Bionic cobweb type spacecraft light-weight heat dissipation anti-vibration device

Abstract

The invention discloses a bionic cobweb type spacecraft lightweight heat dissipation and vibration resistance device which is applied to aerospace equipment and comprises a heat dissipation and vibration resistance cover plate, a plurality of bolt holes used for installation are formed in the peripheral edge of the heat dissipation and vibration resistance cover plate, and the heat dissipation and vibration resistance cover plate is connected with other equipment through the bolt holes; a groove with an edge opening is formed between every two adjacent bolt holes, a cobweb gradient structure is arranged on the heat dissipation anti-vibration cover plate, the cobweb gradient structure comprises a cobweb center wall arranged in the center of the cover plate and gradient layered cobweb walls radiating towards the periphery along the cobweb center wall, and the gradient layered cobweb walls are distributed in a gradient mode in height. The heat dissipation anti-vibration device is of a bionic cobweb type structure, the heat dissipation surface area is maximized on the premise that the strength of the anti-vibration structure is guaranteed, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation structures, and particularly to a bionic spider-web type lightweight heat dissipation and vibration resistance device for spacecraft in the aerospace equipment. Background Art

[0002] With the continuous development of integrated circuits and aerospace equipment, higher requirements are put forward for heat dissipation and vibration resistance effects. Traditional heat dissipation structures often have problems such as large weight and poor stability. In the prior art, the structures for heat dissipation of integrated circuits and aerospace equipment mainly include traditional designs such as metal heat sinks and cooling fans. Metal heat sinks are usually installed on the heat dissipation surface of integrated circuits or aerospace equipment to increase the heat dissipation area and accelerate heat transfer. The cooling fan accelerates the dissipation of heat by the flow of air to the heat sink. Metal heat sinks are usually made of heavy metals such as aluminum or copper, so the overall weight of the equipment will be increased while meeting the heat dissipation requirements. As a mechanical device, the stability and reliability of the cooling fan are limited, it is easily affected by the external environment, and there are also problems such as service life and noise. These problems restrict the application of traditional heat dissipation structures in integrated circuits and aerospace equipment, so it is necessary to seek new heat dissipation structure designs to overcome these problems.

[0003] Heat conduction plays a crucial role in heat dissipation. Traditional metal heat sinks have low heat dissipation efficiency due to limited heat conduction coefficients, and there are also certain limitations in weight. These problems limit the practical application of traditional heat dissipation structures in dealing with high power density, lightweight requirements and high temperature environments. Therefore, in view of the limitations of heat conduction, it is necessary to develop new heat dissipation structures to improve the heat conduction efficiency and take into account multiple requirements such as lightweight, high vibration resistance performance and efficient heat dissipation.

[0004] In addition, vibration excitations will inevitably occur during the launch of space shuttles, launch vehicles, satellites, etc. The common vibration excitations are mainly divided into two excitation modes: sinusoidal vibration and random vibration. When the vibration frequency is the same as that of the electronic control box, resonance will occur. The resonance phenomenon is extremely likely to damage the structure of the electronic control box, resulting in the destruction of important instruments such as internal electronic components and circuit boards.

[0005] Most traditional electronic control box covers adopt solid aluminum rectangular covers. Although such covers can resist the damage of vibration excitations and prevent the occurrence of resonance behavior, the structural form is single and the quality is redundant, adding manufacturing costs, carrying mass and energy consumption. Summary of the Invention

[0006] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a bionic spider-web type lightweight heat dissipation and vibration resistance device for spacecraft, which takes into account lightweight, high vibration resistance performance, efficient heat dissipation, and effectively resists the influence of sinusoidal vibration and random vibration. Through the design of a new heat dissipation and vibration resistance structure, it aims to solve the problems existing in the traditional heat dissipation and vibration resistance structure, such as large weight, low stability, and limited heat dissipation efficiency, so as to improve the actual application performance of heat dissipation and vibration resistance equipment in integrated circuits and aerospace equipment, and meet the heat dissipation requirements and vibration resistance requirements under high power density, lightweight, and high-temperature environments.

