Detection device and system for detecting flatness of electrode plate

Abstract

The invention discloses a detection device and system for detecting the flatness of an electrode plate, and aims to solve the problems of low efficiency, low precision and high requirements on use conditions of the device in the traditional detection process. The detection device is abutted between an upper polar plate and a lower polar plate of a to-be-detected electrode plate; the detection device comprises a shell, a linear displacement sensor assembly, a coil assembly and a connecting assembly. The shell comprises an upper cover and a base and is used for forming a closed space, the upper cover is connected with the top of the linear displacement sensor assembly, the base is connected with the linear displacement sensor assembly through the connecting assembly, and the coil assembly is connected with the bottom of the linear displacement sensor assembly. Through integrated design and closed design, external water vapor and corrosive gas can be prevented from invading, internal electronic elements are protected, the service life of the device is prolonged, the detection precision is improved, the detection operation process is simplified, and the compatibility and the detection efficiency of the detection device are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment detection, and in particular to a detection device and system for detecting the flatness of an electrode plate. Background Art

[0002] In semiconductor manufacturing, measuring the flatness between electrode plates is a key step in ensuring device performance and yield. The flatness of electrode plates (such as photolithography masks, CMP polishing heads, and radio frequency electrodes) directly impacts the accuracy of nanoscale pattern transfer. For example, micron-level deviations in the gap between the mask and wafer during photolithography can lead to increased overlay errors, causing circuit shorts or open circuits. During chemical mechanical polishing, uneven electrode plates can exacerbate uneven film thickness on the wafer surface, reducing the yield of subsequent thin film deposition and photolithography.

[0003] Traditional methods rely on operators using contact tools (such as vernier calipers) to measure the thickness of the electrode plate at multiple points, calculating the difference between the maximum and minimum values as a flatness indicator. This results in low detection efficiency and accuracy, and is unable to dynamically detect electrode plate deformation in high-temperature or vacuum environments.

[0004] Currently, there are devices that use the eddy current effect to detect the displacement of objects. However, the devices are large and difficult to adapt to detection in a small space; the devices are located in an open test space, which affects the detection results; and they cannot measure structures made of non-conductive materials, which limits their use conditions. Summary of the Invention

[0005] (1) Purpose of the invention The purpose of the present invention is to provide a detection device and system for detecting the flatness of an electrode plate, aiming to solve the problems of low efficiency and precision and high requirements on the use conditions of the device in the traditional detection process.

[0006] (2) Technical solution In order to solve the above problems, the present invention provides a detection device for detecting the flatness of an electrode plate, wherein the detection device is abutted between the upper plate and the lower plate of the electrode plate to be detected; The detection device includes a housing, a linear displacement sensor assembly, a coil assembly and a connecting assembly; The housing includes an upper cover and a base, which are used to form a closed space. The upper cover is connected to the top of the linear displacement sensor assembly, the base is connected to the linear displacement sensor assembly through the connecting assembly, and the coil assembly is connected to the bottom of the linear displacement sensor assembly. The linear displacement sensor assembly generates an excitation signal, the coil assembly generates an alternating magnetic field, the base generates an induced eddy current in the alternating magnetic field, and the induced eddy current generates an anti-magnetic field in the opposite direction of the alternating magnetic field. When the distance between the upper cover and the base changes, the linear displacement sensor assembly slides on the base through the connecting assembly. The linear displacement sensor assembly detects the voltage signal generated by the impedance change of the coil assembly and converts it into linear displacement change data.

[0007] Preferably, the linear displacement sensor assembly includes an eddy current plate and a sensor housing, the eddy current plate is fixedly connected to the sensor housing, the upper cover is located on the top of the eddy current plate and is fixedly connected to the sensor housing, the sensor housing is connected to the base through the connecting assembly, the eddy current plate drives the coil assembly to generate an alternating magnetic field, and processes the voltage signal of the coil assembly.

[0008] Preferably, the eddy current plate includes a power module, a control module, an excitation and detection module, an analog-to-digital conversion module and a communication module; The power module is connected to the control module and is used to provide power to the eddy current plate; The control module controls the operation of each module and performs signal processing; The excitation and detection module is connected to the control module, and is used to drive the coil assembly to generate an alternating magnetic field, receive a voltage signal from the coil assembly, and transmit the voltage signal to the control module; The analog-to-digital conversion module is connected to the control module and is used to convert the voltage signal into a digital signal; The communication module is connected to the control module and is used to transmit data of the control module to the host computer.

