Liquid cooling optical module

Abstract

The invention provides a liquid cooling optical module, and relates to the technical field of optical communication, the liquid cooling optical module comprises a shell, a circuit board, a metal sealing cover, a silicon optical assembly, a coupling jumper wire and a digital signal processing chip, the metal sealing cover and the circuit board are welded through soldering tin, and a sealing cavity is formed by the metal sealing cover and the circuit board; the silicon optical assembly is arranged on the circuit board and located in the sealing cavity. The silicon optical assembly comprises a laser light source chip, a collimating lens, a concave-convex lens, an isolator, a focusing lens and a silicon optical integrated chip which are sequentially arranged. The coupling jumper wire comprises a main connecting wire and a sub connecting wire, and a connector of the sub connecting wire and at least part of the sub connecting wire are located in the sealing cavity; a metal welding block is arranged on the part, penetrating through the metal sealing cover, of the sub-connecting line; and the metal welding block is welded with the metal sealing cover and the circuit board through tin soldering. According to the liquid cooling optical module provided by the invention, the sealing performance of the sealing cavity is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to a liquid-cooled optical module. Background Art

[0002] With the rapid development of optical communications, optical communication technology has been widely used in various fields due to its high communication capacity and low loss. As a key component in optical communication technology, optical modules influence the speed and quality of data transmission. However, as the transmission rate of optical modules increases, the high power consumption of optical modules generates a large amount of heat during operation. If this heat cannot be effectively and promptly dissipated, it will directly affect the stability of the optical module's internal environment, resulting in a decrease in the quality of the transmitted light signal and a shortened optical module lifespan. Therefore, coolant is required to dissipate heat from optical transmission modules.

[0003] Currently, the optical components in common liquid-cooled optical modules are mostly sealed with glue. When immersed in coolant for a long time, the sealing parts are prone to aging or corrosion and fail, causing the coolant to seep into the photoelectric conversion elements, affecting the normal operation of the liquid-cooled optical module.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0005] The present disclosure aims to provide a liquid-cooled optical module, which improves the sealing performance of the sealed cavity of the liquid-cooled optical module.

[0006] According to one aspect of the present disclosure, a liquid-cooled optical module is provided, comprising:

[0007] a housing having a receiving space and a first opening and a second opening communicating with the receiving space;

[0008] a circuit board, the circuit board being located in the accommodation space, and a connection end of the circuit board being exposed from the first opening;

[0009] a metal sealing cover, wherein the metal sealing cover is soldered to the circuit board and forms a sealed cavity with the circuit board;

[0010] A silicon photonics component, the silicon photonics component being disposed on the circuit board and located within the sealed cavity, the silicon photonics component comprising a laser light source chip, a collimating lens, a concave-convex lens, an isolator, a focusing lens, and a silicon photonics integrated chip arranged in sequence, wherein the concave-convex lens has a convex surface facing the collimating lens and a concave surface facing the isolator;

[0011] A coupling jumper, the coupling jumper comprising a main connection line and a sub-connection line, one end of the main connection line extending from the second opening into the accommodation space, the other end of the main connection line being connected to one end of the sub-connection line, the other end of the sub-connection line being provided with a connector, and the connector and at least a portion of the sub-connection line being located within the sealed cavity; a metal welding block being provided at a portion of the sub-connection line passing through the metal sealing cover, the metal welding block being soldered to the metal sealing cover and the circuit board;

[0012] A digital signal processing chip is arranged on the circuit board and outside the metal sealing cover.

[0013] In an exemplary embodiment of the present disclosure, an opening is provided on the circuit board, a heat sink is provided in the opening, the metal sealing cover, the circuit board and the heat sink form the sealed cavity, and the silicon photonic component is located on the heat sink.

[0014] In an exemplary embodiment of the present disclosure, the heat sink is welded to the circuit board and seals the opening.

[0015] In an exemplary embodiment of the present disclosure, a step structure is provided on the supporting surface of the heat sink so that the optical waveguide of the laser light source chip located on the heat sink, the center point of the incident surface of the collimating lens, the center point of the exit surface of the collimating lens, the center point of the incident surface of the concave-convex lens, the center point of the exit surface of the concave-convex lens and the center point of the incident surface of the isolator are collinear, and the center of the light beam on the exit surface of the isolator, the center point of the incident surface of the focusing lens and the center point of the exit surface of the focusing lens are collinear.

