High-power data acquisition equipment

Abstract

The invention discloses high-power data acquisition equipment, and relates to the technical field of photovoltaic power station data acquisition equipment, the high-power data acquisition equipment comprises a data acquisition equipment hardware end, and the data acquisition equipment hardware end comprises a connecting plate. Heat generated by a semiconductor heating end is timely discharged to the vicinity of the equipment, so that the service life of the equipment is prolonged, threaded holes which are distributed at equal intervals are formed in the positioning plate, other positioning screws are matched to be connected with the threaded holes during use, so that the whole equipment and an installation position are reinforced and connected, and the stability of the equipment during use is improved; the equipment software end is arranged to help maintenance personnel to identify potential thermal problems of the equipment, so that bidirectional improvement is performed on hardware and software of the data acquisition equipment, the situation that the equipment operation is affected due to the problems of installation, heat dissipation and the like of the data acquisition hardware equipment is reduced, and the intelligent control level of the whole equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic power station data acquisition equipment, and in particular to a high-power data acquisition equipment. Background Art

[0002] As the scale of photovoltaic power plants continues to expand, traditional data acquisition systems can no longer meet the requirements for efficient, safe, and reliable operation of modern photovoltaic power plants. High-power data acquisition equipment based on high-precision data acquisition technology can provide accurate and real-time data acquisition and monitoring, improving the operating efficiency of photovoltaic power plants, ensuring equipment safety, and promoting intelligent management of photovoltaic power plants.

[0003] Chinese Patent Publication No. CN 208077388 U discloses a data acquisition instrument, which relates to a data acquisition device. The instrument is equipped with two processors: a DSP processor and an ARM processor. This ensures that if one processor fails, the other can still operate normally. The processor and communication module of the device are each equipped with separate power interfaces. This allows the communication module to continue operating normally even if one power interface fails. This rational and simple structural design improves system stability.

[0004] However, the above solution still has the following problems: the data acquisition equipment has not been improved in both hardware and software aspects, resulting in various problems with the hardware itself, such as installation and heat dissipation issues, which will also affect the actual accuracy of the equipment and cannot meet the requirements of normal use. Therefore, the present invention needs to design a high-power data acquisition device to solve the above problems. Summary of the Invention

[0005] The object of the present invention is to provide a high-power data acquisition device to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: a high-power data acquisition device, comprising a data acquisition device hardware end: the data acquisition device hardware end includes a connecting plate, a data acquisition device is fixedly connected to the top of the connecting plate, a main control board is installed inside the data acquisition device, and sensors are installed on the top of the connecting plate and on both sides of the main control board at equal intervals;

[0007] A support base is installed on the top of the data acquisition device, a power board is fixedly connected to the top of the support base, and power management modules are installed on the top of the power board at equal intervals, and the power management modules are used to provide power resources;

[0008] A semiconductor refrigeration device is installed at the bottom of the connecting plate, and the semiconductor refrigeration device includes a fixed partition, the bottom of the fixed partition is fixedly connected to a first mounting frame, a semiconductor heating end is installed inside the first mounting frame, and evenly distributed heat dissipation fins are installed at the bottom of the semiconductor heating end and inside the first mounting frame, a first fan is installed at the bottom of the first mounting frame, the top of the fixed partition is fixedly connected to a second mounting frame, a semiconductor refrigeration end is fixedly connected inside the second mounting frame, and evenly distributed temperature conduction plates are installed above the semiconductor refrigeration end and inside the second mounting frame, and a second fan extending to the inside of the data acquisition device is installed on the top of the second mounting frame. The second fan is used to assist in heat dissipation of the entire device, and the first fan is used for heat dissipation of the semiconductor device itself.

[0009] As a preferred embodiment of the present invention, positioning plates are fixedly connected to both sides of the fixed partition, and equidistantly distributed threaded holes are provided inside the positioning plates. When in use, other positioning screws are used to connect with the threaded holes, thereby reinforcing the connection operation between the entire device and the installation position, thereby improving the stability of the device during use.

