Heat dissipation control method and device, equipment, storage medium and program product

Abstract

The invention discloses a heat dissipation control method and device, equipment, a storage medium and a program product, relates to the technical field of server heat dissipation, and can monitor the heat state of a server in real time by obtaining current data of a heat dissipation component. Then, the data are input into a pre-established heat dissipation model, and the model is based on a heat balance equation and a state-space equation of a server and can accurately predict the temperature adjusting amount. Therefore, the system can actively adjust the heat dissipation strategy instead of passively responding to the temperature change, dependence on experimental data is reduced, and complex PID parameter adjustment is avoided. Dynamic control is carried out according to the temperature adjusting quantity, the system can quickly respond to temperature changes, optimize the rotating speed of the fan and reduce energy consumption, meanwhile, the operation stability and reliability of the server are improved, the technical problem of heat dissipation control is solved, and the technical effect of heat dissipation control is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation control method, device, equipment, storage medium and program product. Background Art

[0002] With the rapid development of information technology, the improvement of server performance has led to an increase in the heat generated by internal components of the server, posing a new challenge to the heat dissipation control of the server.

[0003] In related technologies, a proportional-integral-derivative (PID) control method can be used for heat dissipation control. However, overshoot and oscillation have occurred in the above manner, affecting the stable operation of the server. Summary of the Invention

[0004] The present application provides a heat dissipation control method, device, equipment, storage medium and program product, which improves the efficiency and accuracy of heat dissipation control, avoids overshoot and oscillation, and improves the stability of the server.

[0005] The present application provides a heat dissipation control method, including:[[]]

[0006] Obtaining current data of heat dissipation parameters of a heat dissipation component of a server to be processed;

[0007] Inputting the current data into a heat dissipation model corresponding to the server to be processed to obtain a corresponding temperature adjustment amount; the heat dissipation model is determined in advance according to the heat balance equation and state space equation of the server to be processed; the heat balance equation is based on the heat dissipation system architecture of the processing server;

[0008] Performing heat dissipation control on the server to be processed according to the temperature adjustment amount.

[0009] The present application also provides a heat dissipation control device, including:[[]]

[0010] An obtaining module, configured to obtain current data of heat dissipation parameters of a heat dissipation component of a server to be processed;

[0011] An input module, configured to input the current data into a heat dissipation model corresponding to the server to be processed to obtain a corresponding temperature adjustment amount; the heat dissipation model is determined in advance according to the heat balance equation and state space equation of the server to be processed; the heat balance equation is based on the heat dissipation system architecture of the processing server;

[0012] A control module, configured to perform heat dissipation control on the server to be processed according to the temperature adjustment amount.

[0013] The present application also provides an electronic device, including: a memory for storing a computer program; a processor for implementing the steps of any of the above heat dissipation control methods when executing the computer program.

[0014] The present application also provides a computer-readable storage medium storing a computer program, wherein the computer program implements the steps of any of the above heat dissipation control methods when executed by a processor.

[0015] The present application also provides a computer program product including a computer program, and the computer program implements the steps of any of the above heat dissipation control methods when executed by a processor.

[0016] Through the present application, by obtaining the current data of the heat dissipation component, the thermal state of the server can be monitored in real time. Then, these data are input into a pre-established heat dissipation model, which is based on the heat balance equation and state space equation of the server and can accurately predict the temperature adjustment amount. This enables the system to actively adjust the heat dissipation strategy instead of passively responding to temperature changes, reduces the dependence on experimental data, and avoids complex PID parameter adjustment. By dynamically controlling according to the temperature adjustment amount, the system can quickly respond to temperature changes, optimize the fan speed, reduce energy consumption, and improve the operating stability and reliability of the server. Description of the Drawings

[0017] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a flowchart of the heat dissipation control method in the related art;

[0019] Figure 2 It is a schematic diagram of the application scenario of the heat dissipation control method provided by the embodiment of the present application;

[0020] Figure 3 It is a flowchart of the heat dissipation control method provided by the embodiment of the present application Figure 1 ;

[0021] Figure 4 It is a flowchart of the heat dissipation control method provided by the embodiment of the present application Figure 2 ;

[0022] Figure 5 It is a schematic diagram of the structure of the heat dissipation control device provided by the embodiment of the present application;

[0023] Figure 6Schematic structural diagram of the electronic device provided by this application. Detailed implementation manners

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0025] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0026] With the rapid development of information technology, as the core device for data storage and processing, the performance and stability of servers are crucial for ensuring the continuity and quality of various online services. However, with the continuous improvement of server performance, the heat generated by its internal components (such as the Central Processing Unit (CPU), Graphics Processing Unit (GPU), memory, etc.) has increased sharply, which poses a severe challenge to the server's cooling system. In the field of server cooling technology, the air-cooling method is widely used, that is, the temperature of internal components is regulated by controlling the fan speed to prevent performance degradation or damage caused by overheating.

[0027] In the related art, limited by the inability to establish an accurate server cooling model, the Proportional-Integral-Derivative (PID) is usually only used as the cooling control method. Exemplarily, as Figure 1 shown, temperature regulation can be performed based on the temperature regulation curve and PID. In the specific implementation process, the server periodically collects the temperatures of each component. If the temperature is lower than the preset temperature value, the fan speed is controlled through the temperature regulation curve. If the temperature is higher than the preset temperature, the fan speed is controlled through PID.

[0028] However, for the temperature control curve adopted in the above method, a large amount of test data is required for fitting and establishment. Moreover, for server models with different configurations, the temperature control curve usually needs to collect data again for establishment. The PID control adopted adjusts the control input based on the deviation between the current state and the target state of the system. The adjustment of PID parameters is relatively complex, and often needs to be readjusted for different server models. In addition, the PID control accuracy is limited and it is easy to have overshoot and oscillation problems, which affects the stable operation of the server.

[0029] In order to solve the above technical problems, the inventors of this application found through research that a heat dissipation model that can accurately reflect the heat dissipation process of the server can be constructed to improve the server heat dissipation efficiency, reduce energy consumption, and ensure the stable operation of the server. Specifically, a heat balance equation of the server heat dissipation system can be constructed based on the heat dissipation system architecture of the air-cooled server. Further, a linearized state space equation of the server heat dissipation system can be constructed based on the heat balance equation, and a heat dissipation model can be established based on this. Furthermore, heat dissipation control can be performed based on this heat dissipation model. Based on this, an embodiment of this application provides a heat dissipation control method.

[0030] In order to enable those skilled in the art of this technology to better understand the solution of this application, the following further elaborates on this application in conjunction with the accompanying drawings and specific implementation manners.

[0031] Combined with the specific application environment architecture or specific hardware architecture on which the execution of the heat dissipation control method depends, the specific application environment architecture or specific hardware architecture is described herein. Refer to Figure 2 , Figure 2 is a schematic diagram of the application scenario of the heat dissipation control method provided by the embodiment of this application. As Figure 2 shown, the air-cooled server includes a GPU, a memory, a CPU, and a fan group.

