Device for removing impurities in plating solution on line

Abstract

The invention relates to the technical field of plating solution impurity removal, and discloses an online plating solution impurity removal device which comprises an electroplating bath, an online monitor is fixedly connected to the bottom end of the interior of the electroplating bath, an electric control flow pump is fixedly connected into the electroplating bath, and a particle filtering mechanism is fixedly connected to the bottom end, away from the side face of the electroplating bath, of the electric control flow pump. A sealing pipe is movably connected to the side surface of the particle filtering mechanism; an organic filtering mechanism is fixedly connected to the side surface, away from the particle filtering mechanism, of the sealing pipe; the content of impurities in the electroplating liquid is monitored through the online monitor, the electroplating liquid containing the impurities is pumped into the particle filtering mechanism through the electric control flow pump, particle impurities in the electroplating liquid are filtered through the particle filtering mechanism, organic impurities in the electroplating liquid are removed through the organic filtering mechanism after filtering, and the electroplating liquid containing the impurities is obtained. Metal ion impurities in the electroplating liquid are removed through the cation resin column and the anion resin column, the clean electroplating liquid flows back into the electroplating bath, and the purity of the electroplating liquid in the electroplating bath is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of plating solution impurity removal, and more particularly to a device for online plating solution impurity removal. Background Art

[0002] As a surface treatment technology that can be used to decorate, protect, and perform functional processing on metal and non-metal surfaces, electroplating has become an indispensable supporting industry in my country's manufacturing industry. It is widely used in machinery, instrumentation, light industry, printed circuit boards, electronic components, aerospace, and other fields. However, for a long time, the extensive operation of the traditional electroplating industry has not only polluted the environment, but also made enterprises inefficient and difficult to sustain.

[0003] Electroplating wastewater and plated parts cleaning wastewater contain a variety of metal ion impurities such as copper, chromium, zinc, and cadmium. The complex composition not only seriously harms the natural environment, but also causes problems such as low production efficiency and poor product quality in electroplating production lines. In the plating solution, impure metal ions affect the physical and chemical properties of the plating solution, change the electrochemical characteristics of the plating solution, affect the uniformity and crystallization quality of the coating, and lead to many coating defects and poor interface bonding ability, ultimately affecting the gloss, hardness, and corrosion resistance of the coating.

[0004] Therefore, during the electroplating process, the concentration of impure metal ions in the plating solution should be controlled as much as possible to ensure the quality of the coating and process stability. In addition, the current detection of impurity ions in the plating solution is mostly extraction-based, which has a long detection cycle and poor accuracy, and cannot meet the needs of online real-time monitoring. The plating solution also contains various organic impurities and particulate impurities such as dust brought into the plating solution by the electroplated parts, which will also affect the electroplating process.

[0005] The low separation rate of impurity ions in the plating solution and backward technology limit the efficient circulation of the electroplating production line and the green and high-quality development. Traditional electroplating processes are often accompanied by problems such as environmental pollution and waste of resources, which hinder the industry's green transformation and high-quality development. This puts higher requirements on the plating solution stability control technology, plating solution impurity metal ion detection and separation technology, etc. in the electroplating process. Summary of the Invention

[0006] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides an apparatus for removing impurities from a plating solution online, so as to solve the technical problems raised in the background art.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an apparatus for online removal of impurities from a plating solution, comprising an electroplating tank, an anode plate fixedly connected to one side of the electroplating tank, a cathode plate fixedly connected to the other side of the electroplating tank, an online monitor fixedly connected to the bottom end of the interior of the electroplating tank, an electrically controlled flow pump fixedly connected to the electroplating tank, a particle filter mechanism fixedly connected to the bottom end of the electrically controlled flow pump away from the side of the electroplating tank, a sealing tube movably connected to the side of the particle filter mechanism, an organic filter mechanism fixedly connected to the side of the sealing tube away from the particle filter mechanism, and a flow tube fixedly connected to the side of the organic filter mechanism away from the sealing tube;

[0008] The particle filtering mechanism includes a filter box that can receive electroplating liquid, the interior of the filter box is movably connected to a sealing bottom plate, the outside of the side of the sealing bottom plate is fixedly connected to an outer filter cartridge, the middle of the side of the sealing bottom plate is fixedly connected to a middle filter cartridge, and the inside of the side of the sealing bottom plate is fixedly connected to an inner filter cartridge, and the outer filter cartridge, middle filter cartridge and inner filter cartridge are distributed in sequence from the outside to the inside.

