Detection machine head of welding spot detection equipment

Abstract

The invention relates to a detection machine head of welding spot detection equipment, which is provided with an XYZ three-degree-of-freedom movement mechanism, the XYZ three-degree-of-freedom movement mechanism is arranged on a rack, a lifting seat is arranged at the movement tail end of the XYZ three-degree-of-freedom movement mechanism, an image capturing device and a force control shifting device are arranged on the lifting seat, and the force control shifting device is arranged on the lifting seat. The lifting seat drives the image capturing device and the force control shifting device to lift synchronously; the force control shifting device is used for shifting a welding spot, and the image capturing device is at least used for obtaining a welding spot image and a monitoring image of the shifting dynamic state of the force control shifting device and transmitting the images to the computer for detection. According to the invention, not only can image detection be carried out, but also cold solder and insufficient solder online toggle detection can be carried out, welding spot online integrated visual detection and toggle detection can be realized, the technical problem that cold solder and insufficient solder cannot be judged through pure visual detection is solved, the structure is compact, the automation degree is high, and the detection efficiency and speed are improved.

Description

Technical Field

[0001] The invention relates to the technical field of industrial visual inspection, in particular to visual inspection equipment for solder joint inspection. Background Art

[0002] In the 3C electronics industry, it is often necessary to weld components to circuit boards. After welding, the solder joints need to be inspected. Traditionally, workers use their naked eyes to inspect solder joints or solder balls. The manual naked eye inspection method not only has the disadvantages of low detection accuracy, low detection efficiency and poor detection effect, but also leads to high labor intensity for workers and high labor costs for enterprises. Later, in order to solve the problem of automatic detection, some CCD visual inspection equipment (industrial visual inspection) were developed on the market. This type of CCD visual inspection equipment installs the CCD visual inspection camera directly above the inspection station. When the IC electronic components are placed in the inspection station, the solder joints are captured by a camera or a camera for comparison or inspection. However, in actual inspection, if it is a false solder joint, it is sometimes impossible to judge it purely by vision. At this time, it is also necessary to manually detect it by poking, which cannot meet the automatic detection and affect the progress of the production process. Summary of the invention

[0003] The purpose of the present invention is to provide a detection head for solder joint detection equipment, which can not only capture solder joints through a camera or a camera for comparison or detection, but also perform online detection of false solder joints and cold solder joints, thereby meeting automatic detection control and improving detection efficiency and speed.

[0004] In order to achieve the above object, the present invention adopts the following technical scheme: The detection head of the solder joint detection equipment has an XYZ three-degree-of-freedom motion mechanism, which is installed on a frame, and a lifting seat is provided at the motion end of the XYZ three-degree-of-freedom motion mechanism, and an image capturer and a force-controlled toggle are provided on the lifting seat, so that the lifting seat drives the image capturer and the force-controlled toggle to rise and fall synchronously; the force-controlled toggle is used to toggle the solder joint, and the image capturer is at least used to obtain the solder joint image and obtain the monitoring image of the toggle dynamic of the force-controlled toggle and transmit it to the computer for detection.

[0005] The above scheme is further that the force-controlled actuator includes a first cylinder, a second cylinder and a shifting pin connected in series, the first cylinder is positioned on the lifting seat and extends in the Z-axis direction, the second cylinder is connected to the telescopic end of the first cylinder and extends in the X-axis direction, the shifting pin is connected to the telescopic end of the second cylinder, and the second cylinder drives the shifting pin to shift the welding point.

[0006] The above scheme is further that there are three image capturers, namely a first image capturer for taking global images of the product, a second image capturer for taking static images of solder joints, and a third image capturer for cooperating with a force-controlled actuator to perform force-controlled dynamic imaging. The three image capturers are relatively staggered and installed on the lifting seat; the pin moves the solder joint along the X-axis direction below the second image capturer, and the third image capturer is inclined relative to the pin and captures images from the side of the pin, so that the third image capturer can obtain dynamic images of the pin movement and the status of the solder joint being moved, thereby monitoring the solder joint moving process.