[0032] In the specific implementation process, the heat-generating components (such as GPUs, memories, CPUs) and heat-dissipating components (such as fan groups) in the heat dissipation system architecture of the air-cooled server can be determined. Then, based on this heat dissipation system architecture, a heat balance equation of the air-cooled server is constructed, and the heat balance equation is linearized to obtain a linearized state space equation. Furthermore, based on this state space equation, a heat dissipation model of the air-cooled server is constructed. In the actual application of heat dissipation control, the current data of the heat dissipation parameters of the heat-dissipating components of the server to be processed can be obtained, and the current data is input into the corresponding heat dissipation model of the server to be processed to obtain the corresponding temperature adjustment amount. According to the temperature adjustment amount, heat dissipation control is performed on the server to be processed. The heat dissipation control method provided in this embodiment can monitor the thermal state of the server in real time by obtaining the current data of the heat-dissipating components. Then, these data are input into the pre-established heat dissipation model. This model is based on the heat balance equation and state space equation of the server and can accurately predict the temperature adjustment amount. This enables the system to actively adjust the heat dissipation strategy instead of passively responding to temperature changes, reduces the dependence on experimental data, and avoids complex PID parameter adjustment. By performing dynamic control according to the temperature adjustment amount, the system can quickly respond to temperature changes, optimize the fan speed, reduce energy consumption, and improve the operating stability and reliability of the server.

[0033] Figure 3 The flowchart of the heat dissipation control method provided by the embodiment of the present application Figure 1 , as Figure 3 shown, the embodiment of the present application provides a heat dissipation control method, and the method is described in detail as follows:

[0034] 301. Obtain the current data of the heat dissipation parameters of the heat-dissipating components of the server to be processed.

[0035] The execution subject of this embodiment can be a terminal device or a server. Such as Figure 1 the air-cooled server shown.

[0036] In this embodiment, the server to be processed can be an air-cooled server. The heat-dissipating component can be a fan group. The heat dissipation parameter can be the fan speed. The current data can be the current value of the fan speed of the fan group of the air-cooled server.

[0037] 302. Input the current data into the corresponding heat dissipation model of the server to be processed to obtain the corresponding temperature adjustment amount; the heat dissipation model is determined in advance according to the heat balance equation and state space equation of the server to be processed; the heat balance equation is determined based on the heat dissipation system architecture of the processing server.

[0038] Specifically, the heat-generating components (such as GPUs, memories, CPUs) and heat-dissipating components (such as fan groups) in the heat dissipation system architecture of the air-cooled server can be determined first. Then, based on this heat dissipation system architecture, a heat balance equation of the air-cooled server is constructed, and the heat balance equation is linearized to obtain a linearized state space equation. Then, based on this state space equation, a heat dissipation model of the air-cooled server is constructed. After the heat dissipation model is constructed, taking the server to be processed as an air-cooled server as an example, the current data of heat dissipation parameters such as the fan speed obtained in real time can be input into the heat dissipation model. Then, the heat dissipation model outputs the temperature adjustment amount corresponding to the current fan speed. The temperature adjustment amount can be the difference between the actual temperature of the server to be processed and the preset target temperature (steady-state temperature).

[0039] 303. Perform heat dissipation control on the server to be processed according to the temperature adjustment amount.

[0040] Specifically, performing heat dissipation control on the server to be processed according to the obtained temperature adjustment amount is a key step to ensure that the server operates within the optimal temperature range. Specifically, the temperature adjustment amount reflects the difference between the current server temperature and the preset target temperature. By analyzing this difference, the specific heat dissipation measures to be taken can be determined. First, the system evaluates the magnitude and direction of the temperature adjustment amount. If the temperature adjustment amount is positive, it means that the current temperature is higher than the target temperature, and the heat dissipation intensity needs to be increased. At this time, the system can enhance the heat dissipation effect by increasing the fan speed and quickly reduce the server temperature. On the contrary, if the temperature adjustment amount is negative, it means that the current temperature is lower than the target temperature, and excessive heat dissipation may not be required. The system can appropriately reduce the fan speed to save energy consumption and reduce fan wear. In addition, other parameters such as the ambient temperature and server load can be combined during the heat dissipation control process for more refined adjustment. This dynamic adjustment mechanism not only improves the heat dissipation efficiency but also effectively extends the service life of the server and the fan, ensuring the stability and reliability of the system. Through real-time monitoring and adjustment, the system can quickly respond to temperature changes and keep the server within a safe operating temperature range.

[0041] As can be seen from the above description, the heat dissipation control method provided by the embodiments of the present application can monitor the thermal state of the server in real time by obtaining the current data of the heat-dissipating components. Then, these data are input into a pre-established heat dissipation model. Based on the heat balance equation and state space equation of the server, this model can accurately predict the heat dissipation change amount. This enables the system to actively adjust the heat dissipation strategy instead of passively responding to temperature changes, reduces the dependence on experimental data, and avoids complex PID parameter adjustment. By performing dynamic control according to the heat dissipation change amount, the system can quickly respond to temperature changes, optimize the fan speed, reduce energy consumption, and at the same time improve the operating stability and reliability of the server.

[0042] Figure 4 Schematic flow of the heat dissipation control method provided by the embodiment of the present application Figure 2 , such as Figure 4 shown. Based on the above embodiments, for example, on the basis of the embodiment shown in Figure 3 , the embodiment of the present application describes the construction process of the heat dissipation model in detail as follows:

[0043] 401. Based on the heat dissipation system architecture of the processing server, establish the heat balance equation of the server to be processed; the heat dissipation system architecture includes heat dissipation components and multiple heat generation components.

[0044] Specifically, establishing the heat balance equation of the server to be processed is the basis of the entire heat dissipation control method. This step involves a detailed analysis of the heat dissipation system architecture of the server to accurately describe the generation and dissipation of heat during the operation of the server. First, it is necessary to identify all the heat generation components and heat dissipation components in the server. Decouple the heat generation components and heat dissipation components of the server to be processed. The heat generation components usually include a central processing unit (CPU), a graphics processing unit (GPU), a memory module, etc. The heat generation components generate a large amount of heat during operation. The heat dissipation component can be a fan group, and the heat dissipation component is used to take the heat away from the inside of the server. After determining the heat generation components and heat dissipation components, a heat balance equation can be established based on the characteristics and mutual relationships of these components. The heat balance equation describes the input, output, and storage of heat inside the server. Specifically, the equation considers factors such as the heat generation rate of each heat generation component, the heat transfer efficiency of the heat dissipation component, and the overall heat capacity of the system.

[0045] In some embodiments, based on the heat dissipation system architecture of the processing server, constructing the heat balance equation of the server to be processed may include: obtaining the heat dissipation system architecture of the server to be processed; for each heat - generating component, determining the heat - generating power of the heat - generating component and the heat - dissipating power of the heat - dissipating component corresponding to the heat - generating component; based on the heat calculation formula, determining the first relationship corresponding to the heat - generating component according to the heat - generating power and the heat - dissipating power; and determining the heat balance equation of the server to be processed according to the first relationships respectively corresponding to multiple heat - generating components. The heat dissipation control method provided in this embodiment can accurately construct the heat balance equation of the server by obtaining the heat dissipation system architecture of the server to be processed and determining the heat - generating power and the corresponding heat - dissipating power for each heat - generating component. By using the heat calculation formula, the system can establish the first relationship for each heat - generating component, and these relationships comprehensively reflect the heat generation and dissipation inside the server. Finally, by integrating the first relationships of multiple heat - generating components, a complete heat balance equation is formed. This method can accurately describe the thermal dynamic behavior of the server under different working conditions, making the heat dissipation model more accurate and reliable. Through this accurate heat balance analysis, the system can optimize the heat dissipation strategy in real - time, improve the heat dissipation efficiency, reduce the energy consumption, and ensure the server operates stably within a safe temperature range. This not only extends the service life of the device but also enhances the overall reliability and performance of the system.

