Nasal plastic postoperative intelligent pressure regulating and ice compressing integrated device based on semiconductor temperature control

Abstract

The invention discloses an intelligent pressure regulation and ice compress integrated device used after nasal plastic surgery and based on semiconductor temperature control, and relates to the technical field of ice compress used after nasal plastic surgery. The device comprises a cold compress main body layer, an elastic attaching layer and an elastic memory metal support, the elastic attaching layer is arranged on the outer side of the cold compress main body layer, and the elastic memory metal support is arranged on the outer side of the elastic attaching layer; the edge of the elastic metal support is provided with a magnetic type hasp assembly. A miniature lithium battery pack, a wireless communication module and a heat dissipation assembly are fixedly connected to the elastic memory metal support, and by combining shape memory alloy, the semiconductor refrigeration technology, an intelligent regulation and control system and a miniature air bag array structure, the device with the intelligent pressure regulation and ice compress functions is provided. According to the nasal splint, the shape of the splint can be dynamically adjusted according to the nasal swelling fading degree, meanwhile, the cold compress temperature is accurately controlled, integration and intellectualization of postoperative nursing are achieved, and the problems that an existing nasal splint cannot be dynamically adjusted along with swelling fading and postoperative cold compress operation is inconvenient are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of ice compress technology after rhinoplasty surgery, and specifically to an integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery based on semiconductor temperature control. Background Art

[0002] Rhinoplasty is a surgical procedure to reshape the nose. It can reduce or increase the size of the nose, change the shape of the nose tip or nose bridge, correct congenital defects or injuries of the nose, and even help alleviate some breathing problems through rhinoplasty (using various domestic and foreign brands of tissue substitutes or autologous materials) and comprehensive correction of round nose tip, wide nose, crooked nose, upturned nose, hump nose, etc. Postoperative local pain, swelling and other discomfort are the most common clinical complications, and seriously affect the patient's rest, eating, and mood, consume the patient's physical strength, are not conducive to recovery, and affect postoperative wound healing. In order to relieve the patient's pain and make the injured area recover as soon as possible, ice packs are generally used for ice compresses.

[0003] Chinese utility model patent publication number CN218010132U discloses a post-plastic surgery nose ice compress bag, comprising an ice compress bag with a temperature-sensitive patch on the surface, fixed side panels on both sides of the ice compress bag, rope rings on both sides, a main elastic band sleeved and connected to the rope ring at one end, the main elastic band having a convex buckle, and a secondary elastic band sleeved and connected to the rope ring at the other end, the secondary elastic band having a concave buckle.

[0004] However, ice packs rely on gel or water evaporation to cool down, the cold release time is short and the temperature cannot be adjusted. Some medical cold compress masks can cover the entire face, but cannot accurately adapt to the contour of the nose, resulting in uneven cold compress effect. When using traditional nasal splints, since traditional nasal splints are made of thermoplastic material, they need to be softened with hot water before being shaped, and cannot be dynamically adjusted as the swelling subsides. After the operation, a gap will appear between the splint and the nose, and it needs to be repeatedly removed and reshaped, increasing the risk of prosthesis deviation. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present invention provides an integrated intelligent pressure regulation and ice compress device based on semiconductor temperature control after rhinoplasty surgery, which solves the problems that the existing nasal splint cannot be dynamically adjusted as the swelling subsides and the postoperative cold compress operation is inconvenient.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an integrated intelligent pressure regulation and ice compress device for rhinoplasty surgery based on semiconductor temperature control, comprising a cold compress main layer, an elastic bonding layer and an elastic memory metal bracket, the elastic bonding layer is arranged on the outside of the cold compress main layer, and the elastic memory metal bracket is arranged on the outside of the elastic bonding layer; a magnetic buckle assembly is provided on the edge of the elastic metal bracket; a micro lithium battery pack, a wireless communication module and a heat dissipation assembly are fixedly connected to the elastic memory metal bracket.

