Organic silicon pouring sealant and preparation method thereof

Abstract

The invention discloses an organic silicon pouring sealant. The organic silicon pouring sealant is prepared from a component A and a component B, the component A is prepared from vinyl silicone oil, a platinum catalyst, a plasticizer, a silane coupling agent and filler; the component B is prepared from vinyl silicone oil, hydrogen-containing silicone oil, filler, a tackifier, a silane coupling agent, an inhibitor, a flatting agent and a defoaming agent. The heat-conducting filler is matched with aluminum oxide with two particle sizes of 4 mu m and 8 mu m according to the mass ratio of 3: 7, and the optimal powder stacking density can be obtained by reasonably matching aluminum oxide with different particle sizes, namely the larger the contact area between powder is, the higher the heat conductivity of the material is, and the heat-conducting property of the pouring sealant can be improved; the aluminum hydroxide and the magnesium hydroxide are compounded into the flame-retardant filler according to the mass ratio of 1: 1, and the flame-retardant mechanism is mainly dehydration and heat absorption, so that the dosage of the flame-retardant filler can be reduced by compounding the aluminum hydroxide and the magnesium hydroxide according to the mass ratio of 1: 1, the density of the pouring sealant is reduced, and the flame-retardant effect can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicone potting adhesives, and particularly to a silicone potting adhesive and a preparation method thereof. Background Art

[0002] As a high-performance sealing and protection material, silicone potting adhesives are sealing adhesive materials widely used in the fields of electronics, electrical appliances, LEDs, display screens, igniters, circuit boards, etc. During the processing of electronic components, the silicone potting adhesives are poured into devices containing electronic components and circuits by equipment or manually. The silicone potting adhesives will cure into thermosetting polymer insulating materials with excellent performance, so as to achieve the purposes of bonding, sealing, potting and coating protection. Potting can enhance the integrity of electronic components and improve their resistance to external impacts and vibrations. Silicone potting adhesives can improve the insulation performance between internal components and circuits, reduce the risks of short circuits and electric leakage. Potting can prevent components and circuits from being directly exposed to the external environment, improve the waterproof, moisture-proof and corrosion-proof performance of devices. Potting can stabilize the performance parameters of electronic components and improve their stability and reliability during use. By using silicone potting adhesives to protect electronic components, the silicone potting adhesives have extremely high electrical insulation performance, can effectively protect electronic components from the influence of external electromagnetic interference and electrical short circuits, and improve the reliability and service life of electronic components;

[0003] At the present stage, the electrical performance of silicone potting adhesives and their preparation methods is poor. Due to the influence of various factors such as materials and processes, from the perspective of caulking materials, the types, particle sizes, distributions, etc. of fillers will all affect the electrical performance of potting adhesives. Unreasonable filler selection or excessive or insufficient addition amounts may all lead to a decline in electrical performance, resulting in problems such as insufficient hardness of the cured colloid, decreased bonding performance, poor heat conduction performance on the surface of electronic components, and the risk of explosion due to overheating of electronic components. Summary of the Invention

[0004] The purpose of the present invention is to provide a silicone potting adhesive and a preparation method thereof to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A silicone potting adhesive, wherein the silicone potting adhesive is composed of component A and component B; component A is composed of the following mass percentages: 35% - 45% vinyl silicone oil, 0.02% - 0.2% platinum catalyst, 20% - 25% plasticizer, 0.1% - 0.5% silane coupling agent, 35% - 45% filler;

[0007] The B component consists of the following components by mass percentage: 8% - 12% vinyl silicone oil, 40% - 60% hydrogen-containing silicone oil, 20% - 35% filler, 5% - 15% tackifier, 0.5% - 2% silane coupling agent, 0.1% - 0.5% inhibitor, 0.1% - 1% leveling agent, 0.1% - 0.5% defoaming agent;

[0008] Among them, the silane coupling agent is KH570, the inhibitor is ethynylcyclohexanol, the leveling agent is organically modified polysiloxane, and the defoaming agent is a self-emulsifying and self-dispersing defoaming agent;

[0009] Preferably, the vinyl silicone oil has a viscosity of 1000 mPa·s and a vinyl content of 0.3%.