[0046] Specifically, first, a comprehensive understanding of the heat dissipation system architecture of the server to be processed can be obtained, including identifying all heat - generating components (such as CPUs, GPUs, memory modules, etc.) and heat - dissipating components (such as fans, heat sinks, etc.), and determining the physical layout and interaction between the heat - generating components and the heat - dissipating components. Next, for each heat - generating component, calculate its heat - generating power, which can be measured or estimated according to the device specifications. At the same time, evaluate the heat - dissipating power of the heat - dissipating components associated with each heat - generating component, which involves analyzing the efficiency of the heat - dissipating components and their performance under different conditions. Using the heat calculation formula and / or the heat power formula, establish the first relationship for each heat - generating component to describe the balance relationship between the heat - generating power and the heat - dissipating power, reflecting the dynamic balance between heat generation and heat dissipation in the steady state. Integrate the first relationships of all heat - generating components to form the heat balance equation of the entire server. This equation comprehensively considers the heat exchange processes of all components and provides a global perspective to show the thermal dynamic behavior of the server. The heat balance equation can not only be used for real - time monitoring and prediction of the server's thermal state but also serve as the basis for optimizing the heat dissipation strategy, enabling the system to dynamically adjust the heat dissipation measures under different working conditions to ensure the server operates within the optimal temperature range. This precise thermal management not only improves the heat dissipation efficiency and reduces the energy consumption but also significantly enhances the stability and reliability of the server.

[0047] In some embodiments, determining the heat generation power of a heat - generating component may include: determining the heat generation power of the heat - generating component according to the operating power and heat generation coefficient of the heat - generating component. The heat dissipation control method provided in this embodiment can achieve more precise thermal management by determining the heat generation power based on the operating power and heat generation coefficient of the heat - generating component. The operating power represents the actual power consumption of the heat - generating component under a specific load, while the heat generation coefficient reflects the efficiency of converting electrical energy into heat energy. By combining these two parameters, the system can accurately calculate the actual heat generation power of each heat - generating component, thereby providing reliable data support for the heat balance equation. This precise calculation method reduces the reliance on empirical estimation, improves the accuracy and efficiency of the heat dissipation design. The system can more effectively optimize the heat dissipation strategy to ensure the best temperature can be maintained under different working conditions. This not only reduces energy consumption but also extends the service life of the device, improving the stability and reliability of the server. Through precise thermal management, the server can operate efficiently while reducing the risk of overheating and improving the overall performance.

[0048] Specifically, heat - generating components such as the CPU, GPU, and memory generate heat when powered on, that is, electrical energy is converted into heat energy, which is the heat source of the server. Therefore, the calculation formula for the heat generation power of the server is as follows:

[0049] P 产热 =B×P (1)

[0050] Where, P 产热 is the heat generation power generated by the heat - generating component, B is the heat generation coefficient of the heat - generating component, and P is the operating power of the heat - generating component.

[0051] In some embodiments, determining the heat dissipation power of the heat - dissipating component corresponding to the heat - generating component may include: determining the heat dissipation power of the heat - dissipating component corresponding to the heat - generating component according to the heat transfer coefficient and heat dissipation parameters of the heat - dissipating component, the temperature of the heat - generating component, and the ambient temperature. The heat dissipation control method provided in this embodiment can achieve more efficient thermal management by determining the heat dissipation power based on the heat transfer coefficient and heat dissipation parameters of the heat - dissipating component, the temperature of the heat - generating component, and the ambient temperature. The heat transfer coefficient and heat dissipation parameters jointly describe the performance characteristics of the heat - dissipating component, while the difference between the temperature of the heat - generating component and the ambient temperature determines the driving force for heat transfer. By integrating these factors, the system can accurately calculate the actual heat dissipation power of the heat - dissipating component. The beneficial effect of this method is that it provides a precise quantification of the heat dissipation process, enabling the heat dissipation system to be dynamically adjusted to cope with different heat loads and environmental changes. The system can more effectively optimize the fan speed and other heat dissipation measures to ensure that the server operates within the best temperature range. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server and extends the service life of the device.

[0052] Specifically, taking the fan as the heat dissipation component of the system as an example, its heat dissipation principle is the convective heat transfer law. Based on this law, the calculation formula for the heat dissipation power of the fan of the server to be processed is as follows:

[0053] P 散热 =H×A×ΔT (2)

[0054] Among them, P 散热 is the heat dissipation power dissipated by the fan. H is the convective heat transfer coefficient, which represents the heat flux per unit area and per unit temperature difference. A is the surface area of the solid (heat generating component) in contact with the fluid, and ΔT is the temperature difference between the surface of the solid (heat generating component) and the fluid.

[0055] Among them, the convective heat transfer coefficient H has a positive correlation with the rotational speed U of the fan. Therefore, it can be approximated as:

[0056] H = D×U (3)

[0057] Among them, D is the rotational speed heat transfer proportionality coefficient of the fan, which is determined by the physical properties of the fan and the duct design, and U is the rotational speed of the fan.

[0058] In this embodiment, the heat transfer coefficient K can be the product of the rotational speed heat transfer proportionality coefficient D of the fan and the surface area A of the solid in contact with the fluid, and the heat dissipation parameter can be the rotational speed U of the fan.

[0059] In some embodiments, based on the heat calculation formula, according to the heat generation power and the heat dissipation power, determining the first relationship corresponding to the heat generating component may include: based on the heat calculation formula, determining the heat dissipation parameter of the heat dissipation component, the heat generation power of the heat generating component, the temperature difference of the heat generating component within the first time period, the heat capacity of the heat generating component, the temperature of the heat generating component at the current moment, the ambient temperature at the current moment, and the first relationship among the first time period. The heat dissipation control method provided in this embodiment can accurately model the thermal dynamic behavior by determining the first relationship among the heat dissipation parameter of the heat dissipation component, the heat generation power of the heat generating component, the temperature difference, the heat capacity, and the ambient temperature, etc. based on the heat calculation formula. By considering these key parameters, the system can accurately describe the heat change of the heat generating component within a specific time period. The beneficial effect of this method is that it provides a comprehensive thermal management framework, enabling the heat dissipation system to dynamically adapt to different working conditions and environmental changes. The system can more effectively optimize the heat dissipation strategy to ensure that the server operates within the optimal temperature range. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server and extends the service life of the device. Through precise thermal management, the server can operate efficiently while reducing the risk of overheating and improving the overall performance.

[0060] Further, based on the heat calculation formula Q = M×C×ΔT, the heat balance equation of the server heat dissipation control system within time t can be obtained, and the formula is as follows:

[0061] M×C×(T K+1 –T K )=(P 产热 -P 散热 )×t (4)

[0062] Wherein, M is the mass of the heat - generating component, C is the specific heat capacity of the heat - generating component, T K+1 is the temperature of the heat - generating component at the next moment, T K is the temperature of the heat - generating component at the current moment, and t is the first time period.