[0007] Furthermore, the cold compress main layer includes a semiconductor refrigeration sheet array layer, a breathable waterproof membrane and a phase change energy storage material PCM layer. The semiconductor refrigeration sheet array layer is arranged between the breathable waterproof membrane and the phase change energy storage material PCM layer, and the phase change energy storage material PCM layer is in contact with the skin of the nose; the breathable waterproof membrane is connected to the elastic bonding layer, and the semiconductor refrigeration sheet array layer is electrically connected to the micro lithium battery pack.

[0008] Furthermore, the cold compress main layer also includes a temperature sensor, which is embedded in the phase change energy storage material PCM layer and is in contact with the skin of the nose. It is powered by a micro lithium battery pack, and the temperature data detected by the temperature sensor is transmitted to a remote terminal through a wireless communication module.

[0009] Furthermore, the semiconductor refrigeration sheet array layer includes a nose bridge refrigeration array area, a nose wing refrigeration array area and a nose tip refrigeration array area, and a first silicone layer is also provided between the semiconductor refrigeration sheet array layer and the phase change energy storage material PCM layer.

[0010] Furthermore, the elastic bonding layer includes a micro airbag array layer and a second silicone layer, the second silicone layer is arranged on the surface of the micro airbag array layer, and the micro airbag array layer is connected to the surface of the cold compress main layer; the micro airbag array layer includes a nose bridge airbag array area, a nose wing airbag array area and a nose tip airbag array area, and an airway connected to the outside is arranged inside the second silicone layer, and the airway is connected to the micro airbags in the nose bridge airbag array area, the nose wing airbag array area and the nose tip airbag array area.

[0011] Furthermore, the micro airbags in the nose bridge airbag array area are distributed longitudinally, the micro airbags in the nose wing airbag array area are distributed in a fan shape, and the micro airbags in the nose tip airbag array area are distributed in a ring shape.

[0012] Furthermore, the micro airbag includes a spherical bag, a thin film pressure sensor, a micro electromagnetic pump and a supporting substrate. The surface of the thin film pressure sensor is connected to the surface of the cold compress main layer. The micro electromagnetic pump is arranged on the side surface of the spherical bag opposite to the thin film pressure sensor and is connected to the airway. The thin film pressure sensor is electrically connected to the micro lithium battery pack. The supporting substrate is spherical and is arranged inside the spherical bag.

[0013] Furthermore, the elastic memory metal bracket is a hollow structure, the surface of the elastic memory metal bracket is wrapped with a flexible silicone layer, and the inner side of the flexible silicone layer is connected to the surface of the elastic bonding layer.

[0014] Furthermore, the heat dissipation component includes a heat sink and a micro heat dissipation fan, the heat sink is fixedly connected to the flexible silica gel layer, and the heat sink is connected to the micro heat dissipation fan through flexible glue.

[0015] Furthermore, the magnetic buckle assembly includes two flexible connectors, which are respectively fixedly connected to the two sides of the elastic memory metal bracket. Magnet blocks are fixedly connected to the flexible connectors, and the polarities of two adjacent magnet blocks are arranged in opposite directions.

[0016] The present invention has the following beneficial effects:

[0017] This integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery based on semiconductor temperature control combines shape memory alloy (SMA), semiconductor refrigeration technology, an intelligent control system, and a micro-airbag array structure to provide a device with both intelligent pressure regulation and ice compress functions. It can dynamically adjust the splint shape according to the degree of nasal swelling reduction, and accurately control the cold compress temperature, realizing integrated and intelligent postoperative care, and solving the problems of existing nasal splints that cannot be dynamically adjusted as the swelling subsides and the inconvenience of postoperative cold compress operation.

[0018] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention.

[0020] Figure 2 This is a cross-sectional view of the micro airbag at a first angle of the present invention.

[0021] Figure 3 This is a cross-sectional view of the micro airbag from a second angle of the present invention.

[0022] Figure 4 This is a cross-sectional view of the cold compress main body layer of the present invention.

[0023] Figure 5 For the present invention Figure 4 A magnified view of the structure at center A.

[0024] Figure 6 Schematic diagram of the micro airbag structure of the present invention.

[0025] Figure 7 It is a structural schematic diagram of the heat sink of the present invention.

