Server and cabinet

Abstract

The server comprises a bottom shell, the bottom shell is divided into a first installation area and a second installation area, a first functional module is installed in the first installation area, a second functional module is installed in the second installation area, the bottom shell is further provided with a liquid outlet, and the liquid outlet is communicated with the first functional module and the second functional module. The liquid outlet is communicated with the first mounting area; the liquid cooling module is mounted and matched with the first functional module and is used for dissipating heat of the first functional module; the first partition structure is arranged on the bottom shell and separates the first mounting area from the second mounting area; the bottom shell is further provided with a drainage structure, and the drainage structure is used for guiding leaked liquid generated by the liquid cooling module to flow towards the liquid outlet. The leaked liquid is guided by the drainage structure to flow towards the liquid outlet and is finally discharged from the liquid outlet, so that the second functional module is prevented from being damaged by the leaked liquid, potential safety hazards are eliminated, and the safety of the server is protected.

Description

Technical Field

[0001] The present application relates to the technical field of computing devices, and in particular to a server and a cabinet. Background Art

[0002] A server is a specialized IT device that provides computing power and runs software applications within a network environment. It provides computing or application services to other clients (such as personal computers, smartphones, ATMs, and other terminal devices) within the network. During operation, servers generate significant heat, causing their temperatures to rise continuously. Failure to promptly cool down the server can negatively impact its operational performance and stability.

[0003] Currently, server cooling primarily relies on air convection or fans. However, these methods are no longer sufficient for high-integration, high-power-density servers and can also lead to issues such as high noise levels and low energy efficiency. Liquid cooling has emerged as a more effective solution for server cooling. Liquid cooling removes heat generated within the server through liquid circulation, offering advantages such as high heat dissipation efficiency, low noise levels, and high energy efficiency. However, in actual use, server liquid-cooled chassis have also experienced some issues, the most prominent of which is leakage. Leakage not only damages the server's internal hardware but also poses safety risks to the data center, potentially even paralyzing the entire data center. Summary of the Invention

[0004] Based on this, it is necessary to provide a server and cabinet to address the problem of potential safety hazards caused by leakage.

[0005] In a first aspect of the present application, a server is provided, comprising:

[0006] A bottom shell, the bottom shell being divided into a first installation area and a second installation area, the first installation area being provided with a first functional module, the second installation area being provided with a second functional module, the bottom shell further being provided with a drain port, the drain port being in communication with the first installation area;

[0007] a liquid cooling module, the liquid cooling module being mounted and matched with the first functional module to dissipate heat for the first functional module; and

[0008] a first barrier structure, the first barrier structure being disposed on the bottom shell and separating the first installation area from the second installation area;

[0009] The bottom shell is further provided with a drainage structure, and the drainage structure is used to guide the leakage generated by the liquid cooling module to flow toward the drain port.

[0010] In the server of the present solution, the first functional module and the second functional module are respectively installed in the preset first installation area and the second installation area on the bottom shell, and then a liquid cooling module is arranged to be installed in conjunction with the first functional module. When the first functional module generates heat during operation, the liquid cooling module can promptly and effectively perform liquid cooling on the first functional module, thereby avoiding excessive temperature rise of the first functional module and the server and affecting the working efficiency and reliability. Furthermore, by arranging a first partition structure between the first installation area and the second installation area, the first functional module and the liquid cooling module can be separated from the second functional module by the first partition structure. On this basis, even if the liquid cooling module leaks, the leaked liquid is blocked by the first partition structure and cannot flow into the second installation area, and thus cannot contact the second functional module. At this time, the leaked liquid will be guided by the drainage structure to flow toward the drain port and finally discharged from the drain port, thereby avoiding leakage from damaging the second functional module, eliminating potential safety hazards, and protecting the safety of the server.

[0011] The technical solution of this application is further described below:

[0012] In one embodiment, the drainage structure includes a raised structure, and the raised structure is arranged in the first installation area.

[0013] In one embodiment, the drainage structure includes a raised structure and a slope, and the raised structure and the slope are both arranged in the first installation area. The slope has a first side and a second side relative to each other, the height of the first side is greater than the height of the second side, the first side is connected to the raised structure, and the second side is connected to the drain port.

