electrode 29a is joined to the third through-hole electrode 29b and electrically connected. In addition, in the second ceramic layer 12, a fourth through-hole electrode 30b penetrating the second ceramic layer 12 is formed at a position overlapping with the fourth through-hole connecting electrode 30a in a plan view for each base 10. The fourth through-hole connecting electrode 30a is bonded to the fourth through-hole electrode 30b for electrical connection.

[0066] On the upper surface of the second ceramic layer 12, the fifth through-hole connecting electrode 36 is formed on each base 10 so as to be aligned with the first through-hole electrode 22 (see FIG. 2 ) of the first ceramic layer 11 in a plan view. Figure 4 ) and the third through-hole connection electrode 29a overlap. The first through-hole electrode 22 is joined and electrically connected to the fifth through-hole connection electrode 36. The third through-hole connection electrode 29a is joined and electrically connected to the fifth through-hole connection electrode 36.

[0067] On the upper surface of the second ceramic layer 12, a two-layer support portion (pillow portion) 37 is formed at a position corresponding to the free end of the accommodated piezoelectric vibrating piece 101 in each base 10. The support portion (pillow portion) 37 is used to prevent the piezoelectric vibrating piece 101 from contacting the upper surface of the second ceramic layer 12 when the accommodated piezoelectric vibrating piece 101 vibrates.

[0068] In addition, Figure 5 In the figure, in each electrode pad, the portion that does not overlap with the through hole 16 of the first ceramic layer 11 in a plan view is hatched and illustrated, and the portion that overlaps with the through hole 16 is not hatched and illustrated. Figure 5In the figure, grooves parallel to the long sides along [A]-[B] and grooves parallel to the short sides along [B]-[C] are not formed on the upper surface of the second ceramic layer 12, but in order to easily grasp each base 10, dotted lines are drawn at the positions where the grooves 11A and 11B formed on the upper surface of the first ceramic layer 11 overlap when viewed from above.

[0069] like Figure 6 As shown, on the lower surface of the second ceramic layer 12, a pair of first electrode pads 41 and second electrode pads 42 are formed near the center of each base 10 in a plan view so as to be exposed from a through hole 17 formed in the third ceramic layer 13. In the present embodiment, the thermistor 102 is mounted on the pair of first electrode pads 41 and second electrode pads 42.

[0070] like Figure 6 As shown, on the lower surface of the second ceramic layer 12, a first wiring pattern 43 extending from the first electrode pad 41 is formed on each base 10, and the first wiring pattern 43 is branched into two, and one branch and the other branch respectively extend to the long side of the [A]-[B] side of the base 10 which is rectangular when viewed from above.

[0071] On the lower surface side of the second ceramic layer 12, a second wiring pattern 44 extending from the second electrode pad 42 is formed in each base 10. The second wiring pattern 44 is branched into two. One of the branched wiring patterns 44 extends to the long side of the [C]-[D] side of the base 10 in a rectangular shape when viewed from above. The other branched wiring pattern 44 extends to the short side of the [B]-[C] side of the base 10 in a rectangular shape when viewed from above.

[0072] A third wiring pattern 45 is formed on the lower surface of the second ceramic layer 12 for each base 10. The third wiring pattern 45 extends while bending from the long side of the base 10 on the [C]-[D] side to the short side of the [D]-[A] side in a plan view in a rectangular shape.

[0073] One of the branched wiring patterns in the first wiring pattern 43 of the base 10 and the base 10 ( Figure 6 The wiring pattern on one side of the second wiring pattern 44 of the base 10 located on the upper side relative to the base 10 (referred to as "the first adjacent base 10") is connected. In addition, the wiring pattern on the other side of the first wiring pattern 43 of the base 10 is connected to one end of the third wiring pattern 45 of the first adjacent base 10.

[0074] One wiring pattern of the second wiring pattern 44 of the base 10 and the base 10 ( Figure 6The wiring pattern of one side of the first wiring pattern 43 of the base 10 located below the base 10 (hereinafter referred to as "the third adjacent base 10") is connected. In addition, the wiring pattern of the other side of the second wiring pattern 44 of the base 10 is connected to the base 10 ( Figure 6 The other end of the third wiring pattern 45 is connected to the base 10 located on the right side relative to the base 10: here, recorded as "the second adjacent base 10").

[0075] One end of the third wiring pattern 45 of the base 10 is connected to the other wiring pattern of the first wiring pattern 43 of the third adjacent base 10. In addition, the other end of the third wiring pattern 45 of the base 10 is connected to the base 10 ( Figure 6 The other wiring pattern of the second wiring pattern 44 of the base 10 located on the left side relative to the base 10 (referred to as the "fourth adjacent base 10" herein) is connected.

[0076] The first wiring pattern 43 of the base 10 forms a wiring pattern that straddles the boundary between the base 10 and the first adjacent base 10 with the second wiring pattern 44 and the third wiring pattern 45 of the first adjacent base 10. The second wiring pattern 44 of the base 10 forms a wiring pattern that straddles the boundary between the base 10 and the second adjacent base 10 with the third wiring pattern 45 of the second adjacent base 10. The second wiring pattern 44 and the third wiring pattern 45 of the base 10 forms a wiring pattern that straddles the boundary between the base 10 and the third adjacent base 10 with the first wiring pattern 43 of the third adjacent base 10. The third wiring pattern 45 of the base 10 forms a wiring pattern that straddles the boundary between the base 10 and the fourth adjacent base 10 with the second wiring pattern 44 of the fourth adjacent base 10.

[0077] On the lower surface of the second ceramic layer 12, for each base 10, the first through-hole connection electrode 46 is formed at a position overlapping with the first wiring pattern 43 in a plan view and overlapping with the first through-hole electrode 27b in a plan view. The first through-hole connection electrode 46 is electrically connected to the first wiring pattern 43. The first through-hole connection electrode 46 is electrically connected to the first through-hole electrode 27b. On the lower surface of the second ceramic layer 12, for each base 10, the second through-hole connection electrode 47 is formed at a position overlapping with the second through-hole electrode 28b in a plan view. The second through-hole connection electrode 47 is electrically connected to the second through-hole electrode 28b. On the lower surface of the second ceramic layer 12, for each base 10, the third through-hole connection electrode 48 is formed at a position overlapping with the second wiring pattern 44 in a plan view and overlapping with the third through-hole electrode 29b in a plan view. The third through-hole connection electrode 48 is electrically connected to the second wiring pattern 44. The third through-hole connection electrode 48 is electrically connected to the third through-hole electrode 29b. On the lower surface of the second ceramic layer 12, a fourth through-hole connection electrode 49 is formed at a position overlapping the third wiring pattern 45 in a plan view and overlapping the fourth through-hole electrode 30b in a plan view for each base 10. The fourth through-hole connection electrode 49 is electrically connected to the third wiring pattern 45. The fourth through-hole connection electrode 49 is electrically connected to the fourth through-hole electrode 30b.

[0078] In addition, Figure 6 In the figure, in each electrode pad, the portion that does not overlap with the through hole 17 of the third ceramic layer 13 in a plan view is hatched and illustrated, and the portion that overlaps with the through hole 17 is not hatched and illustrated. Figure 6 In the figure, grooves parallel to [A]-[B] and grooves parallel to [B]-[C] are not formed on the lower surface of the second ceramic layer 12, but in order to easily grasp each base 10, dotted lines are drawn at the positions where the grooves 11A and 11B formed on the upper surface of the first ceramic layer 11 overlap when viewed from above.

[0079] like Figure 7As shown, on the upper surface of the third ceramic layer 13, for each base 10, the first through-hole connection electrode 51a is formed at a position overlapping with the first through-hole connection electrode 46 formed on the lower surface of the second ceramic layer 12 in a plan view. The first through-hole connection electrode 51a is electrically connected to the first through-hole connection electrode 46. On the upper surface of the third ceramic layer 13, for each base 10, the second through-hole connection electrode 52a is formed at a position overlapping with the second through-hole connection electrode 47 formed on the lower surface of the second ceramic layer 12 in a plan view. The second through-hole connection electrode 52a is electrically connected to the second through-hole connection electrode 47. On the upper surface of the third ceramic layer 13, for each base 10, the third through-hole connection electrode 53a is formed at a position overlapping with the third through-hole connection electrode 48 formed on the lower surface of the second ceramic layer 12 in a plan view. The third through-hole connection electrode 53a is electrically connected to the third through-hole connection electrode 48. On the upper surface of the third ceramic layer 13, the fourth through-hole connection electrode 54a is formed at a position overlapping with the fourth through-hole connection electrode 49 formed on the lower surface of the second ceramic layer 12 in a plan view for each base 10. The fourth through-hole connection electrode 54a is electrically connected to the fourth through-hole connection electrode 49.

