A chip capacitor termination production line based on thick rubber board

Abstract

The present invention discloses a chip capacitor termination production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, a discharge mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling storage mechanism and a discharge mechanism are provided in sequence; the assembly mechanism is used to place the lead-in plate on top of the thick rubber plate and form an assembly. The chip capacitor termination production line based on a thick rubber plate proposed in this scheme realizes the fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency and the termination accuracy of the chip capacitor, and is conducive to reducing the labor cost in the termination process.

Description

Technical Field

[0001] The present invention relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor termination production line based on a thick rubber plate. Background Art

[0002] In current technology, the fully automatic sealing machine / production line of chip capacitors generally uses a mesh as a carrier for transporting chip capacitors. Specifically, see the Chinese utility model patent with announcement number CN218849426U. During the sealing process, it is necessary to first stick a film on one side of the mesh so that one end of the mesh of the mesh is sealed with the film. After the film is sticky and flat, the chip capacitors are implanted into the mesh, and hundreds of miniature chip capacitors are adhered to the mesh through the film so that they will not fall off. Then, the other end of the chip capacitor that is not adhered to the film is dipped and sealed. During the above-mentioned implantation process, the ends of the pasted ends of the chip capacitors will be aligned under the action of the film, but because the chip capacitors themselves may have production tolerances (such as different lengths), the ends of the chip capacitors to be sealed on the same mesh after implantation are difficult to be flush with each other, resulting in poor consistency of the slurry dipping of the chip capacitors, which greatly affects the sealing quality of the chip capacitors.

[0003] Therefore, to ensure the quality of chip capacitor termination, some manufacturers have begun using thick rubber sheets instead of stencils as a transport carrier for chip capacitors. The thick rubber sheet is used to secure the chip capacitors via silicone clamping. Therefore, to successfully implant the chip capacitors into the holes of the thick rubber sheet, a guide plate must be placed on top of the thick rubber sheet. The chip capacitors are first implanted into the guide holes of the guide plate using vibration, and then the needle bed is used to press the chip capacitors located on the guide plate into the holes of the thick rubber sheet, thus completing the implantation process of the chip capacitors in the thick rubber sheet.

[0004] Due to the heavy weight of the thick rubber plate, manual intervention is required to a greater or lesser extent throughout the entire termination process of the chip capacitors, which greatly increases the labor cost of the termination process. In addition, excessive manual intervention is not conducive to improving the termination efficiency and accuracy of the chip capacitors. Summary of the Invention

[0005] The purpose of the present invention is to propose a chip capacitor termination production line based on thick rubber plates, which can realize fully automatic operation of the chip capacitor termination process, effectively improve the termination efficiency of the chip capacitors and improve the termination accuracy of the chip capacitors, while helping to reduce the labor cost in the termination process, so as to overcome the shortcomings of the existing technology.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A chip capacitor termination production line based on thick rubber plates, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling and material storage mechanism, a plate changing mechanism, a unloading mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling and material storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, one slurry dipping mechanism, one drying mechanism, one cooling and material storage mechanism, the plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling and material storage mechanism and the unloading mechanism are provided in sequence; the assembly mechanism is used to place an inlet plate on top of the thick rubber plate and form an assembly; a plurality of transfer clamps are provided, and the transfer clamps are used to clamp and move the thick rubber plate.

[0008] Preferably, the assembly mechanism includes a thick rubber plate storage rack, an import plate storage rack and a plate taking device; the thick rubber plate storage rack is used to store thick rubber plates, the import plate storage rack is used to store import plates, and the plate taking device is used to move the import plates.

[0009] Preferably, the implantation mechanism includes a mounting base, a mounting seat, an implantation device, an implantation delivery device and a motor vibration device; the mounting seat is mounted on the top of the mounting base, and the top center of the mounting base is rotatably connected to the bottom center of the mounting seat through a bearing seat, and the mounting seat swings relative to the mounting base; the implantation device and the implantation delivery device are both mounted above the mounting seat, and the implantation delivery device is located inside the implantation device; the implantation delivery device is used to deliver the assembly to the implantation device, and the delivery direction of the implantation delivery device is parallel to the swing direction of the mounting seat; the motor vibration device is mounted on the bottom of the mounting seat, and the output end of the motor vibration device is parallel to the swing direction of the mounting seat The implant device is connected, and the motor vibration device is used to drive the implant device to vibrate relative to the mounting seat; the implant device includes an implant base, an implant top plate and an implant frame that are arranged in sequence from bottom to top, the implant base and the implant frame are connected by a vertically extending support column, the implant top plate can be movably arranged up and down between the implant base and the implant frame, and the conveying surface of the implant conveying device is located above the implant top plate; the bottom of the implant frame includes a holding position and an avoidance position, and the holding position and the avoidance position are connected in sequence along a direction perpendicular to the conveying direction of the implant conveying device; the holding position is used to hold the chip capacitor to be implanted, and the implant top plate is used to offset the lead-in plate to be implanted with the avoidance position.

[0010] Preferably, the pressing mechanism includes a detection and conveying device, a first cleaning device, a detection device, a pressing and conveying device and a needle bed pressing device; the detection and conveying device and the pressing and conveying device are connected end to end in sequence, and the pressing and conveying device moves up and down relative to the detection and conveying device, and the needle bed pressing device is located inside the pressing and conveying device; the first cleaning device and the detection device are arranged on the detection and conveying device in sequence along the conveying direction of the detection and conveying device, and the detection and conveying device is used to convey the assembly, the first cleaning device is used to clean the upper surface of the assembly, and the detection device is used to detect whether there is foreign matter on the upper surface of the assembly placed on the detection and conveying device; the needle bed pressing device includes an upper platform and a lower platform arranged opposite to each other in the vertical direction, and the upper platform is located above the lower platform, the upper platform moves up and down relative to the lower platform, and the holding surface of the lower platform is located within the up and down movement range of the pressing and conveying device, and the upper platform is used to press the chip capacitor located in the introduction board in the assembly into the board hole of the thick rubber plate.

[0011] Preferably, the leveling mechanism includes a leveling conveyor device, a jacking platform, a feeding belt, a turning device, an introduction plate recovery device and a leveling device; the leveling conveyor device includes a conveyor frame and a conveyor tray, the conveyor tray is horizontally movably installed on the top of the conveyor frame, and the conveyor tray is used to hold thick rubber sheets; the jacking platform, the feeding belt, the turning device and the introduction plate recovery device are sequentially arranged at the feeding end of the conveyor frame from bottom to top, and the jacking platform and the feeding belt are both located at the inner bottom of the conveyor frame, and the turning device and the introduction plate recovery device are both arranged on the top of the conveyor frame; the jacking platform The lifting platform can move up and down relative to the feeding belt and the turning device, and the lifting platform can pass through the feeding belt and the conveying surface of the leveling conveyor device; the conveying pallet is U-shaped, and an avoidance opening is opened in the middle of the conveying pallet, and the avoidance opening is used to avoid the lifting platform; the leveling device is located on the front side of the turning device, and the leveling device includes a leveling clamp and a leveling platform arranged opposite to each other in the vertical direction, the leveling clamp is located above the conveyor frame, and the leveling clamp can move up and down relative to the conveyor frame, the leveling platform is located below the conveyor frame, and the leveling clamp is used to clamp the thick rubber plate.

[0012] Preferably, the immersion mechanism includes a immersion device, a transfer conveyor platform, a transfer clamp, a pre-drying device, a pre-cooling device, a unloading conveyor platform and a feeding clamp; the transfer conveyor platform, the pre-drying device, the pre-cooling device and the unloading conveyor platform are connected end to end in sequence, and the transfer conveyor platform moves up and down relative to the pre-drying device, and the unloading conveyor platform moves up and down relative to the pre-cooling device; the immersion device is provided with at least two groups, and the loading ends of all the immersion devices and the unloading conveyor platform are located within the moving range of the feeding clamp, and the feeding clamp is used to realize the transfer of thick rubber plates between the loading end of the immersion device and the unloading conveyor platform; the unloading ends of all the immersion devices and the transfer conveyor platform are located within the moving range of the transfer clamp, and the transfer clamp is used to realize the transfer of thick rubber plates between the unloading end of the immersion device and the transfer conveyor platform.

[0013] Preferably, the slurry impregnation device includes a mounting frame, a slurry disc, a slurry spreading assembly, a slurry impregnation fixture and a loading tray; the mounting frame includes a support seat and a conveying bracket; the support seat is mounted above the slurry disc, and the slurry disc moves horizontally relative to the support seat; the conveying bracket is horizontally extended and mounted on the support seat, and the extension direction of the conveying bracket is parallel to the movement direction of the slurry disc, and the conveying bracket is located above the slurry disc; the slurry spreading assembly is mounted on one side of the support seat, and the slurry spreading assembly is located on the top of the slurry disc; the slurry spreading assembly moves up and down relative to the slurry disc, and the slurry spreading assembly is used to lay a slurry layer on the top of the slurry disc; the loading tray is horizontally movably mounted on the conveying bracket; the slurry impregnation fixture is movably mounted up and down on the support seat, and the upper limit of movement of the slurry impregnation fixture is located above the conveying bracket, and the lower limit of movement of the slurry impregnation fixture is located above the slurry disc.

[0014] Preferably, the cooling storage mechanism includes a cooling hood, a lifting device, a cold air delivery head and a circulating fan; the bottom and top of the cooling hood are both provided with openings, the lifting device is arranged inside the cooling hood, and the inlet of the lifting device protrudes from the bottom of the cooling hood, and the lifting device is used to transport the thick rubber plate upward in the vertical direction; the cold air delivery head and the cooling hood are interconnected, and the air inlet end of the cold air delivery head is connected to the cold air source; the circulating fan is installed between the cooling hood and the lifting device, and the circulating fan is located below the cold air delivery head.

[0015] Preferably, the plate changing mechanism includes a needle bed conveying device, a separation frame clamping device, a new plate clamping device, a new plate conveying device and a flattening device; the needle bed conveying device includes a first conveying track and a transfer platform, and the transfer platform is horizontally movably installed on the first conveying track; the transfer platform includes a platform mounting seat and a mesh plate for placing a thick rubber plate, and the mesh plate is installed above the platform mounting seat by spring expansion and contraction; a plurality of ejectors are protruding from the upper surface of the platform mounting seat, and a plurality of mesh holes are opened on the plate surface of the mesh plate, and one ejector corresponds to one mesh hole, and the mesh hole is used for the ejector to pass through the mesh plate; the separation frame clamping device and the new plate clamping device are successively erected above the end of the first conveying track along the conveying direction of the transfer platform, the separation frame clamping device is used to clamp the separation frame, and the new plate clamping device is used to clamp the empty thick rubber plate The loader is installed on both sides of the second conveying track, and the loading end of the second conveying track and the end of the first conveying track are arranged in sequence from top to bottom below the clamp of the new plate clamping device, and the clamp of the new plate clamping device can pass through the conveying surface of the second conveying track; the flattening device is arranged at the end of the second conveying track, and the flattening device includes a flattening clamp and a flattening platform arranged opposite to each other in the vertical direction, the flattening clamp is located above the second conveying track, and the flattening clamp can move up and down relative to the second conveying track, the flattening clamp is used to clamp the thick rubber plate, and the flattening platform is located below the second conveying track.

[0016] Preferably, the unloading mechanism includes a unloading conveying device, a needle bed unloading device, a loading conveying device, a full material conveying device, an empty material box storage rack, a full material box storage rack and a material box moving device; the unloading conveying device includes a unloading conveying frame and a unloading platform, the unloading platform is horizontally movably installed on the top of the unloading conveying frame, and the unloading platform is used to hold the thick rubber plate to be unloaded; a unloading port is provided at the bottom of the unloading platform, and a unloading notch is provided in the middle of the unloading conveying frame, and the unloading port and the unloading notch match each other; the needle bed unloading device is mounted above the unloading conveying frame, and the loading conveying device is arranged below the unloading conveying frame, and the needle bed unloading device, the unloading notch and the loading conveying device The unloading ends are arranged in sequence from top to bottom; the needle bed unloading device moves up and down relative to the unloading conveying frame, and the needle bed unloading device is used to press the chip capacitor away from the thick rubber plate; the loading conveying device and the full conveying device are arranged in parallel, and the empty box storage rack, the disc changing end of the loading conveying device and the loading end of the full conveying device are arranged in sequence within the transfer range of the box moving device, and the unloading end of the full conveying device is connected to the full box storage rack; the empty box storage rack is used to store multiple stacked boxes, the loading conveying device and the full conveying device are both used to convey boxes, and the full conveying device is also used to convey boxes to the full box storage rack, and the box moving device is used to transfer boxes.

