Light emitting device, light source array, detection device, laser radar and terminal

Abstract

A light emitting device, a light source array, a detection device, a laser radar and a terminal are applied to the technical field of detection. The light emitting device comprises multiple rows and multiple columns of light emitting chips, in one direction, light emitting areas of the multiple columns of light emitting chips are sequentially arranged, a gap exists between every two adjacent columns of light emitting chips, in the other direction, the multiple rows of light emitting chips are sequentially arranged, and the edges of the light emitting areas of every two adjacent columns of light emitting chips are connected or partially overlapped. The invention also correspondingly provides a light source array comprising the light emitting device, a detection device, a laser radar and a terminal. According to the light emitting device, the light emitting areas of the N rows of light emitting chips are free of gaps in the second direction, so that the light beams emitted by the light emitting device are free of gaps in the second direction, continuous emission visual fields are achieved, and the problem that visual field blind areas exist in the light beams of the multi-laser emitting end is solved. According to the invention, continuous and blind-area-free detection of the object in the visual field can be further realized, and the detection performance is improved.

Description

Technical Field

[0001] The present application relates to the field of detection technologies, and particularly to an optical emission device, a light source array, a detection device, a lidar, and a terminal. Background Art

[0002] A lidar is a sensor that combines laser technology with optoelectronic conversion technology. Its basic working principle is that the transmitting end emits detection light to a detection area, and the receiving end receives the returned light (or echo) returned from the detection area, and obtains relevant information about the target in the detection area through the returned light. This information helps the device to quickly identify and make decisions about surrounding objects, and is widely used in many fields such as intelligent vehicles, intelligent transportation, or surveying and mapping.

[0003] With the continuous development of device intelligence, people's requirements for the detection accuracy of lidars are getting higher and higher. More and more lidars use multiple lasers mounted sequentially to form the transmitting end in order to increase the transmission power, thereby improving the detection accuracy of the lidar. However, since the lasers are usually individually encapsulated, there is a certain thickness of the housing outside the light-emitting surface, and this layer of housing causes a certain distance between the lasers. When the transmitting end emits detection light, the area corresponding to the gap between the lasers becomes a detection vision blind area, affecting the perception coverage range of the device. Especially when the lidar is applied to a vehicle, the vision blind area will affect the perception of obstacles, thereby further affecting the comfort and safety of driving. Summary of the Invention

[0004] The present application provides an optical emission device, a light source array, a detection device, a lidar, and a terminal, which can achieve close arrangement or overlapping arrangement of the light-emitting areas of the optical emission chips, realize continuous emission vision, and solve the problem of the existence of vision blind areas between light beams. When the optical emission device is applied to a detection device, the present application can improve the detection performance of the detection device, and contribute to improving the intelligent level of the device to which the detection device is applied.

[0005] In a first aspect, the present application provides an optical emission device, including N rows and K columns of optical emission chips, where N and K are both integers, and N≥2, K≥2. Along a first direction, the light-emitting areas of the K columns of optical emission chips are arranged in sequence, and there is a gap between two adjacent columns of optical emission chips. Along a second direction, the N rows of optical emission chips are arranged in sequence, and the edges of the light-emitting areas of two adjacent rows of optical emission chips are connected or partially overlapped, where the first direction is different from the second direction.

[0006] In this application, the edges of the light-emitting regions of two adjacent rows of light-emitting chips are joined or partially overlapped, so that there is no gap in the light-emitting regions of N rows of light-emitting chips in the second direction. When using the light beam emitted by this light-emitting device, there is no slit in the second direction, achieving continuous emission vision and solving the problem of blind vision areas between light beams. When the light beam emitted by the light-emitting device is used to detect the object space, this application can achieve continuous and blind-area-free detection of objects within the vision, improving the detection performance of the detection device, significantly enhancing the accuracy of detection results, and contributing to improving the intelligent level of the equipment to which the detection device is applied.

[0007] In some solutions, the light-emitting device can be applied to a scanning detection device, which scans the light beam in the first direction (i.e., the scanning direction is the first direction), thereby achieving vision stitching in the first direction, making the emission vision continuous and seamless in both the first direction and the second direction. The light beam scanning can significantly increase the emission vision and improve the detection performance.

[0008] In a possible implementation manner of the first aspect, N rows of light-emitting chips are used to emit N line-shaped light spots, and the angular space edges of the N line-shaped light spots are joined or overlapped in the second direction. In this way, the light beam emitted by the light-emitting device is a line beam. The line beam is relatively long in the second direction, making the vision of the light-emitting device wider in the second direction. Moreover, the line beam is easy to scan, and can improve the range of the vision obtained by stitching the fields of view after scanning.

[0009] In another possible implementation manner of the first aspect, part of the light-emitting regions of two adjacent rows of light-emitting chips overlap, and along the second direction, the lengths of the overlapping regions of the light-emitting regions of any two adjacent rows of light-emitting chips are the same. In this way, the length of the overlapping region of the light beam is uniform.

[0010] In another possible implementation manner of the first aspect, along the second direction, there are at least two light-emitting chip groups with different lengths of overlapping regions of the light-emitting regions. One light-emitting chip group includes two adjacent rows of light-emitting chips. In this way, the length of the overlapping region of the light beam can be non-uniform, which is convenient for flexibly designing the energy density distribution of the light beam.

[0011] For example, by designing the overlapping regions of the light-emitting regions of the light-emitting chips, the overlapping region of the light beam in the region of interest (ROI) is made larger, while the overlapping region of the light beam in the non-ROI region is made smaller. In this way, the energy density of the light beam in the ROI region can be improved, and the vision of the light beam is ensured not to be significantly reduced.

[0012] In yet another possible implementation of the first aspect, among the N rows of light-emitting chips, the emission timings of the light beams emitted by adjacent rows of light-emitting chips are different. In the present application, since the distance between adjacent rows of light-emitting chips is relatively close, crosstalk is likely to occur. Through the emission timing, the emission timings of different rows of light-emitting chips are made different in the above implementation, which can reduce the crosstalk between partitions and improve the detection performance.

[0013] In yet another possible implementation of the first aspect, the light-emitting region of each light-emitting chip includes two sub-regions, and the emission timings of the light beams emitted by the two sub-regions are different. In this way, the crosstalk between different sub-regions in the light-emitting chip can be reduced, and the detection performance can be improved.

