Wafer film pasting device and using method thereof

Abstract

The invention provides a wafer film pasting device and a use method thereof, the structural design of a wafer carrier and a film pasting assembly is adopted, the film pasting assembly comprises a supporting body, a film clamping groove, a film attaching roller and a telescopic rod, and the specific use method comprises the steps that a wafer is horizontally placed in a containing groove, the film pasting assembly is fixed to the wafer carrier, and the film pasting assembly is fixed to the supporting body; a to-be-attached film is inserted into the film clamping groove, the to-be-attached film is driven to make contact with the top end of the side wall of the containing groove by moving the film clamping groove and the connecting arm downwards, the film is attached to the top end of the side wall through rolling of the film attaching roller, and finally the to-be-attached film is naturally attached to the surface of a wafer through the telescopic operation of overturning the film attaching device, removing the wafer carrier and the telescopic rod. The accuracy and high efficiency of the film pasting process are ensured, meanwhile, the air bridge structure is not extruded by external force during film pasting, and therefore the problem that in the prior art, an air bridge structure is prone to being extruded by external force and collapses, and then the yield is affected is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer film laminating device and a method for using the same. Background Art

[0002] In the microwave and radio frequency field, air bridge structures are widely used due to their low dielectric constant. This low dielectric constant means lower capacitive coupling and inductance, effectively reducing interference between signals and ensuring signal purity. Air bridge structures perform particularly well when processing high-frequency signals. Air, as a filling medium, offers low loss and high impedance matching. This not only minimizes energy loss during signal transmission, but also ensures signal integrity and clarity, maintaining stable transmission efficiency even in high-frequency environments.

[0003] However, the main challenge facing the air bridge structure is its susceptibility to collapse, especially at the microscopic level. It is easily deformed or collapsed by surface tension and external forces. This challenge poses challenges to its practicality and stability, especially during the film application process, where the air bridge is easily squeezed and collapsed by external forces, resulting in poor appearance and circuit failure. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a wafer film lamination device and a method of use thereof, which is used to solve the problem in the prior art that the air bridge structure is easily collapsed due to external force during film lamination, resulting in poor appearance and circuit failure.

[0005] To achieve the above-mentioned and other related purposes, the present invention provides a wafer film laminating device, which includes: a wafer carrier and a film laminating assembly;

[0006] The wafer carrier has a receiving groove for horizontally carrying the wafer;

[0007] The film attaching assembly includes a support body, a film clamping slot, a film attaching roller and a telescopic rod; wherein, the support body includes two side arms and a connecting arm connecting the two side arms, the film clamping slot is connected to the inner side wall of the side arm of the support body, and is used to horizontally carry the film to be attached and place the film to be attached on the inner side of the support body, the film attaching roller and the telescopic rod are connected to the connecting arm, the film attaching roller can roll along the horizontal circumferential direction, the telescopic rod can be extended and retracted up and down, and the film clamping slot and the connecting arm can reciprocate along the extension direction of the two side arms of the support body;

[0008] The film sticking assembly is detachably connected to the wafer carrier; when the film sticking assembly is connected to the wafer carrier, the film sticking assembly is connected to the outside of the accommodating groove of the wafer carrier, and the film card slot is also arranged on the outside of the accommodating groove, and the film attaching roller and the telescopic rod are facing the accommodating groove.

[0009] Optionally, a telescopic adjustment button is provided on the connecting arm corresponding to the telescopic rod, and the telescopic rod can be extended and retracted by adjusting the telescopic adjustment button.

[0010] Optionally, when the film attaching assembly is connected to the wafer carrier, the film attaching roller is located above the side wall of the accommodating groove, and the telescopic rod is located above the center position of the wafer in the accommodating groove.

[0011] Optionally, sliding tracks in the up-down direction are provided on the two side arms of the support body, and the membrane slot and the connecting arm can move back and forth along the extending direction of the two side arms of the support body through the sliding tracks.

[0012] Optionally, the wafer carrier has two fixing grooves arranged opposite to each other, and the fixing grooves are adapted to the cross-sectional shapes of the two side arms of the support body. By inserting the ends of the two side arms of the support body into the corresponding fixing grooves, the film assembly can be fixed on the wafer carrier.

