Double-loading-position arm control method and system

Abstract

The invention discloses a double-loading-position arm control method and system, and relates to the technical field of wafer conveying. After instruction information is obtained, the action process control layer executes a corresponding action process according to the action execution type, the source position and the target position information; the action execution layer extracts position data which a telescopic motor and a rotating motor need to reach according to the target position information to serve as target positions of motion control; in combination with a preset speed parameter, generating a target motion speed; the execution unit control layer converts the target position and the target motion speed into motion parameters of a telescopic motor and a rotary motor. A layered architecture design is adopted and comprises an action process control layer, an action execution layer and an execution unit control layer, so that not only is a complex multi-step action process convenient to realize, but also switching of different execution modes and integration of safety protection logic can be flexibly supported.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer transfer, and particularly to a dual-loading position arm control method and system. Background Art

[0002] In semiconductor thin film deposition equipment, the wafer transfer arm is a key component for realizing efficient wafer transfer. At present, most transfer arms adopt a single-loading position design, that is, only one wafer placement position is set on the arm. This design enables the arm to complete the operation by simply moving to a fixed working position when performing the task of picking and placing wafers, with relatively simple control logic and convenient calibration and maintenance. However, the single-loading position design can only perform a single pick-and-place action each time. During the transfer process between the wafer cassette, the elevator, and the process chamber, the arm needs to make frequent round trips, severely restricting the equipment throughput. With the development of semiconductor equipment towards compactness, the distance between the wafer cassette and the process chamber increases, and it is difficult for the single-loading position arm to balance the requirements of long-distance transfer and fine operation.

[0003] To improve the wafer transfer efficiency, some equipment has started to adopt a dual-loading position transfer arm, that is, two wafer placement positions are set on the arm. However, existing dual-loading position arm control schemes mostly adopt hard-coded control logic with a fixed action process, making it difficult to adapt to different process requirements. When the equipment layout or process flow changes, it is necessary to rewrite the control program, resulting in a long debugging cycle. In addition, the control software is bound to specific hardware, making it difficult to adapt to different models of transfer arms and unable to support the free combination of complex action processes, restricting the improvement of equipment performance. Summary of the Invention

[0004] The object of the present invention is to propose a dual-loading position arm control method and system, which realizes the efficient conversion from instruction reception to mechanical action through the coordinated work of the action process control layer, the action execution layer, and the execution unit control layer, has outstanding flexibility, and can adapt to various arm controls.

[0005] According to the first aspect of the embodiments of the present disclosure, a dual-loading position arm control method is provided, including the following steps:

[0006] After obtaining the instruction information, the action process control layer executes the corresponding action process according to the action execution type, the source position, and the target position information;

[0007] The action execution layer extracts the position data that the telescopic motor and the rotary motor need to reach according to the target position information as the target position for motion control; combines the preset speed parameters to generate the target motion speed;

[0008] The execution unit control layer converts the target position and the target movement speed into the movement parameters of the telescopic motor and the rotary motor.

[0009] In one embodiment, before the arm performs the transfer action, the calibration of the working position is completed first. The working position refers to the specific positions that the telescopic motor and the rotary motor of the arm need to reach when picking up and placing wafers. When the arm transfers wafers between different transfer stations, the telescopic and rotary actions are performed according to the preset process sequence.

[0010] In one embodiment, the calibration method of the working position is as follows:

[0011] Adjust the arm to the wafer picking and placing position or the idle position through rotation and telescopic movement;

[0012] Record the position data of the current telescopic motor and rotary motor, and assign numbers to them;

[0013] Distinguish the loading positions of the calibrated working positions, and clearly mark them as the first loading position or the second loading position.

[0014] In one embodiment, the host computer transmits the instruction information to the arm in the form of a string, and the keyword fields are separated by ' / '; the instruction information includes the instruction type, the execution action type, the source information, and the target position; after the instruction information is executed, it is fed back in the form of a string, that is, a confirmation signal is returned when successful, and a fault description is returned when an error occurs.

[0015] In one embodiment, after the telescopic motor and the rotary motor execute according to the movement parameters, they return a completion signal to the action execution layer. The action execution layer obtains the deviation between the target position and the current position. If the deviation is within the allowable deviation range, it is confirmed that the wafer has accurately reached the target working position.

[0016] In one embodiment, the action execution layer determines the current working position state by real-time monitoring of the positions of the telescopic motor and the rotary motor. Each working position is preset with an interlock condition. When it is detected that the target action instruction conflicts with the current working position interlock condition, the action execution layer will immediately abort the control instruction issuing process and prohibit sending any motion control signals to the telescopic motor and the rotary motor.

