Printed circuit board, electrical circuit, power conversion device, and air conditioner

Abstract

The printed circuit board is configured to have: a base material formed of an insulator; and a pattern which is formed on the base material and on which a DC voltage unit connected to the rectifier and the inverter in the power conversion device is mounted, the pattern having, mounted as the DC voltage unit, either a first setting provided with a plurality of first electrolytic capacitors and a second setting provided with a plurality of second electrolytic capacitors. The second setting includes a second electrolytic capacitor and a small capacitance capacitor having a smaller capacitance than the plurality of first electrolytic capacitors and a smaller capacitance than the second electrolytic capacitor.

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board, an electric circuit, a power conversion device, and an air conditioner, and more particularly to a printed circuit board for a power conversion device, and an electric circuit, a power conversion device, and an air conditioner using the printed circuit board. Background Art

[0002] In power conversion devices, electrolytic capacitors used to smooth the voltage of the main circuit have been replaced with film capacitors, which have a smaller capacitance than electrolytic capacitors. Patent Document 1 proposes a power supply circuit that uses capacitors with a small capacitance, such as tens of μF or less, as such capacitors. Using film capacitors with small capacitance can reduce the cost of power conversion devices.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-178974

[0004] However, all electrolytic capacitors used in the power conversion device cannot be replaced with film capacitors. In the power conversion device, which one to use, an electrolytic capacitor substrate using an electrolytic capacitor or an electrolytic capacitor-free substrate using a film capacitor, is selected based on the priority of user requirements or the standards of each country. For example, at the shipping destination of the air conditioner equipped with the power conversion device, when reducing the noise caused by vibration is the top priority requirement, or when the higher harmonic standards are strict, an electrolytic capacitor substrate is applied. In addition, when low cost is the top priority requirement and the restrictions on the shipping destination of the air conditioner can be eliminated, an electrolytic capacitor-free substrate is applied. In this case, for each of the electrolytic capacitor substrate and the electrolytic capacitor-free substrate, it is necessary to prepare printed circuit boards and other components separately, which increases the cost of the air conditioner. Summary of the Invention

[0005] An object of the present disclosure is to provide a printed circuit board, an electric circuit, a power conversion device, and an air conditioner that can respond to user demands.

[0006] The printed circuit board disclosed herein is configured to include: a substrate formed of an insulator; and a pattern formed on the substrate, for mounting a DC voltage unit connected to a rectifier and an inverter in a power conversion device. The pattern is mounted with either a first setting or a second setting as the DC voltage unit. The first setting includes a plurality of first electrolytic capacitors, and the second setting includes a second electrolytic capacitor and a small-capacitance capacitor having a smaller capacitance than both the plurality of first electrolytic capacitors and the second electrolytic capacitor.

[0007] In addition, the electrical circuit disclosed herein is configured to include: the above-mentioned printed circuit board; and the above-mentioned DC voltage unit, which is mounted on the above-mentioned printed circuit board. In the above-mentioned first setting, the above-mentioned multiple first electrolytic capacitors are used to smooth the voltage of the above-mentioned power conversion device, and in the above-mentioned second setting, the above-mentioned second electrolytic capacitors are used to suppress voltage fluctuations in the above-mentioned power conversion device.

[0008] Furthermore, the power conversion device of the present disclosure includes: the printed circuit board; and the DC voltage unit mounted on the printed circuit board, wherein the DC voltage unit is composed of the plurality of first electrolytic capacitors or the second electrolytic capacitor and the small-capacitance capacitor.

[0009] Furthermore, an air conditioner according to the present disclosure includes: the power conversion device including the printed circuit board; and a compressor equipped with the power conversion device.

[0010] The printed circuit board, electrical circuit, power conversion device, and air conditioner disclosed herein can be switched between an electrolytic capacitor substrate and an electrolytic capacitor-free substrate by mounting either an electrolytic capacitor or a small-capacitance capacitor in the DC voltage section. This allows for the provision of two power conversion devices based on user requirements using a single printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a circuit diagram of an electric circuit in the case where the power conversion device according to the first embodiment includes an electrolytic capacitor substrate.

[0012] Figure 2 This is a circuit diagram of an electric circuit in the case where the power conversion device according to the first embodiment has no electrolytic capacitor substrate.

[0013] Figure 3 This is a schematic diagram of the surface of the printed wiring board according to the first embodiment.

[0014] Figure 4 This is a schematic diagram of the back surface of the printed circuit board according to the first embodiment.

[0015] Figure 5 This is a mounting image diagram when the printed wiring board of the first embodiment is used as an electrolytic capacitor substrate.