[0009] Preferably, the coil assembly includes a first mounting plate and a coil, the first mounting plate is fixedly connected to the bottom of the sensor housing, and the coil is connected to the first mounting plate.

[0010] Preferably, the coil assembly further includes a second mounting plate, the first mounting plate is connected to the second mounting plate, a mounting groove is formed between the first mounting plate and the second mounting plate, and the coil is arranged in the mounting groove.

[0011] Preferably, the connecting assembly includes a spring, the top end of the spring is connected to the sensor housing, and the bottom end of the spring is connected to the base.

[0012] Preferably, the connecting assembly further comprises a slider, which is sleeved on the outside of the sensor housing and connected to the sensor housing, and the outer wall of the slider is slidably connected to the inner side wall of the base.

[0013] Preferably, a vertical through slot is formed on the side of the base, a limiting portion is formed on the side of the sensor housing, a mounting hole is formed on the side of the slider, and the limiting portion passes through the mounting hole and is slidably connected to the through slot.

[0014] Preferably, the detection device further comprises an adapter plate, the adapter plate is connected to the linear displacement sensor assembly, a reference coil is fixed on the adapter plate, and the reference coil is used to monitor environmental interference signals.

[0015] On the other hand, the present invention provides a system for detecting the flatness of an electrode plate, the system including an electrode plate structure, the electrode plate structure including an upper electrode plate and a lower electrode plate, multiple detection devices are provided at different positions between the upper electrode plate and the lower electrode plate, and the multiple detection devices transmit the data of the current position to a host computer through the communication module of the linear displacement sensor assembly.

[0016] (3) Beneficial effects The above technical solution of the present invention has the following beneficial technical effects: 1. By setting an integrated detection device between the upper electrode plate and the lower electrode plate, the compact volume design makes the detection device adaptable to the detection of small spaces. At the same time, the upper cover and the base are respectively parallel to the surfaces of the upper electrode plate and the lower electrode plate, so that the upper and lower contact surfaces are evenly stressed during the detection process, effectively preventing the electrode plates from being indented or damaged during the detection process; 2. The linear displacement sensor assembly is placed in the enclosed space formed by the upper cover and the base to avoid the shedding of metal debris or dust caused by component friction and vibration during the detection process, meeting the "no additional particles" requirement of semiconductor manufacturing, preventing the intrusion of external moisture and corrosive gases, protecting internal electronic components, extending the service life of the device, and improving detection accuracy; 3. In semiconductor scenarios, the same device may be compatible with mixed detection requirements of metals (such as copper interconnect electrodes) and non-metals (such as silicon dioxide insulating plates). Through standardized detection devices and universal eddy current algorithms, the detection objects can be seamlessly switched without replacing hardware or recalibrating, simplifying the detection operation process and improving the compatibility and detection efficiency of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an exploded schematic diagram of a detection device in the device provided according to the present invention; Figure 2 is an overall schematic diagram of a detection device provided according to the present invention; Figure 3 is a structural block diagram of an eddy current plate provided according to the present invention; Figure 4 This is a schematic structural diagram of a sensor housing provided according to the present invention; Figure 5 This is a schematic structural diagram of a first mounting plate and a second mounting plate provided according to the present invention; Figure 6 This is a schematic diagram of the structure of a slider provided according to the present invention; Figure 7 It is a schematic diagram of the base structure provided according to the present invention.

[0018] Reference numerals: 1. Housing; 11. Upper cover; 12. Base; 12a. Through slot; 2. Linear displacement sensor assembly; 21. Eddy current plate; 22. Sensor housing; 221. Limiting portion; 3. Coil assembly; 31. First mounting plate; 31a. Mounting slot; 32. Coil; 33. Second mounting plate; 4. Connecting assembly; 41. Spring; 42. Slider; 42a. Mounting hole; 5. Adapter board. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present invention.

[0020] The accompanying drawings illustrate schematic diagrams of layer structures according to embodiments of the present invention. These figures are not drawn to scale; for clarity, some details are exaggerated and some details may be omitted. The shapes, relative sizes, and positional relationships of the various regions and layers shown in the figures are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Those skilled in the art may design regions / layers with different shapes, sizes, and relative positions based on actual needs.

[0021] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be noted that the terms “first” and “second” are only used for descriptive purposes and should not be understood as indicating or implying relative importance.

