Automatic feeding and discharging equipment for wafer polishing and grinding

Abstract

The invention discloses wafer polishing and grinding automatic feeding and discharging equipment which is provided with a polishing and grinding machine, the polishing and grinding machine comprises a plurality of wandering star wheels, each wandering star wheel is provided with a plurality of grinding and polishing stations, and the equipment comprises a discharging motion detection module which is used for detecting the relative position relation of the multiple grinding and polishing stations and generating a control signal; the wafer feeding cache module comprises a wafer feeding positioning cache table and a cache movement device, the wafer feeding positioning cache table comprises a positioning station and an adjusting platform, the cache movement device can transfer the wafer in the wafer feeding positioning cache table to the positioning station, and the adjusting platform is used for responding to a control signal to adjust the wafer in the positioning station; and the upper and lower wafer movement module is used for moving the wafer to a grinding and polishing station. Before the equipment executes a grinding and polishing process, a plurality of wafers can be conveniently transferred to a grinding and polishing station at one time by calibrating and adjusting the relative positions of the wafers, the wafer loading and unloading rhythm is improved, and the equipment has higher grinding and polishing efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to an automatic loading and unloading device for wafer polishing and grinding. Background Art

[0002] Wafer polishing and grinding is one of the key processes in semiconductor manufacturing, mainly used for planarizing the wafer surface to ensure the accuracy and yield of subsequent processes such as lithography and thin film deposition.

[0003] In the early days of semiconductor manufacturing, the loading and unloading of wafers mainly relied on manual operation or semi-automatic equipment, which had problems such as low efficiency and poor accuracy. To overcome the deficiencies of the traditional methods, automatic loading and unloading devices have gradually become the mainstream. There are mainly two methods for the existing automatic loading and unloading of wafer polishing and grinding, namely single-wafer loading and unloading at a time and three-wafer loading at a time and single-wafer unloading at a time. First, single-wafer loading and unloading at a time, that is, when loading, the manipulator sucks one wafer from the loading buffer area at a time and places it in the planetary wheel of the polishing and grinding machine. When unloading, the manipulator sucks one wafer from the planetary wheel at a time and places it in the unloading buffer area. Second, three-wafer loading at a time and single-wafer unloading at a time, that is, when loading, the manipulator sucks three wafers (intermittently) from the loading buffer area at a time and places them in the planetary wheel of the polishing and grinding machine (intermittently). When unloading, the manipulator sucks three wafers (intermittently) from the planetary wheel at a time and places them in the unloading buffer area (intermittently). However, the existing automatic loading and unloading devices for wafer polishing and grinding have a slow cycle time in the way of three-wafer loading at a time and single-wafer unloading at a time or single-wafer loading and unloading at a time, and have low visual positioning accuracy and low wafer placement accuracy for the polishing and grinding stations of the planetary wheel. The existing automatic loading and unloading devices for wafer polishing and grinding still have problems such as slow loading and unloading cycle time, low visual positioning accuracy of the detection device, and low wafer placement accuracy. Summary of the Invention

[0004] In order to solve the deficiencies of the existing technology, the purpose of this application is to provide an automatic loading and unloading device for wafer polishing and grinding with high wafer placement accuracy and relatively fast loading and unloading cycle time.

[0005] To achieve the above purpose, this application adopts the following technical solutions: A wafer polishing and grinding automatic loading and unloading device is configured with a polishing and grinding machine for grinding and polishing wafers. The polishing and grinding machine includes a plurality of planetary wheels, and each planetary wheel has a plurality of grinding and polishing stations for fixing wafers. The wafer polishing and grinding automatic loading and unloading device includes a loading and sampling inspection module for carrying a wafer transfer box; a wafer unloading buffer module for storing the ground and polished wafers; a detection and unloading movement module for detecting the relative position relationship between a plurality of grinding and polishing stations in a planetary wheel and generating a control signal representing the relative position relationship; an unload buffer module including an unload positioning buffer table and a buffer movement device. The unload positioning buffer table is used to carry or store wafers. The unload positioning buffer table includes a positioning station and an adjustment platform. The number of positioning stations is the same as the number of grinding and polishing stations in the planetary wheel. The buffer movement device can transfer the wafers stored in the unload positioning buffer table to the corresponding positioning stations. The adjustment platform is used to adjust the wafers located in the positioning stations in response to the control signal so that the position distribution of the wafers is consistent with the position distribution of the plurality of grinding and polishing stations in the planetary wheel; a loading and unloading movement module for transferring the wafers in the wafer transfer box to the unload buffer module, and the loading and unloading movement module is also used to grab all the adjusted wafers in the positioning stations and transfer the wafers to the corresponding grinding and polishing stations.

[0006] Further, the detection and unloading movement module includes a vision positioning component. When the vision positioning component moves above the first planetary wheel, the vision positioning component detects the first relative position relationship of a plurality of grinding and polishing stations in the first planetary wheel and generates a first control signal representing the first relative position relationship. The adjustment platform can adjust the wafers located in the positioning stations in response to the first control signal; when the adjustment platform adjusts the wafers, the vision positioning component moves above the second planetary wheel to detect the second relative position relationship of a plurality of grinding and polishing stations in the second planetary wheel and generate a second control signal representing the second relative position relationship.

[0007] Further, when the vision positioning component detects the second relative position relationship, the loading and unloading movement module grabs all the adjusted wafers in the positioning stations and transfers the wafers to the corresponding grinding and polishing stations in the first planetary wheel.

[0008] Further, the vision positioning component includes a light source and a camera. The light source is used to irradiate the grinding and polishing stations, and the camera is used to receive the optical signals reflected from the grinding and polishing stations and determine the relative position relationship between a plurality of grinding and polishing stations in the planetary wheel based on the reflective imaging method.

[0009] Further, the detecting and unloading motion module includes a detecting and unloading control device and a first supporting structure. The first supporting structure is installed on the detecting and unloading control device and can move under the action of the detecting and unloading control device. A pressing block group with the same number as the grinding and polishing stations is arranged on the first supporting structure. The distribution positions of the multiple pressing block groups are the same as those of the multiple grinding and polishing stations. The pressing block group includes several pressing blocks, and the pressing blocks can press the wafers located in the grinding and polishing stations under the control of the detecting and unloading control device; the vision positioning component is installed on the first supporting structure.

[0010] Further, the detecting and unloading motion module includes a sensor group installed on the first supporting structure. The number of the sensor groups is the same as that of the grinding and polishing stations, and the distribution positions of the multiple sensor groups are the same as those of the multiple grinding and polishing stations. The sensor group can detect whether the wafers are within the range defined by the grinding and polishing stations. The sensor group includes several sensor units. In two adjacent sensor groups, the sensor units in one of the sensor groups can be reused in the other sensor group.

