Multi-specification wafer spin-drying device

Abstract

The invention relates to the technical field of wafer processing, one embodiment of the invention provides a multi-specification wafer spin-drying device which comprises an equipment body and a centrifugal mechanism, a spin-drying cavity is formed in the equipment body, the centrifugal mechanism is arranged in the spin-drying cavity, a cylinder cover used for opening and closing the spin-drying cavity is installed on the equipment body, and the centrifugal mechanism is arranged in the spin-drying cavity. The device further comprises a liquid falling plate, a sliding plate, a heating assembly, a hot air mechanism and a drainage mechanism, the liquid falling plate is fixedly connected to the interior of the spin-drying cavity, the sliding plate is fixedly connected to the interior of the spin-drying cavity, the heating assembly is used for heating the interior of the spin-drying cavity, and the hot air mechanism is used for being matched with the heating assembly to blow hot air into the spin-drying cavity. And the drainage mechanism is used for discharging the cleaning agent sliding down along the sliding plate in time. By means of the technical scheme, the technical problem that in the prior art, a cavity in a spin-drying device is in a wet high-pressure environment under the action of hot air and a thrown-out cleaning agent, and spin-drying of wafers is not convenient is solved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of wafer processing, and more particularly, to a multi-specification wafer drying device. Background Art

[0002] The processing of wafers generally includes: cleaning the A side of the optical film, installing the substrate, depositing the optical film A, inspecting the A side of the optical film, cleaning the B side of the optical film, depositing the optical film B, inspecting the B side of the optical film, cleaning before metallization, dispensing and attaching the ceramic chip, metallization coating, removing the ceramic chip, OQC, and packaging. Among them, after optical coating and before metallization coating, the wafers need to be cleaned, usually by ultrasonic cleaning, and after cleaning, a centrifuge is usually used to centrifuge and dry the wafers.

[0003] In the existing centrifuge, the wafers are placed in a basket, which can adapt to the drying of wafers of various specifications. The basket is driven by a driving mechanism to rotate, and the wafers are centrifuged and dried. At the same time, hot air is used for drying. The cleaning agent thrown out is inside the cavity. There is a certain humidity inside the cavity, and under the action of hot air, the pressure inside the cavity is relatively high. The high-pressure and high-humidity environment is not conducive to the discharge of moisture on the wafer surface, and the drying effect needs to be improved. Summary of the Invention

[0004] To overcome the above defects, embodiments of the present disclosure provide a multi-specification wafer drying device, which solves the technical problem that the cavity inside the existing drying device is in a humid and high-pressure environment under the action of hot air and the thrown-out cleaning agent, which is not conducive to the drying of wafers.

[0005] According to one aspect, at least one embodiment of the present disclosure provides a multi-specification wafer drying device, including a device main body and a centrifugal mechanism. A drying chamber is opened inside the device main body, the centrifugal mechanism is arranged inside the drying chamber, and a cylinder head for opening and closing the drying chamber is installed on the device main body. The device further includes: A liquid dropping plate, which is fixedly connected inside the drying chamber, and the centrifugal mechanism is installed on the liquid dropping plate; A sliding plate, which is fixedly connected inside the drying chamber, and the sliding plate is located below the liquid dropping plate; A heating component, which is arranged below the sliding plate, and the heating component is used for heating the inside of the drying chamber. The heating component includes: A heater, a heating chamber is formed between the sliding plate and the inner bottom wall of the drying chamber, and the heater is installed inside the heating chamber; A hot air mechanism, which is used for blowing hot air into the drying chamber. The hot air mechanism includes: A blower, the air outlet of the blower being in communication with the heating chamber; A filter, an air supply pipe being connected to the heating chamber, the air supply pipe being in communication with the spin-drying chamber through the filter; A drainage mechanism for timely discharging the cleaning agent that slides down along the slide plate, the drainage mechanism comprising: A temporary storage box, a drainage port being provided on the equipment main body, the inner bottom wall of the drainage port being flush with the lower side of the slide plate with a lower height, the temporary storage box being in communication with the spin-drying chamber through the drainage port; A water collection tank, the water collection tank being in communication with the temporary storage box through a water outlet pipe, and a one-way valve being installed on the water outlet pipe.