[0017] In one embodiment, the complete action process of the arm is monitored and judged by the process control module. When all the working position tasks are executed in sequence, it is determined that the arm action is completed.

[0018] According to the second aspect of the embodiments of the present disclosure, a dual-loading position arm control system is provided, including:

[0019] The action process control module, after obtaining the instruction information, executes the corresponding action process according to the action execution type, source position, and target position information;

[0020] The action execution module extracts the position data that the telescopic motor and the rotary motor need to reach according to the target position information as the target position for motion control; combines the preset speed parameters to generate the target motion speed;

[0021] The execution unit control module converts the target position and the target motion speed into the motion parameters of the telescopic motor and the rotary motor.

[0022] According to the third aspect of the embodiments of the present disclosure, an electronic device is provided, including a memory, a processor, and a computer program running on the memory. When the processor executes the program, the above-mentioned dual-loading position arm control method is implemented.

[0023] According to the fourth aspect of the embodiments of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the program is executed by a processor, the above-mentioned dual-loading position arm control method is implemented.

[0024] The above technical solutions adopted by the present invention, compared with the prior art, have the following advantages: The present invention adopts a hierarchical architecture design, including an action process control layer, an action execution layer, and an execution unit control layer. This design not only facilitates the implementation of complex multi-step action processes, but also flexibly supports the switching of different execution modes and the integration of safety protection logics. At the same time, through parameter adjustment and interface adaptation, it can be quickly transplanted and applied to various arm control systems, with good scalability and versatility. Description of the Drawings

[0025] The specification drawings constituting a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0026] Figure 1 It is a flowchart of a dual-loading position arm control method. Detailed Embodiments

[0027] The present disclosure will be further described below in conjunction with the drawings and embodiments.

[0028] It should be noted that the following detailed descriptions are all illustrative and are intended to provide a further description of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0029] Note that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0030] Note that the flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of methods and systems according to various embodiments of the present disclosure. It should be noted that each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code may include one or more executable instructions for implementing the logical functions specified in each embodiment. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. Similarly, it should be noted that each block in the flowchart and / or block diagram, and the combinations of blocks in the flowchart and / or block diagram, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0031] In a chemical vapor deposition (CVD) device for semiconductor manufacturing, wafer transfer is achieved through a dual-loading-position arm to automate the transfer of wafers between a wafer cassette, an elevator, and a process chamber. Considering the equipment layout characteristics - the wafer cassette is relatively far away and the cavity space is limited, the arm is designed with a dual-loading-position structure: a middle groove and a front platform. The front platform is dedicated to the transfer of long-distance stations (such as the wafer cassette), while the middle groove is responsible for the transfer operations of other short-distance stations.

[0032] By parsing the host computer instructions, information such as the source address and target address of the action is obtained, a suitable loading position is selected, and the pre-calibrated position data is called to precisely control the coordinated movement of the two degrees of freedom of rotation and extension. The entire transfer process is completed under the coordinated cooperation of the loading platform, the elevator lifting mechanism of the transfer station, and the internal drive device of the process chamber, ensuring the efficient and reliable transfer of wafers inside the equipment. This design, through the flexible configuration of the dual-loading positions, not only solves the mechanical interference problem under limited space but also meets the process requirements for different transfer distances, significantly improving the equipment throughput and operation reliability.

[0033] Embodiment 1:

[0034] This embodiment provides a dual-loading-position arm control method, including the following steps:

[0035] S1. After obtaining the instruction information, the action process control layer executes the corresponding action process according to the action execution type, source position, and target position information;

[0036] Specifically, different execution types correspond to different operation logics. The complete action process of the arm is scheduled and monitored by the process control module. When all the tasks at the working positions are completed, it is determined that the arm action is completed. The process for the arm to pick and place wafers is as follows:

[0037] S11. First, detect whether the arm is at the initial idle position (both the rotation and telescopic axes are at the zero position)

[0038] S12. Rotate the arm to the first target working position, send a rotation instruction containing the target working position number to the action execution layer, and monitor the in-place status of the rotation axis in real time;

[0039] S13. Execute the telescopic axis movement to the corresponding working position, select the applicable loading position (middle groove / front platform), send an instruction containing the telescopic position number to the action execution layer, and confirm the in-place status of the telescopic axis;

[0040] S14. After arriving, determine the wafer operation (pick / place) to be performed at the current working position, and send a specific operation instruction to the action execution layer; update the wafer status flag: when performing the pick action, mark it as "with wafer", and when performing the place action, mark it as "without wafer";

[0041] S15. Repeat steps S12 - S14, rotate and telescope to the next working position until the operation process of all preset working positions is completed.