[0016] In an exemplary embodiment of the present disclosure, a carrier is provided on the heat sink, and the laser light source chip is provided on the carrier.

[0017] In an exemplary embodiment of the present disclosure, the melting point of the solder is lower than 140°C.

[0018] In an exemplary embodiment of the present disclosure, the solder is tin-bismuth solder.

[0019] In an exemplary embodiment of the present disclosure, the metal sealing cover is formed by stamping, die-casting or injection molding.

[0020] In an exemplary embodiment of the present disclosure, the metal sealing cover is made of stainless steel, aluminum alloy or zinc alloy, and the wall thickness of the metal sealing cover is 0.05 mm to 0.5 mm.

[0021] In an exemplary embodiment of the present disclosure, the metal sealing cover is heated so as to be soldered to the metal welding block and the circuit board to form the sealed cavity.

[0022] The liquid-cooled optical module provided by the present disclosure uses a metal sealing cover in combination with solder paste when sealing the silicon photonic component, transimpedance amplifier chip, and detector chip on the circuit board through a sealing cover. The solder paste is heated and melted by externally heating the metal sealing cover so that the metal sealing cover and the circuit board are soldered together to form a stable and reliable sealed cavity, so that the silicon photonic integrated chip, laser light source chip, detector chip, and their optical path components are sealed. The process is mature, the cost is low, the operability is high, and the sealing part is not prone to aging or corrosion and failure. It can be used for a long time in a liquid environment, thereby improving the reliability and service life of the liquid-cooled optical module and reducing the heat dissipation cost of the application end. At the same time, the use of a metal sealing cover can form an electromagnetic shielding effect to improve the stability of the silicon photonic component. In addition, the silicon photonic component includes a laser light source chip, a collimating lens, an isolator, a concave-convex lens, a focusing lens, and a silicon photonic integrated chip arranged in sequence. The collimating lens, the concave-convex lens, and the focusing lens are designed to narrow the parallel light path, reduce the incident angle of the light beam entering the optical waveguide of the silicon photonic integrated chip, improve the coupling efficiency, and reduce the power consumption of the optical module.

[0023] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0025] Figure 1 A schematic diagram of a liquid-cooled optical module provided in accordance with an embodiment of the present disclosure.

[0026] Figure 2 A bottom view of a liquid-cooled optical module provided in accordance with an embodiment of the present disclosure.

[0027] Figure 3 An exploded view of a liquid-cooled optical module provided in accordance with an embodiment of the present disclosure.

[0028] Figure 4 A schematic diagram of a circuit board, a metal sealing cover, a silicon photonic component, and a coupling jumper provided in an embodiment of the present disclosure.

[0029] Figure 5An exploded diagram of a circuit board, a metal sealing cover, a silicon photonic component, and a coupling jumper provided in accordance with an embodiment of the present disclosure.

[0030] Figure 6 A schematic diagram of a circuit board, a heat sink, and a digital signal processing chip provided in accordance with an embodiment of the present disclosure.

[0031] Figure 7 A schematic diagram of a circuit board, a heat sink, a digital signal processing chip, and a silicon photonic component provided in accordance with an embodiment of the present disclosure.

[0032] Figure 8 A side view of a circuit board, a heat sink, a digital signal processing chip, and a silicon photonics component provided in accordance with an embodiment of the present disclosure.

[0033] Figure 9 A bottom view of a circuit board provided in accordance with an embodiment of the present disclosure.

[0034] Figure 10 A schematic diagram of a heat sink and a silicon photonic component provided in accordance with an embodiment of the present disclosure.

[0035] Figure 11 A schematic diagram of a silicon photonics component provided in accordance with an embodiment of the present disclosure.

[0036] Figure 12 A schematic diagram of a laser light source chip, a collimating lens, an isolator, a concave-convex lens, and a focusing lens provided in accordance with an embodiment of the present disclosure.

[0037] Figure 13 A side view of a laser light source chip, a collimating lens, an isolator, a concave-convex lens, and a focusing lens provided in accordance with an embodiment of the present disclosure.

[0038] Figure 14 A schematic diagram of a laser light source chip provided in accordance with an embodiment of the present disclosure.

