Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises a radio frequency element, an electronic element, a coupler, a detector, a controller and an impedance matching circuit. The radio frequency element, the electronic element, the coupler, the detector and the impedance matching circuit are arranged on the substrate. The coupler generates a first coupled output signal in response to the first input coupled signal and generates a second coupled output signal in response to the second input coupled signal. The detector generates a determination signal according to the first coupling output signal and the second coupling output signal. The controller is arranged outside the substrate. The controller generates a control signal according to the judgment signal. The impedance matching circuit provides impedance of a transmission path between the radio frequency element and the electronic element in response to a control signal.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to an electronic device including a radio frequency component. Background Art

[0002] Generally speaking, due to differences in process and location, multiple transmission paths between multiple components in an electronic device may have impedance mismatch problems. For example, the electronic device is an antenna device, and multiple transmission paths between multiple different / same components in the antenna device (such as between an antenna element and a radio frequency element, between a power divider and a radio frequency element, between two power dividers, etc.) will have different impedance differences (i.e., the difference between output impedance and input impedance), resulting in inconsistent amplitude and / or phase of the radio frequency signal at various locations in the antenna device. The greater the impedance difference, the greater the reflected signal generated by the radio frequency signal in the transmission path, which affects the performance of the antenna device. Summary of the invention

[0003] The present disclosure is directed to an electronic device capable of matching the impedance of a transmission path between an electronic component and a radio frequency component.

[0004] According to an embodiment of the present disclosure, an electronic device includes a substrate, a radio frequency element, a first electronic element, a first coupler, a detector, a controller, and a first impedance matching circuit. The radio frequency element is disposed on the substrate. The first electronic element is disposed on the substrate and is electrically connected to the radio frequency element. The first coupler is disposed on the substrate. The first coupler receives a first coupled output signal generated by the radio frequency element in response to a first input coupled signal and receives a second coupled output signal generated by the first electronic element in response to a second input coupled signal. The detector is disposed on the substrate. The detector is electrically connected to the first coupler. The detector generates a determination signal based on the first coupled output signal and the second coupled output signal. The controller is disposed outside the substrate and is electrically connected to the detector. The controller generates a control signal based on the determination signal. The first impedance matching circuit is disposed on the substrate and is electrically connected to the controller. The first impedance matching circuit provides an impedance of a transmission path between the radio frequency element and the first electronic element in response to the control signal.

[0005] Based on the above, the electronic device generates a determination signal according to the first coupled output signal and the second coupled output signal, and generates a control signal according to the determination signal. Therefore, the first impedance matching circuit responds to the control signal to provide the impedance of the transmission path between the RF component and the first electronic component. In this way, the impedance of the transmission path between the RF component and the first electronic component can be matched. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0007] Figure 2 It is a schematic diagram of the distribution of radio frequency components and multiple electronic components;

[0008] Figure 3 is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure;

[0009] Figure 4 is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure;

[0010] Figure 5 is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure;

[0011] Figure 6 is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0012] Figure 7 is an operation flow chart according to an embodiment of the present disclosure;

[0013] Figure 8 is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0014] Fig. 9 is a schematic diagram of an electronic element, an impedance matching circuit and a switch element according to an embodiment of the present disclosure;

[0015] Fig.10 It is a schematic diagram of an electronic element, an impedance matching circuit and a switch element according to an embodiment of the present disclosure.

[0016] Description of Reference Numerals

[0017] 10, 100, 200, 300: Electronic devices

[0018] 11, 110, 210_1, 210_2: RF components

[0019] 12. 120_1~120_4: Electronic components

[0020] 120: Antenna element

[0021] 121: Power divider

[0022] 130_1~130_4, 230_1, 230_2: Coupler

[0023] 140, 240_1, 240_2: Detector

[0024] 150, 250, 350: Controller

[0025] 160_1~160_4, 260_1, 260_2, 360_1, 360_2: Impedance matching circuit

[0026] 351, 352: Lookup table

[0027] AA: Section Line

[0028] C1~C3:Capacitors

[0029] D1~D4:Connection point

[0030] CP1: Equivalent capacitance value

[0031] G1: Ground connection wire

[0032] IL1~IL3: Insulation layer

[0033] L1~L3:Inductor

[0034] LP1, LP2: Equivalent inductance

[0035] P1, P2: Transmission path

[0036] PL1, PL2: Protective layer

[0037] R1~R3: Resistors

[0038] RFIN: RF input signal

[0039] RP1, RP2: Equivalent resistance value

[0040] S100: Operational Flow

[0041] S110~S160: Steps

[0042] SB: Substrate

[0043] SBS: Substrate body

[0044] SC1: First control signal

[0045] SC2: Second control signal

[0046] SCP1~SCP4: coupled signal

[0047] SD1: First judgment signal

[0048] SD2: Second judgment signal

[0049] SIN1: First input coupling signal

[0050] SIN2: Second input coupling signal

[0051] SIN3: Third input coupling signal

[0052] SIN4: Fourth input coupling signal

[0053] SR1: First coupled output signal

[0054] SR2: Second coupled output signal

[0055] SR3: The third coupled output signal

[0056] SR4: Fourth coupled output signal

[0057] SSW1~SSW3, SSW1_1~SSW3_1, SSW1_2~SSW3_2: switch control signal

[0058] SW1~SW9: Switching elements

[0059] SZ1~SZ3, SZ1_1~SZ3_1, SZ1_2~SZ3_2: Impedance control signal

[0060] VT: Threshold

[0061] Z1, Z2, Z3: Impedance string DETAILED DESCRIPTION

[0062] The present disclosure may be understood by reference to the following detailed description in conjunction with the accompanying drawings as described below. It should be noted that for the purpose of clarity and ease of understanding by the reader, the various drawings of the present disclosure illustrate a portion of an electronic device, and certain elements in the various drawings may not be drawn to scale. In addition, the number and size of each device shown in the drawings are merely illustrative and are not intended to limit the scope of the present disclosure.

[0063] Certain terms are used to refer to specific elements throughout the description and in the following scope of rights. As will be understood by those skilled in the art, electronic equipment manufacturers may refer to elements by different names. This document is not intended to distinguish between elements that are different in name but not in function. In the following description and in the scope of rights, the terms "comprise", "include" and "have" are used in an open manner, and therefore should be interpreted as meaning "including but not limited to..." Therefore, when the terms "comprise", "include" and / or "have" are used in the description of this disclosure, it will indicate that there are corresponding features, regions, steps, operations and / or elements, but not limited to the presence of one or more corresponding features, regions, steps, operations and / or elements.