[0011] Further, the wafer loading and positioning buffer table further includes a buffer station, which is arranged below the adjustment platform. The buffer station has several storage areas distributed from top to bottom. Each storage area can store several wafers transferred by the wafer loading and unloading motion module. The buffer motion device can transfer the wafers in the storage area to the corresponding positioning stations.

[0012] Further, the buffer motion device includes a transfer component and a fixed bracket. One end of the transfer component extends towards the wafer loading and positioning buffer table, and the other end is installed on the fixed bracket and can move relative to the fixed bracket in the height direction; the wafer loading buffer module includes a frame, and a guide rail extending along a set direction is arranged on the frame. The fixed bracket is installed on the guide rail and can slide relative to the guide rail along the set direction.

[0013] Further, the transfer component includes a transfer fork arm and a driving unit for driving the transfer fork arm to move. The transfer fork arm can move in the height direction under the action of the driving unit to grab the wafers in the corresponding storage layer.

[0014] Further, the fork arm is set as a single-piece fork arm and / or a double-piece fork arm. The single-piece fork arm corresponds to one buffer station and grabs the wafers in the storage layer of one buffer station; the double-piece fork arm corresponds to two buffer stations, and the double-piece fork arm can simultaneously grab the wafers in the corresponding storage layers of the two buffer stations.

[0015] Further, the upper and lower wafer movement module includes an upper and lower wafer control device, a second support structure, and multiple suction attachment groups. The second support structure is installed on the upper and lower wafer control device and can move under the action of the upper and lower wafer control device. The number of suction attachment groups is the same as the number of positioning stations, and the distribution positions of the multiple suction attachment groups are the same as the distribution positions of the multiple positioning stations. Each suction attachment includes a number of suction attachments, and the suction attachments can grasp the wafers located at the positioning stations.

[0016] Further, the upper and lower wafer movement module includes a movable mechanism. At least two of the multiple suction attachment groups are configured with the movable mechanism. The movable mechanism can adjust the positions of the suction attachment groups so that the multiple suction attachment groups can correspond to the grasping positions of the wafers adjusted by the adjustment platform.

[0017] Further, the lower wafer buffer module includes a water tank and a movement bracket. The water tank forms a liquid storage space for storing liquid, and the movement bracket can move relative to the water tank in the height direction to enter / leave the liquid storage space; when the movement bracket leaves the liquid storage space, the upper and lower wafer movement module can grasp the wafers in the same planetary wheel and transfer them into the movement bracket.

[0018] Further, the movement bracket includes a first wafer fixing plate and a second wafer fixing plate that can move relative to each other in the height direction, and the first wafer fixing plate and the second wafer fixing plate are staggered in the horizontal direction.

[0019] Further, when the upper and lower wafer movement module grasps the polished and ground wafers, the movable mechanism can drive the suction attachment group to move so that the surfaces of several wafers do not overlap. The upper and lower wafer movement module transfers the wafers adjusted by the movable mechanism to the first wafer fixing plate and the second wafer fixing plate that are staggered in distribution.

[0020] The present application provides a wafer polishing and grinding automatic loading and unloading device. Through the coordinated work of the loading and sampling inspection module, the upper wafer buffer module, the detection and unloading movement module, the upper and lower wafer movement module, and the lower wafer buffer module, efficient automatic loading and unloading operations during the wafer polishing and grinding process are realized. The device detects the relative positions of multiple polishing and grinding stations in a planetary wheel through the detection and unloading movement module and generates a control signal to send to the upper wafer buffer module. The upper wafer buffer module can adjust the relative positions of the wafers in the positioning stations in real time according to the control signal. The upper and lower wafer movement module grasps all the wafers adjusted in the positioning stations at one time, realizing the function of loading and unloading multiple wafers at one time, greatly reducing the loading and unloading cycle time, and improving production efficiency. Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the wafer polishing and grinding automatic loading and unloading device in the embodiment of the present application; Figure 2It is the top view of the automatic loading and unloading equipment for wafer polishing and grinding in the embodiment of the present application; Figure 3 It is the schematic diagram of the wafer loading buffer module in the embodiment of the present application; Figure 4 It is the schematic diagram of the flipping transfer module in the embodiment of the present application; Figure 5 It is the schematic diagram of the unloading module in the embodiment of the present application; Figure 6 It is the schematic diagram of the positioning station in the embodiment of the present application; Figure 7 It is the schematic diagram of the detection unloading motion module in the embodiment of the present application; Figure 8 It is the schematic diagram of the first support structure in the embodiment of the present application; Figure 9 It is the distribution schematic diagram of the sensor units in the sensor group in the embodiment of the present application; Figure 10 It is the schematic diagram of another perspective of the wafer loading buffer module in the embodiment of the present application; Figure 11 It is the schematic diagram of the wafer loading and unloading motion module in the embodiment of the present application; Figure 12 It is the schematic diagram of the second support structure in the embodiment of the present application; Figure 13 It is the schematic diagram of the wafer unloading buffer module in the embodiment of the present application; Figure 14 It is the flowchart of the automatic loading and unloading method for wafer polishing and grinding in the embodiment of the present application.

[0022] Reference numerals: 100, automatic loading and unloading equipment for wafer polishing and grinding; 10, loading and sampling inspection module; 11, wafer transfer box; 20, wafer loading and unloading motion module; 21, wafer loading and unloading control device; 22, second support structure; 221, second support base; 222, second fork arm; 23, suction attachment group; 231, suction attachment; 24, moving mechanism; 30, wafer loading buffer module; 31, wafer loading positioning buffer table; 311, positioning station; 3111, fixed disk; 3112, support block; 3113, support and positioning module; 3113a, positioning member; 3113b, base; 3114, alignment module; 3114a, alignment base; 3114b, alignment moving part; 3115, positioning station sensor; 3115a, reflection sensor; 3115b, opposed photoelectric sensor; 312, adjustment platform; 313, buffer station; 3131, storage area; 32, buffer motion device; 321, transfer assembly; 3211, transfer fork arm; 3211a, single wafer fork arm; 3211b, double wafer fork arm; 3212, drive unit; 322, fixed bracket; 33, frame; 331, guide rail; 40, polishing and grinding machine; 41, planetary gear; 411, grinding and polishing station; 50, inspection and unloading motion module; 51, inspection and unloading control device; 52, first support structure; 521, first support base; 522, vision positioning component; 5221, light source; 5222, camera; 523, wafer picking component; 5231, pneumatic gripper; 5232, clamping plate; 524, pressing block group; 5241, pressing block; 525, sensor group; 5251, inner sensor; 5252, outer sensor; 60, wafer unloading buffer module; 61, water tank; 62, motion support; 621, linear motion unit; 622, first wafer fixing plate; 623, second wafer fixing plate; 624, receiving groove; 70, flipping and transfer module; 71, transfer base; 72, flipping fixed block; 73, frame module; 80, unloading module; 81, unloading water tank; 82, wafer support; 821, notch. Detailed implementation manners

[0023] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the specific embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0024] It should be noted that the orientation nouns such as up, down, left, right, front, and back, or ordinal numbers such as "first, second, third, fourth", etc. mentioned in this article are all based on the accompanying drawings of the specification as a reference and are introduced for the convenience of description, and do not mean any limitation on the order of components. In addition, since the functions of some parts between the components provided in the above embodiments are the same, the present specification uses a unified naming method for these parts. The above has introduced in detail the pipe fitting connection device provided by the related technical solution. Specific embodiments are used in this article for elaboration. The description of the above embodiments is only used to help understand the method and its core idea of the present invention, and does not impose any formal limitation on the present invention.