[0014] In yet another possible implementation of the first aspect, the two sub-regions include a first sub-region and a second sub-region arranged along the second direction, the first sub-region and the second sub-region face the two ends of the second direction respectively, the first sub-region of the light-emitting region of the N rows of light-emitting chips is used to emit a first light beam in a first time period, and the first sub-region of the light-emitting region of the N rows of light-emitting chips is used to emit a first light beam in a second time period, and the first time period is different from the second time period.

[0015] In yet another possible implementation of the first aspect, the N rows of light-emitting chips include 2×N sub-regions, the 2×A sub-regions correspond to at most 2×N emission timings, and at least one sub-region emits light at each emission timing, and the two sub-regions belonging to the same light-emitting region do not emit light at the same timing.

[0016] In yet another possible implementation of the first aspect, along the second direction, the (3×i + 1)-th sub-region emits light in a first time period, the (3×i + 2)-th sub-region emits light in a second time period, and the (3×i + 3)-th sub-region emits light in a third time period, where i takes an integer between

[0017] In yet another possible implementation of the first aspect, the two sub-regions of the light-emitting region of each light-emitting chip are cathode-isolated or anode-isolated. In the above implementation, the same light-emitting chip shares an anode or a cathode. Since the performance of the same chip in terms of voltage, current, and resistance is less different, it is easier to maintain consistent performance during use. Therefore, by dividing into two sub-regions and realizing time-division light emission in units of sub-regions, the reliability and consistency are better.

[0018] In yet another possible implementation of the first aspect, K = 2, and the driving regions of the K columns of light-emitting chips are located on both sides of the light-emitting regions of the K columns of light-emitting chips. The driving regions of the light-emitting chips are used to drive the light-emitting regions of the light-emitting chips to emit light beams. In this way, in the light-emitting device, the driving regions are located on both sides and the light-emitting regions are located in the middle, which can reduce the mounting gap in the first direction and is beneficial to the field of view stitching and point cloud stitching in the first direction.

[0019] In yet another possible implementation of the first aspect, the light-emitting region of the light-emitting chip includes a plurality of light-emitting points, and the plurality of light-emitting points are arranged in rows and columns, and the adjacent two columns of light-emitting points are staggered with each other. In this way, the light-emitting holes are staggered, reducing the gap between the light-emitting points and improving the energy density of the light beam.

[0020] Optionally, the length of the overlapping region between the light-emitting regions of two adjacent rows of light-emitting chips is the length of (Q + 0.5) light-emitting points, where Q is an integer and Q≥0.

[0021] In yet another possible implementation of the first aspect, the light-emitting chip includes one or more of a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a photonic crystal surface emitting laser (PCSEL), or a horizontal cavity surface emitting laser (HCSEL).

[0022] In yet another possible implementation of the first aspect, each column of the K columns of light-emitting chips includes L light-emitting chips, and along the first direction, the centers of the L light-emitting chips in each column of the K columns of light-emitting chips coincide.

[0023] In yet another possible implementation of the first aspect, along the first direction, there is a gap between the centers of two adjacent rows of light-emitting chips among the N rows of light-emitting chips. Along the second direction, there is a gap between the centers of two adjacent rows of light-emitting chips among the N rows of light-emitting chips.

[0024] In a second aspect, the present application provides a light source array, and the light source array includes the light-emitting device described in any one of the first aspects. Among them, the data of the light-emitting devices included in the light source array can be one or more, and for the convenience of description, it is set to be M, where M is an integer and M≥1.

[0025] In a possible implementation of the second aspect, M≥2, and the M light-emitting devices are arranged in sequence along the first direction.

[0026] In a possible implementation of the second aspect, at least two of the light-emitting devices have different powers.

[0027] In a third aspect, the present application provides a detection device, including a transmitting module and a receiving module. The transmitting module includes the light-emitting device described in any one of the first aspects, or includes the light source array described in any one of the second aspects. The transmitting module is used to emit detection light, and the receiving module is used to receive the echo of the detection light.

[0028] In a possible implementation of the third aspect, M≥2, and the M light-emitting devices are arranged in sequence along the first direction.

[0029] In a possible implementation of the third aspect, M≥2, the receiving module includes P array detectors, and the P array detectors are respectively configured to receive the echoes of the detection light emitted by one or more light emitting devices, where P is a positive number and P≥2.

[0030] In a possible implementation of the third aspect, each of the P array detectors includes a plurality of photosensitive regions, and each of the plurality of photosensitive regions corresponds to the light emitting region of one light emitting chip in one light emitting device.

[0031] In a fourth aspect, the present application provides a lidar, including the detection device described in the third aspect.

[0032] In a fifth aspect, the present application provides a terminal, including the light emitting device described in any item of the first aspect, or including the light source array described in any item of the second aspect, or including the detection device described in the third aspect, or including the lidar described in the fourth aspect. Optionally, the terminal includes intelligent terminals or transportation means such as vehicles, robots, drones, or ships. Description of the Drawings

[0033] The following will briefly introduce the drawings required for the description of the embodiments.

[0034] Figure 1 is a schematic structural diagram of a light emitting device provided by an embodiment of the present application;

[0035] Figure 2 is a schematic diagram of the light spot of the light beam emitted by the light emitting device provided by an embodiment of the present application;

[0036] Figure 3 is a schematic diagram of a field of view provided by an embodiment of the present application;

[0037] Figure 4 is a schematic diagram of the regional stitching of a point cloud provided by an embodiment of the present application;

[0038] Figure 5 is a schematic diagram of the length of the overlapping region of the light emitting chips provided by an embodiment of the present application;

[0039] Figure 6 is a schematic diagram of a transmission timing provided by an embodiment of the present application;

[0040] Figure 7 is a schematic structural diagram of another light emitting device provided by an embodiment of the present application;

[0041] Figure 8 is a schematic diagram of a cathode-isolated light emitting region provided by an embodiment of the present application;

[0042] Figure 9It is a schematic diagram of a light-emitting region with anode isolation provided by an embodiment of the present application;

[0043] Figure 10 It is one provided by an embodiment of the present application Figure 7 Schematic diagram of the emission timings of multiple sub-regions shown;

[0044] Figure 11 It is another one provided by an embodiment of the present application Figure 7 Schematic diagram of the emission timings of multiple sub-regions shown;

[0045] Figure 12 It is another one provided by an embodiment of the present application Figure 7 Schematic diagram of the emission timings of multiple sub-regions shown;