[0063] Taking the CPU, a heat - generating component, as an example, the above formula can be written as:

[0064] C M1 ×ΔT 1 =(P 产热1 -P 散热1 )×t (5)

[0065] P 散热1 =K 1 ×U×(T1–T0) (6)

[0066] Wherein, C M1 is the product of the mass M 1 and the specific heat capacity C 1 of the CPU, which is determined by the physical properties of the CPU and is a fixed parameter; ΔT 1 is the temperature difference of the CPU within time t (the first time period); P 产热1 is the heat - generating power of the CPU; P 散热1 is the heat - dissipation power of the fan for the CPU; K 1 is the heat - transfer coefficient, which is the product of the rotational - speed heat - transfer ratio coefficient D1 of the fan for the CPU and the surface area A1 of the CPU in contact with the fluid, and is a fixed parameter; U is the fan speed; T 1 is the temperature of the CPU at time t, and T 0 is the ambient temperature at time t.

[0067] By analogy, the heat balance equations of other heat - generating components such as memory and GPU in the server system can be obtained in the same way.

[0068] Taking the CPU and memory in the server as an example, based on expressions (5) and (6), the heat balance formulas of the CPU and memory can be obtained, that is, the first relational expressions corresponding to the heat - generating components CPU and memory are as follows:

[0069] C M1 ×ΔT 1 =(P产热1 -K 1 ×U×(T 1 –T 0 ))×t (CPU) (7)

[0070] C M2 ×ΔT 2 =(P 产热2 -K 2 ×U×(T 2 –T 0 ))×t (memory) (8)

[0071] Among them, C M1 is the product of the mass M 1 and specific heat capacity C 1 of the CPU, C M2 is the product of the mass M 2 and specific heat capacity C 2 of the memory, which is determined by the physical properties of the CPU and the memory and is a fixed parameter; ΔT 1 is the temperature difference of the CPU within time t, ΔT 2 is the temperature difference of the memory within time t; P 产热1 is the heat generation power of the CPU, P 产热2 is the heat generation power of the memory; P 散热1 is the heat dissipation power of the fan for the CPU, P 散热2 is the heat dissipation power of the fan for the memory; K 1 is the heat transfer coefficient corresponding to the CPU, which is the product of the rotational speed heat transfer ratio coefficient D 1 of the fan for the CPU and the surface area A 1 in contact between the CPU and the fluid, K 2 is the heat transfer coefficient corresponding to the memory, which is the product of the rotational speed heat transfer ratio coefficient D 2 of the fan for the memory and the surface area A 2 in contact between the memory and the fluid, and is a fixed parameter; U is the fan speed; T 1 is the temperature of the CPU at time t, T 2 is the temperature of the memory at time t, T 0 is the ambient temperature at time t; t is the first time duration.

[0072] 402. Linearize the heat balance equation to obtain the state space equation of the server to be processed.

[0073] Specifically, the heat balance equation is usually non - linear, which describes the heat exchange and dynamic balance among various components inside the server. However, non - linear equations are relatively complex in analysis and calculation, and directly applying them to a real - time control system may lead to an excessive computational burden. The linearization process aims to simplify the complex non - linear equation into a linear equation for easier analysis and control. In one implementable way, numerical methods can be used to solve the responses of the heat balance equation under different inputs and states, and then the numerical solutions can be fitted into a linear state - space model through fitting techniques such as the least - squares method. In another implementable way, linearization is usually performed near a certain operating point of the system, so that the behavior of the non - linear system can be approximately described by a linear equation. Through this method, the heat balance equation is transformed into a state - space equation, which represents the dynamic characteristics of the system in matrix form, including state variables, inputs, outputs, and system matrices, etc. The state - space equation enables the system to use various methods in modern control theory to design and optimize the heat dissipation control strategy, thereby improving the response speed and accuracy of the control system. This method enables the system to dynamically adapt to different operating conditions and environmental changes, ensuring that the server operates efficiently within the optimal temperature range. The linearization process and state - space modeling lay the foundation for realizing intelligent and automated heat dissipation control.

[0074] In some embodiments, linearizing the heat balance equation to obtain the state - space equation of the server to be processed may include: linearizing the heat balance equation based on the steady - state operating point to obtain the state - space equation of the server to be processed. The heat dissipation control method provided in this embodiment can significantly simplify the complex heat management problem by linearizing the heat balance equation based on the steady - state operating point to obtain the state - space equation of the server to be processed. By selecting an appropriate steady - state operating point, the system can linearly approximate the non - linear heat dynamic behavior near this point, thus transforming the complex heat balance equation into a linear state - space model that is easy to analyze and control. The beneficial effect of this method is that it reduces the computational complexity, making real - time control and optimization possible. The linearized state - space equation provides a clear framework for applying modern control theory to system design and optimization. The system can adjust the heat dissipation strategy more effectively to ensure that the server maintains the optimal temperature under different load conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server.

[0075] In some embodiments, based on the steady-state operating point, linearizing the heat balance equation to obtain the state-space equation of the server to be processed may include: for each heat-generating component, according to the heat balance equation corresponding to the heat-generating component, determining, when the heat-generating component is at the steady-state temperature and the heat dissipation parameter of the heat-dissipating component is the steady-state parameter value, a second relationship between the heat generation power of the heat-generating component, the steady-state parameter value, and the steady-state temperature; according to the second relationships respectively corresponding to multiple heat-generating components, determining the state-space equation of the server to be processed; the state-space equation includes a third relationship between the first derivative of the temperature adjustment amount, the system matrix, the state vector, the input matrix, and the input vector; the state vector includes the temperature differences of multiple heat-generating components within the first duration respectively corresponding to them, and the input vector includes the heat dissipation parameters of the heat-dissipating component. The heat dissipation control method provided in this embodiment can accurately construct the state-space equation of the server by, for each heat-generating component, determining the relationship between the heat generation power, the steady-state parameter, and the temperature according to its heat balance equation under steady-state conditions. Through this linearization process, the system can simplify the complex heat dynamic behavior into a linear model, where the state-space equation includes the first derivative of the temperature adjustment amount, the system matrix, the state vector, and the input vector, etc. The state vector reflects the temperature changes of each heat-generating component, while the input vector contains the parameters of the heat-dissipating component. The beneficial effect of this method is that it provides an accurate and easy-to-analyze framework, making real-time temperature control and optimization possible. The system can dynamically adjust the heat dissipation strategy to ensure that the server maintains the optimal temperature under various load conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server.

[0076] Specifically, if the time t is short enough, then (ΔT 1 / t)=T 1 ~(T 1 ~ is the first derivative of the variable T1), so it can be obtained based on expressions (7) and (8):

[0077] T 1 ~ =(P 产热1 -K 1 ×U×(T 1 –T 0 ) / C M1 (CPU) (9)

[0078] T 2 ~ =(P 产热2 -K 2 ×U×(T 2 –T 0 ) / C M2 (memory) (10)

[0079] Where, T1 is the temperature of the CPU, T 2 is the temperature of the memory and is a state variable of the system; U is the rotational speed of the fan and is an input variable of the system; the meanings of the parameters can be referred to the introductions of formulas (7) and (8). Since there are products of U and T 1 , T 2 in the relational expressions (9) and (10), the model of this system is a non-linear model and needs to be linearized for subsequent model-based analysis and control.