[0006] To further improve the discharging effect of the cleaning agent, an auxiliary liquid discharging assembly is further included, the auxiliary liquid discharging assembly being used for assisting the cleaning liquid on the slide plate to fall, the auxiliary liquid discharging assembly comprising: A moving plate, the moving plate being movably arranged above the slide plate; A water absorption pad, the water absorption pad being detachably connected to the lower side of the moving plate, the water absorption pad being in contact with the top end of the slide plate.

[0007] To reduce the obstruction caused by the rising of the water absorption pad to the falling of the cleaning agent, a lifting assembly is further included, the lifting assembly comprising: A lifting plate, the lifting plate being movably arranged on the moving plate, the water absorption pad being detachably connected to the lifting plate.

[0008] To further improve the falling of the cleaning agent on the slide plate, a plurality of blowing pipes are installed on the moving plate, and the blowing pipes are in communication with the filter.

[0009] To promote the falling of the cleaning agent on the liquid falling plate, a scraping assembly is further included, the scraping assembly comprising: A rotating plate, the rotating plate being fixedly connected to the centrifugal mechanism, the rotating plate being driven by the centrifugal mechanism to rotate; Scraping blades, a plurality of scraping blades being provided, the scraping blades being fixedly connected to the bottom of the rotating plate, the scraping blades being in contact with the top of the liquid falling plate.

[0010] To further reduce the humidity in the spin-drying chamber, a vacuum pump is further included, and the air extraction port of the vacuum pump is in communication with the water collection tank.

[0011] To improve the drying effect on the wafer, the air supply pipe is in communication with a heating coil, and the heating coil is located inside the heating chamber.

[0012] To facilitate the falling of the discharged cleaning agent, the liquid falling plate is conical, and a plurality of liquid falling holes are provided at the bottom of the liquid falling plate.

[0013] The beneficial effects of the embodiments of the present disclosure are as follows: 1. In the present disclosure, the inside of the drying chamber is heated and dried by a heater to increase the temperature inside the drying chamber, facilitating the drying of the wafer. At the same time, the fan sends air into the heating chamber, and the hot air enters the inside of the drying chamber through the air supply pipe and the filter. While the centrifugal mechanism dries the wafer, hot air drying is performed on the wafer, improving the drying efficiency of the wafer.

[0014] 2. In the present disclosure, the discharged cleaning agent falls onto the slide plate through the conical liquid dropping plate and slides along the slide plate into the inside of the temporary storage box. Under the action of the vacuum pump, the moisture in the temporary storage box and the hot air in the drying chamber enter the inside of the water collection tank through the water outlet pipe. Under the action of the one-way valve, the water vapor in the water collection tank is prevented from flowing back into the inside of the equipment main body, enabling the moisture in the drying chamber to be discharged in a timely manner, reducing the pressure and humidity in the drying chamber, and facilitating the separation of the cleaning agent on the wafer from the wafer.

[0015] 3. In the present disclosure, the centrifugal mechanism drives the rotating plate and the wafer to rotate. While drying the wafer, the rotating plate drives the scraping blade to scrape the upper part of the liquid dropping plate, assisting the cleaning agent on the liquid dropping plate to fall.

[0016] 4. The moving plate drives the water absorption pad to move downward along the slide plate. The water absorption pad absorbs the cleaning agent on the slide plate. When the water absorption pad descends to the drainage port, the lifting plate can squeeze the water absorption pad to squeeze out the excess water and flow it into the inside of the temporary storage box. Then the lifting plate drives the water absorption pad away from the slide plate, and the moving plate drives the water absorption pad to rise along the slide plate, preventing the water absorption pad from affecting the sliding of the cleaning agent on the slide plate. At the same time, part of the hot air blows towards the slide plate through the purging pipe, and the purging pipe moves with the moving plate, assisting in blowing the cleaning agent on the slide plate into the inside of the temporary storage box.