[0026] In the figure, 1. Cold compress main body layer; 101. Semiconductor refrigeration chip array layer; 102. Breathable and waterproof membrane; 103. Phase change energy storage material PCM layer; 104. Temperature sensor; 2. Elastic bonding layer; 201. Micro airbag array layer; 202. Second silicone layer; 3. Elastic memory metal bracket; 4. Magnet block; 5. Micro lithium battery pack; 6. First silicone layer; 7. Airway; 8. Micro airbag; 801. Spherical capsule; 802. Thin film pressure sensor; 803. Micro electromagnetic pump; 804. Support base; 9. Flexible silicone layer; 10. Heat sink; 11. Micro cooling fan; 12. Flexible connector. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] See also Figure 1-Figure 7 The embodiment of the present invention provides a technical solution: an integrated intelligent pressure regulation and ice compress device for rhinoplasty surgery based on semiconductor temperature control, comprising a cold compress main layer 1, an elastic bonding layer 2 and an elastic memory metal bracket 3, wherein the elastic bonding layer 2 is arranged on the outside of the cold compress main layer 1, and the elastic memory metal bracket 3 is arranged on the outside of the elastic bonding layer 2; a magnetic buckle component is provided on the edge of the elastic memory metal bracket 3; a micro lithium battery pack 5, a wireless communication module and a heat dissipation component are fixedly connected to the elastic memory metal bracket 3.

[0030] Specifically, the cold compress main layer 1 includes a semiconductor refrigeration sheet array layer 101, a breathable and waterproof membrane 102 and a phase change energy storage material PCM layer 103. The semiconductor refrigeration sheet array layer 101 is arranged between the breathable and waterproof membrane 102 and the phase change energy storage material PCM layer 103, and the phase change energy storage material PCM layer 103 is in contact with the skin of the nose; the breathable and waterproof membrane 102 is connected to the elastic bonding layer 2, and the semiconductor refrigeration sheet array layer 101 is electrically connected to the micro lithium battery pack 5.

[0031] The TEC (Technical Processor) is an electronic component that uses the Peltier effect to achieve cooling, controlling cooling or heating by the direction of the current. The PCM (Phase Change Material) absorbs and releases heat during phase changes, buffering temperature fluctuations and ensuring a stable cooling compress temperature. The breathable and waterproof membrane 102 prevents moisture penetration while maintaining breathability to prevent skin irritation.

[0032] The cold compress main layer 1 also includes a temperature sensor 104, which is embedded in the phase change energy storage material PCM layer 103, and the temperature sensor 104 is in contact with the nose skin and is powered by a micro lithium battery pack 5. The temperature data detected by the temperature sensor 104 is transmitted to a remote terminal through a wireless communication module.

[0033] Specifically, the semiconductor refrigeration chip array layer 101 includes a nose bridge cooling array area, a nose wing cooling array area, and a nose tip cooling array area. A first silicone layer 6 is also provided between the semiconductor refrigeration chip array layer 101 and the phase change energy storage material PCM layer 103. The semiconductor refrigeration chip TEC array is used to accurately control the temperature of the nose. The semiconductor refrigeration chip array layer 101 is divided into zones according to the temperature requirements of different areas of the nose. For example, the power density of the nose tip area is 1.5W / cm 2 , 0.8W / cm2 for the nasal dorsum 2 The cold end of the semiconductor refrigeration chip TEC is close to the skin, absorbing heat to achieve cooling, and the hot end discharges heat through the heat dissipation component to avoid reverse heat transfer. The control method is PWM signal, which adjusts the input voltage / current to control the cooling power.

[0034] The main cold compress layer 1 is designed to follow the curve of the nose, covering key areas such as the bridge, wings, and tip of the nose. It also provides a breathing passage for the nostrils to ensure normal breathing while wearing the device. A flexible circuit is embedded in the first silicone layer 6 or PCM layer 103, ensuring a comfortable fit and fit around the nose.