[0016] Figure 6 This is a mounting image diagram when the printed wiring board of the first embodiment is used as an electroless capacitor substrate.

[0017] Figure 7 This is a circuit diagram realized by the pattern formed on the printed wiring board of the first embodiment.

[0018] Figure 8This is a schematic diagram showing an air conditioner according to Embodiment 2. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, the present disclosure is not limited to the embodiments described below. Figure 1 In the following drawings, the size relationships of the components may differ from the actual size relationships. In the following description, directional terms are used as appropriate to facilitate understanding of the present disclosure. However, these terms are for illustrative purposes only and do not limit the present disclosure. Examples of directional terms include "up," "down," "right," "left," "front," and "back."

[0020] Implementation method 1.

[0021] In the first embodiment, a power conversion device 100 having an electrolytic capacitor substrate and a power conversion device 100 having an electroless capacitor substrate, that is, an electroless capacitor inverter, are obtained by switching the mounting.

[0022] Figure 1 FIG. 1 is a circuit diagram of an electric circuit 10 in which the power conversion device 100 of the first embodiment includes an electrolytic capacitor substrate. Figure 1 As shown, an AC power source 1 and a motor 2 are connected to a power conversion device 100. The power conversion device 100 converts power from the AC power source 1 into power of an arbitrary frequency and an arbitrary voltage, and supplies the power to a load such as the motor 2. The AC power source 1 is, for example, a three-phase AC voltage of 200V AC.

[0023] The power conversion device 100 includes a rectifier circuit 3, an inter-bus circuit 4, and an inverter circuit 5. The rectifier circuit 3, the inter-bus circuit 4, and the inverter circuit 5 constitute an electric circuit 10. The inter-bus circuit 4 is an example of a DC voltage unit. A reactor 6 is also provided in the electric circuit 10.

[0024] Rectifier circuit 3 rectifies the AC voltage input from AC power supply 1 and converts it into a DC voltage, which is then output from first output terminal 3a and second output terminal 3b. Rectifier circuit 3 is, for example, a three-phase full-wave rectifier consisting of six diodes forming a bridge circuit. First output terminal 3a of rectifier circuit 3 is connected to positive bus 11. Second output terminal 3b of rectifier circuit 3 is connected to negative bus 12. The DC voltage rectified by rectifier circuit 3 includes low-order harmonic components that pulsate at a frequency six times the voltage frequency of AC power supply 1.

[0025] The inverter circuit 5 converts the DC voltage rectified by the rectifier circuit 3 into an AC voltage based on the drive switching signal and outputs it to the motor 2. The DC voltage is input from the first input terminal 5a and the second input terminal 5b of the inverter circuit 5. The first input terminal 5a of the inverter circuit 5 is connected to the positive bus 11. The second input terminal 5b of the inverter circuit 5 is connected to the negative bus 12. In other words, the positive bus 11 connects the first output terminal 3a of the rectifier circuit 3 and the first input terminal 5a of the inverter circuit 5. Furthermore, the negative bus 12 connects the second output terminal 3b of the rectifier circuit 3 to the second input terminal 5b of the inverter circuit 5.

[0026] The inverter circuit 5 is composed of a plurality of switching elements (not shown). The operation of the inverter circuit 5 is controlled by an inverter control unit (not shown). The inverter circuit 5 supplies an AC current of a predetermined frequency to the motor 2.

[0027] The inter-bus circuit 4 is connected between the rectifier circuit 3 and the inverter circuit 5. When the power conversion device 100 includes an electrolytic capacitor substrate, the inter-bus circuit 4 is formed by an electrolytic capacitor 41. The electrolytic capacitor 41 is provided to smooth the waveform of the low-order harmonic components of the DC voltage rectified by the rectifier circuit 3.

[0028] Electrolytic capacitor 41 is a capacitor using an oxide film such as aluminum or tantalum as its dielectric. One end of electrolytic capacitor 41 is connected to positive bus 11, which connects first output terminal 3a of rectifier circuit 3 and first input terminal 5a of inverter circuit 5. The other end of electrolytic capacitor 41 is connected to negative bus 12, which connects second output terminal 3b of rectifier circuit 3 and second input terminal 5b of inverter circuit 5. Electrolytic capacitor 41 has a sufficient capacitance to smooth the waveform of low-order harmonic components of the DC voltage.