[0080] In the third ceramic layer 13, for each base 10, the first through-hole electrode 51b penetrating the third ceramic layer 13 is formed at a position overlapping with the first through-hole connecting electrode 51a in a plan view. The first through-hole connecting electrode 51a is electrically connected to the first through-hole electrode 51b. In the third ceramic layer 13, for each base 10, the second through-hole electrode 52b penetrating the third ceramic layer 13 is formed at a position overlapping with the second through-hole connecting electrode 52a in a plan view. The second through-hole connecting electrode 52a is electrically connected to the second through-hole electrode 52b. In the third ceramic layer 13, for each base 10, the third through-hole electrode 53b penetrating the third ceramic layer 13 is formed at a position overlapping with the third through-hole connecting electrode 53a in a plan view. The third through-hole connecting electrode 53a is electrically connected to the third through-hole electrode 53b. In the third ceramic layer 13, a fourth through-hole electrode 54b penetrating the third ceramic layer 13 is formed at a position overlapping with the fourth through-hole connecting electrode 54a in a plan view for each base 10. The fourth through-hole connecting electrode 54a is electrically connected to the fourth through-hole electrode 54b.

[0081] In addition, Figure 7 In the figure, grooves parallel to [A]-[B] and grooves parallel to [B]-[C] are not formed on the lower surface of the third ceramic layer 13, but in order to easily grasp each base 10, dotted lines are drawn at the positions where the grooves 11A and 11B formed on the upper surface of the first ceramic layer 11 overlap when viewed from above.

[0082] like Figure 8As shown, on the lower surface of the third ceramic layer 13, a pair of first external connection terminals 61 and second external connection terminals 62 are formed separately from the outer periphery of the base 10 in a plan view. The pair of first external connection terminals 61 and second external connection terminals 62 are arranged on the diagonal line in the rectangular base 10. The first external connection terminal 61 is formed to be spaced apart from the long side of the [A]-[B] side and the short side of the [B]-[C] side in the rectangular base 10 in a plan view. The second external connection terminal 62 is formed to be spaced apart from the long side of the [C]-[D] side and the short side of the [D]-[A] side in the rectangular base 10 in a plan view. The first external connection terminal 61 is electrically connected to the second through-hole electrode 52b formed in the third ceramic layer 13 by bonding. The second external connection terminal 62 is electrically connected to the fourth through-hole electrode 54b formed in the third ceramic layer 13 by bonding.

[0083] In the present embodiment, a pair of first external connection terminals 61 and second external connection terminals 62 are a pair of external connection terminals for a piezoelectric vibrating piece for electrically connecting the piezoelectric vibrating piece 101 mounted on a pair of first electrode pads 25 and second electrode pads 26 formed on the upper surface of the second ceramic layer 12 to the outside. The first external connection terminal 61, which is one external connection terminal for a piezoelectric vibrating piece, is connected to the first electrode pad 25 via the second through-hole electrode 52b formed on the third ceramic layer 13, the second through-hole connection electrode 52a formed on the upper surface of the third ceramic layer 13, the second through-hole connection electrode 47 formed on the lower surface of the second ceramic layer 12, the second through-hole electrode 28b formed on the second ceramic layer 12, the second through-hole connection electrode 28a formed on the upper surface of the second ceramic layer 12, and the electrode pad wiring pattern 31 formed on the upper surface of the second ceramic layer 12. The second external connection terminal 62, which serves as an external connection terminal for another piezoelectric vibrating piece, is connected to the second electrode pad 26 via the fourth through-hole electrode 54b formed on the third ceramic layer 13, the fourth through-hole connection electrode 54a formed on the upper surface of the third ceramic layer 13, the fourth through-hole connection electrode 49 formed on the lower surface of the second ceramic layer 12, the fourth through-hole connection electrode 30b formed on the second ceramic layer 12, and the fourth through-hole connection electrode 30a formed on the upper surface of the second ceramic layer 12.

[0084] On the lower surface of the third ceramic layer 13, in each base 10, a pair of third external connection terminals 63 and a fourth external connection terminal 64, which are external connection terminals other than a pair of first external connection terminals 61 and a second external connection terminal 62 as a pair of external connection terminals for a piezoelectric vibrating piece, are formed apart from the outer periphery of the base 10 in a plan view. The pair of third external connection terminals 63 and the fourth external connection terminal 64 are located at opposite corners in the rectangular base 10. The third external connection terminal 63 as the first external connection terminal is formed at intervals from the short side of the [D]-[A] side and the long side of the [A]-[B] side in the rectangular base 10 in a plan view. The fourth external connection terminal 64 as the second external connection terminal is formed at intervals from the short side of the [B]-[C] side and the long side of the [C]-[D] side in the rectangular base 10 in a plan view. The third external connection terminal 63 is electrically connected to the first through-hole electrode 51b formed in the third ceramic layer 13. The fourth external connection terminal 64 is electrically connected to the third through-hole electrode 53b formed in the third ceramic layer 13. The second ceramic layer 12 and the first ceramic layer 11 are stacked on the surface of the third ceramic layer 13 on which the external connection terminal is formed, which is opposite to the outer bottom surface where the external connection terminal is located.

[0085] In the present embodiment, a pair of third external connection terminals 63 and a fourth external connection terminal 64 are mounted on a pair of first electrode pads 41 and second electrode pads 42 formed on the lower surface of the second ceramic layer 12. In the present embodiment, the thermistor 102 is electrically connected to the outside. The third external connection terminal 63 is connected to the first electrode pad 41 via the first through-hole electrode 51b formed on the third ceramic layer 13, the first through-hole connection electrode 51a formed on the upper surface of the third ceramic layer 13, the first through-hole connection electrode 46 formed on the lower surface of the second ceramic layer 12, and the first wiring pattern 43 formed on the lower surface of the second ceramic layer 12. The fourth external connection terminal 64 is connected to the second electrode pad 42 via the third through-hole electrode 53b formed on the third ceramic layer 13, the third through-hole connection electrode 53a formed on the upper surface of the third ceramic layer 13, the third through-hole connection electrode 48 formed on the lower surface of the second ceramic layer 12, and the second wiring pattern 44 formed on the lower surface of the second ceramic layer 12.

[0086] On the lower surface of the third ceramic layer 13, a first connection portion 65 extending from the first external connection terminal 61 is formed in each base 10. The first connection portion 65 extends to the short side of the [B]-[C] side of the base 10 which is rectangular when viewed from above. When the length D1 of the first connection portion 65 in the direction from [B] to [C] is compared with the length D2 of the first external connection terminal 61 in the direction from [B] to [C], D1<D2. The first connection portion 65 extends from the first external connection terminal 61 in a manner other than near the corner of the base 10 (the corner on the [B] side of the base 10).

[0087] On the lower surface of the third ceramic layer 13, a second connection portion 66 extending from the third external connection terminal 63 is formed in each base 10. The second connection portion 66 extends to the short side of the [D]-[A] side of the base 10 which is rectangular when viewed from above. When the length D1 of the second connection portion 66 in the direction from [B] to [C] is compared with the length D2 of the third external connection terminal 63 in the direction from [B] to [C], D1<D2. The second connection portion 66 extends from the third external connection terminal 63 in a manner other than near the corner of the base 10 (the corner on the [A] side of the base 10).

[0088] The first connection portion 65 of the base 10 and the base 10 ( Figure 8 The first connection portion 65 of the base 10 and the second connection portion 66 of the second adjacent base 10 are connected to each other across the boundary between the base 10 and the second adjacent base 10, forming a connection portion that electrically connects the first external connection terminal 61, which is an external connection terminal of one piezoelectric vibrating piece of the base 10, and the third external connection terminal 63, which is the first external connection terminal of the second adjacent base 10 as the first base 10. That is, the first external connection terminal 61 of the base 10 and the third external connection terminal 63 of the second adjacent base 10 are connected and electrically connected via the first connection portion 65 and the second connection portion 66 on the lower surface of the third ceramic layer 13 (the outer bottom surface of the sheet substrate 1).