[0035] Temperature sensor 104, such as an NTC thermistor, monitors nasal skin temperature in real time based on a set sampling frequency, such as 10Hz, to ensure accurate temperature control. Furthermore, a data processing module with a built-in PID algorithm control unit can be provided on the elastic memory metal bracket 3. The data processing module receives the temperature detected by temperature sensor 104 and uses a preset comparison algorithm to determine whether the temperature in each zone meets the specified temperature. If not, the power of the semiconductor cooling element is dynamically adjusted through proportional P, integral I, and differential D to avoid temperature fluctuations and ensure a temperature control accuracy of ±0.5°C. The proportional term P adjusts the output proportionally based on the deviation between the current temperature and the set value; the integral term I eliminates steady-state errors, such as long-term deviations caused by ambient temperature changes; and the differential term D predicts temperature trends and suppresses overshoot or oscillation.

[0036] For example, the user sets a target temperature, such as 10°C, and applies a cold compress to the main body layer 1. Temperature sensor 104 collects skin temperature at a frequency of 50Hz. The PID algorithm control unit compares the set value with the measured value, calculates the required cooling power, and outputs a PWM signal to adjust the TEC current. The TEC cools down at the cold end, transferring heat to the hot end, where the heat dissipation component dissipates the accumulated heat. If the skin temperature approaches the set value, the PID reduces the cooling power to prevent overcooling. If the ambient temperature rises, the PID automatically increases the cooling power. Emergency shutdown occurs when the temperature exceeds the safe range, such as <0°C or >40°C. A low-battery alarm is triggered when the battery charge drops below 20%.

[0037] The data processing module connects to a mobile app via wireless communication modules, such as Bluetooth 5.2, allowing patients to remotely adjust the temperature and set the cold compress duration, making operation more convenient. The micro lithium battery pack 5 is powered by wireless charging and has a battery life of ≥4 hours, ensuring the device's long-term use during postoperative care.

[0038] The micro lithium battery pack 5 matches the TEC operating voltage and has an overcharge / overdischarge protection circuit.

[0039] The cold compress main layer 1 achieves precise control of the nose temperature through the coordinated work of semiconductor refrigeration sheets and phase change materials, avoiding the problems of large temperature fluctuations and uneven cold compress effects of traditional ice compress devices.

[0040] Specifically, the elastic bonding layer 2 includes a micro airbag array layer 201 and a second silicone layer 202. The second silicone layer 202 is arranged on the surface of the micro airbag array layer 201, and the micro airbag array layer 201 is connected to the surface of the cold compress main layer 1; the micro airbag array layer 201 includes a nose bridge airbag array area, a nose wing airbag array area and a nose tip airbag array area, and the second silicone layer 202 is internally provided with an airway 7 connected to the outside world, and the airway 7 is connected to the micro airbags 8 in the nose bridge airbag array area, the nose wing airbag array area and the nose tip airbag array area.

[0041] Specifically, the micro airbags 8 in the nose bridge airbag array area are distributed longitudinally, the micro airbags 8 in the nose wing airbag array area are distributed in a fan shape, and the micro airbags 8 in the nose tip airbag array area are distributed in a ring shape.

[0042] Specifically, the micro airbag 8 includes a spherical bag 801, a thin film pressure sensor 802, a micro electromagnetic pump 803, and a support base 804. The surface of the thin film pressure sensor 802 is connected to the surface of the cold compress main layer 1. The micro electromagnetic pump 803 is arranged on the side of the spherical bag 801 opposite the thin film pressure sensor 802 and is connected to the airway 7. The thin film pressure sensor 802 is electrically connected to the micro lithium battery pack 5. The support base 804 is spherical and is arranged inside the spherical bag 801. The micro electromagnetic pump 803 integrates a micro air pump, a micro air pump, and a micro electromagnetic valve to support positive pressure inflation and negative pressure adsorption.

[0043] In this embodiment, thin-film pressure sensor 802 utilizes a MEMS piezoresistive sensor, a miniature pressure sensor, for real-time monitoring of nasal pressure. Thin-film pressure sensor 802 is connected via a flexible circuit. The airbag array is inflated at low pressure to initially conform to the nasal contour. The pressure distribution map identifies areas of poor contact, such as concave areas on the bridge of the nose. Each airbag is independently inflated and deflated by controlling a micro-electromagnetic pump 803. When one airbag becomes over-pressurized, adjacent airbags are simultaneously depressurized to distribute the pressure. In the event of localized nasal edema, a "pulse mode" is activated to promote lymphatic drainage.