[0064] It should be understood that when an element is referred to as being "coupled to", "connected to" or "conducted to" another element, the element may be directly connected to the other element and an electrical connection may be directly established, or an intermediate element may exist between these elements for relaying the electrical connection (indirect electrical connection). In contrast, when an element is referred to as being "directly coupled to", "directly conductive to" or "directly connected to" another element, there are no intermediate elements.

[0065] Although terms such as first, second, third, etc. can be used to describe different components, such components are not limited by these terms. The terms are only used to distinguish components in the specification from other components. The scope of rights protection may not use the same terms, but may use the terms first, second, third, etc. relative to the order required for the elements. Therefore, in the following description, the first component may be the second component in the scope of rights protection.

[0066] The electronic device disclosed herein may include a display device, an antenna device, a sensing device, a light-emitting device, a touch display, a curved display, or a free shape display, but is not limited thereto. The electronic device may include a bendable or flexible electronic device. The electronic device may, for example, include a liquid crystal, a light-emitting diode, a quantum dot (QD), fluorescence, phosphorescence, other suitable display media, or a combination of the above materials, but is not limited thereto. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (miniLED), a micro-light-emitting diode (micro LED), or a quantum dot light-emitting diode (quantum dot LED, which may include QLED, QDLED), or other suitable materials, or a combination of the above, but is not limited thereto. The display device may, for example, include a spliced ​​display device, but is not limited thereto. The antenna device may, for example, be a liquid crystal antenna, an antenna splicing device, or a phase radio frequency device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. In addition, the appearance of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a peripheral system such as a drive system, a control system, a light source system, etc. to support a display device, an antenna device, or a splicing device, but the disclosure is not limited thereto. The sensing device may include a camera or an infrared sensor or a fingerprint sensor, etc., and the disclosure is not limited thereto. In some embodiments, the sensing device may also include a flash, an infrared (IR) light source, other sensors, electronic components, or a combination thereof, but is not limited thereto.

[0067] It should be noted that the technical features in the different embodiments described below may be replaced, reorganized or mixed with each other to constitute another embodiment without departing from the spirit of the present disclosure.

[0068] Please refer to Figure 1 , Figure 11 is a schematic diagram of an electronic device according to an embodiment of the present disclosure. In this embodiment, the electronic device 100 includes a substrate SB, a radio frequency element 110, electronic elements 120_1-120_4, couplers 130_1-130_4, a detector 140, a controller 150, and impedance matching circuits 160_1-160_4. The radio frequency element 110, the electronic elements 120_1-120_4, the couplers 130_1-130_4, the detector 140, and the impedance matching circuits 160_1-160_4 are disposed on the substrate SB. The controller 150 is disposed outside the substrate SB. The electronic elements 120_1-120_4 are electrically connected to the radio frequency element 110. The couplers 130_1-130_4 are electrically connected to the detector 140. The couplers 130_1-130_4 are electrically connected to the electronic elements 120_1-120_4 in a one-to-one manner. For example, the coupler 130_1 is electrically connected to the electronic component 120_1 , the coupler 130_2 is electrically connected to the electronic component 120_2 , and so on. The controller 150 is electrically connected to the detector 140 and the impedance matching circuits 160_1 ˜ 160_4 .

[0069] The impedance matching circuit 160_1 is electrically connected to the transmission path P1 between the RF component 110 and the electronic component 120_1. The impedance matching circuit 160_2 is electrically connected to the transmission path P2 between the RF component 110 and the electronic component 120_2, and so on. Taking the coupler 130_1 as an example, the coupler 130_1 is electrically connected to the electronic component 120_1. The coupler 130_1 generates a first coupled output signal SR1 in response to the first input coupled signal SIN1. The coupler 130_1 generates a second coupled output signal SR2 in response to the second input coupled signal SIN2. The detector 140 receives the first coupled output signal SR1 and the second coupled output signal SR2 from the coupler 130_1. The detector 140 generates a first determination signal SD1 according to the first coupled output signal SR1 and the second coupled output signal SR2. The controller 150 generates a first control signal SC1 according to the first determination signal SD1. The impedance matching circuit 160_1 provides an impedance of a transmission path P1 between the RF component 110 and the electronic component 120_1 in response to the control signal SC1 .

[0070] It is worth mentioning here that the first coupled output signal SR1 and the second coupled output signal SR2 can be associated with the path impedance between the electronic component 120_1 and the coupler 130_1 and the path impedance between the RF component 110 and the coupler 130_1. The electronic device 100 generates a determination signal SD1 according to the first coupled output signal SR1 and the second coupled output signal SR2, and generates a control signal SC1 according to the first determination signal SD1. Therefore, the impedance matching circuit 160_1 can respond to the first control signal SC1 to provide the impedance of the transmission path P1 between the RF component 110 and the electronic component 120_1. In this way, based on the first coupled output signal SR1 and the second coupled output signal SR2, the impedance of the transmission path P1 between the RF component 110 and the electronic component 120_1 can be matched.

[0071] In this embodiment, the RF element 110 can receive a RF input signal RFIN. The RF element 110 adjusts the RF input signal RFIN and provides the adjusted RF input signal to the plurality of electronic components 120_1 and 120_2. For example, the RF element 110 can adjust at least one of the amplitude, frequency, and phase of the RF input signal RFIN.

[0072] Please refer to Figure 1 and Figure 2 , Figure 2 It is a schematic diagram of the distribution of radio frequency components and multiple electronic components. Figure 2 The electronic device 10 may be suitable for Figure 1 The electronic device 10 is provided with a matching operation. Figure 1 The electronic components 120_1 to 120_4 may be, for example, Figure 2 electronic components 12 (such as, one of the antenna components 120 and the power divider 121 (power divider)), but not limited thereto. It should be noted that the multiple transmission paths between the multiple electronic components 12 and the multiple RF components 11 located at different positions or the multiple transmission paths between the multiple electronic components 12 will have different impedance differences (i.e., the difference between the output impedance and the input impedance). In the electronic device 10, the greater the above-mentioned impedance difference, the greater the reflected signal generated by the RF signal in the transmission path. In this embodiment, the impedance matching circuits 160_1~160_4 respond to the impedance provided in the multiple transmission paths to reduce the impedance difference of the multiple transmission paths, so that the electronic device has better performance.