[0039] Figure 15 A schematic diagram of a silicon photonic integrated chip provided in accordance with an embodiment of the present disclosure.

[0040] Figure 16 A schematic diagram of a heat sink provided in accordance with an embodiment of the present disclosure.

[0041] Figure 17 A schematic diagram of a coupling jumper provided in accordance with an embodiment of the present disclosure.

[0042] Figure 18 A schematic diagram of a circuit board, silicon photonic components, and coupling jumpers provided in accordance with an embodiment of the present disclosure.

[0043] Figure 19 A schematic diagram of a metal sealing cover provided in accordance with an embodiment of the present disclosure.

[0044] Figure 20 A schematic diagram of a metal sealing cover from another perspective provided in an embodiment of the present disclosure.

[0045] Description of reference numerals:

[0046] 11. Shell; 111. Upper shell; 112. Lower shell; 12. Pull ring;

[0047] 20. Circuit board;

[0048] 30. Metal sealing cover;

[0049] 40. Silicon photonic components; 41. Laser light source chip; 42. Collimating lens; 43. Concave-convex lens; 44. Isolator; 45. Focusing lens; 46. Silicon photonic integrated chip; 47. Carrier;

[0050] 50, coupling jumper; 510, main connecting line; 520, sub-connecting line; 521, metal welding block; 530, MPO connector; 540, connecting end; 550, wire cap; 560, pressing block;

[0051] 60. Digital signal processing chip;

[0052] 71. Heat sink; 711. Step structure; 72. Upper heat sink; 73. Lower heat sink;

[0053] 80. Solder paste;

[0054] 90. Transimpedance amplifier chip / photodetector chip. DETAILED DESCRIPTION

[0055] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0056] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0057] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second", etc. are used only as labels and are not intended to limit the quantity of their objects.

[0058] The present disclosure provides a liquid-cooled optical module. Figures 1 to 10 As shown, the liquid-cooled optical module includes: a housing 11, a circuit board 20, a metal sealing cover 30, a silicon photonic component 40, a coupling jumper 50 and a digital signal processing chip 60. The housing 11 has a receiving space and a first opening and a second opening connected to the receiving space. The circuit board 20 is located in the receiving space of the housing 11, and the connection end 540 of the circuit board 20 is exposed from the first opening of the housing 11; the metal sealing cover 30 is soldered to the circuit board 20 and forms a sealed cavity with the circuit board 20; the silicon photonic component 40 is provided on the circuit board 20 and is located in the sealed cavity. The silicon photonic component 40 includes a laser light source chip 41, a collimating lens 42, a concave-convex lens 43, an isolator 44, a focusing lens 45 and a silicon photonic integrated chip arranged in sequence. The side of the concave-convex lens 43 facing the collimating lens 42 is convex, and the side facing the isolator 44 is concave. The coupling jumper 50 includes a main connecting line 510 and a sub-connecting line 520. One end of the main connecting line 510 extends from the second opening of the housing 11 into the accommodation space and is connected to one end of another terminal connecting line 520. The other end of the sub-connecting line 520 is provided with a connector, and at least a portion of the connector and the sub-connecting line 520 are located within the sealed cavity. A metal welding block 521 is provided at the portion where the sub-connecting line 520 passes through the metal sealing cover 30. The metal welding block 521 is soldered to the metal sealing cover 30 and the circuit board 20. The digital signal processing chip 60 is provided on the circuit board 20 and is located outside the metal sealing cover 30. The silicon photonic integrated chip 46 integrates the detector and modulator functional units.

[0059] The liquid-cooled optical module provided by the present disclosure uses a metal sealing cover 30 in conjunction with solder paste 80 when sealing the silicon photonic component 40 on the circuit board 20 through a sealing cover. The solder paste 80 is heated and melted by externally heating the metal sealing cover 30, so that the metal sealing cover 30 and the circuit board 20 are soldered together to form a stable and reliable sealed cavity, thereby sealing the silicon photonic integrated chip 46, the laser light source chip 41 and its optical path components. The process is mature, low-cost, and highly operable. The sealed parts are not easily aged or corroded and fail, and can be used for a long time in a liquid environment, thereby improving the reliability and service life of the liquid-cooled optical module and reducing the heat dissipation cost at the application end. At the same time, the use of the metal sealing cover 30 can form an electromagnetic shielding effect to improve the stability of the silicon photonic component 40. In addition, the silicon photonic component 40 includes a laser light source chip 41, a collimating lens 42, an isolator 44, a concave-convex lens 43, a focusing lens 45 and a silicon photonic integrated chip 46 arranged in sequence. Through the design of the three lenses of the collimating lens 42, the concave-convex lens 43 and the focusing lens 45, the parallel light path can be narrowed, and the incident angle of the light beam entering the optical waveguide of the silicon photonic integrated chip 46 can be reduced, which can improve the coupling efficiency and reduce the power consumption of the optical module.

