A semiconductor wafer processing device and its processing method

By designing multiple vertical wafer carrier components and conveyor belt structures, combined with inertial rotation and extrusion positioning, the problems of cleaning dead angles and applicability of existing equipment have been solved, achieving efficient cleaning without dead angles and applicability to multiple wafer specifications, thereby improving production efficiency.

CN120453225BActive Publication Date: 2025-11-14CHUZHOU HRM ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202510612406.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-05-13
Publication Date
2025-11-14
Estimated Expiration
2045-05-13

AI Technical Summary

Technical Problem

Existing semiconductor wafer processing equipment suffers from problems such as cleaning dead zones, low processing efficiency, and poor applicability to wafer specifications.

Method used

It employs multiple vertically placed wafer carrier components and conveyor belt structures, utilizing soft carrier belts and limiting tracks to achieve thorough cleaning and efficient clamping of wafers. Inertial rotation eliminates cleaning dead angles, and extrusion positioning components and extension units are added to improve applicability.

Benefits of technology

It achieves thorough cleaning of semiconductor wafer processing equipment, improves processing efficiency and applicability to wafers of different specifications, and enhances the cleaning effect and production efficiency of the equipment.

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Abstract

This application discloses a semiconductor wafer processing equipment and method, relating to the field of semiconductor processing equipment technology. This application provides a gripper-type wafer processing equipment, where the grippers are vertically positioned conveyor belt structures mounted on vertical rods. The conveyor belt is made of a soft material and has a ring of soft teeth on its outer edge. The number of grippers is greater than or equal to three, sliding towards each other to clamp and release the wafer. During use, the wafer to be cleaned is inserted between the grippers, and as the conveyor belt rotates, its edge is gradually filled between the teeth and positioned. During the rotational cleaning process, if it is desired to rotate the wafer around its own axis, the clamping on the wafer can be loosened without disengaging the soft teeth. After rotation, a rapid stop or deceleration is performed, and then the wafer rotates relative to the grippers due to inertia. This achieves the technical effects of enabling the semiconductor wafer processing equipment to clean wafers without dead angles, with high wafer processing efficiency and strong applicability to wafer specifications.
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