Device for reducing content of metal ions in electronic chemicals by using plasma technology

Abstract

The invention discloses a device for reducing the content of metal ions in electronic chemicals through a plasma technology, and relates to the technical field of metal ion removal. According to the device for reducing the content of the metal ions in the electronic chemicals through the plasma technology, through cooperation of the annular temperature control frame and the spiral temperature control frame, cooling treatment on a chemical solution can be completed firstly through the spiral temperature control frame, and the chemical solution flows along the top of the spiral temperature control frame till entering the machine body; according to the chemical solution temperature control device, the temperature control efficiency of a chemical solution can be improved, then temperature control treatment is achieved through cooperation of the annular temperature control frame, compared with a traditional operation mode, the temperature control effect of the chemical solution can be further improved, and the operation efficiency of the device is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of metal ion removal, in particular to a device for reducing the metal ion content in electronic chemicals using plasma technology. Background Art

[0002] Photoresists used in the semiconductor industry often require high metal ion content. The metal ion content of high-end electronic chemicals has a significant impact on the final product. Therefore, it is necessary to reduce the metal ion content of high-end electronic chemicals to produce qualified photoresists. Currently, the main method for removing the metal ion content in raw materials is purification, but this method often only removes free metal ions and cannot remove metal ions in metal complexes. Therefore, effectively removing metal ions from high-end electronic chemicals is a widely researched topic. Referring to the Chinese patent with the announcement number "CN217498763U" entitled "A device for reducing the metal ion content in electronic chemicals using plasma technology", the patent points out the current lack of corresponding equipment for discharging photoresists to remove metal ions. However, this equipment still has the problem of poor temperature control, which affects the metal ion removal efficiency. To address this problem, we propose a device for reducing the metal ion content in electronic chemicals using plasma technology to solve this problem. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the present invention provides a device for reducing the metal ion content in electronic chemicals using plasma technology, which solves the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a device for reducing the metal ion content in electronic chemicals using plasma technology, comprising a body, an upper cover fixedly mounted on the top of the body, and an annular temperature control rack fixedly mounted inside the body, the annular temperature control rack being used to control the temperature of a chemical solution delivered to the interior of the body;

[0005] A spiral temperature control rack is fixedly installed inside the upper cover, and a feed end pipe is fixedly installed on the top of the upper cover. The feed end pipe is used to transport the chemical solution to the top of the spiral temperature control rack, so that the chemical solution can flow along the spiral temperature control rack until it enters the interior of the body. The annular temperature control rack and the spiral temperature control rack are both hollow and connected by a connecting pipe. A negative pressure device is fixedly installed on the outside of the body, and a delivery pipe is connected between the negative pressure device and the annular temperature control rack and the spiral temperature control rack.

[0006] A plasma mechanism is fixedly installed inside the body, which is used to generate active substances that enter the chemical solution to ionize the metal complex in the chemical solution into metal ions;

[0007] A discharge end pipe is fixedly installed at the bottom of the machine body, and the discharge end pipe is used to discharge the chemical solution.

[0008] Preferably, a sealed positioning frame is fixedly installed inside the body, a conductive module is fixedly installed inside the sealed positioning frame, the plasma mechanism is fixedly connected to the end of the conductive module, and a plasma power module is fixedly installed at the end of the conductive module away from the plasma mechanism.

[0009] Preferably, a gas supply pipe is fixedly installed on the top of the plasma mechanism for providing gas medium to the interior of the plasma mechanism.

[0010] Preferably, a plurality of support frames are fixedly installed on the bottom of the body.

[0011] Preferably, the annular temperature control rack and the spiral temperature control rack are connected to each other through a connecting pipe, and the outer side of the annular temperature control rack is in contact with the inner wall of the machine body.

[0012] Preferably, a filter screen is fixedly mounted on the end of the spiral temperature control rack, one end of the filter screen is fixedly connected to the inner wall of the machine body, and the filter screen is used to filter impurities in the chemical solution.

[0013] Preferably, a rectangular notch is opened inside the body, the opening position of the rectangular notch is kept flush with the installation position of the filter plate, and a collection rack is fixedly installed on the outside of the rectangular notch for collecting filtered impurities.

[0014] Preferably, a mixing component is provided inside the body for stirring the chemical solution poured into the body.