[0007] The above scheme is further that the detection head is also provided with a laser displacement sensor, which is installed on the lifting seat, and the laser displacement sensor recognizes the height difference through laser to assist the force control actuator to move the welding point.

[0008] The above scheme is further that the XYZ three-degree-of-freedom motion mechanism includes a fixed seat, a Y-axis motion seat, an X-axis motion seat and a Z-axis motion member that drives the lifting seat to rise and fall, which are assembled in series. The fixed seat is fixedly connected to the frame and is in an elevated state. Two Y-axis guide rails arranged in parallel and a Y-axis telescopic shaft located between the two Y-axis guide rails are provided on the lower side of the fixed seat; the Y-axis motion seat is assembled and connected to the fixed seat corresponding to the two Y-axis guide rails and is connected to the telescopic end of the Y-axis telescopic shaft, so that the telescopic end of the Y-axis telescopic shaft drives the Y-axis motion seat to slide along the two Y-axis guide rails; a crossbeam extending along the X-axis direction is provided at the front end of the Y-axis motion seat, and the X-axis motion seat is installed on the crossbeam through a guide rail structure and is driven by a power mechanism to reciprocate along the X-axis direction; a support plate is provided on the X-axis motion seat, which is located on the outside of the crossbeam and is in a vertical posture; the Z-axis motion member and the lifting seat are installed on the support plate together, and the lifting seat is connected to the support plate through a guide rail structure and is driven by the Z-axis motion member to move along the Z-axis direction.

[0009] The above scheme is further that the Z-axis moving part is a Z-axis cylinder installed on the support plate and arranged in a vertical posture, and the telescopic end of the Z-axis cylinder is connected to the lifting seat.

[0010] The above scheme is further that a first adjustment slide is provided on the front of the lifting seat, and a first support column and a second support column extend from the same side of the lifting seat, the first support column and the second support column are staggered and extend in the same direction, a second adjustment slide is constructed on the first support column, and a third adjustment slide is constructed on the second support column; the first image grabber is installed on the first adjustment slide and vertically downward, the second image grabber is installed on the second adjustment slide and vertically downward, the third image grabber is installed on the third adjustment slide and utilizes the rotation relationship of the third adjustment slide around the second support column to obtain a state of relative needle tilting.

[0011] The above solution is further characterized in that the first cylinder and the second cylinder are connected in series to form an L shape and surround the outer side and the lower side of the lifting seat.

[0012] The inspection head of the solder joint inspection equipment provided by the present invention can not only take pictures for inspection, but also perform online toggle inspection on false solder joints and cold solder joints, thereby realizing online integrated visual inspection and toggle inspection of solder joints, solving the technical problem that false solder joints and cold solder joints cannot be judged by purely visual inspection, and has a compact and reliable structure, a high degree of automation, and improved inspection efficiency and speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Attached Figure 1 It is a schematic diagram of the structure of a preferred embodiment of the present invention; Attached Figure 2 for Figure 1 A schematic diagram of a partial structure of an embodiment; Attached Figure 3 for Figure 2 Schematic diagram of the structure at an upward viewing angle; Attached Figure 4 for Figure 2 Schematic diagram of the structure from a top-down angle. DETAILED DESCRIPTION

[0014] The concept, specific structure and technical effects of the invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the invention.