[0073] In some embodiments, the electronic components include active components and passive components on the transmission path, such as chips, diodes, transistors, etc. The controller 150 is, for example, a central processing unit (CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessors), digital signal processors (Digital Signal Processors, DSPs), programmable controllers, application-specific integrated circuits (Application Specific Integrated Circuits, ASICs), programmable logic devices (Programmable Logic Devices, PLDs) or other similar devices or combinations of these devices, which can load and execute computer programs.

[0074] In the present embodiment, the coupler 130_1 includes connection points D1 to D4. During the first matching period, the detector 140 may provide a first input coupling signal SIN1. During the first matching period, the coupler 130_1 receives the first input coupling signal SIN1 through the connection point D1. The coupler 130_1 shunts the first input coupling signal SIN1 to generate a first coupling output signal SR1 and a coupling signal SCP1. The coupler 130_1 provides the first coupling output signal SR1 to the detector 140 through the connection point D3. The coupler 130_1 provides the coupling signal SCP1 to the electronic component 120_1 through the connection point D4. The shunt ratio between the first coupling output signal SR1 and the coupling signal SCP1 is determined according to the impedance ratio of the connection points D3 and D4 located at the coupler 130_1. Therefore, during the first matching period, the value of the first coupling output signal SR1 can reflect the impedance ratio of the connection points D3 and D4 located at the coupler 130_1.

[0075] During the second matching period, the detector 140 may provide a second input coupling signal SIN2. The first input coupling signal SIN1 is the same as the second input coupling signal SIN2. During the second matching period, the coupler 130_1 receives the second input coupling signal SIN2 through the connection point D3. The coupler 130_1 shunts the first input coupling signal SIN2 to generate a second coupling output signal SR2 and a coupling signal SCP2. The coupler 130_1 provides the first coupling output signal SR1 to the detector 140 through the connection point D1. The coupler 130_1 provides the coupling signal SCP2 to the RF element 110 through the connection point D2. The shunt ratio between the second coupling output signal SR2 and the coupling signal SCP2 is determined according to the impedance ratio of the connection points D1 and D2 located at the coupler 130_1. Therefore, during the second matching period, the value of the second coupling output signal SR2 can reflect the impedance ratio of the connection points D1 and D2 located at the coupler 130_1.

[0076] The first matching period is different from the second matching period. For example, the first matching period is earlier than the second matching period. For example, the first matching period is later than the second matching period. Coupler 130_1 can control the connection between connection points D1 to D4. During the first matching period, coupler 130_1 can connect connection points D1, D3, and D4 together. During the second matching period, coupler 130_1 can connect connection points D1, D2, and D3 together. During normal operation, coupler 130_1 can connect connection points D2 and D4 together.

[0077] In the present embodiment, the detector 140 generates the first determination signal SD1 according to the difference between the first coupled output signal SR1 and the second coupled output signal SR2. The difference may be, for example, the difference between the first coupled output signal SR1 and the second coupled output signal SR2 (SR1-SR2), the difference between the second coupled output signal SR2 and the first coupled output signal SR1 (SR2-SR1), the ratio between the first coupled output signal SR1 and the second coupled output signal SR2 (SR1 / SR2), or the ratio between the second coupled output signal SR2 and the first coupled output signal SR1 (SR2 / SR1), but is not limited thereto. For example, at a frequency (for example, the center frequency of the electronic device / antenna device), the detector 140 may generate the first determination signal SD1 according to at least one value of the amplitude difference, voltage difference, and phase difference between the first coupled output signal SR1 and the second coupled output signal SR2. The controller 150 receives the first determination signal SD1 and determines the first determination signal SD1. When the first determination signal SD1 indicates that the difference between the first coupled output signal SR1 and the second coupled output signal SR2 is greater than or equal to the threshold VT, this indicates that the impedance of the transmission path P1 between the RF component 110 and the electronic component 120_1 is obviously mismatched (i.e., the input impedance of the electronic component 120_1 is obviously different from the output impedance of the electronic component 120_1). Therefore, the controller 150 changes the first control signal SC1, so that the first impedance matching circuit 160_1 changes the impedance of the transmission path P1 between the RF component 110 and the electronic component 120_1 according to the first control signal SC1.

[0078] On the other hand, when the first determination signal SD1 indicates that the difference between the first coupled output signal SR1 and the second coupled output signal SR2 is less than the threshold VT, this indicates that the impedance of the transmission path P1 between the RF component 110 and the electronic component 120_1 is matched (i.e., the input impedance of the electronic component 120_1 is significantly the same as or similar to the output impedance of the electronic component 120_1). Therefore, the controller 150 does not change the first control signal SC1.

[0079] Taking the coupler 130_2 as an example, the coupler 130_2 is electrically connected to the electronic component 120_2. The coupler 130_2 generates a third coupled output signal SR3 in response to the third input coupled signal SIN3. The coupler 130_1 generates a fourth coupled output signal SR4 in response to the fourth input coupled signal SIN4. The detector 140 receives the third coupled output signal SR3 and the fourth coupled output signal SR4 from the coupler 130_1. The detector 140 generates a second determination signal SD2 based on the third coupled output signal SR3 and the fourth coupled output signal SR4. The controller 150 generates a second control signal SC2 based on the second determination signal SD2. The impedance matching circuit 160_2 provides an impedance of a transmission path P2 between the RF component 110 and the electronic component 120_2 in response to the second control signal SC2.

[0080] In this embodiment, similar to the coupler 130_1, the coupler 130_2 includes connection points D1 to D4. During the third matching period, the detector 140 can provide a third input coupling signal SIN3. During the third matching period, the coupler 130_2 receives the third input coupling signal SIN3 through the connection point D1. The coupler 130_2 shunts the first input coupling signal SIN3 to generate a third coupling output signal SR3 and a coupling signal SCP3. The coupler 130_2 provides the first coupling output signal SR3 to the detector 140 through the connection point D3. The coupler 130_2 provides the coupling signal SCP3 to the electronic component 120_2 through the connection point D4. The shunt ratio between the third coupling output signal SR3 and the coupling signal SCP3 is determined according to the impedance ratio of the connection points D3 and D4 located at the coupler 130_2. Therefore, during the third matching period, the value of the third coupling output signal SR3 can reflect the impedance ratio of the connection points D3 and D4 located at the coupler 130_2.