[0017] The technical solution provided by the present invention may include the following beneficial effects: This solution proposes a chip capacitor termination production line based on thick rubber plates, which realizes fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency of the chip capacitor and improve the termination accuracy of the chip capacitor, and at the same time is conducive to reducing the labor cost in the termination process to overcome the shortcomings of the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a chip capacitor termination production line based on thick rubber plate of the present invention. Figure 2 It is a structural schematic diagram of the introduction plate and the thick rubber plate in the present invention. Figure 3 It is a structural schematic diagram of the implantation mechanism of the present invention from one perspective. Figure 4 It is a structural schematic diagram of the implant mechanism of the present invention from another perspective. Figure 5 It is a side view of the implant mechanism of the present invention. Figure 6 It is a partial structural diagram of the implantation mechanism in the present invention. Figure 7 It is a schematic diagram of the working state of the implantation mechanism in the present invention. Figure 8 It is a side view of the press-in mechanism of the present invention. Figure 9 It is a structural schematic diagram of the pressing mechanism in the present invention. Figure 10It is a partial structural diagram of the pressing mechanism in the present invention. Figure 11 It is a partial structural diagram of the pressing mechanism in the present invention. Figure 12 It is a side view of the leveling mechanism of the present invention. Figure 13 It is a structural schematic diagram of the leveling mechanism in the present invention from one perspective. Figure 14 It is a structural schematic diagram of the leveling mechanism in the present invention from another perspective. Figure 15 It is a partial structural diagram of the leveling mechanism in the present invention. Figure 16 It is a top view of the slurry dipping mechanism in the present invention. Figure 17 It is a partial structural diagram of the slurry dipping mechanism in the present invention from one perspective. Figure 18 It is a partial structural schematic diagram of the slurry dipping mechanism in the present invention from another perspective. Figure 19 It is a partial structural diagram of the slurry dipping mechanism in the present invention. Figure 20 It is a structural schematic diagram of the cooling storage mechanism of the present invention from one perspective. Figure 21 It is a structural schematic diagram of the cooling storage mechanism of the present invention from another perspective. Figure 22 It is a partial structural diagram of the cooling storage mechanism in the present invention. Figure 23 It is a schematic diagram of the gas flow direction of the cooling storage mechanism in the present invention. Figure 24 It is a partial structural diagram of the cooling storage mechanism in the present invention. Figure 25 It is a structural schematic diagram of the plate changing mechanism in the present invention from one perspective. Figure 26 It is a structural schematic diagram of the plate changing mechanism in the present invention from another perspective. Figure 27 It is a partial structural diagram of the plate changing mechanism in the present invention. Figure 28 It is a partial structural diagram of the plate changing mechanism in the present invention. Figure 29 It is a structural schematic diagram of the flattening device in the present invention. Figure 30 It is a schematic diagram of the plate changing mechanism of the present invention. Figure 31 It is a structural schematic diagram of the unloading mechanism in the present invention. Figure 32 It is a partial structural diagram of the unloading mechanism in the present invention. Figure 33 It is a partial structural diagram of the unloading mechanism in the present invention. Figure 34 It is a partial structural diagram of the unloading mechanism in the present invention. Figure 35 It is a partial structural diagram of the unloading mechanism in the present invention. DETAILED DESCRIPTION

[0019] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0020] This technical solution provides a chip capacitor termination production line based on thick rubber plates, including an assembly mechanism, an implantation mechanism 2, a pressing mechanism 3, a leveling mechanism 4, a slurry dipping mechanism 5, a drying mechanism, a cooling and storage mechanism 6, a plate changing mechanism 7, a discharge mechanism 8, and a transfer clamp;

[0021] The immersion mechanism 5, the drying mechanism and the cooling storage mechanism 6 are each provided with two, and the assembling mechanism, the implanting mechanism 2, the pressing mechanism 3, the leveling mechanism 4, one immersion mechanism 5, one drying mechanism, one cooling storage mechanism 6, the plate changing mechanism 7, another immersion mechanism 5, another drying mechanism, another cooling storage mechanism 6 and the unloading mechanism 8 are provided in sequence;

[0022] The assembly mechanism is used to place the introduction plate 92 on top of the thick rubber plate 93 to form an assembly;

[0023] There are multiple transfer clamps, and the transfer clamps are used to clamp and move the thick rubber plate 93.

[0024] In order to realize the fully automatic operation of the chip capacitor termination process using thick rubber plate as a carrier, thereby improving the termination efficiency and accuracy of the chip capacitor and reducing the labor cost in the termination process, this technical solution proposes a chip capacitor termination production line based on thick rubber plate, such as Figure 1 As shown, it includes an assembling mechanism (not shown in the figure) for placing the introduction plate 92 on the top of the thick rubber plate 93 and forming an assembly, an implanting mechanism 2 for implanting the chip capacitor to be sealed into the introduction plate 92, a pressing mechanism 3 for pressing the chip capacitor located on the introduction plate 92 into the thick rubber plate 93, a leveling mechanism 4 for achieving the flushness of the end (i.e., the first end) of the chip capacitor, a dipping mechanism 5 for dipping the first end of the chip capacitor located on the thick rubber plate 93, a drying mechanism (not shown in the figure), a cooling storage mechanism 6, a plate changing mechanism 7 for replacing the chip capacitor from the old thick rubber plate 93 to the new thick rubber plate 93, and making the unsealed second end of the chip capacitor protrude from the new thick rubber plate 93, a unloading mechanism 8 for unloading the sealed chip capacitor from the thick rubber plate 93, and a transport clamp (not shown in the figure) for transporting the thick rubber plate 93 or the assembly formed by the thick rubber plate 93 and the introduction plate 92 between the above-mentioned mechanisms. Through the setting of the above-mentioned mechanisms, this solution can realize the fully automatic operation of the chip capacitor termination process using thick rubber plates as carriers, which can effectively improve the termination efficiency and termination accuracy of the chip capacitors, and at the same time help reduce the labor cost in the termination process.

[0025] Specifically, the assembly mechanism, implantation mechanism 2, pressing mechanism 3, leveling mechanism 4, a slurry dipping mechanism 5, a drying mechanism, a cooling storage mechanism 6, a plate changing mechanism 7, another slurry dipping mechanism 5, another drying mechanism, another cooling storage mechanism 6 and unloading mechanism 8 of this scheme are arranged in sequence along the unloading direction of the chip capacitor 91, so that the chip capacitor termination production line in this scheme includes the following work flow: (1) using the assembly mechanism to place the introduction plate 92 on the top of the thick rubber plate 93 and form an assembly, and then using the transport clamp to clamp the thick rubber plate 93 and transfer the assembly to the loading end of the implantation mechanism 2; (2) using the implantation mechanism 2 to implant the chip capacitor to be terminated into the introduction plate 92, and then using the transport clamp to clamp the thick rubber plate 93 and transfer the implanted assembly to the loading end of the pressing mechanism 3; (3) using the pressing mechanism 3 to press the chip capacitor located on the introduction plate 92 into the thick rubber plate 93, and then using the leveling mechanism 4 to make the protruding portion on the thick rubber plate The first end of the chip capacitor 93 is flush with the first end of the chip capacitor, and the thick rubber plate 93 is clamped by the transport clamp and transferred to the feeding end of the slurry dipping mechanism 5; (4) the thick rubber plate 93 with the chip capacitor implanted is sequentially entered into the first group of slurry dipping mechanisms 5, drying mechanisms and cooling storage mechanisms 6, thereby completing the sealing of the first end of the chip capacitor; (5) the chip capacitor is replaced from the old thick rubber plate 93 to the new thick rubber plate 93 by the plate changing mechanism 7, and the second end of the chip capacitor is made to protrude from the A new thick rubber plate 93 is produced, and the new thick rubber plate 93 is clamped by the transfer clamp and transferred to the loading end of the dipping mechanism 5; (6) the new thick rubber plate 93 with the chip capacitor implanted therein is sequentially fed into the second group of dipping mechanisms 5, drying mechanisms and cooling storage mechanisms 6, thereby completing the sealing of the second end of the chip capacitor; (7) the chip capacitor with the sealed end is removed from the thick rubber plate 93 by the unloading mechanism 8, and the chip capacitor with both ends having been sealed is obtained.

[0026] It should be noted that the drying mechanism and transfer clamps of this solution are commonly used in this field, and their specific structures are not described in detail here. Specifically, the drying mechanism of this solution can use the Chinese utility model patent with announcement number CN221197945U "A Drying Device for Chip Capacitor Termination", which is not limited here.

[0027] It should be further explained that, in order to ensure the assembly and movement stability of the introduction plate 92 and the thick rubber plate 93, a positioning block (not shown in the figure) is generally provided on the lower surface of the introduction plate 92, and a positioning groove that matches the positioning block is provided on the upper surface of the thick rubber plate 93, such as Figure 2 As shown, after assembly, the introduction holes of the introduction plate 92 correspond one to one with the plate holes of the thick rubber plate 93.

[0028] To further illustrate, the assembly mechanism includes a thick rubber plate storage rack, an introduction plate storage rack 1 and a plate taking device;

[0029] The thick rubber plate storage rack is used to store thick rubber plates 93 , the inlet plate storage rack 1 is used to store inlet plates 92 , and the plate taking device is used to move the inlet plates 92 .

[0030] In a preferred embodiment of the present technical solution, the assembly mechanism includes a thick rubber plate storage rack (not shown in the figure), an inlet plate storage rack 1 and a plate taking device (not shown in the figure). By moving the inlet plate 92 located in the inlet plate storage rack 1 to above the thick rubber plate located in the thick rubber plate storage rack, the two can be easily assembled.

[0031] It should be noted that the plate-removing device of the present solution may be a conventional structure such as a suction cup, a clamping claw, etc. commonly used in the art, and its specific structure will not be described in detail here.

[0032] To further illustrate, the implant mechanism 2 includes a mounting base 21, a mounting seat 22, an implant device 23, an implant delivery device 24, and a motor vibration device 25;

[0033] The mounting seat 22 is mounted on the top of the mounting base 21, and the top center of the mounting base 21 is rotatably connected to the bottom center of the mounting seat 22 via a bearing seat, so that the mounting seat 22 swings relative to the mounting base 21;

[0034] The implantation device 23 and the implantation delivery device 24 are both mounted above the mounting seat 22, and the implantation delivery device 24 is located inside the implantation device 23; the implantation delivery device 24 is used to deliver the assembly to the implantation device 23, and the delivery direction of the implantation delivery device 24 is parallel to the swing direction of the mounting seat 22;

[0035] The motor vibration device 25 is installed at the bottom of the mounting seat 22, and the output end of the motor vibration device 25 is connected to the implant device 23. The motor vibration device 25 is used to drive the implant device 23 to vibrate relative to the mounting seat 22;

[0036] The implantation device 23 includes an implantation base plate 231, an implantation top plate 232, and an implantation frame 233, which are sequentially spaced from bottom to top. The implantation base plate 231 and the implantation frame 233 are connected by a vertically extending support column. The implantation top plate 232 is movably disposed between the implantation base plate 231 and the implantation frame 233, and the conveying surface of the implantation conveying device 24 is located above the implantation top plate 232.

[0037] The bottom of the implantation frame 233 includes a holding position 2331 and an avoidance position 2332, and the holding position 2331 and the avoidance position 2332 are connected in sequence along a direction perpendicular to the conveying direction of the implantation conveying device 24; the holding position 2331 is used to hold the chip capacitor 91 to be implanted, and the implantation top plate 232 is used to offset the introduction plate 92 to be implanted with the avoidance position 2332.

[0038] In the prior art, the implant device used in the chip capacitor termination process generally uses an electromagnet to achieve vibration implantation of the product. However, since the electromagnet generates a magnetic field by the flow of current in the wire, this magnetic field can attract or repel other magnetic materials. In other words, the electromagnet may cause resonance in the structure of other magnetic materials in the implant mechanism 2.