[0025] As Figure 1 shown, the present application provides a wafer polishing and grinding automatic loading and unloading device 100. In order to clearly illustrate the technical solution of the present invention, the up, down, left, right, front, and back directions as Figure 1 shown are also defined as the up, down, left, right, front, and back directions of the wafer polishing and grinding automatic loading and unloading device 100.

[0026] As Figure 1 and Figure 2 shown, as an implementation manner, the wafer polishing and grinding automatic loading and unloading device 100 includes a loading and sampling inspection module 10, an up and down wafer movement module 20, an upper wafer buffer module 30, a detection and unloading movement module 50, and a lower wafer buffer module 60.

[0027] Optionally, the wafer polishing and grinding automatic loading and unloading device 100 is further configured with a polishing and grinding machine 40 for polishing the wafer.

[0028] The loading and sampling inspection module 10 is used to carry the wafer transfer box 11. The wafer transfer box 11 is a container for safely transporting and storing wafers during the wafer manufacturing process. The up and down wafer movement module 20 is used to grab the wafer from the wafer transfer box 11 and transfer the wafer to the upper wafer buffer module 30. When multiple wafers are placed in the upper wafer buffer module 30, the upper wafer buffer module 30 can adjust the relative positions between the multiple wafers. The up and down wafer movement module can also transfer the adjusted multiple wafers to the polishing and grinding machine 40. The detection and unloading movement module 50 can grab the polished wafer and transfer it to the lower wafer buffer module 60. The lower wafer buffer module 60 is used to store the polished wafer and immerse the wafer in the cleaning liquid.

[0029] Specifically, the polishing and grinding machine 40 includes a plurality of planetary wheels 41 circumferentially distributed. The planetary wheels 41 are rotating components in the polishing and grinding machine 40, responsible for providing the power and pressure for grinding and polishing. Each planetary wheel 41 has a plurality of grinding and polishing stations 411, and the grinding and polishing stations 411 are used to carry and fix the wafers, ensuring that the wafers will not shift during the grinding and polishing process, and at the same time providing the mechanical force for grinding and polishing, so that the surfaces of the wafers are evenly ground.

[0030] Exemplarily, three grinding and polishing stations 411 are provided in each planetary wheel 41, and the three grinding and polishing stations 411 are arranged in a triangle.

[0031] The detection and blanking motion module 50 is used to detect the relative position relationship between a plurality of grinding and polishing stations 411 in a planetary wheel 41, and generate a control signal characterizing the relative position relationship. The control signal is used to guide the adjustment and placement of the wafers in the wafer loading buffer module 30.

[0032] Exemplarily, taking one planetary wheel 41 as an example, three grinding and polishing stations 411 are provided therein, and the relative position relationship between the three grinding and polishing stations 411 is detected by the detection and blanking motion module 50. For example, the center distance between any two grinding and polishing stations 411, and / or the included angle between the connecting lines of the centers of the three grinding and polishing stations 411, and / or the levelness of each grinding and polishing station 411.

[0033] As Figure 2 and Figure 3 As shown, the wafer loading buffer module 30 includes a wafer loading positioning buffer table 31 and a buffer motion device 32. The wafer loading positioning buffer table 31 is used to carry or store wafers. The wafer loading positioning buffer table 31 includes a positioning station 311 and an adjustment platform 312. The number of positioning stations 311 is the same as the number of grinding and polishing stations 411 in the planetary wheel 41. The buffer motion device 32 can transfer the wafers stored in the wafer loading positioning buffer table 31 to the corresponding positioning stations 311. The adjustment platform 312 is used to adjust the wafers located in the positioning stations 311 in response to the control signal, so that the position distribution of the wafers is consistent with the position distribution of the plurality of grinding and polishing stations 411 in the planetary wheel 41.

[0034] It should be noted that due to the influence of manufacturing processes or installation tolerances, there may be deviations in the relative position relationship of the grinding and polishing stations 411 in the plurality of planetary wheels 41. Each time the wafers are transferred to the positioning stations 311 through the wafer loading and unloading motion module 20, the adjustment platform 312 can adjust the positioning stations 311 in response to the control signal, so as to ensure that the position distribution of the plurality of wafers in the positioning stations 311 is consistent with the position distribution of the plurality of grinding and polishing stations 411 in the planetary wheel 41.

[0035] In some examples, the wafer polishing and grinding automatic loading and unloading device 100 is configured with a controller for controlling the coordinated operation among various modules. The controller receives the control signals generated by the detection unloading motion module 50 and controls the adjustment platform 312 based on the control signals.

[0036] In other examples, an independent controller is configured inside the adjustment platform 312. This controller is used to receive the control signals generated by the detection unloading motion module 50 and control the adjustment platform 312 to adjust the position distribution of the positioning station 311.

[0037] The wafer loading and unloading motion module 20 is used to transfer the wafers in the wafer transfer box 11 to the wafer loading buffer module 30. The wafer loading and unloading motion module 20 can grab multiple wafers at a time. Further, the wafer loading and unloading motion module 20 is also used to grab all the adjusted wafers in the positioning station 311 and transfer the wafers to the corresponding grinding and polishing station 411.

[0038] Through the above settings, before the device performs the grinding and polishing process, the relative positions of the wafers are calibrated and adjusted, facilitating the transfer of multiple wafers to the grinding and polishing station 411 at one time, improving the rhythm of wafer loading and unloading, and enabling the device to have higher grinding and polishing efficiency.

[0039] As Figure 2 and Figure 4 shown, as an optional implementation, the wafer polishing and grinding automatic loading and unloading device 100 further includes a flipping and transfer module 70. The flipping and transfer module 70 includes a transfer base 71, flipping fixing blocks 72, and a frame module 73. A plurality of flipping fixing blocks 72 are circumferentially distributed on the transfer base 71, and the intervals between the plurality of flipping fixing blocks 72 are the same. The plurality of flipping fixing blocks 72 provide support and fixation for the wafers. A flipping and transfer module sensor 711 is provided on the transfer base 71. The flipping and transfer sensor 711 is used to detect whether there is a wafer on the transfer base and give feedback. The wafers grabbed by the wafer loading and unloading motion module 20 are placed on the flipping and transfer module 70 while maintaining the original front and back orientations of the wafers or after being flipped according to the incoming material processing instructions. After the wafer loading and unloading motion module 20 takes out a wafer from the wafer transfer box 11 of the loading and inspection module 10, the wafer is first sent to the flipping and transfer module 70 to adjust the front and back orientations, and then transferred to the top layer of the wafer loading buffer module 30.