[0089] The second connection portion 66 of the base 10 and the base 10 ( Figure 8The second connection portion 66 of the base 10 and the first connection portion 65 of the fourth adjacent base 10 are connected to each other across the boundary between the base 10 and the fourth adjacent base 10, forming a connection portion that electrically connects the third external connection terminal 63, which is the first external connection terminal of the base 10, and the first external connection terminal 61, which is an external connection terminal for a piezoelectric vibrating piece of the fourth adjacent base 10. That is, the third external connection terminal 63 of the base 10 and the first external connection terminal 61 of the fourth adjacent base 10 are connected and electrically connected via the connection portion on the lower surface of the third ceramic layer 13 (the outer bottom surface of the sheet substrate 1).

[0090] The first external connection terminal 61 is less susceptible to the heat generated by the irradiation of the energy beam described later, as compared with a configuration in which the first external connection terminal 61 is connected to the third external connection terminal 63 of the adjacent base 10 without being separated inward from the outer peripheral edge of the outer bottom surface of the base 10. Specifically, Figure 8 As shown, the first external connection terminal 61 is formed to be separated inward from the outer peripheral edge of the outer bottom surface of the base 10, and the first external connection terminal 61 is connected to the third external connection terminal 63 of the adjacent base 10 by the first connection portion 65 and the second connection portion 66 whose length D1 is smaller than D2, so that the area cut by laser irradiation can be reduced as much as possible. That is, the area cut by the energy beam becomes smaller, so that the nickel of the nickel-plated layer in the first external connection terminal 61 composed of a multi-layer metal film and the third external connection terminal 63 of the adjacent base 10 can be suppressed from diffusing into the gold-plated layer on the upper layer due to the heat generated by the irradiation of the energy beam. As a result, it is possible to prevent the wettability of the first external connection terminal 61 and the third external connection terminal 63 of the adjacent base 10 to the solder from being reduced, so that the connection reliability with the external substrate is improved.

[0091] Furthermore, in the present embodiment, the connection portion (the first connection portion 65, the second connection portion 66) is formed at a position that does not include the corner farthest from the center of the outer bottom surface of the base 10 among the multiple corners of the external connection terminal (the first external connection terminal 61, the third external connection terminal 63) in a plan view. It is known that, in a configuration where the external connection terminal having multiple corners is formed near the outer peripheral edge of the outer bottom surface of the base 10, the corner farthest from the center of the outer bottom surface of the base 10 in a plan view among the multiple corners is the starting point of the annual degradation of the solder. In the present embodiment, the corner farthest from the center of the outer bottom surface of the base 10 in a plan view is not connected to a connection portion, so the farthest corner is not heated by the energy beam. Thus, it is possible to prevent the wettability of the solder from being reduced due to the diffusion of nickel of the nickel-plated layer into the gold-plated layer above it.

[0092] The second external connection terminal 62 as another external connection terminal for the piezoelectric vibrating piece of the base 10 is connected to the base 10 through wiring formed inside the sheet substrate 1 (through-hole electrodes (51b, 53b, 54b) formed on the lower surface of the third ceramic layer 13, through-hole connection electrodes (51a, 53a, 54a) formed on the upper surface of the third ceramic layer 13, through-hole connection electrodes (46, 48, 49) formed on the lower surface of the second ceramic layer 12, wiring patterns (43, 44, 45) formed on the lower surface of the second ceramic layer 12, etc.), and the base 10 ( Figure 8 The second external connection terminal, that is, the fourth external connection terminal 64, of the base 10 located on the left side relative to the base 10, and the base 10 ( Figure 8 The third external connection terminal 63 of the base 10 located at the lower side relative to the base 10 is connected and electrically connected.

[0093] The third external connection terminal 63, which is the first external connection terminal of the base 10, is connected to the base 10 through wiring formed inside the sheet substrate 1 (through-hole electrodes (51b, 54b) formed on the third ceramic layer 13, through-hole connection electrodes (51a, 54a) formed on the upper surface of the third ceramic layer 13, first through-hole connection electrodes (46, 49) formed on the lower surface of the second ceramic layer 12, wiring patterns (43, 45) formed on the lower surface of the second ceramic layer 12, etc.), and the base 10 ( Figure 8 The second external connection terminal 62 of the base 10 located on the upper side relative to the base 10 is connected and electrically connected.

[0094] The fourth external connection terminal 64, which is the second external connection terminal of the base 10, is connected to the base 10 through wiring formed inside the sheet substrate 1 (through-hole electrodes (53b, 54b) formed on the third ceramic layer 13, through-hole connection electrodes (53a, 54a) formed on the upper surface of the third ceramic layer 13, through-hole connection electrodes (48, 49) formed on the lower surface of the second ceramic layer 12, and wiring patterns (43, 44, 45) formed on the lower surface of the second ceramic layer 12, etc.), and the second external connection terminal 62, which is another external connection terminal for the piezoelectric vibrating piece of the base 10, and the base 10 ( Figure 8 The second external connection terminal 62 of the base 10 located on the right side relative to the base 10 is connected and electrically connected.

[0095] In addition, the second external connection terminal 62 of the base 10 is not electrically connected to any of the first to fourth external connection terminals 61 to 64 of any base 10 adjacent to the base 10 on the lower surface of the third ceramic layer 13 (the outer bottom surface of the sheet substrate 1). In addition, no connection portion is provided for electrically connecting the second external connection terminal 62 of the base 10 to any of the first to fourth external connection terminals 61 to 64 of any base 10 adjacent to the base 10 on the lower surface of the third ceramic layer 13 (the outer bottom surface of the sheet substrate 1).

[0096] In addition, Figure 8 In the figure, no groove parallel to [B]-[C] is formed on the lower surface of the third ceramic layer 13, but in order to easily grasp each base 10, a dotted line is drawn at a position overlapping with the groove 11B formed on the upper surface of the first ceramic layer 11 when viewed from above.

[0097] The above-mentioned external connection terminals (61-64), connection parts (65-66), through-hole electrodes (51b-54b), through-hole connection electrodes (51a-54a), electrode pads (41-42), wiring patterns (43-45), through-hole connection electrodes (46-49), electrode pads (25-26), through-hole connection electrodes (27a-30a), wiring patterns (31), through-hole electrodes (27b-30b), through-hole connection electrodes (36), through-hole electrodes (22), and metal layers (21) are respectively formed by stacking a molybdenum (Mo) metallization layer, a nickel (Ni) plating layer, and a gold (Au) plating layer in order from the formation surface. In addition, as the metallization layer, for example, tungsten (W) can also be used instead of molybdenum.

[0098] Next, refer to Fig. 9 , for use reference Figures 1 to 8 The sheet substrate 1 described above will be described with respect to the configuration of a piezoelectric vibration device 100 manufactured by the method for manufacturing a piezoelectric vibration device according to the present embodiment. Fig. 9 2 is a schematic cross-sectional view of the piezoelectric vibration device 100 according to the present embodiment.

[0099] The piezoelectric vibration device 100 includes: a base 10; a piezoelectric vibration piece 101 accommodated in a first cavity 18 of the base 10; a thermistor 102 accommodated in a second cavity 19 of the base 10; and a cover 103 for airtightly sealing the piezoelectric vibration piece 101 accommodated in the first cavity 18 of the base 10. The base 10 has an H-shaped structure in cross-sectional view.

[0100] The pair of electrodes of the piezoelectric vibrating piece 101 housed in the first cavity 18 are mechanically and electrically connected to a pair of electrode pads (first electrode pad 25 and second electrode pad 26 ) of the base 10 using a conductive bonding portion 104 such as a metal bump or a conductive adhesive.

[0101] The pair of electrodes of the thermistor 102 housed in the second cavity 19 are mechanically and electrically connected to a pair of electrode pads (the first electrode pad 41 and the second electrode pad 42 ) of the base 10 using solder 105 .

[0102] Next, use the reference Figures 1 to 8 The following describes a method for manufacturing a piezoelectric vibration device according to the present embodiment, in which the piezoelectric vibration device 100 is manufactured using the sheet substrate 1 described above. The method for manufacturing a piezoelectric vibration device includes a cutting step.

[0103] First, after forming molybdenum metallization layers on the first ceramic layer 11, the second ceramic layer 12, and the third ceramic layer 13, the first ceramic layer 11, the second ceramic layer 12, and the third ceramic layer 13 are stacked. Next, grooves 11A and 11B are formed on the upper surface of the first ceramic layer 11 by metal scribing, laser scribing, etc. (see Figure 1 ), a groove 13B is formed on the lower surface of the third ceramic layer 13 by metal scribing, laser scribing, etc. Then, a nickel-plated layer is stacked on the molybdenum metallization layer by firing the first to third ceramic layers 11 to 13 and electroplating, and a gold-plated layer is further stacked on the nickel-plated layer by electroplating. The sheet substrate 1 is manufactured in this way. However, the manufacturing method of the sheet substrate 1 is not particularly limited, as long as it can achieve the reference Figures 1 to 8 The method for manufacturing a sheet substrate having the structure of the sheet substrate 1 described above may be used.