[0039] Therefore, in order to avoid the electromagnet from causing resonance to other magnetic materials in the implant mechanism 2, thereby preventing it from causing unnecessary vibration to other magnetic materials, the present invention optimizes the structure of the implant mechanism 2, such as Figure 3-7 As shown, it includes a mounting base 21, a mounting seat 22, an implant device 23, an implant delivery device 24 and a motor vibration device 25. This solution utilizes the motor vibration device 25 to replace the electromagnet in the prior art to realize the vibration implantation of the chip capacitor. Since the motor vibration device 25 is driven by a motor and its output end is only connected to the implant device 23, during the implantation process, the vibration can be applied to the implant device 23, and then the chip capacitor located in the implant device 23 can be driven to vibrate, and the swinging action of the mounting seat 22 can be coordinated to realize the effective implantation of the chip capacitor in the introduction plate 92. It should be noted that since the vibration of the motor vibration device 25 directly acts on the implant device 23 through a mechanical connection, and the amplitude of the vibration is very small, it can effectively avoid the resonance phenomenon between the structures and extend the service life of the mechanism.

[0040] Specifically, the implantation process of the implantation mechanism 2 in this solution includes the following steps: (1) using the implantation delivery device 24 to deliver the assembly formed by the introduction plate 92 and the thick rubber plate 93 to the top of the implantation top plate 232 of the implantation device 23; at the same time, the chip capacitor to be implanted is unloaded to the holding position 2331 of the implantation frame 233; (2) the implantation top plate 232 moves upward and lifts up the assembly located in the implantation delivery device 24, so that the introduction plate 92 in the assembly is against the avoidance position 2332; (3) the mounting seat 22 is relatively The mounting base 21 is swung, and the motor vibration device 25 is used to drive the implantation device 23 to vibrate relative to the mounting seat 22, so that the chip capacitor located at the holding position 2331 enters the avoidance position 2332 and is implanted into the introduction hole of the introduction plate 92 by vibration; (4) After the implantation is completed, the motor vibration device 25 is turned off and the mounting seat 22 is reset; then the implantation top plate 232 is moved downward, and the assembly implanted with the chip capacitor is returned to the conveying surface of the implantation conveying device 24, and finally transported to the next process by the implantation conveying device 24.

[0041] It should be noted that the implant delivery device 24 used in this solution is a conventional delivery device in the art, specifically a delivery belt, which is not limited here.

[0042] Preferably, the motor vibration device 25 includes a rotating motor 251, a transmission rod 252 and a driving rod 253; the rotating motor 251 is installed at the bottom of the mounting base 22;

[0043] The transmission rod 252 is rotatably connected to the output end of the rotary motor 251 , and the end of the transmission rod 252 is rotatably connected to the end of the driving rod 253 ;

[0044] The top end of the driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implant base 231 .

[0045] Specifically, the motor vibration device 25 of this solution is powered by a rotating motor 251, and the vibration is transmitted to the implant chassis 231 of the implant device 23 by a transmission rod 252 and a drive rod 253 that are rotatably connected to each other. It has a simple structure and a compact size, and can effectively prevent the vibration from being transmitted to other unnecessary mechanisms.

[0046] Preferably, the implant device 23 further includes a limiting rod 234 , which is movably mounted on the front side of the implant chassis 231 , and the limiting rod 234 can extend and retract on the conveying surface of the implant conveying device 24 .

[0047] In a preferred embodiment of the present technical solution, by setting a limit rod 234, the positioning and transportation of the assembly can be achieved without stopping the implant delivery device 24, thereby avoiding frequent starting and stopping of the implant delivery device 24, which would have adverse effects on mechanical performance, service life, energy consumption, maintenance costs and other aspects.

[0048] Preferably, the implant device 23 further includes a slider 235, and the slider 235 is protrudingly mounted on both sides of the bottom of the implant chassis 231;

[0049] Slide rails 221 are protruding from both sides of the top of the mounting seat 22, and the extending direction of the slide rails 221 is parallel to the conveying direction of the implant conveying device 24;

[0050] The slider 235 is slidably connected to the slide rail 221 .

[0051] In another preferred embodiment of the present technical solution, the implant device 23 is mounted on the top of the mounting seat 22 through the cooperation of the slider 235 and the slide rail 221. Under the premise of stable installation of the implant device 23 on the top of the mounting seat 22, sufficient vibration space can be provided for the slight vibration of the implant device 23 relative to the mounting seat 22, thereby ensuring the implantation effect of the implant device 23.

[0052] Preferably, at least two groups of implanting devices 23 are provided, and the two groups of implanting devices 23 are arranged side by side along the conveying direction of the implant conveying device 24;

[0053] The implant delivery device 24 is located inside the two groups of implant devices 23;

[0054] There are two driving rods 253, and the two ends of the transmission rod 252 are rotatably connected to the ends of the two driving rods 253 respectively, and the top end of one driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implant chassis 231 of one implant device 23, and the top end of the other driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implant chassis 231 of the other implant device 23.

[0055] In order to improve the implantation efficiency of the implant mechanism 2, the present solution can also provide at least two groups of implantation devices 23 on the top of the mounting seat 22, and the two groups of implantation devices 23 can share a group of implantation delivery devices 24 and a group of motor vibration devices 25, thereby improving the implantation efficiency of the implant mechanism 2 without increasing the equipment cost.

[0056] Preferably, a U-shaped edge 2311 is protruding from the upper surface of the implant base 231, and the edge 2311 is arranged close to the edge of the implant base 231;

[0057] The end of the implant base 231 is recessed inwardly to form a material receiving groove 2312, and the opening of the surrounding edge 2311 faces the material receiving groove 2312;

[0058] The containing position 2331 and the material receiving groove 2312 are respectively located on both sides of the swing axis of the mounting seat 22.

[0059] In addition, this solution also adds a border 2311 on the upper surface of the implant chassis 231 to prevent the chip capacitors from scattering to other places in the implant mechanism 2, so that during the vibration process of the implant, the chip capacitors that fall from the holding position 2331 are always located on the upper surface of the implant chassis 231, and are recovered by the receiving trough 2312 during the swinging process of the mounting seat 22, which facilitates the collection of the product and avoids product waste.

[0060] To further illustrate, the pressing mechanism 3 includes a detection and conveying device 31, a first cleaning device 32, a detection device 33, a pressing and conveying device 34 and a needle bed pressing device 35;

[0061] The detection conveying device 31 and the pressing conveying device 34 are connected end to end in sequence, and the pressing conveying device 34 moves up and down relative to the detection conveying device 31, and the needle bed pressing device 35 is located inside the pressing conveying device 34;

[0062] The first cleaning device 32 and the detection device 33 are sequentially arranged on the detection conveying device 31 along the conveying direction of the detection conveying device 31, and the detection conveying device 31 is used to convey the assembly, the first cleaning device 32 is used to clean the upper surface of the assembly, and the detection device 33 is used to detect whether there is foreign matter on the upper surface of the assembly placed on the detection conveying device 31;

[0063] The needle bed pressing device 35 includes an upper platform 351 and a lower platform 352 that are arranged opposite to each other in the vertical direction, and the upper platform 351 is located above the lower platform 352. The upper platform 351 moves up and down relative to the lower platform 352. The holding surface of the lower platform 352 is located within the up and down movement range of the pressing and conveying device 34. The upper platform 351 is used to press the chip capacitor 91 located in the import plate 92 in the assembly into the plate hole of the thick rubber plate 93.

[0064] During the termination process of chip capacitors, the needle bed presses the chip capacitors located in the lead-in plate 92 into the plate holes of the thick rubber plate 93. This process often requires multiple manual confirmations and interventions before and after. This is because the needle bed press-in is a mechanical hard press driven by a motor. If the chip capacitors located in the lead-in plate 92 are tilted at the implantation position, or even not implanted and rolling on the surface of the lead-in plate 92, the needle bed press-in process may cause product deformation, needle bed damage, lead-in holes / plate holes to be blocked, and lead-in plate / thick rubber plate to be damaged.

[0065] In order to avoid the above situation, this technical solution proposes a pressing mechanism 3, such as Figure 8-11 As shown, the detection and conveying device 31, the first cleaning device 32, the detection device 33, the pressing and conveying device 34 and the needle bed pressing device 35. Before the needle bed pressing device 35 is used to press the chip capacitor located in the introduction plate 92 into the plate hole of the thick rubber plate 93, the first cleaning device 32 is used to clean the upper surface of the assembly to remove the products on the surface of the introduction plate 92 that are not implanted in the introduction hole and / or the products that are inserted obliquely into the introduction hole; then the detection device 33 is used to detect whether there are foreign objects on the upper surface of the assembly to ensure the smooth progress of the subsequent pressing process.

[0066] Specifically, the pressing process of the pressing mechanism 3 in this scheme includes the following steps: (1) using the detection conveying device 31 to convey the assembly formed by the introduction plate 92 and the thick rubber plate 93 to the first cleaning device 32, and using the first cleaning device 32 to clean the upper surface of the assembly; (2) using the detection conveying device 31 to convey the assembly to the bottom of the detection device 33, and using the detection device 33 to detect whether there is foreign matter on the upper surface of the assembly; (3) using the detection conveying device 31 to continue conveying the assembly forward, and make the conveying surface of the pressing conveying device 34 move to be flush with the conveying surface of the detection conveying device 31, and the pressing conveying device 34 receives the assembly. (4) The assembly is conveyed to the top of the lower platform 352 by the pressing and conveying device 34, and then the pressing and conveying device 34 moves downward, so that the assembly located on the pressing and conveying device 34 is placed on the holding surface of the lower platform 352; (5) The upper platform 351 moves downward relative to the lower platform 352, and the chip capacitor 91 located in the introduction plate 92 in the assembly is pressed into the board hole of the thick rubber plate 93 through the upper platform 351; (6) After the pressing is completed, the upper platform 351 is reset upward, and at the same time, the pressing and conveying device 34 is reset upward and the assembly leaves the holding surface of the lower platform 352, and finally the assembly is conveyed to the next process by the pressing and conveying device 34.

[0067] It should be noted that the detection conveying device 31 and the pressing conveying device 34 used in this solution are conventional conveying devices in the art, specifically conveying belts, which are not limited here.

[0068] Preferably, the detection device 33 includes a detection platform 331 and a displacement detection probe;

[0069] The detection platform 331 is located above the detection conveying device 31, and the detection platform 331 moves up and down relative to the detection conveying device 31;

[0070] There are multiple displacement detection probes, and the multiple displacement detection probes are embedded in the interior of the detection platform 331 . The displacement detection probes are used to detect whether there is foreign matter on the upper surface of the assembly placed on the detection conveying device 31 .

[0071] In this embodiment, a displacement detection probe (not shown in the figure) is used to detect whether there are products or other impurities on the surface of the introduction plate 92, and the data fed back by the displacement detection probe can be used to promptly detect problems, and an alarm can be issued in time when problems occur, so that the corresponding staff can handle them. When subsequent products are pressed in, the probability of product deformation, broken needles on the needle bed, clogged introduction holes / plate holes, broken introduction plates / thick rubber plates, etc. can be effectively reduced.

[0072] It should be noted that the displacement detection probe used in this solution is a common sensor in this field, specifically a capacitive displacement sensor, which is not limited here.

[0073] Preferably, the pressing mechanism 3 further includes a detection limit block 36, and the detection limit block 36 is located in front of the detection device 33;

[0074] The detection limit block 36 is installed inside the detection conveying device 31 so as to be movable up and down, and the detection limit block 36 can extend and retract on the conveying surface of the detection conveying device 31 .

[0075] In a preferred embodiment of the present technical solution, by setting the detection limit block 36, the positioning and transportation of the assembly can be achieved without stopping the detection and transportation device 31, thereby avoiding the frequent start and stop of the detection and transportation device 31, which will bring adverse effects on mechanical performance, service life, energy consumption, maintenance costs and other aspects.

[0076] Preferably, the pressing mechanism 3 further includes a second cleaning device 37, the second cleaning device 37 is located between the detection conveying device 31 and the pressing conveying device 34, and the cleaning action surface of the second cleaning device 37 is flush with the conveying surface of the detection conveying device 31;

[0077] The second cleaning device 37 is used to clean the lower surface of the assembly.