[0044] Specifically, the elastic memory metal bracket 3 is a hollow structure, the surface of the elastic memory metal bracket 3 is wrapped with a flexible silicone layer 9 , and the inner side of the flexible silicone layer 9 is connected to the surface of the elastic bonding layer 2 .

[0045] In this embodiment, the elastic memory metal bracket 3 is a metal material that can restore a preset shape at a specific temperature. The present invention uses NiTiCu alloy, and may also use nickel-titanium alloy. Nickel-titanium alloy has good elasticity and biocompatibility, is bendable at room temperature, and restores a preset shape at body temperature. It can evenly distribute pressure to avoid oppression on the nose after surgery.

[0046] The elastic memory metal stent 3 is a three-dimensional bionic stent that conforms to the anatomical curve of the nose, with a preset curvature that matches the expected shape after rhinoplasty. The hollow grid design can reduce weight, increase breathability, and disperse pressure to avoid excessive local pressure. The elastic memory metal stent 3 is soft and easy to shape at room temperature, making it easy to fit different nose shapes during surgery. It is similar to the aluminum-plastic plates commonly used in rhinoplasty. After wearing, the memory alloy phase change is triggered, and the elastic memory metal stent 3 initially maintains its current state, lightly pressing the nose to achieve uniform fixation. In the early stage of postoperative nasal swelling, the elasticity of the stent allows moderate expansion; as the swelling subsides, the stent rebounds to maintain a fit, dispersing the pressure through the grid structure, avoiding the "excessive compression pressure" problem of traditional nasal splints.

[0047] Specifically, the heat dissipation assembly includes a heat sink 10 and a micro heat dissipation fan 11 . The heat sink 10 is fixedly connected to the flexible silicone layer 9 , and the heat sink 10 is connected to the micro heat dissipation fan 11 via flexible glue.

[0048] In this embodiment, the heat sink 10 is an aluminum heat sink, which is suitable for low-power scenarios.

[0049] Specifically, the magnetic buckle assembly includes two flexible connectors 12, which are respectively fixedly connected to the two sides of the elastic memory metal bracket 3. The flexible connectors 12 are fixedly connected to magnet blocks 4, and the polarities of the two adjacent magnet blocks 4 are arranged in opposite directions.

[0050] Flexible connector 12 is embedded in the end of the elastic memory metal bracket 3. Magnets 4 are arranged in an alternating N / S pattern to enhance adhesion. Bringing the two ends of flexible connector 12 together automatically aligns the magnetic buckles, achieving "one-click fixation." By varying the buckle spacing or magnet density, multiple levels of tightness can be selected, such as a low setting during swelling and a tighter setting during recovery. During swelling, the bracket elastically expands, and the magnetic buckle is in a low position to prevent compression. During deswelling, the bracket gradually rebounds, and the magnetic buckle is adjusted to a high position to maintain shaping pressure.

[0051] Patients can remove and put it on with one hand, eliminating the pressure and inconvenience of traditional strapping. The elastic memory metal bracket 3 and magnetic buckle ensure a tight fit between the nose and the prosthesis, eliminating the risk of prosthesis deflection caused by uneven pressure in traditional nose splints. If the magnetic force unexpectedly fails, the elastic memory metal bracket 3 can still be temporarily fixed with a physical buckle.

[0052] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0053] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor temperature control-based integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery, characterized in that: The cold compress comprises a main cold compress layer (1), an elastic bonding layer (2) and an elastic memory metal bracket (3), wherein the elastic bonding layer (2) is arranged on the outside of the main cold compress layer (1), and the elastic memory metal bracket (3) is arranged on the outside of the elastic bonding layer (2); The edge of the elastic memory metal bracket (3) is provided with a magnetic buckle assembly; The elastic memory metal bracket (3) is fixedly connected to a micro lithium battery pack (5), a wireless communication module and a heat dissipation component.