[0017] 5. Therefore, compared with the wafer drying device in the prior art, in the present disclosure, the inside of the drying chamber is heated by a heater, and at the same time, the hot air entering the drying chamber is heated. The centrifugal mechanism drives the wafer to rotate for drying. The discharged cleaning agent slides onto the upper part of the slide plate through the liquid dropping plate and then slides into the inside of the temporary storage box through the slide plate. The centrifugal mechanism drives the rotating plate and the scraping blade to rotate to scrape the cleaning agent on the liquid dropping plate. The moving plate drives the water absorption pad to move to push the cleaning agent on the surface of the slide plate down. The vacuum pump pumps air into the inside of the water collection tank to suck the cleaning agent in the temporary storage box and the hot air in the equipment main body into the inside of the water collection tank, reducing the air pressure and humidity in the drying chamber and facilitating the drying of the wafer. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the accompanying drawings required for the description of the embodiments of the present disclosure. Obviously, the accompanying drawings in the following description are only some exemplary embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained according to the content of the exemplary embodiments of the present disclosure and these drawings.

[0019] Figure 1 Structural schematic diagram of the overall first perspective in an embodiment of the present disclosure; Figure 2 is Figure 1 Structural schematic diagram of a partial cross-section in the embodiment of; Figure 3 is Figure 1 Structural schematic diagram of the vacuum pump and the drainage mechanism in the embodiment of; Figure 4 is Figure 1 Structural schematic diagram of the slide plate, the heating assembly and the fan in the embodiment of; Figure 5 is Figure 1 Structural schematic diagram of the slide plate, the fan and the auxiliary liquid drainage assembly in the embodiment of; Figure 6 is Figure 1 Structural schematic diagram of the auxiliary liquid drainage assembly and the purge pipe in the embodiment of; Figure 7 is Figure 1 Structural schematic diagram of the first perspective of the liquid dropping plate, the centrifugal mechanism and the scraping assembly in the embodiment of; Figure 8 is Figure 1 Structural schematic diagram of the second perspective of the liquid dropping plate, the centrifugal mechanism and the scraping assembly in the embodiment of; Figure 9 is Figure 1 Structural schematic diagram of the overall second perspective in the embodiment of; Figure 10 is Figure 2 Local enlarged structural schematic diagram at position A in.

[0020] In the figure: 1. Equipment main body; 2. Cylinder head; 3. Driving cylinder; 4. Liquid dropping plate; 5. Slide plate; 6. Vacuum pump; 7. Purge pipe; 8. Transfer pipe; 101. Rotating frame; 102. Basket; 201. Heater; 301. Fan; 302. Filter; 303. Air supply pipe; 304. Air hood; 305. Heating coil; 401. Temporary storage box; 402. Water collection tank; 403. Water outlet pipe; 404. Check valve; 501, moving plate; 502, water absorption pad; 503, lead screw feeding mechanism; 601, lifting plate; 602, electric cylinder; 701, rotating plate; 702, scraping blade. Specific embodiments

[0021] The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present disclosure, rather than limiting the present disclosure.

[0022] To make the drawings concise, only the parts related to the disclosure are schematically shown in each drawing, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, components with the same structure or function are only schematically shown for one of them, or only one of them is marked. In this article, "one" not only means "only this one", but also means "more than one" situation, and "several" includes "two" and "more than two".

[0023] In this article, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific situations.

[0024] In the present disclosure, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0025] In the description of this embodiment, the orientation or positional relationship terms such as "above", "below", "left", and "right" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present disclosure.

[0026] In addition, in the description of the present application, terms such as "first" and "second" are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0027] As Figures 1 to 10 shown, it shows a multi-specification wafer drying device in an embodiment of the present disclosure, including a device main body 1 and a centrifugal mechanism. A drying chamber is provided inside the device main body 1, and the centrifugal mechanism is arranged inside the drying chamber. A cylinder head 2 for opening and closing the drying chamber is installed on the device main body 1. A pick-up and placement port is provided at the top of the drying chamber, and the cylinder head 2 is rotatably connected at the pick-up and placement port. A driving cylinder 3 is rotatably installed at the top of the device main body 1, and the output end of the driving cylinder 3 is rotatably connected to the cylinder head 2. By the expansion and contraction of the driving cylinder 3, the cylinder head 2 can be driven to rotate to open and close the pick-up and placement port. It also includes a liquid dropping plate 4, a sliding plate 5, a heating component, a hot air mechanism and a drainage mechanism. Compared with the wafer drying device in the prior art, in the present disclosure, the inside of the drying chamber is heated by a heater 201, and at the same time, the hot air entering the drying chamber is heated. The wafer is driven to rotate by the centrifugal mechanism to dry it. The dropped cleaning agent slides down the liquid dropping plate 4 to the upper side of the sliding plate 5, and then slides down through the sliding plate 5 into the inside of the temporary storage box 401. The centrifugal mechanism drives the rotating plate 701 and the scraping blade 702 to rotate to scrape off the cleaning agent on the liquid dropping plate 4. The moving plate 501 drives the water absorption pad 502 to move to push off the cleaning agent on the surface of the sliding plate 5. The vacuum pump 6 pumps air into the inside of the collection tank 402 to suck the cleaning agent in the temporary storage box 401 and the hot air in the device main body 1 into the inside of the collection tank 402, reducing the air pressure and humidity in the drying chamber and facilitating the drying of the wafer.