[0010] As a preferred embodiment of the present invention, the sensor includes a voltage sensor, a current sensor, and a power sensor. An input interface is provided on one side of the voltage sensor, current sensor, and power sensor. By using the voltage sensor, current sensor, power sensor, and multiple input interfaces in combination, high-power physical quantities including voltage, current, power, etc. are converted into processable electrical signals.

[0011] As a preferred embodiment of the present invention, a second mounting bracket extending into the interior of the data acquisition device is installed on the top of the second mounting frame, the second fan is located inside the second mounting bracket, and the top of the second mounting bracket is threadedly connected with second positioning bolts extending into the interior of the second mounting bracket. A second filter plate used in conjunction with the second fan is installed on the bottom of the second mounting bracket. The second fan is a bidirectional fan structure. When the equipment is operating normally, the second fan is operated to assist in heat dissipation. When the temperature is too high, both the second fan and the semiconductor refrigeration end are operated to quickly dissipate heat. The equipment operating temperature is monitored and processed in real time by the temperature control module, and the semiconductor heating end and the semiconductor refrigeration end are separated by a fixed partition to reduce the problem of hot and cold gases being mixed together and difficult to handle.

[0012] As a preferred embodiment of the present invention, a first mounting bracket is installed at the bottom of the first mounting frame, the first fan is located inside the first mounting bracket, and the bottom of the first mounting bracket is threadedly connected with first positioning bolts extending into the first mounting frame. A first filter plate is installed at the bottom of the first mounting bracket for use with the first fan. The first fan is a bidirectional fan structure. When in use, heat is generated when the semiconductor refrigeration end is running, and the heat is discharged through the semiconductor heating end. Natural heat dissipation is assisted by multiple heat dissipation fins. When the heat is too high, the first fan is operated to discharge the heat generated by the semiconductor heating end in time near the equipment, thereby extending the service life of the equipment.

[0013] As a preferred embodiment of the present invention, a temperature control module is fixedly connected to the bottom of the power board and on one side of the support base, and an analog-to-digital conversion module is fixedly connected to one side of the temperature control module. The analog-to-digital conversion module is used to convert analog signals into digital signals to meet the dynamic range and accuracy in high-power scenarios. The temperature control module is used for real-time temperature monitoring and processing when the equipment is running.

[0014] As a preferred embodiment of the present invention, a cavity is provided inside the data acquisition device for installation of a main control board, a communication module and a transmission distance control module are installed on the top of the main control board, and the transmission distance control module is located on one side of the communication module. An isolation protection module is installed on the top of the main control board, and the isolation protection module is located on one side of the transmission distance control module. The communication module is used to maintain a communication connection with an external device, the transmission distance control module is used to control the effective transmission distance of each communication data, and the isolation protection module is used to prevent high-power signals from impacting low-voltage circuits to ensure equipment safety.

[0015] As a preferred embodiment of the present invention, the data acquisition device, sensor, semiconductor heating end, semiconductor cooling end, second fan and power board are all electrically connected to the main control board. The main control board is used to control the operation of the data acquisition device, sensor, semiconductor heating end, semiconductor cooling end, second fan and power board, thereby realizing unified control of hardware equipment.

[0016] As a preferred embodiment of the present invention, it also includes a data acquisition device software end, the main control board is bidirectionally connected to the data acquisition device software end, and the communication module, transmission distance control module, isolation protection module, power management module, analog-to-digital conversion module and temperature control module are all communicatively connected to the main control board. The main control board is used to control the operation of the communication module, transmission distance control module, isolation protection module, power management module, analog-to-digital conversion module and temperature control module, thereby realizing unified control of the software.