[0060] In some embodiments, as Figures 5 to 9 As shown, the circuit board 20 is provided with an opening, and a heat sink 71 is disposed below the opening. The metal sealing cover 30, the circuit board 20, and the heat sink 71 enclose a sealed cavity, and the silicon photonic component 40 is located on the heat sink 71. By opening a hole in the circuit board 20, sealing the hole with the heat sink 71, and placing the silicon photonic component 40 on the heat sink 71, the heat generated by the silicon photonic component 40 can be directly transferred out of the sealed cavity through the heat sink 71, without having to be conducted to the heat sink 71 through the circuit board 20, thereby improving heat dissipation efficiency.

[0061] The heat sink 71 is welded to the circuit board 20 and seals the opening. The heat sink 71 can be a metal heat sink, such as Kovar, molybdenum copper, or aluminum nitride, which has better thermal conductivity. The metal heat sink 71 can be welded to the circuit board 20 to improve the sealing at the connection point. This ensures that the connection gaps around the sealed cavity are sealed by welding, making the sealed area less susceptible to aging or corrosion, allowing for long-term use in liquid environments, thereby improving the reliability and service life of the liquid-cooled optical module.

[0062] The heat sink 71 (after surface treatment) can be soldered to the circuit board 20 (window gold-plated) using SMT (surface mount technology), which has good sealing, automated operation and high consistency.

[0063] In some embodiments, as Figure 7 As shown, a transimpedance amplifier chip (TIA) and / or a photodetector chip (PD) 90 may be provided on the circuit board 20 , so that the transimpedance amplifier chip and / or the photodetector chip 90 are sealed in a sealed cavity.

[0064] In some embodiments, as Figures 10 to 15 As shown, the silicon photonic component 40 includes a laser light source chip 41, a collimating lens 42, a concave-convex lens 43, an isolator 44, a focusing lens 45 and a silicon photonic integrated chip 46 arranged in sequence. The laser light source chip 41, the collimating lens 42, the concave-convex lens 43, the isolator 44, and the focusing lens 45 can be provided in two groups and arranged in parallel to form two optical paths.

[0065] Among them, such as Figure 12 and Figure 13 As shown, the light incident surface of the collimating lens 42 is a plane, and the light emitting surface of the collimating lens 42 is a convex surface; the light incident surface of the meniscus lens 43 is a convex surface, and the light emitting surface of the meniscus lens 43 is a concave surface; the light incident surface of the focusing lens 45 is a plane, and the light emitting surface of the focusing lens 45 is a convex surface.

[0066] Among them, such as Figure 16 As shown, a step structure 711 is provided on the supporting surface of the heat sink 71 so that the optical waveguide of the laser light source chip 41 located on the heat sink 71, the center point of the incident surface of the collimating lens 42, the center point of the exit surface of the collimating lens 42, the center point of the incident surface of the meniscus lens 43, the center point of the exit surface of the meniscus lens 43 and the center point of the incident surface of the isolator 44 are collinear, and the center of the light beam on the exit surface of the isolator 44, the center point of the incident surface of the focusing lens 45 and the center point of the exit surface of the focusing lens 45 are collinear.

[0067] Among them, such as Figures 11 to 13 As shown, a carrier 47 is provided on the heat sink 71, and the laser light source chip 41 is provided on the carrier 47. The carrier 47 is, for example, an aluminum nitride carrier. The aluminum nitride carrier has high thermal conductivity and heat dissipation performance, can effectively reduce thermal stress, and improve heat dissipation efficiency. In high-speed optical modules, the chip power density is high, and the aluminum nitride carrier can significantly reduce the temperature, extend the life of the device, and avoid light decay and signal distortion. The aluminum nitride carrier also has high frequency and insulation characteristics. The high insulation resistance and low dielectric loss of the aluminum nitride carrier are suitable for high-frequency signal transmission, reduce electromagnetic interference, and improve the signal integrity of the optical module in scenarios such as 5G communications and data centers. The aluminum nitride carrier also has a lightweight structure and high integration. Compared with metal substrates, aluminum nitride ceramic substrates are lighter and thinner, support high-density packaging design, and are in line with the miniaturization trend of optical communication equipment. The aluminum nitride carrier can achieve high-precision wiring through processes such as tape casting and copper / silver plating circuit layer, directly encapsulate the laser light source chip 41 and optimize optical performance.

