Solder paste printing and quality detection integrated system for circuit board production

Abstract

The invention discloses a solder paste printing and quality detection integrated system for circuit board production, which relates to the technical field of circuit board detection, and is characterized by comprising a control module, a printing module, a quality detection module and a feedback regulation module, the device has the effects that the control module performs deviation analysis and comprehensive quality evaluation based on a solder paste quality standard preset in the quality standard database, when detection data exceed a standard range, the control module generates instructions for adjusting printing pressure, scraper speed, scraper angle and solder paste supply quantity, the deviation is corrected in real time through the feedback adjustment module, and the printing quality is improved. Therefore, the printing quality is optimized; when the data is within the standard range, the system does not need to be adjusted, the printing module continues to operate according to the original parameters, an efficient real-time closed-loop control process is formed, the process complexity is reduced through an integrated detection and feedback mechanism, the production efficiency is improved, boundary integrity detection and parameter dynamic optimization are achieved through a # imgabs0 # visual algorithm, and the method is suitable for large-scale production. And the defect rate is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and more specifically, it relates to an integrated system for solder paste printing and quality detection in circuit board production. Background Art

[0002] In modern electronics manufacturing, the production of printed circuit boards (PCBs) is a core link in the entire electronics industry. With the development of miniaturization and high density of electronic components, solder paste printing, as an important step in the circuit board soldering process, directly affects the success rate of subsequent chip soldering and the performance of the final product.

[0003] Traditional solder paste printing equipment and quality detection equipment are usually set separately. After solder paste printing is completed, the circuit board needs to be transferred to an independent quality detection equipment to detect the solder paste thickness, printing position deviation, and boundary shape, etc. This results in multiple steps required to complete printing and detection, increasing the complexity of the process, reducing the overall efficiency of the production line, and the detection result lags behind the printing process, making it impossible to detect problems in time during printing, leading to the accumulation of potential defects. The printing parameters (such as pressure, squeegee speed, solder paste supply volume, etc.) cannot be dynamically adjusted according to the detection result, resulting in insufficient quality control accuracy.

[0004] Therefore, in order to solve the above technical problems, the present application proposes an integrated system for solder paste printing and quality detection in circuit board production. Summary of the Invention

[0005] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide an integrated system for solder paste printing and quality detection in circuit board production.

[0006] To achieve the above purpose, the present invention provides the following technical solution: An integrated system for solder paste printing and quality detection in circuit board production, including a control module, a printing module, a quality detection module, and a feedback adjustment module;

[0007] The quality detection module is integrated within the running track of the printing module. The quality detection module uses an industrial camera and a laser scanning device to perform real-time detection on the thickness, shape, and printing position of the solder paste, and transmits the detection data to the control module;

[0008] The control module calculates the detection data based on the preset quality standard of solder paste printing, and uses the following formula to evaluate the printing deviation:

[0009] Solder paste thickness deviation formula:

[0010]

[0011] Where is the solder paste thickness deviation, is the actual thickness of the solder paste detected by the quality inspection module, is the preset standard solder paste thickness;

[0012] Solder paste position deviation formula:

[0013] ,

[0014] wherein, , are the horizontal and vertical position deviations of the solder paste respectively, , is the actual position coordinate of the detected solder paste, , is the standard position coordinate of the solder paste;

[0015] Deviation weight function:

[0016]

[0017] wherein, is the comprehensive deviation evaluation value, is the thickness deviation weight factor, is the horizontal deviation weight factor;

[0018] The control module generates a parameter adjustment instruction according to the calculation result of the deviation weight function and transmits the instruction to the feedback adjustment module;

[0019] The feedback adjustment module is used to adjust the printing pressure of the printing module , the blade speed , the blade angle and the solder paste supply amount , so as to reduce the total deviation evaluation value to achieve the purpose of adjusting the printing of the printed circuit board by the printing module.