[0046] Figure 13 It is a schematic diagram of the structure of another light-emitting device provided by an embodiment of the present application;

[0047] Figure 14 It is a schematic diagram of a light-emitting point of a light-emitting device provided by an embodiment of the present application;

[0048] Figure 15 It is a schematic diagram of the structure of another light-emitting device provided by an embodiment of the present application;

[0049] Figure 16 It is a schematic diagram of the structure of another light-emitting device provided by an embodiment of the present application;

[0050] Figure 17 It is a schematic diagram of a light source array provided by an embodiment of the present application;

[0051] Figure 18 It is a schematic diagram of another light source array provided by an embodiment of the present application;

[0052] Figure 19 It is a schematic diagram of another light source array provided by an embodiment of the present application;

[0053] Figure 20 It is a schematic diagram of another light source array provided by an embodiment of the present application;

[0054] Figure 21 It is a schematic diagram of another light source array provided by an embodiment of the present application;

[0055] Figure 22 It is a schematic diagram of the structure of a detection device provided by an embodiment of the present application;

[0056] Figure 23 It is a schematic diagram of the structure of a detector provided by an embodiment of the present application. Detailed implementation manners

[0057] The following is an explanation of some terms in this application. It should be noted that these explanations are for the convenience of those skilled in the art and are not intended to limit the scope of protection required by this application.

[0058] The region of interest (ROI) refers to the area that needs to be processed or concerned, which is represented by a square, circle, ellipse, or irregular polygon in the detection area. Generally, the detection target is included in the region of interest.

[0059] The light spot refers to the bright spot formed by the light beam, and also refers to the energy density (or intensity, power) distribution of the light beam in the angular space.

[0060] The point cloud is the aggregation or set of points. Here, the points (also called target points, data points) are usually used to indicate the characteristics of the target. Exemplarily, the points indicate one or more of position (such as one-dimensional, two-dimensional, or three-dimensional coordinate positions), distance, angle, reflection intensity, color information, etc.

[0061] The explanations of the above terms can be applied in the following text.

[0062] The detection device uses the signal as the detection medium and realizes the detection of the detection area by transmitting the signal to the detection area (i.e., the object space) and receiving the echo of the signal. For example, distance measurement, speed measurement, or azimuth angle measurement, etc. A transmitting end and a receiving end are provided in the detection device. The transmitting end is used to transmit the signal, and the receiving end is used to receive the signal. Here, the signal includes light, such as laser.

[0063] In some solutions, the transmitting end includes a plurality of lasers mounted sequentially to improve the transmitting power of the light beam. However, due to the outer shell of the laser, there are gaps between the light beams emitted by the sequentially mounted lasers, and a vision blind area is easily formed at the gaps, which affects the sensing result.

[0064] In view of this, this application provides a light emitting device, a light source array, a detection device, a lidar, and a terminal, which can realize the close arrangement or overlapping arrangement of the light emitting areas of the light emitting chips, realize continuous emission vision, and solve the problem of the vision blind area existing between the light beams. When the light emitting device is applied to the detection device, this application can improve the detection performance of the detection device and contribute to improving the intelligent level of the equipment to which the detection device is applied.

[0065] The following first introduces the light emitting device provided by this application.

[0066] An embodiment of this application provides a light emitting device, including N rows and K columns of light emitting chips, where N and K are both integers, and N≥2, K≥2. Combined with Figure 1, the light emitting device 100 includes 4 rows and 2 columns of light emitting chips 10. Each light emitting chip 10 includes a light emitting area 11. Each light emitting chip 10 further includes a packaged housing 12, and the housing 12 is used to package the circuit and / or optical path of the light emitting chip. For example, a driving circuit is provided inside the housing 12 (the position where it is provided can be called the driving area), and the driving circuit is used to drive the light emitting area 11 to emit light.

[0067] In the embodiments of the present application, along the first direction (such as Figure 1 the X direction shown), the light emitting areas of K columns of light emitting chips are arranged in sequence, and there is a gap between two adjacent columns of light emitting chips. Along the second direction (such as Figure 1 the Y direction shown), N rows of light emitting chips are arranged in sequence, and the edges of the light emitting areas of two adjacent rows of light emitting chips are in contact or partially overlapped. Among them, the first direction is different from the second direction, and optionally, the first direction is perpendicular to the second direction. Combining Figure 1 , in the Y direction, the edge of the light emitting area of the first row of light emitting chips is in contact or partially overlapped with the edge of the light emitting area of the second row of light emitting chips, the edge of the light emitting area of the second row of light emitting chips is in contact or partially overlapped with the edge of the light emitting area of the third row of light emitting chips, and so on for the remaining rows, realizing seamless gaps between the light emitting areas in the Y direction.

[0068] Such as Figure 2 shown is a schematic diagram of the light spot of the light beam emitted by a light emitting device provided in the present application. N rows of light emitting chips emit N line light spots, and the angular space edges of the N line light spots are in contact in the second direction, as shown in Figure 2 (a). Or, there is an overlap in the angular space of the N line light spots in the second direction, as shown in Figure 2 (b). Of course, the present application is also equally applicable to the combined situation of the two, that is, the edges of the light emitting areas between some adjacent rows of light emitting chips are in contact, and the light emitting areas between some adjacent rows of light emitting chips overlap.

[0069] Optionally, the light spot sizes and shapes of the N line light spots may be the same or different. For example, in Figure 2 (b), along the second direction (i.e., the Y direction), the length of the light spot 202 is greater than the length of the light spot 201.

[0070] Combining Figure 2, the light beam emitted by the light emitting device is a line beam formed by splicing N light spots. The line beam is longer in the second direction, so that the field of view in the second direction is wider, and the line beam is easy to implement scanning, which can improve the range of the field of view obtained by stitching the scanned rear fields of view. In some solutions, the light emitting device 100 is applied to a scanning type detection device. The scanning type detection device scans the light beam in the first direction (that is, the scanning direction is the first direction), so as to realize the stitching of the field of view in the first direction, so that the emission field of view is continuous and seamless in both the first direction and the second direction. The light beam scanning can significantly increase the emission field of view and improve the detection performance. As Figure 3 is a schematic diagram of a field of view provided by an embodiment of the present application, Figure 4 is a schematic diagram of the regional stitching of a point cloud provided by an embodiment of the present application. Combining Figure 3 and Figure 4 , the scanning direction is along the short side direction of the line beam, corresponding to the first direction of the light emitting device, that is, the X direction. As Figure 4 shown, when the receiving end of the detection device sequentially receives echoes along the scanning direction, for example, receives echoes at multiple scanning angles, the regions of the obtained point cloud are sequentially stitched along the first direction to obtain the detection result of the entire field of view. Figure 4 The number of scanning angles shown is only for illustration.