[0010] Preferably, the hydrogen-containing silicone oil has a viscosity of 300 mPa·s and a hydrogen content of 0.2%.

[0011] Preferably, the platinum content in the platinum catalyst is 0.5%.

[0012] Preferably, the heat-conducting filler is aluminum oxide, and two kinds of aluminum oxide with particle sizes of 4 μm and 8 μm are used in a ratio of 3:7.

[0013] Preferably, the flame-retardant filler is a compound of aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:1.

[0014] A method for preparing an organosilicon potting adhesive, comprising the following steps:

[0015] Step 1: The A-component adhesive is selected according to the mass percentage of each component: 40% vinyl silicone oil, 0.1% platinum catalyst, 22% methyl silicone oil, 0.4% KH570, 37.5% filler, and weighed according to the sum of the mass percentages being 1;

[0016] The B-component adhesive is selected according to the mass percentage of each component: 9.5% vinyl silicone oil, 48% hydrogen-containing silicone oil, 30% filler, 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent, 0.3% defoaming agent, and weighed according to the sum of the mass percentages being 1;

[0017] Step 2: Preparation of platinum catalyst. In a three-necked flask equipped with a reflux condenser, add 10 parts of H2Pt-C16·6H20, 20 parts of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 50 parts of C2H5OH and 20 parts of NaHCO3 in proportion, introduce nitrogen, heat and stir under reflux at 60 °C for 2 h. After the reaction is completed, let it stand to room temperature, and then perform a filtration operation to remove solid impurities and low-boiling substances. The precipitate is washed with ethanol, and the filtrate and washing solution are combined. After rotary evaporation to remove the solvent, a platinum-tetramethyltetravinylcyclotetrasiloxane complex catalyst, that is, the platinum catalyst, is obtained.

[0018] Step 3: Put aluminum oxide with two particle sizes of 4 μm and 8 μm used in a ratio of 3:7 into an electrothermal constant temperature forced air drying oven and dry at 100 °C for 3 h.

[0019] Step 4: Take out the dried aluminum oxide in Step 3 and pour it into a high-speed mixer. Under the stirring state of 1500 r / min, add 0.4% KH570 and an isopropanol / toluene solution with a mass fraction of 20% in a spray form, raise the temperature to 110 °C and continue stirring for 30 min. Take it out and dry at 110 °C for 4 h, then cool to obtain modified aluminum oxide, which is sealed and stored for later use.

[0020] Step 5: Add hydrogen-containing cyclic body and KH-560 to a four-necked beaker in sequence, raise the temperature to 120 °C and react for 2 h. After cooling, remove low-boiling substances under reduced pressure, and then raise the temperature to 100 °C to obtain tackifier A. Use 0.5% tackifier A and 1% boron-modified tackifier in a compounded manner.

[0021] Step 6: Preparation of Component A glue. Pour 40% vinyl silicone oil into a vacuum kneader, add 0.1% platinum catalyst to the 40% vinyl silicone oil and disperse it evenly. Then add the modified aluminum oxide in Step 3 and a flame retardant filler compounded with aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:1 into the kneader and mix evenly. Mix at low temperature and normal pressure for 1 h, then treat at 160 °C for 2 h, evacuate for 2 h, and then further disperse evenly with a three-roll mill to obtain Component A glue.

[0022] Step 7: Preparation of Component B glue. Add 9.5% vinyl silicone oil, 55% hydrogen-containing silicone oil and 30% filler into a vacuum kneader, turn on the vacuum pump for preliminary mixing. After mixing evenly, add to the kneader in a ratio of 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent and 0.3% defoamer, and continue to mix until completely uniform. Mix at low temperature and normal pressure for 1 h, then treat at 160 °C for 2 h, evacuate for 2 h, and then further disperse evenly with a three-roll mill to obtain Component B glue.