[0068] In some embodiments, as Figure 17 and Figure 18As shown, the coupling jumper 50 includes a main cable 510 and a sub-cable 520. When two optical paths are configured, two sub-cables 520 can be provided. One end of the main cable 510 extends out of the accommodation space from the second opening, and the other end connects to one end of each of the two sub-cables 520. A connector is provided at the other end of each sub-cable 520, and at least a portion of the connector and the sub-cable 520 are located within the sealed cavity. Each of the two sub-cables 520 has four optical fibers. One sub-cable 520 has four input optical fibers that couple to the photodetector chip; the other sub-cable 520 has four output optical fibers that couple to the waveguide at the optical port edge of the silicon photonic integrated chip 46.

[0069] Among them, such as Figure 17 As shown, an MPO connector 530 is provided on one end of the main connecting line 510 extending out of the accommodation space from the second opening. The MPO connector 530 may be provided with a wire cap 550.

[0070] Among them, a metal welding block 521 is provided at the position where the sub-connecting line 520 passes through the metal sealing cover 30. The metal welding block 521 is sealed between the surface of the sub-connecting line 520, so that the optical fiber is metallized and soldered to the metal sealing cover 30 and the circuit board 20 through the metal welding block 521.

[0071] During soldering, first apply solder paste on the circuit board 20, then place the metal sealing cover 30, and then continue to apply solder paste between the metal sealing cover 30 and the metal welding block 521 on the sub-connecting line 520, and then heat the metal sealing cover 30 to melt the solder and weld it to achieve a sealed gap state, so that the metal sealing cover 30 is soldered to the metal welding block 521 and the circuit board 20 to form a sealed cavity.

[0072] The melting point of solder is lower than 140°C, for example, 140°C, 138°C, 135°C, 133°C, 130°C, etc. By using solder with a lower melting point, the metal sealing cover 30 can be welded at a relatively low heating temperature when heating the metal sealing cover 30, thus avoiding the impact of high-temperature welding on other components.

[0073] The solder can be tin-bismuth solder. Tin-bismuth (Sn-Bi) low-temperature solder has a melting point range of 138°C to 140°C, which is much lower than the 217°C to 221°C of traditional high-temperature solder. It can be soldered at a peak temperature of approximately 180°C, significantly reducing thermal stress and the risk of warping of the circuit board 20 and the chip. Of course, those skilled in the art may also use other solders, and this disclosure is not limited thereto.

[0074] In some embodiments, as Figure 19 and Figure 20As shown, the metal sealing cover 30 is formed by a stamping process. The metal sealing cover 30 formed by the stamping process has no gaps as a whole and has good sealing performance. Of course, it can also be formed by die casting or injection molding, which is not limited by the present disclosure.

[0075] The metal sealing cover 30 is made of stainless steel, which has good electromagnetic shielding properties. Of course, aluminum alloy or zinc alloy can also be used, and the present disclosure does not limit this.

[0076] The wall thickness of the metal sealing cover 30 is 0.05 mm to 0.5 mm, for example, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.50 mm, etc.

[0077] In some embodiments, as Figure 3 As shown, the housing 11 includes an upper shell 111 and a lower shell 112 , which are buckled together to form an accommodating space.

[0078] Among them, such as Figure 3 As shown, the coupling jumper 50 is provided with a pressing block upper shell and a pressing block lower shell, which are buckled together on the coupling jumper 50 to form a pressing block 560. During assembly, the upper shell 111 and the lower shell 112 are buckled together on the pressing block 560 to limit the coupling jumper 50.

[0079] Among them, the pressure block 560 can also be an integrated structure with the coupling jumper 50, that is, the pressure block 560 is formed at one time through an injection molding process; or, the pressure block 560 can also be a structure on the shell 11, or other independent structural parts, which can realize the assembly limit of the coupling jumper 50, and the present disclosure does not impose any restrictions on this.