[0081] During the fourth matching period, the detector 140 may provide a fourth input coupling signal SIN4. The third input coupling signal SIN3 is the same as the fourth input coupling signal SIN4. During the fourth matching period, the coupler 130_1 shunts the fourth input coupling signal SIN4 to generate a fourth coupling output signal SR4 and a coupling signal SCP4. The coupler 130_2 provides the fourth coupling output signal SR4 to the detector 140 through the connection point D1. The coupler 130_2 provides the coupling signal SCP4 to the RF element 110 through the connection point D2. The shunt ratio between the fourth coupling output signal SR4 and the coupling signal SCP4 is determined according to the impedance ratio of the connection points D1 and D2 located at the coupler 130_2. Therefore, during the fourth matching period, the value of the fourth coupling output signal SR4 can reflect the impedance ratio of the connection points D1 and D2 located at the coupler 130_2.

[0082] The third matching period is different from the fourth matching period. For example, the third matching period is earlier than the fourth matching period. For example, the third matching period is later than the fourth matching period. In addition, the third matching period is the same as or different from the first matching period. The fourth matching period is the same as or different from the second matching period.

[0083] The coupler 130_2 may control the connection between the connection points D1 to D4. During the third matching period, the coupler 130_2 may connect the connection points D1, D3, and D4 together. During the fourth matching period, the coupler 130_2 may connect the connection points D1, D2, and D3 together. During normal operation, the coupler 130_2 may connect the connection points D2 and D4 together.

[0084] In the present embodiment, the detector 140 generates the second determination signal SD2 according to the difference between the third coupled output signal SR3 and the fourth coupled output signal SR4. The difference may be, for example, the difference between the third coupled output signal SR3 and the fourth coupled output signal SR4 (SR3-SR4), the difference between the fourth coupled output signal SR4 and the third coupled output signal SR3 (SR4-SR3), the ratio between the third coupled output signal SR3 and the fourth coupled output signal SR4 (SR3 / SR4), or the ratio between the fourth coupled output signal SR4 and the third coupled output signal SR3 (SR4 / SR3), but is not limited thereto. For example, at a frequency (for example, the center frequency of the electronic device / antenna device), the detector 140 may generate the second determination signal SD2 according to at least one value of the amplitude difference, voltage difference, and phase difference between the third coupled output signal SR3 and the fourth coupled output signal SR4. The controller 150 determines the second determination signal SD2. When the second determination signal SD2 indicates that the difference between the third coupled output signal SR3 and the fourth coupled output signal SR4 is greater than the threshold VT, this indicates that the impedance of the transmission path P2 between the RF component 110 and the electronic component 120_2 is obviously mismatched (i.e., the input impedance of the electronic component 120_2 is obviously different from the output impedance of the electronic component 120_2). Therefore, the controller 150 changes the second control signal SC2, so that the impedance matching circuit 160_2 changes the impedance of the transmission path P2 between the RF component 110 and the electronic component 120_2 according to the second control signal SC2.

[0085] On the other hand, when the first determination signal SD1 indicates that the difference between the third coupled output signal SR3 and the fourth coupled output signal SR4 is less than or equal to the threshold VT, this indicates that the impedance of the transmission path P2 between the RF component 110 and the electronic component 120_2 is matched (i.e., the input impedance of the electronic component 120_2 is significantly the same as or similar to the output impedance of the electronic component 120_2). Therefore, the controller 150 does not change the second control signal SC2.

[0086] In this embodiment, the first input coupling signal SIN1, the second input coupling signal SIN2, the third input coupling signal SIN3, the fourth input coupling signal SIN4, the first coupling output signal SR1, the second coupling output signal SR2, the third coupling output signal SR3 and the fourth coupling output signal SR4 are RF signals. The first control signal SC1 and the second control signal SC2 each include at least one DC signal (e.g., a DC voltage signal).

[0087] In this embodiment, the operations of the couplers 130_3 , 130_4 and the impedance matching circuits 160_3 , 160_4 may be similar to the operations of the couplers 130_1 , 130_2 and the impedance matching circuits 160_1 , 160_2 , and thus will not be repeated here.

[0088] For ease of description, this embodiment is illustrated by one RF element 110, four electronic elements 120_1-120_4, four couplers 130_1-130_4 and one detector 140. However, the present disclosure is not limited thereto. In some embodiments, the number of RF elements, electronic elements, couplers and detectors can be one or more.

[0089] In some embodiments, at least one of the impedance matching circuits 160_1 - 160_4 is electrically connected to a transmission path between two electronic components. For example, at least one of the impedance matching circuits 160_1 - 160_4 is electrically connected to a transmission path between two power dividers.

[0090] In this embodiment, the controller 150 is disposed outside the substrate SB. The controller 150 is electrically connected to the substrate SB through any form of chip-on-film (COF) packaging. In some embodiments, the controller 150 may be disposed on the substrate SB.

[0091] Please refer to Figure 1 as well as Figure 3 , Figure 3is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure. In this embodiment, the electronic device 100 further includes switch elements SW1 to SW9. The switch elements SW1 to SW9 are disposed on the substrate SB. In this embodiment, the first end of the impedance matching circuit 160_1 is electrically connected to the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW9. In other words, the first end of the impedance matching circuit 160_1 is electrically connected to the transmission path P1 between the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW9. The second end of the impedance matching circuit 160_1 is electrically connected to a reference low voltage (e.g., ground).

[0092] Taking this embodiment as an example, the impedance matching circuit 160_1 includes resistors R1-R3, capacitors C1-C3 and inductors L1-L3. The resistance values ​​of the resistors R1-R3 are different from each other. The capacitance values ​​of the capacitors C1-C3 are different from each other. The inductance values ​​of the inductors L1-L3 are different from each other. In other words, the impedance matching circuit 160_1 can provide multiple resistance values, capacitance values ​​and inductance values. In addition, the number of switch elements SW1-SW9 that are turned on can determine different impedances used to perform impedance matching on the transmission path P1.

[0093] The first end of the switch element SW1 is electrically connected to the transmission path P1. The control end of the switch element SW1 is coupled to the controller 150. The resistor R1 is electrically connected between the second end of the switch element SW1 and the reference low voltage. The first end of the switch element SW2 is electrically connected to the transmission path P1. The control end of the switch element SW2 is coupled to the controller 150. The resistor R2 is electrically connected between the second end of the switch element SW2 and the reference low voltage. The first end of the switch element SW3 is electrically connected to the transmission path P1. The control end of the switch element SW3 is coupled to the controller 150.