[0023] Step 8: Mix Component A and Component B to prepare the glue in a ratio of 1:1, stir for 2 - 5 minutes under the condition of a rotation speed of 1500 - 2000 revolutions per minute. After stirring evenly, subject the glue material to vacuum degassing treatment, maintain it for 3 - 6 minutes after defoaming, and finally release the vacuum to obtain the silicone potting compound.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: By using aluminum oxide as the thermal conductive filler and using two kinds of aluminum oxide with particle sizes of 4μm and 8μm in a mass ratio of 3:7, the best powder packing density can be obtained by reasonably using aluminum oxide with different particle sizes. That is, the larger the contact area between the powders, the higher the thermal conductivity of the material, which can improve the thermal conductivity of the potting compound, ensure timely heat dissipation from the surface of electronic components, and eliminate the risk of explosion due to overheating of electronic components. Aluminum oxide can effectively improve the electrical insulation performance of the potting compound, not only having high resistivity and dielectric strength, but also improving the heat resistance and mechanical strength of the potting compound;

[0025] By using aluminum hydroxide and magnesium hydroxide as the flame retardant filler and compounding them in a mass ratio of 1:1, the decomposition temperature of aluminum hydroxide is 250°C and it absorbs 1965 J / g of heat. The decomposition temperature of magnesium hydroxide is above 300°C. Aluminum hydroxide and magnesium hydroxide have good flame retardant properties, and their flame retardant mechanism is mainly dehydration and heat absorption. When the temperature reaches the decomposition temperature of aluminum hydroxide, first, aluminum hydroxide will absorb a large amount of heat to achieve a flame retardant effect. When the temperature further rises, the dehydration of magnesium hydroxide will also play a certain flame retardant effect. Therefore, the compounding use of the two in a ratio of 1:1 can reduce the dosage of the flame retardant filler and the density of the potting compound. In addition, the platinum catalyst also has a certain flame retardant effect. The combined action of the three can effectively improve the flame retardant effect and further reduce the density and viscosity of the potting compound;

[0026] Under the action of the platinum catalyst, the silicon - hydrogen bond in the hydrogen - containing cyclic siloxane reacts with the epoxy group in KH - 560 to form an organosilicon compound containing new functional groups. The organosilicon compound containing new functional groups is compounded with the boron - modified tackifier, which greatly improves the adhesiveness of the potting compound. At the same time, it can also bond a variety of substrates without poisoning phenomenon. Moreover, the silicon - hydrogen bond reacts with the vinyl group of vinyl silicone oil through hydrosilylation to cure, making its molecules contain a large number of active groups such as alkoxy groups and epoxy groups. The active groups can improve the bonding ability of the potting compound to the substrate. The improvement of the bonding performance of the potting compound helps to prevent water vapor from penetrating into the electronic device, ensuring that the electronic components are not affected by rain and snow weather during outdoor operation, thereby extending the service life of the electronic components and enhancing the reliability of the electronic components. Description of the Drawings

[0027] Figure 1 It is a flow chart of the preparation method of the silicone potting compound of the present invention;

[0028] Figure 2 Flow chart for preparing the platinum catalyst of the present invention;

[0029] Figure 3 Flow chart for preparing the modified aluminum oxide of the present invention;

[0030] Figure 4 Flow chart for compounding the tackifier of the present invention;

[0031] Figure 5 Flow chart for preparing the component A glue of the present invention;

[0032] Figure 6 Flow chart for preparing the component B glue of the present invention;

[0033] Figure 7 Flow chart for preparing the glue mixing of component A and component B of the present invention. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment

[0036] Please refer to Figure 1-7 , an embodiment provided by the present invention: an organosilicon potting adhesive, which is composed of component A and component B; Component A is composed of the following mass percentages: 35%-45% vinyl silicone oil, 0.02%-0.2% platinum catalyst, 20%-25% plasticizer, 0.1%-0.5% silane coupling agent, 35%-45% filler;

[0037] Component B is composed of the following mass percentages: 8%-12% vinyl silicone oil, 40%-60% hydrogen-containing silicone oil, 20%-35% filler, 5%-15% tackifier, 0.5%-2% silane coupling agent, 0.1%-0.5% inhibitor, 0.1%-1% leveling agent, 0.1%-0.5% defoaming agent;

[0038] Among them, the silane coupling agent uses KH570, the inhibitor uses ethynylcyclohexanol, the leveling agent uses organically modified polysiloxane, the defoaming agent uses a self-emulsifying and self-dispersing defoaming agent, which is mainly composed of an organosilicon surfactant copolymerized from polysiloxane and polyether. The fillers in component A and component B are composed of heat-conducting fillers and flame-retardant fillers;

[0039] Furthermore, the viscosity of the vinyl silicone oil is 1000 mPa·s, and the vinyl content is 0.3%.