[0017] As a preferred embodiment of the present invention, the communication module is used to maintain a communication connection with an external device and can be adapted to the data collector in the communication ring network cabinet provided by Sunshine;

[0018] The transmission distance control module is used to control the effective transmission distance of each communication data;

[0019] The isolation protection module is used to prevent the impact of high-power signals on low-voltage circuits and ensure the safety of equipment. The isolation protection module is a DC-DC isolation module, which is used to achieve electrical isolation. By isolating the input and output power circuits, it blocks common ground interference and suppresses noise transmission;

[0020] The power management module is used to manage and optimize the distribution, conversion, regulation and protection of the internal power supply of the device, and can intelligently switch between multiple input sources to ensure uninterrupted power supply to the device;

[0021] The analog-to-digital conversion module is used to convert the voltage or current value from the analog signal into a digital signal so that the device can perform digital processing, analysis and storage. The analog-to-digital conversion module can be designed to support multi-channel simultaneous acquisition to ensure that multiple signals can be accurately converted and processed at the same time to avoid signal loss or time delay;

[0022] The temperature control module is used to manage the temperature inside the equipment, ensure that the equipment operates within a safe and stable temperature range, record temperature data during equipment operation, and perform trend analysis to help maintenance personnel identify potential thermal problems with the equipment.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention is provided with a device hardware end, which converts high-power physical quantities including voltage, current, power, etc. into processable electrical signals through the cooperation of a voltage sensor, a current sensor, a power sensor and a plurality of input interfaces. The first fan and the second fan are bidirectional fan structures. When the device is operating normally, the second fan is operated to assist in heat dissipation. When the temperature is too high, the second fan and the semiconductor refrigeration end are both operated to quickly dissipate heat. The operating temperature of the device is monitored and processed in real time by a temperature control module. The semiconductor heating end and the semiconductor refrigeration end are separated by a fixed partition to reduce the problem of hot and cold gases being mixed together and difficult to handle. When the semiconductor refrigeration end is operating, heat is generated, and the heat is discharged through the semiconductor heating end. Natural heat dissipation is assisted by a plurality of heat dissipation fins. When the heat is too high, the first fan is operated to promptly discharge the heat generated by the semiconductor heating end near the device, thereby extending the service life of the device. The interior of the positioning plate is provided with equidistantly distributed threaded holes, which are connected to the threaded holes with other positioning screws when in use, thereby reinforcing the connection operation between the entire device and the installation position, thereby improving the stability of the device during use.

[0025] 2. The present invention is provided with a device software end, a communication module for maintaining a communication connection with an external device, and can be adapted to the data acquisition device in the communication ring network cabinet provided by Sunshine. The transmission distance control module is used to control the effective transmission distance of each communication data, and the isolation protection module is used to prevent the impact of high-power signals on low-voltage circuits to ensure equipment safety. The isolation protection module is a DC-DC isolation module for achieving electrical isolation. The temperature control module is used to manage the temperature inside the equipment to ensure that the equipment operates within a safe and stable temperature range, record the temperature data during the operation of the equipment, and perform trend analysis to help maintenance personnel identify potential thermal problems of the equipment, thereby making two-way improvements to the hardware and software of the data acquisition equipment, reducing the impact on equipment operation caused by problems such as the installation and heat dissipation of the data acquisition hardware equipment, and improving the overall intelligent control level of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of a high-power data acquisition device of the present invention. Figure 1 ;

[0027] Figure 2 This is a schematic diagram of the overall structure of a high-power data acquisition device of the present invention. Figure 2 ;

[0028] Figure 3 This is a schematic diagram of the internal structure of a data acquisition device for a high-power data acquisition device of the present invention. Figure 1 ;

[0029] Figure 4 This is a schematic diagram of the internal structure of a data acquisition device for a high-power data acquisition device of the present invention. Figure 2 ;

[0030] Figure 5 A high-power data acquisition device of the present invention Figure 1 A schematic diagram of the structure enlargement at point A;

[0031] Figure 6 A high-power data acquisition device of the present invention Figure 4 A magnified schematic diagram of the structure at point B in FIG.

[0032] Figure 7 This is the overall structural topology diagram of a high-power data acquisition device of the present invention.