[0009] In a preferred embodiment, the side of the flow tube away from the organic filtration mechanism is fixedly connected to a cationic resin column, the side of the cationic resin column is fixedly connected to a connecting tube, the side of the connecting tube away from the cationic resin column is fixedly connected to an anion resin column, the bottom end of the anion resin column away from the side of the connecting tube is fixedly connected to a reflux pipe, and the discharge port of the reflux pipe is located inside the electroplating tank.

[0010] In a preferred embodiment, the side of the sealing bottom plate away from the outer filter cartridge is fixedly connected to a rotating shaft, the side of the rotating shaft away from the sealing bottom plate is fixedly connected to a servo motor, the side of the outer filter cartridge away from the sealing bottom plate is fixedly connected to a sealing plate, the sealing plate seals the interior of the outer filter cartridge and the middle filter cartridge, and the top of the filter box is fixedly connected to a sealing cover.

[0011] In a preferred embodiment, a cleaning plate is movably connected to the side of the filter box, a through hole is opened inside the cleaning plate, and a support rod is fixedly connected to the through hole of the cleaning plate, and the inner filter cylinder and the sealing tube are movably connected and sealed to each other.

[0012] In a preferred embodiment, guide blocks are fixedly connected to both sides of the bottom end of the filter box, and conical grooves are provided at the bottom ends of the two guide blocks in the filter box close to the sides. The bottom ends of the conical grooves in the filter box are fixedly connected to a discharge channel, and the sides of the discharge channel are fixedly connected to a sealing valve.

[0013] In a preferred embodiment, the organic filtration mechanism includes a first reversing valve fixedly connected to a sealing tube, a first branch pipe fixedly connected to a side of the first reversing valve away from the sealing tube, and a second branch pipe fixedly connected to the other side of the first reversing valve away from the sealing tube, the first branch pipe and the second branch pipe are fixedly connected to the second reversing valve on sides away from the first reversing valve, a first activated carbon adsorption column fixedly connected to the side of the first branch pipe, and a second activated carbon adsorption column fixedly connected to the side of the second branch pipe.

[0014] In a preferred embodiment, the top end of the second reversing valve is fixedly connected to a rotating rod, the top end of the rotating rod is fixedly connected to a rotating wheel, the side of the rotating wheel is fixedly connected to an output gear, the side of the output gear is meshed with a transmission gear, and the bottom end of the transmission gear is fixedly connected to a synchronization rod.

[0015] In a preferred embodiment, the bottom end of the synchronization rod is movably connected to a support plate, the side of the support plate is fixedly connected to the side of the second reversing valve, the side of the synchronization rod is fixedly connected to a rotating gear, the side of the rotating gear is engaged with a synchronization belt, the inner side of the synchronization belt away from the rotating gear is engaged with a synchronization wheel, and the bottom end of the synchronization wheel is fixedly connected to the top of the first reversing valve.

[0016] In a preferred embodiment, the online monitor collects the impurity concentration data information in the electroplating solution and calculates the flow value LL. The calculation formula of the flow value LL is: Where ND is the particle concentration of impurities in the plating solution, k1, k2 and k3 are weights, m is the number of types of impurity metal ions in the plating solution, i is the current i-th impurity metal ion, JS i is the concentration of the current i-th impurity metal ion, n is the number of organic impurities, j is the current j-th organic impurity, YJ j is the current concentration of the jth organic impurity. The online monitor uses the flow value LL to control the flow L of the electronically controlled flow pump. The flow L is calculated as L=(1+LL)×BZ, where BZ is the standard flow value at which impurities in the plating solution do not affect the electroplating process.

[0017] Technical effects and advantages of the present invention:

[0018] 1. The present invention monitors the impurity content in the plating solution through an online monitor. When the impurities in the plating solution are high, an electronically controlled flow pump pumps the impure plating solution into a particle filter mechanism, which filters the particulate impurities in the plating solution. After filtration, the organic impurities in the plating solution are removed through an organic filter mechanism. The metal ion impurities in the plating solution are then removed through a cationic resin column and an anionic resin column. The clean plating solution is then returned to the plating tank to ensure the purity of the plating solution in the plating tank.