[0007] To achieve the above object, the present invention provides a bionic spider-web type lightweight heat dissipation and vibration resistance device for spacecraft. The heat dissipation and vibration resistance device is applied to aerospace equipment. The heat dissipation and vibration resistance device includes: a heat dissipation and vibration resistance cover plate; a plurality of bolt holes for installation are provided at the four peripheral edges of the heat dissipation and vibration resistance cover plate, and it is connected to other devices through the bolt holes; an edge opening groove is provided between adjacent two bolt holes. A spider-web gradient structure is provided on the heat dissipation and vibration resistance cover plate. The spider-web gradient structure includes a spider-web center wall provided at the center of the cover plate and gradient layer-like spider-web walls radially radiating from the spider-web center wall to the surroundings. The gradient layer-like spider-web walls show a gradient distribution in height.

[0008] Further, the gradient layer-like spider-web walls are made of aluminum alloy plates. The spider-web gradient structure includes multi-level aluminum alloy plates, and the multi-level aluminum alloy plates show a gradient distribution in height. Each layer of spider-web aluminum alloy plates includes trapezoidal reinforcing ribs with a height gradient.

[0009] Further, the height at the short side boundary of the heat dissipation and vibration resistance cover plate is greater than the height h at the spider-web center o .

[0010] Further, the spider-web center wall is a cylindrical wall with a radius of 2 - 3 mm and a thickness of 0.5 - 1 mm.

[0011] Further, the thickness of each layer of gradient layer-like spider-web wall is 0.5 - 2 mm, the thickness of the trapezoidal reinforcing rib is 0.5 - 2 mm, and the thickness of the edge opening groove is 1 - 2 mm.

[0012] Further, the material of the heat dissipation and vibration resistance cover plate is aluminum alloy.

[0013] Further, the wall thickness is the smallest near the spider-web center. As the spider-web gradient extends towards the edge, the spider-web wall thickness gradually increases.

[0014] Further, the minimum wall thickness near the spider-web center is 0.5 mm, and the wall thickness of each level of spider-web increases by 0.25 mm until it reaches a wall thickness of 2 mm and then no longer increases.

[0015] Further, the gradient layer - like spider - web wall has a non - uniform thickness structure. Its outermost side is connected to the edge of the heat - dissipation structure, and the thickness of the outermost side is the same as that of the heat - dissipation structure. Its innermost side is connected to the spider - web central wall, and the thickness of the innermost side is the same as that of the spider - web central wall. The distance between each layer of the spider - web is arranged in an arithmetic progression. The closer to the center of the spider - web, the smaller the distance between two adjacent gradient layer - like spider - web walls.

[0016] Through the bionic spider - web - like structure design, the present invention can, while ensuring resistance to sinusoidal vibration excitation and random vibration excitation, significantly reduce the weight of the heat - dissipation structure and effectively improve the heat - dissipation efficiency. Brief Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the bionic spider - web - like lightweight heat - dissipation and vibration - resistant device for spacecraft provided by an embodiment of the present invention; Figure 2 It is a schematic structural diagram of a traditional heat - dissipation and vibration - resistant structure in the aerospace field; Figure 3 It is a schematic structural diagram of a partially enlarged bionic spider - web - like lightweight heat - dissipation and vibration - resistant device for spacecraft; Figure 4 It is a schematic side - view structure diagram; Figure 5 It shows a schematic structural diagram of an opening groove; Figure 6 It shows Figure 5 a schematic enlarged structure diagram of the opening groove in Figure 7 It is a cross - sectional side - view corresponding to Figure 4 the heat - dissipation and vibration - resistant cover plate; Figure 8 It is a schematic temperature - distribution diagram of a cover plate in the prior art. Figure 8 a shows the overall calculated area, including the air domain, the solid cover plate, and the heat source. The heat - dissipation methods include heat convection and heat conduction methods, as well as the corresponding position distributions. Figure 8 b shows the position of the heat source where the heat - dissipation method is only heat conduction, and the temperature distribution around the heat source; Figure 9 It is a schematic temperature - distribution diagram of the bionic spider - web - like heat - dissipation structure according to the present invention. Figure 9 a shows the overall calculated area, including the air domain, the bionic spider - web - like heat - dissipation structure, and the heat source. The heat - dissipation methods include heat convection and heat conduction methods. Here, the heat source and the air domain are the same as those in Figure 8 and include the corresponding position distributions. Figure 9 b shows the position distribution of the heat source where the heat - dissipation method is only heat conduction in the bionic spider - web - like heat - dissipation structure, and the temperature distribution around the heat source; Description of the reference numerals: 1. Bolt hole; 2. Edge opening groove; 3. Gradient laminated spider web wall; 4. Spider web center wall; 5. Laminated spider web reinforcing rib. Detailed implementation manners