[0029] The reactor 6 is connected to the first output terminal 3a of the rectifier circuit 3 via the positive bus 11. An electrolytic capacitor 41 constituting the bus circuit 4 is connected to the downstream of the reactor 6. The reactor 6 has the function of reducing the higher harmonics of the power supply. Figure 1 , an example is shown in which the reactor 6 is connected between the rectifier circuit 3 and the inter-bus circuit 4 , but the reactor 6 may be connected between the AC power supply 1 and the rectifier circuit 3 .

[0030] Figure 2 FIG. 1 is a circuit diagram of an electric circuit 10 in which the power conversion device 100 according to the first embodiment has no electrolytic capacitor substrate. Figure 2 As shown, when the power converter 100 has a substrate without electrolytic capacitors, the busbar circuit 4 is composed of a small-capacitance capacitor 42, a diode 43, an electrolytic capacitor 41, and a resistor 44. The small-capacitance capacitor 42 is provided to suppress voltage fluctuations in the power converter 100.

[0031] The small-capacitance capacitor 42 is a capacitor having a smaller capacitance than the electrolytic capacitor 41. The small-capacitance capacitor 42 is, for example, a film capacitor. The film capacitor is a capacitor using, for example, polypropylene, polyethylene terephthalate, polyphenylene sulfide, or polyethylene naphthalate as a dielectric.

[0032] One end of the small-capacitance capacitor 42 is connected to the positive-side bus 11 connecting the first output terminal 3a of the rectifier circuit 3 and the first input terminal 5a of the inverter circuit 5. The other end of the small-capacitance capacitor 42 is connected to the negative-side bus 12 connecting the second output terminal 3b of the rectifier circuit 3 and the second input terminal 5b of the inverter circuit 5.

[0033] The electrolytic capacitor 41 is connected in series with a diode 43 connected to the positive bus 11, with the high-potential side serving as the anode. Specifically, one end of the electrolytic capacitor 41 is connected to the cathode of the diode 43, and the other end is connected to the negative bus 12, which connects the second output terminal 3b of the rectifier circuit 3 and the second input terminal 5b of the inverter circuit 5.

[0034] Furthermore, the electrolytic capacitor 41 is connected in parallel with the resistor 44. Specifically, the electrolytic capacitor 41 is connected in parallel with the resistor 44, one end of which is connected to the cathode side of the diode 43 and the other end of which is connected to the negative bus 12 connecting the second output terminal 3b of the rectifier circuit 3 and the second input terminal 5b of the inverter circuit 5.

[0035] Here, the low-capacitance capacitor 42 does not smooth the waveform of the low-order harmonic components of the DC voltage, and therefore cannot absorb voltage fluctuations when the AC power supply 1 or the operation of the motor 2 changes. On the other hand, the electrolytic capacitor 41 does not smooth the DC voltage due to the presence of the diode 43, but it can prevent sudden changes in the bus voltage. The charge accumulated in the electrolytic capacitor 41 is discharged through the resistor 44 connected in parallel with the electrolytic capacitor 41. The provision of the electrolytic capacitor 41 prevents damage to the various components that make up the power conversion device 100 due to sudden changes in the bus voltage.

[0036] Furthermore, when the power conversion device 100 includes a substrate without an electrolytic capacitor, the capacitance of the reactor 6 can be smaller than that of the reactor used when the power conversion device 100 includes an electrolytic capacitor substrate. This is because when the power conversion device 100 includes a substrate without an electrolytic capacitor, that is, when an inverter without an electrolytic capacitor, the amount of low-order harmonics generated in the power supply voltage is less than when the power conversion device 100 includes an electrolytic capacitor 41.

[0037] exist Figure 2 The example in which the reactor 6 is connected between the rectifier circuit 3 and the busbar circuit 4 is shown in FIG. Figure 1 The same as the case above, the reactor 6 can also be connected between the AC power supply 1 and the rectifier circuit 3.

[0038] Figure 3 This is a schematic diagram of the surface of printed wiring board 111 according to the first embodiment. Figure 4 Schematic diagram of the back side of the printed circuit board 111 according to the first embodiment. Figure 3 as well as Figure 4 In FIG, the dotted lines indicate the positions of the electronic components mounted on the printed circuit board 111. Figure 3 as well as Figure 4 In the figure, the electronic components mounted on the electrolytic capacitor substrate and the electronic components mounted on the non-electrolytic capacitor substrate are staggered.

[0039] like Figure 3 as well as Figure 4 As shown, printed circuit board 111 includes substrate 110, multiple holes 120, and pattern 240. Multiple holes 120 and pattern 240 are examples of circuits formed in substrate 110. Multiple holes 120 and pattern 240 are configured to mount inter-busbar circuit 4 connected to rectifier circuit 3 and inverter circuit 5 of power conversion device 100. In power conversion device 100, printed circuit board 111 can also constitute either an electrolytic capacitor substrate or a non-electrolytic capacitor substrate. Furthermore, multiple holes 120 and pattern 240 can also be configured to mount rectifier circuit 3 and inverter circuit 5.