[0020] Preferably, the quality inspection module realizes the detection of the solder paste boundary shape through a vision algorithm, and the vision algorithm uses the following formula to evaluate the integrity of the solder paste boundary:

[0021]

[0022] wherein, is the solder paste boundary integrity index, is the actual area of the detected solder paste boundary, is the preset standard solder paste boundary area. When , the system determines that the solder paste boundary is incomplete and generates an adjustment instruction, and the is a preset integrity threshold.

[0023] Preferably, the control module includes a data processing unit and a quality standard database, and the data processing unit generates a parameter adjustment instruction based on the following optimization algorithm:

[0024]

[0025] wherein, and are the adjusted printing pressure and squeegee speed respectively, and are the current printing pressure and squeegee speed, and are preset adjustment factors.

[0026] Preferably, the feedback adjustment module adjusts at least one of the following printing parameters through a dynamic learning algorithm:

[0027]

[0028] wherein, is the adjusted solder paste supply amount, is the current solder paste supply amount, is the learning rate, is the solder paste boundary integrity error.

[0029] Preferably, the control module applies a feedback control algorithm, predicts possible printing defects based on continuously detected deviation data, and uses the following prediction formula:

[0030]

[0031] wherein, is the predicted comprehensive deviation evaluation value, is the current comprehensive deviation evaluation value, is the change rate of the deviation over time, is the prediction factor;

[0032] When , the system generates an adjustment instruction in advance, and the is a preset deviation threshold.

[0033] Preferably, the control module and the quality detection module are connected by wireless communication. The industrial camera and laser scanning device in the quality detection module send the collected data to the control module through wireless communication. According to the preset solder paste quality standard in the quality standard database, analyze the data of the solder paste thickness, position and boundary shape, judge whether there is a deviation. If the quality data exceeds the standard range, generate a corresponding adjustment instruction. If the data is within the standard range, no adjustment is required and the operation continues.

[0034] Preferably, the adjustment instruction generation logic includes:

[0035] If the deviation of the solder paste thickness is large, generate instructions to adjust the printing pressure and the supply amount of the solder paste;

[0036] If the deviation of the solder paste position is large, generate instructions to adjust the blade angle or the moving speed;

[0037] If the boundary shape is incomplete, generate instructions to optimize the supply amount of the solder paste;

[0038] Meanwhile, based on the continuously detected data, predict the upcoming printing defects, generate adjustment instructions in advance, and prevent the subsequent defects from expanding.

[0039] Preferably, the feedback adjustment module receives and executes the adjustment instructions through the control module. The adjustment instructions include adjusting the following parameters of the printing module:

[0040] Printing pressure, that is, adjusting the printing force on the circuit board during printing; Blade speed, that is, adjusting the moving speed of the blade scraping the solder paste; Blade angle, that is, the inclination angle of the blade during solder paste printing; Supply amount of the solder paste, that is, adjusting the actual amount of the solder paste used according to the detection result of the boundary shape.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] In the present invention, by integrating the quality detection module into the running track of the printing module, the real-time detection of the solder paste thickness, position and boundary shape is realized by combining the industrial camera and the laser scanning device. The detection data is transmitted to the control module by wireless communication. The control module performs deviation analysis and comprehensive quality evaluation based on the preset solder paste quality standard in the quality standard database. When the detection data exceeds the standard range, the control module generates instructions to adjust the printing pressure, blade speed, blade angle and supply amount of the solder paste, and the deviation is corrected in real time through the feedback adjustment module, thereby optimizing the printing quality; while when the data is within the standard range, the system does not need to be adjusted, and the printing module continues to run according to the original parameters, forming an efficient real-time closed-loop control process. Compared with the traditional method of separating the solder paste printing and quality detection equipment mentioned in the background technology, the present invention reduces the process complexity and improves the production efficiency by integrating the detection and feedback mechanism, and realizes the boundary integrity detection and parameter dynamic optimization through the vision algorithm, effectively reducing the defect rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of this application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0044] Figure 1 is the system flow chart of the present invention;

[0045] Figure 2 is the schematic diagram of the module relationship in the present invention. Detailed implementation manners