[0023] Combine Figure 1 and Figure 2On the one hand, the present invention provides a detection device for detecting the flatness of an electrode plate, the detection device is abutted between the upper electrode plate and the lower electrode plate of the electrode plate to be detected; the detection device includes a shell 1, a linear displacement sensor assembly 2, a coil assembly 3 and a connecting assembly 4; the shell 1 includes an upper cover 11 and a base 12, which are used to form a closed space, the upper cover 11 is connected to the top of the linear displacement sensor assembly 2, the base 12 is connected to the linear displacement sensor assembly 2 through the connecting assembly 4, and the coil assembly 3 is connected to the bottom of the linear displacement sensor assembly 2; the linear displacement sensor assembly 2 generates an excitation signal, the coil assembly 3 generates an alternating magnetic field, the base 12 generates an induced eddy current in the alternating magnetic field, and the induced eddy current generates an anti-magnetic field in the opposite direction to the alternating magnetic field. When the distance between the upper cover 11 and the base 12 changes, the linear displacement sensor assembly 2 slides on the base 12 through the connecting assembly 4, and the linear displacement sensor assembly 2 detects the voltage signal generated by the impedance change of the coil assembly 3 and converts it into linear displacement change data.

[0024] Specifically, the upper cover 11 abuts against the upper electrode plate, and the base 12 abuts against the lower electrode plate. A sealed space can be formed by its own structure, or a seal can be provided to form a closed space, which encloses the linear displacement sensor assembly 2, the coil assembly 3, etc. to prevent external particles from entering the detection environment. The upper cover 11 serves as the top support of the linear displacement sensor assembly 2, and the base 12 is elastically connected to the linear displacement sensor assembly 2 through the connecting assembly 4. When the distance between the upper and lower electrode plates changes, the base 12 moves with the lower electrode plate, driving the connecting assembly 4 to make the linear displacement sensor assembly 2 slide perpendicular to the upper and lower electrode plates. The linear displacement sensor assembly 2 generates an excitation signal to drive the coil assembly 3 to generate an alternating magnetic field. When the base 12 moves up and down due to the change in the distance between the electrode plates, the distance between the coil assembly 3 and the base 12 changes, resulting in a change in the impedance of the coil 32. The linear displacement sensor assembly 2 detects the voltage signal of the coil 32 and converts it into linear displacement data after analog-to-digital conversion and signal processing. Coil assembly 3 generates an alternating magnetic field under the action of an excitation signal. Base 12, acting as a target conductor, generates induced eddy currents in the magnetic field. The anti-magnetic field generated by the eddy currents interacts with the magnetic field of coil 32, changing the impedance of coil 32. Connector assembly 4 connects linear displacement sensor assembly 2 to base 12, providing elastic support so that linear displacement sensor assembly 2 can move with the upper plate.

[0025] It should be noted that the specific manner in which the shell forms a closed space is not limited here. The linear displacement sensor assembly 2 and the base 12 are movably connected through the connecting assembly 4. A sealing structure, such as a sealing ring, may be provided on the movable part thereof to achieve a sealing effect without affecting the activity, or a sealing sleeve or other structure may be provided to set the movable part in the entire sealing sleeve to achieve a sealing effect and ensure that the shell is in a closed state. The specific material of the base 12 is not limited here. It can be made of materials such as aluminum, copper, etc. that can generate induced eddy currents and generate an anti-magnetic field due to the alternating magnetic field of the coil assembly 3. The specific shape of the detection device is also not limited. Preferably, the detection device is designed to be integrated and flat cylindrical, which can effectively avoid damage to the electrode plate during the detection process.

[0026] This arrangement, by providing an integrated detection device between the upper and lower plates, creates a compact design that allows the detection device to adapt to testing in confined spaces. Furthermore, by having the upper cover 11 and base 12 parallelly attached to the surfaces of the upper and lower plates, respectively, the upper and lower contact surfaces are evenly stressed during testing, effectively preventing indentations or damage to the electrode plates during testing. The integrated structure reduces the number of connection nodes between components, suppressing resonance in vibrational environments (such as the mechanical scanning process of semiconductor equipment) and ensuring detection signal stability. The housing 1 forms an enclosed space, preventing the ingress of particulate matter and external contaminants during testing, meeting the clean environment requirements of semiconductor manufacturing and addressing the problem of particulate contamination caused by non-enclosed spaces. By detecting the change in distance between the coil 32 and the base 12 through the eddy current effect, there is no need to contact the electrode plate surface, thus avoiding indentations or damage to the electrode plates caused by traditional contact measurement methods (such as vernier calipers). Furthermore, the deformation of the electrode plates can be monitored in real time under harsh environments such as vacuum and high temperatures. The sliding design of the linear displacement sensor assembly 2 on the base 12 enables the device to sensitively respond to micron- or even nanometer-level vertical displacement changes between the plates. Displacement data is accurately captured through impedance changes in the coil 32, improving detection accuracy. In semiconductor applications, the same device can accommodate mixed detection requirements for metals (such as copper interconnects) and non-metals (such as silicon dioxide insulated plates). Through standardized detection equipment and universal eddy current algorithms, detection targets can be seamlessly switched without hardware replacement or recalibration, simplifying the detection process and improving the compatibility and efficiency of the detection device.