[0040] Substrate 110 is an insulator, for example, a glass epoxy substrate made by impregnating epoxy resin into glass cloth made by weaving glass fibers. Multiple holes 120 are openings through which the leads of electronic components such as electrolytic capacitor 41 are inserted. Multiple holes 120 include first holes 120a and second holes 120b. Copper foil is applied to the interior and surrounding areas of substrate 110, forming the openings of multiple holes 120. The leads of the electronic components are inserted through the openings of multiple holes 120 and soldered, thereby mounting the electronic components on substrate 110.

[0041] The pattern 240 is a copper foil applied to the substrate 110 along the path through which electricity passes. The pattern 240 is configured to be inserted into the openings of the plurality of holes 120 and to connect the electronic components mounted on the substrate 110 to each other as designed. The pattern 240 applied on the surface of the substrate 110 is Figure 1 as well as Figure 2 The pattern 240 implemented on the back side of the substrate 110 is the wiring of the positive side bus 11 in the electrical circuit 10. Figure 1 as well as Figure 2The wiring for the negative busbar 12 in the electrical circuit 10 is ground-side wiring. Pattern 240 is formed, for example, by a subtractive method, removing the copper foil previously covering the entire surface of substrate 110, leaving only the wiring portion. Pattern 240 can also be formed by an additive method, adding a copper foil wiring pattern to the surface of substrate 110. Pattern 240 connects multiple holes 120 in parallel.

[0042] Furthermore, when electronic components are mounted on the surface of the substrate 110 , the circuit may be formed by copper foil formed into a land shape such as a rectangular shape, rather than inside and around the plurality of openings 120 .

[0043] Figure 5 This is a mounting image diagram of the printed circuit board 111 of the first embodiment when it is used as an electrolytic capacitor substrate. The case where the printed circuit board 111 is used as an electrolytic capacitor substrate is an example of the first setting. Figure 5 As shown, when the printed circuit board 111 is used as an electrolytic capacitor substrate, the printed circuit board 111 is equipped with a Figure 1 The electrolytic capacitor 41 of the busbar circuit 4 is mounted on the plurality of holes 120 and the pattern 240 of the printed circuit board 111. The electrolytic capacitor 41 is electrically connected to the rectifier circuit 3 and the inverter circuit 5 via the plurality of holes 120 and the pattern 240 of the printed circuit board 111.

[0044] The electrolytic capacitor 41 includes, for example, a first electrolytic capacitor 41a and a plurality of third electrolytic capacitors 41b to 41g. The electrolytic capacitor 41 is an example of a plurality of first electrolytic capacitors, and the first electrolytic capacitor 41a is an example of a first electrolytic capacitor. The first electrolytic capacitor 41a is welded and mounted on Figure 3 The first hole 120a of the printed circuit board 111 is shown. A plurality of third electrolytic capacitors 41b to 41g are soldered and mounted on Figure 3 The printed circuit board 111 is shown with a plurality of second holes 120 b.

[0045] As described above, the plurality of holes 120 of printed circuit board 111 are connected in parallel via pattern 240. Therefore, when printed circuit board 111 is used as an electrolytic capacitor substrate, first electrolytic capacitor 41a and third electrolytic capacitors 41b to 41g are connected in parallel. This parallel connection of first electrolytic capacitor 41a and third electrolytic capacitors 41b to 41g ensures sufficient capacitance and withstand voltage in power conversion device 100.

[0046] Figure 6This is an installation image diagram of the printed circuit board 111 of the first embodiment when it is used as a substrate without electrolytic capacitors. The case where the printed circuit board 111 is used as a substrate without electrolytic capacitors is an example of the second setting. Figure 6 As shown, when the printed circuit board 111 is used as a substrate for a non-electrolytic capacitor, a component is mounted on the printed circuit board 111. Figure 2 The busbar circuit 4 includes a small-capacitance capacitor 42. The small-capacitance capacitor 42 is mounted in the plurality of holes 120 and pattern 240 of the printed circuit board 111. The small-capacitance capacitor 42 is electrically connected to the rectifier circuit 3 and the inverter circuit 5 via the plurality of holes 120 and pattern 240 of the printed circuit board 111.