[0046] As Figure 1 and Figure 2 shown, the present invention provides an integrated system for solder paste printing and quality inspection in circuit board production, including a control module, a printing module, a quality inspection module, and a feedback adjustment module;

[0047] Printing module: Executes the solder paste printing task and evenly applies the solder paste on the surface of the circuit board through a squeegee;

[0048] Quality inspection module: Integrated within the running track of the printing module, used to detect the quality data of the solder paste in real time. This module includes an industrial camera and a laser scanning device;

[0049] Control module: Used to receive the data collected by the quality inspection module, calculate the deviation of the detection data based on the preset standard of the solder paste quality, and generate an adjustment instruction;

[0050] Feedback adjustment module: According to the adjustment instruction generated by the control module, dynamically adjusts the printing pressure, squeegee speed, squeegee angle, and solder paste supply amount of the printing module to form a closed-loop control.

[0051] The quality inspection module is integrated within the running track of the printing module. The quality inspection module uses the industrial camera and the laser scanning device to detect the thickness, shape, and printing position of the solder paste in real time, and transmits the detection data to the control module;

[0052] The control module and the quality inspection module are connected by wireless communication. The wireless communication method selected in this embodiment is the industrial wireless protocol (such as WirelessHART or ISA100, which will not be elaborated in the prior art here), which is dedicated to industrial automation scenarios and has high reliability;

[0053] The control module calculates the detection data based on the preset quality standard of the solder paste printing, and uses the following formula to evaluate the printing deviation:

[0054] Solder paste thickness deviation formula:

[0055]

[0056] Where is the solder paste thickness deviation, is the actual solder paste thickness detected by the quality inspection module, is the preset standard solder paste thickness;

[0057] It should be noted that the laser scanning device in the quality inspection module of this embodiment scans the surface of the solder paste at a high frequency to obtain the thickness value of the solder paste, and the detection data is sent to the control module and compared with the preset standard thickness to calculate the thickness deviation .

[0058] Solder paste position deviation formula:

[0059] ,

[0060] wherein, , are respectively the lateral and longitudinal position deviations of the solder paste, , is the actual position coordinate of the detected solder paste, , is the standard position coordinate of the solder paste;

[0061] It should be noted that in this embodiment, during the continuous production process, the control module predicts that the solder paste position of a certain batch of circuit boards may deviate through the continuously detected data stream. Through the position deviation detection algorithm, the system detects that the position deviation values and are approaching the preset allowable upper limit, = 0.09 mm (the allowable upper limit is 0.1 mm). To prevent the deviation from further expanding and causing uneven solder paste coverage, the control module generates optimization instructions for adjusting the squeegee speed and the squeegee tilt angle in advance and sends them to the feedback adjustment module. After the feedback adjustment module adjusts the parameters, the printing position of the solder paste remains within the standard range again, ensuring the stability of the subsequent process.

[0062] The quality inspection module realizes the detection of the solder paste boundary shape through the vision algorithm, and the vision algorithm uses the following formula to evaluate the integrity of the solder paste boundary:

[0063]

[0064] wherein, is the solder paste boundary integrity index, is the actual area of the detected solder paste boundary, is the preset standard solder paste boundary area. When , the system determines that the solder paste boundary is incomplete and generates an adjustment instruction, is the preset integrity threshold

[0065] In this embodiment, based on the solder paste printing image data collected by the industrial camera, The vision algorithm first pre - processes the image, including denoising, contrast enhancement, and edge detection. Then, through a boundary recognition algorithm (such as existing technologies like the Canny edge detection - based or deep - learning - based boundary extraction algorithms), it accurately extracts the actual boundary region of the solder paste printing and calculates the actual area of the solder paste through pixel area calculation. Meanwhile, the system extracts the preset standard solder paste area from the quality standard database. As a comparison benchmark, based on these two pieces of data, the system calculates the boundary integrity index to quantify the integrity degree of the solder paste printing boundary.