[0028] The liquid dropping plate 4 is fixedly connected inside the drying chamber, and the centrifugal mechanism is installed on the liquid dropping plate 4. The liquid dropping plate 4 is conical, and a plurality of liquid dropping holes are provided at the bottom of the liquid dropping plate 4. The sliding plate 5 is fixedly connected inside the drying chamber, and the sliding plate 5 is located below the liquid dropping plate 4. The sliding plate 5 is inclined and arranged inside the drying chamber. The centrifugal mechanism includes a motor and a rotating frame 101. A basket 102 is arranged on the rotating frame 101. The rotating frame 101 is rotatably connected to the liquid dropping plate 4. The wafer is placed inside the basket 102. By driving the rotating frame 101 and the basket 102 to rotate by the motor, the cleaning agent on the wafer is thrown out under the centrifugal force, so as to dry the wafer. The centrifugal mechanism is a structure in the existing wafer drying machine well-known to those skilled in the art and is not an innovation point of the present disclosure, so it will not be elaborated here. The dropped cleaning agent falls on the liquid dropping plate 4 and flows through the conical liquid dropping plate 4 to the liquid dropping holes at the bottom of the liquid dropping plate 4. The cleaning agent passes through the liquid dropping holes and falls on the sliding plate 5 and flows downward along the sliding plate 5 to discharge from the drying chamber, facilitating the centralized treatment of the cleaning agent.

[0029] The heating component is arranged below the sliding plate 5 and is used to heat the inside of the drying chamber. The heating component includes a heater 201. A heating cavity is formed between the sliding plate 5 and the inner bottom wall of the drying chamber. The heater 201 is installed inside the heating cavity. The heater 201 can be an electric heating wire. When the heater 201 is powered on, it generates heat to heat the inside of the drying chamber, especially the sliding plate 5, to raise the temperature inside the drying chamber, facilitating the heating and drying of the wafers and improving the efficiency of wafer drying.

[0030] The hot air mechanism is used to blow hot air into the inside of the drying chamber. The hot air mechanism includes a fan 301 and a filter 302. The air outlet of the fan 301 is communicated with the heating cavity. The heating cavity is communicated with an air supply pipe 303. The air supply pipe 303 is communicated with the drying chamber through the filter 302. The air supply pipe 303 is communicated with an air hood 304 through a hose. The air hood 304 is communicated with the top of the filter 302. The filter 302 is a filter 302 used in a known existing wafer dryer in the art. Fiberglass or polypropylene (PP) filter materials can be used. The folded structure is used to increase the filtration area. Multilayer filter screens and substances such as activated carbon are used to filter the incoming gas to prevent external dust and impurities from entering the inside of the drying chamber, ensuring the cleanliness of the process and improving the drying effect on the wafers. The air supply pipe 303 is communicated with a heating coil 305. The heating coil 305 is located inside the heating cavity. The heating coil 305 is arranged in a bent shape inside the heating cavity, which can extend the residence time of air in the heating cavity, thus ensuring the heating effect of the heater 201 on the air. The fan 301 is used to supply air into the heating cavity. The heater 201 heats the air inside the heating cavity. The hot air enters the inside of the drying chamber through the filter 302 to assist in hot air drying of the wafers in the basket 102, further accelerating the efficiency of wafer drying.