[0047] The small-capacitance capacitor 42 includes, for example, a plurality of small-capacitance capacitors 42a to 41c. The plurality of small-capacitance capacitors 42a to 42c are welded and mounted on Figure 3 Second hole 120b of printed circuit board 111 is shown. When printed circuit board 111 is used as an electrolytic capacitor substrate, second hole 120b is where third electrolytic capacitors 41b to 41g are mounted. As described above, multiple holes 120 in printed circuit board 111 are connected in parallel via pattern 240. Therefore, multiple small-capacitance capacitors 42a to 42c are mounted in parallel.

[0048] When the printed circuit board 111 is used as a substrate without electrolytic capacitors, a second electrolytic capacitor 41a is also installed on the printed circuit board 111. The second electrolytic capacitor 41a when the printed circuit board 111 is used as a substrate without electrolytic capacitors uses the same capacitor as the first electrolytic capacitor 41a used when the printed circuit board 111 is used as an electrolytic capacitor substrate. The second electrolytic capacitor 41a is installed at the same position as the position configured when the printed circuit board 111 is used as an electrolytic capacitor substrate. That is, when the printed circuit board 111 is used as a substrate without electrolytic capacitors, the second electrolytic capacitor 41a is also soldered to Figure 3 In addition, when the printed circuit board 111 is used as a substrate for a non-electrolytic capacitor, a component constituting the same is also installed on the printed circuit board 111. Figure 2 The diode 43 and the resistor 44 of the busbar circuit 4.

[0049] Figure 7 This is a circuit diagram implemented by the pattern 240 formed on the printed circuit board 111 of the first embodiment. Figure 7 As shown, the pattern 240 includes a first pattern 240a, a second pattern 240b, a third pattern 240c, a fourth pattern 240d, and a fifth pattern 240e.

[0050] First pattern 240a is a pattern 240 for mounting first or second electrolytic capacitor 41a. First pattern 240a is provided with first holes 120a. Second pattern 240b is a pattern 240 for mounting third electrolytic capacitors 41b-41g or small-capacitance capacitors 42a-42c. Second pattern 240b is provided with second holes 120b. Second pattern 240b is arranged in parallel with first pattern 240a between positive busbar 11 and negative busbar 12.

[0051] The third pattern 240c and the fourth pattern 240d are arranged in series with the first pattern 240a. In addition, the third pattern 240c and the fourth pattern 240d are arranged in parallel with each other. The fifth pattern 240e is arranged in parallel with the first pattern 240a. A plurality of resistors 44 are connected in parallel to the fifth pattern 240e.

[0052] When the printed circuit board 111 is used as an electrolytic capacitor substrate, a first electrolytic capacitor 41a is installed in the first pattern 240a, and a plurality of third electrolytic capacitors 41b to 41g are installed in the second pattern 240b. In addition, a jumper 45 serving as a short-circuit unit is installed in the third pattern 240c, and nothing is installed in the fourth pattern 240d, with only the fourth pattern 240d being conductive. For example, two jumpers 45 are connected in parallel. The number of jumpers 45 is not particularly limited as long as the current capacitance value can be met. In addition, five resistors 44 are installed in the fifth pattern 240e, for example. The resistors 44 are provided to release the charge accumulated in the first electrolytic capacitor 41a and the plurality of third electrolytic capacitors 41b to 41g. In this way, an electrolytic capacitor substrate can be obtained.

[0053] When the printed circuit board 111 is used as a non-electrolytic capacitor substrate, a second electrolytic capacitor 41a is installed in the first pattern 240a, and a plurality of small-capacitance capacitors 42a to 42c are installed in the second pattern 240b. In addition, nothing is installed in the third pattern 240c, and a diode 43 is installed in the fourth pattern 240d, with only the fourth pattern 240d being conductive. In addition, two resistors 44 are installed in the fifth pattern 240e, for example. Unlike an electrolytic capacitor substrate, a non-electrolytic capacitor substrate does not have multiple third electrolytic capacitors 41b to 41g, so the number of resistors 44 can be reduced. Thus, a non-electrolytic capacitor substrate can be obtained.

[0054] In this way, the printed circuit board 111 can also be used as a non-electrolytic capacitor substrate by installing a small-capacitance capacitor 42, so that a cheap power conversion device 100 can be obtained. In addition, a second electrolytic capacitor 41a is installed on the non-electrolytic capacitor substrate as a regeneration countermeasure circuit. Therefore, it is possible to absorb the voltage fluctuation when the operation of the AC power supply 1 or the motor 2 changes, protecting the power conversion device 100 from the influence of overvoltage. In addition, a diode 43 and a resistor 44 are installed on the non-electrolytic capacitor substrate, so that the charge accumulated in the second electrolytic capacitor 41a can be released.