[0080] Furthermore, the method of steady-state operating point can be adopted for model linearization. If the heat dissipation control objectives of the server to be processed are that the temperatures of the CPU and the memory are respectively stabilized at the steady-state temperatures T 1W and T 2W , then the final control effect is that the system achieves a thermal equilibrium steady state at the operating point (T 1W , T 2W , U W ), and U W is the steady-state rotational speed of the fan. Because at the steady-state operating point, the temperatures of the CPU and the memory no longer change, that is, T 1 ~ = T 2 ~ = 0, then there is the following formula, that is, the second relational expression:

[0081] P 产热1 = K 1 × U W × (T 1W – T 0 ) (CPU) (11)

[0082] P 产热2 = K 2 × U W × (T 2W – T 0 ) (memory) (12)

[0083] Among them, P 产热1 is the heat generation power of the CPU, P 产热2 is the heat generation power of the memory; K 1 is the heat transfer coefficient corresponding to the CPU, which is the product of the rotational speed heat transfer ratio coefficient D 1 of the fan for the CPU and the surface area A 1 in contact between the CPU and the fluid, K 2 is the heat transfer coefficient corresponding to the memory, which is the product of the rotational speed heat transfer ratio coefficient D 2 of the fan for the memory and the surface area A 2 in contact between the memory and the fluid, and are fixed parameters; U W is the steady-state rotational speed of the fan, that is, the steady-state heat dissipation parameter; T1W is the steady-state temperature of the CPU, T 2W is the steady-state temperature of the CPU, T 0 is the ambient temperature.

[0084] Furthermore, based on this steady-state operating point, let ΔT 1 = T 1 - T 1W , ΔT 2 = T 2 – T 2W , ΔU = U – U W , substituting into the relational expression (9) gives:

[0085] (ΔT 1 + T 1W ) ~ = (P 产热1 - K 1 × (ΔU + U W ) × (ΔT 1 + T 1W – T 0 ) ) / C M1 (CPU) (13)

[0086] where, P 产热1 is the heat generation power of the CPU, ΔT 1 is the difference between the actual temperature T 1 of the CPU and the CPU control target temperature (steady-state temperature) T 1W , ΔU is the difference between the actual fan speed U and the steady-state speed U W ; K 1 is the heat transfer coefficient corresponding to the CPU, which is the product of the rotational speed heat transfer ratio coefficient D 1 of the fan for the CPU and the surface area A 1 where the CPU contacts the fluid; C M1 is the product of the mass M 1 of the CPU and the specific heat capacity C 1 , T 0 is the ambient temperature.

[0087] Also, since in the expression (11), P 产热1 = K 1 × U W × (T 1W – T 0 ), and ignoring the high-order term ΔU × ΔT1, we get:

[0088] ΔT 1 ~ = (-K 1 × U W / C M1 ) × ΔT 1+ (-K 1 (T 1W – T 0 ) / C M1 ) × ΔU (CPU) (14)

[0089] Where, T 1W is a constant, (ΔT 1 + T 1W ) ~ can be simplified to ΔT 1 ~ ; ΔT 1 is the difference between the actual temperature T 1 of the CPU and the CPU control target temperature (steady-state temperature) T 1W ; ΔU is the difference between the actual fan speed U and the steady-state speed U W ; K 1 is the heat transfer coefficient corresponding to the CPU, which is the product of the rotational speed heat transfer proportionality coefficient D 1 of the fan for the CPU and the surface area A 1 in contact between the CPU and the fluid; C M1 is the product of the mass M 1 of the CPU and the specific heat capacity C 1 , and T 0 is the ambient temperature.

[0090] Similarly, for the memory, we can get:

[0091] ΔT 2 ~= (-K 2× U W / C M2 ) × ΔT 2 + (-K 2 (T 2W – T 0 ) / C M2 ) × ΔU (memory) (15)

[0092] Where, T 2W is a constant, (ΔT 2 + T 2W ) ~ can be simplified to ΔT 2 ~ ; ΔT 2 is the difference between the actual temperature T 2 of the memory and the memory control target temperature (steady-state temperature) T 2W ; ΔU is the difference between the actual fan speed U and the steady-state speed U W ; K 2 is the heat transfer coefficient corresponding to the memory, which is the product of the rotational speed heat transfer proportionality coefficient D 2 of the fan for the memory and the surface area A 2The product of; C M2 is the mass M of the memory 2 and the specific heat capacity C 2 of the product, T 0 is the ambient temperature.

[0093] Furthermore, the state - space equation of the heat - dissipation control system of the server to be processed can be constructed. The state - space equation of the system is a mathematical model describing the behavior of a dynamic system and consists of two parts: the state equation and the output equation.

[0094] Based on the above - obtained formulas (14) and (15) and matrix operations, the state equation of the system can be obtained as follows:

[0095] ΔT ~ =A×ΔT + B×U (16)

[0096] where, ΔT=[ΔT 1 ,ΔT 2 T is the state vector;

[0097] U = [U]: is the input vector;

[0098] A=[(-K 1 ×U W / C M1 ,0),(0,-K 2 ×U W / C M2 )T: is the system matrix;

[0099] B=[(-K 1 (T 1W –T 0 ) / C M1 ),( - K 2 (T 2W –T 0 ) / C M2 )T: is the input matrix.

[0100] The meanings of the parameters can be referred to the introductions of formulas (14) and (15).

[0101] Based on the above - obtained formulas (14) and (15) and matrix operations, the output equation of this system can be obtained as follows:

[0102] Y = C×ΔT (17)

[0103] where, Y=[ΔT 1 ,ΔT 2 T: is the output vector;

[0104] ΔT=[ΔT 1 ,ΔT 2 T: is the state vector;

[0105] C = [(1, 0), (0, 1)]^T: is the output matrix; the meanings of the parameters can be referred to in Formulas (14) and (15).

[0106] 403. Determine the heat dissipation model corresponding to the server to be processed according to the state space equation.

[0107] In some embodiments, determining the heat dissipation model corresponding to the server to be processed according to the state space equation may include: through experimental calibration, determine the heat transfer coefficients and heat capacities respectively corresponding to multiple heat - generating components, and the steady - state heat dissipation parameters of the heat dissipation component; determine the system matrix and input matrix in the state space equation according to the heat transfer coefficients and heat capacities respectively corresponding to multiple heat - generating components, and the steady - state heat dissipation parameters of the heat dissipation component; based on the state space equation, determine the heat dissipation model of the server to be processed according to the system matrix and input matrix. The heat dissipation control method provided in this embodiment determines the heat transfer coefficients and heat capacities of each heat - generating component, and the steady - state heat dissipation parameters of the heat dissipation component through experimental calibration, and can accurately construct the heat dissipation model of the server. Through these experimental data, the system can accurately define the system matrix and input matrix in the state space equation, so as to accurately describe the thermal dynamic behavior. The beneficial effect of this method is that it provides a reliable data basis for the heat dissipation model, enabling the model to truly reflect the thermal response of the server under different working conditions. Through this accurate modeling, the system can optimize the heat dissipation strategy and dynamically adjust the heat dissipation measures to ensure that the server maintains the best temperature under various load conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server and extends the service life of the equipment.

[0108] Specifically, after obtaining the state equation (16) of the server heat dissipation control system (taking the heat - generating components as the CPU and memory as an example), only by obtaining matrices A and B, the relationship between ΔT and U can be established, and then the heat dissipation model of the heat dissipation control system of the server to be processed can be constructed. For matrices A and B (taking the CPU as an example), only by obtaining K1, UW, and CM1 can it be done.