[0019] 2. After entering the filter box, the electroplating solution of the present invention is filtered three times through the outer filter cartridge, the middle filter cartridge, and the inner filter cartridge, intercepting particulate impurities of different diameters in the electroplating solution. The electroplating solution discharged from the inner filter cartridge does not contain particulate impurities. When the inner filter cartridge refluxes, impurities on the outer surface of the outer filter cartridge, the middle filter cartridge, and the inner filter cartridge can be washed away. The present invention has a good impurity removal effect and is easy to clean.

[0020] 3. According to the present invention, the electroplating solution after removing particulate impurities enters the organic filtration mechanism. At this time, the first reversing valve controls the solution to flow in the first branch pipe and pass through the first activated carbon adsorption column to remove organic impurities. When the first activated carbon adsorption column is blocked, the wheel is rotated, and the output gear is rotated. After the rotating gear rotates, the synchronous wheel and the output gear rotate in a mirror image, so that the first reversing valve and the second reversing valve are synchronously switched to the second branch pipe for circulation, and the impurities are removed through the second activated carbon adsorption column. The first activated carbon adsorption column can be cleaned without stopping the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the overall structure of the particle filtering mechanism of the present invention.

[0023] Figure 3 It is a schematic diagram of the internal structure of the particle filtering mechanism of the present invention.

[0024] Figure 4 It is a schematic diagram of the overall structure of the outer filter cartridge of the present invention.

[0025] Figure 5 This is a schematic diagram of the internal structure of the outer filter cartridge of the present invention.

[0026] Figure 6 It is a schematic diagram of the overall structure of the organic filtration mechanism of the present invention.

[0027] Figure 7 This is a schematic diagram of the decomposed structure of the organic filtration mechanism of the present invention.

[0028] The accompanying drawings are marked as follows: 1. electroplating tank; 2. anode plate; 3. cathode plate; 4. online monitor; 5. electronically controlled flow pump; 6. particle filtering mechanism; 601. filter box; 602. sealing cover; 603. guide block; 604. discharge channel; 605. sealing valve; 606. servo motor; 607. rotating shaft; 608. cleaning plate; 609. support rod; 610. sealing bottom plate; 611. outer filter cartridge; 612. middle filter cartridge; 613. inner filter cartridge; 614. sealing plate; 7. sealing pipe; 8. organic filter Structure; 801, first reversing valve; 802, first branch pipe; 803, second branch pipe; 804, first activated carbon adsorption column; 805, second activated carbon adsorption column; 806, second reversing valve; 807, rotor; 808, rotating rod; 809, output gear; 810, transmission gear; 811, synchronization rod; 812, support plate; 813, rotating gear; 814, synchronization belt; 815, synchronization wheel; 9, flow tube; 10, cation resin column; 11, connecting tube; 12, anion resin column; 13, reflux pipe. DETAILED DESCRIPTION

[0029] The technical solutions of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples. The device for online removal of impurities from the plating solution involved in the present invention is not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] Reference Figure 1 The present invention provides an online device for removing impurities from a plating solution, comprising an electroplating tank 1, wherein an anode plate 2 is fixedly connected to one side of the electroplating tank 1, a cathode plate 3 is fixedly connected to the other side of the electroplating tank 1, an online monitor 4 is fixedly connected to the bottom end of the electroplating tank 1, an electric-controlled flow pump 5 is fixedly connected to the electroplating tank 1, a particle filter mechanism 6 is fixedly connected to the bottom end of the electric-controlled flow pump 5 away from the side of the electroplating tank 1, a sealing tube 7 is movably connected to the side of the particle filter mechanism 6, an organic filter mechanism 8 is fixedly connected to the side of the sealing tube 7 away from the particle filter mechanism 6, a flow tube 9 is fixedly connected to the side of the organic filter mechanism 8 away from the sealing tube 7, a cationic resin column 10 is fixedly connected to the side of the flow tube 9 away from the organic filter mechanism 8, a connecting tube 11 is fixedly connected to the side of the cationic resin column 10, an anion resin column 12 is fixedly connected to the side of the connecting tube 11 away from the cationic resin column 10, a reflux pipe 13 is fixedly connected to the bottom end of the anion resin column 12 away from the side of the connecting tube 11, and the discharge port of the reflux pipe 13 is located inside the electroplating tank 1.