[0078] As a better embodiment of the present technical solution, a second cleaning device 37 for cleaning the lower surface of the assembly is further provided between the detection conveying device 31 and the pressing conveying device 34 to further ensure the smooth progress of the pressing step, and further avoid the occurrence of product deformation, broken needles on the needle bed, clogged guide holes / plate holes, broken guide plates / thick rubber plates, etc.

[0079] Preferably, the first cleaning device 32 includes a first roller brush 321 and a first receiving tray 322 that are arranged opposite to each other in the vertical direction, and the first roller brush 321 is located above the detection and conveying device 31, and the first receiving tray 322 is located below the detection and conveying device 31;

[0080] The second cleaning device 37 includes a second roller brush 371 and a second material receiving tray 372 arranged opposite to each other in the vertical direction, and the cleaning action surface of the second roller brush 371 is flush with the conveying surface of the detection and conveying device 31, and the second material receiving tray 372 is located at the bottom of the second roller brush 371.

[0081] This facilitates efficient cleaning and collection of the product, thus avoiding waste.

[0082] Preferably, the pressing mechanism 3 further includes a pressing limit block 38, and the pressing limit block 38 is located at the front side of the needle bed pressing device 35;

[0083] The pressing-in limiting block 38 is installed inside the pressing-in conveying device 34 so as to be movable up and down, and the pressing-in limiting block 38 can extend and retract on the conveying surface of the pressing-in conveying device 34 .

[0084] In another preferred embodiment of the present technical solution, by setting a press-in limit block 38, the positioning and transportation of the assembly can be achieved without stopping the press-in conveying device 34, thereby avoiding frequent starting and stopping of the press-in conveying device 34, which would have adverse effects on mechanical performance, service life, energy consumption, maintenance costs and other aspects.

[0085] Preferably, the upper platform 351 includes a platform mounting plate 3511 and a mesh plate 3512, and the mesh plate 3512 is installed below the platform mounting plate 3511 by spring expansion and contraction; a plurality of pressure pins are protruding from the lower surface of the platform mounting plate 3511, and a plurality of through holes are opened on the plate surface of the mesh plate 3512, and one pressure pin corresponds to one through hole, and the through hole is used for the pressure pin to pass through the mesh plate 3512.

[0086] Specifically, the upper platform 351 of this solution includes a platform mounting plate 3511 for mounting a press pin (not shown) and a mesh plate 3512 for the press pin to pass through. The upper platform 351 moves downward relative to the lower platform 352, and when the upper platform 351 and the assembly are against each other, the platform mounting plate 3511 compresses the spring and continues to move downward, allowing the press pin to pass through the mesh plate 3512 through the through hole and press the chip capacitor implanted in the lead-in plate 92 into the plate hole of the thick rubber plate 93, thereby completing the pressing process.

[0087] To further illustrate, the leveling mechanism 4 includes a leveling conveying device 41, a lifting platform 42, a feeding belt 43, a turning device 44, an inlet plate recovery device and a leveling device 45;

[0088] The leveling conveying device 41 includes a conveying frame 411 and a conveying tray 412. The conveying tray 412 is horizontally movably mounted on the top of the conveying frame 411, and the conveying tray 412 is used to hold the thick rubber plate 93.

[0089] The jacking platform 42, the feeding belt 43, the flipping device 44 and the lead-in plate recovery device are sequentially arranged at the feeding end of the conveyor frame 411 from bottom to top, and the jacking platform 42 and the feeding belt 43 are both located at the inner bottom of the conveyor frame 411, and the flipping device 44 and the lead-in plate recovery device are both arranged at the top of the conveyor frame 411;

[0090] The lifting platform 42 can move up and down relative to the feeding belt 43 and the turning device 44, and the lifting platform 42 can pass through the feeding belt 43 and the conveying surface of the leveling conveyor 42; the conveying tray 412 is U-shaped, and an escape opening is opened in the middle of the conveying tray 412, and the escape opening is used to avoid the lifting platform 42;

[0091] The leveling device 45 is located in front of the flipping device 44, and the leveling device 45 includes a leveling clamp 451 and a leveling platform 452 that are arranged opposite to each other in the vertical direction. The leveling clamp 451 is located above the conveyor frame 411, and the leveling clamp 451 can move up and down relative to the conveyor frame 411. The leveling platform 452 is located below the conveyor frame 411, and the leveling clamp 451 is used to clamp the thick rubber plate 93.

[0092] During the termination process of the chip capacitor, in the prior art, the chip capacitor located in the introduction board 92 is generally pressed into the plate hole of the thick rubber plate 93 by a needle bed, and the end surface of the protruding end of the chip capacitor implanted in the thick rubber plate 93 is made relatively flush only by the pressure needle of the needle bed, without adding an additional leveling step.

[0093] However, since the pressure needles in the needle bed also have tolerances, and there are slight differences in the clamping force of each plate hole in the thick rubber plate 93 on the chip capacitor, in order to ensure the sealing quality of the chip capacitor, it is necessary to level the end faces of the chip capacitor in the thick rubber plate 93 before dipping.

[0094] Therefore, this technical solution proposes a leveling mechanism 4, such as Figure 12-15 As shown, it includes a leveling conveying device 41, a lifting platform 42, a feeding belt 43, a turning device 44, an introduction plate recovery device (not shown in the figure) and a leveling device 45.

[0095] Specifically, the leveling process in the leveling mechanism 4 of this scheme includes the following steps: (1) using the feeding belt 43 to transport the assembly conveyed from the previous process to the top of the jacking platform 42, and at the same time making the conveying tray 412 away from the feeding end of the conveyor frame 411; (2) the jacking platform 42 moves upward and pushes the assembly away from the conveying surface of the feeding belt 43, and the guide plate recovery device removes the guide plate 92 located at the top of the assembly, and then the turning device 44 clamps the remaining thick rubber plate 93 in the assembly; (3) the jacking platform 42 moves downward and reserves sufficient space for the turning device 44 to turn over, and at the same time makes the conveying tray 412 move to the bottom of the turning device 44, and then The flipping device 44 flips the thick rubber plate 93 180°; at this time, the end of the chip capacitor 91 to be sealed protrudes from the lower surface of the thick rubber plate 93; (4) After the lifting platform 42 moves upward and takes back the thick rubber plate 93, the thick rubber plate 93 is placed on the top of the conveying tray 412; (5) The conveying tray 412 is conveyed forward and conveys the thick rubber plate 93 to the top of the leveling platform 452; (6) The thick rubber plate 93 is clamped by the leveling fixture 451, and the thick rubber plate 93 is moved downward to the top of the leveling platform 452, so that the end of the chip capacitor 91 in the thick rubber plate 93 is against the upper surface of the leveling platform 452, and the end of the chip capacitor 91 is flush, completing the leveling action.

[0096] It should be noted that the thick rubber sheet 93 after the leveling operation can be transported to the unloading end of the leveling conveyor device 41 via the conveyor tray 413, which is not limited here. The lead-in plate recovery device used in this solution can be a robot for transporting the lead-in plate to the lead-in plate storage rack 1, and the output end of the robot is equipped with a clamp or suction cup for moving the lead-in plate 92, which is not limited here.

[0097] Preferably, the leveling fixture 451 includes a leveling mounting base 4511 and a fixture assembly. The leveling mounting base 4511 is mounted directly above the conveyor frame 411 and moves up and down relative to the conveyor frame 411. Two sets of fixture assemblies are provided, and the two sets of fixture assemblies are relatively arranged on both sides of the bottom of the leveling mounting base 4511. The fixture assemblies are used to clamp the thick rubber plate 93.

[0098] The clamp assembly includes a horizontal extension cylinder 4512, a bottom extension cylinder 4513 and a clamp 4514;

[0099] The horizontal extension cylinder 4512 is installed on the edge of the leveling mounting seat 4511, and the output end of the horizontal extension cylinder 4512 can move away from and close to the center of the leveling mounting seat 4511;

[0100] The output end of the horizontal extension cylinder 4512 is mounted with the bottom extension cylinder 4513 , and the output end of the bottom extension cylinder 4513 can move up and down relative to the leveling mounting base 4511 ;

[0101] The output end of the bottom extending cylinder 4513 is installed with the clip 4514 .

[0102] In a preferred embodiment of this technical solution, the leveling fixture 451 includes a leveling mounting base 4511 and two sets of clamp assemblies for clamping the thick rubber sheet 93. The clamp assemblies include a horizontal extension cylinder 4512 and a bottom extension cylinder 4513, which respectively enable horizontal and vertical movement of the clamping piece 4514. These two drive structures enable the clamp assemblies to flexibly and effectively clamp the heavy thick rubber sheet 93, ensuring the stable operation of the leveling mechanism 4.

[0103] Preferably, the flipping device 44 includes two sets of flipping components arranged opposite to each other in the horizontal direction, and the two sets of flipping components are respectively mounted on both sides of the conveyor frame 411;

[0104] The flip assembly includes a flip mounting bracket 441, a side-extending cylinder 442, a flip motor 443 and a flip clamp 444;

[0105] The side extension cylinder 442 is detachably mounted on the conveyor frame 411 via the flip mounting bracket 441;

[0106] The output end of the lateral extension cylinder 442 can be moved away from or close to the center of the conveyor frame 411 , and the flip motor 443 is installed at the output end of the lateral extension cylinder 442 ;

[0107] The output end of the flip motor 443 is mounted on the flip clamp 444 for clamping the thick rubber plate 93 , and the flip clamp 444 is rotated relative to the conveyor frame 411 by the flip motor 443 .

[0108] In another preferred embodiment of this technical solution, the flipping device 44 includes two flipping assemblies for clamping the thick rubber sheet 93. The flipping assemblies include a laterally extending cylinder 442 and a flipping motor 443, which respectively enable horizontal movement and rotation of the flipping jaws 444. These two drive structures enable the flipping assemblies to flexibly and effectively clamp and flip the heavy thick rubber sheet 93, ensuring stable operation of the leveling mechanism 4.

[0109] Preferably, the leveling conveying device 42 further includes a material unloading tray 413 , which is horizontally movably mounted on the top of the conveying frame 411 , and the material unloading tray 413 is located on the front side of the conveying tray 412 .

[0110] In a more preferred embodiment of the present technical solution, the thick rubber sheet 93 after the leveling action is completed can be transported to the unloading end of the leveling conveying device 41 by the unloading tray 413, so that the leveling mechanism 4 can use the conveying tray 412 to level the next thick rubber sheet 93 while unloading after leveling, so as to improve the leveling efficiency of the leveling mechanism 4.

[0111] Preferably, a plurality of support blocks 414 are protrudingly provided on the upper surface of the conveying tray 412 and the upper surface of the unloading tray 413 , and the plurality of support blocks 414 are used to support the thick rubber plate 93 .

[0112] This is beneficial for positioning and conveying the thick rubber plate 93 and also facilitates clamping of the thick rubber plate 93 by other devices.

[0113] Preferably, the leveling mechanism 4 further includes a cleaning device 46, and the cleaning device 46 is located between the flipping device 44 and the leveling device 45;

[0114] The cleaning device 46 includes an upper roller brush 461, a lower roller brush 462 and a product receiving tray 463;

[0115] The upper roller brush 461 is provided above the conveyor frame 411 and is used to clean the upper surface of the thick rubber plate 93; the lower roller brush 462 is provided below the conveyor frame 411 and is used to clean the lower surface of the thick rubber plate 93;

[0116] The product receiving tray 463 is located directly below the upper roller brush 461 and the lower roller brush 462 .

[0117] In order to further ensure the smooth progress of the leveling step, this solution also adds a cleaning device 46 for cleaning the upper and lower surfaces of the thick rubber plate 93 between the flipping device 44 and the leveling device 45, so as to prevent abnormal products or impurities remaining on the upper and lower surfaces of the thick rubber plate 93 from affecting the leveling of the ends of the chip capacitors.