[0013] The present invention also provides a method for using the wafer lamination device, the method comprising:

[0014] Providing a wafer lamination device as described in any one of the above;

[0015] Providing a wafer, and placing the wafer horizontally in the accommodating groove, with the upper surface of the wafer lower than the top surface of the accommodating groove;

[0016] Fixing the film attachment assembly on the wafer carrier;

[0017] Providing a film to be attached, and inserting the film to be attached into the film card slot;

[0018] Moving the film clamping slot downward to drive the film to be attached to move to contact the top of the side wall of the accommodating groove;

[0019] Moving the connecting arm downward to drive the film attaching roller to move to contact the film to be attached, and controlling the film attaching roller to roll circumferentially along the top of the side wall of the accommodating groove to attach the film to be attached to the top of the side wall of the accommodating groove;

[0020] Turning over the wafer laminating device so that the wafer carrier is placed above the laminating assembly;

[0021] removing the wafer carrier to place the wafer on the film to be attached;

[0022] Extending the telescopic rod so as to lift the film to be attached until the film to be attached contacts the surface of the wafer;

[0023] The telescopic rod is retracted to naturally adhere the film to be attached to the surface of the wafer.

[0024] Optionally, one side surface of the wafer has an air bridge structure, and the wafer is placed in the accommodating groove with the side having the air bridge structure facing downward.

[0025] Optionally, the film to be attached includes a UV film.

[0026] Optionally, when a telescopic adjustment button is provided at the connecting arm corresponding to the telescopic rod, the telescopic rod can be extended and retracted by adjusting the telescopic adjustment button, the method of extending the telescopic rod so that the telescopic rod lifts the film to be attached until the film to be attached contacts the surface of the wafer is to press the telescopic adjustment button, and the method of contracting the telescopic rod so that the film to be attached is naturally attached to the surface of the wafer is to release the telescopic adjustment button.

[0027] Optionally, in the step of moving the connecting arm downward to drive the film attaching roller to move to contact the film to be attached, the connecting arm drives the telescopic rod to move to lightly touch the film to be attached or not to contact the film to be attached.

[0028] As described above, the wafer film laminating device of the present invention and the method of use thereof have the following beneficial effects: by adopting the structural design of the wafer carrier and the film laminating assembly, wherein the film laminating assembly includes a supporting body, a film card slot, a film attaching roller and a telescopic rod, and combined with a specific method of use: the wafer is placed horizontally in the accommodating groove, the film laminating assembly is fixed on the wafer carrier, the film to be attached is inserted into the film card slot, and the film card slot and the U-shaped side arm connecting arm are moved downward to drive the film to be attached to contact the top of the side wall of the accommodating groove, and the film attaching roller is used to roll the film to adhere to the top of the side wall, and further by flipping the film laminating device, removing the wafer carrier, and extending and retracting the telescopic rod, the film to be attached is finally naturally attached to the wafer surface, thereby ensuring the accuracy and efficiency of the film laminating process, and at the same time achieving the air bridge structure not being squeezed by external force during film laminating, thereby solving the problem in the prior art that the air bridge structure is easily squeezed by external force and thus collapses, thereby affecting the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It shows a schematic cross-sectional structure diagram of the wafer laminating device of the present invention.

[0030] Figure 2Shown is a flow chart of a method for using the wafer attaching device of the present invention.

[0031] Figures 3 to 13 It shows a schematic structural diagram of each step of laminating a wafer using a wafer laminating device according to the present invention.

[0032] Component number description

[0033] 10 Wafer carrier

[0034] 11 Accommodating groove

[0035] 12 fixing slots

[0036] 13 side wall of the accommodating groove

[0037] 20 wafers

[0038] 21 Air bridge structure

[0039] 22 Attachment Area

[0040] 30 film components

[0041] 31 Support body

[0042] 32 Sidearm

[0043] 33 Connecting Arm

[0044] 34 membrane slots

[0045] 35 film roller

[0046] 36 telescopic rod

[0047] 37 Film to be attached

[0048] Steps S1 to S10 DETAILED DESCRIPTION

[0049] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0050] See also Figures 1 to 13 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0051] This embodiment provides a wafer film attaching device, such as Figure 1 As shown, the film laminating device includes: a wafer carrier 10 and a film laminating assembly 30;