[0071] In a possible implementation manner, the edges of the light emitting regions of each row of light emitting chips are relatively close in the first direction. For example, the distance is less than the first distance, in order to further reduce the registration degree during point cloud stitching and improve the effect of point cloud stitching. In some solutions, the first distance is 2 times the distance between the outer edge and the light emitting region of the light emitting chip in the first direction. In other words, along the first direction, the outer edges of two adjacent light emitting units are closely adjacent, so that the distance between the light emitting regions of two adjacent light emitting units in the first direction is twice the distance between the outer edge of the outer edge and the light emitting region. In still other solutions, due to circuit design or crosstalk prevention considerations, the light emitting chips cannot be closely adjacent, but at this time the distance between them will not be set too far. Exemplarily, the first distance is less than 3 times the distance between the outer edge and the light emitting region of the light emitting chip in the first direction. Further, the first distance is less than 2.5 times the distance between the outer edge and the light emitting region of the light emitting chip in the first direction. Still further exemplarily, the first distance is less than the length of the light emitting region in the first direction.

[0072] In a possible implementation manner, one light emitting chip includes one light emitting region, that is, each light emitting region is epitaxially grown on one light emitting chip. Compared with the solution of encapsulating multiple light emitting regions into an entire light emitting chip, setting one light emitting region for each light emitting chip can reduce the thermal load of a single light emitting chip and improve the reliability of the light emitting chip.

[0073] As mentioned above, there is an overlap in the light-emitting regions of the optical emission chips in the second direction. In some solutions, the overlap is uniform. In some other solutions, the overlap is non-uniform. Here, uniform means that the length of the overlap region between any two adjacent rows is the same, while non-uniform means that the length of the overlap region can be different. The following will introduce them respectively by way of example.

[0074] As a solution with uniform overlap, along the second direction, the length of the overlap region between the light-emitting regions of any two adjacent rows of optical emission chips is the same. Please refer to Figure 5 (a) of it. The light-emitting regions of the optical emission chips in the 1st to 4th rows are successively denoted as light-emitting region 11a, light-emitting region 11b, light-emitting region 11c, and light-emitting region 11d. Along the Y direction, the lengths of the overlapping regions of the light-emitting regions of the optical emission chips in the 1st to 4th rows are successively denoted as d1, d2, and d3, where d1, d2, and d3 are the same.

[0075] As a solution with non-uniform overlap, along the second direction, there are at least two groups of optical emission chips whose lengths of the overlap regions of the light-emitting regions are different. One group of optical emission chips includes two adjacent rows of optical emission chips. Please refer to Figure 5 (b) of it. The light-emitting regions of the optical emission chips in the 1st to 4th rows are successively denoted as light-emitting region 11a, light-emitting region 11b, light-emitting region 11c, light-emitting region 11d, and light-emitting region 11e. Along the Y direction, the lengths of the overlapping regions of the light-emitting regions of the optical emission chips in the 1st to 4th rows are successively denoted as d1, d2, d3, and d4. Among them, the optical emission chips in the 1st row and the 2nd row can be regarded as a group of optical emission chips, and the overlap length of their light-emitting regions is d1. The optical emission chips in the 2nd row and the 3rd row can be regarded as another group of optical emission chips, and the overlap length of their light-emitting regions is d2, and d1 is different from d2. Of course, in the case of non-uniform overlap, the lengths of the overlap regions of some groups of optical emission chips may be the same. For example, d2 and d3 can be the same.

[0076] In the above-mentioned solutions, the non-uniform overlap of the light-emitting regions facilitates the flexible design of the energy density distribution of the light beam. As a possible example, by designing the overlap region of the light-emitting regions of the optical emission chips, the overlap region of the light beam in the region of interest (ROI) is made larger. Please refer to Figure 5 (b) of it. Both d2 and d3 are greater than d1 and d4. In this way, along the second direction, the energy density of the central part of the emitted field of view is higher. Since the value of the perception result of the central part of the field of view is higher and it is usually designed as the ROI region, the design of this overlap region can increase the energy density of the light beam in the ROI region, thereby correspondingly improving the detection accuracy of the ROI. Further, in the non-ROI region, the overlap region of the light beam is relatively designed to be smaller to ensure that the field of view of the light beam is not significantly reduced.

[0077] In a possible implementation, among the N rows of light-emitting chips, the emission timings of the light beams emitted by adjacent two rows of light-emitting chips are different. Please refer to Figure 6 , Figure 6 which is a schematic diagram of an emission timing provided by an embodiment of the present application. Among them, the first row of light-emitting chips emits light beams between time period t0 and t1, while the second row emits light beams between time period t2 and t3. Combining Figure 1 it can be seen that since the distance between the first row of light-emitting chips and the second row of light-emitting chips is relatively close, setting them to work at different timings can reduce the mutual crosstalk between them.

[0078] Optionally, for two non-adjacent rows of light-emitting chips, they can be in the working state simultaneously. Combining Figure 6 , the emission timing of the third row of light-emitting chips is the same as that of the first row of light-emitting chips, and the emission timing of the fourth row of light-emitting chips is the same as that of the second row of light-emitting chips. In this way, the detection efficiency can be ensured on the premise of reducing crosstalk.

[0079] In a possible implementation, some or all of the light-emitting chips include multiple sub-regions, and here the multiple can be 2 or more than 2. Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of another light-emitting device provided by an embodiment of the present application. The light-emitting region of each light-emitting chip in the light-emitting device includes two sub-regions, which can be called the first sub-region and the second sub-region for easy distinction. The light-emitting region of the first row of light-emitting chips includes the first sub-region 111a and the second sub-region 112a. The light-emitting region of the second row of light-emitting chips includes the first sub-region 111b and the second sub-region 112b. The light-emitting region of the third row of light-emitting chips includes the first sub-region 111c and the second sub-region 112c. The light-emitting region of the fourth row of light-emitting chips includes the first sub-region 111d and the second sub-region 112d. For the convenience of description below, the sub-regions are sequentially numbered as sub-regions 1, 2, 3, 4, 5, 6, 7, and 8 along the vertical direction (i.e., the negative Y-axis).