[0040] Furthermore, the viscosity of the hydrogen-containing silicone oil is 300 mPa·s and the hydrogen content is 0.2%.

[0041] Furthermore, the platinum content in the platinum catalyst is 0.5%.

[0042] Furthermore, the heat-conducting filler is aluminum oxide, and two kinds of aluminum oxide with particle sizes of 4 μm and 8 μm are used in a ratio of 3:7.

[0043] Furthermore, the flame-retardant filler is a compound of aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:1. The decomposition temperature of aluminum hydroxide is 250°C and the heat absorption is 1965 J / g. The decomposition temperature of magnesium hydroxide is above 300°C.

[0044] A method for preparing an organosilicon potting adhesive, comprising the following steps:

[0045] Step 1: For component A glue, the mass percentages of each component are respectively: 40% vinyl silicone oil, 0.1% platinum catalyst, 22% methyl silicone oil, 0.4% KH570, 37.5% filler. They are selected and weighed according to the sum of the mass percentages being 1.

[0046] For the preparation of component B glue, the mass percentages of each component are respectively: 9.5% vinyl silicone oil, 48% hydrogen-containing silicone oil, 30% filler, 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent, 0.3% defoamer. They are selected and weighed according to the sum of the mass percentages being 1.

[0047] Step 2: For the preparation of the platinum catalyst, in a three-necked flask equipped with a reflux condenser, 10 parts of H2Pt-C16·6H20, 20 parts of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 50 parts of C2H5OH and 20 parts of NaHCO3 are added in proportion, nitrogen is introduced, and the mixture is heated and stirred under reflux at 60°C for 2 h. Heating is used to increase the activity of the reactants so that they are more likely to undergo chemical reactions. Stirring helps the uniform distribution of the reactants in the solution and improves the reaction efficiency. Reflux can ensure the mixing of the reaction. After the reaction is completed, it is left to stand at room temperature, and then a filtration operation is carried out to remove solid impurities and low-boiling substances. The precipitate is washed with ethanol, the filtrate and the washing liquid are combined, and the solvent is removed by rotary evaporation to obtain a platinum-tetramethyltetravinylcyclotetrasiloxane complex catalyst, that is, the platinum catalyst.

[0048] Among them, 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, abbreviated as D4V, has saturated hydrocarbon groups in the form of methyl groups, while vinyl groups contain carbon-carbon double bonds. Its molecular structure contains four silicon atoms, each of which is connected to a methyl group (-CH3) and a vinyl group (-CH=CH2), and is connected into a ring structure through silicon-oxygen bonds (-Si-O-);

[0049] C2H5OH, as an ethanol solvent, helps dissolve and mix the reactants;

[0050] NaHCO3, sodium bicarbonate, is used to adjust the pH value of the reaction system to promote the reaction;

[0051] Before heating and stirring, nitrogen is introduced to remove the air in the reaction system. At the same time, nitrogen forms an inert atmosphere to protect the reaction system from external interference;

[0052] Step 3: Put aluminum oxide with two particle sizes of 4 μm and 8 μm used in a ratio of 3:7 into an electrothermal constant temperature forced air drying oven, dry it at 100 °C for 3 h, and perform heat treatment on aluminum oxide at a certain temperature, which can promote the crystal form transformation, such as from γ-Al2O3 to the more stable α-Al2O3;

[0053] Step 4: Take out the dried aluminum oxide in Step 3 and pour it into a high-speed mixer. Under the stirring state of 1500 r / min, add 0.4% KH570 and an isopropanol / toluene solution with a mass fraction of 20% in the form of spraying. The isopropanol / toluene solution with a mass fraction of 20% is used to dilute the silane coupling agent to promote its uniform dispersion. Heat up to 110 °C and continue stirring for 30 min, take out, dry at 110 °C for 4 h, cool, and obtain modified aluminum oxide, which is sealed and stored for later use;