[0104] Next, based on the predetermined shape of the base 10, the boundary between adjacent bases 10 (along Figure 2 The lower surface of the third ceramic layer 13 constituting the manufactured sheet substrate 1 is irradiated with an energy beam (laser beam, electron beam, etc.) by irradiating the lower surface of the third ceramic layer 13 with an energy beam (a dotted line drawn on the lower surface of the third ceramic layer 13 in FIG. 1 ). As a result, while a groove is formed on the lower surface of the third ceramic layer 13 along the boundary between the adjacent bases 10, the connecting portion (the connecting portion formed by the adjacent first connecting portion 65 and the second connecting portion 66) connecting the adjacent first external connecting terminal 61 and the third external connecting terminal 63 is physically cut off, thereby cutting off the electrical connection between the adjacent first external connecting terminal 61 and the third external connecting terminal 63, making the first external connecting terminal 61 electrically independent of the third external connecting terminal 63 (cutting process). The groove formed in the third ceramic layer 13 by irradiation with the energy beam is formed at a position overlapping with the groove 11B of the first ceramic layer 11 in a plan view.

[0105] Next, in each base 10, the piezoelectric vibrating piece 101 is housed in the first cavity 18 of the base 10. At this time, the characteristics such as the frequency are measured in the base 10 in the state where the piezoelectric vibrating piece 101 is housed in the first cavity 18. Next, in each base 10, the opening of the upper surface of the first ceramic layer 11 constituting the sheet substrate 1 is closed by the cover 103, and the thermistor 102 is housed in the second cavity 19 of the base 10. Next, the piezoelectric vibrating device 100 including the base 10, the piezoelectric vibrating piece 101, the thermistor 102, and the cover 103 is separated into individual pieces by using the grooves 11A and 11B formed in the upper surface of the first ceramic layer 11, the groove 13B formed in the lower surface of the third ceramic layer 13, and the groove formed by irradiation with the energy beam.

[0106] According to the above-described embodiment, in the cutting step, the connecting portion (the connecting portion composed of the first connecting portion 65 extending from the first external connecting terminal 61 and the second connecting portion 66 extending from the third external connecting terminal 63) electrically connecting the first external connecting terminal 61 as one piezoelectric vibrating piece and the third external connecting terminal 63 as the first external connecting terminal are cut by the energy beam in the adjacent base 10, thereby cutting off the electrical connection between the first external connecting terminal 61 and the third external connecting terminal 63, thereby making the first external connecting terminal 61 electrically independent. Thus, even in the sheet substrate 1 in which a plurality of (nine in the present embodiment) bases 10 are connected integrally, the characteristics of the piezoelectric vibrating device 100 can be measured while suppressing the influence of other bases 10 by bringing the measurement probe into contact with the first external connecting terminal 61 and the second external connecting terminal 62 electrically connected to the piezoelectric vibrating piece 101 in each base 10.

[0107] In addition, the second external connection terminal 62 of the base 10 is not electrically connected to the first external connection terminal 61 to the fourth external connection terminal 64 of the other bases 10 on the lower surface of the third ceramic layer 13 (the outer bottom surface of the sheet substrate 1), so that the area irradiated with the energy beam during the cutting process can be suppressed to Figure 2 The dotted line depicted in FIG. 8 includes a portion including a connection portion formed by the adjacent first connection portion 65 and second connection portion 66 .

[0108] In addition, the first external connection terminal 61 to the fourth external connection terminal 64 are usually formed by stacking a plating layer on a metallization layer that becomes a base metal layer. Assuming that the first external connection terminal 61 to the fourth external connection terminal 64 are respectively formed in a manner that the outer periphery of the outer bottom surface of the base 10 is not separated inward when viewed from above, when an energy beam is irradiated along the boundary between adjacent bases 10 to cut off the boundaries between the connected external connection terminals (61 to 64), the plating layer in the portion of the boundary of the external connection terminals (61 to 64) is scraped off. If the plating layer is scraped off, the base metal layer covered by the plating layer is exposed to the outside, so depending on the type of the base metal layer, it is sometimes not preferred in terms of environmental resistance. For example, if the base metal layer is a molybdenum metallization layer, it is easily corroded by hot water, etc. Since the first external connection terminals 61 to 64 are formed to be separated inward from the outer periphery of the outer bottom surface of the base 10 in a plan view, interference between the energy beam and the first to fourth external connection terminals 61 to 64 can be eliminated, thereby preventing the above-mentioned problem from occurring.

[0109] Furthermore, by the electroplating method, the plurality of first to fourth external connection terminals 61 to 64 formed on the outer bottom surface of the sheet substrate 1 can be formed at once.

[0110] Furthermore, by irradiating the energy beam along the shape of the base 10, the first external connection terminal 61 and the third external connection terminal 63 of the adjacent base 10 can be reliably cut off, thereby cutting off the electrical connection between the first external connection terminal 61 and the third external connection terminal 63, and at the same time, the boundary portion of the adjacent base 10 can be thinned. Alternatively, the portion can be cut off.

[0111] Compared with a tool such as a blade cutting, the energy beam has excellent production efficiency because it does not require replacement of parts corresponding to the replacement of the tool due to the wear of the blade. In addition, compared with blade cutting, the cutting tolerance can be reduced. As a result, the number of piezoelectric vibrating devices that can be obtained from one sheet substrate increases. In addition, by using a cutting device that uses an energy beam as a cutting unit, even a small area can be reliably cut.

[0112] Furthermore, since the characteristics of each piezoelectric vibration device 100 can be measured in a state where a plurality of piezoelectric vibration devices 100 are connected, it is possible to obtain a piezoelectric vibration device 100 having excellent characteristics.

[0113] [Variation of Embodiment 1]

[0114] Next, refer to Figures 10 to 12 , a method for manufacturing a piezoelectric vibration device according to a modified example of an embodiment of the present invention, a piezoelectric vibration device manufactured by the manufacturing method, and a sheet substrate used in the manufacturing method are described with reference to the drawings. Fig.10 It is a schematic plan view of the upper surface side of the second ceramic layer 12A constituting the sheet substrate 1A in a modified example of the embodiment of the present invention. Fig.11 It is a schematic plan view (perspective view) of the lower surface side of the second ceramic layer 12A constituting the sheet substrate 1A. Fig.12 1 is a schematic top view (perspective view) of the lower surface side of the third ceramic layer 13A constituting the sheet substrate 1A. The sheet substrate 1A is different in that both the first external connection terminal 61 and the second external connection terminal 62, which are a pair of external connection terminals for the piezoelectric vibrating piece, are connected to the external connection terminal. In addition, Figures 10 to 12 The same English letters [A], [B], [C], and [D] in the figure are shown for easy understanding of the corresponding positions. Figures 10 to 12 In the embodiment, the plurality of bases 10 formed in a matrix on the sheet substrate 1A have the same structure. Figures 10 to 12 Some of the reference numerals are omitted.

[0115] The sheet substrate 1A as a modified example of the embodiment of the present invention is a ceramic laminate composed of three layers including a first ceramic layer 11, a second ceramic layer 12A, and a third ceramic layer 13A, wherein the third ceramic layer 13A, the second ceramic layer 12A, and the first ceramic layer 11 are laminated in this order. In the sheet substrate 1A, the grooves 11A and 11B (see FIG. 1 ) are formed in a plan view. Figure 1 ) are each formed as one base 10. The first ceramic layer 11, the second ceramic layer 12A and the third ceramic layer 13A are formed in a matrix of three rows and three columns of bases 10, but the matrix may also be formed in other structures.

[0116] The first ceramic layer 11 has a rectangular outer periphery in a plan view, and the through holes 16 in a rectangular shape in a plan view are formed in a matrix (see Figure 4 ). The second ceramic layer 12A and the third ceramic layer 13A are rectangular flat plates in a plan view. Therefore, each base 10 of the sheet substrate has the upper surface of the second ceramic layer 12A as the bottom surface and is formed with a first cavity 18 surrounded by the first ceramic layer 11 having the through hole 16. In this embodiment, the piezoelectric vibrating piece 101 is accommodated in the first cavity 18 (see Fig.13 ).