[0080] In a possible implementation, the two sub-regions belong to the same light-emitting region, and the two sub-regions are not completely separated in hardware, but share some materials, and their isolation can be carried out on the cathode or the anode. As a schematic diagram of cathode isolation, please refer to Figure 8, the light-emitting region of the light-emitting chip includes a cathode and an anode, and multiple optical material layers or conductive material layers are provided between the cathode and the anode. Taking a light-emitting element in the light-emitting chip, such as a VCSEL, for example, a P-type distributed Bragg reflector (P-DBR), an oxidation layer, a multi quantum well (MQW), a passivation layer, an N-type distributed Bragg reflector (N-DBR), a substrate, etc. can be provided between the cathode and the anode. During isolation, an isolation strip can be provided at the cathode in the light-emitting region. At this time, the two sub-regions of the light-emitting region share the anode. As a schematic illustration of anode isolation, please refer to Figure 9 , an isolation strip can be provided at the anode in the light-emitting region. At this time, the two sub-regions of the light-emitting region share the cathode.

[0081] In yet another possible design, different sub-regions of a light-emitting region can be independently controlled to emit light. On the one hand, working at the granularity of sub-regions can reduce the working current of each light-emitting region and improve reliability. On the other hand, emitting light at the granularity of sub-regions enables the field of view to be staggered more finely, which can improve the point cloud stitching effect.

[0082] In a possible implementation manner, the emission timings of adjacent sub-regions among the multiple sub-regions of the light-emitting region of a light-emitting chip are different. Taking two sub-regions as an example, if the light-emitting region of each light-emitting chip includes two sub-regions, the emission timings of the light beams emitted by the two sub-regions are different. The following lists several possible designs:

[0083] Design 1, the two sub-regions include a first sub-region and a second sub-region arranged along a first direction. The first sub-region and the second sub-region face the two ends of the first direction respectively. The first sub-region of the light-emitting region of N rows of light-emitting chips is used to emit a first light beam in a first time period, and the first sub-region of the light-emitting region of N rows of light-emitting chips is used to emit a first light beam in a second time period. The first time period is different from the second time period. Combining Figure 7 , in each light-emitting region, the sub-region facing the positive direction of the second direction is the first sub-region, that is, sub-regions 1, 3, 5, and 7 are the first sub-regions, and the sub-region facing the negative direction of the second direction is the second sub-region, that is, sub-regions 2, 4, 5, and 8. Please refer to Figure 10 , Figure 10 is one provided by the embodiments of the present application Figure 7Schematic diagram of the emission timings of multiple sub-regions shown. Sub-regions 1, 3, 5, and 7 emit light beams between time periods t0 and t1, while sub-regions 2, 4, 5, and 8 emit light beams between time periods t2 and t3. In this way, the granularity of time-division light emission can be controlled more precisely, reducing the crosstalk between the light-emitting sub-regions while improving the detection accuracy.

[0084] Design 2. The N-row light-emitting chip includes 2×N sub-regions. 2×A sub-regions correspond to at most 2×N emission timings. For each emission timing, at least one sub-region emits light, and two sub-regions belonging to the same light-emitting region do not emit light beams at the same timing.

[0085] Exemplarily, along the second direction, the (3×i + 1)-th sub-region emits light in the first time period, the (3×i + 2)-th sub-region emits light in the second time period, and the (3×i + 3)-th sub-region emits light in the third time period, where i takes integers between. As Figure 11 Another Figure 7 Schematic diagram of the emission timings of multiple sub-regions shown. Sub-regions 1, 4, and 7 emit light beams between time periods t0 and t1, while sub-regions 2, 5, and 8 emit light beams between time periods t2 and t3, and sub-regions 3 and 6 emit light beams between time periods t4 and t5. In this way, the granularity of time-division light emission can be controlled more precisely, reducing the crosstalk between the light-emitting sub-regions while improving the detection accuracy.

[0086] Again exemplarily, along the second direction, the (4×i + 1)-th sub-region emits light in the first time period, the (4×i + 2)-th sub-region emits light in the second time period, the (4×i + 3)-th sub-region emits light in the third time period, and the (4×i + 4)-th sub-region emits light in the third time period, where i takes integers between. As Figure 12 Another Figure 7 Schematic diagram of the emission timings of multiple sub-regions shown. Sub-regions 1 and 5 emit light beams between time periods t0 and t1, while sub-regions 2 and 6 emit light beams between time periods t2 and t3, sub-regions 3 and 7 emit light beams between time periods t4 and t5, and sub-regions 4 and 8 emit light beams between time periods t6 and t7. In this way, the granularity of time-division light emission can be controlled more precisely, reducing the crosstalk between the light-emitting sub-regions while improving the detection accuracy.

[0087] Of course, the present application is also applicable to the case of setting more emission timings. For example, for 8 sub-regions, 8 emission timings can be set, and one sub-region emits one light beam in each time period.

[0088] In a possible implementation, the light-emitting device includes two columns of light-emitting chips, i.e., K = 2. The driving regions of the two columns of light-emitting chips are located on both sides of the light-emitting regions of the two columns of light-emitting chips, and the driving regions of the light-emitting chips are used to drive the light-emitting regions of the light-emitting chips to emit light beams. Please refer to Figure 13 , Figure 13 which is a schematic structural diagram of another light-emitting device provided by an embodiment of the present application. Each light-emitting chip further includes a driving region 13. For the two columns of light-emitting chips, the driving regions of the two columns of light-emitting chips are located on both sides, and the light-emitting regions are located in the middle, so as to reduce the mounting gap in the first direction, which is beneficial to the field of view stitching and point cloud stitching in the first direction.

[0089] In a possible implementation, the light-emitting region of the light-emitting chip includes a plurality of light-emitting points (or light-emitting holes). Please refer to Figure 14 , Figure 14 which is a schematic diagram of the light-emitting points of a light-emitting device provided by an embodiment of the present application. Combining Figure 1 , Figure 13 and Figure 14 , each light-emitting region includes a plurality of light-emitting points (i.e., the black ellipses shown in Figure 14 ). The plurality of light-emitting points are arranged in rows and columns, and the adjacent two columns of light-emitting points are staggered with each other. Staggering the light-emitting holes can reduce the gap between the light-emitting points and improve the energy density of the emitted light beam.