[0094] The first end of the switch element SW4 is electrically connected to the transmission path P1. The control end of the switch element SW4 is coupled to the controller 150. The inductor L1 is electrically connected between the second end of the switch element SW4 and the reference low voltage. The first end of the switch element SW5 is electrically connected to the transmission path P1. The control end of the switch element SW5 is coupled to the controller 150. The inductor L2 is electrically connected between the second end of the switch element SW5 and the reference low voltage. The first end of the switch element SW6 is electrically connected to the transmission path P1. The control end of the switch element SW6 is coupled to the controller 150. The inductor L3 is electrically connected between the second end of the switch element SW6 and the reference low voltage.

[0095] The first end of the switch element SW7 is electrically connected to the transmission path P1. The control end of the switch element SW7 is coupled to the controller 150. The capacitor C1 is electrically connected between the second end of the switch element SW7 and the reference low voltage. The first end of the switch element SW8 is electrically connected to the transmission path P1. The control end of the switch element SW5 is coupled to the controller 150. The capacitor C2 is electrically connected between the second end of the switch element SW8 and the reference low voltage. The first end of the switch element SW9 is electrically connected to the transmission path P1. The control end of the switch element SW9 is coupled to the controller 150. The capacitor C3 is electrically connected between the second end of the switch element SW9 and the reference low voltage.

[0096] In the present embodiment, the RF element 110 has an equivalent resistance value RP1, an equivalent capacitance value CP1, and an equivalent inductance value LP1. The transmission path P1 has an equivalent resistance value RP2 and an equivalent inductance value LP2. It should be noted that based on the process of the RF element 110, the distance between the RF element 110 and the design of the transmission path P1, at least one of the equivalent resistance values ​​RP1, RP2, the equivalent capacitance value CP1, and the equivalent inductance values ​​LP1, LP2 may change. The above changes may cause impedance mismatch of the transmission path P1. Therefore, the controller 150 may provide a first control signal SC1 based on the first judgment signal SD1. The first control signal SC1 may include a switch control signal. The switch elements SW1~SW9 may be turned on or off according to the switch control signal (for example, a DC voltage signal). In other words, the switch elements SW1 ˜ SW9 can determine whether to provide the impedance of at least one of the resistors R1 ˜ R3 , the capacitors C1 ˜ C3 and the inductors L1 ˜ L3 to the transmission path P1 according to the switch control signal, thereby changing the impedance of the transmission path P1 .

[0097] In some embodiments, the switch elements SW1 ˜ SW9 may be disposed in the impedance matching circuit 160_1 .

[0098] Please refer to Figure 1 as well as Figure 4 , Figure 4 is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure. In this embodiment, the electronic device 100 further includes switch elements SW1 to SW3. The switch elements SW1 to SW3 are disposed on the substrate SB. In this embodiment, the first end of the impedance matching circuit 160_1 is electrically connected to the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW3. In other words, the first end of the impedance matching circuit 160_1 is electrically connected to the transmission path P1 between the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW3. The second end of the impedance matching circuit 160_1 is electrically connected to a reference low voltage (e.g., ground).

[0099] Taking this embodiment as an example, the impedance matching circuit 160_1 includes a resistor R1, a capacitor C1 and an inductor L1. The resistor R1 is a variable resistor. The capacitor C1 is a variable capacitor. The inductor L1 is a variable inductor. The impedance matching circuit 160_1 changes at least one of the resistance value, capacitance value and inductance value of the impedance matching circuit 160_1 in response to the first control signal SC1.

[0100] The first end of the switch element SW1 is electrically connected to the transmission path P1. The control end of the switch element SW1 is coupled to the controller 150. The resistor R1 is electrically connected between the second end of the switch element SW1 and the reference low voltage. The first end of the switch element SW2 is electrically connected to the transmission path P1. The control end of the switch element SW2 is coupled to the controller 150. The inductor L1 is electrically connected between the second end of the switch element SW2 and the reference low voltage. The first end of the switch element SW3 is electrically connected to the transmission path P1. The control end of the switch element SW3 is coupled to the controller 150. The capacitor C1 is electrically connected between the second end of the switch element SW3 and the reference low voltage.

[0101] In the present embodiment, the RF element 110 has an equivalent resistance value RP1, an equivalent capacitance value CP1, and an equivalent inductance value LP1. The transmission path P1 has an equivalent resistance value RP2 and an equivalent inductance value LP2. Based on the process of the RF element 110, the distance between the RF element 110 and the design of the transmission path P1, at least one of the equivalent resistance values ​​RP1, RP2, the equivalent capacitance value CP1, and the equivalent inductance values ​​LP1, LP2 may change. The above changes may cause impedance mismatch of the transmission path P1. Therefore, the controller 150 may provide a first control signal SC1 based on the first judgment signal SD1. The first control signal SC1 includes switch control signals SSW1~SSW3 and impedance control signals SZ1~SZ3. The resistance value of the resistor R1 can be adjusted based on the impedance control signal SZ1. The inductance value of the inductor L1 can be adjusted based on the impedance control signal SZ2. The capacitance value of the capacitor C1 can be adjusted based on the impedance control signal SZ3. In addition, the switch element SW1 can be turned on or off according to the switch control signal SSW1. The switch element SW2 can be turned on or off according to the switch control signal SSW2. The switch element SW3 can be turned on or off according to the switch control signal SSW3. Therefore, the switch elements SW1-SW3 can determine whether to provide at least one of the resistance value of the resistor R1, the capacitance value of the capacitor C1, and the inductance value of the inductor L1 to the transmission path P1 according to the switch control signals SSW1-SSW3, thereby changing the impedance of the transmission path P1.

[0102] In this embodiment, the switch control signals SSW1 - SSW3 and the impedance control signals SZ1 - SZ3 are DC signals (eg, DC voltage signals), respectively.

[0103] In some embodiments, the switch elements SW1 ˜ SW3 may be disposed in the impedance matching circuit 160_1 .

[0104] Please refer to Figure 1 as well as Figure 5 , Figure 5 is a schematic diagram of an impedance matching circuit according to an embodiment of the present disclosure. In this embodiment, the electronic device 100 further includes switch elements SW1 to SW3. The switch elements SW1 to SW3 are disposed on the substrate SB. In this embodiment, the first end of the impedance matching circuit 160_1 is electrically connected to the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW3. In other words, the first end of the impedance matching circuit 160_1 is electrically connected to the transmission path P1 between the RF element 110 and the electronic element 120_1 through the switch elements SW1 to SW3. The second end of the impedance matching circuit 160_1 is electrically connected to a reference low voltage (e.g., ground).