[0040] As Figure 2 and Figure 5As shown in the figure, as another alternative implementation, the automatic loading and unloading device 100 for wafer polishing and grinding further includes an unloading module 80. Specifically, the unloading module 80 includes an unloading water tank 81 and a wafer support 82. The unloading water tank 81 is used to provide a storage area, and the wafer support 82 is used to provide a stable support structure to prevent the wafer from being displaced or damaged during storage and handling. A plurality of notches 821 are provided on the wafer support for fixing the wafer. The unloading module 80 is used to cooperate with the wafer unloading buffer module 60 and the detection and unloading motion module 50. The unloading module 80 provides a stable and safe environment for storing and processing the wafers that have completed the grinding and polishing process.

[0041] As Figure 3 and Figure 6 shown in the figure, as an implementation, the positioning station includes a fixed disk 3111, a support block 3112, a support and positioning module 3113, a rectifying module 3114, and a positioning station sensor 3115. The fixed disk 3111 serves as the base of the positioning station, and the support block 3112, the support and positioning module 3113, the rectifying module 3114, and the positioning station sensor 3115 are all installed on one end face of the fixed disk 3111. Among them, the support block 3112 and the support and positioning module 3113 are diagonally distributed. For example, the positioning station includes a pair of support blocks 3112 and a pair of support and positioning modules 3113. The pair of support blocks 3112 and the pair of support and positioning modules 3113 surround to form a rectangular area for accommodating the wafer, and a corresponding support and positioning module 3113 is provided in the diagonal direction of any support block 3112. The rectifying module 3114 is arranged between the pair of support blocks 3112 and is used to apply an adjustable acting force to the wafer along the radial direction of the wafer.

[0042] Specifically, the support block 3112 is used to abut against the wafer in the radial direction of the wafer and is specifically set as a boss for providing support force. In addition to abutting against the wafer in the radial direction of the wafer, the support and positioning module 3113 can also limit the rotation of the wafer. The support and positioning module 3113 includes a positioning member 3113a and a base 3113b. The positioning member 3113a is installed on the fixed disk 3111 and has a positioning panel extending in the direction of the center of the wafer. The base 3113b is installed on the fixed disk 3111, and at least part of the base 3113b is located above the positioning panel, so that a gap is formed between the base 3113b and the positioning panel. When the wafer is at the positioning station, part of the area at the edge of the wafer can be embedded in the gap. By abutting against the outer edge of the wafer at opposite ends of the base 3113b, the movement of the wafer is restricted.

[0043] Further, the alignment module 3114 includes an alignment base 3114a and an alignment moving part 3114b. The alignment base 3114a is installed on the fixed disk 3111, and the alignment moving part 3114b is installed on the alignment base 3114a. The alignment moving part 3114b is set as a slide table capable of reciprocating relative to the alignment base 3113b, and the moving direction of the alignment moving part 3114b coincides with the radial direction of the wafer. For example, a reference line is defined whose extending direction is parallel to the moving direction of the alignment moving part 3114b, and a pair of support and positioning modules 3113 are symmetrically distributed with respect to the reference line. Through the cooperation of the alignment moving part 3114b and the support and positioning modules 3113, the wafer is restricted to a set position in the positioning station, avoiding the wafer from shifting when adjusting the position of the wafer.

[0044] The positioning station sensor 3115 is used to detect whether there is a wafer on the positioning station 311, and simultaneously detect the tilt angle of the wafer on the positioning station 311 to detect whether the wafer is horizontal, and the detection result is fed back to the adjustment platform 312.

[0045] Exemplarily, the positioning station sensor 3115 includes a reflection sensor 3115a and two pairs of opposed photoelectrics 3115b arranged diagonally on the fixed disk 3111. The reflection sensor 3115a is used to detect whether there is a wafer on the positioning station 311, and the opposed photoelectrics 3115b are used to detect the tilt angle of the wafer on the positioning station 311 to detect whether the wafer is horizontal.

[0046] Each group of positioning stations 311 are respectively installed on a group of adjustment platforms 312. The adjustment platforms 312 can perform linear motion along the width direction and the length direction. In response to the control signal obtained by the detection and blanking motion module 50 for characterizing the relative position relationship of the three grinding and polishing stations 411 of the planet gear 41, the position of the wafer on the positioning station 311 is adjusted in real time to maintain the relative position consistency with the three grinding and polishing stations 411 of the planet gear 41.

[0047] In the embodiment of the present application, the wafer loading and unloading motion module 20 takes out a wafer from the wafer transfer box 11 on the loading and sampling inspection module 10, transfers the wafer to the wafer loading buffer module 30 until three wafers are filled, and waits for the wafer loading instruction. When receiving the wafer loading instruction, the detection and blanking motion module 50 moves to the planet gear 41, obtains the relative position relationship of the three grinding and polishing stations 411 of the planet gear 41, generates a control signal characterizing the relative position of the grinding and polishing stations 411. The wafer loading buffer module 30 receives this control signal, and the adjustment platform 312 calibrates the positions of the three wafers on the positioning station 311 in real time to ensure that the relative position distribution of the wafers is consistent with the relative position distribution of the grinding and polishing stations 411 of the planet gear 41. The wafer loading and unloading motion module 20 simultaneously sucks and adjusts the three adjusted wafers at one time, and transfers the wafers to the corresponding grinding and polishing stations 411.

[0048] Through the above settings, the detection and blanking motion module 50 and the wafer loading buffer module 30 cooperate with each other to achieve a high-precision matching between the wafer position at the positioning station 311 and the grinding and polishing station 411 of the planetary wheel 41, improving the wafer loading accuracy; the wafer loading and unloading motion module 20 simultaneously picks up three adjusted wafers at one time, greatly reducing the wafer loading and unloading cycle time and improving the production efficiency.

[0049] As an implementation, as Figure 7 and Figure 8 shown, the detection and blanking motion device further includes a vision positioning component 522. The vision positioning component 522 includes a light source 5221 and a camera 5222. When the vision positioning component 522 moves above the first planetary wheel 41, the light source 5221 irradiates the surface of the grinding and polishing station 411 of the planetary wheel 41, and the camera 5222 receives the optical signal reflected from the grinding and polishing station 411, thereby determining the first relative position relationship of multiple grinding and polishing stations 411 in the first planetary wheel 41, generating a first control signal representing the first relative position relationship, and sending it to the adjustment platform 312. The adjustment platform 312 can respond to the first control signal to finely adjust the wafers at the positioning station 311 so that their distribution completely matches the grinding and polishing stations 411 of the first planetary wheel 41, ensuring that there is no offset when the wafers are placed on the grinding and polishing stations 411.