[0031] In an embodiment of the present application, particulate impurities in the plating solution can be filtered through the particle filtering mechanism 6, and after filtration, the organic impurities in the plating solution are removed through the organic filtering mechanism 8, and the metal ion impurities in the plating solution are removed through the cationic resin column 10 and the anionic resin column 12. Therefore, the present application can remove different impurities in the plating solution, ensuring that the plating solution that finally flows back into the plating tank 1 through the reflux pipe 13 is clean enough, and the present application can clean the plating solution during electroplating. The whole is in a dynamic adjustment process and can accurately control the plating solution. The electronically controlled flow pump 5 can control the flow rate of the purified plating solution to ensure its stability during electroplating.

[0032] Reference Figure 2-Figure 5 The particle filtering mechanism 6 includes a filter box 601 that can receive the electroplating liquid. The interior of the filter box 601 is movably connected to a sealing bottom plate 610. The outside of the side of the sealing bottom plate 610 is fixedly connected to an outer filter cartridge 611. The middle of the side of the sealing bottom plate 610 is fixedly connected to a middle filter cartridge 612. The inside of the side of the sealing bottom plate 610 is fixedly connected to an inner filter cartridge 613. The outer filter cartridge 611, the middle filter cartridge 612 and the inner filter cartridge 613 are distributed in sequence from the outside to the inside. The side of the sealing bottom plate 610 away from the outer filter cartridge 611 is fixedly connected to a rotating shaft 607. The side of the rotating shaft 607 away from the sealing bottom plate 610 is fixedly connected to a servo motor 606. The side of the outer filter cartridge 611 away from the sealing bottom plate 610 is fixedly connected to a sealing The sealing plate 614 seals the interior of the outer filter cartridge 611 and the middle filter cartridge 612. The top of the filter box 601 is fixedly connected to the sealing cover 602. The side of the filter box 601 is movably connected to the cleaning plate 608. A through hole is provided inside the cleaning plate 608, and a support rod 609 is fixedly connected to the through hole of the cleaning plate 608. The inner filter cartridge 613 is movably connected to the sealing tube 7 and sealed with each other. The two sides of the bottom end of the interior of the filter box 601 are fixedly connected with the guide blocks 603. The bottom ends of the two guide blocks 603 in the filter box 601 are close to the sides with conical grooves. The bottom end of the conical groove in the filter box 601 is fixedly connected to the discharge channel 604. The side of the discharge channel 604 is fixedly connected with a sealing valve 605.

[0033] In the embodiment of the present application, when the sealing bottom plate 610 rotates, it will drive the outer filter cartridge 611, the middle filter cartridge 612 and the inner filter cartridge 613 to rotate synchronously. Therefore, the plating liquid entering the filter box 601 is filtered through the outer filter cartridge 611, the middle filter cartridge 612 and the inner filter cartridge 613 to remove the particulate impurities in the plating liquid. The filtered plating liquid enters the sealing tube 7 through the inner filter cartridge 613, and the outer filter cartridge 611 is the first stage of filtration, so it is exposed to more impurities. Cleaning plates 608 are provided on both sides of the outer filter cartridge 611 so that impurities on the surface can be scraped off when the outer filter cartridge 611 rotates. In addition, a through hole is provided inside the cleaning plate 608 so that the plating liquid can fall normally, making it easier for the plating liquid to enter the outer filter cartridge 611. There is a conical groove at the bottom of the filter box 601. Therefore, when backwashing is performed, the water entering through the inner filter cartridge 613 will flow into the conical groove when it flows out through the outer filter cartridge 611, making it easier to be discharged from the discharge channel 604.

[0034] Reference Figure 7 The organic filtering mechanism 8 includes a first reversing valve 801 fixedly connected to the sealing tube 7, a first branch pipe 802 fixedly connected to the side of the first reversing valve 801 away from the sealing tube 7, and a second branch pipe 803 fixedly connected to the other side of the first reversing valve 801 away from the sealing tube 7, a second reversing valve 806 fixedly connected to the side of the first branch pipe 802 and the second branch pipe 803 away from the first reversing valve 801, a first activated carbon adsorption column 804 fixedly connected to the side of the first branch pipe 802, a second activated carbon adsorption column 805 fixedly connected to the side of the second branch pipe 803, and a rotating rod 808 fixedly connected to the top of the second reversing valve 806. The top is fixedly connected to a rotating wheel 807, the side of the rotating wheel 807 is fixedly connected to an output gear 809, the side of the output gear 809 is meshed with a transmission gear 810, the bottom end of the transmission gear 810 is fixedly connected to a synchronization rod 811, the bottom end of the synchronization rod 811 is movably connected to a support plate 812, the side of the support plate 812 is fixedly connected to the side of the second reversing valve 806, the side of the synchronization rod 811 is fixedly connected to a rotating gear 813, the side of the rotating gear 813 is meshed with a synchronization belt 814, the inner side of the synchronization belt 814 away from the rotating gear 813 is meshed with a synchronization wheel 815, and the bottom end of the synchronization wheel 815 is fixedly connected to the top of the first reversing valve 801.