[0042] This process adopts a closed-loop control strategy. In-place detection and status feedback are set for each motion link to ensure the precise positioning of each axis and the reliability of the operation. By updating the wafer status information in real time, accurate material tracking is maintained.

[0043] S2. The action execution layer extracts the position data that the telescopic motor and the rotation motor need to reach according to the target position information as the target position for motion control; combines the preset speed parameters to generate the target motion speed;

[0044] Specifically, according to the target position information (including the working position number and pick / place status), extract the corresponding motor position data from the calibration position database to obtain the accurate motor target position parameters; then call the preset speed parameters to generate the matching target motion speed

[0045] The action execution layer accurately determines the current working position status by real-time monitoring the actual position coordinates of the telescopic motor and the rotary motor. Each working position is preset with mechanical interlock conditions (including prohibiting rotation, prohibiting telescoping, or prohibiting both operations simultaneously). When it is detected that the target action instruction conflicts with the interlock condition of the current working position, the action execution layer will immediately abort the control instruction issuing process and prohibit sending any motion control signals to the relevant motors (telescopic / rotary), thereby ensuring the safety of the equipment. This interlock mechanism is effectively protected by both hardware-level protection and software logic judgment, preventing the risk of mechanical interference.

[0046] S3. The execution unit control layer converts the target position and the target motion speed into the motion parameters of the telescopic motor and the rotary motor.

[0047] Specifically, the motion parameters include the target rotation angle / telescopic displacement of each motor, the motion speed curve (including acceleration and deceleration parameters) of each axis, and the motion trajectory interpolation parameters, and these parameters are sent to each motor driver through the real-time communication interface to drive the motors to complete precise coordinated motion.

[0048] In this embodiment, the action execution of the arm is realized by the host computer through the instruction control system. The instructions and feedback information are both transmitted in the form of strings, and the keyword segments are separated by ' / '. The instructions mainly include the instruction type (MOV task instruction / SET setting instruction / REQ request instruction), the execution action type (such as pick / place / exchange / load / unload / single action, etc.), the source information, and the target position. When executing the task instruction (MOV), it is necessary to specify the action type, the source, and the target position. The key information is extracted by identifying ' / ' and sent to the action execution layer. After the execution is completed, the feedback information in the string format is returned. When successful, the confirmation signal is returned, and when an error occurs, the fault description is returned.

[0049] In this embodiment, before the arm executes the transfer action, it is necessary to first complete the calibration of the working position. The working position refers to the specific position that the telescopic motor and the rotary motor of the arm need to reach when picking and placing the wafers. When the arm transfers the wafers between different transfer stations, it is necessary to execute actions such as telescoping and rotating according to the preset process sequence. When calibrating the position, the operation steps are as follows:

[0050] 1) Adjust the arm to the appropriate wafer picking and placing position or the idle position through rotation and telescoping movements;

[0051] 2) Record the position data of the current telescopic motor and the rotary motor and assign numbers to them;

[0052] 3) Differentiate the loaded positions of the calibrated working positions and clearly mark them as the first loading position or the second loading position.

[0053] The present invention realizes the free combination of complex actions through the action process control layer. The action execution layer supports the flexible configuration of motion parameters, and the execution unit control layer can adapt to a variety of execution mechanisms. Through the design concept of hierarchical decoupling, while ensuring the control accuracy, it provides good functional scalability and device compatibility.

[0054] Embodiment 2:

[0055] This embodiment provides a dual-loading position arm control system, including:

[0056] The action process control module, after obtaining the instruction information, executes the corresponding action process according to the action execution type, source position, and target position information;

[0057] The action execution module extracts the position data that the telescopic motor and the rotary motor need to reach according to the target position information as the target position for motion control; combines the preset speed parameters to generate the target motion speed;

[0058] The execution unit control module converts the target position and the target motion speed into the motion parameters of the telescopic motor and the rotary motor.

[0059] Embodiment 3:

[0060] An electronic device includes a memory, a processor, and a computer program running on the memory. When the processor executes the program, it implements the above-mentioned dual-loading position arm control method, including:

[0061] After obtaining the instruction information, the action process control layer executes the corresponding action process according to the action execution type, source position, and target position information;

[0062] The action execution layer extracts the position data that the telescopic motor and the rotary motor need to reach according to the target position information as the target position for motion control; combines the preset speed parameters to generate the target motion speed;

[0063] The execution unit control layer converts the target position and the target motion speed into the motion parameters of the telescopic motor and the rotary motor.