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments in the present invention belong to the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0021] The following will be combined with Figure 1 , Figures 3 - 7 , Figure 9 to describe the detailed implementation manners of the present invention in detail. It should be understood that the specific implementation manners described here are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0022] The present invention provides a bionic spider web type lightweight heat dissipation and vibration resistance device for a spacecraft. The heat dissipation and vibration resistance device includes a cover plate and a box body used in cooperation with the cover plate. The box body can be an electric control box, which can ensure stable and efficient heat dissipation during space launch and normal operation to meet the heat dissipation requirements under high power density, high vibration resistance, lightweight and high temperature environments.

[0023] There is a certain connection between resisting sine vibration excitation and random vibration excitation and heat dissipation. In engineering design, the cover plate structure needs to meet the requirements of resisting various excitations, including the force from vibration excitation and the heat dissipation. However, there is a contradiction between the requirements of anti-vibration and heat dissipation. To balance this contradiction, the shape of the bionic cobweb structure of the present invention maximizes the heat dissipation surface area on the premise of ensuring the strength of the anti-vibration structure, and improves the heat dissipation efficiency. By designing the void size and distribution of the bionic cobweb structure, so that air can flow smoothly, promoting heat dissipation, and reducing the impact of vibration excitation on the structure. By optimizing the value range of these parameters, the cobweb structure can not only meet the requirements of resisting various excitations, but also effectively improve the heat dissipation efficiency, thus solving the contradiction between anti-vibration and heat dissipation.

[0024] As Figure 1 shown, the lightweight heat dissipation and anti-vibration device for spacecraft with a bionic cobweb structure according to the present invention includes: a heat dissipation and anti-vibration cover plate; a plurality of bolt holes 1 for installation are provided at the four peripheral edges of the cover plate, and are connected to other devices (such as an electronic control box) through the bolt holes; an edge opening groove 2 is provided between two adjacent bolt holes, and a cobweb gradient structure is provided on the cover plate. The cobweb gradient structure includes a cobweb center wall 4 provided at the center of the cover plate and a gradient layer cobweb wall 3 radially radiating from the cobweb center wall 4. The gradient layer cobweb wall shows a gradient distribution in height, and a layer cobweb reinforcing rib 5 is also provided on the cover plate.

[0025] Figure 2 The schematic diagram of the cover plate of the traditional structure is shown, which is a flat plate structure without a designed bionic cobweb.

[0026] Figure 3 The partial enlarged view of the lightweight heat dissipation and anti-vibration device for spacecraft with a bionic cobweb structure is shown. Among them, the gradient layer cobweb wall 3 is made of an aluminum alloy plate. The cobweb gradient structure includes multiple levels of aluminum alloy plates, which shows a gradient distribution in height. Each layer of cobweb aluminum alloy plate includes a trapezoidal reinforcing rib with a height gradient.