[0080] In some embodiments, as Figure 3 As shown, the liquid-cooled optical module further includes a pull ring 12, which is connected to the upper shell 111 and / or the lower shell 112. By operating the pull ring 12, the shell 11 can be separated from the optical cage, thereby realizing the quick plug-in and pull-out function of the liquid-cooled optical module.

[0081] In some embodiments, as Figure 3 As shown, the liquid-cooled optical module also includes an upper heat sink 72 and a lower heat sink 73. The upper heat sink 72 is located between the circuit board 20 and the upper shell 111, and the lower heat sink 73 is located between the circuit board 20 and the lower shell 112. The arrangement of the upper heat sink 72 and the lower heat sink 73 further achieves heat conduction, increases the heat exchange area with the coolant, and thus improves heat exchange efficiency.

[0082] Among them, a through hole can be set on the lower heat sink 73, and the bottom of the heat sink 71 is located in the through hole. The heat sink 71 is directly exposed through the lower heat sink 73, and then directly contacts the coolant to achieve direct heat exchange, thereby improving heat exchange efficiency.

[0083] A limiting structure may be provided on the upper shell 111 to form an assembly limit for the upper heat sink 72 ; and a limiting structure may be provided on the lower shell 112 to form an assembly limit for the lower heat sink 73 .

[0084] Among them, heat dissipation material can be coated between components that need to transfer heat to improve the efficiency of heat transfer and thus improve the heat dissipation effect.

[0085] A flow channel opening for the coolant to enter may be provided on the lower shell 112 to achieve flow and heat exchange of the coolant in the accommodating space.

[0086] Specifically, during the assembly process, the heat sink (Bench) 71 and the electronic materials are first attached to the PCB (circuit board 20) through SMT (surface mount technology); then the silicon photonic integrated chip 46 is mounted on the heat sink 71, the TIA (transimpedance amplifier chip) and the PD (photodetector chip) are mounted on the circuit board 20, and the laser light source chip 41 is mounted on the carrier 47. The silicon photonic integrated chip 46, the transimpedance amplifier chip, the photodetector chip and the laser light source chip 41 can be respectively connected to the corresponding electrodes on the PCB using Gold wire is used to achieve electrical connection; then the optical path is mounted and coupled, and a collimating lens 42, a concave-convex lens 43, an isolator 44 and a focusing lens 45 are arranged in sequence on the heat sink 71; then jumper coupling is performed, the FA block on the sub-connecting line 520 includes a top cover and a V-groove substrate. When the light source box is provided with two optical paths, optical fibers can be clamped between the top cover and the V-groove substrate, one group is four incident optical fibers, and the other group is four output optical fibers; the output optical fibers are coupled with the waveguide at the edge of the optical port of the silicon photonic integrated chip 46, and the incident optical fibers are coupled with the light detector chip. The sub-connecting line 520 has been optical fiber metallized when it is received, that is, the metal welding block 521 is set; then low-temperature solder paste 80 is applied on the circuit board 20, and then the metal sealing cover 30 is placed; then the gap between the metal sealing cover 30 and the metal welding block 521 is also coated with solder paste 80; after the solder paste 80 is applied, the top of the metal sealing cover 30 is heated to melt and weld the solder paste 80 to achieve a sealed state; then the upper pressing block and the lower pressing block are assembled, and a pressing block 560 is formed on the coupling jumper 50 to limit the coupling jumper 50; then heat dissipation material is applied to the structural parts corresponding to the back position of the DSP (digital signal processing chip 60) and the heat sink 71, where the upper heat sink 72 and the lower heat sink 73 have been mounted on the upper shell 111 and the lower shell 112, and can also be replaced by the bosses of the upper shell 111 and the lower shell 112; finally, the upper shell 111 and the lower shell 112 are buckled together to complete the overall assembly.