[0118] To further illustrate, the slurry dipping mechanism 5 includes a slurry dipping device 51, a transfer conveyor platform 52, a transfer clamp 53, a pre-drying device 54, a pre-cooling device 55, a material unloading conveyor platform 56 and a material feeding clamp 57;

[0119] The transfer conveyor 52, the pre-drying device 54, the pre-cooling device 55 and the unloading conveyor 56 are sequentially connected end to end, and the transfer conveyor 52 moves up and down relative to the pre-drying device 54, and the unloading conveyor 56 moves up and down relative to the pre-cooling device 55;

[0120] The immersion device 51 is provided with at least two groups, and the loading end of all the immersion devices 51 and the unloading conveying platform 56 are located within the moving range of the feeding clamp 57, and the feeding clamp 57 is used to realize the transfer of the thick rubber plate 93 between the loading end of the immersion device 51 and the unloading conveying platform 56; the unloading end of all the immersion devices 51 and the transfer conveying platform 52 are located within the moving range of the transfer clamp 53, and the transfer clamp 53 is used to realize the transfer of the thick rubber plate 93 between the unloading end of the immersion device 51 and the transfer conveying platform 52.

[0121] Conventional terminal capping machines typically only require the chip capacitor to be pressed down onto the pad once during slurry dipping to complete the end capping process. Furthermore, the slurry used is typically thicker to ensure that the slurry in the pad effectively adheres to the end of the chip capacitor during this single press.

[0122] Because the slurry used for terminal sealing is relatively thick, it is easy for the terminal of the chip capacitor to form an irregular sealing layer shape after dipping, causing bubbles to exist between the terminal surface of the chip capacitor and the sealing layer, resulting in uneven thickness of the sealing layer and poor bonding, thus affecting the sealing quality of the chip capacitor. Furthermore, the terminal sealing requirement of chip capacitors is generally to form a straight terminal line on the surface of the capacitor. However, chip capacitors sealed with a slurry with a higher viscosity generally have an uneven terminal line and are prone to sagging outside the sealing layer, which also affects the terminal sealing quality of the chip capacitor.

[0123] In order to make the slurry effectively adhere to the end of the chip capacitor and ensure that its sealing layer has the required thickness and straight sealing line, the present technical solution proposes a slurry dipping mechanism 5, such as Figure 16As shown, it includes at least two groups of slurry dipping devices 51, a transfer conveying platform 52, a transfer clamp 53, a pre-drying device 54, a pre-cooling device 55, a material unloading conveying platform 56 and a material feeding clamp 57.

[0124] This solution introduces at least two groups of dipping devices 51 in the dipping mechanism 5. During the dipping process of the patch capacitor, the end of the chip capacitor can first be pre-dipped by the dipping device 51 of the first group, and dried and cooled by the pre-drying device 54 and the pre-cooling device 55 to form a pre-impregnation layer, and then the chip capacitor is formally dipped by the dipping device 51 of the second group, thereby completing the dipping process of the chip capacitor. The dipping mechanism 5 of this solution implements at least two dipping processes, and the presence of the pre-impregnation layer is conducive to improving the bonding between the slurry and the chip capacitor during the formal dipping process, ensuring that the sealing surface of the chip capacitor is flat and the sealing line is flat, so as to ensure the sealing quality of the chip capacitor. In addition, the two groups of dipping devices 51 in this solution share the same group of pre-drying device 54 and pre-cooling device 55, which is conducive to reducing the occupied space of the equipment and saving equipment costs.

[0125] It should be noted that, in a specific embodiment, the end of the chip capacitor can be pre-dipped once or multiple times using a thinner slurry in the first group of dipping devices 51, and then the end of the chip capacitor can be formally dipped once or multiple times using a slurry of normal consistency in the second group of dipping devices 51. In another specific embodiment, the same or multiple groups of dipping devices 51 can also be used to dip the chip capacitor multiple times using a slurry of the same thin viscosity. This is not limited here and can be selected as needed based on the sealing quality. In this solution, multiple groups of dipping devices 51 are used to implement multiple dipping processes, which can further improve the sealing effect and quality of the chip capacitor.

[0126] It should be noted that the transfer conveyor 52, transfer clamp 53, pre-drying device 54, pre-cooling device 55, unloading conveyor 56, and feeding clamp 57 used in this solution are all conventional structures in the field, and their specific structures are not described in detail here. In some specific embodiments, the transfer conveyor 52 and unloading conveyor 56 of this solution can be conveyor belts that can be raised and lowered, the pre-drying device 54 can be a conventional infrared heating device, and the pre-cooling device 55 can be connected to an external cooling device, which can be used to deliver cold air to the interior of the pre-cooling device, thereby cooling the chip capacitors on the thick rubber board 93.

[0127] Specifically, the dipping process of a specific embodiment of the dipping mechanism 5 in this scheme includes the following steps: (1) using the feeding clamp 57 to load the thick rubber plate 93 with the chip capacitor 91 implanted therein to the loading end of the dipping device 51 of the first group; at this time, the end of the chip capacitor 91 to be dipped protrudes from the lower surface of the thick rubber plate 93; (2) using the dipping device 51 of the first group to dip the end of the chip capacitor 91; (3) moving the transfer conveyor 52 downward, and making the transfer conveyor 52 and the dipping device 51 of the first group at the same height, and then using the transfer clamp 53 to move the thick rubber plate 93 located at the unloading end of the dipping device 51 of the first group to the top of the transfer conveyor 52; (4) moving the transfer conveyor 52 upward, and making the transfer conveyor The platform 52 and the pre-drying device 54 are at the same height, and then the transfer conveyor platform 52 is used to convey the thick rubber plate 93 after the slurry dipping to the interior of the pre-drying device 54 for drying, and then enters the interior of the pre-cooling device 55 for cooling, and is temporarily stored on the unloading conveyor platform 56 (at this time, the unloading conveyor platform 56 and the pre-cooling device 55 are at the same height); (5) the unloading conveyor platform 56 is moved downward, and the unloading conveyor platform 56 and the second group of slurry dipping devices 51 are at the same height, and the end of the chip capacitor 91 is dipped by the second group of slurry dipping devices 51; (6) steps (3) and (4) are repeated, so that the chip capacitor 91 after the second slurry dipping is dried and cooled again, and is temporarily stored on the unloading conveyor platform 56 again, waiting to enter the next process.

[0128] To further illustrate, the slurry dipping device 51 includes a mounting frame 511 , a slurry tray 512 , a slurry spreading assembly 513 , a slurry dipping fixture 514 and a loading tray 515 ;

[0129] The mounting frame 511 includes a support base 5111 and a conveying bracket 5112;

[0130] The support base 5111 is mounted above the paddle disc 512, and the paddle disc 512 moves horizontally relative to the support base 5111; the conveying bracket 5112 is horizontally mounted on the support base 5111, and the extension direction of the conveying bracket 5112 is parallel to the movement direction of the paddle disc 512, and the conveying bracket 5112 is located above the paddle disc 512;

[0131] The slurry spreading assembly 513 is installed on one side of the support seat 5111, and the slurry spreading assembly 513 is located on the top of the slurry disc 512; the slurry spreading assembly 513 moves up and down relative to the slurry disc 512, and the slurry spreading assembly 513 is used to lay a slurry layer on the top of the slurry disc 512;

[0132] The loading tray 515 is horizontally movably mounted on the conveying bracket 5112;

[0133] The slurry dipping fixture 514 is movably mounted on the support seat 5111 , and the upper limit of movement of the slurry dipping fixture 514 is located above the conveying bracket 5112 , and the lower limit of movement of the slurry dipping fixture 514 is located above the slurry disk 512 .

[0134] Furthermore, in order to ensure the continuity and smoothness of the slurry dipping process, the present technical solution also optimizes the structure of the slurry dipping device 51, such as Figure 17-19 As shown, it includes a mounting frame 511, a slurry disc 512, a slurry spreading assembly 513, a slurry dipping fixture 514 and a loading tray 515.

[0135] Specifically, the dipping process of the dipping device 51 in this embodiment includes the following steps: (1) using the feeding clamp 57 to load the thick rubber plate 93 with the chip capacitor 91 embedded therein to the loading tray 515 located at the loading end of the dipping device 51; at this time, the end of the chip capacitor 91 to be dipped protrudes from the lower surface of the thick rubber plate 93; (2) using the loading tray 515 to move the thick rubber plate 93 to the bottom of the dipping fixture 514; at the same time, using the dipping assembly 513 to lay a slurry layer on the top of the slurry plate 512, and moving the slurry plate 512 horizontally to the bottom of the dipping fixture 514; (3 ) After the thick rubber plate 93 located on the loading tray 515 is clamped by the dipping fixture 514, the loading tray 515 is reset; then, the dipping fixture 514 moves downward, and the end of the chip capacitor in the thick rubber plate 93 contacts the slurry layer on the top of the slurry tray 512; (4) The dipping fixture 514 moves upward, and the loading tray 515 moves to the bottom of the dipping fixture 514; then, the dipping fixture 514 puts the thick rubber plate 93 after dipping back into the loading tray 515, and the loading tray 515 and the thick rubber plate 93 after dipping are transported to the unloading end of the dipping device 51, completing the dipping process.

[0136] It should be noted that, in a specific embodiment, the slurry spreading component 513 in this scheme can be a scraper. After the slurry is added to the slurry plate 512, the up and down movement of the scraper and the horizontal movement of the slurry plate 512 are coordinated to form a slurry layer of the required thickness with a smooth surface on the slurry plate 512.

[0137] Preferably, the slurry soaking device 51 further includes a debubbling assembly, which includes a debubbling tray 516 and a debubbling top cover 517, and the cover of the debubbling top cover 517 is connected to a negative pressure pipe;

[0138] The debubble tray 516 is horizontally movably mounted on the conveying bracket 5112, and the loading tray 515 is located at the loading end of the conveying bracket 5112, and the debubble tray 516 is located at the unloading end of the conveying bracket 5112;

[0139] The debubble top cover 517 is installed on the top of the conveying bracket 5112, and the debubble top cover 517 is located on one side of the support seat 5111; the debubble top cover 517 moves up and down relative to the conveying bracket 5112, and the debubble top cover 517 is used to cover the debubble tray 516.

[0140] Most of the existing chip capacitors have small bubbles in their terminations, which is an unavoidable shortcoming of the existing termination technology. The presence of the above small bubbles directly affects the termination quality of the chip capacitors, thereby affecting the operation of the circuit and further affecting the quality of electronic products.

[0141] In order to ensure the sealing quality of the chip capacitor and avoid the presence of small bubbles inside its sealing layer, the present technical solution also adds a debubble assembly to the immersion device 51. Specifically, the debubble assembly includes a debubble tray 516 and a debubble top cover 517. The present solution can use the debubble tray 516 as a carrier for unloading the thick rubber plate 93 after immersion. After immersion, the thick rubber plate 93 is first moved to the bottom of the debubble top cover 517 through the debubble tray 516, and after covering the debubble tray 516 with the debubble top cover 517, vacuum debubbling is performed through the negative pressure pipe (not shown in the figure) provided on the top of the debubble tray 516, and then the thick rubber plate 93 is transported to the unloading end of the immersion device 51.

[0142] In addition, due to the addition of the degassing tray 516, the dipping process and the degassing process of the thick rubber plate 93 in the dipping device 51 can be separated, which is more conducive to speeding up the production cycle of the chip capacitor.

[0143] Further explanation, the cooling storage mechanism 6 includes a cooling cover 61, a lifting device 62, a cold air delivery head 63 and a circulating fan 64; the bottom and top of the cooling cover 61 are both provided with openings, the lifting device 62 is provided inside the cooling cover 61, and the inlet of the lifting device 62 protrudes from the bottom of the cooling cover 61, and the lifting device 62 is used to transport the thick rubber plate 93 upward in the vertical direction;

[0144] The cold air delivery head 63 is connected to the cooling cover 61, and the air inlet end of the cold air delivery head 63 is connected to the cold air source;

[0145] The circulation fan 64 is installed between the cooling cover 61 and the lifting device 62 , and the circulation fan 64 is located below the cold air delivery head 63 .

[0146] In the prior art, due to the heavy weight of thick rubber sheets, each step of the end-capping process is generally carried manually. Furthermore, to facilitate maintenance of the corresponding equipment in each step, each step is generally separated by a certain distance. Therefore, the cooling air blown during the end-cooling step of the chip capacitor generally does not affect the internal temperature of the end-drying oven.

[0147] Shortening the transfer distance between processes is a simple and effective measure to improve the efficiency of chip capacitor termination. However, if the distance between the cooling process and the drying process is too close, the cooling air blown from the chip capacitor end cooling process can easily enter the oven directly from the discharge end, affecting the temperature curve of the drying process and reducing the drying efficiency and quality of the chip capacitor end.