[0027] The gradient distribution of the cobweb wall 3 can reduce the redundant mass and enhance the specific stiffness of the structure at the place where the vibration excitation is the largest at the cobweb center. Based on the structural theory F = kd, when the load is constant, the greater the stiffness, the smaller the displacement. Therefore, the gradient distribution of the cobweb wall 3 can effectively reduce the maximum amplitude at the center.

[0028] Optionally, as Figure 4 shown, it can be seen from the side view of the heat dissipation and anti-vibration cover plate that the height at the short side boundary of the cover plate is greater than the height at the cobweb center ; the angle of the cobweb gradient structure, the slope from the core thickness of the center cobweb to the outermost cobweb boundary thickness is: ; Among them, is the gradient slope from the center of the spider web to the short side boundary of the rectangle, is the height at the short side boundary of the cover plate, is the height at the center of the spider web, is the length from the center of the spider web to the short side boundary of the rectangle.

[0029] The heat dissipation analysis of the heat dissipation and vibration-resistant cover plate is as follows: Heat convection heat dissipation: Imagine a heat source surface with a surface temperature of , and the temperature of the surrounding fluid is . The heat transfer coefficient describes the heat transfer rate from the heat source surface to the fluid, and the temperature difference - describes the driving force for heat transfer. The heat transfer rate can be expressed by the following formula: ; Among them, is the surface area of the heat source. The heat transfer coefficient is affected by factors such as the fluid flow state, flow velocity, and fluid properties. In the present invention, the fluid flow state, flow velocity, and fluid properties are all kept constant. Therefore, heat dissipation is only related to the heat transfer surface area.

[0030] Heat conduction heat dissipation: For one-dimensional heat conduction in a steady state, it can be expressed in the following form: ; Among them, is the heat transfer cross-sectional area. The thermal conductivity is related to the material. When the material is fixed, assuming that the thermal conductivity remains unchanged, heat transfer is related to the heat surface area.

[0031] In summary, the heat transfer effect is greatly related to the surface area, and the surface area is affected by the slope. The slope design takes into account various factors. In the present invention, the directional electric control box cover plate is used as the main body, the edge height and the center thickness are fixed. The center thickness adopts the minimum thickness allowed by machining (0.5 mm), and the edge thickness is fixed at 3 mm. The unfixed can meet the value requirements, preferably 1 / 4 to 1 / 3 of the total length of the structure, is the height of the outermost structure, so the gradient spider web can be designed as a triangle or a right trapezoid in the example; If it is too small, the specific stiffness of the inner side is insufficient, and excessive deformation is likely to occur, resulting in structural bending instability and collapse; if is too large, the overall structure mass is too small, which will cause the overall characteristic frequency to be too large.

[0032] This example is a thin and light board. In this example, the slope is: ; The preferred slope range is 0.04 - 0.05, within which the comprehensive effects of anti-vibration and heat dissipation are the best.

[0033] Optionally, the cobweb center wall is a cylindrical wall with a radius of 2 - 3 mm and a thickness of 0.5 - 1 mm.

[0034] Optionally, the thickness of each layer of the cobweb wall is 0.5 - 2 mm.

[0035] Preferably, the thickness of the cobweb wall closest to the cobweb center is 0.5 mm. As the cobweb gradient extends towards the edge, the thickness of the cobweb wall increases step by step, with each step increase of 0.25 mm in the cobweb wall thickness, and the thickness no longer increases when it reaches 2 mm. This design can adjust the thickness of the cobweb wall according to the heat distribution in different regions, thereby achieving more effective heat dissipation. In terms of the heat dissipation principle, this design can optimize the heat conduction path, enabling heat to be transferred to the external environment more quickly, thus improving the heat dissipation effect. Under real aerospace working conditions, the center position of the cobweb structure suffers the most severe vibration load. However, due to considering the actual production and processing requirements, the longitudinal gradient near the cobweb center is reduced, the number of cobweb layers is increased, and the thickness of each layer of the cobweb wall is increased in a step-by-step gradient manner to control the specific stiffness of the structure at the cobweb center and prevent excessive deformation due to vibration excitation.