[0027] In a preferred case, the linear displacement sensor assembly 2 includes an eddy current plate 21 and a sensor housing 22. The eddy current plate 21 is fixedly connected to the sensor housing 22. The upper cover 11 is located on the top of the eddy current plate 21 and is fixedly connected to the sensor housing 22. The sensor housing 22 is connected to the base 12 through the connecting assembly 4. The eddy current plate 21 drives the coil assembly 3 to generate an alternating magnetic field and processes the voltage signal of the coil assembly 3.

[0028] This arrangement secures the eddy current plate 21 to the sensor housing 22, with the upper cover 11 directly connected to the top of the housing. This eliminates the wiring between the probe and controller in traditional split-type structures, significantly reducing the size of the device and enabling it to fit into the narrow space between the electrode plates for testing. This addresses the issue of the prior art, which is bulky and unable to detect in confined spaces. Furthermore, the sensor housing 22 serves as the supporting structure, securing the various components with screws to ensure the stable position of the eddy current plate 21, coil assembly 3, and other components during testing, preventing signal fluctuations caused by vibration or movement and improving detection reliability.

[0029] The specific connection method of the current plate, coil assembly 3 and upper cover 11 and sensor housing 22 is not limited here. Figure 4 As shown, in an optional scenario, an installation space for the eddy current plate 21 is formed in the sensor housing 22. By setting screw holes on the sensor housing 22, the eddy current plate 21 is fixed in the installation space by screws, and then the upper cover 11 is fixed to the top of the sensor housing 22, and the coil assembly 3 is fixed to the bottom of the sensor housing 22 by screws.

[0030] Combine Figure 3 In a preferred embodiment, the eddy current plate 21 includes a power module, a control module, an excitation and detection module, an analog-to-digital conversion module, and a communication module; the power module is connected to the control module and is used to provide power to the eddy current plate 21; the control module controls the operation of each module and performs signal processing; the excitation and detection module is connected to the control module and is used to drive the coil assembly 3 to generate an alternating magnetic field, receive the voltage signal of the coil assembly 3, and transmit it to the control module; the analog-to-digital conversion module is connected to the control module and is used to convert the voltage signal into a digital signal; and the communication module is connected to the control module and is used to transmit the data of the control module to the host computer.

[0031] Specifically, the power module includes a power management system that provides stable power to the eddy current plate 21 and the entire device, ensuring the proper operation of the excitation and detection circuits. For example, the power management chip regulates voltage to meet the power supply requirements of different modules. The control module, as the core processing unit, receives the voltage signal transmitted by the excitation and detection modules, performs preprocessing such as amplification and filtering, then converts the analog signal into a digital signal via the analog-to-digital conversion module. Ultimately, an algorithm converts the digital signal into linear displacement data and controls the communication module to transmit the data. The excitation and detection module includes an oscillator circuit that generates a high-frequency excitation signal to drive the coil 32 to generate an alternating magnetic field. Simultaneously, the detection module collects the voltage signal generated by the coil 32 due to impedance changes and transmits it to the control module for processing. For example, as the distance between the coil 32 and the base 12 changes, the voltage signal changes accordingly. The excitation and detection module captures this change in real time and transmits it to the control module. The analog-to-digital conversion module converts the analog voltage signal into a digital signal (such as an AD value), facilitating digital signal processing and algorithm calculations in the control module, improving signal processing accuracy and anti-interference capabilities. The communication module uses protocols such as RS485 to transmit displacement data processed by the control module to a host computer, enabling data aggregation and real-time display from multiple devices. For example, when multiple detection devices are operating simultaneously, the communication module ensures accurate data transmission from each device to the host computer, facilitating unified analysis of plate flatness.