[0090] Optionally, the plurality of light-emitting points in the same light-emitting region can work together. For example, they can be simultaneously driven by a single driving chip to emit light, which can improve the emission power. Further, in the case where a light-emitting region includes a plurality of sub-regions, the plurality of light-emitting points in one sub-region can work together and be simultaneously driven by a single driving chip.

[0091] Optionally, the length of the overlapping region between the light-emitting regions of the adjacent two rows of light-emitting chips is the length of (Q + 0.5) light-emitting points, where Q is an integer and Q ≥ 0. In this way, in the light beam overlapping region, the centers of the light-emitting points are intertwined in the second direction, further improving the energy density of the overlapping region.

[0092] In a possible implementation, the light-emitting chip includes one or more of VCSEL, EEL, PCSEL, or HCSEL, etc. For example, the light-emitting chip includes a plurality of VCSELs, and one VCSEL can be used as Figure 14 a single light-emitting point shown. Again, for example, the light-emitting chip includes a plurality of VCSELs and a plurality of PCSELs.

[0093] In a possible implementation, each column of the K columns of light-emitting chips includes L light-emitting chips. Along the first direction, the centers of the L light-emitting chips in each column of the K columns of light-emitting chips coincide, where L is an integer and L ≥ 1. For example, combiningFigure 1 , each column of the two columns of light-emitting chips includes four light-emitting chips. In the X direction, the centers of the four light-emitting chips in the first column coincide, and the centers of the four light-emitting chips in the second column also coincide.

[0094] In a possible implementation, each column of the K columns of light-emitting chips includes L light-emitting chips. Along the first direction, there are intervals between the centers of the L light-emitting chips in each column of the K columns of light-emitting chips. For example, in combination with Figure 15 , the light-emitting device includes eight rows and two columns of light-emitting chips. Each column of the two columns of light-emitting chips includes four light-emitting chips. In the X direction, there are intervals between the centers of the four light-emitting chips in the first column, and there are also intervals between the centers of the four light-emitting chips in the second column. In the X direction, the driving areas of the two columns of light-emitting chips are still located on both sides of the light-emitting area.

[0095] It should be understood that in some embodiments of the present application, the number of columns is taken as 2 for illustration. In some embodiments, the number of columns of the light-emitting chips can be more. As Figure 16 shown, the light-emitting device can include six rows and three columns of light-emitting chips. In addition, the embodiments of the present application and their possible implementation manners can be combined, and the combined situations are not described one by one here.

[0096] The embodiment of the present application also provides a light source array, and the light source array includes the foregoing light-emitting device, such as Figure 1 , Figure 13 , Figure 15 or Figure 16 and other light-emitting devices described in the embodiments and their possible implementation manners. In some solutions, since a light-emitting device includes N rows and K columns of light-emitting chips, a light-emitting device is also referred to as a group of light-emitting chips.

[0097] In a possible implementation manner, the light source array may include one or more of the foregoing light-emitting devices. For the convenience of description, the number of light-emitting devices included in the light source array is set as M herein, and M is an integer and M≥1.

[0098] In a possible implementation manner, M≥2, and the M light-emitting devices are arranged in sequence along the first direction. Please refer to Figure 17 , Figure 17 is a schematic diagram of a light source array provided by an embodiment of the present application. The light source array includes three light-emitting devices (or three groups of light-emitting chips), and each light-emitting device includes four rows of light-emitting chips. The three light-emitting devices are arranged along the first direction (i.e., Figure 1 the X direction shown).

[0099] In a possible implementation manner, at least two of the light-emitting devices have different powers. In combination withFigure 17 , the transmission power of the first light emitting device is different from the power of the second light emitting device. Furthermore, the M groups of light emitting chips can perform voltage adjustment respectively to control the light emitting chips to output light pulses of different powers. In this way, hardware redundancy can be used to realize large and small transmission functions and improve resolution. For example, some light emitting devices emit high-power pulses for high-precision detection at a long distance, and some light emitting devices emit low-power pulses to detect objects at a close distance. In this way, the combination of long-distance measurement and short-distance measurement can be realized, and the accuracy of the detection results can be improved.

[0100] The multiple possible implementations of the light emitting device described above can also be applied to the light source array. Figure 17 In the embodiment, the edges of the light emitting areas of two adjacent rows of light emitting chips are connected. Figure 17 The embodiment shown can also be combined with one or more of the possible implementations described above. As an example of a combination, Figure 17 In the light source array shown, the first and third rows of each light emitting device emit light beams simultaneously, while the second and fourth rows emit light beams simultaneously at another timing, which can reduce crosstalk between adjacent partitions. For related descriptions, refer to the possible implementations described above.

[0101] The following continues to introduce several light source arrays provided in the embodiments of the present application in combination with the accompanying drawings.

[0102] See also Figure 18 , Figure 18 This is a schematic diagram of another light source array provided in an embodiment of the present application, wherein the light source array includes three groups of light emitting chips, the three groups of light emitting chips are arranged along a first direction, each group of light emitting chips includes four rows of light emitting chips, wherein the light emitting areas of two adjacent rows of light emitting chips overlap, and the overlap is uniform or non-uniform.

[0103] See also Figure 19 , Figure 19 It is a schematic diagram of another light source array provided in an embodiment of the present application, the light source array includes 2 groups of light emitting chips, the 2 groups of light emitting chips are arranged along a first direction, each group of light emitting chips includes 8 rows of light emitting chips, wherein the light emitting areas of two adjacent rows of light emitting chips overlap, and the overlap is uniform or non-uniform.

[0104] See also Figure 20 , Figure 20FIG. 0 is a schematic diagram of another light source array provided by an embodiment of the present application. The light source array includes two groups of light emitting chips. The two groups of light emitting chips are arranged along a first direction. Each group of light emitting chips includes eight rows of light emitting chips. The edges of the light emitting regions of adjacent two rows of light emitting chips are in contact. Each light emitting chip includes a first sub-region and a second sub-region. The first sub-region and the second sub-region are arranged along a second direction. When emitting a light beam, the emission timings of the two sub-regions in each light emitting region are different. For relevant descriptions, please refer to Figures 10 to 12 for relevant descriptions.