[0052] The wafer carrier 10 has a receiving groove 11 for horizontally supporting the wafer 20;

[0053] The film attaching assembly 30 includes a support body 31, a film clamping slot 34, a film attaching roller 35 and a telescopic rod 36; wherein the support body 31 includes two side arms 32 and a connecting arm 33 connecting the two side arms 32, the film clamping slot 34 is connected to the inner side wall of the side arm 32 of the support body 31, and is used to horizontally carry the film 37 to be attached and place the film 37 to be attached inside the support body 31, the film attaching roller 35 and the telescopic rod 36 are connected to the connecting arm 33, the film attaching roller 35 can roll in the horizontal circumferential direction, the telescopic rod 36 can be extended and retracted up and down, and the film clamping slot 34 and the connecting arm 33 can reciprocate along the extension direction of the two side arms 32 of the support body 31;

[0054] The film sticking assembly 30 is detachably connected to the wafer carrier 10; when the film sticking assembly 30 is connected to the wafer carrier 10, the film sticking assembly 30 is connected to the outside of the accommodating groove 11 of the wafer carrier 10, and the film card groove 34 is also arranged on the outside of the accommodating groove 11, and the film attaching roller 35 and the telescopic rod 36 are facing the accommodating groove 11.

[0055] The wafer laminating device of this embodiment adopts the structural design of a wafer carrier and a film laminating assembly, wherein the film laminating assembly includes a supporting body, a film card slot, a film attaching roller and a telescopic rod, and can be combined with a specific method of use: the wafer is placed horizontally in the accommodating groove, the film attaching assembly is fixed on the wafer carrier, and the film to be attached is inserted into the film card slot, and the film card slot and the connecting arm are moved downward to drive the film to contact the top of the side wall of the accommodating groove, and the film attaching roller is used to roll the film to adhere to the top of the side wall, and further by flipping the film laminating device, removing the wafer carrier, and extending and retracting the telescopic rod, the film to be attached is finally naturally attached to the wafer surface, thereby ensuring the accuracy and efficiency of the film laminating process, and at the same time realizing that the air bridge structure is not squeezed by external force during film laminating, thereby solving the problem in the prior art that the air bridge structure is easily squeezed by external force and collapses, thereby affecting the yield.

[0056] As an example, a telescopic adjustment button (not shown) is provided at the connecting arm 33 corresponding to the telescopic rod 36. By adjusting the telescopic adjustment button, the telescopic rod 36 can be extended and retracted to finely control the contact process between the film to be attached 37 and the wafer 20. In particular, when there is an air bridge structure on the surface of the wafer, the impact and extrusion of the air bridge structure on the wafer surface by external force can be reduced, effectively avoiding the risk of collapse of the air bridge structure due to excessive force, and the convenient telescopic adjustment function can reduce the operating steps and adjustment time, making the entire film-attaching process smoother, which helps to improve the overall production efficiency and capacity.

[0057] As a preferred example, when the film attaching assembly 30 is connected to the wafer carrier 10 , the film attaching roller 35 is located above the side wall 13 of the accommodating groove, and the telescopic rod 36 is located above the center of the wafer 20 in the accommodating groove 11 . The film attaching roller 35 and the telescopic rod 36 are configured to move along the top of the film 37 to be attached, so that the film 37 can be attached to the top of the side wall 13 of the accommodating groove. The film attaching roller 35 and the telescopic rod 36 are configured to move along the top of the side wall 13 of the accommodating groove, so that the film 37 can be attached to the top of the side wall 13 of the accommodating groove. The film attaching roller 35 can roll along the top of the side wall 13 of the accommodating groove to attach the film 37 to the top of the side wall 13 of the accommodating groove. The telescopic rod 36 can be telescopically adjusted to not contact or lightly touch the film 37 to be attached. When the wafer carrier 10 is removed from the film attaching assembly 30 and the wafer 20 is placed on the film 37 to be attached, the telescopic rod 36 can be telescopically adjusted to lift the film 37 to contact the center of the surface of the wafer 20, thereby ensuring uniformity of the film attaching effect and improving film attaching efficiency.