[0117] like Fig.10As shown in the figure, in each base 10, a pair of first electrode pads 25 and second electrode pads 26 are located on the upper surface of the second ceramic layer 12A. The pair of first electrode pads 25 and second electrode pads 26 are arranged along the short side direction on one short side of the base 10 which is rectangular in a plan view. In addition, an electrode pad wiring pattern 31 extending from the first electrode pad 25 in the long side direction is located on the upper surface of the second ceramic layer 12A. The electrode pad wiring pattern 31 is electrically connected to the first electrode pad 25.

[0118] In addition, on the upper surface of the second ceramic layer 12A, the second to fourth through-hole connection electrodes 28a to 30a are formed near the corners of each base 10. The electrode pad wiring pattern 31, the second through-hole connection electrode 28a, and the second through-hole electrode 28b penetrating the second ceramic layer 12A are connected and electrically connected. On the upper surface of the second ceramic layer 12A, the third through-hole electrode 29b penetrating the second ceramic layer 12A and the third through-hole connection electrode 29a are located at a position where the first electrode pad 25, the second electrode pad 26, and the electrode pad wiring pattern 31 are not electrically connected. The second electrode pad 26, the fourth through-hole connection electrode 30a, and the fourth through-hole electrode 30b penetrating the second ceramic layer 12A are connected and electrically connected.

[0119] like Fig.11 As shown, on the lower surface of the second ceramic layer 12A, each base 10 has a first wiring pattern 43A extending from the long side of the [A]-[B] side toward the short side of the [A]-[D] side in a plan view. In addition, on the lower surface of the second ceramic layer 12A, each base 10 has a second wiring pattern 44A extending from the long side of the [D]-[C] side toward the short side of the [B]-[C] side in a plan view.

[0120] The end of the first wiring pattern 43A on the [A]-[D] side and the base 10 ( Fig.11 The end of the second wiring pattern 44A on the [B]-[C] side of the base 10 located on the left side relative to the base 10 (hereinafter referred to as "the fourth adjacent base 10") is connected. In addition, the end of the first wiring pattern 43A on the [A]-[B] side is connected to the base 10 ( Fig.11 The end portion on the [D]-[C] side of the second wiring pattern 44A of the base 10 located on the upper side relative to the base 10 (referred to as “the first adjacent base 10” herein) is connected.

[0121] The end of the second wiring pattern 44A on the [D]-[C] side and the base 10 ( Fig.11The end of the first wiring pattern 43A on the [A]-[B] side of the base 10 located below the base 10 is connected to the base 10 (hereinafter referred to as the "third adjacent base 10"). In addition, the end of the second wiring pattern 44A on the [B]-[C] side is connected to the base 10 ( Fig.11 The end portion on the [A]-[D] side of the first wiring pattern 43A is connected to the base 10 located on the right side relative to the base 10: herein described as "the second adjacent base 10").

[0122] The first wiring pattern 43A of the base 10 and the second wiring pattern 44A of the first adjacent base 10 form a wiring pattern that straddles the boundary between the base 10 and the first adjacent base 10. The second wiring pattern 43A of the base 10 and the second wiring pattern 44A of the fourth adjacent base 10 form a wiring pattern that straddles the boundary between the base 10 and the fourth adjacent base 10. The second wiring pattern 44A of the base 10 and the first wiring pattern 43A of the second adjacent base 10 form a wiring pattern that straddles the boundary between the base 10 and the second adjacent base 10. The second wiring pattern 44A of the base 10 and the first wiring pattern 43A of the third adjacent base 10 form a wiring pattern that straddles the boundary between the base 10 and the third adjacent base 10.

[0123] On the lower surface of the second ceramic layer 12A, the first through-hole connection electrode 46 is formed at a position overlapping with the first wiring pattern 43A in a plan view for each base 10. The first through-hole connection electrode 46 is electrically connected to the first wiring pattern 43A. On the lower surface of the second ceramic layer 12, the second through-hole connection electrode 47 is formed at a position overlapping with the second through-hole electrode 28b in a plan view for each base 10. The second through-hole connection electrode 47 is electrically connected to the second through-hole electrode 28b. On the lower surface of the second ceramic layer 12, the third through-hole connection electrode 48 is formed at a position overlapping with the second wiring pattern 44A in a plan view and overlapping with the third through-hole electrode 29b in a plan view for each base 10. The third through-hole connection electrode 48 is electrically connected to the second wiring pattern 44. The third through-hole connection electrode 48 is electrically connected to the third through-hole electrode 29b. On the lower surface of the second ceramic layer 12, a fourth through-hole connection electrode 49 is formed at a position overlapping with the fourth through-hole electrode 30b in a plan view for each base 10. The fourth through-hole connection electrode 49 is electrically connected to the fourth through-hole electrode 30b.

[0124] On the upper surface of the third ceramic layer 13A, there are first through-hole connection electrodes 51a and 51b, second through-hole connection electrodes 52a and 52b, third through-hole connection electrodes 53a and 53b, and fourth through-hole connection electrodes 54a and 54b (see FIG. 1 ). Figure 7). The first through-hole connection electrode 51a is electrically connected to the first through-hole connection electrode 46. The second through-hole connection electrode 52a is electrically connected to the second through-hole connection electrode 47. The third through-hole connection electrode 53a is electrically connected to the third through-hole connection electrode 48. The fourth through-hole connection electrode 54a is electrically connected to the fourth through-hole connection electrode 49.

[0125] like Fig.12 As shown, on the lower surface of the third ceramic layer 13A, in each base 10, a pair of first external connection terminals 61 and second external connection terminals 62A are located on the diagonal line of the base 10 in a plan view. The first external connection terminal 61 and the second through-hole electrode 52b (see FIG. 5A ) formed on the upper surface of the third ceramic layer 13A are connected to each other. Figure 7 The second external connection terminal 62A is electrically connected to the fourth through-hole electrode 54b (see Figure 7 )Electrical connection.

[0126] Furthermore, on the lower surface of the third ceramic layer 13A, the third external connection terminal 63 and the fourth external connection terminal 64A are located on the diagonal line of the base 10 in a plan view. The third external connection terminal 63 and the first through-hole electrode 51b (see FIG. 1 ) formed on the upper surface of the third ceramic layer 13A are connected to each other. Figure 7 The fourth external connection terminal 64A is electrically connected to the third through-hole electrode 53b (see Figure 7 )Electrical connection.

[0127] In the present embodiment, the pair of first external connection terminals 61 and the second external connection terminals 62A are mounted on the pair of first electrode pads 25 and the second electrode pads 26 (see FIG. 1 ) formed on the upper surface of the second ceramic layer 12A. Fig.10 ) of the piezoelectric vibrating piece 101 (see Fig.13 ) is a pair of piezoelectric vibrating piece external connection terminals electrically connected to the outside. The first external connection terminal 61 as a piezoelectric vibrating piece external connection terminal is connected to the second through-hole electrode 52b formed on the upper surface of the third ceramic layer 13A, the second through-hole connection electrode 52a formed on the upper surface of the third ceramic layer 13A, and the second through-hole connection electrode 47 formed on the lower surface of the second ceramic layer 12A (see Fig.11 ), the second through-hole electrode 28b formed on the upper surface of the second ceramic layer 12A (see Fig.10 ), the electrode pad wiring pattern 31 formed on the upper surface of the second ceramic layer 12A is connected to the first electrode pad 25. The second external connection terminal 62A as another external connection terminal for the piezoelectric vibrating piece is connected to the first electrode pad 25 via the fourth through-hole electrode 54b formed on the upper surface of the third ceramic layer 13A and the fourth through-hole connection electrode 54a formed on the upper surface of the third ceramic layer 13A (see Figure 7 ), a fourth through-hole connection electrode 49 formed on the lower surface of the second ceramic layer 12A (see Fig.11 ), a fourth through-hole electrode 30b formed on the upper surface of the second ceramic layer 12A, and a fourth through-hole connecting electrode 30a formed on the upper surface of the second ceramic layer 12A (see Fig.10 ) and connected to the second electrode pad 26.

[0128] On the lower surface of the third ceramic layer 13A, in each base 10, a pair of external connection terminals, i.e., a pair of third external connection terminals 63 and a fourth external connection terminal 64A, which are external connection terminals for a pair of piezoelectric vibrating pieces, are formed apart from the outer periphery of the base 10 in a plan view. The pair of third external connection terminals 63 and the fourth external connection terminal 64A are arranged in a diagonal positional relationship in the rectangular base 10. The third external connection terminal 63 is electrically connected to the first through-hole electrode 51b formed in the third ceramic layer 13A. The fourth external connection terminal 64A is electrically connected to the third through-hole electrode 53b formed on the upper surface of the third ceramic layer 13A.