[0032] This setup provides clear division of labor among the functional modules. The power module ensures stable power supply, the control module centralizes signal processing, the excitation and detection module focuses on magnetic field generation and signal acquisition, the analog-to-digital conversion module improves signal accuracy, and the communication module ensures reliable data transmission. This significantly enhances overall system stability and anti-interference capabilities. Through the analog-to-digital conversion and control module's algorithmic processing, minute changes in coil 32 voltage (corresponding to minute displacements between the plates) are precisely converted into digital quantities, achieving nanometer-level detection accuracy and meeting the requirements for semiconductor electrode plate flatness testing.

[0033] In a preferred case, the eddy current plate 21 also includes an expansion interface, which provides a peripheral interface for the eddy current plate 21 for debugging and maintenance. The expansion interface can also be used to connect a standard displacement calibrator to update the voltage-displacement mapping table. For example, when the linear displacement sensor assembly 2 is applied to a housing made of different materials, the voltage-displacement mapping table needs to be adjusted according to the different materials to ensure the accuracy of the detection results.

[0034] Combine Figures 1 to 5 In a preferred embodiment, the coil assembly 3 includes a first mounting plate 31 and a coil 32 . The first mounting plate 31 is fixedly connected to the bottom of the sensor housing 22 , and the coil 32 is connected to the first mounting plate 31 .

[0035] Specifically, the first mounting plate 31 is fixed to the bottom of the sensor housing 22 and serves as a direct mounting carrier for the coil 32. The coil 32 is fixed on the first mounting plate 31 to ensure that the position of the coil 32 is stable, and to avoid the displacement of the coil 32 due to vibration or movement, which affects the magnetic field distribution and detection accuracy. The coil 32 is arranged on the first mounting plate 31 and is located on the side close to the base 12, and generates an alternating magnetic field under the action of the excitation signal. The inductance of the coil 32 is strictly designed according to the measuring range, and is adaptively designed according to the actual needs of the detection device. For example, when the measuring range is large, a coil 32 with fewer turns is used, and when the measuring range is small, a coil 32 with more turns is used to ensure that the magnetic field strength and detection sensitivity match the actual needs.

[0036] This arrangement secures the first mounting plate 31 to the sensor housing 22, and the coil 32 is secured to the first mounting plate 31, forming a rigid support structure. This prevents displacement or deformation of the coil 32 during detection, ensuring a stable magnetic field distribution and improving detection accuracy. By adjusting parameters such as the number of turns and wire diameter of the coil 32 on the first mounting plate 31, the device can be flexibly adapted to different detection ranges. For example, a high-sensitivity coil 32 design can be used when detecting micron-level displacements, while a wide-range coil 32 design can be used when detecting larger displacements, expanding the device's application range.

[0037] It should be noted that the specific connection method between the coil 32 and the first mounting plate 31 is not limited here, and the coil 32 is sandwiched in the middle by AB glue or clamping, or by two upper and lower mounting plates. In a preferred case, the coil assembly 3 also includes a second mounting plate 33, the first mounting plate 31 is connected to the second mounting plate 33, and a mounting groove 31a is formed between the first mounting plate 31 and the second mounting plate 33, and the coil 32 is arranged in the mounting groove 31a. Specifically, the second mounting plate 33 is connected to the first mounting plate 31 (such as by screws or glue), and a mounting groove 31a is formed between the two, and the coil 32 is embedded in the mounting groove 31a. The first mounting plate 31 and the second mounting plate 33 sandwich the coil 32 in the middle, forming a physical protective layer to isolate external pollutants such as dust and water vapor, while reducing the impact of external electromagnetic interference on the magnetic field of the coil 32.

[0038] This arrangement completely encloses the coil 32, preventing external particulate contaminants from contacting it. This reduces the impact of environmental interference on the coil 32's magnetic field, ensuring the purity of the detection signal and improving measurement accuracy. For example, in the complex electromagnetic environment of a semiconductor manufacturing plant, this structure effectively suppresses external interference, resulting in more reliable detection results. The mounting plates are removable (e.g., screw connections). If the coil 32 ages or becomes damaged due to long-term use, the first and second mounting plates 31, 33 can be quickly removed and replaced with a new coil 32 without disassembling the entire device, reducing maintenance costs and time.