[0035] In the embodiment of the present application, organic impurities and some metal ion impurities in the plating solution are removed through the first activated carbon adsorption column 804, and after removal, the solution flows into the organic filtration mechanism 8 through the second reversing valve 806, and enters the cationic resin column 10 and the anionic resin column 12 through the organic filtration mechanism 8 to remove cationic impurities and anionic impurities in the metal ion impurities, respectively. The clean plating solution flows back to the plating tank 1 through the reflux pipe 13, and the output gear 809 is driven to rotate when the rotating wheel 807 rotates. When the output gear 809 rotates, the rotating gear 813 is driven to rotate through the transmission gear 810 and the synchronization rod 811. When the rotating gear 813 rotates, the synchronous wheel 815 is driven to rotate synchronously through the synchronous belt 814. At this time, the output gear 809 and the synchronous wheel 815 rotate synchronously and in a mirror image, so the first reversing valve 801 and the second reversing valve 806 are adjusted synchronously.

[0036] Reference Figure 1 The online monitor 4 collects the impurity concentration data in the plating solution and calculates the flow value LL. The calculation formula of the flow value LL is: Where ND is the particle concentration of impurities in the plating solution, k1, k2 and k3 are weights, m is the number of types of impurity metal ions in the plating solution, i is the current i-th impurity metal ion, JS i is the concentration of the current i-th impurity metal ion, n is the number of organic impurities, j is the current j-th organic impurity, YJ j is the current concentration of the jth organic impurity. The online monitor 4 uses the flow value LL to control the flow L of the electronically controlled flow pump 5. The flow L is calculated as L=1+LL×BZ, where BZ is the standard flow value at which impurities in the plating solution do not affect the electroplating process.

[0037] In the embodiment of the present application, the concentrations of various impurities in the plating solution are first collected by the online monitor 4. The collected impurity concentrations include all types of metal ion impurities and organic impurities. The particle concentration in the plating solution is also detected. Impurities such as metal ions are impurities that are not visible to the naked eye, while various dust impurities in the plating solution are impurities that are visible to the naked eye and are detected using particle concentration. Therefore, when monitoring, the present application takes into account metal ion impurities, organic impurities, and dust impurities or anode mud and other impurities that are visible to the naked eye. The larger the calculated flow rate value LL, the higher the impurity concentration in the plating solution and the more impurities there are. Therefore, the calculated flow rate value LL is proportional to the preset flow rate value. When the concentration is higher, more plating solution is filtered and discharged. This puts the present application in a dynamic adjustment process, avoiding the impact of directly filtering and purifying the plating solution with a large flow rate on the normal electroplating process, and also avoiding the inability to remove impurities when the flow rate is small. The standard flow rate value BZ is the flow rate at which impurities in the plating solution do not affect the electroplating process, and its specific value can be set by the user.

[0038] The working principle of the present invention is as follows: electroplating processing of the electroplated parts is carried out through the electroplating liquid in the electroplating tank 1 and the anode plate 2 and the cathode plate 3, and the online monitor 4 monitors the various impurity contents of the electroplating liquid in the electroplating tank 1. When the impurity content of the electroplated parts is high, the electronically controlled flow pump 5 pumps the electroplating liquid in the electroplating tank 1 into the particle filter mechanism 6. The electroplating liquid entering the particle filter mechanism 6 passes through the outer filter cartridge 611 for filtration. When the outer filter cartridge 611 is filtering, the servo motor 606 drives the cleaning plate 608 to rotate through the rotating shaft 607. When the cleaning plate 608 rotates, it drives the sealing bottom plate 610 to rotate. When the sealing bottom plate 610 rotates, it drives the outer filter cartridge 611, the middle filter cartridge 612 and the inner filter cartridge 613 to rotate synchronously. Therefore, the electroplating liquid entering the filter box 601 passes through the outer filter cartridge 611, the middle filter cartridge 612 and the inner filter cartridge 613 for three-stage filtration to remove particulate impurities in the electroplating liquid. The filtered electroplating liquid passes through the inner filter cartridge 613 and enters the sealing tube 7;