[0129] The third external connection terminal 63 is connected to the first wiring pattern 43A formed on the lower surface of the second ceramic layer 12 via the first through-hole electrode 51b formed on the upper surface of the third ceramic layer 13A and the first through-hole connection electrode 51a formed on the upper surface of the third ceramic layer 13A. The fourth external connection terminal 64A is connected to the third through-hole electrode 53b formed on the upper surface of the third ceramic layer 13A, the third through-hole connection electrode 53a formed on the upper surface of the third ceramic layer 13A, the third through-hole connection electrode 48 formed on the lower surface of the second ceramic layer 12A, the second wiring pattern 44A formed on the lower surface of the second ceramic layer 12A, and the first through-hole electrode 22 penetrating the first ceramic layer 11.

[0130] On the lower surface of the third ceramic layer 13A, a first connection portion 65 (one connection portion) extending from the first external connection terminal 61 is formed in each base 10 . The first connection portion 65 extends to the short side on the [B]-[C] side of the rectangular base 10 in a plan view.

[0131] On the lower surface of the third ceramic layer 13A, a second connection portion 66 extending from the third external connection terminal 63 is formed for each base 10 . The second connection portion 66 extends to the short side on the [D]-[A] side of the base 10 which is rectangular in a plan view.

[0132] The first connection portion 65 of the base 10 and the base 10 ( Fig.12The second connecting portion 66 of the base 10 located on the right side relative to the base 10 (hereinafter referred to as "the second adjacent base 10") is electrically connected. The second connecting portion 66 of the base 10 and the base 10 ( Fig.12 The first connecting portion 65 of the base 10 located on the left side relative to the base 10 (referred to as the "fourth adjacent base 10" herein) is electrically connected.

[0133] On the lower surface of the third ceramic layer 13A, a third connection portion 67 (the other connection portion) extending from the second external connection terminal 62A is formed in each base 10, and the third connection portion 67 extends to the short side of the [A]-[D] side of the base 10 which is rectangular in plan view. When the length D1 of the third connection portion 67 in the direction from [C] to [D] is compared with the length D2 of the second external connection terminal 62A in the direction from [C] to [D], D1<D2. The third connection portion 67 extends from the second external connection terminal 62A in a manner other than the vicinity of the corner of the base 10 (the corner on the [D] side of the base 10).

[0134] On the lower surface of the third ceramic layer 13A, a fourth connection portion 68 extending from the fourth external connection terminal 64A is formed in each base 10, and the fourth connection portion 68 extends to the short side of the base 10 on the [B]-[C] side in a rectangular shape when viewed from above. When the length D1 of the fourth connection portion 68 in the direction from [D] to [C] is compared with the length D2 of the fourth external connection terminal 64A in the direction from [D] to [C], D1<D2. The fourth connection portion 68 extends from the fourth external connection terminal 64A in a manner other than near the corner of the base 10 (the corner on the [C] side of the base 10).

[0135] The third connection portion 67 of the base 10 and the base 10 ( Fig.12 The third connection portion 67 of the base 10 and the fourth connection portion 68 of the fourth adjacent base 10 are connected to the fourth connection portion 68 of the base 10 located on the left side relative to the base 10 in the figure: described herein as "the fourth adjacent base 10"). The third connection portion 67 of the base 10 and the fourth connection portion 68 of the fourth adjacent base 10 span the boundary between the base 10 and the fourth adjacent base 10, forming the other connection portion that electrically connects the second external connection terminal 62A, which is the external connection terminal of the other piezoelectric vibrating piece of the base 10, and the fourth external connection terminal 64A, which is the second external connection terminal of the fourth adjacent base 10 as the second base 10. That is, the second external connection terminal 62A of the base 10 and the fourth external connection terminal 64A of the fourth adjacent base 10 are connected and electrically connected via the third connection portion 67 and the fourth connection portion 68 on the lower surface of the third ceramic layer 13A (the outer bottom surface of the sheet substrate 1A).

[0136] The fourth connection portion 68 of the base 10 and the base 10 ( Fig.12 The fourth connection portion 68 of the base 10 and the third connection portion 67 of the second adjacent base 10 are connected to each other across the boundary between the base 10 and the second adjacent base 10, forming another connection portion that electrically connects the fourth external connection terminal 64A, which is the second external connection terminal of the base 10, and the second external connection terminal 62A, which is the external connection terminal for another piezoelectric vibrating piece of the second adjacent base 10. That is, the fourth external connection terminal 64A of the base 10 and the second external connection terminal 62A of the second adjacent base 10 are connected and electrically connected via the connection portion on the lower surface of the third ceramic layer 13A (the outer bottom surface of the sheet substrate 1A).

[0137] The first external connection terminal 61 is an external connection terminal for a piezoelectric vibrating piece of the base 10, and the base 10 ( Fig.12 The first external connection terminal of the base 10 located on the right side relative to the base 10, that is, the third external connection terminal 63 is connected and electrically connected.

[0138] The second external connection terminal 62A, which is another external connection terminal for the piezoelectric vibrating piece of the base 10, and the base 10 ( Fig.12 The second external connection terminal of the base 10 located on the left side relative to the base 10, that is, the fourth external connection terminal 64A is connected and electrically connected.

[0139] The first external connection terminal of the base 10, that is, the third external connection terminal 63, and the base 10 ( Fig.12 A piezoelectric vibrating piece of the base 10 located on the left side relative to the base 10 is electrically connected to the first external connection terminal 61 which is an external connection terminal.

[0140] The fourth external connection terminal 64 of the second external connection terminal of the base 10 and the base 10 ( Fig.12 Another piezoelectric vibrating piece of the base 10 (located on the right side relative to the base 10) is electrically connected to the fourth external connection terminal 64A, which is an external connection terminal.

[0141] Next, use Fig.13, a configuration of a piezoelectric vibration device 100A manufactured by a method for manufacturing a piezoelectric vibration device according to a modified example of the first embodiment will be described. Fig.13 It is a schematic cross-sectional view of a piezoelectric vibration device 100A according to a modified example of the embodiment.

[0142] like Fig.13 As shown, the piezoelectric vibration device 100A includes: a base 10 ; a piezoelectric vibration piece 101 accommodated in a first cavity 18 of the base 10 ; and a cover 103 for airtightly sealing the piezoelectric vibration piece 101 accommodated in the first cavity 18 of the base 10 .

[0143] The pair of electrodes of the piezoelectric vibrating piece 101 housed in the first cavity 18 are mechanically and electrically connected to a pair of electrode pads (first electrode pad 25 and second electrode pad 26 ) of the base 10 using a conductive bonding portion 104 such as a metal bump or a conductive adhesive.

[0144] Next, use the reference Figures 10 to 12 The following describes a method for manufacturing a piezoelectric vibration device according to the present embodiment, which manufactures the piezoelectric vibration device 100 using the sheet substrate 1A described above. The method for manufacturing a piezoelectric vibration device includes a cutting step.

[0145] First, after forming molybdenum metallization layers on the first ceramic layer 11, the second ceramic layer 12A, and the third ceramic layer 13A, the first ceramic layer 11, the second ceramic layer 12A, and the third ceramic layer 13A are stacked. Next, grooves 11A and 11B are formed on the upper surface of the first ceramic layer 11 by metal scribing, laser scribing, etc. (see Figure 1 ), a groove 13B is formed on the lower surface of the third ceramic layer 13A by metal scribing, laser scribing, etc. (refer to Figure 2 ). Next, the first to third ceramic layers 11 to 13A are fired and a nickel-plated layer is stacked on the molybdenum metallization layer by electroplating, and a gold-plated layer is further stacked on the nickel-plated layer by electroplating. In this way, the sheet substrate 1A is manufactured.

[0146] Next, an energy beam (laser beam, electron beam, etc.) is irradiated to the lower surface of the third ceramic layer 13A constituting the sheet substrate 1A along the boundary between adjacent bases 10. Thus, the boundary between adjacent bases 10 along the lower surface of the third ceramic layer 13A (see Fig.12The first external connection terminal 61 and the third external connection terminal 63 are connected to each other by forming a groove (the dotted line), and the connection portion connecting the adjacent first connection terminal 61 and the third external connection terminal 63 (the connection portion formed by the adjacent first connection portion 65 and the second connection portion 66) and the connection portion connecting the adjacent second external connection terminal 62A and the fourth external connection terminal 64A (the connection portion formed by the adjacent third connection portion 67 and the fourth connection portion 68) are physically cut off. Thus, the electrical connection between the adjacent first external connection terminal 61 and the third external connection terminal 63, and the second external connection terminal 62A and the fourth external connection terminal 64A is cut off, so that the first external connection terminal 61 and the third external connection terminal 63, and the second external connection terminal 62A and the fourth external connection terminal 64A are electrically independent (cutting process).