[0015] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0016] See also Figure 1 , 2, as shown in Figures 3 and 4, is a schematic diagram of a preferred embodiment of the present invention. The present invention relates to a detection head of a solder joint detection device, which is suitable for detecting solder joints of high-end precision connector chips and wire harness integrated boards, and intelligently and digitally detecting and controlling defective processes such as false soldering, solder pad detachment, and offset soldering of fine solder joints on the integrated board. The detection head structure has an XYZ three-degree-of-freedom motion mechanism 1, which is installed on the frame, and a lifting seat 2 is provided at the moving end of the XYZ three-degree-of-freedom motion mechanism. An image grabber 3 and a force control pusher 4 are provided on the lifting seat 2 to realize the synchronous lifting of the lifting seat 2 driving the image grabber 3 and the force control pusher 4 to meet the working requirements. The force control pusher 4 is used to push the solder joint, and the image grabber 3 is at least used to acquire the solder joint image, acquire the monitoring image of the dynamic pushing of the force control pusher 4 and transmit it to the computer for detection. The computer is equipped with an AI algorithm module for existing visual detection. It can not only take pictures for detection, but also perform on-line pushing detection for false soldering and virtual soldering, realizing on-line integrated visual detection and pushing detection of solder joints.

[0017] The force control pusher 4 includes a series-connected first cylinder 41, a second cylinder 42 and a push pin 43. The first cylinder 41 is positioned on the lifting seat 2 and extends and retracts in the Z-axis direction. The second cylinder 42 is connected to the telescopic end of the first cylinder 41 and extends and retracts in the X-axis direction. The push pin 43 is connected to the telescopic end of the second cylinder 42, and the push pin 43 is driven by the second cylinder 42 to push the solder joint. Further in this embodiment, the push pin 43 is directly connected to the telescopic end of the second cylinder 42 through a pressure sensor 44 and forms an axial series state. The pressure sensor 44 verifies the torque value of the push pin and provides curve data of the push pin torque value and the motion value. Based on the motion of the XYZ three-degree-of-freedom motion mechanism, the extension and retraction of the first cylinder 41 increase the position adjustment of the push pin 43 in the Z-axis direction, which is used to move down to contact the solder joint and push it, while the telescopic end of the second cylinder 42 provides the pushing force of the push pin 43. The structure is simple and easy to control.

[0018] Figure 1 , 2As shown in FIGS. 3 and 4, the XYZ three-degree-of-freedom motion mechanism 1 of this embodiment includes a fixed seat 11, a Y-axis motion seat 12, an X-axis motion seat 13, and a Z-axis moving member 14 that drives the lifting seat 2 to lift, which are assembled in series. The fixed seat 11 is fixedly connected to the machine frame and is in a raised form. Two parallel Y-axis guide rails 111 and a Y-direction telescopic shaft 112 located between the two Y-axis guide rails 111 are provided on the lower side of the fixed seat 11; the Y-axis motion seat 12 is assembled and connected to the fixed seat 11 corresponding to the two Y-axis guide rails 111 and is connected to the telescopic end of the Y-direction telescopic shaft 112, so that the telescopic end of the Y-direction telescopic shaft 112 drives the Y-axis motion seat 12 to slide along the two Y-axis guide rails 111. The cooperation and support of the two Y-axis guide rails and the Y-direction telescopic shaft can ensure the smooth movement of the Y-axis motion seat 12 and reduce shaking. The Y-direction telescopic shaft 112 is preferably an electric lead screw, which improves the smoothness and accuracy of the movement and can accurately drive the Y-axis motion seat 12 to move in the Y-axis direction. A cross beam 121 extending in the X-axis direction is provided at the front end of the Y-axis motion seat 12. The X-axis motion seat 13 is installed on the cross beam 121 through a guide rail structure and can be driven by a power mechanism to reciprocate in the X-axis direction. The power mechanism can be a motor lead screw or a cylinder, etc.; a support plate 131 is provided on the X-axis motion seat 13, and the support plate 131 is located outside the cross beam 121 and is in a vertical posture. The Z-axis moving member 14 and the lifting seat 2 are installed on the support plate 131 together, and the lifting seat 2 is connected to the support plate through a guide rail structure and is driven by the Z-axis moving member to move in the Z-axis direction. The Z-axis moving member 14 of this embodiment is a Z-axis cylinder installed on the support plate and arranged in a vertical posture, and the telescopic end of the Z-axis cylinder is connected to the lifting seat 2. The lifting seat 2 is installed on the support plate 131 and is connected to the telescopic end of the Z-axis cylinder, forming a linear connection relationship. The Z-axis cylinder is installed on the support plate in a vertical posture to ensure the vertical center of gravity of the support plate and improve the movement stability and accuracy. The XYZ three-degree-of-freedom motion mechanism 1 realizes the XYZ three-degree-of-freedom series motion, has a high degree of automation, and a solid mechanical structure, which helps to improve the detection accuracy. The image grabber 3 and the force control pusher 4 are both installed on the lifting seat 2, so that the lifting seat drives the image grabber and the force control pusher to lift synchronously, which is convenient for control.