[0058] As an example, sliding tracks (not shown) are provided on the two side arms 32 of the support body 31 in the up and down directions, and the film slot 34 and the connecting arm 33 can be reciprocated along the extension direction of the two side arms 32 of the support body 31 through the sliding tracks. While enhancing the operational flexibility and ensuring the structural stability, the moving trajectory of the film slot 34 and the connecting arm 33 can be more accurately controlled, reducing problems such as uneven film application or bubbles caused by position deviation, thereby improving the film application accuracy.

[0059] As an example, Figure 3 As shown, the wafer carrier 10 has two fixing grooves 12 arranged opposite to each other, and the fixing grooves 12 are adapted to the cross-sectional shapes of the two side arms 32 of the support body 31. By inserting the ends of the two side arms 32 of the support body 31 into the corresponding card grooves 34, the film assembly 30 can be fixed on the wafer carrier 10.

[0060] This embodiment also provides a method for using the wafer lamination device, such as Figure 2 As shown, the method of use includes:

[0061] S1, providing the wafer laminating device as described above;

[0062] S2, providing a wafer, and placing the wafer horizontally in the accommodating groove, with the upper surface of the wafer lower than the top surface of the accommodating groove;

[0063] S3, fixing the film laminating assembly on the wafer carrier;

[0064] S4, providing a film to be attached, and inserting the film to be attached into the film card slot;

[0065] S5, moving the film clamping slot downward to drive the film to be attached to move to contact the top of the side wall of the accommodating groove;

[0066] S6, moving the connecting arm downward to drive the film attaching roller to move to contact the film to be attached, and controlling the film attaching roller to roll circumferentially along the top of the side wall of the accommodating groove to attach the film to be attached to the top of the side wall of the accommodating groove;

[0067] S7, turning over the wafer laminating device so that the wafer carrier is placed above the laminating assembly;

[0068] S8, removing the wafer carrier to place the wafer on the film to be attached;

[0069] S9, extending the telescopic rod so as to lift the film to be attached until the film to be attached contacts the surface of the wafer;

[0070] S10, retracting the telescopic rod to naturally adhere the film to be attached to the surface of the wafer.

[0071] The method for using the wafer film laminating device of this embodiment adopts the structural design of a wafer carrier and a film laminating assembly, wherein the film laminating assembly includes a supporting body, a film card slot, a film attaching roller and a telescopic rod. The wafer is placed horizontally in the accommodating groove, the film attaching assembly is fixed on the wafer carrier, the film to be attached is inserted into the film card slot, the film card slot and the connecting arm are moved downward, the film to be attached is driven to contact the top of the side wall of the accommodating groove, and the film attaching roller is used to roll the film to adhere to the top of the side wall. The film laminating device is further flipped, the wafer carrier is removed, and the telescopic rod is extended and retracted, so that the film to be attached is naturally attached to the surface of the wafer, thereby ensuring the accuracy and efficiency of the film laminating process. At the same time, the air bridge structure is not squeezed by external force during film laminating, thereby solving the problem in the prior art that the air bridge structure is easily squeezed by external force and collapses, thereby affecting the yield.

[0072] The following combination Figures 3 to 13 The method of using the wafer bonding apparatus of this embodiment is described in detail.

[0073] First, step S1 is performed to provide the wafer film mounting device as described above. Figure 3 As shown, the wafer carrier 10 in the wafer laminating device.

[0074] like Figure 4 As shown, step S2 is then performed to provide a wafer 20 and place the wafer 20 horizontally in the accommodating cavity 11 , with the upper surface of the wafer 20 being lower than the top surface of the accommodating cavity 11 .

[0075] As an example, one side surface of the wafer 20 has an air bridge structure 21. In step S2, the wafer 20 with the air bridge structure 21 is placed face down in the accommodating groove 11 to protect the air bridge structure 21 from external force in subsequent steps.

[0076] like Figure 5 As shown, the process then proceeds to step S3 , where the film attaching assembly 30 is fixed on the wafer carrier 10 .

[0077] like Figure 6 As shown, step S4 is then performed to provide a film 37 to be attached, and insert the film 37 to be attached into the film slot 34.

[0078] As an example, the film to be attached 37 includes a UV film. The specific material type can also be selected according to the usage scenario and is not overly restricted here.