[0015] Preferably, the mixing assembly includes a mixing shaft, which is rotatably mounted inside the machine body, and a plurality of mixing racks are fixedly mounted on the outer side of the mixing shaft for rotating inside the machine body along with the mixing shaft.

[0016] Preferably, a driving motor is fixedly mounted on the top of the machine body, and an output end of the driving motor is connected to the end of the mixing shaft via a coupling.

[0017] The present invention provides a device that uses plasma technology to reduce the metal ion content in electronic chemicals. Compared with existing technologies, it has the following advantages:

[0018] (1) The device for reducing the metal ion content in electronic chemicals by using plasma technology can first complete the cooling treatment of the chemical solution through the spiral temperature control rack through the cooperation of the annular temperature control rack and the spiral temperature control rack. As the chemical solution flows along the top of the spiral temperature control rack until it enters the interior of the machine body, the temperature control efficiency of the chemical solution can be improved. Then, the temperature control treatment is achieved through the cooperation of the annular temperature control rack. Compared with the traditional operation method, the temperature control effect of the chemical solution can be further improved, and the operation efficiency of the equipment is effectively improved.

[0019] (2) The device for reducing the metal ion content in electronic chemicals by using plasma technology can filter the chemical solution as it flows above the spiral temperature control rack through the filter plate. The device can also collect impurities through the rectangular slot and the collection rack, thereby further improving the maintenance convenience of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of the machine body of the present invention;

[0022] Figure 3 For the present invention Figure 2 A in the middle is an enlarged structural diagram;

[0023] Figure 4 For the present invention Figure 2 Side view structural diagram;

[0024] Figure 5 This is a schematic diagram of the cross-sectional structure of the upper cover of the present invention;

[0025] Figure 6 For the present invention Figure 5 The enlarged structural diagram at B in the middle;

[0026] Figure 7 For the present invention Figure 5 Side view structural diagram;

[0027] Figure 8 It is a schematic diagram of the plasma mechanism structure of the present invention.

[0028] In the figure: 1. Machine body; 2. Support frame; 3. Upper cover; 301. Rectangular notch; 302. Collecting frame; 4. Feed end pipe; 5. Discharge end pipe; 6. Negative pressure device; 601. Conveying pipeline; 7. Annular temperature control frame; 701. Connecting pipeline; 8. Spiral temperature control frame; 9. Filter plate; 10. Driving motor; 11. Mixing shaft; 1101. Mixing frame; 12. Plasma mechanism; 13. Plasma power module; 1301. Conductive module; 14. Sealed positioning frame; 15. Air supply pipeline. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figures 1-8 The present invention provides two technical solutions, specifically including the following embodiments:

[0031] Example 1:

[0032] In an embodiment of the present invention, a device for reducing the metal ion content in electronic chemicals using plasma technology includes a body 1, an upper cover 3 fixedly mounted on the top of the body 1, and an annular temperature control rack 7 fixedly mounted inside the body 1. The annular temperature control rack 7 is used to control the temperature of a chemical solution delivered to the interior of the body 1;

[0033] In the embodiment of the present invention, a spiral temperature control rack 8 is fixedly installed inside the upper cover 3, and a feed end pipe 4 is fixedly installed on the top of the upper cover 3. The feed end pipe 4 is used to transport the chemical solution to the top of the spiral temperature control rack 8, so that the chemical solution can flow along the spiral temperature control rack 8 until it enters the interior of the body 1. The annular temperature control rack 7 and the spiral temperature control rack 8 are both hollow and connected by a connecting pipe 701. A negative pressure device 6 is fixedly installed on the outside of the body 1, and a delivery pipe 601 is connected between the negative pressure device 6 and the annular temperature control rack 7 and the spiral temperature control rack 8.

[0034] In the embodiment of the present invention, specifically, the annular temperature control rack 7 is hollow. After the chemical solution is introduced into the interior of the body 1 through the feed end pipe 4, the negative pressure device 6 is operated to introduce the coolant into the annular temperature control rack 7 for circulation, thereby achieving temperature control treatment of the chemical solution. In addition, through the cooperation of the spiral temperature control rack 8, after the chemical solution is introduced into the interior of the body 1 through the feed end pipe 4, it can flow along the top of the spiral temperature control rack 8 until it separates from the spiral temperature control rack 8 and enters the interior of the body 1. As the chemical solution contacts the spiral temperature control rack 8, it can complete the preliminary cooling treatment, and then the annular temperature control rack 7 realizes the temperature control treatment. Compared with the traditional operation method, the temperature control effect of the chemical solution can be further improved, and the operation efficiency of the equipment is effectively improved.