2. The semiconductor temperature control-based integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery according to claim 1, characterized in that: The cold compress main body layer (1) comprises a semiconductor refrigeration sheet array layer (101), a breathable and waterproof membrane (102), and a phase change energy storage material PCM layer (103); the semiconductor refrigeration sheet array layer (101) is arranged between the breathable and waterproof membrane (102) and the phase change energy storage material PCM layer (103); and the phase change energy storage material PCM layer (103) is in contact with the nose skin; The breathable and waterproof membrane (102) is connected to the elastic bonding layer (2), and the semiconductor refrigeration sheet array layer (101) is electrically connected to the micro lithium battery pack (5).

3. The semiconductor temperature control-based integrated intelligent pressure regulation and ice compress device for rhinoplasty surgery according to claim 2, characterized in that: The cold compress main layer (1) further includes a temperature sensor (104), which is embedded in the phase change energy storage material PCM layer (103), and the temperature sensor (104) is in contact with the nose skin and is powered by a micro lithium battery pack (5). The temperature data detected by the temperature sensor (104) is transmitted to a remote terminal via a wireless communication module.

4. The semiconductor temperature control-based integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery according to claim 2, characterized in that: The semiconductor refrigeration chip array layer (101) comprises a nose bridge refrigeration array region, a nose wing refrigeration array region, and a nose tip refrigeration array region, and a first silica gel layer (6) is further provided between the semiconductor refrigeration chip array layer (101) and the phase change energy storage material PCM layer (103).

5. The integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery based on semiconductor temperature control according to claim 1, characterized in that: The elastic bonding layer (2) comprises a micro airbag array layer (201) and a second silicone layer (202), wherein the second silicone layer (202) is arranged on the surface of the micro airbag array layer (201), and the micro airbag array layer (201) is connected to the surface of the cold compress main layer (1); The micro airbag array layer (201) includes a nose bridge airbag array region, a nose wing airbag array region, and a nose tip airbag array region. An airway (7) communicating with the outside is provided inside the second silicone layer (202). The airway (7) is connected to the micro airbags (8) in the nose bridge airbag array region, the nose wing airbag array region, and the nose tip airbag array region.

6. The semiconductor temperature control-based intelligent pressure regulation and ice compress integrated device for rhinoplasty surgery according to claim 5, characterized in that: The micro airbags (8) in the nose bridge airbag array area are distributed longitudinally, the micro airbags (8) in the nose wing airbag array area are distributed in a fan shape, and the micro airbags (8) in the nose tip airbag array area are distributed in an annular shape.

7. The semiconductor temperature control-based integrated intelligent pressure regulation and ice compress device for rhinoplasty after surgery according to claim 6, characterized in that: The micro airbag (8) comprises a spherical bag (801), a thin film pressure sensor (802), a micro electromagnetic pump (803) and a supporting base (804); the surface of the thin film pressure sensor (802) is connected to the surface of the cold compress main layer (1); the micro electromagnetic pump (803) is arranged on the side surface of the spherical bag (801) opposite to the thin film pressure sensor (802) and is connected to the airway (7); the thin film pressure sensor (802) is electrically connected to the micro lithium battery pack (5); and the supporting base (804) is spherical and arranged inside the spherical bag (801).

8. The semiconductor temperature control-based integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery according to claim 1, characterized in that: The elastic memory metal bracket (3) is a hollow structure, the surface of the elastic memory metal bracket (3) is wrapped with a flexible silicone layer (9), and the inner side of the flexible silicone layer (9) is connected to the surface of the elastic bonding layer (2).

9. The semiconductor temperature control-based intelligent pressure regulation and ice compress integrated device for rhinoplasty surgery according to claim 8, characterized in that: The heat dissipation component comprises a heat sink (10) and a micro heat dissipation fan (11); the heat sink (10) is fixedly connected to the flexible silica gel layer (9); and the heat sink (10) is connected to the micro heat dissipation fan (11) via flexible glue.

10. The semiconductor temperature control-based integrated device for intelligent pressure regulation and ice compress after rhinoplasty surgery according to claim 1, characterized in that: The magnetic buckle assembly comprises two flexible connectors (12), the two flexible connectors (12) being fixedly connected to two sides of an elastic memory metal bracket (3), respectively; magnet blocks (4) are fixedly connected to the flexible connectors (12), and the polarities of two adjacent magnet blocks (4) are arranged in opposite directions.

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