[0064] Embodiment 4:

[0065] A computer-readable storage medium stores a computer program. When the program is executed by a processor, it implements the above-mentioned dual-loading position arm control method, including:

[0066] After obtaining the instruction information, the action process control layer executes the corresponding action process according to the action execution type, source position, and target position information;

[0067] The action execution layer extracts the position data that the telescopic motor and the rotary motor need to reach based on the target position information, and uses it as the target position for motion control; combines the preset speed parameters to generate the target motion speed.

[0068] The execution unit control layer converts the target position and the target motion speed into the motion parameters of the telescopic motor and the rotary motor.

[0069] Those skilled in the art should understand that the above-mentioned modules or steps of the present disclosure can be implemented by a general-purpose computer device. Optionally, they can be implemented by program codes executable by a computing device, so that they can be stored in a storage device and executed by the computing device, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module for implementation. The present disclosure is not limited to any specific combination of hardware and software.

[0070] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0071] Although the specific implementation manners of the present disclosure have been described above in conjunction with the accompanying drawings, it is not a limitation on the protection scope of the present disclosure. Those skilled in the art should understand that based on the technical solutions of the present disclosure, various modifications or deformations that can be made without creative efforts by those skilled in the art are still within the protection scope of the present disclosure.

Claims

1. A dual loading position arm control method, characterized in that: The following steps are involved: After obtaining the instruction information, the action flow control layer executes the corresponding action flow according to the action execution type, source location and target location information; The action execution layer extracts the position data that the telescopic motor and the rotating motor need to reach based on the target position information as the target position of motion control; Combined with the preset speed parameters, the target motion speed is generated; The execution unit control layer converts the target position and target motion speed into motion parameters of the telescopic motor and the rotary motor.

2. A dual loading position arm control method according to claim 1, characterized in that: Before the arm performs the transfer action, the work position calibration is completed first. The work position refers to the specific position that the telescopic motor and rotation motor of the arm need to reach when the arm takes and places the wafer. When the arm transfers the wafer between different transfer stations, the telescopic and rotation actions are performed according to the preset process sequence.

3. A dual loading position arm control method according to claim 2, characterized in that: The working position is calibrated as follows: Adjust the arm to the wafer placement position or idle position through rotation and telescopic movement; Record the current position data of the telescopic motor and the rotating motor and assign numbers to them; The calibrated working positions are distinguished by loading positions and clearly marked as the first loading position or the second loading position.

4. A dual loading position arm control method according to claim 1, characterized in that: The host computer transmits the command information to the arm in the form of a string, with key fields separated by ' / '; the command information includes the command type, execution action type, source information and target position; after the command information is executed, it is fed back in the form of a string, that is, a confirmation signal is returned when successful, and a fault description is returned when an error occurs.

5. A dual loading position arm control method according to claim 1, characterized in that: The telescopic motor and the rotating motor return a completion signal to the action execution layer after executing according to the motion parameters. The action execution layer obtains the deviation between the target position and the current position. If the deviation is within the allowable deviation range, it is confirmed that the wafer has accurately reached the target working position.

6. A dual loading position arm control method according to claim 1, characterized in that: The action execution layer determines the current working position status by monitoring the position of the telescopic motor and the rotating motor in real time. Each working position has preset interlocking conditions. When it is detected that the target action instruction conflicts with the interlocking condition of the current working position, the action execution layer will immediately terminate the control instruction issuance process and prohibit sending any motion control signals to the telescopic motor and the rotating motor.

7. A dual loading position arm control method according to claim 1, characterized in that: The complete movement process of the arm is monitored and judged by the process control module. When all workstation tasks are executed in sequence, the arm movement is considered to be completed.

8. A dual loading arm control system, characterized in that: include: The action flow control module, after obtaining the instruction information, executes the corresponding action flow according to the action execution type, source location and target location information; The action execution module extracts the position data that the telescopic motor and the rotating motor need to reach according to the target position information as the target position of the motion control; and generates the target motion speed in combination with the preset speed parameters; The execution unit control module converts the target position and target motion speed into motion parameters of the telescopic motor and the rotary motor.

9. An electronic device comprising a memory, a processor and a computer program stored and running on the memory, characterized in that: When the processor executes the program, a dual-loading arm control method as described in any one of claims 1-7 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, a dual-loading arm control method as described in any one of claims 1-7 is implemented.

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