[0105] Taking this embodiment as an example, the impedance matching circuit 160_1 includes resistors R1-R3, capacitors C1-C3 and inductors L1-L3. The resistor R1, the inductor L1 and the capacitor C1 are connected in series to form an impedance string Z1. The resistor R2, the inductor L2 and the capacitor C2 are connected in series to form an impedance string Z2. The resistor R3, the inductor L3 and the capacitor C3 are connected in series to form an impedance string Z3. The number of switch elements SW1-SW3 that are turned on can determine different impedances used to perform impedance matching on the transmission path P1.

[0106] The first end of the switch element SW1 is electrically connected to the transmission path P1. The control end of the switch element SW1 is coupled to the controller 150. The impedance string Z1 is electrically connected between the second end of the switch element SW1 and the reference low voltage. The first end of the switch element SW2 is electrically connected to the transmission path P1. The control end of the switch element SW2 is coupled to the controller 150. The impedance string Z2 is electrically connected between the second end of the switch element SW2 and the reference low voltage. The first end of the switch element SW3 is electrically connected to the transmission path P1. The control end of the switch element SW3 is coupled to the controller 150. The impedance string Z3 is electrically connected between the second end of the switch element SW3 and the reference low voltage.

[0107] In the present embodiment, the RF element 110 has an equivalent resistance value RP1, an equivalent capacitance value CP1, and an equivalent inductance value LP1. The transmission path P1 has an equivalent resistance value RP2 and an equivalent inductance value LP2. Based on the process of the RF element 110, the distance between the RF element 110 and the design of the transmission path P1, at least one of the equivalent resistance values ​​RP1, RP2, the equivalent capacitance value CP1, and the equivalent inductance values ​​LP1, LP2 may change. The above changes may cause impedance mismatch of the transmission path P1. Therefore, the controller 150 may provide a first control signal SC1 based on the first judgment signal SD1. The switch elements SW1~SW3 may determine whether to provide the impedance of at least one of the impedance strings Z1~Z3 to the transmission path P1 based on the first control signal SC1, thereby changing the impedance of the transmission path P1.

[0108] In some embodiments, the switch elements SW1 ˜ SW3 may be disposed in the impedance matching circuit 160_1 .

[0109] In some embodiments, at least one of the impedance strings Z1 - Z3 may be replaced by a parallel impedance circuit of at least two of a resistor, an inductor, and a capacitor.

[0110] Please refer to Figure 6 , Figure 6 is a schematic diagram of an electronic device according to an embodiment of the present disclosure. Part of the circuit of an electronic device 200 is shown in this embodiment. In this embodiment, the electronic device 200 includes a substrate SB, RF components 210_1, 210_2, couplers 230_1, 230_2, detectors 240_1, 240_2, a controller 250, impedance matching circuits 260_1, 260_2, and switch components SW1, SW2. The RF components 210_1, 210_2, couplers 230_1, 230_2, detectors 240_1, 240_2, impedance matching circuits 260_1, 260_2, and switch components SW1, SW2 are respectively disposed on a substrate (e.g., Figure 1 The controller 250 is arranged outside the substrate SB.

[0111] In the present embodiment, the coupler 230_1 includes connection points D1 to D4. During the first matching period, the detector 240_1 provides a first input coupling signal SIN1. During the first matching period, the coupler 230_1 shunts the first input coupling signal SIN1 to generate a first coupling output signal SR1 and a coupling signal. The coupler 230_1 provides the first coupling output signal SR1 to the detector 240_1 through the connection point D3. The coupler 230_1 provides the coupling signal to the electronic component through the connection point D4. During the first matching period, the value of the first coupling output signal SR1 can reflect the impedance ratio of the connection points D3 and D4 located at the coupler 230_1.

[0112] During the second matching period, the detector 240_1 provides a second input coupling signal SIN2. The first input coupling signal SIN1 is the same as the second input coupling signal SIN2. During the second matching period, the coupler 230_1 receives the second input coupling signal SIN2 through the connection point D3. The coupler 230_1 shunts the first input coupling signal SIN2 to generate a second coupling output signal SR2 and a coupling signal. The coupler 230_1 provides the first coupling output signal SR1 to the detector 240_1 through the connection point D1. The coupler 230_1 provides the coupling signal to the RF element 210_1 through the connection point D2. During the second matching period, the value of the second coupling output signal SR2 can reflect the impedance ratio of the connection points D1 and D2 located at the coupler 230_1.

[0113] In this embodiment, the detector 240_1 generates a first determination signal SD1 according to the difference between the first coupled output signal SR1 and the second coupled output signal SR2. The controller 250 determines the first determination signal SD1 to generate a first control signal SC1. The controller 250 uses the first control signal SC1 to change the impedance of the transmission path P1. The first control signal SC1 includes a switch control signal SSW1 and impedance control signals SZ1_1~SZ3_1.

[0114] In this embodiment, the first end of the switch element SW1 is electrically connected to the transmission path P1. The control end of the switch element SW1 is coupled to the controller 250. The impedance matching circuit 260_1 includes variable impedance circuits 261_1-263_1. The variable impedance circuits 261_1-263_1 each include at least one of a variable resistor, a variable capacitor, and a variable inductor. The variable impedance circuits 261_1-263_1 are electrically connected between the second end of the switch element SW1 and the reference low voltage.

[0115] The switch element SW1 can be turned on or off according to the switch control signal SSW1. The variable impedance circuit 261_1 can adjust the impedance value according to the voltage value of the impedance control signal SZ1_1. The variable impedance circuit 262_1 can adjust the impedance value according to the voltage value of the impedance control signal SZ2_1. The variable impedance circuit 263_1 can adjust the impedance value according to the voltage value of the impedance control signal SZ3_1.

[0116] The coupler 230_2 includes connection points D1 to D4. During the third matching period, the detector 240_2 provides a third input coupling signal SIN3. During the third matching period, the coupler 230_2 shunts the third input coupling signal SIN3 to generate a third coupling output signal SR3 and a coupling signal. The coupler 230_2 provides the first coupling output signal SR3 to the detector 240_2 through the connection point D3. The coupler 230_2 provides the coupling signal to the electronic component through the connection point D4. During the third matching period, the value of the third coupling output signal SR3 can reflect the impedance ratio of the connection points D3 and D4 located at the coupler 230_2.