[0039] It should be noted that the specific structure of the first mounting plate 31 and the second mounting plate 33 is not limited here. The mounting groove 31a can be set on the first mounting plate 31, and the two sides of the second mounting plate 33 are flat, similar to the structure of the cover plate, and the coil 32 is fixed in the mounting groove 31a of the first mounting plate 31; or the first mounting plate 31 and the second mounting plate 33 are set into a symmetrical structure, and the two together form the mounting groove 31a, which is conducive to improving the versatility of the first mounting plate 31 and the second mounting plate 33.

[0040] In a preferred case, the connecting assembly 4 includes a spring 41, the top end of the spring 41 is connected to the sensor housing 22, and the bottom end of the spring 41 is connected to the base 12. Specifically, the top end of the spring 41 is connected to the sensor housing 22, such as by a threaded pin or a clamp, and the bottom end is connected to the base 12, forming an elastic connection. When the distance between the upper and lower plates changes, the spring 41 is compressed or rebounds, driving the linear displacement sensor assembly 2 to move vertically relative to the base 12, thereby changing the distance between the coil 32 and the base 12. The elastic coefficient of the spring 41 is designed according to the plate material and the detection accuracy requirements. For example, a high elastic coefficient spring 41 is used for a rigid plate to ensure that a small displacement can cause a significant deformation of the spring 41 and a change in the impedance of the coil 32; a low elastic coefficient spring 41 is used for an easily deformable plate to avoid damage to the plate.

[0041] This arrangement, through the precise design of the strength of spring 41, keeps the contact pressure between base 12 and the lower plate at an extremely low level (far below the plate surface tolerance threshold), preventing indentations or scratches on the plate surface caused by traditional contact measurement tools (such as vernier calipers). This protects the plate surface topography and is particularly suitable for nanometer-level precision semiconductor electrode plate testing. The elastic deformation characteristics of spring 41 enable the device to quickly respond to micron-level displacement changes between the plates. For example, when the plate flatness changes by 0.5μm, the deformation of spring 41 causes the distance between coil 32 and base 12 to change. The change in coil 32's impedance can be detected by eddy current plate 21 and converted into displacement data, enabling high-precision real-time monitoring.

[0042] Combine Figures 1 to 7 In a preferred embodiment, the connecting assembly 4 further includes a slider 42. The slider 42 is mounted on the outside of the sensor housing 22 and connected to the sensor housing 22. The outer wall of the slider 42 is slidably connected to the inner side wall of the base 12. Specifically, the slider 42 is mounted on the outside of the sensor housing 22, with its inner wall connected to the sensor housing 22, and its outer wall is slidably connected to the inner side wall of the base 12. When the base 12 moves with the lower electrode plate, the slider 42 and the sensor housing 22 slide vertically along the inner wall of the base 12.

[0043] Through such an arrangement, the slider 42 is connected to the sensor housing 22, limiting the horizontal movement of the linear displacement sensor assembly 2, avoiding false changes in the distance between the coil 32 and the base 12 due to horizontal shaking, and ensuring that the detected displacement data only reflects the vertical flatness difference between the upper and lower plates, thereby improving measurement accuracy. For example, in an environment where the plates vibrate, the structure of the slider 42 can effectively suppress horizontal vibration interference, making the detection results true and reliable. The slider 42 is sleeved on the outside of the sensor housing 22, without the need for additional guide rails or complex guide components. The structure is simple and compact, reducing the size of the device, making it easy to install in the narrow space between the electrode plates, and reducing machining costs.

[0044] It should be noted that the specific connection method between the slider 42 and the sensor housing 22 is not limited herein and may be a snap connection, a screw connection, or a welding connection, etc., nor is the specific method for the slider 42 and the sensor housing 22 to slide along the inner wall of the base 12 limited. Alternatively, matching slide rail assemblies may be provided on the inner wall of the base 12 and the outer wall of the slider 42 to enable the slider 42 and the sensor housing 22 to slide vertically along the side wall of the base 12. In a preferred embodiment, a vertical through-slot 12a is formed on the side surface of the base 12, a limiting portion 221 is formed on the side surface of the sensor housing 22, and a mounting hole 42a is formed on the side surface of the slider 42. The limiting portion 221 passes through the mounting hole 42a and is slidably connected to the through-slot 12a.

[0045] Specifically, a vertical through-slot 12a is defined on the side of the base 12, which engages with a stopper 221 (e.g., a protrusion or pin) on the side of the sensor housing 22. The stopper 221 passes through the mounting hole 42a of the slider 42 and is inserted into the through-slot 12a. When the slider 42 moves vertically with the base 12, the stopper 221 slides up and down within the through-slot 12a, providing guidance and limiting position. The width of the through-slot 12a is slightly larger than that of the stopper 221, allowing vertical movement but restricting horizontal movement.