[0055] According to the printed circuit board 111 of the embodiment 1 described above, it is possible to switch between installing a first setting with an electrolytic capacitor 41 and a second setting with a small-capacitance capacitor 42 as the busbar circuit 4. Therefore, it is possible to switch to one of an electrolytic capacitor substrate with an electrolytic capacitor 41 or an electrolytic capacitor-free substrate with a small-capacitance capacitor 42 in the printed circuit board 111, and it is also possible to obtain either an electrolytic capacitor substrate or an electrolytic capacitor-free substrate. Compared with the electrolytic capacitor substrate, the regenerative action of the motor 2 is weaker in the electrolytic capacitor-free substrate, but by using the printed circuit board 111 and applying the circuit of the electrolytic capacitor substrate, an electrolytic capacitor-free inverter equipped with a thin film capacitor and a regenerative countermeasure circuit can be obtained. Therefore, by using a printed circuit board 111, two types of power conversion devices 100 can be provided: a power conversion device 100 with an electrolytic capacitor substrate and a power conversion device 100 with an electrolytic capacitor-free substrate. The printed circuit board 111 can realize either the power conversion device 100 using the electrolytic capacitor 41 or the power conversion device 100 using the small-capacity capacitor 42 , thereby being able to respond to user demands at a low cost.

[0056] In addition, the first electrolytic capacitor 41a or the second electrolytic capacitor 41a among the electrolytic capacitors 41 is mounted in the first hole 120a provided in the first pattern 240a of the printed circuit board 111. The third electrolytic capacitors 41b to 41g or the small-capacitance capacitor 42 is mounted in the second hole 120b provided in the second pattern 240b. When the printed circuit board 111 is used as an electrolytic capacitor substrate, the first electrolytic capacitor 41a is mounted in the first hole 120a provided in the first pattern 240a. Furthermore, the third electrolytic capacitors 41b to 41g are mounted in the second hole 120b provided in the second pattern 240b. When the printed circuit board 111 is used as a substrate without electrolytic capacitors, the second electrolytic capacitor 41a is mounted in the first hole 120a, similarly to the electrolytic capacitor substrate, and the small-capacitance capacitor 42 is mounted in the second hole 120b, different from the electrolytic capacitor substrate.

[0057] In addition, the pattern 240 includes a first pattern 240a on which the first electrolytic capacitor 41a or the second electrolytic capacitor 41a is mounted, and a second pattern 240b on which either the third electrolytic capacitors 41b to 41g or the small-capacitance capacitor 42 is mounted. Therefore, in the printed circuit board 111, it is not necessary to provide a mounting location for the second electrolytic capacitor 41a when used as a substrate without electrolytic capacitors separately from a mounting location for the first electrolytic capacitor 41a when used as an electrolytic capacitor substrate. By using the printed circuit board 111, the electrolytic capacitor 41 can be shared between the electrolytic capacitor substrate and the substrate without electrolytic capacitors. For example, when the printed circuit board 111 is used as a substrate without electrolytic capacitors, the small-capacitance capacitor 42 can be mounted at the position where the electrolytic capacitor 41 is mounted on the electrolytic capacitor substrate, thereby reducing the space required on the printed circuit board 111.

[0058] Furthermore, when the printed circuit board 111 is used as an electrolytic capacitor substrate, a jumper 45 is connected to the third pattern 240c, and only the fourth pattern 240d is conductive. When the printed circuit board 111 is used as a substrate for a non-electrolytic capacitor, a diode 43 is connected to the third pattern 240c, and only the fourth pattern 240d is conductive. Thus, for example, when the printed circuit board 111 is used as a substrate for a non-electrolytic capacitor, voltage fluctuations can be absorbed and the charge stored in the second electrolytic capacitor 41a can be released.

[0059] Furthermore, when the printed circuit board 111 is used as an electrolytic capacitor substrate, the number of resistors 44 connected to the fifth pattern 240e is greater than when it is used as a non-electrolytic capacitor substrate. Since only the second electrolytic capacitor 41a is mounted on the non-electrolytic capacitor substrate, charge can be discharged through a smaller number of resistors 44 than when it is used as an electrolytic capacitor substrate.

[0060] Furthermore, the third pattern 240c, the fourth pattern 240d, and the fifth pattern 240e are all formed around the first pattern 240a. Therefore, the path from the first electrolytic capacitor 41a or the second electrolytic capacitor 41a to the diode 43, the jumper 45, or the resistor 44 can be shortened, thereby reducing noise.