[0035] In the embodiment of the present invention, specifically, a temperature monitoring module is provided inside the body 1 for detecting the temperature of the chemical solution; a cooling device is connected to the outside of the body 1 for cooling the circulating coolant; the cooling device is not shown in the figure;

[0036] In the embodiment of the present invention, specifically, a plasma mechanism 12 is fixedly installed inside the body 1, which is used to generate active substances that enter the chemical solution to ionize the metal complex in the chemical solution into metal ions;

[0037] In the embodiment of the present invention, specifically, a discharge end pipe 5 is fixedly installed at the bottom of the body 1, and the discharge end pipe 5 is used to discharge the chemical solution;

[0038] In the embodiment of the present invention, specifically, a sealed positioning frame 14 is fixedly installed inside the body 1, a conductive module 1301 is fixedly installed inside the sealed positioning frame 14, the plasma mechanism 12 is fixedly connected to an end of the conductive module 1301, and a plasma power module 13 is fixedly installed at an end of the conductive module 1301 away from the plasma mechanism 12;

[0039] In the embodiment of the present invention, specifically, the plasma mechanism 12 and the plasma power module 13 are both existing devices, which are used to discharge through the plasma mechanism 12, so that the active substances generated by the discharge enter the interior of the body 1 and contact the chemical solution, so that the metal complex in the chemical solution is ionized to produce metal ions. No further details are given here.

[0040] In the embodiment of the present invention, specifically, a gas supply pipe 15 is fixedly installed on the top of the plasma mechanism 12 for providing a gas medium to the interior of the plasma mechanism 12;

[0041] In the embodiment of the present invention, specifically, by cooperating with the annular temperature control rack 7 and the spiral temperature control rack 8, the spiral temperature control rack 8 can first complete the temperature reduction treatment of the chemical solution. As the chemical solution flows along the top of the spiral temperature control rack 8 until it enters the interior of the body 1, the temperature control efficiency of the chemical solution can be improved. Then, the temperature control treatment is achieved by cooperating with the annular temperature control rack 7. Compared with the traditional operation method, the temperature control effect of the chemical solution can be further improved, thereby effectively improving the operation efficiency of the equipment.

[0042] In the embodiment of the present invention, specifically, a mixing component is provided inside the body 1 for stirring the chemical solution poured into the body 1;

[0043] In the embodiment of the present invention, specifically, the mixing assembly includes a mixing shaft 11, which is rotatably mounted inside the machine body 1, and a plurality of mixing racks 1101 are fixedly mounted on the outside of the mixing shaft 11, for rotating inside the machine body 1 along with the mixing shaft 11;

[0044] In the embodiment of the present invention, specifically, a driving motor 10 is fixedly installed on the top of the machine body 1, and an output end of the driving motor 10 is connected to an end of the mixing shaft 11 through a coupling.

[0045] Example 2: Based on Example 1, a device for reducing the metal ion content in electronic chemicals using plasma technology includes a body 1, an upper cover 3 fixedly installed on the top of the body 1, and an annular temperature control rack 7 fixedly installed inside the body 1. The annular temperature control rack 7 is used to control the temperature of the chemical solution delivered to the interior of the body 1;

[0046] In the embodiment of the present invention, specifically, a spiral temperature control rack 8 is fixedly installed inside the upper cover 3, and a feed end pipe 4 is fixedly installed on the top of the upper cover 3. The feed end pipe 4 is used to transport the chemical solution to the top of the spiral temperature control rack 8, so that the chemical solution can flow along the spiral temperature control rack 8 until it enters the interior of the body 1. The annular temperature control rack 7 and the spiral temperature control rack 8 are both hollow and connected by a connecting pipe 701. A negative pressure device 6 is fixedly installed on the outside of the body 1, and a conveying pipe 601 is connected between the negative pressure device 6 and the annular temperature control rack 7 and the spiral temperature control rack 8.