[0019] Furthermore, in this embodiment, there are three image capturers 3, namely, a first image capturer 3A for global image capture of the product, a second image capturer 3B for static image capture of the solder joint, and a third image capturer 3C for dynamic force-controlled imaging in cooperation with the force-controlled toggle 4; the pin 43 toggles the solder joint along the X-axis direction below the second image capturer 3B, and the third image capturer 3C is tilted relative to the pin 43 and captures images from the side of the pin, so that the third image capturer 3C can obtain dynamic images of the pin movement and the solder joint state, so as to monitor the solder joint toggle process, and can intelligently detect and control poor processes such as false soldering, pad drop, and biased soldering of small solder joints on the integrated board. The image capturer 3 is preferably an industrial camera, which can capture images and transmit them to a computer for analysis and processing to achieve visual inspection.

[0020] When working, the first image capturer 3A takes pictures of the product welding status and saves it, and binds it with the PCB identification code to upload it to the database and predict the quality of the solder joints; the second image capturer 3B detects poor front-end welding process, combines AI visual algorithms and static and dynamic images of solder joints to identify poor solder joints; the third image capturer 3C observes the pin in real time, and the dynamic process of moving the solder joints is convenient for product analysis; when the second image capturer 3B captures the image and finds suspected defects through the AI ​​intelligent algorithm, the pin will move down to the welding area to test the suspicious solder joints. In order to prevent the force from being too large or too small, the pressure sensor 44 is introduced in this embodiment for real-time monitoring to ensure that the time and torque value of the force are within the range of 2N.

[0021] In this embodiment, a first adjustment slide 21 is provided on the front side of the lifting seat 2, and a first support column 22 and a second support column 23 extend from the same side of the lifting seat 2. The first support column 22 and the second support column 23 are staggered and extend in the same direction. A second adjustment slide 24 is constructed on the first support column 22, and a third adjustment slide 25 is constructed on the second support column 23; the first image capturer 3A is installed on the first adjustment slide 21 and vertically downward, the second image capturer 3B is installed on the second adjustment slide 24 and vertically downward, and the third image capturer 3C is installed on the third adjustment slide 25 and utilizes the rotation relationship of the third adjustment slide 25 around the second support column 23 to obtain a tilted setting state relative to the dial needle 43. The first adjustment slide 21, the second adjustment slide 24 and the third adjustment slide 25 adopt a dovetail slide structure, which is convenient for adjusting the height positions of the first image grabber 3A, the second image grabber 3B and the third image grabber 3C respectively; in this embodiment, the front ends of the first image grabber 3A and the second image grabber 3B are also arranged with light sources, and the matching light sources are correspondingly installed on the corresponding adjustment slides, which is convenient for installation and adjustment. Further, the first cylinder 41 and the second cylinder 42 are connected in series in an L shape and surround the outer side and the lower side of the lifting seat. The first cylinder 41 is arranged on a side surface of the lifting seat 2 and is opposite to the first support column 22 and the second support column 23, and the second cylinder 42 is located at the lower end of the lifting seat 2. Such a design not only achieves a compact structure between the head components and facilitates adjustment and implementation, but also can effectively ensure that the counterweights on the opposite sides of the lifting seat 2 are close to each other, prevent the center of gravity of the lifting seat 2 from being skewed, facilitate the movement of the lifting seat and maintain a stable posture, and facilitate detection work.