[0066] When the boundary integrity index is less than the preset integrity threshold (for example = 0.95), the system determines that the solder paste boundary is incomplete and may have defects (such as irregular, broken, or missing solder paste edges). In this case, the system generates boundary optimization adjustment instructions, specifically including instructions to optimize the solder paste supply amount, adjust the squeegee angle or speed, to improve the boundary shape of the solder paste. The generated instructions are sent to the feedback adjustment module through wireless communication, and it performs the adjustment operation to optimize the printing parameters in real - time, thereby ensuring the integrity and quality stability of the solder paste boundary. The whole process is executed in real - time under closed - loop control to ensure continuous optimization of the printing quality.

[0067] Deviation weight function:

[0068]

[0069] Among them, is the comprehensive deviation evaluation value, is the thickness deviation weight factor, is the lateral deviation weight factor.

[0070] The control module generates parameter adjustment instructions according to the calculation result of the deviation weight function and passes the instructions to the feedback adjustment module.

[0071] The logic for generating this adjustment instruction includes:

[0072] If the solder paste thickness deviation is large, generate instructions to adjust the printing pressure and solder paste supply amount.

[0073] If the solder paste position deviation is large, generate instructions to adjust the squeegee angle or moving speed.

[0074] If the boundary shape is incomplete, that is, when the boundary integrity index is less than the threshold , generate instructions to optimize the solder paste supply amount.

[0075] Based on the continuously detected data, predict the upcoming printing defects, generate adjustment instructions in advance, and prevent the subsequent defects from expanding.

[0076] The feedback adjustment module is used to adjust the printing pressure of the printing module , the squeegee speed , the squeegee angle and the solder paste supply amount , so as to reduce the total deviation evaluation value and achieve the purpose of adjusting the printing of the circuit board by the printing module.

[0077] The control module includes a data processing unit and a quality standard database. The data processing unit generates parameter adjustment instructions based on the following optimization algorithm:

[0078]

[0079] Among them, , are the adjusted printing pressure and squeegee speed respectively, , are the current printing pressure and squeegee speed, , are preset adjustment factors.

[0080] The feedback adjustment module adjusts at least one of the following printing parameters through a dynamic learning algorithm:

[0081]

[0082] Among them, is the adjusted solder paste supply amount, is the current solder paste supply amount, is the learning rate, is the solder paste boundary integrity error.

[0083] The feedback adjustment module receives and executes the adjustment instructions through the control module. The adjustment instructions include adjusting the following parameters of the printing module:

[0084] Printing pressure adjustment: According to the adjustment instructions, change the pressure of the printing squeegee , and optimize the thickness distribution of the solder paste on the surface of the circuit board;

[0085] Squeegee speed adjustment: Adjust the moving speed of the squeegee , and ensure the uniform distribution of the solder paste;

[0086] Squeegee angle adjustment: Change the tilt angle of the squeegee , and improve the printing form of the solder paste;

[0087] Solder paste supply amount adjustment: According to the boundary detection data, adjust the supply amount of the solder paste in real time , ensure the integrity of the solder paste printing boundary.

[0088] It should be noted that in this embodiment, during the circuit board production process, the laser scanning device in the quality detection module monitors in real time that the thickness of the solder paste has a deviation. The detection data shows the deviation value between the actual thickness and the preset standard thickness > 0.1 mm. This thickness deviation may cause problems such as loose or false soldering of subsequent components. The detection data is transmitted to the control module through wireless communication. The control module immediately starts the thickness deviation analysis algorithm to generate an optimized instruction for adjusting the printing pressure , and sends it to the feedback adjustment module. The feedback adjustment module dynamically reduces the pressure value of the squeegee according to the instruction to make the solder paste thickness evenly distributed. Subsequently, through continuous detection and verification, the thickness deviation gradually shrinks to ≤0.02 mm, returning to the standard range.