[0047] In the embodiment of the present invention, specifically, the annular temperature control rack 7 is hollow. After the chemical solution is introduced into the interior of the body 1 through the feed end pipe 4, the negative pressure device 6 is operated to introduce the coolant into the annular temperature control rack 7 for circulation, thereby achieving temperature control treatment of the chemical solution. In addition, through the cooperation of the spiral temperature control rack 8, after the chemical solution is introduced into the interior of the body 1 through the feed end pipe 4, it can flow along the top of the spiral temperature control rack 8 until it separates from the spiral temperature control rack 8 and enters the interior of the body 1. As the chemical solution contacts the spiral temperature control rack 8, it can complete the preliminary cooling treatment, and then the annular temperature control rack 7 realizes the temperature control treatment. Compared with the traditional operation method, the temperature control effect of the chemical solution can be further improved, and the operation efficiency of the equipment is effectively improved.

[0048] In the embodiment of the present invention, specifically, a temperature monitoring module is provided inside the body 1 for detecting the temperature of the chemical solution; a cooling device is connected to the outside of the body 1 for cooling the circulating coolant; the cooling device is not shown in the figure;

[0049] In the embodiment of the present invention, specifically, a plasma mechanism 12 is fixedly installed inside the body 1, which is used to generate active substances that enter the chemical solution to ionize the metal complex in the chemical solution into metal ions;

[0050] In the embodiment of the present invention, specifically, a discharge end pipe 5 is fixedly installed at the bottom of the body 1, and the discharge end pipe 5 is used to discharge the chemical solution;

[0051] In the embodiment of the present invention, specifically, a sealed positioning frame 14 is fixedly installed inside the body 1, a conductive module 1301 is fixedly installed inside the sealed positioning frame 14, the plasma mechanism 12 is fixedly connected to an end of the conductive module 1301, and a plasma power module 13 is fixedly installed at an end of the conductive module 1301 away from the plasma mechanism 12;

[0052] In the embodiment of the present invention, specifically, the plasma mechanism 12 and the plasma power module 13 are both existing devices, which are used to discharge through the plasma mechanism 12, so that the active substances generated by the discharge enter the interior of the body 1 and contact the chemical solution, so that the metal complex in the chemical solution is ionized to produce metal ions. No further details are given here.

[0053] In the embodiment of the present invention, specifically, a gas supply pipe 15 is fixedly installed on the top of the plasma mechanism 12 for providing a gas medium to the interior of the plasma mechanism 12;

[0054] In the embodiment of the present invention, specifically, a plurality of support frames 2 are fixedly mounted on the bottom of the body 1;

[0055] In the embodiment of the present invention, specifically, the annular temperature control frame 7 and the spiral temperature control frame 8 are connected to each other through a connecting pipe 701, and the outer side of the annular temperature control frame 7 is in contact with the inner wall of the body 1;

[0056] In the embodiment of the present invention, specifically, by cooperating with the annular temperature control rack 7 and the spiral temperature control rack 8, the spiral temperature control rack 8 can first complete the temperature reduction treatment of the chemical solution. As the chemical solution flows along the top of the spiral temperature control rack 8 until it enters the interior of the body 1, the temperature control efficiency of the chemical solution can be improved. Then, the temperature control treatment is achieved by cooperating with the annular temperature control rack 7. Compared with the traditional operation method, the temperature control effect of the chemical solution can be further improved, thereby effectively improving the operation efficiency of the equipment.

[0057] In the embodiment of the present invention, specifically, a filter screen plate 9 is fixedly installed at the end of the spiral temperature control frame 8, one end of the filter screen plate 9 is fixedly connected to the inner wall of the body 1, and the filter screen plate 9 is used to filter impurities in the chemical solution;

[0058] In the embodiment of the present invention, specifically, a rectangular notch 301 is opened inside the body 1, and the opening position of the rectangular notch 301 is kept flush with the installation position of the filter plate 9. A collection rack 302 is fixedly installed on the outside of the rectangular notch 301 for collecting filtered impurities;

[0059] In the embodiment of the present invention, specifically, by providing the filter screen plate 9, as the chemical solution flows above the spiral temperature control rack 8, when the chemical solution passes through the filter screen plate 9, the filter screen plate 9 can complete the filtration treatment of the chemical solution, and the rectangular notch 301 cooperates with the collection rack 302 to complete the collection operation of impurities, further improving the maintenance convenience of the equipment;

[0060] In the embodiment of the present invention, specifically, a mixing component is provided inside the body 1 for stirring the chemical solution poured into the body 1;