[0031] The drainage mechanism is used to timely drain the cleaning agent that slides down along the slide plate 5. The drainage mechanism includes a temporary storage tank 401 and a water collection tank 402. A drainage port is provided on the equipment main body 1, and the inner bottom wall of the drainage port is flush with the lower side of the slide plate 5. The temporary storage tank 401 is communicated with the drying chamber through the drainage port. The water collection tank 402 is communicated with the temporary storage tank 401 through a water outlet pipe 403. A one-way valve 404 is installed on the water outlet pipe 403. To further reduce the humidity in the drying chamber, a vacuum pump 6 is also included. The air extraction port of the vacuum pump 6 is communicated with the water collection tank 402. The dropped cleaning agent is concentrated into the interior of the temporary storage tank 401 through the liquid dropping plate 4 and the slide plate 5. The vacuum pump 6 is used to extract air into the interior of the water collection tank 402, so that the interior of the water collection tank 402 is in a relatively low pressure state. The hot air and steam generated by heating in the drying chamber are sucked into the interior of the water collection tank 402 under the action of the pressure difference. The excess gas is discharged to the outside through the vacuum pump 6. The cleaning agent in the temporary storage tank 401 flows into the interior of the water collection tank 402 through the water outlet pipe 403. The cleaning agent in the water collection tank 402 can be drained regularly. Under the action of the one-way valve 404, the gas and cleaning agent in the drying chamber flow unidirectionally into the interior of the water collection tank 402, preventing the liquid in the water collection tank 402 from flowing back, reducing the air pressure and humidity in the drying chamber, and thus facilitating the separation of the cleaning agent on the wafer from the wafer.

[0032] To further improve the discharge effect of the cleaning agent, an auxiliary liquid discharging assembly is further included. The auxiliary liquid discharging assembly is used to assist the cleaning liquid on the slide plate 5 to fall. The auxiliary liquid discharging assembly includes a moving plate 501 and a water absorption pad 502. The moving plate 501 is movably arranged above the slide plate 5. A lead screw feeding mechanism 503 is installed inside the drying chamber, that is, the motor drives the lead screw to rotate, thereby driving the movement of the lead screw nut seat on the lead screw. The moving plate 501 is installed on the lead screw nut seat, and the motor drives the moving plate 501 to move. The inclination angle of the lead screw is adapted to that of the slide plate 5, so that the moving plate 501 moves along the slide plate 5. The water absorption pad 502 is detachably connected to the lower part of the moving plate 501, and the water absorption pad 502 contacts the top end of the slide plate 5. To reduce the obstruction to the falling of the cleaning agent caused by the rising of the water absorption pad 502, a lifting assembly is further included. The lifting assembly includes a lifting plate 601. The lifting plate 601 is movably arranged on the moving plate 501. An electric cylinder 602 is installed on the moving plate 501. The lifting plate 601 is fixedly connected to the output end of the electric cylinder 602. The water absorption pad 502 is detachably connected to the lifting plate 601 through Velcro. The telescopic direction of the electric cylinder 602 is perpendicular to the slide plate 5 and the lead screw. The electric cylinder 602 can drive the water absorption pad 502 to approach or move away from the slide plate 5. When the motor drives the moving plate 501 and the water absorption pad 502 to move downward from top to bottom, the electric cylinder 602 drives the lifting plate 601 to descend so that the water absorption pad 502 contacts the top end of the slide plate 5, and absorbs the cleaning agent at the top end of the slide plate 5. When the water absorption pad 502 descends to the lowest position of the slide plate 5, that is, the drainage port position, the electric cylinder 602 drives the lifting plate 601 to descend, and cooperates with the slide plate 5 to squeeze the water absorption pad 502, and squeezes out the cleaning agent in the water absorption pad 502 and flows it into the internal of the temporary storage box 401. Then the electric cylinder 602 drives the lifting plate 601 and the water absorption pad 502 to rise away from the slide plate 5, and the motor reverses to drive the moving plate 501 and the water absorption pad 502 to rise along the slide plate 5. During the rising process, the water absorption pad 502 moves away from the slide plate 5, avoiding pushing the cleaning agent on the slide plate 5 above the slide plate 5, thereby facilitating the falling and discharging of the cleaning agent on the slide plate 5.