[0039] The electroplating solution enters the sealed tube 7 and flows through the first reversing valve 801 into the first branch pipe 802. The solution passes through the first activated carbon adsorption column 804 to remove organic impurities and some metal ion impurities. After removal, the solution flows through the second reversing valve 806 to the organic filter mechanism 8. The solution then flows through the organic filter mechanism 8 and enters the cationic resin column 10 and the anionic resin column 12 to remove cationic impurities and anionic impurities from the metal ion impurities, respectively. The cleaned electroplating solution then flows back to the electroplating tank 1 through the reflux pipe 13.

[0040] When the particle filter mechanism 6 is clogged, backwashing is used to drain water inward through the inner filter cartridge 613. At this time, the drained water is discharged outward through the inner filter cartridge 613, the middle filter cartridge 612 and the outer filter cartridge 611 in sequence, thereby removing impurities from the bottom. During backwashing, the sealing valve 605 is opened and the waste water after backwashing is collected through the discharge channel 604.

[0041] When the first activated carbon adsorption column 804 is blocked, the rotating wheel 807 is rotated. When the rotating wheel 807 rotates, it drives the output gear 809 to rotate. When the output gear 809 rotates, it drives the rotating gear 813 to rotate through the transmission gear 810 and the synchronization rod 811. When the rotating gear 813 rotates, it drives the synchronization wheel 815 to rotate synchronously through the synchronization belt 814. At this time, the output gear 809 and the synchronization wheel 815 rotate synchronously and in a mirror image. Therefore, the first reversing valve 801 and the second reversing valve 806 are adjusted synchronously to close the second branch pipe 803, allowing the electroplating solution to enter the second branch pipe 803 and be filtered through the second activated carbon adsorption column 805. At this time, the first activated carbon adsorption column 804 can be cleaned.

[0042] Finally: The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for removing impurities from a plating solution online, comprising an electroplating tank (1), wherein an anode plate (2) is fixedly connected to one side of the electroplating tank (1), and a cathode plate (3) is fixedly connected to the other side of the electroplating tank (1), characterized in that: The bottom end of the electroplating tank (1) is fixedly connected to an online monitor (4), the electroplating tank (1) is fixedly connected to an electric-controlled flow pump (5), the bottom end of the electric-controlled flow pump (5) away from the side of the electroplating tank (1) is fixedly connected to a particle filter mechanism (6), the side of the particle filter mechanism (6) is movably connected to a sealing tube (7), the side of the sealing tube (7) away from the particle filter mechanism (6) is fixedly connected to an organic filter mechanism (8), the side of the organic filter mechanism (8) away from the sealing tube (7) is fixedly connected to a flow tube (9), the particle filter mechanism (6) is fixedly connected to the bottom end of the electroplating tank (1) and the side of the particle filter mechanism (6) is fixedly connected to an organic filter mechanism (8), the side of the organic filter mechanism (8) away from the sealing tube (7) is fixedly connected to a flow tube (9), the particle filter mechanism (6) is fixedly connected to the bottom end of the electric-controlled flow pump (5) away from the side of the electroplating tank (1 ... The particle filtering mechanism (6) comprises a filter box (601) capable of receiving electroplating liquid, wherein the filter box (601) is movably connected to a sealing bottom plate (610) inside, an outer filter cartridge (611) is fixedly connected to the outside of the side of the sealing bottom plate (610), a middle filter cartridge (612) is fixedly connected to the middle of the side of the sealing bottom plate (610), and an inner filter cartridge (613) is fixedly connected to the inside of the side of the sealing bottom plate (610), and the outer filter cartridge (611), the middle filter cartridge (612) and the inner filter cartridge (613) are distributed in sequence from the outside to the inside.