[0022] The three image capturers work in 3 different ways, completely replacing the manual inspection of quality inspectors, achieving the working efficiency of electronic visual magnifiers, and identifying poor solder joints with multi-functional visual inspection techniques: the first image capturer 3A takes a global picture of the product and combines it with the AI ​​visual algorithm to predict the poor quality of solder joints. Specifically, it shoots the status of all solder joints of the product to mark the very obvious bad solder joints and saves and uploads them to the database; the second image capturer 3B statically enlarges and captures a picture of a single solder joint of the product and combines it with the AI ​​visual algorithm to perform a secondary inspection of poor quality. Specifically, it shoots the process status of a single solder joint and saves and uploads it to the database; when the second image capturer 3B captures the image, the needle 43 moves to avoid under the drive of the second cylinder 42, so that the second image capturer 3B can capture a static enlarged picture of a single solder joint of the product. The force control toggle device 4 is used to check the suspected solder joints, and the third image capturer 3C is used to obtain the dynamic image of the process, and the computer recognition method is used to detect the solder joints. Specifically, the entire solder joint toggle process can be monitored in real time, the feedback curve of the force control data can be observed in real time, and the relevant parameters can be saved and uploaded to the database; thereby achieving intelligent and digital detection and control of poor processes such as false soldering, pad loss, and biased soldering of small solder joints on the integrated board.

[0023] In this embodiment, the detection head is also provided with a laser displacement sensor 5, which is installed on the lifting seat 2. The laser displacement sensor 5 recognizes the height difference through laser to assist the force control actuator 4 in moving the solder joint. Specifically, the laser displacement sensor 5 measures the precise height value of the PCB based on the reference value (such as the height position of the dial pin) and feeds it back to the control system, automatically adjusting the height of the dial pin to prevent damage to the PCB board caused by differences in products or fixtures, accurately controlling and aligning, and facilitating intelligent detection and control. This structural design meets the height differences of solder joints on different PCB boards and during clamping, and automatically controls the height of the dial pin, specifically the telescopic control of the first cylinder 41.

[0024] The present invention optimizes the detection head structure of the solder joint detection equipment, which can not only detect the image, but also detect the false solder joints and the cold solder joints online, thereby realizing the online integrated visual detection and the cold solder joint detection, and solving the technical problem that the false solder joints and the cold solder joints cannot be judged by purely visual detection. The present invention has the advantages of compact structure, stable and reliable operation, high degree of automation, and improved detection efficiency and speed.

[0025] Although the preferred specific embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention should not be limited to the structures and operations that are exactly the same as the above descriptions and drawings. For those skilled in the art, many equivalent improvements and changes can be made to the above embodiments through logical analysis, reasoning or limited experiments without exceeding the concept and scope of the present invention, but these improvements and changes should all fall within the scope of protection required by the present invention.

Claims

1. The inspection head of the solder joint inspection equipment is characterized by: The invention comprises an XYZ three-degree-of-freedom motion mechanism (1), which is mounted on a frame, and a lifting seat (2) is provided at the motion end of the XYZ three-degree-of-freedom motion mechanism, and an image capturer (3) and a force-controlled toggle (4) are provided on the lifting seat (2), so that the lifting seat (2) drives the image capturer (3) and the force-controlled toggle (4) to rise and fall synchronously; the force-controlled toggle (4) is used to toggle a welding point, and the image capturer (3) is used to at least obtain an image of the welding point and obtain a monitoring image of the toggle dynamics of the force-controlled toggle (4) and transmit the image to a computer for detection.

2. The inspection head of the solder joint inspection equipment according to claim 1, characterized in that: The force-controlled actuator (4) comprises a first cylinder (41), a second cylinder (42) and a shifting pin (43) connected in series, wherein the first cylinder (41) is positioned on the lifting seat (2) and is telescopically extended in the Z-axis direction, the second cylinder (42) is connected to the telescopic end of the first cylinder (41) and is telescopically extended in the X-axis direction, and the shifting pin (43) is connected to the telescopic end of the second cylinder (42), and the shifting pin (43) is driven by the second cylinder (42) to shift the welding point.