[0061] Furthermore, the first electrolytic capacitor 41a mounted on the electrolytic capacitor substrate and the second electrolytic capacitor 41a mounted on the non-electrolytic capacitor substrate can use the same electrolytic capacitor. Therefore, the first electrolytic capacitor 41a mounted on the electrolytic capacitor substrate and the second electrolytic capacitor 41a mounted on the non-electrolytic capacitor substrate are shared, and there is no need to prepare them separately.

[0062] Furthermore, the first electrolytic capacitor 41a mounted on the electrolytic capacitor substrate and the second electrolytic capacitor 41a mounted on the non-electrolytic capacitor substrate are mounted on the first pattern 240a. In other words, a single printed circuit board 111 can be used to implement either the electrolytic capacitor substrate or the non-electrolytic capacitor substrate. Therefore, a method that meets user expectations can be achieved without having to prepare separate printed circuit boards 111 for each of the electrolytic capacitor substrate and the non-electrolytic capacitor substrate.

[0063] Furthermore, in the electric circuit 10, the electrolytic capacitor 41 is configured to smooth the voltage of the power conversion device 100 when the printed circuit board 111 is used as an electrolytic capacitor substrate. Furthermore, when the printed circuit board 111 is used as an electrolytic capacitor substrate, it is configured to suppress voltage fluctuations in the power conversion device 100. Therefore, there is no need to prepare separate printed circuit boards 111 on which the electric circuit 10 is formed for each of the electrolytic capacitor substrate and the non-electrolytic capacitor substrate. There is also no need to prepare separate components for each of the electrolytic capacitor substrate and the non-electrolytic capacitor substrate.

[0064] Furthermore, the power conversion device 100 is configured such that a rectifier circuit 3, an inverter circuit 5, and an inter-bus circuit 4 are mounted on a printed circuit board 111. As the inter-bus circuit 4, an electrolytic capacitor 41 or a small-capacity capacitor 42 having a smaller capacitance than the electrolytic capacitor 41 is mounted. In other words, by switching between mounting the electrolytic capacitor 41 and the small-capacity capacitor 42, two types of power conversion devices 100 can be provided using a single printed circuit board 111: a power conversion device using an electrolytic capacitor substrate and a power conversion device using a substrate without an electrolytic capacitor. Consequently, the manufacturing cost and inventory cost associated with the power conversion device 100 can be reduced.

[0065] Implementation method 2.

[0066] Figure 8 : is a schematic diagram showing an air conditioner 400 according to Embodiment 2. Figure 8 As shown in FIG. 4 , the air conditioner 400 includes a refrigeration cycle device 300 and a blower 401. Figure 7 The hollow arrows indicate the flow of the refrigerant. The blower 401 blows and circulates outdoor air. The refrigeration cycle device 300 includes a refrigerant compression device 200, a condenser 301, an expansion valve 302, and an evaporator 303. The refrigerant compression device 200 includes a compressor 201 and a power conversion device 100. The power conversion device 100 can be a power conversion device 100 having an electrolytic capacitor substrate or a power conversion device 100 without an electrolytic capacitor substrate. The compressor 201, condenser 301, expansion valve 302, and evaporator 303 are connected by piping, and the refrigerant circulates through the piping.

[0067] Compressor 201 includes electric motor 2. Electric motor 2 is driven by electric power input from power converter 100 to compress refrigerant gas in compressor 201 into high-pressure gas. Power converter 100 is variable-speed controlled by an operating command from a control device (not shown).

[0068] In the refrigeration cycle device 300, the refrigerant circulates within the piping of the refrigeration cycle device 300, driven by the compressor 201. The circulating refrigerant repeats the processes of evaporation, compression, condensation, and expansion. As a result, the refrigerant changes from liquid to gas and back again, exchanging heat with the outside air. Furthermore, the refrigeration cycle device 300 is combined with the blower 401 that circulates the outside air, thereby forming the air conditioner 400.

[0069] The power conversion device 100 has Figure 4 or Figure 5 The printed circuit board 111 shown is used as either an electrolytic capacitor substrate or an electroless capacitor substrate. The power conversion device 100 includes the printed circuit board 111, eliminating the need to manufacture or maintain separate electrolytic and electroless capacitor substrates, thereby reducing component costs. Consequently, an inexpensive air conditioner 400 can be provided.

[0070] In particular, in emerging countries, the demand for air conditioners 400 is increasing. Therefore, the use of the power conversion device 100 has the significance of being able to provide air conditioners 400 with variable speed controlled electric motors 2 at low cost.

