Semiconductor wafer processing equipment and processing method thereof
Through the design of jaw-type wafer processing equipment, the cleaning blind spots are eliminated by the inertial rotation of conveyor belts and wafers, and the problems of cleaning blind spots and inefficiency of existing equipment are solved and the applicability is improved.
CN120453225AActive Publication Date: 2025-08-08CHUZHOU HRM ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202510612406.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-13
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2045-05-13
AI Technical Summary
Technical Problem
Existing semiconductor wafer processing equipment has problems such as blind spots in cleaning, low processing efficiency and poor applicability to wafer specifications.
Method used
The jaw type wafer processing equipment is adopted. The jaw is a vertically arranged conveyor belt structure. The outer ring of the conveyor belt is equipped with soft teeth. The clamping and relaxation of the wafer is achieved through the sliding of the multiple jaws, and the inertial rotation of the wafer is used to eliminate the cleaning blind spots.
Benefits of technology
It realizes blind spot-free cleaning, improves wafer processing efficiency, and enhances the applicability to wafers of different specifications.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses semiconductor wafer processing equipment and a processing method thereof, and relates to the technical field of semiconductor processing equipment, clamping jaw type wafer processing equipment is provided, a clamping jaw of the clamping jaw type wafer processing equipment is of a vertically-arranged conveying belt structure positioned on a vertically-arranged rod body, a conveying belt is made of a soft material, and the outer ring of the conveying belt is provided with a circle of soft teeth; the number of the clamping jaws is larger than or equal to three, and the clamping jaws slide oppositely to clamp and loosen a wafer. During use, a wafer needing to be cleaned is plugged between the clamping jaws and then is gradually filled between the two teeth along with the rotating edge of the conveying belt so as to be positioned; in the rotating cleaning process, if the wafer needs to rotate around the axis of the wafer, clamping on the wafer can be released on the premise that the wafer is not separated from the soft teeth, and the wafer rotates relative to the clamping jaw by means of inertia after the wafer is rapidly stopped or rapidly decelerated after rotating; the technical effects that the semiconductor wafer processing equipment can clean the wafer without dead corners, the wafer processing efficiency is high, and the applicability to the wafer specification is high are achieved.
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