3. The inspection head of the solder joint inspection equipment according to claim 1, characterized in that: The image capturers (3) are three, namely a first image capturer (3A) for capturing an overall image of the product, a second image capturer (3B) for capturing a static image of a welding spot, and a third image capturer (3C) for cooperating with a force-controlled actuator (4) to perform force-controlled dynamic imaging. The three image capturers (3) are relatively staggeredly mounted on the lifting seat (2); the pin (43) moves the welding spot along the X-axis direction below the second image capturer (3B); the third image capturer (3C) is tilted relative to the pin (43) and captures an image from the side of the pin (43), so that the third image capturer (3C) can obtain dynamic images of the pin movement and the state of the welding spot being moved, thereby monitoring the welding spot moving process.

4. The inspection head of the solder joint inspection equipment according to claim 1, characterized in that: The detection machine head is also provided with a laser displacement sensor (5), which is mounted on the lifting seat (2). The laser displacement sensor (5) assists the force control actuator (4) in moving the welding point by laser recognition of the height difference.

5. The inspection head of the solder joint inspection equipment according to claim 1, characterized in that: The XYZ three-degree-of-freedom motion mechanism (1) comprises a fixed seat (11), a Y-axis motion seat (12), an X-axis motion seat (13) and a Z-axis motion member (14) for driving a lifting seat to rise and fall, the fixed seat (11) being fixedly connected to a frame and being in an elevated state; two Y-axis guide rails (111) arranged in parallel and a Y-direction telescopic shaft (112) located between the two Y-axis guide rails (111) are provided on the lower side of the fixed seat (11); the Y-axis motion seat (12) is assembled and connected to the fixed seat (11) corresponding to the two Y-axis guide rails (111) and is connected to the telescopic end of the Y-direction telescopic shaft (112), so that the Y The telescopic end of the telescopic shaft drives the Y-axis motion seat to slide along the two Y-axis guide rails; the front end of the Y-axis motion seat (12) is provided with a crossbeam (121) extending along the X-axis direction; the X-axis motion seat (13) is mounted on the crossbeam (121) through a guide rail structure and is driven by a power mechanism to reciprocate along the X-axis direction; the X-axis motion seat (13) is provided with a support plate (131), which is located outside the crossbeam (121) and is in a vertical posture; the Z-axis motion member (14) and the lifting seat (2) are mounted together on the support plate (131), and the lifting seat (2) is connected to the support plate through the guide rail structure and is driven by the Z-axis motion member to move along the Z-axis direction.

6. The inspection head of the solder joint inspection equipment according to claim 1, characterized in that: The Z-axis moving part (14) is a Z-axis cylinder installed on the support plate and arranged in a vertical posture, and the telescopic end of the Z-axis cylinder is connected to the lifting seat (2).

7. The inspection head of the solder joint inspection equipment according to claim 3, characterized in that: A first adjustment slide (21) is provided on the front of the lifting seat (2), and a first support column (22) and a second support column (23) extend from the same side of the lifting seat, the first support column (22) and the second support column (23) are staggered and extend in the same direction, a second adjustment slide (24) is constructed on the first support column, and a third adjustment slide (25) is constructed on the second support column; the first image capturer (3A) is mounted on the first adjustment slide and vertically downward, the second image capturer (3B) is mounted on the second adjustment slide and vertically downward, and the third image capturer (3C) is mounted on the third adjustment slide and utilizes the rotation relationship of the third adjustment slide around the second support column to obtain a state of relative needle tilting.

8. The inspection head of the solder joint inspection equipment according to claim 2, characterized in that: The first cylinder (41) and the second cylinder (42) are connected in series to form an L shape and surround the outer side and the lower side of the lifting seat.

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