[0148] Therefore, in order to solve the above technical problems, the present technical solution proposes a cooling storage mechanism 6, such as Figure 20-24 As shown, it includes a cooling cover 61, a lifting device 62, a cold air delivery head 63 and a circulating fan 64. The gas flow direction in the cooling storage mechanism 6 is as follows Figure 23 As shown, the cold air delivery head 63 is used to deliver cold air (indicated by the hollow arrow) to the interior of the cooling cover 61, thereby cooling the thick rubber plate 93 delivered vertically upward inside the cooling cover 61; the circulating fan 64 is used to form a circulating airflow (indicated by the solid arrow) at the lower part of the cooling cover 61, and the circulating airflow can act as an air curtain to prevent the cold air delivered to the interior of the cooling cover 61 by the cold air delivery head 63 from sinking, thereby losing through the bottom opening of the cooling cover 61, and even affecting the drying process of the previous step, and can also make the cold air effectively gather inside the cooling cover 61, thereby improving the cooling efficiency of the end of the chip capacitor.

[0149] Specifically, the operation process of the cooling storage mechanism 6 of this scheme includes the following steps: (1) the thick rubber plate 93 implanted with the chip capacitor 91 enters the cooling storage mechanism 6 from the bottom of the lifting device 62, and is driven upward by the lifting device 62 into the interior of the cooling cover 61; (2) cold air is transported to the interior of the cooling cover 61 through the cold air delivery head 63, so that the thick rubber plate 93 implanted with the chip capacitor 91 is effectively cooled in the process of being driven upward by the lifting device 62; (3) after cooling, the thick rubber plate 93 implanted with the chip capacitor 91 is unloaded from the top of the cooling cover 61 and moved to the next process by the transfer clamp.

[0150] Preferably, the lifting device 62 includes two conveying components 621 arranged opposite to each other in the vertical direction, and a conveying gap is left between the two conveying components 621;

[0151] The conveying assembly 621 includes a vertical conveying frame 6211, a conveyor belt 6212, and a support plate 6213. The conveyor belt 6212 rotates relative to the vertical conveying frame 6211. A plurality of support plates 6213 are provided. The plurality of support plates 6213 are installed at intervals on the outside of the conveyor belt 6212, and the support plates 6213 rotate along with the rotation of the conveyor belt 6212.

[0152] The conveying directions of the inner conveying sections of the conveyor belts 6212 of the two conveying assemblies 621 are the same and synchronous, and the supporting plates 6213 of the two conveying assemblies 621 are used to support the thick rubber sheet 93 together.

[0153] In a preferred embodiment of this technical solution, the lifting device 62 includes two conveyor assemblies 621 arranged in a vertically opposed relationship, with a conveying gap left between the two conveyor assemblies 621 to enable the thick rubber sheet 93 to rise within the conveying gap. Specifically, the conveyor assembly 621 of this solution includes a vertical conveyor frame 6211, a conveyor belt 6212, and a support plate 6213. The support plate 6213, which is used to support the thick rubber sheet 93, rotates in conjunction with the rotation of the conveyor belt 6212. When the inner conveying sections of the conveyor belts 6212 of the two conveyor assemblies 621 are synchronously directed upward, and the thick rubber sheet 93 is placed on the support plates 6213 of the two conveyor assemblies 621, the thick rubber sheet 93 can be vertically lifted within the conveying gap.

[0154] The lifting device 62 of this solution has a simple structure and reliable performance, and can stably achieve the vertical lifting of the thick rubber plate 93. The lifting device 62 is composed of two symmetrical conveying components 621, which is conducive to reducing the design cost of the lifting device 62 while ensuring stable performance.

[0155] Preferably, the conveying assembly 621 further includes a driving wheel 6214 and a driven wheel 6215, and the driving wheel 6214 and the driven wheel 6215 are both rotatably mounted on the same side of the vertical conveying frame 6211, and the driving wheel 6214 is protrudingly arranged at the lower part of the vertical conveying frame 6211, and the driven wheel 6215 is protrudingly arranged at the upper part of the vertical conveying frame 6211;

[0156] The conveyor belt 6212 is wound around the outer sides of the driving wheel 6214 and the driven wheel 6215 , and the rotation of the driving wheel 6214 drives the rotation of the conveyor belt 6212 .

[0157] Preferably, the driving wheel 6214, the driven wheel 6215 and the conveyor belt 6212 form a set of lifting members, the conveying assembly 621 includes two sets of the lifting members, and the two sets of the lifting members are respectively arranged on opposite sides of the vertical conveying frame 6211;

[0158] The supporting plates 6213 of the two groups of lifting members are used together to support one edge of the thick rubber plate 93.

[0159] In this way, the thick rubber plate 93 has four supporting points during the upward movement, which is more conducive to the stable rise of the thick rubber plate 93.

[0160] Preferably, the driving wheel 6214 and the driven wheel 6215 are both sprockets, and the conveyor belt 6212 is a chain.

[0161] In a more preferred embodiment of the present technical solution, the transmission mode of the conveying component 621 is preferably chain drive. On the one hand, since the chain drive has no elastic sliding and slipping phenomenon, it is beneficial to improve its transmission efficiency. On the other hand, it can transmit greater power and has a strong overload capacity, thereby effectively improving the conveying component 621's supporting capacity for the heavier thick rubber plate 93.

[0162] Preferably, the support plate 6213 includes a connecting piece 62131 and a supporting piece 62132, and the connecting piece 62131 and the supporting piece 62132 are perpendicular to each other;

[0163] The connecting piece 62131 is connected to the outer side of the conveyor belt 6212, and the long side of the supporting piece 62132 is integrally formed with the long side of the connecting piece 62131;

[0164] When the support plate 6213 is located inside the conveying gap, the supporting piece 62132 is located on top of the connecting piece 62131 .

[0165] In another preferred embodiment of the present technical solution, the support plate 6213 of the present solution includes a connecting piece 62131 and a supporting piece 62132, wherein the connecting piece 62131 is used to be connected to the conveyor belt 6212, and the supporting piece 62132 is used to support the thick rubber plate 93 so as to achieve stable transportation of the thick rubber plate 93.

[0166] In addition, since the supporting piece 62132 is located on top of the connecting piece 62131 when the support plate 6213 is located inside the conveying gap, the supporting piece 62132 can be effectively prevented from obstructing the unloading action during the unloading process of the thick rubber plate 93, thereby achieving smooth unloading of the thick rubber plate 93.

[0167] To further illustrate, the plate changing mechanism 7 includes a needle bed conveying device 71, a partition frame clamping device 72, a new plate clamping device 73, a new plate conveying device 74 and a flattening device 75;

[0168] The needle bed conveying device 71 includes a first conveying track 711 and a transfer platform 712. The transfer platform 712 is horizontally movably mounted on the first conveying track 711. The transfer platform 712 includes a platform mounting seat 7121 for placing the thick rubber plate 93 and a mesh plate 7122. The mesh plate 7122 is mounted above the platform mounting seat 7121 by spring expansion. A plurality of ejector pins are protruding from the upper surface of the platform mounting seat 7121. The mesh plate 7122 has a plurality of mesh holes, with one ejector pin corresponding to one mesh hole. The mesh holes are used for the ejector pins to pass through the mesh plate 7122.

[0169] The partition frame clamping device 72 and the new plate clamping device 73 are sequentially mounted above the end of the first conveying track 711 along the conveying direction of the transfer platform 712. The partition frame clamping device 72 is used to clamp the partition frame 94, and the new plate clamping device 73 is used to clamp the empty thick rubber plate 93. The clamps of the partition frame clamping device 72 and the new plate clamping device 73 can both move up and down relative to the transfer platform 712.

[0170] The new board conveying device 74 includes a second conveying rail 741 and a support bar 742. The support bar 742 is horizontally movably installed on both sides of the interior of the second conveying rail 741. The loading end of the second conveying rail 741 and the end of the first conveying rail 711 are sequentially arranged below the clamp of the new board clamping device 73 from top to bottom, and the clamp of the new board clamping device 73 can pass through the conveying surface of the second conveying rail 741.

[0171] The flattening device 75 is arranged at the end of the second conveying track 741. The flattening device 75 includes a flattening clamp 751 and a flattening platform 752 arranged opposite to each other in the vertical direction. The flattening clamp 751 is located above the second conveying track 741, and the flattening clamp 751 can move up and down relative to the second conveying track 741. The flattening clamp 751 is used to clamp the thick rubber plate 93, and the flattening platform 752 is located below the second conveying track 741.

[0172] In the prior art, the surface replacement process of the chip capacitor is completed on the same thick rubber plate, that is, a needle bed is used to act on the sealed end of the chip capacitor to directly press down from above the plate hole of the thick rubber plate, so that the sealed end of the chip capacitor passes through the center of the plate hole of the thick rubber plate to the bottom of the thick rubber plate, and the unsealed end of the chip capacitor protrudes from the lower surface of the thick rubber plate.

[0173] The above-mentioned surface replacement steps have the following quality problems: 1. The depth of the hole in the thick rubber plate is 8.9mm. Since rubber has the characteristic that "within the same hole diameter, the elasticity and clamping force of the central rubber are greater than those of the edge", the sealed end of the chip capacitor is directly pressed down from the top of the hole in the thick rubber plate, and pressed out through the center of the rubber to the lower surface of the thick rubber plate, which causes excessive friction on the side of the sealed end and easily creates the risk of exposed porcelain on the corners of the chip capacitor; 2. The diameter of the needle bed needle is generally smaller than the diameter of the hole in the thick rubber plate. When the needle head contacts and presses down with the sealed end of the chip capacitor, from the top of the hole through the center of the board to the bottom of the hole, due to the high friction of the center hole, the sealed end is prone to indentation damage.

[0174] Therefore, in order to reduce the damage of the sealed end of the chip capacitor during the face-changing process, the present technical solution proposes a plate-changing mechanism 7, such as Figure 25-29 As shown, through the downward pressure of the clamp in the new board clamping device 73, the ejector pin of the transfer platform 712 penetrates into the plate hole of the thick rubber plate 93 (hereinafter referred to as the "old plate") implanted with the chip capacitor 91, and directly acts on the unsealed end of the chip capacitor 91. After the downward pressure is reset, the sealed end of the chip capacitor 91 protruding from the upper surface of the old plate is accommodated in the plate hole of the hollow thick rubber plate 93 (hereinafter referred to as the "new plate") in the new board clamping device 73, and the unsealed end protrudes from the lower surface of the new plate, thereby completing the surface replacement step of the chip capacitor 91. Figure 30 This solution improves the face-changing step of the chip capacitor 91 from "same board face-changing" to "board-changing" to avoid problems such as exposed corners of the chip capacitor, cracks on the top of the terminal, and chip capacitor being pressed and distorted, thereby ensuring the sealing quality of the chip capacitor.

[0175] Furthermore, the present solution also adds a flattening device 75 for achieving flushness of the unsealed ends after the board replacement step is completed, so as to further ensure the sealing quality of the chip capacitor.

[0176] Specifically, the plate changing process in the plate changing mechanism 7 of this scheme includes the following steps: (1) placing the old plate to be replaced on the top of the transfer platform 712, at this time, the sealed end of the chip capacitor 91 protrudes from the upper surface of the old plate; (2) using the transfer platform 712 to move the old plate to the bottom of the partition frame clamping device 72, and using the clamp of the partition frame clamping device 72 to place the partition frame 94 on the top of the old plate; (3) using the transfer platform 712 to move the old plate to the bottom of the new plate clamping device 73, and at the same time, the clamp of the new plate clamping device 73 is pressed down, and the new plate clamped by the clamp is against the partition frame 94, until the pin of the transfer platform 712 transfers the chip capacitor 91 to the new plate, and the unsealed end of the chip capacitor 91 protrudes from the lower surface of the new plate. (4) Use the clamp of the new plate clamping device 73 to place the new plate on the support bar 742 of the new plate conveying device 74, and use the support bar 742 to convey the new plate to the flattening device 75. Then use the flattening clamp 751 to clamp the new plate and press it down so that the unsealed end protruding from the lower surface of the new plate is against the flattening platform 752 to achieve flattening of the end. At the same time, use the transfer platform 712 to move the partition frame 94 to the bottom of the partition frame clamping device 72, and the clamp of the partition frame clamping device 72 is recovered; then use the transfer platform 712 to move the empty old plate to the bottom of the new plate clamping device 73, and the clamp of the new plate clamping device 73 is recovered. (5) The transfer platform 712 moves to the loading end of the first conveying track 711, waiting for the next old plate to be replaced.