[0054] Step 5: Add hydrogen-containing cyclic body and KH-560 to a four-necked beaker in sequence, heat up to 120 °C and react for 2 hours, cool down and remove low-boiling substances under reduced pressure, then heat up to 100 °C to obtain tackifier A. Use 0.5% tackifier A and 1% boron-modified tackifier in a compound manner. Tackifier A has good adhesiveness to various materials under heating conditions, especially for non-metallic materials. The boron-modified tackifier has good adhesiveness to metals. The two are used in combination, and can bond a variety of substrates;

[0055] Step 6: Preparation of Component A glue. Pour 40% vinyl silicone oil into a vacuum kneader. Add 0.1% platinum catalyst to the 40% vinyl silicone oil and disperse it evenly. Then add the modified aluminum oxide in Step 3 and the flame retardant filler prepared by compounding aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:1 into the kneader and mix evenly. Mix at low temperature and normal pressure for 1 hour, then treat at 160°C for 2 hours, evacuate for 2 hours, and then further disperse evenly with a three-roll grinder to obtain Component A glue;

[0056] Step 7: Preparation of Component B glue. Add 9.5% vinyl silicone oil, 55% hydrogen-containing silicone oil and 30% filler into a vacuum kneader, turn on the vacuum pump for preliminary mixing. After mixing evenly, add to the kneader according to the ratio of 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent and 0.3% defoaming agent, and continue to mix until completely uniform. Mix at low temperature and normal pressure for 1 hour, then treat at 160°C for 2 hours, evacuate for 2 hours, and then further disperse evenly with a three-roll grinder to obtain Component B glue;

[0057] Step 8: Mix Component A and Component B in a ratio of 1:1. Stir at a speed of 1500 - 2000 revolutions per minute for 2 - 5 minutes. The stirrer should be placed slightly below the center of the liquid surface, and the depth of the stirrer in the glue liquid should be 1 / 2 - 2 / 3 of the liquid surface height. After mixing evenly, subject the glue material to vacuum degassing treatment. During the vacuum degassing process, the liquid level of the mixture rises to 3 - 4 times the original volume, and then automatically collapses after defoaming. Maintain for 3 - 6 minutes after defoaming to completely remove the bubbles. Finally, release the vacuum to obtain the silicone potting glue. The Si-H in the hydrogen-containing silicone oil and the Si-Vi in the vinyl silicone oil undergo a hydrosilylation reaction under the action of the platinum catalyst to generate Si-Et at 1258 cm-1, thereby realizing the curing of the potting glue.

[0058] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A silicone potting adhesive, characterized in that, The silicone potting adhesive is composed of component A and component B; component A is composed of the following mass percentages: 35% - 45% vinyl silicone oil, 0.02% - 0.2% platinum catalyst, 20% - 25% plasticizer, 0.1% - 0.5% silane coupling agent, 35% - 45% filler; Component B is composed of the following mass percentages: 8% - 12% vinyl silicone oil, 40% - 60% hydrogen-containing silicone oil, 20% - 35% filler, 5% - 15% tackifier, 0.5% - 2% silane coupling agent, 0.1% - 0.5% inhibitor, 0.1% - 1% leveling agent, 0.1% - 0.5% defoaming agent; Among them, the silane coupling agent uses KH570, the inhibitor uses ethynylcyclohexanol, the leveling agent uses organically modified polysiloxane, and the defoaming agent uses a self-emulsifying and self-dispersing defoaming agent.

2. The silicone potting adhesive according to claim 1, wherein: The viscosity of the vinyl silicone oil is 1000 mPa·s and the vinyl content is 0.3%.

3. An organosilicon potting adhesive according to claim 1, characterized in that: The viscosity of the hydrogen-containing silicone oil is 300 mPa·s and the hydrogen content is 0.2%.

4. An organosilicon potting adhesive according to claim 1, characterized in that: The platinum content in the platinum catalyst is 0.5%.