[0033] To further improve the falling of the cleaning agent on the slide plate 5, a plurality of purging pipes 7 are installed on the moving plate 501. The purging pipes 7 are communicated with the filter 302. A transfer pipe 8 is installed on the equipment main body 1. The transfer pipe 8 is communicated with the air outlet of the filter 302. The purging pipes 7 are communicated with the transfer pipe 8 through a telescopic hose. The fan 301 transports the hot air in the heating chamber to the inside of the filter 302 for filtering. Part of the clean hot air enters the inside of the drying chamber to heat and dry the wafer. Part of the hot air enters the inside of the purging pipes 7 through the transfer pipe 8. When the purging pipes 7 move along the slide plate 5 with the moving plate 501, the hot air blown out by the purging pipes 7 blows and heats the cleaning agent on the slide plate 5, further reducing the humidity in the drying chamber and ensuring the drying of the wafer.

[0034] To facilitate the fall of the cleaning agent on the liquid dropping plate 4, a scraping assembly is further included. The scraping assembly includes a rotating plate 701 and scraping blades 702. The rotating plate 701 is fixedly connected to the centrifugal mechanism. The rotating plate 701 is driven by the centrifugal mechanism to rotate. A plurality of scraping blades 702 are provided. The scraping blades 702 are fixedly connected to the bottom of the rotating plate 701. The scraping blades 702 are in contact with the top of the liquid dropping plate 4. The rotating plate 701 is fixedly connected to the rotating frame 101. When the motor drives the rotating frame 101 and the wafer in the basket 102 to rotate, the rotating frame 101 drives the rotating plate 701 to rotate. The rotating frame 101 is located at the center of the liquid dropping plate 4. The scraping blades 702 are made of soft elastic material. For example, rubber sheets can be selected. The bottom of the scraping blades 702 is in contact with the liquid dropping plate 4. By driving the scraping blades 702 to rotate through the rotating plate 701, the cleaning agent on the liquid dropping plate 4 can be assisted to be scraped off, and the cleaning agent is assisted to fall onto the sliding plate 5 and enter the inside of the water collecting tank 402 for collection.

[0035] The working principle or usage process of this multi-specification wafer drying device is as follows: The cylinder head 2 is opened through the driving cylinder 3, and the cleaned wafer is placed inside the basket 102 and fixed. Then the driving cylinder 3 closes the cylinder head 2, and the motor drives the rotating frame and the basket 102 to rotate, separating the cleaning agent on the wafer surface from the wafer under the action of centrifugal force; During the centrifugal drying process, the heater 201 is powered on to generate heat, and the fan 301 conveys air into the heating chamber. The heater 201 heats the air, and the hot air passes through the filter 302 and part of it is blown into the inside of the drying chamber to heat and dry the wafer; The fallen cleaning agent falls through the liquid dropping plate 4 above the sliding plate 5 and slides through the sliding plate 5 into the inside of the temporary storage box 401. The vacuum pump 6 pumps air into the inside of the water collecting tank 402. The cleaning agent in the temporary storage box 401 enters the inside of the water collecting tank 402 through the water outlet pipe 403. At the same time, the excess air and water vapor in the drying chamber are also sucked into the inside of the water collecting tank 402; When the centrifugal mechanism drives the wafer to rotate and dry, it drives the rotating plate 701 and the scraping blades 702 to rotate. The scraping blades 702 assist in scraping off the cleaning agent on the liquid dropping plate 4. The lead screw feeding mechanism 503 drives the moving plate 501 to move along the sliding plate 5, and the water absorption pad 502 absorbs and pushes down the cleaning agent above the sliding plate 5. When the moving plate 501 moves to the drainage port, the electric cylinder 602 drives the lifting plate 601 to squeeze the water absorption pad 502, squeezing out the cleaning agent in the water absorption pad 502 and flowing it into the inside of the temporary storage box 401 and the water collecting tank 402. Then the electric cylinder 602 drives the lifting plate 601 and the water absorption pad 502 away from the sliding plate 5, and the moving plate 501 drives the water absorption pad 502 to rise along the sliding plate 5; After drying, the driving cylinder 3 opens the cylinder head 2, takes out the wafer in the basket 102, and puts the wafer to be dried into the basket 102 for drying.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure rather than to limit them. Although the present disclosure has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present disclosure can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present disclosure, and they should all be covered within the scope of the claims of the present disclosure.