[0147] The sheet substrate 1A formed by integrally connecting a plurality of (nine in the present embodiment) bases 10 thus constructed can measure the characteristics of the piezoelectric vibration device 100 while suppressing the influence of other bases 10 by bringing the measurement probe into contact with the first external connection terminal 61 and the second external connection terminal 62A in each base 10 that are electrically connected to the piezoelectric vibration piece 101.

[0148] In addition, the manufacturing method of the piezoelectric vibration device, the piezoelectric vibration device manufactured by the manufacturing method, and the sheet substrate used in the manufacturing method are not limited to the manufacturing method of the piezoelectric vibration device, the piezoelectric vibration device 100 manufactured by the manufacturing method, and the sheet substrates 1 and 1A used in the manufacturing method described above, but various changes can be made.

[0149] For example, in the above embodiment, the second external connection terminal 62 of the base 10 is not connected to any external connection terminal (the first external connection terminal 61 to the fourth external connection terminal 64A) of any base 10 adjacent to the base 10 on the lower surface of the third ceramic layer 13A (the outer bottom surface of the sheet substrate 3), but this is not limited to this, and for example, it may be as follows. The second external connection terminal 62A of the base 10 may also be connected to the lower surface of the third ceramic layer 13A (the outer bottom surface of the sheet substrate 1A) and the base 10 ( Figure 8The fourth external connection terminal 64A of the base 10 located on the left side relative to the base 10 in the sheet substrate 1A (hereinafter referred to as "the fourth adjacent base 10") is electrically connected. This electrical connection can also be achieved by forming a connection portion (a connection portion formed in the same manner as the connection portion formed by the first connection portion 65 and the second connection portion 66 connected thereto) on the lower surface of the third ceramic layer 13A (the outer bottom surface of the sheet substrate 1A) that crosses the boundary between the base 10 and the fourth adjacent base 10 and connects the second external connection terminal 62A of the base 10 to the fourth external connection terminal 64A of the fourth adjacent base 10. In this case, the electrical connection between the first external connection terminal 61 of the base 10 and the third external connection terminal 63 of the base 10 on the [B]-[C] side of the base 10 can be cut off in the cutting step, and the electrical connection between the second external connection terminal 62A of the base 10 and the fourth external connection terminal 64A of the fourth adjacent base 10 can be cut off. In this way, even in a sheet substrate 1A in which a plurality of bases 10 are integrally connected, the characteristics of the piezoelectric vibration device can be measured while suppressing the influence of other bases by making the measurement probe contact a pair of external connection terminals (the first external connection terminal 61 and the second external connection terminal 62A) in each base 10 that are electrically connected to the piezoelectric vibration piece.

[0150] In the above-described embodiment, an energy beam is used to cut the connection portion formed by the adjacent first connection portion 65 and second connection portion 66 , but the present invention is not limited thereto, and for example, a cutter or the like may be used.

[0151] In the above embodiment, Figure 2 The energy beam is irradiated to all the dotted lines depicted in the figure, but it is not limited to this. For example, it is also possible to irradiate only the Figure 2 A portion of the dotted line drawn in FIG. 1 including a connection portion formed by the adjacent first connection portion 65 and second connection portion 66 is irradiated with an energy beam to physically cut the connection portion.

[0152] In the above-described embodiment, in the third ceramic layer 13, the piezoelectric vibrating piece external connection terminals (a pair of first external connection terminals 61, second external connection terminals 62A) and the external connection terminals (a pair of third external connection terminals 63, fourth external connection terminals 64A) are electrically connected respectively through the connection portions formed by the adjacent first connection portions 65 and second connection portions 66 and the adjacent first connection portions 67 and second connection portions 68. However, it is also possible to form the external connection terminals in the third ceramic layer so as to span the portion where the separation groove is not formed between the adjacent bases. That is, it is also possible to form the external connection terminals in the third ceramic layer so as to span the portion where the separation groove is not formed between the adjacent bases. Fig.12 The configuration shown is that the adjacent external connection terminals of the adjacent bases are not connected to each other via the connection portion.

[0153] In the above embodiment, in the third ceramic layer 13, the piezoelectric vibrating piece external connection terminals (a pair of first external connection terminals 61, second external connection terminals 62A) and the external connection terminals (a pair of third external connection terminals 63, fourth external connection terminals 64A) are electrically connected respectively through the connection portions formed by the adjacent first connection portions 65 and second connection portions 66 and the adjacent first connection portions 67 and second connection portions 68. However, it is also possible to form the external connection terminals in the third ceramic layer in such a manner that they span across four adjacent bases in a state where one corner is shared by each other. That is, it is also possible to form the configuration in which the adjacent external connection terminals in the four adjacent bases in a state where one corner is shared by each other are connected to each other without a connection portion.

[0154] In the above embodiment, the thermistor 102 built-in type piezoelectric vibration device 100 accommodating a piezoelectric vibration reed and a thermistor is used as an object, but the content of the above embodiment can be applied to a piezoelectric vibration device accommodating only a piezoelectric vibration reed.

[0155] In the above embodiment, the element mounted together with the piezoelectric vibrating piece 101 is the thermistor 102 , but the present invention is not limited thereto and may be other temperature sensors such as a diode or an integrated circuit element (IC element) constituting an oscillation circuit together with the piezoelectric vibrating piece 101 .

[0156] In the variation of the first embodiment, a piezoelectric vibrator in which only the piezoelectric vibrating piece 101 is housed in the first cavity 18 is exemplified. However, the present invention is not limited to the piezoelectric vibrator and can also be applied to a piezoelectric oscillator that houses an integrated circuit element (IC element) that forms an oscillation circuit together with the piezoelectric vibrating piece 101.

[0157] In the above embodiment, the structure of the base 10 (package structure) is set to be an H-shaped structure in cross-section, but it is not limited to this. For example, it can also be a box-shaped structure in cross-section with a cavity 18 opened only at the top as in the modified example of embodiment 1. In addition, it can also be a piezoelectric vibration device configured as follows: the base 10 is set to be flat, a piezoelectric vibrator and other electronic components (for example, an IC that constitutes an oscillation circuit together with the piezoelectric vibrator) are mounted on the main surface side of one side of the substrate, and the piezoelectric vibrator and other electronic components mounted on the main surface side of one side of the substrate are molded in a manner such that they are covered with resin.

[0158] The piezoelectric vibration element 100A of the modified example of the first embodiment in which only one main surface of the base 10 is open is accommodated in the first cavity 18. However, the piezoelectric vibration element may be configured to include a thermistor, an integrated circuit, etc., together with the piezoelectric vibration element.

[0159] The piezoelectric vibration piece 101 accommodated in the base 10 in the above-mentioned embodiment may be, for example, a flat piezoelectric vibration plate, a piezoelectric vibration plate with a table structure (a structure in which the central portion is thicker than the outer periphery), or a piezoelectric vibration plate with an inverted table structure (a structure in which the central portion is thinner than the outer periphery). In addition, a piezoelectric vibration plate (a framed piezoelectric vibration plate) may be formed in an integral structure including a vibration portion (a region in which an excitation electrode is formed), an outer frame portion that surrounds the vibration portion with a gap therebetween and is thicker than the vibration portion, and a connection portion connecting the vibration portion and the outer frame portion. The shape of the vibration portion may be, for example, a rectangle (AT cut, SC cut, etc.) or a tuning fork shape (BT cut).

[0160] In the above embodiment, the piezoelectric vibrating piece 101 is accommodated in the base 10, but the present invention is not limited thereto, and for example, a piezoelectric vibrator whose vibrating portion is hermetically sealed may be accommodated in the base 10. The piezoelectric vibrator has, for example, a structure in which three crystals are stacked (a structure in which a flat-plate-shaped sealing member is bonded to the front and back surfaces of a crystal vibrating plate integrally formed in such a manner that the periphery of the vibrating portion is surrounded by a frame).