[0177] It should be noted that the clamp of the partition frame clamping device 72, the clamp of the new plate clamping device 73 and the equalizing clamp 751 in this solution are conventional clamps in this field. The above clamps can all achieve clamping and loosening of the clamped objects, and the specific structure of the clamps will not be described here.

[0178] Preferably, the flattening fixture 751 and the leveling fixture 451 have the same structure.

[0179] Preferably, the needle bed conveying device 71 further includes a photoelectric sensor 713, which is mounted on the top of the first conveying track 711 and located between the partition frame clamping device 72 and the new plate clamping device 73;

[0180] The photoelectric sensor 713 is used to detect whether there is any chip capacitor 91 remaining on the upper surface of the thick rubber plate 93 .

[0181] In this way, it can be used to detect whether the ejector pins of the transfer platform 712 are broken, so that timely maintenance can be performed.

[0182] Preferably, the plate changing mechanism 7 further includes a first brush 76 , and the first brush 76 is located between the photoelectric sensor 713 and the new plate clamping device 73 ;

[0183] The first brush 76 is used to clean the upper surface of the thick rubber plate 93 .

[0184] Preferably, the plate changing mechanism 7 further includes a second brush 77 , which is mounted on the bottom of the second conveying track 741 , and is located between the new plate clamping device 73 and the flattening device 75 ;

[0185] The second brush 77 is used to clean the lower surface of the thick rubber plate 93 .

[0186] In order to further ensure the smooth progress of the plate changing and flattening steps, this solution also adds a first brush 76 and a second brush 77 to the plate changing mechanism 7, so as to prevent abnormal products or impurities remaining on the upper and lower surfaces of the thick rubber plate 93 from affecting the plate changing and flattening of the chip capacitor.

[0187] Preferably, the first conveying track 711 and the second conveying track 741 are perpendicular to each other.

[0188] This helps to make the structure of the plate changing mechanism 7 more compact.

[0189] Preferably, the photoelectric sensor 713 is a through-beam photoelectric sensor.

[0190] To further illustrate, the unloading mechanism 8 includes a unloading conveying device 81, a needle bed unloading device 82, a loading conveying device 83, a full material conveying device 84, an empty material box storage rack 85, a full material box storage rack 86 and a material box moving device 87;

[0191] The unloading conveying device 81 includes a unloading conveying frame 811 and a unloading platform 812. The unloading platform 812 is horizontally movably mounted on the top of the unloading conveying frame 811 and is used to hold the thick rubber sheet 93 to be unloaded. A discharge opening 8121 is formed at the bottom of the unloading platform 812, and a discharge notch 8111 is formed in the middle of the unloading conveying frame 811. The discharge opening 8121 and the discharge notch 8111 match each other.

[0192] The needle bed unloading device 82 is mounted above the unloading conveyor frame 811, and the loading and conveying device 83 is arranged below the unloading conveyor frame 811, and the needle bed unloading device 82, the unloading notch 8111 and the unloading end of the loading and conveying device 83 are arranged in sequence from top to bottom; the needle bed unloading device 82 moves up and down relative to the unloading conveyor frame 811, and the needle bed unloading device 82 is used to press the chip capacitor 91 away from the thick rubber plate 93;

[0193] The loading conveyor device 83 and the full material conveyor device 84 are arranged in parallel, and the empty material box storage rack 85, the tray changing end of the loading conveyor device 83 and the loading end of the full material conveyor device 84 are sequentially arranged within the transfer range of the material box moving device 87, and the unloading end of the full material conveyor device 84 is connected to the full material box storage rack 86;

[0194] The empty box storage rack 85 is used to store multiple stacked boxes 95, the loading conveying device 83 and the full conveying device 84 are both used to convey the boxes 95, and the full conveying device 84 is also used to convey the boxes 95 to the full box storage rack 86, and the box moving device 87 is used to transfer the boxes 95.

[0195] In the chip capacitor manufacturing process, the chip capacitors on the end-capping carrier board need to be unloaded into a receiving box after the end-capping process is completed. In common production, only one box is installed on the unloader. With this type of unloader, the box can only be manually taken in and placed, and only one box can be replaced at a time, which may require replacement 10-30 times. This single-box unloading method has the disadvantage of small box capacity and cannot support long-term automatic large-capacity unloading. After the box receives a certain amount of material, it needs to be shut down for processing. The full box needs to be removed manually and replaced with a new one before production can continue. This results in frequent manual operations, time-consuming and labor-intensive operations, and seriously affects the operating efficiency of the entire line, resulting in low production efficiency.

[0196] Therefore, in order to achieve continuous unloading of large-capacity chip capacitors without stopping, this technical solution proposes a unloading mechanism 8, such as Figures 31-35 As shown, it includes a unloading and conveying device 81, a needle bed unloading device 82, a loading and conveying device 83, a full material conveying device 84, an empty material box storage rack 85, a full material box storage rack 86 and a material box moving device 87, wherein the empty material box 95 can be transferred in the empty material box storage rack 85, the loading and conveying device 83, the full material conveying device 84 and the full material box storage rack 86 in sequence, so that the unloading mechanism 8 of this scheme can realize the automatic loading of empty material boxes and the automatic unloading of full material boxes filled with chip capacitors, thereby overcoming the technical defects of the single material box unloading method in the prior art, that is, the material box capacity is small and it cannot support long-term automatic large-capacity unloading.

[0197] Specifically, the unloading process of the unloading mechanism 8 of this scheme includes the following steps: (1) the thick rubber plate 93 to be unloaded is rotated from the previous process to the top of the unloading platform 812, and at this time the end of the chip capacitor implanted in the thick rubber plate 93 protrudes from its lower surface, and the unloading port 8121 is used to avoid the above-mentioned chip capacitor; (2) the thick rubber plate 93 to be unloaded is moved to the bottom of the needle bed unloading device 82 by using the unloading platform 812; at the same time, the empty material box 95 is moved from the empty material box storage rack 85 to the disc changing end of the loading and conveying device 83 by using the material box moving device 87, and the above-mentioned empty material box is conveyed to its unloading end by the loading and conveying device 83; (3) the needle bed unloading device 82 moves downward relative to the unloading conveying rack 811 The chip capacitors 91 are moved and pressed away from the thick rubber plate 93, and the chip capacitors after unloading pass through the unloading notch 8111 and fall into the empty material box at the unloading end of the loading and conveying device 83; (4) After the empty material box at the unloading end of the loading and conveying device 83 is filled with chip capacitors (hereinafter referred to as "full material box"), it is transported to its tray changing end by the loading and conveying device 83; (5) The full material box is moved from the tray changing end of the loading and conveying device 83 to the full material conveying device 84 by the material box moving device 87, and is transported to the full material box storage rack 86 for storage by the full material conveying device 84; at the same time, the new empty material box is moved from the empty material box storage rack 85 to the tray changing end of the loading and conveying device 83 by the material box moving device 87 for the next round of unloading and receiving, and the cycle is repeated.

[0198] Preferably, the unloading and conveying device 81 further includes a limit frame 813, which is installed in the middle of the unloading and conveying frame 811, and the unloading notch 8111 is opened in the middle of the limit frame 813;

[0199] The material conveying device 83 includes a material conveying frame 831, a material loading platform 832 and a material box lifting seat 833. The material loading platform 832 is horizontally movably mounted on the top of the material conveying frame 831, and the material loading platform 832 is used to hold the material box 95; the material box lifting seat 833 is vertically movably mounted on the unloading end of the material conveying frame 831, and the material box lifting seat 833 is located directly below the unloading notch 8111.

[0200] The material box lifting seat 833 is used to lift the material box 95 and make the material box 95 collide with the limiting frame 813.

[0201] In a preferred embodiment of the present technical solution, the unloading conveyor device 81 is further provided with a limit frame 813, and the loading conveyor device 83 is provided with a material box lifting seat 833 for realizing the up and down movement of the material box 95. Specifically, when the material box 95 is transported to the unloading end by the loading platform 832 of the loading conveyor device 83 for unloading and receiving, the material box 95 can first be lifted by the material box lifting seat 833 until it contacts the bottom of the limit frame 813, thereby effectively shortening the unloading drop distance of the chip capacitor 91 and avoiding adverse effects on the sealing quality of the chip capacitor during the unloading process.

[0202] Preferably, the full material conveying device 84 includes a full material conveying frame 841 and a material unloading push block 842;

[0203] A plurality of rotatable conveying wheels 8411 are provided on both sides of the top of the full material conveying frame 841, and the rotating shafts of the conveying wheels 8411 are perpendicular to the conveying direction of the full material conveying device 84;

[0204] The unloading push block 842 can be horizontally movably installed on the top of the full material conveying rack 841, and the unloading push block 842 is set close to the loading end of the full material conveying rack 841. The unloading push block 842 is used to push the fully loaded material box 95 to the full material box storage rack 86.

[0205] In another preferred embodiment of the present invention, the full material conveyor device 84 includes a full material conveyor frame 841 and a material discharge push block 842, and a plurality of rotatable conveyor wheels 8411 are provided on both sides of the top of the full material conveyor frame 841. When a full material box is moved from the tray-changing end of the material-carrying conveyor device 83 to the full material conveyor device 84 by the box moving device 87, the full material box can be conveniently and easily moved to the full material box storage rack 86 by the interaction of the material discharge push block 842 and the conveyor wheels 8411, thereby achieving a simple structure and reliable performance.

[0206] Preferably, the material box moving device 87 includes a moving crossbeam 871, an empty material box feeding clamp 872 and a full material box unloading clamp 873;

[0207] The movable crossbeam 871 is installed above the material-carrying conveying device 83 and the full-material conveying device 84, and the extending direction of the movable crossbeam 871 is perpendicular to the conveying direction of the material-carrying conveying device 83;

[0208] The empty box loading clamp 872 and the full box unloading clamp 873 can both be mounted on the movable beam 871 in a horizontally movable manner, and the empty box loading clamp 872 and the full box unloading clamp 873 can both move up and down relative to the movable beam 871;

[0209] The empty box loading clamp 872 is used to transfer the box 95 located on the empty box storage rack 85 to the tray changing end of the loading and conveying device 83, and the full box unloading clamp 873 is used to transfer the box 95 located on the tray changing end of the loading and conveying device 83 to the loading end of the full material conveying device 84.

[0210] Specifically, the material box moving device 87 used to realize the material box 95 in this solution includes an empty material box loading clamp 872 for moving the empty material box and a full material box unloading clamp 873 for moving the full material box. The setting of the two clamps can effectively increase the moving speed of the material box 95, thereby improving the replacement efficiency of the material box 95.

[0211] It should be noted that the empty box loading clamp 872 and the full box unloading clamp 873 in this solution are conventional clamps in this field. The above clamps can clamp and release the clamped objects, and the specific structure of the clamps will not be described here.

[0212] Preferably, the empty box loading clamp 872 and the full box unloading clamp 873 move synchronously, and the empty box storage rack 85 moves up and down relative to the moving beam 871.

[0213] As a better embodiment of the above, in order to further improve the replacement efficiency of the material box 95, this solution optimizes the structure of the material box moving device 87 and the empty material box storage rack 85, that is, the empty material box storage rack 85 moves up and down relative to the moving beam 871, and through its up and down movement, the material picking surface of the empty material box storage rack 85 is made flush with the conveying surface of the loading conveying device 83 and the full material conveying device 84, so that the empty material box and the full material box can be moved synchronously, greatly improving the replacement speed of the material box 95.

[0214] Preferably, a plurality of storage positions are provided inside the full box storage rack 86 in the vertical direction, and the full box storage rack 86 moves up and down relative to the full box conveying rack 841 .

[0215] In a preferred embodiment of this technical solution, the full-box storage rack 86 is provided with multiple storage locations in the vertical direction, and can be moved up and down relative to the full-box conveyor rack 841. This effectively reduces the space occupied by the full-box storage rack 86 while achieving large-capacity storage of chip capacitors. Furthermore, the up and down movement of the full-box storage rack 86 can always ensure that the conveying surface of the full-box conveyor device 84 is flush with the top of the corresponding storage location, making it easier for the full-box conveyor device 84 to horizontally convey the full boxes to the full-box storage rack 86 for storage.