[0079] As an example, before inserting the film to be attached 37 into the film card slot 34, the film to be attached 37 is placed on a supporting iron ring, and the supporting iron ring is used to preliminarily position and support the film 37, which helps to more accurately control the position and direction of the film 37 in subsequent steps, thereby improving the accuracy and consistency of the film.

[0080] like Figure 7 As shown, step S5 is then performed to move the film clamping slot 34 downward to drive the film to be attached 37 to move to contact the top of the side wall 13 of the accommodating groove.

[0081] like Figure 7 As shown, step S6 is then performed to move the connecting arm 33 downward to drive the film attaching roller 35 to move to contact the film to be attached 37, and control the film attaching roller 35 to roll circumferentially along the top of the side wall 13 of the accommodating groove to attach the film to be attached 37 to the top of the side wall 13 of the accommodating groove.

[0082] like Figure 8 , which is a schematic top view of the film 37 to be attached, the top of the side wall 13 of the accommodating groove, the wafer 20 and the film attaching roller 35 when the film attaching roller 35 rolls circumferentially along the top of the side wall 13 of the accommodating groove.

[0083] As an example, in the step of moving the connecting arm 33 downward to drive the film attaching roller 35 to move to contact the film to be attached 37, the connecting arm 33 drives the telescopic rod 36 to move to lightly touch the film to be attached 37 or not to contact the film to be attached 37, so as to avoid applying excessive pressure on the film to be attached 37 before attaching the film to be attached 37, prevent the film material from being deformed or damaged, and thus ensure the accuracy and stability of the film attaching process.

[0084] like Figure 9 As shown, step S7 is then performed to flip the wafer film mounting device so that the wafer carrier 10 is placed above the film mounting assembly 30 .

[0085] like Figure 10 As shown, step S8 is then performed to remove the wafer carrier 10 so that the wafer 20 is placed on the film to be attached 37 .

[0086] like Figure 11 As shown, the process then proceeds to step S9, extending the telescopic rod 36 so that the telescopic rod 36 lifts the film 37 to be attached until the film 37 to be attached contacts the surface of the wafer 20. Figure 12 1 is a schematic diagram of the top view of the film to be attached 37 , the wafer 20 and the central attachment area 22 of the wafer 20 .

[0087] like Figure 13 As shown, step S10 is then performed to retract the telescopic rod 36 to naturally adhere the film 37 to be attached to the surface of the wafer 20 .

[0088] As an example, when the connecting arm 33 is provided with a telescopic adjustment button (not shown) at the position corresponding to the telescopic rod 36, the telescopic rod 36 can be extended and retracted by adjusting the telescopic adjustment button. In step S9, the telescopic rod 36 is extended so that the telescopic rod 36 lifts the film to be attached 37 until the film to be attached 37 contacts the surface of the wafer 20 by pressing the telescopic adjustment button. In step S10, the telescopic rod 36 is retracted so that the film to be attached 37 is naturally attached to the surface of the wafer 20 by releasing the telescopic adjustment button. Through the telescopic adjustment button, the contact process between the film to be attached 37 and the wafer 20 can be finely controlled, further reducing the impact and extrusion of the air bridge structure 21 on the surface of the wafer 20 by external force, effectively avoiding the risk of collapse of the air bridge structure 21 due to excessive force, and reducing the operation steps and adjustment time, thereby improving the efficiency of the entire film attaching process.

[0089] In summary, the wafer film laminating device and its use method of the present invention adopt the structural design of a wafer carrier and a film laminating assembly, wherein the film laminating assembly includes a support body, a film card slot, a film attaching roller and a telescopic rod, and is combined with a specific use method: the wafer is placed horizontally in the accommodating groove, the film laminating assembly is fixed on the wafer carrier, the film to be attached is inserted into the film card slot, the film card slot and the connecting arm are moved downward to drive the film to be attached to contact the top of the side wall of the accommodating groove, and the film attaching roller is used to roll the film to adhere to the top of the side wall, and further by flipping the film laminating device, removing the wafer carrier, and extending and retracting the telescopic rod, the film to be attached is finally naturally attached to the wafer surface, ensuring the accuracy and efficiency of the film laminating process, and at the same time achieving that the air bridge structure is not squeezed by external force during film laminating, thereby solving the problem in the prior art that the air bridge structure is easily squeezed by external force and collapses, thereby affecting the yield. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial utilization value.