[0046] Through such an arrangement, the cooperation between the through slot 12a and the limiting portion 221 further strengthens the vertical guiding function, prevents the slider 42 from tilting or offsetting during the sliding process, ensures that the linear displacement sensor assembly 2 and the base 12 always maintain vertical alignment, and avoids detection deviations caused by installation errors or external forces. For example, when multiple devices are collaboratively detected, the vertical guiding consistency of each device can improve the comparability and accuracy of the overall detection data. The structural design of the through slot 12a and the limiting portion 221 makes the device assembly process simpler. It only needs to align the limiting portion 221 with the through slot 12a and insert it to achieve a sliding connection. There is no need for complicated calibration or adjustment steps, which improves production efficiency and assembly accuracy.

[0047] It should be noted that the number and distribution of the mounting holes 42a, the limiting portions 221 and the through slots 12a are not limited here. Figure 4 、 Figure 6 and Figure 7 In an optional case, the mounting hole 42 a , the limiting portion 221 and the through slot 12 a are provided in a one-to-one correspondence and are evenly arranged in the circumferential direction of the inner side of the base 12 .

[0048] In a preferred embodiment, the detection device further comprises an adapter plate 5, which is connected to the eddy current plate 21, and the adapter plate 5 is fixedly connected to the sensor housing 22. A reference coil is fixed on the adapter plate 5, and the reference coil is used to monitor environmental interference signals. Specifically, the adapter plate 5 is fixed in the sensor housing 22, connected to the eddy current plate 21, and a reference coil (not shown in the figure) is installed thereon. The reference coil is arranged in parallel with the detection coil 32 and is used to monitor electromagnetic interference signals in the environment (such as the electromagnetic field generated by other equipment in the workshop). The control module eliminates environmental interference factors by comparing the signals of the reference coil and the detection coil 32, and obtains displacement data that truly reflects the change in the distance between the plates.

[0049] This setup uses a reference coil to monitor environmental interference in real time. The differential measurement principle eliminates common-mode interference (such as the effects of spatial electromagnetic field fluctuations and temperature changes on coil 32), ensuring that the detection signal retains only the differential-mode component caused by variations in the plate spacing. This significantly improves detection accuracy and reliability. For example, in environments with strong electromagnetic interference, the reference coil can effectively offset external interference signals, ensuring the accuracy and reliability of detection data. Furthermore, the detection device can operate stably in complex electromagnetic environments or those subject to significant temperature and humidity fluctuations, without the need for additional anti-interference measures. This broadens the device's application scenarios and meets the detection needs of various process environments in semiconductor manufacturing, such as photolithography and CMP polishing.

[0050] Another aspect of the present invention provides a system for detecting the flatness of an electrode plate, the system including an electrode plate structure, the electrode plate structure including an upper plate and a lower plate, a plurality of detection devices being provided at different positions between the upper plate and the lower plate, and the plurality of detection devices transmitting data of the current position to a host computer through a communication module of a linear displacement sensor assembly. Specifically, a plurality of detection devices are arranged at different positions between the upper plate and the lower plate, and each detection device independently detects the distance between the plates at its position. The communication module of each device is connected to the host computer via an RS485 bus to transmit detection data in real time. The host computer software collects, stores and analyzes the displacement data of multiple positions, calculates the difference in distance between each point, and evaluates the overall flatness of the plate.

[0051] Through such a setting, multi-point detection can capture the flatness differences in different areas of the plate surface, avoiding the limitations of single-point measurement. For example, it can detect the difference in warpage between the center and edge areas of the plate, and fully reflect the plate morphology. Real-time data transmission allows operators to view the flatness changes at each point through the host computer interface, promptly detect plate deformation and adjust process parameters to improve production qualification rate. The simultaneous operation of multiple devices can significantly shorten the detection time. Compared with traditional point-by-point contact measurement, the efficiency is improved. The communication module supports multiple detection devices to work and transmit data simultaneously. The host computer can receive the detection data of each position in real time, realize the simultaneous detection of multiple points on the plate surface, reduce the cost and error of manual detection and analysis, comprehensively evaluate the flatness, and improve the detection efficiency and accuracy.