[0105] Please refer to Figure 21 , Figure 21 FIG. 9 is a schematic diagram of another light source array provided by an embodiment of the present application. The light source array includes two groups of light emitting chips. The two groups of light emitting chips are arranged along a first direction. Each group of light emitting chips includes eight rows of light emitting chips. There is an overlap between the light emitting regions of adjacent two rows of light emitting chips, and the overlap is uniform or non-uniform. Each light emitting chip includes a first sub-region and a second sub-region. The first sub-region and the second sub-region are arranged along a second direction. When emitting a light beam, the emission timings of the two sub-regions in each light emitting region are different. For relevant descriptions, please refer to Figures 10 to 12 for relevant descriptions.

[0106] It should be understood that the above Figures 17 - 21 takes M groups of light emitting arrays as light emitting devices with the same arrangement as an example. In a specific implementation, the arrangement modes of multiple light emitting devices included in the light source array may be different. For example, for a light source array including two light emitting devices, the arrangement mode of the first light emitting device is as shown in Figure 13 , and the second light emitting device is as shown in Figure 15 .

[0107] An embodiment of the present application further provides a detection device. With reference to Figure 22 , the detection device 200 includes a transmitting module 21 and a receiving module 22. The transmitting module 21 is used to emit detection light, and the receiving module 22 is used to receive the echo of the detection light. Among them, the transmitting module includes the aforementioned light emitting device or light source array.

[0108] In a possible implementation, the receiving module includes a detector. Further, the detector includes one or more of the following detection units: single-photon avalanche diode (SPAD), Silicon photomultiplier (SiPM), multi-pixel photon counter (MPPC), avalanche photo detector (APD), or positive-intrinsic-negative (PIN) diode (or P-type semiconductor - impurity - N-type semiconductor diode), etc. When the detector includes multiple detection units, the multiple detection units can be arranged in an array to form an array detector. For example, the receiving module includes a SPAD array detector.

[0109] In a possible implementation, the detection device 200 further includes a transmitting optical system, and the transmitting optical system includes one or more optical elements, including one or more of optical elements such as lenses, meta-lenses, mirrors, filters, cloud light sheets, polarizers, or wave plates. Further optionally, the transmitting optical system can be integrated in the transmitting module 21.

[0110] In a possible implementation, the receiving module may further include a receiving optical system, including one or more of optical elements such as lenses, meta-lenses, mirrors, filters, cloud light sheets, polarizers, or wave plates. Further optionally, the receiving optical system can be integrated in the receiving module 22.

[0111] In a possible implementation, when the detection device 200 includes multiple light-emitting devices, the receiving module 21 of the detection device 200 may include P detectors, and each detector is respectively used to receive the echo of the light beam emitted by one or more light-emitting devices, where P is a positive number and P≥2.

[0112] Exemplarily, the transmitting module 21 of the detection device includes a Figure 19 light source array as shown. The light source array includes 2 light-emitting devices. At this time, the receiving module 22 may include two SPAD array detectors, and each SPAD array detector is used to receive the echo of the detection light emitted by one light-emitting device. Optionally, the two SPADs can share a receiving optical system, or they can also use a set of receiving optical systems respectively.

[0113] In a possible implementation, the detector includes a plurality of photosensitive regions, and each photosensitive region is configured to receive the echo of the light beam emitted by a light-emitting region in a light-emitting device. Further, each of the P array detectors includes one or more photosensitive regions, and each photosensitive region corresponds to a light-emitting region of a light-emitting chip in a light-emitting device.

[0114] As shown in Figure 23 (a) thereof, the detector includes a plurality of detection units arranged in an array, and each photosensitive region includes some of the detection units among the plurality of detection units, and the detection units of the photosensitive region are in an operating state. As shown in Figure 23 (b) thereof, the spot of the echo of the light beam emitted by the light source array can fall into the photosensitive region of the detector, and each photosensitive region can receive the echo of the light beam emitted by a light-emitting region. It should be understood that Figure 23 the size of the photosensitive region and the number of detection units included shown are only examples, and there may be other designs in the specific implementation.

[0115] In a possible implementation manner, the detection device 200 further includes a scanning module. The scanning module is configured to scan the detection light emitted by the emission module 21 to the detection area, and provide the light beam (including the echo) from the detection area to the receiving module 22. Further, the scanning module includes one or more of a galvanometer mirror, a polygon mirror, a micro-electro-mechanical system (MEMS) galvanometer mirror, or a metal galvanometer mirror, etc. In some solutions, the scanning module may include one or more reflecting surfaces, and the reflecting surfaces may be mounted on the main body of the scanning module in the form of patches, or the reflecting surface of the scanning module and the body of the scanning module may also be integrated. Optionally, the scanning method of the scanning module may be one-dimensional scanning, two-dimensional scanning, etc.

[0116] This application also provides a lidar, which includes the foregoing light-emitting device, or includes the foregoing light source array, or includes the foregoing detection device.

[0117] The embodiment of this application also provides a terminal, which includes the foregoing light-emitting device, or includes the foregoing light source array, or includes the foregoing detection device, or includes the foregoing lidar.

[0118] Optionally, the terminal may be an intelligent terminal or a transportation vehicle such as a vehicle, a drone, a robot, etc., or the terminal may also be an industrial device. It should be understood that the terminals involved in this application may include intelligent terminals or transportation vehicles such as vehicles, robots, drones, or ships. Among them, the vehicle is a vehicle in a broad sense, and can be a transportation vehicle (such as a commercial vehicle, a passenger vehicle, a motorcycle, a flying car, a train, etc.), an industrial vehicle (such as a forklift, a trailer, a tractor, etc.), an engineering vehicle (such as an excavator, a bulldozer, a crane, etc.), an agricultural device (such as a lawn mower, a harvester, etc.). Again, the robot may be an automated guided vehicle (AGV), a walking conversation robot, a service robot, or other robots. Industrial devices such as industrial robots, robotic arms, etc. Leisure and entertainment devices such as virtual reality (VR) devices, mixed reality (MR) devices, or 4D cinema cockpits, etc.

[0119] Optionally, there are various possible implementations for the installation position of the detection device. For example, it can be installed on the platform of the vehicle's dashboard, or on the top of the cockpit, or it can also be installed on one or more parts of the vehicle head, vehicle side, or vehicle tail, etc.