[0033] In the picture:

[0034] 1. Connection board; 11. Data acquisition device; 12. Sensor; 13. Input interface; 14. Main control board; 15. Communication module; 16. Transmission distance control module; 17. Isolation protection module;

[0035] 2. Fixed baffle; 21. Semiconductor heating end; 22. First mounting frame; 23. Heat sink fins; 24. Second mounting frame; 25. Semiconductor cooling end; 26. Temperature conduction plate; 27. First mounting bracket; 28. First positioning bolt; 29. First fan; 291. First filter plate; 292. Second mounting bracket; 293. Second positioning bolt; 294. Second fan; 295. Second filter plate;

[0036] 3. Power board; 31. Power management module; 32. Analog-to-digital conversion module; 33. Temperature control module; 34. Support base. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] See also Figure 1-Figure 7 The present invention provides a technical solution: a high-power data acquisition device, including a data acquisition device hardware end: the data acquisition device hardware end includes a connecting plate 1, a data acquisition device 11 is fixedly connected to the top of the connecting plate 1, a main control board 14 is installed inside the data acquisition device 11, and sensors 12 are installed on the top of the connecting plate 1 and on both sides of the main control board 14 at equal distances.

[0039] In this solution, a support base 34 is installed on the top of the data acquisition device 11. A power board 3 is fixedly connected to the top of the support base 34. Equally spaced power management modules 31 are installed on the top of the power board 3. The power management modules 31 are used to provide power resources.

[0040] In this solution, a semiconductor refrigeration device is installed at the bottom of the connecting plate 1, and the semiconductor refrigeration device includes a fixed partition 2, and the bottom of the fixed partition 2 is fixedly connected to a first mounting frame 22, and a semiconductor heating end 21 is installed inside the first mounting frame 22. The bottom of the semiconductor heating end 21 and the interior of the first mounting frame 22 are installed with equidistantly distributed heat dissipation fins 23, and the bottom of the first mounting frame 22 is installed with equidistantly distributed heat dissipation fins. A first fan 29 is installed at the bottom of the first mounting frame 22, and the top of the fixed partition 2 is fixedly connected to a second mounting frame 24, and the interior of the second mounting frame 24 is fixedly connected to a semiconductor refrigeration end 25. Above the semiconductor refrigeration end 25 and inside the second mounting frame 24, equidistantly distributed temperature conduction plates 26 are installed. A second fan 294 extending to the interior of the data acquisition device 11 is installed on the top of the second mounting frame 24. The second fan 294 is used to assist in heat dissipation of the entire device, and the first fan 29 is used for heat dissipation of the semiconductor device itself.

[0041] See also Figure 1-Figure 4 In this solution, the sensor 12 includes a voltage sensor, a current sensor, and a power sensor. An input interface 13 is provided on one side of the voltage sensor, the current sensor, and the power sensor. By using the voltage sensor, the current sensor, the power sensor, and multiple input interfaces 13 in combination, high-power physical quantities including voltage, current, power, etc. are converted into processable electrical signals.

[0042] See also Figures 1-6 In this solution, a second mounting bracket 292 extending into the interior of the data acquisition device 11 is installed on the top of the second mounting frame 24, and a second fan 294 is located inside the second mounting bracket 292. Second positioning bolts 293 extending into the interior of the second mounting bracket 292 are threadedly connected on all four sides of the top of the second mounting bracket 292, and a second filter plate 295 used in conjunction with the second fan 294 is installed at the bottom of the second mounting bracket 292. The second fan 294 is a two-way fan structure. When the equipment is operating normally, the second fan 294 is used to assist in heat dissipation. When the temperature is too high, the second fan 294 and the semiconductor refrigeration end 25 are both operated to quickly dissipate heat. The operating temperature of the equipment is monitored and processed in real time by the temperature control module 33. The semiconductor heating end 21 and the semiconductor refrigeration end 25 are separated by a fixed partition 2 to reduce the problem of hot and cold gases being mixed together and difficult to handle.

[0043] In this solution, a first mounting bracket 27 is installed at the bottom of the first mounting frame 22, and a first fan 29 is located inside the first mounting bracket 27. The bottom of the first mounting bracket 27 is threadedly connected with first positioning bolts 28 extending into the first mounting frame 22. A first filter plate 291 for use with the first fan 29 is installed at the bottom of the first mounting bracket 27. The first fan 29 is a two-way fan structure. When in use, heat is generated when the semiconductor refrigeration end 25 is running. The heat is discharged through the semiconductor heating end 21 and assisted by multiple heat dissipation fins 23 to dissipate heat naturally. When the heat is too high, the first fan 29 is operated to discharge the heat generated by the semiconductor heating end 21 out of the vicinity of the equipment in a timely manner, thereby extending the service life of the equipment.