[0050] It should be noted that the camera 5222 is used to receive the optical signal reflected from the grinding and polishing station 411 and determine the relative position relationship between multiple grinding and polishing stations 411 in the planetary wheel 41 based on the reflection imaging method. The reflection imaging method is to irradiate light from the light source 5221 onto the grinding and polishing station 411. After the light is reflected by the grinding and polishing station 411, it is received and imaged by the camera 5222. The acquired image data is analyzed through image processing algorithms to identify the positions of multiple grinding and polishing stations 411 on the planetary wheel 41. Usually, image processing will accurately determine the positions of the grinding and polishing stations 411 through techniques such as edge detection and morphological analysis, calculate the relative position relationship of each grinding and polishing station 411, calculate the wafer position difference based on the processed image data, and then generate a control signal.

[0051] When the adjustment platform 312 adjusts the wafers, the vision positioning component 522 moves above the second planetary wheel 41 to detect the second relative position relationship of multiple grinding and polishing stations 411 in the second planetary wheel 41, generating a second control signal representing the second relative position relationship, and the second control signal will be used for subsequent adjustment of the wafer placement position of the second planetary wheel 41.

[0052] When the visual positioning component 522 detects the second relative position relationship, the upper and lower wafer movement module 20 grabs all the adjusted wafers at the positioning station 311 and transfers the wafers to the corresponding grinding and polishing station 411 in the first planetary wheel 41 to complete high-precision loading.

[0053] With the above settings, the detection of the second planetary wheel 41 by the visual positioning component 522 and the loading operation of the first planetary wheel 41 by the upper and lower wafer movement module 20 are carried out synchronously, eliminating the waiting time of the wafer polishing and grinding automatic loading and unloading equipment 100 and shortening the working cycle of the wafer polishing and grinding automatic loading and unloading equipment 100.

[0054] As Figure 7 and Figure 8 shown, as an implementation, the detection and unloading movement module 50 includes a detection and unloading control device 51 and a first support structure 52. The first support structure 52 is installed on the detection and unloading control device 51 and can move under the action of the detection and unloading control device 51.

[0055] Exemplarily, the detection and unloading control device 51 is set as a manipulator for controlling the movement of the first support structure 52.

[0056] Furthermore, a first support seat 521, a visual positioning component 522, a wafer picking component 523, and a pressing block group 524 are provided on the first support structure 52. The visual positioning component 522 and the wafer picking component 523 are arranged on the first support seat 521. The number of the pressing block groups 524 is set to be the same as the number of the grinding and polishing stations 411. The distribution positions of the multiple pressing block groups 524 are the same as the distribution positions of the multiple grinding and polishing stations 411 in the same planetary wheel 41. The pressing block group 524 includes a plurality of pressing blocks 5241. The pressing blocks 5241 can press the wafers located at the grinding and polishing stations 411 under the control of the detection and unloading control device 51 to discharge the excess liquid existing under the wafers at the grinding and polishing stations 411 during the grinding process. The wafer picking component 523 is arranged at one end of the support seat. A pneumatic gripper 5231 and two clamping plates 5232 are provided on the wafer picking component 523. One end of each clamping plate 5232 is respectively connected to the pneumatic gripper 5231. The clamping plates 5232 can, under the control of the pneumatic gripper 5231, realize the grasping and releasing of the wafers through clamping or loosening actions. Each clamping plate 5232 is responsible for controlling one side of the wafer, so that the clamping plates 5232 can uniformly apply a clamping force to the wafers between the two clamping plates 5232 to ensure the stability of the wafers during the picking and placing process.

[0057] Further, the blanking motion detection module 50 further includes a sensor group 525 mounted on the first support structure 52. The number of sensor groups 525 is the same as the number of grinding and polishing stations 411, and the distribution positions of the multiple sensor groups 525 are the same as the distribution positions of the multiple grinding and polishing stations 411. The sensor group 525 can detect whether the wafer is within the range defined by the grinding and polishing station 411. The sensor group 525 includes a number of sensor units. Among two adjacent sensor groups 525, the sensor units in one of the sensor groups 525 can be reused in the other sensor group 525.

[0058] As Figure 9 shown, exemplarily, each sensor group 525 includes three identical inner sensors 5251 and three identical outer sensors 5252. The orthographic projection of the inner sensor 5251 on the planetary wheel 41 is located within the grinding and polishing station 411, and it is used to measure the height of the wafer. The outer sensors 5252 are arranged around the grinding and polishing station 411, and they are used to measure the height of the planetary wheel 51. One outer sensor 5252 is shared between two adjacent sensor groups 525. In the embodiment of the present application, the three inner sensors 5251 and the three outer sensors 5252 are all distributed in a triangle.

[0059] Through the combined action of multiple sensor groups 525, the relative height difference and parallelism between multiple wafers and multiple grinding and polishing stations 411 can be detected simultaneously, so as to determine whether the wafers are correctly placed in the grinding and polishing stations 411, and avoid the situation where the wafers are not correctly placed in the grinding and polishing stations 411 during the grinding process, which may cause pressure on the planetary wheel 41 and damage. In addition, since among two adjacent sensor groups 525, the sensor units in one of the sensor groups 525 can be reused in the other sensor group 525, the number of sensor units is reduced, and the equipment cost is lowered.

[0060] As Figure 10 shown, as an implementation manner, the wafer loading positioning buffer table 31 further includes a buffer station 313. The buffer station 313 is arranged below the adjustment platform 312. The buffer station 313 has a number of storage areas 3131 distributed from top to bottom. A number of wafers transferred by the wafer loading and unloading motion module 20 can be stored in each storage area 3131. The buffer motion device 32 can transfer the wafers in the storage area 3131 to the corresponding positioning station 311. The buffer station 313 provides a multi-level storage space, enabling the wafers to be temporarily stored in the buffer station 313 and waiting to be transferred to the positioning station 311 by the buffer motion device 32.

[0061] As Figure 10As shown, as an implementation, the buffer motion device 32 includes a transfer component 321 and a fixed bracket 322. One end of the transfer component 321 extends upward in the direction of the upper wafer positioning buffer table 31, and the other end is installed on the fixed bracket 322 and can move relative to the fixed bracket 322 in the height direction; the upper wafer buffer module 30 includes a frame 33, and a guide rail 331 extending in a set direction is provided on the frame 33. The fixed bracket 322 is installed on the guide rail 331 and can slide relative to the guide rail 331 in the set direction. Specifically, the set direction is the direction in which one end of the transfer component 321 extends upward to the upper wafer positioning buffer table 31. The fixed bracket 322 is used to support the transfer component 321. The fixed bracket 322 moves horizontally along the guide rail 331, so that the transfer component 321 can reach different station positions, so as to be able to grasp or place wafers.