[0161] In the above embodiment, the first external connection terminal 61 and the third external connection terminal 63 are connected by the connection portion formed by the first connection portion 65 and the second connection portion 66, and the second external connection terminal 62A and the fourth external connection terminal 64A are connected by the connection portion formed by the third connection portion 67 and the fourth connection portion 68. However, it is also possible to have a configuration in which the first external connection terminal, the second external connection terminal, the third external connection terminal, and the fourth external connection terminal are connected. In other words, any connection method can be used as long as the first external connection terminal, the second external connection terminal, the third external connection terminal, and the fourth external connection terminal are electrically connected.

[0162] Furthermore, the contents of the above-described embodiment and the contents of the modified examples may be appropriately combined.

[0163] Industrial Applicability

[0164] The present invention can be widely applied to a method for manufacturing a piezoelectric vibration device for manufacturing a piezoelectric vibration device, a piezoelectric vibration device manufactured by the manufacturing method, and a sheet substrate used in the manufacturing method.

[0165] Description of Reference Numerals

[0166] 1. 1A sheet substrate

[0167] 10 Base

[0168] 111st ceramic layer

[0169] Slots 11A, 11B, 13B

[0170] 12. 12A Second ceramic layer

[0171] 13. 13A The third ceramic layer

[0172] 16, 17 through holes

[0173] 18 Chambers

[0174] 19 Chamber 2

[0175] 21 metal layers

[0176] 22 electrodes

[0177] 25 1st electrode pad

[0178] 26 2nd electrode pad

[0179] 27a~30a, 36, 46~49 through-hole connection electrodes

[0180] 51a~54a through-hole connection electrode

[0181] 27b~30b through-hole electrode

[0182] 31 Wiring pattern for electrode pad

[0183] 37 Supporting part

[0184] 41 1st electrode pad

[0185] 42 2nd electrode pad

[0186] 43, 43A 1st wiring pattern

[0187] 44, 44A Second wiring pattern

[0188] 45 3rd wiring pattern

[0189] 611st external connection terminal

[0190] 62, 62A 2nd external connection terminal

[0191] 63 3rd external connection terminal

[0192] 64, 64A 4th external connection terminal

[0193] 651st connection

[0194] 66 Second connection

[0195] 67 3rd connection

[0196] 68 4th connection

[0197] 100, 100A piezoelectric vibration device

[0198] 102 Thermistor

[0199] 103 Cover

[0200] 104 conductive joint

[0201] 105 solder.

Claims

1. A method for manufacturing a piezoelectric vibration device, comprising: manufacturing a plurality of piezoelectric vibration devices by using a sheet substrate formed by connecting a plurality of rectangular bases in a matrix shape and accommodating at least piezoelectric vibration pieces, wherein: A plurality of external connection terminals are formed on the outer bottom surface of each of the bases, the plurality of external connection terminals including a pair of external connection terminals for piezoelectric vibration pieces for electrically connecting the piezoelectric vibration piece accommodated in the base to the outside of the base. On the outer bottom surface of the sheet substrate, one of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the plurality of bases is electrically connected to a first external connection terminal of the plurality of external connection terminals of a first base, the first base being a base adjacent to the specified base among the plurality of bases, The manufacturing method of the piezoelectric vibration device includes a cutting step of cutting the electrical connection between the one piezoelectric vibration piece external connection terminal and the first external connection terminal in the sheet substrate by using a cutting device, thereby making the one piezoelectric vibration piece external connection terminal electrically independent from the first external connection terminal.

2. The method for manufacturing a piezoelectric vibration device according to claim 1, wherein: On the outer bottom surface of the sheet substrate, the other of the pair of piezoelectric vibrating piece external connection terminals of the predetermined mount is not electrically connected to any of the plurality of external connection terminals of any mount adjacent to the predetermined mount among the plurality of mounts.

3. The method for manufacturing a piezoelectric vibration device according to claim 1, wherein: On the outer bottom surface of the sheet substrate, the other of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the plurality of bases is electrically connected to a second of the plurality of external connection terminals of a second base, the second base being a base adjacent to the specified base among the plurality of bases, In the cutting step, in the sheet substrate, the electrical connection between the other piezoelectric vibrating reed external connection terminal and the second external connection terminal is cut using a cutting device, thereby making the other piezoelectric vibrating reed external connection terminal electrically independent from the second external connection terminal.

4. The method for manufacturing a piezoelectric vibration device according to claim 1, wherein: The plurality of external connection terminals of each of the bases are formed to be separated from the inner side of the base relative to the outer peripheral edge of the outer bottom surface of the base in a plan view. A connection portion is formed on the outer bottom surface of the sheet substrate, and the connection portion physically and electrically connects one of the pair of piezoelectric vibrating piece external connection terminals of the prescribed base and the first external connection terminal of the first base by crossing the boundary between the prescribed base and the first base.

5. The method for manufacturing a piezoelectric vibration device according to claim 3, wherein: The plurality of external connection terminals of each of the bases are formed to be separated from the inner side of the base relative to the outer peripheral edge of the outer bottom surface of the base in a plan view. A connection portion is formed on the outer bottom surface of the sheet substrate, and the connection portion crosses the boundary between the predetermined base and the first base to physically and electrically connect one of the pair of piezoelectric vibrating piece external connection terminals of the predetermined base and the first external connection terminal of the first base, Another connection portion is formed, which physically and electrically connects the other piezoelectric vibration piece external connection terminal of the pair of piezoelectric vibration piece external connection terminals of the specified base and the second external connection terminal of the second base by crossing the boundary between the specified base and the second base.

6. The method for manufacturing a piezoelectric vibration device according to claim 4, wherein: A connection portion is not formed on the outer bottom surface of the sheet substrate, and the connection portion physically and electrically connects the other piezoelectric vibration piece external connection terminal of the pair of piezoelectric vibration piece external connection terminals of the specified base to any one of the multiple external connection terminals of the any one base by crossing the boundary between the specified base and any one of the multiple bases adjacent to the specified base.

7. The method for manufacturing a piezoelectric vibration device according to any one of claims 1 to 3, wherein: The sheet substrate is a laminate having a plurality of layers, the plurality of layers including a layer having the plurality of external connection terminals of each of the bases formed on its outer bottom surface, and one or more layers laminated on a surface opposite to the outer bottom surface of the layer. Between stacked layers of the plurality of layers, a wiring pattern is formed that straddles a boundary between the predetermined base and a base adjacent to the predetermined base among the plurality of bases.

8. The method for manufacturing a piezoelectric vibration device according to claim 4 or 6, wherein: The sheet substrate is a laminate having a plurality of layers, the plurality of layers including a layer having the plurality of external connection terminals of each of the bases formed on its outer bottom surface, and one or more layers laminated on a surface opposite to the outer bottom surface of the layer. A wiring pattern is formed between stacked layers in the plurality of layers, straddling a boundary between the predetermined base and a base adjacent to the predetermined base among the plurality of bases. The other of the pair of piezoelectric vibrating piece external connection terminals of the predetermined mount is electrically connected to a second external connection terminal of a second mount adjacent to the predetermined mount among the plurality of mounts through the wiring pattern.

9. The method for manufacturing a piezoelectric vibration device according to any one of claims 4 to 6, wherein: The cutting step physically cuts at least the connection portion along a boundary between the predetermined base and the first base.

10. The method for manufacturing a piezoelectric vibration device according to any one of claims 1 to 3, wherein: The cutting device is a device using an energy beam.

11. A piezoelectric vibration device, characterized in that: The piezoelectric vibration device is manufactured by the method for manufacturing the piezoelectric vibration device according to any one of claims 1 to 3.

12. A sheet substrate, wherein a plurality of rectangular bases each containing at least a piezoelectric vibrating piece are connected in a matrix and integrally formed, wherein: A plurality of external connection terminals are formed on the outer bottom surface of each of the bases, the plurality of external connection terminals including a pair of external connection terminals for piezoelectric vibration pieces for electrically connecting the piezoelectric vibration piece accommodated in the base to the outside of the base. On the outer bottom surface of the sheet substrate, one of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the multiple bases is electrically connected to a first external connection terminal among the multiple external connection terminals of a first base, and the first base is a base adjacent to the specified base among the multiple bases.

13. The sheet substrate according to claim 12, wherein: On the outer bottom surface of the sheet substrate, the other piezoelectric vibrating piece external connection terminal of the pair of piezoelectric vibrating piece external connection terminals of a specified base among the multiple bases is electrically connected to the second external connection terminal of the multiple external connection terminals of a second base, which is a base adjacent to the specified base among the multiple bases.

Images