[0044] See also Figures 1-6 In this solution, a temperature control module 33 is fixedly connected to the bottom of the power board 3 and on one side of the support base 34. An analog-to-digital conversion module 32 is fixedly connected to one side of the temperature control module 33. The analog-to-digital conversion module 32 is used to convert analog signals into digital signals to meet the dynamic range and accuracy in high-power scenarios. The temperature control module 33 is used for real-time temperature monitoring and processing when the equipment is running.

[0045] In this solution, a cavity is opened inside the data acquisition device 11 for installing the main control board 14. A communication module 15 and a transmission distance control module 16 are installed on the top of the main control board 14. The transmission distance control module 16 is located on one side of the communication module 15. An isolation protection module 17 is installed on the top of the main control board 14. The isolation protection module 17 is located on one side of the transmission distance control module 16. The communication module 15 is used to maintain a communication connection with an external device. The transmission distance control module 16 is used to control the effective transmission distance of each communication data. The isolation protection module 17 is used to prevent high-power signals from impacting low-voltage circuits to ensure equipment safety.

[0046] See also Figure 1-Figure 7 In this solution, the data acquisition device 11, sensor 12, semiconductor heating end 21, semiconductor cooling end 25, second fan 294 and power board 3 are all electrically connected to the main control board 14. The main control board 14 is used to control the operation of the data acquisition device 11, sensor 12, semiconductor heating end 21, semiconductor cooling end 25, second fan 294 and power board 3, realizing unified control of hardware devices. The sensor 12 measures environmental parameters, converts them into signals and sends them to the main control board 14. The main control board 14 receives and processes the signals and generates corresponding control signals according to a preset control algorithm.

[0047] See also Figure 1-Figure 7 In this solution, both sides of the fixed partition 2 are fixedly connected with positioning plates, and the interior of the positioning plates are provided with equidistantly distributed threaded holes. When in use, other positioning screws are connected to the threaded holes to reinforce the connection operation between the entire device and the installation position, thereby improving the stability of the equipment during use.

[0048] See also Figure 1-Figure 7 This solution also includes a data acquisition device software end, and the main control board 14 is bidirectionally connected to the data acquisition device software end. The communication module 15, the transmission distance control module 16, the isolation protection module 17, the power management module 31, the analog-to-digital conversion module 32 and the temperature control module 33 are all communicatively connected to the main control board 14. The main control board 14 is used to control the operation of the communication module 15, the transmission distance control module 16, the isolation protection module 17, the power management module 31, the analog-to-digital conversion module 32 and the temperature control module 33, thereby realizing unified control of the software.

[0049] In this solution, the communication module 15 is used to maintain communication connection with external devices and can be adapted to the data collector in the communication ring network cabinet provided by Sunshine; the transmission distance control module 16 is used to control the effective transmission distance of each communication data, and extend the effective transmission distance of the inverter communication from 1000 meters to about 1500 meters; the isolation protection module 17 is used to prevent the impact of high-power signals on low-voltage circuits and ensure the safety of equipment. The isolation protection module 17 is a DC-DC isolation module used to achieve electrical isolation. By isolating the input and output power circuits, it blocks common ground interference and suppresses noise transmission; the power management module 31 is used to manage and optimize the distribution, conversion, and operation of the internal power supply of the equipment. Regulation and protection, it can intelligently switch between multiple input sources to ensure uninterrupted power supply to the equipment; the analog-to-digital conversion module 32 is used to convert the voltage or current value from the analog signal into a digital signal so that the equipment can perform digital processing, analysis and storage. The analog-to-digital conversion module 32 can be designed to support multi-channel simultaneous acquisition to ensure that multiple signals can be accurately converted and processed at the same time to avoid signal loss or time delay; the temperature control module 33 is used to manage the temperature inside the equipment, ensure that the equipment operates within a safe and stable temperature range, record the temperature data during equipment operation, and perform trend analysis to help maintenance personnel identify potential thermal problems of the equipment.