[0109] In some embodiments, through experimental calibration, determining the heat transfer coefficients corresponding to multiple heat generating components may include: for each heat generating component, placing the heat generating component in a constant temperature environment, operating at a constant power, and setting the heat dissipation parameter to a constant value. After the server to be processed reaches the thermal equilibrium state, obtaining the heat generation power of the heat generating component, the temperature at the current moment, the ambient temperature, and the actual value of the heat dissipation parameter of the heat dissipation component, and determining the heat transfer coefficient corresponding to the heat generating component according to the heat generation power, the temperature at the current moment, the ambient temperature, and the actual value. The heat dissipation control method provided in this embodiment can accurately determine the heat transfer coefficients corresponding to each heat generating component by placing the heat generating component in a constant temperature environment and operating at a constant power, and obtaining key parameters after reaching the thermal equilibrium state. Through this experimental calibration method, the system can calculate the heat transfer coefficient under known environmental conditions by using the heat generation power, the current temperature, the ambient temperature, and the actual value of the heat dissipation parameter. The beneficial effect of this method is that it provides accurate heat transfer characteristic parameters for the heat dissipation model, enabling the model to more accurately reflect the actual thermal dynamic behavior. The system can optimize the heat dissipation strategy based on the accurate heat transfer coefficient to ensure that the server maintains the optimal temperature under various load conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server.

[0110] Specifically, for solving the parameter K 1 , if the heat dissipation control system is in a steady state, i.e., the thermal equilibrium state, the temperature of the heat generating component will no longer change, and then based on Equation (7), C M1 ×Δ T1 =(P 产热1 -K 1 ×U×(T 1 –T 0 ))×t = 0, that is:

[0111] K 1 =P 产热1 / (U×(T 1 –T 0 )) (17).

[0112] Among them, the meanings of the parameters can refer to the introduction of Equation (7).

[0113] In practical applications, in order to construct the thermal equilibrium state of the server, the server can be placed in a constant temperature environment, the server can be operated at a constant power, and the fan can be set to a constant speed. After normal operation for a period of time, observing that the temperatures of all components no longer change indicates that the server has reached the thermal equilibrium state. In this state, K 1 is solved.

[0114] Among them, P 产热1 =B 1 ×P 1 , B1 is the heat generation coefficient of the CPU, which can be obtained from the data sheet of the component, P 1 is the operating power of the CPU, which can be obtained from the BMC in the server; U is the actual rotation speed of the fan, which can be obtained from the BMC in the server; T 1 and T 0 are the actual temperature and the ambient temperature of the CPU respectively, which can be obtained from the BMC in the server. Then, according to formula (17), K for the CPU is obtained. 1 Similarly, K for the memory can be obtained. 2 and the parameter K of other components.

[0115] In some embodiments, through experimental calibration, the steady-state heat dissipation parameters of the heat dissipation component can be determined, which may include: for each heat generation component, obtaining the heat generation power and the ambient temperature of the heat generation component, and based on the second relational expression, determining the steady-state heat dissipation parameters of the heat dissipation component corresponding to the heat generation component according to the heat generation power and the ambient temperature; determining the steady-state heat dissipation parameters of the heat dissipation component according to the steady-state heat dissipation parameters corresponding to each heat generation component. The heat dissipation method provided in this embodiment can accurately evaluate the performance of the heat dissipation component under different heat source conditions by obtaining the heat generation power and the ambient temperature of each heat generation component and determining the steady-state heat dissipation parameters corresponding to each heat generation component based on the second relational expression. By comprehensively considering the steady-state heat dissipation parameters corresponding to each heat generation component to determine the steady-state heat dissipation parameters of the overall heat dissipation component, the system can more comprehensively reflect the heat dissipation capacity under actual operating conditions. The beneficial effect of this method is that it provides a more accurate and adaptable heat dissipation model, enabling the system to optimize the heat dissipation strategy under various load and environmental conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server, ensuring efficient operation in a changing working environment.

[0116] Exemplarily, the average value or the median of the steady-state heat dissipation parameters corresponding to each heat generation component can be determined, and this average value or median is used as the steady-state heat dissipation parameters of the heat dissipation component. The heat dissipation method provided in this embodiment can balance the heat dissipation performance under different heat source conditions by calculating the average value or the median of the steady-state heat dissipation parameters corresponding to each heat generation component as the steady-state heat dissipation parameters of the overall heat dissipation component. The beneficial effect of this method is that it provides a robust and adaptable heat dissipation model, improving the heat dissipation efficiency and stability of the system.

[0117] In some embodiments, determining the steady-state heat dissipation parameter of the heat dissipation component according to the steady-state heat dissipation parameters corresponding to each heat generation component may include: determining the maximum value among the steady-state heat dissipation parameters corresponding to each heat generation component of the heat dissipation component as the steady-state heat dissipation parameter of the heat dissipation component. The heat dissipation control method provided in this embodiment can accurately identify the performance of the heat dissipation component under different conditions by obtaining the heat generation power and ambient temperature of each heat generation component and determining the steady-state heat dissipation parameter corresponding to the heat dissipation component based on the second relational expression (11). By taking the maximum value among the steady-state heat dissipation parameters corresponding to each heat generation component of the heat dissipation component as the final steady-state heat dissipation parameter, the system ensures the heat dissipation capacity under the most demanding conditions. The beneficial effect of this method is that it provides a conservative and reliable parameter selection for the heat dissipation model, ensuring that the heat dissipation control system of the server can effectively respond to heat changes under various load conditions. This not only improves the heat dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server, ensuring safe operation under high load conditions.

[0118] Specifically, for solving the parameter U W , it can be obtained from formula (11) as follows:

[0119] U W =P 产热1 / (K 1 ×(T 1W –T 0 )) (18).

[0120] Among them, the meanings of the parameters can refer to the introduction of formula (11). P 产热1 and T 0 can both be obtained. T 1W is the control target temperature of the CPU, which is set by itself. Then, the U W for the CPU can be obtained. Similarly, the U W for the memory and the U W for other components can be obtained. Obviously, the U W obtained for each component is not equal, but there is only one parameter U W in the model. In order to ensure that the temperatures of all controlled components are within the safe target range, the maximum U W is taken as the parameter in the model for redundant design.

[0121] In some embodiments, through experimental calibration, determining the heat capacities corresponding to multiple heat - generating components may include: for each heat - generating component, when the heat - dissipation parameter of the heat - dissipating component is 0 and the heat - dissipation power is 0, obtaining the temperature difference, heat - generating power, and the second time duration of the heat - generating component within the second time duration, and determining the heat capacity corresponding to the heat - generating component according to the temperature difference, heat - generating power, and the second time duration of the heat - generating component within the second time duration. The heat - dissipation method provided in this embodiment can accurately calculate the heat capacities of each heat - generating component by obtaining the temperature difference and heat - generating power of each heat - generating component within a specific time duration under the condition that both the heat - dissipation parameter and heat - dissipation power of the heat - dissipating component are 0. Through this experimental calibration method, the system can accurately evaluate the heat - storage capacity of the heat - generating component in an isolated thermal environment. The beneficial effect of this method is that it provides key thermal characteristic parameters for the thermal - management model, enabling the model to more accurately simulate and predict thermal dynamic behavior. The system can optimize the heat - dissipation strategy based on accurate heat - capacity data to ensure that the server maintains the best temperature under various load conditions. This not only improves the heat - dissipation efficiency, reduces energy consumption, but also enhances the stability and reliability of the server and extends the service life of the device.

[0122] Specifically, for solving the parameter C M1 , if the rotational speed of the fan is set to 0, then the heat - dissipation power of the system is 0. Then, based on formula (5), we get C M1 ×ΔT 1 =P 产热1 ×t, that is:

[0123] C M1 =P 产热1 ×t / ΔT 1 (19).