[0216] Preferably, the full box storage rack 86 is provided in plurality, and the plurality of full box storage racks 86 are arranged in parallel;

[0217] The full box storage rack 86 can move horizontally relative to the full material conveying rack 841 , and the moving direction of the full box storage rack 86 and the extending direction of the full material conveying rack 841 are perpendicular to each other.

[0218] As a better embodiment of the above embodiment, a plurality of full box storage racks 86 are provided and can be horizontally moved relative to the full material conveying rack 841, thereby further improving the full box storage capacity of the unloading mechanism 8.

[0219] Preferably, the needle bed unloading device 82 includes a needle bed unloading seat 821 and a unloading plate 822, and the unloading plate 822 is installed below the needle bed unloading seat 821 by spring extension; a plurality of pressing needles are protruding from the lower surface of the needle bed unloading seat 821, and a plurality of through holes are opened on the plate surface of the unloading plate 822, and one pressing needle corresponds to one through hole, and the through hole is used for the pressing needle to pass through the unloading plate 822.

[0220] Preferably, the unloading mechanism 8 further includes a thick rubber sheet recovery device, and the thick rubber sheet recovery device is disposed near the unloading end of the unloading conveyor device 81. In one embodiment, the thick rubber sheet recovery device includes a clamp (not shown) and a thick rubber sheet recovery rack (not shown). The clamp is used to clamp the unloaded thick rubber sheet 93 to the thick rubber sheet recovery rack, and the thick rubber sheet recovery rack is used to store the thick rubber sheets.

[0221] In another embodiment, the thick rubber plate recovery device is a thick rubber plate conveyor line 88, such as Figure 1 As shown, the thick rubber sheet conveyor line 88 is used to convey the unloaded thick rubber sheets 93, and the unloading conveyor device 81, the thick rubber sheet conveyor line 88, and the thick rubber sheet storage rack in the assembly mechanism are sequentially connected. It should be noted that the thick rubber sheet conveyor line 88 of this solution is a conventional conveying device in the art, and its structure is not described in detail here.

[0222] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A chip capacitor termination production line based on thick rubber plate, characterized by: It includes an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling and storage mechanism, a plate changing mechanism, a discharging mechanism and a transfer clamp; The immersion mechanism, the drying mechanism, and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, one immersion mechanism, one drying mechanism, one cooling storage mechanism, the plate changing mechanism, another immersion mechanism, another drying mechanism, another cooling storage mechanism, and the unloading mechanism are provided in sequence; The assembly mechanism is used to place the lead-in plate on top of the thick rubber plate to form an assembly; The transporting clamps are provided in plurality, and are used to clamp and move the thick rubber sheet; The implantation mechanism comprises a mounting base, a mounting seat, an implantation device, an implantation delivery device and a motor vibration device; The mounting seat is mounted on the top of the mounting base, and the top center of the mounting base is rotatably connected to the bottom center of the mounting seat via a bearing seat, and the mounting seat swings relative to the mounting base; The implantation device and the implantation delivery device are both mounted above the mounting seat, and the implantation delivery device is located inside the implantation device; the implantation delivery device is used to deliver the assembly to the implantation device, and the delivery direction of the implantation delivery device is parallel to the swing direction of the mounting seat; The motor vibration device is installed at the bottom of the mounting base, and the output end of the motor vibration device is connected to the implant device, and the motor vibration device is used to drive the implant device to vibrate relative to the mounting base; The implant device includes an implant base, an implant top plate, and an implant frame, which are sequentially spaced from bottom to top. The implant base and the implant frame are connected by a vertically extending support column. The implant top plate is movably disposed between the implant base and the implant frame, and the conveying surface of the implant conveying device is located above the implant top plate. The bottom of the implantation frame includes a holding position and an avoidance position, and the holding position and the avoidance position are connected in sequence along a direction perpendicular to the transport direction of the implantation delivery device; the holding position is used to hold the chip capacitor to be implanted, and the implantation top plate is used to offset the lead-in plate to be implanted with the avoidance position.

2. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The assembly mechanism includes a thick rubber plate storage rack, an introduction plate storage rack and a plate taking device; The thick rubber plate storage rack is used to store thick rubber plates, the import plate storage rack is used to store import plates, and the plate taking device is used to move the import plates.

3. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The pressing mechanism includes a detection and conveying device, a first cleaning device, a detection device, a pressing and conveying device and a needle bed pressing device; The detection conveying device and the pressing conveying device are connected end to end in sequence, and the pressing conveying device moves up and down relative to the detection conveying device, and the needle bed pressing device is located inside the pressing conveying device; The first cleaning device and the detection device are sequentially arranged on the detection conveyor device along the conveying direction of the detection conveyor device, and the detection conveyor device is used to convey the assembly, the first cleaning device is used to clean the upper surface of the assembly, and the detection device is used to detect whether there is foreign matter on the upper surface of the assembly placed on the detection conveyor device; The needle bed pressing device includes an upper platform and a lower platform arranged opposite to each other in the vertical direction, and the upper platform is located above the lower platform. The upper platform moves up and down relative to the lower platform. The holding surface of the lower platform is located within the up and down movement range of the pressing and conveying device. The upper platform is used to press the chip capacitor located in the import board in the assembly into the board hole of the thick rubber plate.

4. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The leveling mechanism includes a leveling conveying device, a lifting platform, a feeding belt, a turning device, an inlet plate recovery device and a leveling device; The leveling conveying device includes a conveying frame and a conveying tray, wherein the conveying tray is horizontally movably mounted on the top of the conveying frame, and the conveying tray is used to hold thick rubber sheets; The jacking platform, the feeding belt, the turning device and the introduction plate recovery device are sequentially arranged at the feeding end of the conveyor frame from bottom to top, and the jacking platform and the feeding belt are both located at the inner bottom of the conveyor frame, and the turning device and the introduction plate recovery device are both arranged at the top of the conveyor frame; The jacking platform can move up and down relative to the feeding belt and the turning device, and the jacking platform can pass through the feeding belt and the conveying surface of the leveling conveyor device; the conveying tray is U-shaped, and an avoidance opening is opened in the middle of the conveying tray, and the avoidance opening is used to avoid the jacking platform; The leveling device is located in front of the flipping device, and the leveling device includes a leveling clamp and a leveling platform arranged opposite to each other in the vertical direction. The leveling clamp is located above the conveyor frame, and the leveling clamp can move up and down relative to the conveyor frame. The leveling platform is located below the conveyor frame, and the leveling clamp is used to clamp the thick rubber plate.

5. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The slurry dipping mechanism includes a slurry dipping device, a transfer conveying platform, a transfer clamping claw, a pre-drying device, a pre-cooling device, a material unloading conveying platform and a material feeding clamping claw; The transfer conveyor, the pre-drying device, the pre-cooling device and the unloading conveyor are sequentially connected end to end, and the transfer conveyor moves up and down relative to the pre-drying device, and the unloading conveyor moves up and down relative to the pre-cooling device; The immersion device is provided with at least two groups, and the loading ends and the unloading conveying platforms of all the immersion devices are located within the moving range of the feeding clamps, and the feeding clamps are used to realize the transfer of thick rubber sheets between the loading ends and the unloading conveying platforms of the immersion devices; the unloading ends and the transfer conveying platforms of all the immersion devices are located within the moving range of the transfer clamps, and the transfer clamps are used to realize the transfer of thick rubber sheets between the unloading ends and the transfer conveying platforms of the immersion devices.

6. The thick rubber plate-based chip capacitor termination production line according to claim 5, characterized in that: The slurry dipping device includes a mounting frame, a slurry tray, a slurry spreading assembly, a slurry dipping fixture and a loading tray; The mounting frame includes a support base and a conveying bracket; The support seat is mounted above the paddle disc, and the paddle disc moves horizontally relative to the support seat; the conveying bracket is horizontally extended and mounted on the support seat, and the extending direction of the conveying bracket is parallel to the moving direction of the paddle disc, and the conveying bracket is located above the paddle disc; The slurry spreading assembly is installed on one side of the support seat, and the slurry spreading assembly is located on the top of the slurry pan; the slurry spreading assembly moves up and down relative to the slurry pan, and the slurry spreading assembly is used to lay a slurry layer on the top of the slurry pan; The loading tray is horizontally movably mounted on the conveying bracket; The slurry dipping fixture is mounted on the support seat so as to be movable up and down, and the upper limit of movement of the slurry dipping fixture is located above the conveying bracket, and the lower limit of movement of the slurry dipping fixture is located above the slurry tray.

7. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The cooling storage mechanism includes a cooling cover, a lifting device, a cold air delivery head and a circulating fan; the bottom and top of the cooling cover are both provided with openings, the lifting device is arranged inside the cooling cover, and the inlet of the lifting device protrudes from the bottom of the cooling cover, and the lifting device is used to transport the thick rubber plate upward in the vertical direction; The cold air delivery head is connected to the cooling cover, and the air inlet end of the cold air delivery head is connected to a cold air source; The circulating fan is installed between the cooling cover and the lifting device, and the circulating fan is located below the cold air delivery head.

8. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The plate changing mechanism includes a needle bed conveying device, a partition frame clamping device, a new plate clamping device, a new plate conveying device and a flattening device; The needle bed conveying device includes a first conveying track and a transfer platform, the transfer platform is horizontally movably mounted on the first conveying track; the transfer platform includes a platform mounting seat for placing a thick rubber plate and a mesh plate, the mesh plate is mounted above the platform mounting seat by spring expansion and contraction; a plurality of ejector pins are protruding from the upper surface of the platform mounting seat, the mesh plate has a plurality of mesh holes, and one ejector pin corresponds to one mesh hole, and the mesh holes are used for the ejector pins to pass through the mesh plate; The partition frame clamping device and the new plate clamping device are sequentially mounted above the end of the first conveying track along the conveying direction of the transfer platform, the partition frame clamping device is used to clamp the partition frame, and the new plate clamping device is used to clamp the empty thick rubber plate, and the clamps of the partition frame clamping device and the new plate clamping device can both move up and down relative to the transfer platform; The new board conveying device includes a second conveying track and supporting bars, the supporting bars are horizontally movably installed on both sides of the interior of the second conveying track; the loading end of the second conveying track and the end of the first conveying track are sequentially arranged below the clamp of the new board clamping device from top to bottom, and the clamp of the new board clamping device can pass through the conveying surface of the second conveying track; The flattening device is arranged at the end of the second conveying track. The flattening device includes a flattening clamp and a flattening platform arranged opposite to each other in the vertical direction. The flattening clamp is located above the second conveying track and can move up and down relative to the second conveying track. The flattening clamp is used to clamp the thick rubber plate, and the flattening platform is located below the second conveying track.

9. The thick rubber plate-based chip capacitor termination production line according to claim 1, characterized in that: The unloading mechanism includes a unloading conveying device, a needle bed unloading device, a loading conveying device, a full material conveying device, an empty material box storage rack, a full material box storage rack and a material box moving device; The unloading and conveying device includes a unloading and conveying frame and an unloading platform. The unloading platform is horizontally movably mounted on the top of the unloading and conveying frame, and the unloading platform is used to hold the thick rubber sheet to be unloaded. A discharge port is provided at the bottom of the unloading platform, and a discharge notch is provided in the middle of the unloading and conveying frame, and the discharge port and the discharge notch match each other. The needle bed unloading device is mounted above the unloading conveying frame, and the loading and conveying device is arranged below the unloading conveying frame, and the needle bed unloading device, the unloading notch and the unloading end of the loading and conveying device are arranged in sequence from top to bottom; the needle bed unloading device moves up and down relative to the unloading conveying frame, and the needle bed unloading device is used to press the chip capacitor away from the thick rubber plate; The loading conveyor device and the full material conveyor device are arranged in parallel, and the empty material box storage rack, the tray changing end of the loading conveyor device and the loading end of the full material conveyor device are sequentially arranged within the transfer range of the material box moving device, and the unloading end of the full material conveyor device is connected to the full material box storage rack; The empty box storage rack is used to store multiple stacked boxes, the loading conveying device and the full conveying device are both used to convey boxes, and the full conveying device is also used to convey boxes to the full box storage rack, and the box moving device is used to transfer boxes.

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