5. The silicone potting adhesive according to claim 1, characterized in that: The heat-conducting filler uses aluminum oxide, and two kinds of aluminum oxide with particle sizes of 4 μm and 8 μm are used in a ratio of 3:

7.

6. The silicone potting adhesive according to claim 1, wherein: The flame-retardant filler uses a compound of aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:

1.

7. A preparation method of silicone potting adhesive, characterized in that It includes the following steps: Step 1: For component A glue, according to the mass percentage of each component, they are respectively: 40% vinyl silicone oil, 0.1% platinum catalyst, 22% methyl silicone oil, 0.4% KH570, 37.5% filler for selection, and weighed according to the sum of the mass percentages being 1; For component B glue, according to the mass percentage of each component, they are respectively: 9.5% vinyl silicone oil, 48% hydrogen-containing silicone oil, 30% filler, 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent, 0.3% defoaming agent for selection, and weighed according to the sum of the mass percentages being 1; Step 2: Preparation of the platinum catalyst. In a three-necked flask equipped with a reflux condenser, add 10 parts of H2Pt-C16·6H20, 20 parts of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 50 parts of C2H5OH and 20 parts of NaHCO3 in proportion, introduce nitrogen, heat and stir for reflux at 60 °C for 2 h. After the reaction is completed, let it stand to room temperature, and then perform a filtration operation to remove solid impurities and low-boiling substances. The precipitate is washed with ethanol, and the filtrate and washing solution are combined. After rotary evaporation to remove the solvent, a platinum-tetramethyltetravinylcyclotetrasiloxane complex catalyst, that is, the platinum catalyst, is obtained; Step 3: Put the aluminum oxide with particle sizes of 4 μm and 8 μm used in a ratio of 3:7 into an electrothermal constant-temperature forced-air drying oven and dry it at 100 °C for 3 h; Step 4: Take out the dried aluminum oxide in Step 3 and pour it into a high-speed mixer. Under the stirring state of 1500 r / min, add 0.4% KH570 and an isopropanol / toluene solution with a mass fraction of 20% in the form of spraying. Heat up to 110 °C and continue stirring for 30 min. Take it out, dry it at 110 °C for 4 h, cool it, and obtain modified aluminum oxide, which is sealed and stored for later use; Step 5: Add cyclic siloxane and KH-560 to a four-necked beaker in sequence. Heat up to 120 °C and react for 2 h. After cooling, remove the low-boiling substances under reduced pressure, and then heat up to 100 °C to obtain tackifier A. Use 0.5% tackifier A and 1% boron-modified tackifier in a compound manner; Step 6: Preparation of Component A glue. Pour 40% vinyl silicone oil into a vacuum kneader. Add 0.1% platinum catalyst to 40% vinyl silicone oil and disperse it evenly. Then add the modified aluminum oxide in Step 3 and a flame retardant filler prepared by compounding aluminum hydroxide and magnesium hydroxide in a mass ratio of 1:1 into the kneader and mix evenly. Mix at low temperature and normal pressure for 1 h, then treat at 160 °C for 2 h, evacuate for 2 h, and then further disperse evenly with a three-roll mill to obtain Component A glue; Step 7: Preparation of Component B glue. Add 9.5% vinyl silicone oil, 55% hydrogen-containing silicone oil and 30% filler into a vacuum kneader. Turn on the vacuum pump for preliminary mixing. After mixing evenly, add to the kneader according to the ratio of 1% KH570, 10% tackifier, 0.4% inhibitor, 0.8% leveling agent and 0.3% defoaming agent, and continue to mix until completely uniform. Mix at low temperature and normal pressure for 1 h, then treat at 160 °C for 2 h, evacuate for 2 h, and then further disperse evenly with a three-roll mill to obtain Component B glue; Step 8: Mix Component A and Component B in a ratio of 1:

1. Stir at a speed of 1500 - 2000 revolutions per minute for 2 - 5 minutes. After stirring evenly, perform vacuum degassing treatment on the glue material. Maintain for 3 - 6 minutes after defoaming, and finally release the vacuum to obtain silicone potting glue.

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