[0124] Wherein, t is the second time duration; P 产热1 is the heat - generating power of the CPU; C M1 is the product of the mass M 1 of the CPU and the specific heat capacity C 1 ; ΔT 1 is the temperature difference of the CPU within the time t.

[0125] Therefore, in order to solve C M1 , it is necessary to set the server to run at a constant power, set the rotational speed of the fan to 0, and run for a period of time, such as 120 s, record the temperatures of the CPU at two moments of 0 s and 120 s, then the temperature rise ΔT 1 of the CPU within this period of time can be obtained, and since P 产热1 and t can both be obtained, the parameter C M1 for the CPU can be obtained. Similarly, the C M2 for the memory and the C M for other components can be obtained.

[0126] In summary, the parameters K and U are obtained respectively. W and C M After that, the matrices A and B can be constructed, thus completing the establishment of the heat dissipation model.

[0127] 404. Obtain current data of heat dissipation parameters of a heat dissipation component of the server to be processed.

[0128] 405. Input the current data into the heat dissipation model corresponding to the server to be processed to obtain the corresponding temperature adjustment amount; the heat dissipation model is determined in advance based on the heat balance equation and state space equation of the server to be processed; the heat balance equation is determined based on the heat dissipation system architecture of the processing server.

[0129] 406. Perform heat dissipation control on the server to be processed according to the temperature adjustment amount.

[0130] In this embodiment, steps 404 to 406 are similar to steps 201 to 203 in the above embodiment, and are not described again here.

[0131] From the above description, it can be seen that the heat dissipation control method provided in this embodiment is

[0132] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0133] Figure 5 This is a schematic diagram of the structure of the heat dissipation control device provided in the embodiment of the present application. Figure 5 As shown, an embodiment of the present application further provides a heat dissipation control device 50 , including: an acquisition module 501 , an input module 502 and a control module 503 .

[0134] An acquisition module 501 is used to acquire current data of heat dissipation parameters of a heat dissipation component of a server to be processed;

[0135] Input module 502, used to input current data into the heat dissipation model corresponding to the server to be processed to obtain the corresponding temperature adjustment amount; the heat dissipation model is determined in advance according to the heat balance equation and state space equation of the server to be processed; the heat balance equation is determined based on the heat dissipation system architecture of the processing server;

[0136] The control module 503 is used to control the heat dissipation of the server to be processed according to the temperature adjustment amount.

[0137] The heat dissipation control device provided in the embodiment of the present application can monitor the thermal state of the server in real time by acquiring the current data of the heat dissipation component. Then, these data are input into a pre-established heat dissipation model, which is based on the thermal balance equation and state space equation of the server and can accurately predict the temperature adjustment amount. This enables the system to actively adjust the heat dissipation strategy instead of passively responding to temperature changes, reduces dependence on experimental data, and avoids complex PID parameter adjustments. By dynamically controlling according to the temperature adjustment amount, the system can quickly respond to temperature changes, optimize fan speed, reduce energy consumption, and improve the operational stability and reliability of the server.

[0138] In some embodiments, the heat dissipation control device 50 also includes a model building module 500, which is used to: construct a thermal balance equation for the server to be processed based on the heat dissipation system architecture of the processing server; the heat dissipation system architecture includes a heat dissipation component and a plurality of heat generating components; linearize the thermal balance equation to obtain a state space equation for the server to be processed; and determine the heat dissipation model corresponding to the server to be processed based on the state space equation.

[0139] In some embodiments, the model building module 500 is specifically used to: obtain the cooling system architecture of the server to be processed; determine the heat generation power of the heat generating component and the heat dissipation power of the heat dissipation component corresponding to the heat generating component for each heat generating component; based on the heat calculation formula, determine the first relationship corresponding to the heat generating component according to the heat generation power and the heat dissipation power; determine the thermal balance equation of the server to be processed according to the first relationship corresponding to multiple heat generating components.

[0140] In some embodiments, the model building module 500 is specifically used to determine the heat generation power of the heat generation component according to the operating power and the heat generation coefficient of the heat generation component.

[0141] In some embodiments, the model building module 500 is specifically used to determine the heat dissipation power of the heat dissipation component corresponding to the heat generating component according to the heat transfer coefficient and heat dissipation parameters of the heat dissipation component, the temperature of the heat generating component, and the ambient temperature.

[0142] In some embodiments, the model building module 500 is specifically used to determine, based on a heat calculation formula, the heat dissipation parameters of the heat dissipation component, the heat generation power of the heat generating component, the temperature difference of the heat generating component within a first time period, the heat capacity of the heat generating component, the temperature of the heat generating component at the current moment, the ambient temperature at the current moment and the first relationship between the first time period.

[0143] In some embodiments, the model building module 500 is specifically used to: linearize the heat balance equation based on the steady-state operating point to obtain the state space equation of the server to be processed.

[0144] In some embodiments, the model building module 500 is specifically used to: for each heat-generating component, determine, according to the heat balance equation corresponding to the heat-generating component, the second relationship between the heat-generating power of the heat-generating component and the steady-state parameter value and the steady-state temperature when the heat-generating component is at a steady-state temperature and the heat dissipation parameter of the heat dissipation component is a steady-state parameter value; determine the state space equation of the server to be processed according to the second relationship corresponding to multiple heat-generating components respectively; the state space equation includes the first-order derivative of the temperature adjustment amount, the system matrix, the state vector, the input matrix and the third relationship between the input vector; the state vector includes the temperature difference within the first time period corresponding to multiple heat-generating components respectively, and the input vector includes the heat dissipation parameters of the heat dissipation component.

[0145] In some embodiments, the model building module 500 is specifically used to: determine the heat transfer coefficients and heat capacities corresponding to multiple heat-generating components, and the steady-state heat dissipation parameters of the heat dissipation components through experimental calibration; determine the system matrix and input matrix in the state-space equation according to the heat transfer coefficients and heat capacities corresponding to multiple heat-generating components, and the steady-state heat dissipation parameters of the heat dissipation components; based on the state-space equation, determine the heat dissipation model of the server to be processed according to the system matrix and the input matrix.

[0146] In some embodiments, the model building module 500 is specifically used to: for each heat-generating component, place the heat-generating component in a constant temperature environment, operate it at a constant power, and set the heat dissipation parameter to a constant value; after the server to be processed reaches a thermal equilibrium state, obtain the heat-generating power of the heat-generating component and the current temperature, ambient temperature, and actual value of the heat dissipation parameter of the heat-generating component; determine the heat transfer coefficient corresponding to the heat-generating component based on the heat-generating power, the current temperature, ambient temperature and actual value.

[0147] In some embodiments, the model building module 500 is specifically used to: for each heat-generating component, obtain the heat generation power and ambient temperature of the heat-generating component, and based on the second relationship, determine the steady-state heat dissipation parameters of the heat dissipation component corresponding to the heat-generating component according to the heat generation power and the ambient temperature; determine the maximum value of the steady-state heat dissipation parameters of the heat dissipation component corresponding to each heat-generating component as the steady-state heat dissipation parameter of the heat dissipation component.

[0148] In some embodiments, the model building module 500 is specifically used to: for each heat-generating component, when the heat dissipation parameter of the heat dissipation component is 0 and the heat dissipation power is 0, obtain the temperature difference, heat generation power and second time length of the heat-generating component within the second time length, and determine the heat capacity corresponding to the heat-generating component according to the temperature difference, heat generation power and second time length of the heat-generating component within the second time length.