[0062] Specifically, the transfer component 321 includes a transfer fork arm 3211 and a driving unit 3212 for driving the transfer fork arm 3211 to move. The transfer fork arm 3211 can move in the height direction under the action of the driving unit 3212 to grasp the wafers in the corresponding storage area 3131. Specifically, the driving unit 3212 is used to adjust the position of the transfer fork arm 3211 in the height direction, so that the transfer fork arm 3211 can grasp or place wafers.

[0063] In some examples, the transfer fork arm 3211 is set as a single-piece fork arm 3211a. In some other examples, the transfer fork arm 3211 is set as a double-piece fork arm 3211b. In some other examples, multiple transfer fork arms 3211 are respectively set as single-piece fork arms 3211a or double-piece fork arms 3211b, and act together on different buffer stations 313. The single-piece fork arm 3211a corresponds to one buffer station 313 and grasps the wafers in the storage area 3131 of one buffer station 313; the single-piece fork arm 3211a can place a wafer from the positioning station 311 into the buffer station 313, or place the wafer stored in the buffer station 313 at the positioning station 311. The double-piece fork arm 3211b corresponds to two buffer stations 313, and the double-piece fork arm 3211b can simultaneously grasp the wafers in the corresponding storage layers of the two buffer stations 313. The double-piece fork arm 3211b is used to simultaneously place two wafers from the positioning station 311 into the buffer station 313, or place the wafers stored in the buffer station 313 at the positioning station 311.

[0064] Through the above settings, the transfer fork arm 3211 can pick up one and / or simultaneously pick up multiple wafers in the storage area 3131 and place them from the positioning station 311 into the buffer station 313, or place the wafers stored in the buffer station 313 at the positioning station 311. Furthermore, the transfer fork arm 3211 can complete the operations of grasping, transferring or placing wafers at multiple positions, meeting the need to serve multiple stations.

[0065] Such asFigure 11 As shown, as an implementation, the upper and lower wafer movement module 20 includes an upper and lower wafer control device 21, a second support structure 22, and a plurality of suction attachment groups 23.

[0066] Exemplarily, the upper and lower wafer control device 21 is arranged as a manipulator for controlling the movement of the second support structure 22.

[0067] As Figure 12 shown, further, the second support structure 22 includes a second support base 221 and a second fork arm 222. One end of the second fork arm 222 is connected to the second support base 221, and the other end of the second fork arm 222 is arranged as a U-shaped sheet structure with an adsorption function. The second fork arm 222 is used to suck and place the wafers in the wafer transfer cassette 11 on the flipping and transfer module 70. The second support structure 22 is installed on the upper and lower wafer control device 21 and can move under the action of the upper and lower wafer control device 21. The number of the suction attachment groups 23 is the same as the number of the positioning stations 311, and the distribution positions of the plurality of suction attachment groups 23 are the same as the distribution positions of the plurality of positioning stations 311. The suction attachments 23 can grasp the wafers located at the positioning stations 311, so that the upper and lower wafer movement module 20 can suck multiple wafers at one time, greatly improving the loading and unloading cycle time.

[0068] As Figure 12 shown, further, the upper and lower wafer movement module 20 further includes a moving mechanism 24, and the moving mechanism 24 is arranged as a linear motion mechanism in the height direction.

[0069] Exemplarily, the moving mechanism 24 is arranged as a pneumatic slide.

[0070] At least two of the plurality of suction attachment groups 23 are configured with the moving mechanism 24. The moving mechanism 24 is arranged at the end of the second support base 221. The moving mechanism 24 can adjust the positions of the suction attachment groups 23 so that the plurality of suction attachment groups 23 can correspond to the grasping positions of the wafers adjusted by the adjustment platform 312. After the adjustment platform 312 of the upper wafer buffer module 30 completes the wafer position calibration, the moving mechanism 24 drives the suction attachment groups 23 to move in the height direction to accurately match the calibrated wafer grasping positions. The suction attachments 231 adsorb the wafers, and the moving mechanism 24 retracts to the initial position, ready to transfer the wafers to the polishing and grinding machine 40 or the lower wafer buffer module 60. Through the above settings, the moving mechanism 24 can perform dynamic adjustment, and thus can adapt to wafers of different specifications for grasping work.

[0071] As Figure 13As shown, as an implementation, the lower wafer buffer module 60 includes a water tank 61 and a moving bracket 62. The water tank 61 has a liquid storage space for storing liquid. The moving bracket 62 includes a plurality of pairs of linear motion units 621. The moving bracket 62 is arranged on the water tank 61 in a liftable manner. The moving bracket 62 is arranged in a U shape. One end of the linear motion unit 621 is arranged at the end of the moving bracket 62, and the other end of the linear motion unit 621 is arranged outside the water tank 61, so that the moving bracket 62 can move relative to the water tank 61 in the height direction to enter / leave the liquid storage space; when the linear motion unit 621 extends, the moving bracket 62 rises out of the water tank 61, and when the linear motion unit 621 retracts, the moving bracket 62 descends into the water tank 61. When the moving bracket 62 leaves the liquid storage space, the upper and lower wafer motion module 20 can grasp the wafers in the same planet gear 41 and transfer them into the moving bracket 62.

[0072] The moving bracket 62 includes a first wafer fixing plate 622 and a second wafer fixing plate 623 that can move relative to each other in the height direction. The first wafer fixing plate 622 and the second wafer fixing plate 623 are staggered in the horizontal direction. Through the above settings, independent storage spaces are provided for multiple wafers in the lower wafer buffer module 60. The first wafer fixing plate 622 and the second wafer fixing plate 623 are provided with receiving grooves 624 for placing wafers. Specifically, the first wafer fixing plate 622 is fixed and used to carry one wafer, and the second wafer fixing plate 623 can move relative to each other in the height direction and is adjustable for carrying other wafers.

[0073] When the upper and lower wafer motion module 20 grasps the polished wafers, the moving mechanism 24 can drive the suction accessory group 23 to move, so that the surfaces of several wafers do not coincide. The upper and lower wafer motion module 20 transfers the wafers adjusted by the moving mechanism 24 to the first wafer fixing plate 622 and the second wafer fixing plate 623 that are staggered. Through the above settings, the first wafer fixing plate 622 and the second wafer fixing plate 623 can alternately receive the wafers adjusted by the moving mechanism 24 in the height direction brought by the upper and lower wafer motion module 20, so that there is enough space for the wafers in the lower wafer buffer module 60 to be stored without interfering with each other.

[0074] In summary, the automatic loading and unloading equipment 100 for wafer polishing and grinding provided by the present application detects the grinding and polishing station 411 by using the vision positioning component 522 through the reflective imaging method, thereby accurately detecting the relative position of the wafer in the grinding and polishing station 411, generating a control signal and sending it to the adjustment platform 312. The adjustment platform 312 can adjust the relative position of the wafer in the positioning station 311 in real time according to the control signal, and has the functions of high-precision positioning, detection and adjustment of the wafer during the processing. The equipment adjusts the relative position of the wafer through the adjustment platform 312, and the suction cup 231 sucks all the wafers adjusted in the positioning station 311 at one time, realizing the function of loading and unloading multiple wafers at one time, greatly reducing the loading and unloading cycle and improving the production efficiency.