[0089] This embodiment is applicable to the production of the same batch. When the industrial camera captures that the solder paste boundary in some circuit board areas is broken or irregular, after analysis by the vision algorithm, the boundary integrity index calculated by the system is less than the threshold, = 0.95, and the actually detected solder paste area is only 90% of the standard area . The system determines that the boundary is incomplete, which may cause the solder to fail to evenly cover the pads during the soldering process and affect the soldering quality. The control module generates an adjustment instruction for optimizing the solder paste supply amount according to the deviation calculation result , and transmits the instruction to the feedback adjustment module. The feedback adjustment module immediately executes it, and by increasing the solder paste supply amount and slightly adjusting the squeegee angle , the boundary compensation optimization is realized, and the integrity of the solder paste printing is restored to the standard.

[0090] The control module applies the feedback control algorithm to predict possible printing defects based on the continuously detected deviation data, using the following prediction formula:

[0091]

[0092] where is the predicted comprehensive deviation evaluation value, is the current comprehensive deviation evaluation value, is the change rate of the deviation over time, is the prediction factor;

[0093] When , the system generates an adjustment instruction in advance, is the preset deviation threshold;

[0094] In this embodiment, the quality detection module continuously collects the real-time data of solder paste printing and transmits it to the control module. After analyzing the deviation, the control module generates an adjustment instruction and feeds it back to the adjustment module for real-time adjustment, forming a closed-loop control.

[0095] The control module and the quality detection module are connected by wireless communication. The industrial camera in the quality detection module collects the image data of solder paste printing in real time. The laser scanning device synchronously obtains the solder paste thickness information, and transmits the quality data such as the detected thickness, position, and boundary shape to the control module through wireless communication. After receiving the data, the control module compares and analyzes it with the preset solder paste quality standard in the quality standard database, calculates the deviation value of the data, and evaluates the comprehensive quality status of solder paste printing. If the analysis result shows that the quality data exceeds the standard range, the control module will generate corresponding adjustment instructions in real time, including parameters such as adjusting the printing pressure, squeegee speed, squeegee angle, and solder paste supply amount, and send the instructions to the feedback adjustment module through wireless communication. The feedback adjustment module performs dynamic adjustment according to the instructions to correct the deviation, thereby optimizing the printing quality. If the detected data is within the standard range, the system does not need to be adjusted, and the printing module continues to run according to the original parameters, forming an efficient real-time closed-loop control process.

[0096] In summary, by integrating the quality detection module into the running track of the printing module, combining the industrial camera and the laser scanning device to realize the real-time detection of the solder paste thickness, position, and boundary shape, using wireless communication to transmit the detection data to the control module, and the control module performing deviation analysis and comprehensive quality evaluation based on the preset solder paste quality standard in the quality standard database. When the detection data exceeds the standard range, the control module generates instructions to adjust the printing pressure, squeegee speed, squeegee angle, and solder paste supply amount, and corrects the deviation in real time through the feedback adjustment module, thereby optimizing the printing quality. When the data is within the standard range, the system does not need to be adjusted, and the printing module continues to run according to the original parameters, forming an efficient real-time closed-loop control process. Compared with the traditional method of separating solder paste printing and quality detection equipment mentioned in the background technology, the present invention reduces the process complexity and improves the production efficiency by integrating the detection and feedback mechanism, and realizes the boundary integrity detection and parameter dynamic optimization through the vision algorithm, effectively reducing the defect rate.

[0097] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention; any ordinary technician in the industry can smoothly implement the present invention according to what is shown in the accompanying drawings of the specification and the above description; however, any minor changes, modifications, and equivalent variations made by those skilled in the art without departing from the technical solution of the present invention and using the technical content disclosed above are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications, and evolutions made to the above embodiments based on the essential technology of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. An integrated system for solder paste printing and quality inspection in circuit board production, characterized in that: It includes a control module, a printing module, a quality inspection module, and a feedback adjustment module; The quality inspection module is integrated into the running track of the printing module. The quality inspection module uses an industrial camera and a laser scanning device to detect the thickness, shape, and printing position of the solder paste in real time, and transmits the detection data to the control module; Based on the preset quality standard for solder paste printing, the control module calculates the detection data and uses the following formula to evaluate the printing deviation: Solder paste thickness deviation formula: ； Among them is the solder paste thickness deviation is the actual solder paste thickness detected by the quality inspection module is the preset standard solder paste thickness; Solder paste position deviation formula: ， ； Among them, and are the horizontal and vertical position deviations of the solder paste respectively, , is the actual position coordinate of the detected solder paste, , is the standard position coordinate of the solder paste; Deviation weight function: ； Among them, is the comprehensive deviation evaluation value, is the thickness deviation weight factor, is the lateral deviation weight factor; The control module generates a parameter adjustment instruction according to the calculation result of the deviation weight function and transmits the instruction to the feedback adjustment module; The feedback adjustment module is used to adjust the printing pressure of the printing module , the squeegee speed , the squeegee angle and the solder paste supply amount , so as to reduce the total deviation evaluation value , achieving the purpose of adjusting the printing of the circuit board by the printing module.