[0071] According to the air conditioner 400 of the second embodiment described above, either an electrolytic capacitor substrate or an electroless capacitor substrate can be provided using the printed circuit board 111. Therefore, a single printed circuit board 111 can be used to provide an air conditioner 400 that reduces vibration noise, complies with higher harmonic standards, or is inexpensive, depending on the user's needs.

[0072] Description of Reference Numerals

[0073] 1…AC power supply; 2…motor; 3…rectifier circuit; 3a…first output terminal; 3b…second output terminal; 4…busbar circuit; 5…inverter circuit; 5a…first input terminal; 5b…second input terminal; 6…reactor; 10…electrical circuit; 11…positive busbar; 12…negative busbar; 41…electrolytic capacitor; 41a…first and second electrolytic capacitors; 41b…third electrolytic capacitor; 41c…third electrolytic capacitor; 41d…third electrolytic capacitor; 41e…third electrolytic capacitor; 41f…third electrolytic capacitor; 41g…third electrolytic capacitor; 42…small-capacitance capacitor; 42a…small-capacitance capacitor ; 42b…small-capacitance capacitor; 42c…small-capacitance capacitor; 43…diode; 44…resistor; 45…jumper; 100…power conversion device; 110…substrate; 111…printed circuit board; 120…hole; 120a…first hole; 120b…second hole; 200…refrigerant compression device; 201…compressor; 240…pattern; 240a…first pattern; 240b…second pattern; 240c…third pattern; 240d…fourth pattern; 240e…fifth pattern; 300…refrigeration cycle device; 301…condenser; 302…expansion valve; 303…evaporator; 400…air conditioner; 401…blower.

Claims

1. A printed circuit board, characterized in that: It is composed of: a substrate formed of an insulator; and The pattern is formed on the substrate and is mounted on a DC voltage unit connected to a rectifier and an inverter in a power conversion device. The pattern is installed with either a first setting or a second setting as the DC voltage unit, The first configuration includes a plurality of first electrolytic capacitors, The second configuration includes a second electrolytic capacitor and a small-capacitance capacitor having a smaller capacitance than the plurality of first electrolytic capacitors and a smaller capacitance than the second electrolytic capacitor.

2. The printed circuit board according to claim 1, wherein: The plurality of first electrolytic capacitors include: one first electrolytic capacitor, and a plurality of third electrolytic capacitors, The pattern includes: a first pattern on which the one first electrolytic capacitor or the second electrolytic capacitor is mounted; and The second pattern is mounted with either the plurality of third electrolytic capacitors or the small-capacitance capacitors.

3. The printed circuit board according to claim 2, wherein: Composition: The pattern includes a third pattern and a fourth pattern that are arranged in parallel with each other and in series with the first pattern, In the first setting, a short-circuit unit is connected to the third pattern, and only the fourth pattern is conductive. In the second setting, a diode is connected to the third pattern, and only the fourth pattern is conductive.

4. The printed circuit board according to claim 3, wherein: The third pattern and the fourth pattern are arranged around the first pattern.

5. The printed circuit board according to any one of claims 2 to 4, wherein: Composition: The pattern includes a fifth pattern configured to be arranged in parallel with the first pattern and having a plurality of resistors connected in parallel. The number of the plurality of resistors connected to the fifth pattern in the first setting is greater than the number of the plurality of resistors connected to the fifth pattern in the second setting.

6. The printed circuit board according to claim 5, wherein: The fifth pattern is arranged around the first pattern.

7. The printed circuit board according to any one of claims 2 to 6, wherein: The first electrolytic capacitor and the second electrolytic capacitor are the same electrolytic capacitor.

8. The printed circuit board according to any one of claims 2 to 7, wherein: The one first electrolytic capacitor and the second electrolytic capacitor are mounted at the same position on the pattern in the first setting and the second setting.

9. An electrical circuit, characterized in that It is composed of: The printed circuit board according to any one of claims 1 to 8; and The DC voltage unit is mounted on the printed circuit board. In the first setting, the plurality of first electrolytic capacitors are used to smooth the voltage of the power conversion device. In the second setting, the second electrolytic capacitor is used to suppress voltage fluctuations in the power conversion device.

10. A power conversion device, characterized in that: have: The printed circuit board according to any one of claims 1 to 8; and The DC voltage unit is mounted on the printed circuit board. The DC voltage unit is composed of the plurality of first electrolytic capacitors or the second electrolytic capacitor and the small-capacitance capacitor.

11. An air conditioner, characterized in that: have: The power conversion device comprising the printed circuit board according to any one of claims 1 to 8; and A compressor is provided with the power conversion device.

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