[0036] Optionally, the thickness of the trapezoidal reinforcing rib is 0.5 - 2 mm.

[0037] Optionally, the thickness of the edge opening groove is 1 - 2 mm.

[0038] Figure 5 and Figure 6 The opening groove structure is shown. The main function of the opening groove is to reduce weight. The vibration excitation at the structure edge is relatively small, so redundant mass is not required. At the same time, the opening groove should avoid the connecting bolt hole diameter to prevent shear failure of the bolt hole. Based on P = F / S, where P represents pressure, F represents the force applied to the object, and S represents the stress area of the object; the bolt shear stress is equal to the bolt pull-off load divided by the edge cross-sectional area. Therefore, when designing the opening groove, it is necessary to enhance the bolt hole wall thickness. Taking an M4 bolt as an example, an opening groove thickness of 1 mm is sufficient to ensure strength; for an M6 bolt, an opening groove thickness of 2 mm is sufficient to ensure strength.

[0039] Optionally, the diameter of the hexagonal bolt hole is M4 - M6.

[0040] Optionally, the material of the cover plate structure is aluminum alloy.

[0041] The heat dissipation and vibration-resistant cover plate is usually connected to a processor or other integrated circuit device through bolt holes. The internal heat source can be devices such as a central processing unit (CPU), a graphics processing unit (GPU), or even a power amplifier. In the background art, a cooling fan accelerates the dissipation of heat by causing air flow over the heat sink. Usually, the cooling fan is located on top of the heat sink and helps accelerate the dissipation of heat by causing air flow over the surface of the heat sink. The present invention can be used in conjunction with a cooling fan, with the fan located on top of the heat sink.

[0042] The cobweb gradient structure can provide an auxiliary air flow guiding function under the action of the fan, which helps the hot air in the center to flow or diffuse quickly, thereby further enhancing the heat dissipation effect. Specifically, the design of the cobweb gradient structure can guide the air flow generated by the fan so that it flows more concentratedly over the surface of the heat sink. By controlling the flow direction and speed of the air flow, the cobweb gradient structure can make the hot air be taken away more effectively, accelerating the dissipation of heat. The cobweb gradient structure itself has a large surface area, which can increase the contact area between the hot air and the surface of the heat sink, facilitating the dissipation of heat.

[0043] A bionic cobweb-style lightweight heat dissipation and vibration-resistant device for spacecraft provided by the present invention, the heat dissipation and vibration-resistant structure includes: bolt holes at the four corners and the center of the edge, open grooves on the four edges, gradient-layered cobweb walls, interlayer reinforcing ribs, and a cobweb center wall; the gradient-layered cobweb walls are structures with unequal thicknesses, the outermost side is connected to the edge of the heat dissipation structure, the outermost thickness is the same as the thickness of the heat dissipation structure, the innermost side is connected to the cobweb center wall, and the innermost thickness is the same as the thickness of the cobweb center wall. As Figure 7 shown, The block diagram shows that the outermost thickness is consistent; The block diagram shows that the innermost side and the wall thickness of the cobweb center round hole decrease layer by layer as shown by the arrow in the figure. The distance between each cobweb layer is arranged in an arithmetic progression, and the closer to the cobweb center, the denser the cobweb layers.

[0044] The heat dissipation and vibration-resistant structure of the present invention takes the directional electronic control box cover plate as the main body, the edge height and the center thickness are fixed, the center thickness is designed to be the minimum thickness allowed by machining (0.5 mm), and the edge thickness is fixed at 3 mm. The unfixed can have value requirements, generally 1 / 4 to 1 / 3 of the total length of the structure. When the value is 1 / 4, at 0 - 1 / 4L, the spacing between each cobweb layer is machined with a wall thickness of the highest machining accuracy of 1 mm, and at the same time, the thickness at is designed in an arithmetic progression with the same slope as the thickness at 1 / 4L, that is: ; Similarly, when is equal to 1 / 4 to 1 / 3, the arithmetic progression changes to: ; From the position greater than 1 / 3L to the structural edge, an arithmetic sequence design based on the position at 1 / 3L is adopted.