[0050] See also Figure 1-Figure 7 , the working principle of the present invention:

[0051] The present invention is provided with a device hardware end, which converts high-power physical quantities including voltage, current, power, etc. into processable electrical signals through the cooperation of voltage sensors, current sensors, power sensors and multiple input interfaces 13.

[0052] The first fan 29 and the second fan 294 are bidirectional fan structures. When the equipment is operating normally, the second fan 294 is operated to assist in heat dissipation. When the temperature is too high, both the second fan 294 and the semiconductor refrigeration end 25 are operated to quickly dissipate heat. The equipment operating temperature is monitored and processed in real time by the temperature control module 33.

[0053] The semiconductor heating end 21 and the semiconductor cooling end 25 are separated and operated by fixing the partition plate 2, thereby reducing the problem of hot and cold gases being mixed together and being difficult to handle.

[0054] When the semiconductor cooling end 25 is in operation, heat is generated, which is discharged through the semiconductor heating end 21 and naturally dissipated with the assistance of multiple heat dissipation fins 23. When the heat is too high, the first fan 29 is operated to promptly discharge the heat generated by the semiconductor heating end 21 out of the vicinity of the device, thereby extending the service life of the device.

[0055] The main control board 14 is used to control the operation of the data acquisition device 11, the sensor 12, the semiconductor heating end 21, the semiconductor cooling end 25, the second fan 294 and the power board 3, thereby realizing unified control of the hardware devices.

[0056] The sensor 12 measures environmental parameters, converts them into signals and sends them to the main control board 14. The main control board 14 receives and processes the signals and generates corresponding control signals according to a preset control algorithm.

[0057] The interior of the positioning plate is provided with threaded holes distributed at equal distances. When in use, other positioning screws are connected to the threaded holes to reinforce the connection between the entire device and the installation position, thereby improving the stability of the device during use.

[0058] The present invention is provided with a device software end, and the main control board 14 is used to control the operation of the communication module 15, the transmission distance control module 16, the isolation protection module 17, the power management module 31, the analog-to-digital conversion module 32 and the temperature control module 33, thereby realizing unified control of the software.

[0059] The communication module 15 is used to maintain communication connection with external devices and can be adapted to the data collector in the communication ring network cabinet provided by Sungrow.

[0060] The transmission distance control module 16 is used to control the effective transmission distance of each communication data, and to extend the effective transmission distance of the inverter communication from 1000 meters to about 1500 meters.

[0061] The isolation protection module 17 is used to prevent high-power signals from impacting low-voltage circuits and ensure equipment safety. The isolation protection module 17 is a DC-DC isolation module used to achieve electrical isolation. By isolating the input and output power supply circuits, it blocks common ground interference and suppresses noise transmission.

[0062] The power management module 31 is used to manage and optimize the distribution, conversion, regulation and protection of the internal power supply of the device. It can intelligently switch between multiple input sources to ensure uninterrupted power supply to the device.

[0063] The analog-to-digital conversion module 32 is used to convert the voltage or current value from the analog signal into a digital signal so that the device can perform digital processing, analysis and storage. The analog-to-digital conversion module 32 can be designed to support multi-channel simultaneous acquisition to ensure that multiple signals can be accurately converted and processed at the same time to avoid signal loss or time delay.

[0064] The temperature control module 33 is used to manage the temperature inside the equipment, ensure that the equipment operates within a safe and stable temperature range, record the temperature data during the operation of the equipment, and perform trend analysis to help maintenance personnel identify potential thermal problems of the equipment, thereby making two-way improvements to the hardware and software of the data acquisition equipment, reducing the impact of problems such as the installation and heat dissipation of the data acquisition hardware equipment on the operation of the equipment, and improving the overall intelligent control level of the equipment.