Claims

1. A multi-specification wafer spin-drying device, comprising a device body (1) and a centrifugal mechanism, wherein a spin-drying chamber is provided inside the device body (1), the centrifugal mechanism is arranged inside the spin-drying chamber, and a cylinder cover (2) for opening and closing the spin-drying chamber is installed on the device body (1), characterized in that: Also includes: A liquid drop plate (4), the liquid drop plate (4) being fixedly connected to the interior of the spin-drying chamber, and the centrifugal mechanism being mounted on the liquid drop plate (4); A slide plate (5), the slide plate (5) being fixedly connected to the interior of the spin-drying chamber, the slide plate (5) being located below the liquid drop plate (4); A heating component, the heating component is arranged below the slide plate (5), and the heating component is used to heat the interior of the spin-drying chamber; A hot air mechanism, the hot air mechanism is used to cooperate with the heating component to blow hot air into the interior of the spin-drying chamber; A drainage mechanism, the drainage mechanism is used to timely discharge the cleaning agent that slides down the slide plate (5), the drainage mechanism comprising: A temporary storage box (401), wherein a drainage port is provided on the device body (1), and the temporary storage box (401) is connected to the drying chamber through the drainage port; A water collecting tank (402), the water collecting tank (402) is connected to the temporary storage tank (401) via a water outlet pipe (403), and a one-way valve (404) is installed on the water outlet pipe (403).

2. The multi-specification wafer drying device according to claim 1, characterized in that: The heating assembly comprises: A heater (201), wherein a heating chamber is formed between the slide plate (5) and the inner bottom wall of the spin-drying chamber, and the heater (201) is installed inside the heating chamber.

3. The multi-specification wafer drying device according to claim 2, characterized in that: The hot air mechanism comprises: A fan (301), wherein an air outlet of the fan (301) is in communication with the heating chamber; The filter (302) is connected to the heating chamber through an air supply pipe (303), and the air supply pipe (303) is connected to the drying chamber through the filter (302).

4. The multi-specification wafer drying device according to claim 3, characterized in that: It also includes an auxiliary liquid drainage component, which is used to assist the cleaning liquid on the slide plate (5) to fall, and the auxiliary liquid drainage component includes: A movable plate (501), the movable plate (501) being movably arranged above the sliding plate (5); A water-absorbing pad (502) is detachably connected to the bottom of the movable plate (501), and the water-absorbing pad (502) is in contact with the top of the slide plate (5).

5. The multi-specification wafer drying device according to claim 4, characterized in that: Also included is a lifting assembly, the lifting assembly comprising: A lifting plate (601), wherein the lifting plate (601) is movably arranged on the movable plate (501), and the water-absorbing pad (502) is detachably connected to the lifting plate (601).

6. The multi-specification wafer drying device according to claim 5, characterized in that: A plurality of purge pipes (7) are installed on the movable plate (501), and the purge pipes (7) are in communication with the filter (302).

7. The multi-specification wafer drying device according to claim 6, characterized in that: Also included is a scraping assembly, the scraping assembly comprising: a rotating plate (701), the rotating plate (701) being fixedly connected to the centrifugal mechanism, the rotating plate (701) being driven by the centrifugal mechanism to rotate; A scraper (702), wherein a plurality of scrapers (702) are provided, wherein the scraper (702) is fixedly connected to the bottom of the rotating plate (701), and the scraper (702) is in contact with the top of the liquid drop plate (4).

8. The multi-specification wafer drying device according to claim 7, characterized in that: It also includes a vacuum pump (6), wherein an air suction port of the vacuum pump (6) is in communication with the water collecting tank (402).

9. The multi-specification wafer drying device according to claim 8, characterized in that: The air supply pipe (303) is connected to a heating coil (305), and the heating coil (305) is located inside the heating chamber.

10. The multi-specification wafer drying device according to claim 9, characterized in that: The liquid drop plate (4) is conical in shape, and a plurality of liquid drop holes are provided at the bottom of the liquid drop plate (4).

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