[0117] During the fourth matching period, the detector 240_2 provides a fourth input coupling signal SIN4. The third input coupling signal SIN3 is the same as the fourth input coupling signal SIN4. During the fourth matching period, the coupler 230_2 shunts the fourth input coupling signal SIN4 to generate a fourth coupling output signal SR4 and a coupling signal. The coupler 230_2 provides the fourth coupling output signal SR4 to the detector 240_2 through the connection point D1. The coupler 230_2 provides the coupling signal to the RF element 210_2 through the connection point D2. The shunt ratio between the fourth coupling output signal SR4 and the coupling signal is determined based on the impedance ratio of the connection points D1 and D2 located at the coupler 230_2. During the fourth matching period, the value of the fourth coupling output signal SR4 can reflect the impedance ratio of the connection points D1 and D2 located at the coupler 230_2.

[0118] In this embodiment, the detector 240_2 generates a second determination signal SD2 according to the difference between the third coupled output signal SR3 and the fourth coupled output signal SR4. The controller 250 determines the second determination signal SD2 to generate a second control signal SC2. The controller 250 uses the second control signal SC2 to change the impedance of the transmission path P2. The second control signal SC2 includes a switch control signal SSW2 and impedance control signals SZ1_2 to SZ3_2.

[0119] In this embodiment, the first end of the switch element SW2 is electrically connected to the transmission path P2. The control end of the switch element SW2 is coupled to the controller 250. The impedance matching circuit 260_2 includes variable impedance circuits 261_2-263_2. The variable impedance circuits 261_2-263_2 each include at least one of a variable resistor, a variable capacitor, and a variable inductor. The variable impedance circuits 261_2-263_2 are electrically connected between the second end of the switch element SW2 and the reference low voltage, respectively.

[0120] The switch element SW2 can be turned on or off according to the switch control signal SSW2. The variable impedance circuit 261_2 can adjust the impedance value according to the voltage value of the impedance control signal SZ1_2. The variable impedance circuit 262_2 can adjust the impedance value according to the voltage value of the impedance control signal SZ2_2. The variable impedance circuit 263_2 can adjust the impedance value according to the voltage value of the impedance control signal SZ3_2.

[0121] In this embodiment, the detectors 240_1 and 240_2 are connected to the couplers 230_1 and 230_2 in a one-to-one manner. However, the present disclosure is not limited thereto. In some embodiments, the detector 240_1 is at least connected to the couplers 230_1 and 230_2 in a corresponding manner (e.g. Figure 1 For example, the detector 240_1 may also transmit the third input coupling signal SIN3 and the fourth input coupling signal SIN4 to the coupler 230_2, and receive the third coupling output signal SR3 and the fourth coupling output signal SR4 from the coupler 230_2. The detector 240_1 may also generate a second determination signal SD2 according to the third coupling output signal SR3 and the fourth coupling output signal SR4, and provide the second determination signal SD2 to the controller 250.

[0122] Please refer to Figure 6 as well as Figure 7 , Figure 7is an operation flow chart according to an embodiment of the present disclosure. In this embodiment, the operation process S100 includes steps S110 to S160. The controller 250 receives a determination signal (e.g., a first determination signal SD1) from a detector (e.g., a detector 240_1) in step S110, and determines in step S120 whether the difference between the two coupled output signals received by the detector (e.g., the difference between the first coupled output signal SR1 and the second coupled output signal SR2 received by the detector 240_1) is less than a threshold value VT according to the determination signal (e.g., the first determination signal SD1). When the difference is less than the threshold value VT, the controller 250 determines in step S130 whether the current detection position (e.g., the range detected by the detector) is the last detection position. When the current detection position is the last detection position, the operation process S100 ends. When the current detection position is not the last detection position, the next detection position is selected and the operation returns to step S110.

[0123] In step S120, when the difference degree is greater than or equal to the threshold value VT, the controller 250 provides the switch control signal SSW1 and adjusts the impedance control signals SZ1_1~SZ3_1 in step S140, and determines again in step S150 whether the difference degree is less than the threshold value VT. When the difference degree is still greater than or equal to the threshold value VT, the controller 250 provides the switch control signal SSW1 again in step S140 and adjusts the impedance control signals SZ1_1~SZ3_1 different from the previous one. When the difference degree is less than the threshold value VT, it means that the previous adjustment has matched the impedance of the transmission path P1. Therefore, the controller 250 provides the switch control signal SSW1 and provides the adjusted impedance control signals SZ1_1~SZ3_1 in step S160. Next, the controller 250 enters the operation of step S130.

[0124] Please refer to Figure 8 , Figure 8 1 is a schematic diagram of an electronic device according to an embodiment of the present disclosure. In this embodiment, a partial circuit of an electronic device 300 is shown. In this embodiment, the electronic device 300 includes a substrate SB, RF components 210_1, 210_2, couplers 230_1, 230_2, detectors 240_1, 240_2, a controller 350, impedance matching circuits 360_1, 360_2, and switch components SW1_1~SW3_1, SW1_2~SW3_2. The operation of the RF components 210_1, 210_2, couplers 230_1, 230_2, and detectors 240_1, 240_2 in this embodiment has been described. Figure 6 This is clearly described in the embodiments, so it will not be repeated here.

[0125] In this embodiment, the controller 350 generates a first control signal SC1 according to the first determination signal SD1 and generates a second control signal SC2 according to the second determination signal SD2. The first control signal SC1 includes switch control signals SSW1_1 to SSW3_1. The second control signal SC2 includes switch control signals SSW1_2 to SSW3_2.

[0126] The first ends of the switch elements SW1_1 to SW3_1 are electrically connected to the transmission path P1. The control ends of the switch elements SW1_1 to SW3_1 are coupled to the controller 350. The impedance matching circuit 360_1 includes impedance circuits 361_1 to 363_1. The impedance circuit 361_1 is electrically connected between the second end of the switch element SW1_1 and the reference low voltage. The impedance circuit 362_1 is electrically connected between the second end of the switch element SW2_1 and the reference low voltage. The impedance circuit 363_1 is electrically connected between the second end of the switch element SW3_1 and the reference low voltage. The switch element SW1_1 can be turned on or off according to the switch control signal SSW1_1. The switch element SW2_1 can be turned on or off according to the switch control signal SSW2_1. The switch element SW3_1 can be turned on or off according to the switch control signal SSW3_1.