[0065] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A high-power data acquisition device, characterized in that: Including data acquisition equipment hardware: The data acquisition device hardware end comprises a connecting plate (1), a data acquisition device (11) is fixedly connected to the top of the connecting plate (1), a main control board (14) is installed inside the data acquisition device (11), and sensors (12) are installed at equal distances on the top of the connecting plate (1) and on both sides of the main control board (14); A support base (34) is installed on the top of the data acquisition device (11), a power supply board (3) is fixedly connected to the top of the support base (34), and power management modules (31) are installed on the top of the power supply board (3) at equal intervals; A semiconductor refrigeration device is installed at the bottom of the connecting plate (1), and the semiconductor refrigeration device includes a fixed partition (2), the bottom of the fixed partition (2) is fixedly connected to a first installation frame (22), the interior of the first installation frame (22) is installed with a semiconductor heating end (21), the bottom of the first installation frame (22) is installed with a first fan (29), the top of the fixed partition (2) is fixedly connected to a second installation frame (24), the interior of the second installation frame (24) is fixedly connected with a semiconductor refrigeration end (25), and the top of the second installation frame (24) is installed with a second fan (294) extending to the interior of the data acquisition device (11).

2. The high-power data acquisition device according to claim 1, characterized in that: Positioning plates are fixedly connected to both sides of the fixed partition (2), and threaded holes distributed at equal intervals are provided inside the positioning plates.

3. The high-power data acquisition device according to claim 2, characterized in that: The sensor (12) comprises a voltage sensor, a current sensor, and a power sensor, and one side of each of the voltage sensor, the current sensor, and the power sensor is provided with an input interface (13).

4. The high-power data acquisition device according to claim 3, characterized in that: A second mounting frame (292) extending into the interior of the data acquisition device (11) is installed on the top of the second mounting frame (24); the second fan (294) is located inside the second mounting frame (292); and second positioning bolts (293) extending into the interior of the second mounting frame (292) are threadedly connected around the top of the second mounting frame (292).

5. The high-power data acquisition device according to claim 4, characterized in that: A first mounting frame (27) is installed at the bottom of the first mounting frame (22), the first fan (29) is located inside the first mounting frame (27), and the bottom of the first mounting frame (27) is threadedly connected to first positioning bolts (28) extending into the interior of the first mounting frame (22).

6. The high-power data acquisition device according to claim 3, characterized in that: A temperature control module (33) is fixedly connected to the bottom of the power board (3) and located on one side of the support base (34), and an analog-to-digital conversion module (32) is fixedly connected to one side of the temperature control module (33).

7. The high-power data acquisition device according to claim 6, characterized in that: The data acquisition device (11) is provided with a cavity inside for mounting a main control board (14), a communication module (15) and a transmission distance control module (16) are mounted on the top of the main control board (14), and an isolation protection module (17) is mounted on the top of the main control board (14).

8. The high-power data acquisition device according to claim 7, characterized in that: The data acquisition device (11), the sensor (12), the semiconductor heating end (21), the semiconductor cooling end (25), the second fan (294) and the power supply board (3) are all electrically connected to the main control board (14).

9. The high-power data acquisition device according to claim 8, characterized in that: The system further comprises a data acquisition device software terminal, wherein the main control board (14) is bidirectionally connected to the data acquisition device software terminal, and the communication module (15), the transmission distance control module (16), the isolation protection module (17), the power management module (31), the analog-to-digital conversion module (32) and the temperature control module (33) are all connected to the main control board (14).

10. The high-power data acquisition device according to claim 9, characterized in that: The communication module (15) is used to maintain a communication connection with an external device; The transmission distance control module (16) is used to control the effective transmission distance of each communication data; The isolation protection module (17) is used to prevent the impact of high-power signals on low-voltage circuits and ensure the safety of equipment. The isolation protection module (17) is a DC-DC isolation module and is used to achieve electrical isolation. The power management module (31) is used to manage and optimize the distribution, conversion, regulation and protection of the power supply inside the device; The analog-to-digital conversion module (32) is used to convert the voltage or current value of the analog signal into a digital signal for digital processing, analysis and storage; The temperature control module (33) is used to manage the temperature inside the device and record temperature data during the operation of the device.

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