[0090] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A wafer lamination device, characterized in that: The film laminating device comprises: a wafer carrier and a film laminating assembly; The wafer carrier has a receiving groove for horizontally carrying the wafer; The film attaching assembly includes a support body, a film clamping slot, a film attaching roller and a telescopic rod; wherein, the support body includes two side arms and a connecting arm connecting the two side arms, the film clamping slot is connected to the inner side wall of the side arm of the support body, and is used to horizontally carry the film to be attached and place the film to be attached on the inner side of the support body, the film attaching roller and the telescopic rod are connected to the connecting arm, the film attaching roller can roll along the horizontal circumferential direction, the telescopic rod can be extended and retracted up and down, and the film clamping slot and the connecting arm can reciprocate along the extension direction of the two side arms of the support body; The film sticking assembly is detachably connected to the wafer carrier; when the film sticking assembly is connected to the wafer carrier, the film sticking assembly is connected to the outside of the accommodating groove of the wafer carrier, and the film card slot is also arranged on the outside of the accommodating groove, and the film attaching roller and the telescopic rod are facing the accommodating groove.

2. The wafer lamination device according to claim 1, wherein: A telescopic adjustment button is provided at a position of the connecting arm corresponding to the telescopic rod, and the telescopic rod can be extended or retracted by adjusting the telescopic adjustment button.

3. The wafer laminating device according to claim 1, wherein: When the film attaching assembly is connected to the wafer carrier, the film attaching roller is located above the side wall of the accommodating groove, and the telescopic rod is located above the center position of the wafer in the accommodating groove.

4. The wafer lamination device according to claim 1, wherein: Sliding tracks in the up-down direction are provided on the two side arms of the support body, and the membrane slot and the connecting arm can move back and forth along the extending direction of the two side arms of the support body through the sliding tracks.

5. The wafer laminating device according to claim 1, wherein: The wafer carrier has two fixing grooves arranged opposite to each other, and the fixing grooves are adapted to the cross-sectional shapes of the two side arms of the support body. By inserting the ends of the two side arms of the support body into the corresponding fixing grooves, the film assembly can be fixed on the wafer carrier.

6. A method for using a wafer film attaching device, characterized in that: The method of use includes: Providing a wafer bonding device according to any one of claims 1 to 5; Providing a wafer, and placing the wafer horizontally in the accommodating groove, with the upper surface of the wafer lower than the top surface of the accommodating groove; Fixing the film attachment assembly on the wafer carrier; Providing a film to be attached, and inserting the film to be attached into the film card slot; Moving the film clamping slot downward to drive the film to be attached to move to contact the top of the side wall of the accommodating groove; Moving the connecting arm downward to drive the film attaching roller to move to contact the film to be attached, and controlling the film attaching roller to roll circumferentially along the top of the side wall of the accommodating groove to attach the film to be attached to the top of the side wall of the accommodating groove; Turning over the wafer laminating device so that the wafer carrier is placed above the laminating assembly; removing the wafer carrier to place the wafer on the film to be attached; Extending the telescopic rod so as to lift the film to be attached until the film to be attached contacts the surface of the wafer; The telescopic rod is retracted to naturally adhere the film to be attached to the surface of the wafer.

7. The method for using the wafer lamination device according to claim 6, wherein: One side surface of the wafer has an air bridge structure, and the wafer with the air bridge structure is placed downward in the accommodating groove.

8. The method for using the wafer laminating device according to claim 6, wherein: The film to be attached includes a UV film.

9. The method for using the wafer laminating device according to claim 6, wherein: When a telescopic adjustment button is provided at the position of the connecting arm corresponding to the telescopic rod, the telescopic rod can be extended and retracted by adjusting the telescopic adjustment button, the telescopic rod is extended so that the telescopic rod lifts the film to be attached until the film to be attached contacts the surface of the wafer by pressing the telescopic adjustment button, and the telescopic rod is retracted so that the film to be attached is naturally attached to the surface of the wafer by releasing the telescopic adjustment button.

10. The method for using the wafer laminating device according to claim 6, wherein: In the step of moving the connecting arm downward to drive the film attaching roller to move to contact the film to be attached, the connecting arm drives the telescopic rod to move to lightly touch the film to be attached or not to contact the film to be attached.

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