[0052] It should be understood that the above-described specific embodiments of the present invention are merely illustrative or illustrative of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included within the scope of protection of the present invention. In addition, the appended claims are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. A detection device for detecting the flatness of an electrode plate, characterized in that: The detection device is in contact with the upper electrode plate and the lower electrode plate of the electrode plate to be detected; The detection device comprises a housing (1), a linear displacement sensor assembly (2), a coil assembly (3) and a connecting assembly (4); The housing (1) comprises an upper cover (11) and a base (12) for forming a closed space, the upper cover (11) being connected to the top of the linear displacement sensor assembly (2), the base (12) being connected to the linear displacement sensor assembly (2) via the connecting assembly (4), and the coil assembly (3) being connected to the bottom of the linear displacement sensor assembly (2); The linear displacement sensor assembly (2) generates an excitation signal, the coil assembly (3) generates an alternating magnetic field, the base (12) generates an induced eddy current in the alternating magnetic field, and the induced eddy current generates an anti-magnetic field in the opposite direction to the alternating magnetic field. When the distance between the upper cover (11) and the base (12) changes, the linear displacement sensor assembly (2) slides on the base (12) through the connecting assembly (4), and the linear displacement sensor assembly (2) detects a voltage signal generated by the impedance change of the coil assembly (3) and converts the voltage signal into linear displacement change data.

2. The detection device according to claim 1, characterized in that The linear displacement sensor assembly (2) comprises an eddy current plate (21) and a sensor housing (22), wherein the eddy current plate (21) is fixedly connected to the sensor housing (22), the upper cover (11) is located on top of the eddy current plate (21) and is fixedly connected to the sensor housing (22), and the sensor housing (22) is connected to the base (12) via the connecting assembly (4). The eddy current plate (21) drives the coil assembly (3) to generate an alternating magnetic field and processes a voltage signal of the coil assembly (3).

3. The detection device according to claim 2, characterized in that The eddy current plate (21) comprises a power module, a control module, an excitation and detection module, an analog-to-digital conversion module and a communication module; The power module is connected to the control module and is used to provide power to the eddy current plate (21); The control module controls the operation of each module and performs signal processing; The excitation and detection module is connected to the control module and is used to drive the coil assembly (3) to generate an alternating magnetic field, receive a voltage signal from the coil assembly (3) and transmit it to the control module; The analog-to-digital conversion module is connected to the control module and is used to convert the voltage signal into a digital signal; The communication module is connected to the control module and is used to transmit data of the control module to the host computer.

4. The detection device according to claim 2, characterized in that The coil assembly (3) comprises a first mounting plate (31) and a coil (32), wherein the first mounting plate (31) is fixedly connected to the bottom of the sensor housing (22), and the coil (32) is connected to the first mounting plate (31).

5. The detection device according to claim 4, characterized in that The coil assembly (3) further comprises a second mounting plate (33), the first mounting plate (31) being connected to the second mounting plate (33), a mounting groove (31a) being formed between the first mounting plate (31) and the second mounting plate (33), and the coil (32) being arranged in the mounting groove (31a).

6. The detection device according to claim 2, characterized in that The connecting assembly (4) comprises a spring (41), the top end of the spring (41) is connected to the sensor housing (22), and the bottom end of the spring (41) is connected to the base (12).

7. The detection device according to claim 6, characterized in that The connecting assembly (4) further includes a slider (42), the slider (42) being sleeved on the outside of the sensor housing (22) and connected to the sensor housing (22), and the outer wall of the slider (42) being slidably connected to the inner side wall of the base (12).

8. The detection device according to claim 7, characterized in that A vertical through slot (12a) is formed on the side of the base (12), a limiting portion (221) is formed on the side of the sensor housing (22), a mounting hole (42a) is formed on the side of the slider (42), and the limiting portion (221) passes through the mounting hole (42a) and is slidably connected to the through slot (12a).

9. The detection device according to claim 1, characterized in that The detection device further comprises an adapter plate (5), the adapter plate (5) being connected to the linear displacement sensor assembly (2), a reference coil being fixed on the adapter plate (5), and the reference coil being used to monitor environmental interference signals.

10. A system for detecting the flatness of an electrode plate, comprising the detection device according to any one of claims 1 to 9, characterized in that: The system also includes an electrode plate structure, which includes an upper electrode plate and a lower electrode plate. Multiple detection devices are provided at different positions between the upper electrode plate and the lower electrode plate. The multiple detection devices transmit current position data to a host computer through the communication module of the linear displacement sensor assembly.

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