[0120] In the description of this application, the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", "side", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application. It should be understood that in some embodiments of this application, the Z direction, Y direction, X direction, etc. mentioned are based on the XYZ rectangular coordinate system as a reference to facilitate the description of the features in this solution, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0121] In the embodiments of this application, words such as "exemplarily" or "for example" are used to represent examples, illustrations, or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in this application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, the use of words such as "exemplarily" or "for example" is intended to present relevant concepts in a specific manner.

[0122] In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "At least one of the following" or a similar expression means any combination of these items, including any combination of single item(s) or plural item(s). For example, at least one of a, b, or c can represent: a, b, c, (a and b), (a and c), (b and c), or (a and b and c), where a, b, and c can be single or multiple. "And / or" describes the association relationship of associated objects and indicates that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Here, A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0123] In addition, unless otherwise stated, the ordinal numbers such as "first" and "second" in the embodiments of the present application are used to distinguish multiple objects and are not used to limit the order, time sequence, priority, or importance of multiple objects. For another example, the first sub-region and the second sub-region are only used to describe different sub-regions in a certain implementation manner and do not indicate differences in aspects such as the importance, structure, or material of the sub-regions.

Claims

1. An optical emission device, characterized in that, The light emitting device includes N rows and K columns of light emitting chips, where N and K are both integers, and N≥2, K≥2. Along the first direction, the light emitting regions of the K columns of light emitting chips are arranged in sequence, and there is a gap between two adjacent columns of light emitting chips. Along the second direction, the N rows of light emitting chips are arranged in sequence, and the edges of the light emitting regions of two adjacent rows of light emitting chips are in contact or partially overlapped. Wherein, the first direction is different from the second direction.

2. The optical emission device according to claim 1, characterized in that, The N rows of light emitting chips are used to emit N line light spots, and the angular space edges of the N line light spots are in contact or edge-overlapped in the second direction.

3. The light emitting device according to claim 1 or 2, characterized in that, The light emitting regions of two adjacent rows of light emitting chips partially overlap; Along the second direction, the lengths of the overlapping regions of the light emitting regions of any two adjacent rows of light emitting chips are the same. Or, along the second direction, there are at least two groups of light emitting chips with different lengths of overlapping regions of the light emitting regions, and one group of light emitting chips includes two adjacent rows of light emitting chips.

4. The optical emission device according to any one of claims 1 to 3, characterized in that, Among the N rows of light emitting chips, the emission timings of the light beams emitted by two adjacent rows of light emitting chips are different.

5. The optical emission device according to any one of claims 1 to 4, characterized in that, The light emitting region of each light emitting chip includes two sub-regions, and the emission timings of the light beams emitted by the two sub-regions are different.

6. The optical emission device according to claim 5, characterized in that, The two sub-regions include a first sub-region and a second sub-region arranged along the first direction, and the first sub-region and the second sub-region face the two ends of the first direction respectively. The first sub-regions of the light emitting regions of the N rows of light emitting chips are used to emit the first light beam in the first time period, and the first sub-regions of the light emitting regions of the N rows of light emitting chips are used to emit the first light beam in the second time period, and the first time period is different from the second time period.

7. The light emitting device according to claim 5, characterized in that, The N rows of light emitting chips include 2×N sub-regions, and the 2×A sub-regions correspond to at most 2×N emission timings. There is at least one sub-region emitting light at each emission timing, and the two sub-regions belonging to the same light emitting region do not emit light beams at the same timing.

8. The optical emission device according to claim 7, characterized in that, In the second direction, the (3×i + 1)-th sub-region emits light in the first time period, the (3×i + 2)-th sub-region emits light in the second time period, and the (3×i + 3)-th sub-region emits light in the third time period, where i takes integers between.

9. The optical emission device according to any one of claims 5-8, characterized in that, The two sub-regions of the light emitting region of each light emitting chip are cathode-isolated or anode-isolated.

10. The optical emission device according to any one of claims 1-9, characterized in that, K = 2, and the driving regions of the K columns of light emitting chips are located on both sides of the light emitting regions of the K columns of light emitting chips. The driving regions of the light emitting chips are used to drive the light emitting regions of the light emitting chips to emit light beams.

11. The optical emission device according to any one of claims 1-10, characterized in that, The light emitting region of the light emitting chip includes a plurality of light emitting points, and the plurality of light emitting points are arranged in rows and columns, and the adjacent two columns of light emitting points are staggered with each other.

12. The optical emission device according to any one of claims 1-11, characterized in that, The light emitting chip includes one or more of a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a photonic crystal surface emitting laser (PCSEL), or a horizontal cavity surface emitting laser (HCSEL).

13. The optical emission device according to any one of claims 1 to 12, characterized in that, Each column of the K columns of light emitting chips includes L light emitting chips, where L is an integer and L≥1. Along the first direction, the centers of the L light emitting chips in each column of the K columns of light emitting chips coincide.

14. The optical emission device according to any one of claims 1 to 12, characterized in that, Each column of the K columns of light emitting chips includes L light emitting chips, where L is an integer and L≥1. Along the first direction, there is a gap between the centers of the L light emitting chips in each column of the K columns of light emitting chips.

15. A light source array, characterized in that, The light source array includes M light emitting devices as described in any one of claims 1-14, where M is an integer and M≥1.

16. The light source array according to claim 15, characterized in that, M≥2, and the M light emitting devices are arranged in sequence along the first direction.

17. The light source array according to claim 15 or 16, characterized in that, There are at least two light emitting devices with different powers.

18. A detection device, characterized in that, The detection device includes a transmitting module and a receiving module. The transmitting module includes M light emitting devices as described in any one of claims 1-14, or includes a light source array as described in any one of claims 15-17, where M is an integer and M≥1; The transmitting module is used to emit detection light, and the receiving module is used to receive the echo of the detection light.

19. The detection device according to claim 18, characterized in that, M≥2， The receiving module includes P array detectors, and the P array detectors are respectively used to receive the echo of the detection light emitted by one or more light emitting devices, where P is a positive number and P≥2.

20. The detection device according to claim 19, characterized in that, Each of the P array detectors includes a plurality of photosensitive regions, and each photosensitive region in the plurality of photosensitive regions corresponds to the light emitting region of a light emitting chip in a light emitting device.

21. A lidar, characterized in that, The lidar includes a detection device as described in any one of claims 18-20.

22. A terminal, characterized in that, The terminal includes a light emitting device as described in any one of claims 1-14, or includes a light source array as described in any one of claims 15-17, or includes a detection device as described in any one of claims 18-20, or includes the lidar as described in claim 21.

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