[0149] For the description of the features in the embodiment corresponding to the heat dissipation control device, reference can be made to the relevant description of the embodiment corresponding to the heat dissipation control method, which will not be repeated here.

[0150] Figure 6 This is a schematic diagram of the structure of the electronic device provided in this application. Figure 6 As shown, the electronic device 60 provided in this embodiment includes: at least one processor 601 and a memory 602. Optionally, the electronic device 60 further includes a communication component 603. The processor 601, the memory 602 and the communication component 603 are connected via a bus.

[0151] In the specific implementation process, at least one processor 601 executes the computer execution instructions stored in the memory 602, so that at least one processor 601 executes the above-mentioned heat dissipation control method embodiment.

[0152] The specific implementation process of the processor 601 can be found in the above method embodiment, and its implementation principle and technical effect are similar, so this embodiment will not be repeated here.

[0153] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the application may be directly implemented as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0154] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk storage.

[0155] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of this application is not limited to only one bus or one type of bus.

[0156] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned heat dissipation control method embodiments when running.

[0157] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0158] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above-mentioned heat dissipation control method embodiments are implemented.

[0159] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned heat dissipation control method embodiments are implemented.

[0160] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0161] The above is a detailed introduction to a heat dissipation control method provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A heat dissipation control method, characterized in that: include: Acquire current data of heat dissipation parameters of a heat dissipation component of the server to be processed; Input the current data into the heat dissipation model corresponding to the server to be processed to obtain the corresponding temperature adjustment amount; the heat dissipation model is determined in advance according to the heat balance equation and state space equation of the server to be processed; the heat balance equation is determined based on the heat dissipation system architecture of the processing server; Heat dissipation control is performed on the server to be processed according to the temperature adjustment amount.

2. The heat dissipation control method according to claim 1, characterized in that: The method further comprises: Based on the heat dissipation system architecture of the processing server, a heat balance equation of the server to be processed is constructed; the heat dissipation system architecture includes a heat dissipation component and a plurality of heat generating components; Linearizing the heat balance equation to obtain a state space equation of the server to be processed; According to the state-space equation, a heat dissipation model corresponding to the server to be processed is determined.

3. The heat dissipation control method according to claim 2, characterized in that: The heat balance equation of the server to be processed is constructed based on the heat dissipation system architecture of the processing server, including: Obtaining a cooling system architecture of the server to be processed; For each of the heat generating components, determine the heat generating power of the heat generating component and the heat dissipation power of the heat dissipation component corresponding to the heat generating component; based on a heat calculation formula, determine a first relationship corresponding to the heat generating component according to the heat generating power and the heat dissipation power; The heat balance equation of the server to be processed is determined according to the first relationship expressions respectively corresponding to the plurality of heat generating components.

4. The heat dissipation control method according to claim 3, characterized in that: The determining the heat generating power of the heat generating component comprises: The heat generating power of the heat generating component is determined according to the operating power and the heat generating coefficient of the heat generating component.

5. The heat dissipation control method according to claim 3, characterized in that: The determining the heat dissipation power of the heat dissipation component corresponding to the heat generating component includes: The heat dissipation power of the heat dissipation component corresponding to the heat generating component is determined according to the heat transfer coefficient and heat dissipation parameters of the heat dissipation component, the temperature of the heat generating component, and the ambient temperature.

6. The heat dissipation control method according to claim 5, characterized in that: The heat calculation formula is based on the heat generation power and the heat dissipation power to determine the first relationship corresponding to the heat generation component, including: Based on a heat calculation formula, determine the heat dissipation parameters of the heat dissipation component, the heat generation power of the heat generating component, the temperature difference of the heat generating component within a first time period, the heat capacity of the heat generating component, the temperature of the heat generating component at a current moment, the ambient temperature at a current moment and a first relationship between the first time period.

7. The heat dissipation control method according to claim 2, characterized in that: The linearizing the heat balance equation to obtain the state space equation of the server to be processed includes: Based on the steady-state operating point, the heat balance equation is linearized to obtain the state space equation of the server to be processed.

8. The heat dissipation control method according to claim 7, characterized in that: The step of linearizing the heat balance equation based on the steady-state operating point to obtain the state space equation of the server to be processed includes: For each of the heat generating components, determining, according to a heat balance equation corresponding to the heat generating component, a second relationship between the heat generating power of the heat generating component, the steady-state parameter value, and the steady-state temperature when the heat generating component is at a steady-state temperature and the heat dissipation parameter of the heat dissipation component is a steady-state parameter value; According to the second relationship corresponding to the multiple heat-generating components, the state space equation of the server to be processed is determined; the state space equation includes the first-order derivative of the temperature adjustment amount, the system matrix, the state vector, the input matrix and the third relationship between the input vector; the state vector includes the temperature difference within the first time period corresponding to the multiple heat-generating components, and the input vector includes the heat dissipation parameters of the heat dissipation components.

9. The heat dissipation control method according to claim 2, characterized in that: Determining the heat dissipation model corresponding to the server to be processed according to the state space equation includes: Determine the heat transfer coefficient and heat capacity corresponding to each of the plurality of heat generating components and the steady-state heat dissipation parameters of the heat dissipation component through experimental calibration; Determine the system matrix and the input matrix in the state space equation according to the heat transfer coefficients and heat capacities respectively corresponding to the plurality of heat generating components and the steady-state heat dissipation parameters of the heat dissipation components; Based on the state-space equation, a heat dissipation model of the server to be processed is determined according to the system matrix and the input matrix.

10. The heat dissipation control method according to claim 9, characterized in that: The heat transfer coefficients corresponding to the plurality of heat generating components are determined by test calibration, including: For each heat-generating component, the heat-generating component is placed in a constant temperature environment, operated at a constant power, and the heat dissipation parameter is set to a constant value. After the server to be processed reaches a thermal equilibrium state, the heat-generating power of the heat-generating component and the current temperature, the ambient temperature, and the actual value of the heat dissipation parameter of the heat dissipation component are obtained, and the heat transfer coefficient corresponding to the heat-generating component is determined according to the heat-generating power, the current temperature, the ambient temperature and the actual value.

11. The heat dissipation control method according to claim 9, characterized in that: The step of determining the steady-state heat dissipation parameters of the heat dissipation component by means of test calibration includes: For each heat generating component, the heat generating power and the ambient temperature of the heat generating component are obtained, and based on a second relationship, the steady-state heat dissipation parameter of the heat dissipation component corresponding to the heat generating component is determined according to the heat generating power and the ambient temperature; The steady-state heat dissipation parameters of the heat dissipation component are determined according to the steady-state heat dissipation parameters corresponding to each heat-generating component.

12. The heat dissipation control method according to claim 9, characterized in that: The test calibration is used to determine the heat capacities of the plurality of heat generating components, respectively, including: For each heat-generating component, when the heat dissipation parameter of the heat dissipation component is 0 and the heat dissipation power is 0, the temperature difference, heat generation power and second time length of the heat-generating component within the second time length are obtained, and the heat capacity corresponding to the heat-generating component is determined according to the temperature difference, heat generation power and second time length of the heat-generating component within the second time length.

13. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the heat dissipation control method according to any one of claims 1 to 12 when executing the computer program.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the heat dissipation control method according to any one of claims 1 to 12.

15. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the heat dissipation control method according to any one of claims 1 to 12 are implemented.

Images