[0045] There are trapezoidal reinforcing ribs between each layer of cobweb walls, and the slope of the hypotenuse is the same as the slope of the height difference between the wall thicknesses of adjacent two layers of cobweb walls.

[0046] The anti-vibration principle of the present invention lies in: enhancing the local specific stiffness of the structure where the vibration excitation load is large, and reducing the redundant mass where the vibration excitation load is weak. According to it can be known that enhancing the local specific stiffness will increase the structural characteristic frequency and avoid the occurrence of resonance. Among them, represents the circular frequency, represents the elastic coefficient, represents the mass. At the same time, based on the structural theory F = kd, when the load is constant, the greater the stiffness, the smaller the displacement. Therefore, the cobweb gradient distribution can effectively reduce the maximum amplitude at the center.

[0047] Through the structural design of the present invention, while ensuring resistance to sinusoidal vibration excitation and random vibration excitation, the weight of the heat dissipation structure can be significantly reduced.

[0048] In a specific embodiment of the present invention, the size of the bionic cobweb structure is 276 * 200 * 3 mm, and the total weight is 0.248 kg. For the original rectangular solid heat dissipation structure used for comparison, the cover plate has the same size of 276 * 200 * 3 mm, and the weight of the cover plate is 0.446 kg.

[0049] As Figure 8 shown, for the original rectangular solid heat dissipation structure, the temperature distribution of the traditional solid heat dissipation structure under the condition of a heat dissipation of 20 W is considered, taking into account the structural heat transfer and air heat transfer. Figure 8 a shows the overall calculation area, including the air domain, the solid cover plate and the heat source. The heat dissipation methods include heat convection and heat conduction methods, as well as the corresponding position distribution. Figure 8 b shows the position of the heat source where the heat dissipation method is only the heat conduction method, as well as the temperature distribution and heat dissipation effect around the heat source. It can be seen that the cover plate of the present invention has a better heat dissipation effect.

[0050] As Figure 9 shown, according to the temperature distribution of the bionic cobweb heat dissipation structure of the present invention, for the heat conduction simulation, the temperature distribution of the bionic cobweb heat dissipation structure under the condition of a heat dissipation of 20 W is considered, taking into account the structural heat transfer and air heat transfer. Compared with the original structure, the heat dissipation structure of the present invention maintains the same heat dissipation efficiency, and the mass is reduced by more than 30% compared with the traditional solid heat dissipation structure, effectively reducing the working temperature of the device. Figure 9a shows the overall area of the calculation, including the air domain, the bionic spider-web heat dissipation structure, and the heat source. The heat dissipation methods include heat convection and heat conduction. The heat source and the air domain are the same as those in Figure 8 which is consistent with. Figure 9 b shows the heat source with only heat conduction as the heat dissipation method, the position distribution in the bionic spider-web heat dissipation structure, and the temperature distribution around the heat source, demonstrating its heat dissipation effect. It can be seen that the heat dissipation structure of the present invention has a better heat dissipation effect.

[0051] On the other hand, according to the frequency requirements of the box envelope conditions in the aerospace field: the components meet the strength requirements under sinusoidal vibration, and the first-order frequency is greater than 30 Hz and there is no resonance under random vibration.

[0052] In the present invention, a bionic spider web is provided on one side of the flat structure. The bionic spider-web box cover structure proposed by the present invention reduces the weight by more than 30% compared with the traditional solid cover structure. The maximum stress does not exceed the strength limit of the material under sinusoidal vibration. After testing, under random vibration, the first-order characteristic frequency is higher than 30 Hz and there is no resonance phenomenon, having a good anti-vibration effect. The bionic spider-web form enhances the local specific stiffness, and at the same time, the spider-web gradient can reduce excessive redundant mass.