[0075] Exemplarily, three grinding and polishing stations 411 are provided, and the storage area 3131 of the storage area 313 is set to five layers.

[0076] As Figure 14 shown, the present application also provides an automatic loading and unloading method for wafer polishing and grinding, and the method includes the following steps: Step S1401: The second fork arm 222 takes out the wafer from the wafer transfer box 11 and places it in the flipping transfer module 70; Exemplarily, the second fork arm 222 of the loading and unloading motion module 20 takes out a wafer from the wafer transfer box 11, and according to the incoming material processing instruction, keeps the original front and back sides of the wafer or flips it after judging through the flipping transfer sensor 711, and temporarily stores it in the flipping transfer module 70.

[0077] Step S1402: The suction attachment 231 of the loading and unloading motion module 20 adsorbs the wafer and places it in the storage layer of the buffer station 313; Exemplarily, the suction attachment 231 of the loading and unloading motion module 20 transfers the wafer from the flipping transfer module 70 to the top layer of the loading buffer module 30. When the top layer is full of three wafers, the single-piece fork arm 3211a and the double-piece fork arm 3211b cooperate to transfer the three wafers to the storage area 3131 of the buffer station 313.

[0078] Steps S1401 and S1402 are repeated until the loading buffer module 30 is full of fifteen wafers.

[0079] Step S1403: The detection unloading motion module 50 detects the grinding and polishing station 411 and generates a control signal, so that the adjustment platform 312 adjusts the relative position of the positioning station 311 according to the control signal; Exemplarily, the detection and blanking motion module 50 moves above the first planet gear 41, obtains the relative position relationship of the three grinding and polishing stations 411 in the planet gear 41 through the vision positioning component 522, and generates a control signal representing the relative position relationship. The adjustment platform 312 of the wafer loading buffer module 30 receives the control signal and calibrates the relative positions of the three wafers in the positioning station 311 of the wafer loading buffer module 30 according to the control signal, so that the relative position relationship of the wafers in the positioning station 311 is consistent with the relative position relationship of the grinding and polishing stations 411.

[0080] Step S1404: The suction and attachment member 231 simultaneously sucks three wafers from the positioning station 311 and places them into the first planet gear 41. Exemplarily, the suction and attachment group 23 of the wafer loading and unloading motion module 20 moves to the positioning station 311 of the wafer loading buffer module 30, and simultaneously sucks three wafers at a time through the suction and attachment member 231. The suction and attachment group 23 of the wafer loading and unloading motion module 20 moves to the first planet gear 41 and places the three wafers into the grinding and polishing stations 411 of the first planet gear 41 simultaneously.

[0081] Step S1405: The polishing and grinding machine 40 rotates, and the detection and blanking motion module 50 performs a pressing detection on the second planet gear 41. Exemplarily, the polishing and grinding machine 40 rotates, the first planet gear 41 with wafers placed on it moves to the second planet gear 41, the pressing block 5241 on the detection and blanking motion module 50 performs a pressing detection function, discharges the excess liquid in the grinding and polishing station 411, and detects the wafer position through the sensor group 525. If the wafer is not accurately placed in the grinding and polishing station 411, an alarm is triggered. If the detection is normal, the loading of the three wafers is completed.

[0082] Repeat step S1403 to step S1405 until all the planet gears 41 in the polishing and grinding machine 40 are filled with wafers, and the loading is completed.

[0083] Step S1406: The suction and attachment group 23 moves above the first planet gear 41, sucks three wafers at a time, and transfers them to the wafer unloading buffer module 60.

[0084] Exemplarily, when the polishing and grinding machine 40 finishes processing and receives the wafer unloading instruction, the suction and attachment group 23 of the wafer loading and unloading motion module 20 moves to the first planet gear 41, grabs three wafers at one time and transfers them to the wafer unloading buffer module 60 for temporary storage.

[0085] Step S1407: The wafer taking component 523 sends the wafers in the wafer unloading buffer module 60 to the blanking module 80.

[0086] Exemplarily, when the lower wafer buffer module 60 is filled with wafers, the wafer picking component 523 of the wafer unloading motion module 50 picks up one wafer and transfers the wafers one by one to the wafer unloading module 80 for storage.

[0087] Repeat step S1406 to step S1407 until all wafers are unloaded.

[0088] With the above settings, a wafer polishing and grinding automatic loading and unloading device 100 provided by the present application realizes loading and unloading three wafers simultaneously at one time, greatly shortening the loading and unloading cycle. The vision positioning component 522 and the adjustment platform 312 cooperate for calibration, with high wafer placement accuracy. The wafer unloading motion module 50 can simultaneously press and detect three wafers, with high pressing and detecting efficiency.

[0089] It should be understood that for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present application.

Claims

1. An automatic loading and unloading device for wafer polishing and grinding, which is configured with a polishing and grinding machine (40) for grinding and polishing wafers. The polishing and grinding machine (40) includes a plurality of planetary wheels (41), and each planetary wheel (41) has a plurality of grinding and polishing stations (411) for fixing wafers. It is characterized in that The automatic loading and unloading device for wafer polishing and grinding includes: A loading and sampling inspection module (10) for carrying a wafer transfer box (11); A wafer unloading buffer module (60) for storing the wafers after grinding and polishing; A detection and unloading motion module (50) for detecting the relative position relationship between a plurality of the grinding and polishing stations (411) in one planetary wheel (41) and generating a control signal representing the relative position relationship; A wafer loading buffer module (30) includes a wafer loading positioning buffer table (31) and a buffer motion device (32). The wafer loading positioning buffer table (31) is used for carrying or storing wafers. The wafer loading positioning buffer table (31) includes a positioning station (311) and an adjustment platform (312). The number of positioning stations (311) is the same as the number of the grinding and polishing stations (411) in the planetary wheel (41). The buffer motion device (32) can transfer the wafers stored in the wafer loading positioning buffer table (31) to the corresponding positioning stations (311). The adjustment platform (312) is used to adjust the wafers located in the positioning stations (311) in response to the control signal, so that the position distribution of the wafers is consistent with the position distribution of a plurality of the grinding and polishing stations (411) in the planetary wheel (41); A wafer loading and unloading motion module (20) for transferring the wafers in the wafer transfer box (11) to the wafer loading buffer module (30), and the wafer loading and unloading motion module (20) is also used to grab all the adjusted wafers in the positioning stations (311) and transfer the wafers to the corresponding grinding and polishing stations (411).