[0061] In the embodiment of the present invention, specifically, the mixing assembly includes a mixing shaft 11, which is rotatably mounted inside the machine body 1, and a plurality of mixing racks 1101 are fixedly mounted on the outside of the mixing shaft 11, for rotating inside the machine body 1 along with the mixing shaft 11;

[0062] In the embodiment of the present invention, specifically, a driving motor 10 is fixedly mounted on the top of the machine body 1, and the output end of the driving motor 10 is connected to the end of the mixing shaft 11 via a coupling;

[0063] In the embodiment of the present invention, specifically, after the chemical solution enters the interior of the machine body 1 , the operation of the driving motor 10 can drive the mixing shaft 11 and the mixing frame 1101 to rotate, thereby achieving mixing of the chemical solution.

[0064] At the same time, the contents not described in detail in this specification belong to the existing technology well known to those skilled in the art.

[0065] The above is a detailed description of an embodiment of the present invention. However, the content is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the present invention.

Claims

1. A device for reducing the metal ion content in electronic chemicals using plasma technology, comprising a body (1), an upper cover (3) fixedly mounted on the top of the body (1), and characterized in that: An annular temperature control rack (7) is fixedly installed inside the machine body (1), and the annular temperature control rack (7) is used to perform temperature control on the chemical solution transported to the inside of the machine body (1); A spiral temperature control rack (8) is fixedly installed inside the upper cover (3), and a feed end pipe (4) is fixedly installed on the top of the upper cover (3). The feed end pipe (4) is used to transport the chemical solution to the top of the spiral temperature control rack (8), so that the chemical solution can flow along the spiral temperature control rack (8) until it enters the inside of the body (1). The annular temperature control rack (7) and the spiral temperature control rack (8) are both hollow and a connecting pipe (701) is connected between the two. A negative pressure device (6) is fixedly installed on the outside of the body (1), and a conveying pipe (601) is connected between the negative pressure device (6) and the annular temperature control rack (7) and the spiral temperature control rack (8). A plasma mechanism (12) is fixedly installed inside the body (1) for generating active substances that enter the chemical solution to ionize the metal complex in the chemical solution into metal ions; A discharge end pipe (5) is fixedly mounted on the bottom of the machine body (1), and the discharge end pipe (5) is used to discharge the chemical solution.

2. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 1, characterized in that: A sealed positioning frame (14) is fixedly installed inside the machine body (1), a conductive module (1301) is fixedly installed inside the sealed positioning frame (14), the plasma mechanism (12) is fixedly connected to the end of the conductive module (1301), and a plasma power module (13) is fixedly installed at one end of the conductive module (1301) away from the plasma mechanism (12).

3. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 2, characterized in that: A gas supply pipe (15) is fixedly installed on the top of the plasma mechanism (12) for supplying gaseous medium to the interior of the plasma mechanism (12).

4. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 1, characterized in that: A plurality of support frames (2) are fixedly mounted on the bottom of the machine body (1).

5. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 1, characterized in that: The annular temperature control frame (7) and the spiral temperature control frame (8) are connected to each other through a connecting pipe (701), and the outer side of the annular temperature control frame (7) is in contact with the inner wall of the machine body (1).

6. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 1, characterized in that: A filter screen plate (9) is fixedly mounted on the end of the spiral temperature control rack (8), one end of the filter screen plate (9) is fixedly connected to the inner wall of the machine body (1), and the filter screen plate (9) is used to filter impurities in the chemical solution.

7. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 6, characterized in that: A rectangular notch (301) is provided inside the machine body (1), the opening position of the rectangular notch (301) is kept flush with the installation position of the filter screen plate (9), and a collection rack (302) is fixedly installed outside the rectangular notch (301) for collecting filtered impurities.

8. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 1, characterized in that: A mixing component is provided inside the machine body (1) for stirring the chemical solution poured into the machine body (1).

9. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 8, characterized in that: The mixing assembly comprises a mixing shaft (11), the mixing shaft (11) being rotatably mounted inside the machine body (1), and a plurality of mixing racks (1101) being fixedly mounted on the outer side of the mixing shaft (11) for rotating inside the machine body (1) along with the mixing shaft (11).

10. The device for reducing the metal ion content in electronic chemicals using plasma technology according to claim 9, characterized in that: A driving motor (10) is fixedly mounted on the top of the machine body (1), and an output end of the driving motor (10) is connected to an end of a mixing shaft (11) via a coupling.

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