2. The integrated system for solder paste printing and quality inspection in circuit board production according to claim 1, wherein: The quality inspection module detects the shape of the solder paste boundary through a vision algorithm. The vision algorithm uses the following formula to evaluate the integrity of the solder paste boundary: ； Among them, is the solder paste boundary integrity index, is the actual area of the detected solder paste boundary, is the preset standard solder paste boundary area. When , the system determines that the solder paste boundary is incomplete and generates an adjustment instruction. The is the preset integrity threshold.

3. An integrated system for solder paste printing and quality inspection in circuit board production according to claim 1 or 2, characterized in that: The control module includes a data processing unit and a quality standard database. The data processing unit generates a parameter adjustment instruction based on the following optimization algorithm: ； Among them, and are the adjusted printing pressure and squeegee speed respectively, and are the current printing pressure and squeegee speed, and are preset adjustment factors.

4. An integrated system for solder paste printing and quality inspection in circuit board production according to claim 1 or 3, characterized in that: The feedback adjustment module adjusts at least one of the following printing parameters through a dynamic learning algorithm: ； Among them, is the adjusted solder paste supply amount, is the current solder paste supply amount, is the learning rate, is the solder paste boundary integrity error.

5. An integrated system for solder paste printing and quality inspection in circuit board production according to claim 1 or 4, characterized in that: The control module applies a feedback control algorithm to predict possible printing defects based on continuously detected deviation data, and uses the following prediction formula: ； Among them, is the predicted comprehensive deviation evaluation value, is the current comprehensive deviation evaluation value, is the rate of change of the deviation over time, is the prediction factor; When the system generates an adjustment instruction in advance, and the is a preset deviation threshold.

6. The integrated system for solder paste printing and quality inspection in circuit board production according to claim 5, wherein: The control module and the quality inspection module are connected by wireless communication. The industrial camera and laser scanning device in the quality inspection module send the collected data to the control module through wireless communication. According to the preset solder paste quality standard in the quality standard database, analyze the data of the solder paste thickness, position, and boundary shape, and judge whether there is a deviation. If the quality data exceeds the standard range, generate a corresponding adjustment instruction. If the data is within the standard range, no adjustment is required and the operation continues.

7. An integrated system for solder paste printing and quality inspection in circuit board production according to claim 6, characterized in that: The adjustment instruction generation logic includes: If the solder paste thickness deviation is large, generate an instruction to adjust the printing pressure and the solder paste supply amount; If the solder paste position deviation is large, generate an instruction to adjust the squeegee angle or the moving speed; If the boundary shape is incomplete, generate an instruction to optimize the solder paste supply amount; At the same time, based on continuously detected data, predict upcoming printing defects and generate adjustment instructions in advance to prevent subsequent defect expansion.

8. An integrated system for solder paste printing and quality inspection in circuit board production according to claim 7, characterized in that: The feedback adjustment module receives and executes the adjustment instruction through the control module. The adjustment instruction includes adjusting the following parameters of the printing module: Printing pressure, that is, adjusting the printing force on the circuit board during printing; squeegee speed, that is, adjusting the moving speed of the squeegee scraping the solder paste; squeegee angle, that is, the inclination angle of the squeegee during solder paste printing; solder paste supply amount, that is, adjusting the actual amount of solder paste used according to the detection result of the boundary shape.

Images