2. The device for online removal of impurities from a plating solution according to claim 1, characterized in that: A cation resin column (10) is fixedly connected to the side of the flow pipe (9) away from the organic filtering mechanism (8), a connecting pipe (11) is fixedly connected to the side of the cation resin column (10), an anion resin column (12) is fixedly connected to the side of the connecting pipe (11) away from the cation resin column (10), a reflux pipe (13) is fixedly connected to the bottom end of the anion resin column (12) away from the side of the connecting pipe (11), and a discharge port of the reflux pipe (13) is located inside the electroplating tank (1).

3. The device for online removal of impurities from plating solution according to claim 1, characterized in that: The side of the sealing bottom plate (610) away from the outer filter cartridge (611) is fixedly connected to a rotating shaft (607), the side of the rotating shaft (607) away from the sealing bottom plate (610) is fixedly connected to a servo motor (606), the side of the outer filter cartridge (611) away from the sealing bottom plate (610) is fixedly connected to a sealing plate (614), the sealing plate (614) seals the interior of the outer filter cartridge (611) and the middle filter cartridge (612), and the top of the filter box (601) is fixedly connected to a sealing cover (602).

4. The device for online removal of impurities from a plating solution according to claim 3, characterized in that: A cleaning plate (608) is movably connected to the side of the filter box (601), a through hole is provided inside the cleaning plate (608), and a support rod (609) is fixedly connected to the through hole of the cleaning plate (608), and the inner filter cartridge (613) and the sealing tube (7) are movably sleeved and sealed with each other.

5. The device for online removal of impurities from plating solution according to claim 4, characterized in that: Guide blocks (603) are fixedly connected to both sides of the bottom end of the filter box (601), and tapered grooves are provided at the bottom ends of the two guide blocks (603) in the filter box (601) close to the sides. A discharge channel (604) is fixedly connected to the bottom ends of the tapered grooves in the filter box (601), and a sealing valve (605) is fixedly connected to the side of the discharge channel (604).

6. The device for online removal of impurities from plating solution according to claim 1, characterized in that: The organic filtering mechanism (8) comprises a first reversing valve (801) fixedly connected to the sealing tube (7); a first branch pipe (802) is fixedly connected to the side of the first reversing valve (801) away from the sealing tube (7); and a second branch pipe (803) is fixedly connected to the other side of the first reversing valve (801) away from the sealing tube (7); a second reversing valve (806) is fixedly connected to the sides of the first branch pipe (802) and the second branch pipe (803) away from the first reversing valve (801); a first activated carbon adsorption column (804) is fixedly connected to the side of the first branch pipe (802); and a second activated carbon adsorption column (805) is fixedly connected to the side of the second branch pipe (803).

7. The device for online removal of impurities from plating solution according to claim 6, characterized in that: The top end of the second reversing valve (806) is fixedly connected to a rotating rod (808), the top end of the rotating rod (808) is fixedly connected to a rotating wheel (807), the side of the rotating wheel (807) is fixedly connected to an output gear (809), the side of the output gear (809) is meshed with a transmission gear (810), and the bottom end of the transmission gear (810) is fixedly connected to a synchronization rod (811).

8. The device for online removal of impurities from plating solution according to claim 7, characterized in that: The bottom end of the synchronization rod (811) is movably connected to a support plate (812), the side of the support plate (812) is fixedly connected to the side of the second reversing valve (806), the side of the synchronization rod (811) is fixedly connected to a rotating gear (813), the side of the rotating gear (813) is meshed with a synchronization belt (814), the inner side of the synchronization belt (814) away from the rotating gear (813) is meshed with a synchronization wheel (815), and the bottom end of the synchronization wheel (815) is fixedly connected to the top end of the first reversing valve (801).

9. The device for online removal of impurities from plating solution according to claim 1, characterized in that: The online monitor (4) collects data information on impurity concentration in the electroplating solution and calculates the flow value LL. The calculation formula of the flow value LL is: Where ND is the particle concentration of impurities in the plating solution, k1, k2 and k3 are weights, m is the number of types of impurity metal ions in the plating solution, i is the current i-th impurity metal ion, JS i is the concentration of the current i-th impurity metal ion, n is the number of organic impurities, j is the current j-th organic impurity, YJ j is the current concentration of the jth organic impurity. The online monitor (4) uses the flow value LL to control the flow L of the electronically controlled flow pump (5). The flow L is calculated as L=(1+LL)×BZ, where BZ is the standard flow value at which impurities in the electroplating solution do not affect the electroplating process.

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