[0053] By using the Comsol modeling and simulation software, finite element simulations of sinusoidal vibration, random vibration, and heat dissipation are carried out on the designed structure. Comparing with the anti-vibration design requirements of the aerospace industrial-grade electronic control box cover and the requirements of the traditional solid heat dissipation structure, on the premise of meeting the anti-vibration and heat dissipation requirements, the overall mass of the cover is reduced by more than 30%. The present invention can be used for but is not limited to the cover structures of aerospace planes, launch vehicles, satellites, etc. in the aerospace field.

[0054] In the description of this specification, the description referring to terms such as "embodiment", "example", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. In addition, those skilled in the art can combine or combine different embodiments or examples described in this specification and the features therein without contradiction.

[0055] Although the above content has shown and described the embodiments of the present invention, it can be understood that the above embodiments are exemplary and cannot be construed as a limitation of the present invention. Those of ordinary skill in the art can perform update operations such as changes, modifications, substitutions, and variations on the above embodiments within the scope of the present invention.

Claims

1. A bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft, characterized in that: The heat dissipation and vibration-proof device is applied to aerospace equipment, and includes: a heat dissipation and vibration-proof cover plate, wherein a plurality of bolt holes for installation are arranged on the edges around the heat dissipation and vibration-proof cover plate, and the cover plate is connected with other equipment through the bolt holes; an edge opening groove is arranged between two adjacent bolt holes, and a spider web gradient structure is arranged on the heat dissipation and vibration-proof cover plate, and the spider web gradient structure includes a spider web center wall arranged at the center of the cover plate and gradient layered spider web walls radiating from the spider web center wall to the surrounding areas, and the gradient layered spider web walls present a gradient distribution in height.

2. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 1 is characterized in that: The gradient layered spider web wall is made of aluminum alloy plates. The spider web gradient structure includes multiple layers of aluminum alloy plates. The multiple layers of aluminum alloy plates are gradiently distributed in height. Trapezoidal reinforcing ribs with a height gradient are included between each layer of spider web aluminum alloy plates.

3. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 2 is characterized in that: The height of the short side boundary of the heat dissipation and vibration-resistant cover plate Greater than the height h at the center of the spider web o .

4. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 3 is characterized in that: The central wall of the spider web is a cylindrical wall with a radius of 2-3 mm and a thickness of 0.5-1 mm.

5. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 3 is characterized in that: The wall thickness of each gradient layered spider web is 0.5-2mm, and the thickness of the trapezoidal reinforcing rib is 0.5-2mm.

6. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 5 is characterized in that: The thickness of the edge opening groove is 1-2 mm.

7. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 3 is characterized in that: The material of the heat dissipation and vibration-resistant cover plate is aluminum alloy.

8. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to any one of claims 1 to 3, characterized in that: The wall thickness is smallest near the center of the spider web, and increases gradually as the spider web gradient extends toward the edge.

9. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to claim 8, characterized in that: The minimum wall thickness near the center of the spider web is 0.5mm, and the wall thickness increases by 0.25mm at each level, and the wall thickness no longer increases when it reaches 2mm.

10. The bionic spider web-like lightweight heat dissipation and vibration-resistant device for spacecraft according to any one of claims 1 to 3, characterized in that: The gradient layered spider web wall is a structure of uneven thickness. The outermost side is connected to the edge of the heat dissipation structure, and the outermost thickness is the same as the thickness of the heat dissipation structure. The innermost side is connected to the central wall of the spider web, and the innermost thickness is the same as the thickness of the central wall of the spider web. The distance between each layer of the spider web is arranged in an arithmetic progression. The closer to the center of the spider web, the smaller the distance between two adjacent gradient layered spider web walls.

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