2. The automatic loading and unloading device for wafer polishing and grinding according to claim 1, wherein The detection and unloading motion module (50) includes a vision positioning component (522). When the vision positioning component (522) moves above the first planetary wheel, the vision positioning component (522) detects the first relative position relationship of a plurality of the grinding and polishing stations (411) in the first planetary wheel and generates a first control signal representing the first relative position relationship. The adjustment platform (312) can adjust the wafers located in the positioning stations (311) in response to the first control signal. When the adjustment platform (312) adjusts the wafers, the vision positioning component (522) moves above the second planetary wheel to detect the second relative position relationship of a plurality of the grinding and polishing stations (411) in the second planetary wheel and generate a second control signal representing the second relative position relationship.

3. The automatic loading and unloading device for wafer polishing and grinding according to claim 2, wherein When the visual positioning component (522) detects the second relative position relationship, the upper and lower wafer movement module (20) grabs all the adjusted wafers at the positioning station (311) and transfers the wafers to the corresponding grinding and polishing stations (411) in the first planetary wheel.

4. The automatic loading and unloading device for wafer grinding and polishing according to claim 2, wherein the visual positioning component (522) includes a light source (5221) and a camera (5222). The light source (5221) is used to irradiate the grinding and polishing station (411), and the camera (5222) is used to receive the optical signal reflected from the grinding and polishing station (411) and determine the relative position relationship between multiple grinding and polishing stations (411) in the planetary wheel (41) based on the reflection imaging method.

5. The automatic loading and unloading device for wafer grinding and polishing according to claim 2, wherein the detection and unloading movement module (50) includes a detection and unloading control device (51) and a first support structure (52). The first support structure (52) is installed on the detection and unloading control device (51) and can move under the action of the detection and unloading control device (51). A pressing block group (524) with the same number as the grinding and polishing stations (411) is arranged on the first support structure (52). The distribution positions of the multiple pressing block groups (524) are the same as the distribution positions of the multiple grinding and polishing stations (411) in the same planetary wheel. The pressing block group (524) includes several pressing blocks (5241), and the pressing blocks (5241) can press the wafers located at the grinding and polishing stations (411) under the control of the detection and unloading control device (51); the visual positioning component (522) is installed on the first support structure (52).

6. The automatic loading and unloading device for wafer grinding and polishing according to claim 5, wherein the detection and unloading movement module (50) includes a sensor group (525) installed on the first support structure (52). The number of the sensor groups (525) is the same as the number of the grinding and polishing stations (411), and the distribution positions of the multiple sensor groups (525) are the same as the distribution positions of the multiple grinding and polishing stations (411). The sensor group (525) can detect whether the wafer is within the range defined by the grinding and polishing station (411); the sensor group (525) includes several sensor units. Among two adjacent sensor groups (525), the sensor units in one of the sensor groups (525) can be reused in the other sensor group (525).

7. The automatic loading and unloading device for wafer grinding and polishing according to claim 1, wherein The upper wafer positioning and buffering table (31) further includes a buffering station (313). The buffering station (313) is arranged below the adjustment platform (312). The buffering station (313) has a plurality of layers of storage areas (3131) distributed from top to bottom. Each layer of the storage area (3131) can store a plurality of wafers transferred by the wafer loading and unloading motion module (20). The buffering motion device (32) can transfer the wafers in the storage area (3131) to the corresponding positioning station (311).

8. The automatic wafer polishing and grinding loading and unloading equipment according to claim 7, characterized in that The buffering motion device (32) includes a transfer assembly (321) and a fixed bracket (322). One end of the transfer assembly (321) extends towards the positioning and buffering table (31), and the other end is installed on the fixed bracket (322) and can move relative to the fixed bracket (322) in the height direction. The upper wafer buffering module (30) includes a frame (33). A guide rail (331) extending in a set direction is arranged on the frame (33). The fixed bracket (322) is installed on the guide rail (331) and can slide relative to the guide rail (331) in the set direction.

9. The automatic wafer polishing and grinding loading and unloading equipment according to claim 8, characterized in that The transfer assembly (321) includes a transfer fork arm (3211) and a driving unit (3212) for driving the transfer fork arm (3211) to move. The transfer fork arm (3211) can move in the height direction under the action of the driving unit (3212) to grasp the wafers in the corresponding storage layer (3131).

10. The automatic wafer polishing and grinding loading and unloading equipment according to claim 9, characterized in that The fork arm is set as a single-piece fork arm (3211a) and / or a double-piece fork arm (3211b). The single-piece fork arm (3211a) corresponds to one buffering station (313) and grasps the wafers in the storage layer (3131) of one buffering station (313). The double-piece fork arm (3211b) corresponds to two buffering stations (313). The double-piece fork arm (3211b) can simultaneously grasp the wafers in the corresponding storage layers (3131) of the two buffering stations (313).

11. The automatic wafer polishing and grinding loading and unloading equipment according to claim 1, characterized in that The upper and lower wafer movement module (20) includes an upper and lower wafer control device (21), a second support structure (22), and a plurality of suction attachment groups (23). The second support structure (22) is installed on the upper and lower wafer control device (21) and can move under the action of the upper and lower wafer control device (21). The number of the suction attachment groups (23) is the same as the number of the positioning stations (311), and the distribution positions of the plurality of suction attachment groups (23) are the same as the distribution positions of the plurality of positioning stations (311). Each suction attachment group (23) includes a plurality of suction attachments (231), and the suction attachments (231) can grasp the wafers located at the positioning stations (311).

12. The automatic wafer polishing and grinding loading and unloading equipment according to claim 11, wherein the upper and lower wafer movement module (20) includes a moving mechanism (24). At least two of the plurality of suction attachment groups (23) are configured with the moving mechanism (24). The moving mechanism (24) can adjust the positions of the suction attachment groups (23) so that the plurality of suction attachment groups (23) can correspond to the grasping positions of the wafers adjusted by the adjustment platform (312).

13. The automatic wafer polishing and grinding loading and unloading equipment according to claim 12, wherein the lower wafer buffer module (60) includes a water tank (61) and a moving bracket (62). The water tank (61) forms a liquid storage space for storing liquid. The moving bracket (62) can move relative to the water tank (61) in the height direction to enter / leave the liquid storage space. When the moving bracket (62) leaves the liquid storage space, the upper and lower wafer movement module (20) can grasp the wafers in the same planetary gear (41) and transfer them into the moving bracket (62).

14. The automatic wafer polishing and grinding loading and unloading equipment according to claim 13, wherein the moving bracket (62) includes a first wafer fixing plate (622) and a second wafer fixing plate (623) that can move relative to each other in the height direction. The first wafer fixing plate (622) and the second wafer fixing plate (623) are staggered in the horizontal direction.

15. The automatic wafer polishing and grinding loading and unloading equipment according to claim 14, wherein when the upper and lower wafer movement module (20) grasps the polished and ground wafers, the moving mechanism (24) can drive the suction attachment groups (23) to move so that the surfaces of the plurality of wafers do not overlap. The upper and lower wafer movement module (20) transfers the wafers adjusted by the moving mechanism (24) into the first wafer fixing plate (622) and the second wafer fixing plate (623) that are staggered in distribution.

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