[0087] The liquid-cooled optical module provided by the present disclosure uses a sealing cover to seal the silicon photonic component 40, the transimpedance amplifier chip, and the detector chip on the circuit board 20. A metal sealing cover 30 is used in conjunction with solder paste 80. The solder paste 80 is heated and melted by externally heating the metal sealing cover 30, so that the metal sealing cover 30 and the circuit board 20 are soldered together to form a stable and reliable sealed cavity, thereby sealing the silicon photonic integrated chip 46, the laser light source chip 41, and its optical path components. The process is mature, low-cost, and highly operable. The sealed parts are not easily aged or corroded and fail. They can be used for a long time in a liquid environment, thereby improving the reliability and service life of the liquid-cooled optical module and reducing the heat dissipation cost at the application end. At the same time, the use of the metal sealing cover 30 can form an electromagnetic shielding effect to improve the stability of the silicon photonic component 40. In addition, the silicon photonic component 40 includes a laser light source chip 41, a collimating lens 42, a concave-convex lens 43, an isolator 44, a focusing lens 45 and a silicon photonic integrated chip 46 arranged in sequence. Through the design of the three lenses of the collimating lens 42, the concave-convex lens 43 and the focusing lens 45, the parallel light path can be narrowed, and the incident angle of the light beam entering the optical waveguide of the silicon photonic integrated chip 46 can be reduced, which can improve the coupling efficiency and reduce the power consumption of the optical module, thereby being beneficial to the stability of the liquid-cooled light module and extending the service life of the liquid-cooled light module.

[0088] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A liquid-cooled optical module, characterized in that: include: a housing having a receiving space and a first opening and a second opening communicating with the receiving space; a circuit board, the circuit board being located in the accommodation space, and a connection end of the circuit board being exposed from the first opening; a metal sealing cover, wherein the metal sealing cover is soldered to the circuit board and forms a sealed cavity with the circuit board; A silicon photonics component, the silicon photonics component being disposed on the circuit board and located within the sealed cavity, the silicon photonics component comprising a laser light source chip, a collimating lens, a concave-convex lens, an isolator, a focusing lens, and a silicon photonics integrated chip arranged in sequence, wherein the concave-convex lens has a convex surface facing the collimating lens and a concave surface facing the isolator; A coupling jumper, the coupling jumper comprising a main connection line and a sub-connection line, one end of the main connection line extending from the second opening into the accommodation space, the other end of the main connection line being connected to one end of the sub-connection line, the other end of the sub-connection line being provided with a connector, and the connector and at least a portion of the sub-connection line being located within the sealed cavity; a metal welding block being provided at a portion of the sub-connection line passing through the metal sealing cover, the metal welding block being soldered to the metal sealing cover and the circuit board; A digital signal processing chip is arranged on the circuit board and outside the metal sealing cover.

2. The liquid-cooled optical module according to claim 1, wherein: An opening is provided on the circuit board, a heat sink is provided in the opening, the metal sealing cover, the circuit board and the heat sink are enclosed to form the sealed cavity, and the silicon photonic component is located on the heat sink.

3. The liquid-cooled optical module according to claim 2, characterized in that: The heat sink is welded to the circuit board and seals the opening.

4. The liquid-cooled optical module according to claim 2, wherein: A step structure is provided on the bearing surface of the heat sink so that the optical waveguide of the laser light source chip located on the heat sink, the center point of the incident surface of the collimating lens, the center point of the exit surface of the collimating lens, the center point of the incident surface of the concave-convex lens, the center point of the exit surface of the concave-convex lens and the center point of the incident surface of the isolator are collinear, and the center of the light beam on the exit surface of the isolator, the center point of the incident surface of the focusing lens and the center point of the exit surface of the focusing lens are collinear.

5. The liquid-cooled optical module according to claim 2, wherein: A carrier is provided on the heat sink, and the laser light source chip is provided on the carrier.

6. The liquid-cooled optical module according to claim 1, characterized in that: The melting point of the solder is lower than 140°C.

7. The liquid-cooled optical module according to claim 6, characterized in that: The solder is tin-bismuth solder.

8. The liquid-cooled optical module according to claim 1, wherein: The metal sealing cover is formed by stamping, die-casting or injection molding.

9. The liquid-cooled optical module according to claim 1, wherein: The metal sealing cover is made of stainless steel, aluminum alloy or zinc alloy, and the wall thickness of the metal sealing cover is 0.05mm to 0.5mm.

10. The liquid-cooled optical module according to claim 1, wherein: The metal sealing cover is heated to weld the metal sealing cover, the metal welding block and the circuit board through soldering to form the sealed cavity.

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