[0127] The first ends of the switch elements SW1_2 to SW3_2 are electrically connected to the transmission path P2. The control ends of the switch elements SW1_2 to SW3_2 are coupled to the controller 350. The impedance matching circuit 360_2 includes impedance circuits 361_2 to 363_2. The impedance circuit 361_2 is electrically connected between the second end of the switch element SW1_2 and the reference low voltage. The impedance circuit 362_2 is electrically connected between the second end of the switch element SW2_2 and the reference low voltage. The impedance circuit 363_2 is electrically connected between the second end of the switch element SW3_2 and the reference low voltage. The switch element SW1_2 can be turned on or off according to the switch control signal SSW1_2. The switch element SW2_2 can be turned on or off according to the switch control signal SSW2_2. The switch element SW3_2 can be turned on or off according to the switch control signal SSW3_2.

[0128] In some embodiments, the impedance circuits 361_1-363_1, 361_2-363_2 include at least one of a resistor, a capacitor, and an inductor. In some embodiments, the impedance circuits 361_1-363_1, 361_2-363_2 include at least two of a resistor, a capacitor, and an inductor. At least two of the resistor, the capacitor, and the inductor are connected to each other in parallel or in series, for example.

[0129] In this embodiment, the controller 350 includes lookup tables 351 and 352. The lookup table 351 provides switch control signals SSW1_1-SSW3_1 of the first control signal SC1 according to the first determination signal SD1. The lookup table 352 provides switch control signals SSW1_2-SSW3_2 of the second control signal SC2 according to the second determination signal SD2.

[0130] Please refer to Fig. 9 , Fig. 9 It is a schematic diagram of an electronic element, an impedance matching circuit and a switch element according to an embodiment of the present disclosure. Fig. 9 A cross-sectional view along section line AA is shown. In the present embodiment, the substrate SB includes a substrate body SBS, protective layers PL1, PL2, and insulating layers IL1, IL2. The electronic component 120_1 is disposed on a first surface of the substrate body SBS and is covered by the protective layer PL1. The insulating layer IL1 covers a second surface of the substrate body SBS. The second surface is opposite to the first surface. The ground connection line G1 is disposed on the insulating layer IL1 and is covered by the insulating layer IL2. The transmission path P1 is disposed on the insulating layer IL2. The protective layer PL2 covers the insulating layer IL2 and at least a portion of the transmission path P1.

[0131] In the present embodiment, the first end of the switch element SW1 is electrically connected to the transmission path P1 on the insulating layer IL3 by, for example, surface mount technology. The impedance matching circuit 160_1 includes an inductor L1, a capacitor C1, and a resistor R1. The inductor L1, the capacitor C1, and the resistor R1 are connected in series between the second end of the switch element SW1 and the reference low voltage by, for example, surface mount technology. The switch element SW1, the inductor L1, the capacitor C1, and the resistor R1 are surface mount devices (SMDs).

[0132] In addition, the electronic element 120_1 may be electrically connected to the first end of the switch element SW1 , for example, through a via structure (not shown) and / or a connection structure (not shown) between the insulating layers IL1 ˜ IL3 .

[0133] Please refer to Fig.10 , Fig.10 It is a schematic diagram of an electronic element, an impedance matching circuit and a switch element according to an embodiment of the present disclosure. Fig.10 A cross-sectional view along the section line AA is shown. Fig. 9 The difference is that the substrate SB further includes an insulating layer IL3. The insulating layer IL3 covers the insulating layer IL2 and is covered by the protection layer PL2. The inductor L1 and the capacitor C1 of this embodiment are fabricated on the insulating layer IL3 using an integrated passive technology.

[0134] In some embodiments, the resistor R1 is fabricated on the insulating layer IL3 using an integrated passive technology and covered by the protection layer PL2. In some embodiments, the switch element SW1 is fabricated on the insulating layer IL3 using an integrated passive technology and covered by the protection layer PL2.

[0135] In summary, the electronic device at least includes a radio frequency component, a first electronic component, a first coupler, a detector, a controller, and a first impedance matching circuit. The electronic device generates a judgment signal according to the coupled output signal and the coupled output signal, and generates a control signal according to the judgment signal. Therefore, the first impedance matching circuit responds to the control signal to provide the impedance of the transmission path between the radio frequency component and the first electronic component. In this way, the impedance of the transmission path between the radio frequency component and the first electronic component can be matched.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An electronic device, characterized in that: The electronic device comprises: substrate; A radio frequency component is disposed on the substrate; A first electronic component is disposed on the substrate and electrically connected to the radio frequency component; a first coupler disposed on the substrate and configured to generate a first coupled output signal in response to a first input coupled signal and to generate a second coupled output signal in response to a second input coupled signal; a detector disposed on the substrate, electrically connected to the first coupler, and configured to generate a first determination signal according to the first coupled output signal and the second coupled output signal; a controller, disposed outside the substrate, electrically connected to the detector, and configured to generate a first control signal according to the first determination signal; and The first impedance matching circuit is disposed on the substrate, electrically connected to the controller, and configured to provide an impedance of a transmission path between the RF component and the first electronic component in response to the first control signal.

2. The electronic device according to claim 1, characterized in that: The first electronic component is one of an antenna element and a power divider.

3. The electronic device according to claim 1, characterized in that: The electronic device further comprises: A second electronic component is disposed on the substrate; The second coupler is disposed on the substrate, electrically connected to the detector, and configured to generate a third coupled output signal in response to a third input coupled signal and to generate a fourth coupled output signal in response to a fourth input coupled signal.

4. The electronic device according to claim 3, characterized in that: The detector generates a second determination signal according to the third coupled output signal and the fourth coupled output signal.

5. The electronic device according to claim 4, characterized in that: The controller generates a second control signal according to the second determination signal.

6. The electronic device according to claim 5, characterized in that: The electronic device further comprises: The second impedance matching circuit is disposed on the substrate, electrically connected to the controller, and configured to provide an impedance of a transmission path between the RF component and the second electronic component in response to the second control signal.

7. The electronic device according to claim 1, characterized in that: The electronic device further comprises: A switch element is disposed on the substrate, wherein the first end of the first impedance matching circuit is electrically connected to the first electronic element and the radio frequency element through the switch element.

8. The electronic device according to claim 7, characterized in that: The second end of the first impedance matching circuit is electrically connected to a reference low voltage.

9. The electronic device according to claim 1, characterized in that: When the first determination signal is greater than a threshold, the controller changes the first control signal so that the first impedance matching circuit changes the impedance of the transmission path between the RF component and the first electronic component according to the first control signal.

10. The electronic device according to claim 1, characterized in that: The first impedance matching circuit changes at least one of a resistance value, a capacitance value, and an inductance value of the first impedance matching circuit in response to the first control signal.

Images