[0014] In one embodiment, the first barrier structure includes a barrier wall and a first adhesive member, the barrier wall is provided on the bottom shell, the first adhesive member bonds and seals the barrier wall to the bottom shell, and the first adhesive member is arranged in the first installation area or the second installation area;

[0015] Alternatively, the first partition structure includes a partition wall, a first adhesive and a second adhesive, the partition wall is arranged on the bottom shell, the first adhesive bonds and seals the partition wall to the bottom shell, and is arranged in the first installation area, and the second adhesive bonds and seals the partition wall to the bottom shell, and is arranged in the second installation area.

[0016] In one embodiment, the first functional module includes a mainboard unit, the liquid cooling module includes a liquid cooling component, a liquid inlet pipe and a liquid outlet pipe, the liquid cooling module is installed and cooperated with the mainboard unit to dissipate heat from the mainboard unit, the liquid inlet pipe is connected to the liquid inlet of the liquid cooling component, and the liquid outlet pipe is connected to the liquid outlet of the liquid cooling component.

[0017] In one embodiment, the motherboard units are provided with two and are respectively a first motherboard unit and a second motherboard unit, the first motherboard unit and the second motherboard unit are arranged side by side, the liquid cooling components are provided with two and are respectively a first liquid cooling component and a second liquid cooling component, the first liquid cooling component is installed and matched with the first motherboard unit, and the second liquid cooling component is installed and matched with the second motherboard unit, and the liquid cooling module further includes a first infusion pipe, a second infusion pipe, a first return liquid pipe, a second return liquid pipe, a first liquid distributor and a second liquid distributor;

[0018] The liquid inlet pipe is connected to the first liquid distributor, one end of the first liquid infusion pipe and one end of the second liquid infusion pipe are both connected to the first liquid distributor, the other end of the first liquid infusion pipe is connected to the first liquid cooling assembly, the other end of the second liquid infusion pipe is connected to the second liquid cooling assembly, one end of the first liquid return pipe is connected to the first liquid cooling assembly, one end of the second liquid return pipe is connected to the second liquid cooling assembly, the other end of the first liquid return pipe and the other end of the second liquid return pipe are both connected to the second liquid distributor, and the second liquid distributor is connected to the liquid outlet pipe;

[0019] Wherein, the liquid inlet pipe and the liquid outlet pipe both adopt a quick-disassembly structure design.

[0020] In one embodiment, the second functional module includes a power module and a fan module, and the power module is arranged closer to the first functional module than the fan module, so that the fan module is arranged at an edge of the bottom shell;

[0021] The fan module includes an installation box and multiple fans. The installation box is provided with multiple installation compartments arranged side by side on a side away from the power module. The fans are installed in the installation compartments one by one. A positioning piece is provided on the installation box or the bottom shell.

[0022] In one embodiment, the fan has a handle, and both the liquid inlet pipe and the liquid outlet pipe are provided with fasteners, which are engaged with the handle.

[0023] In one embodiment, the bottom shell further has a third mounting area, the third mounting area is arranged on a side of the first mounting area away from the second mounting area, and a third functional module is arranged in the third mounting area;

[0024] A second barrier structure is provided on the bottom shell, and the second barrier structure is arranged between the third installation area and the first installation area.

[0025] In a second aspect of the present application, a cabinet is further provided, comprising:

[0026] a cabinet body, wherein a mounting cavity is formed inside the cabinet body; and

[0027] A plurality of servers as described above are stacked in the installation cavity along the height direction of the cabinet. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings that constitute a part of this application are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 A schematic diagram of a partially exploded structure of a server according to an embodiment.

[0031] Figure 2 This is a schematic diagram of the server structure viewed from above after the top cover is removed.

[0032] Figure 3 This is a schematic diagram of the distribution structure of the first installation area, the second installation area, the third installation area, the first partition structure and the second partition structure on the bottom shell.

[0033] Figure 4 for Figure 2 Schematic diagram of the structure from another perspective.

[0034] Figure 5 for Figure 4 Schematic diagram of the locally enlarged structure at point A in the middle.

[0035] Figure 6 Schematic diagram of the structure of the first baffle structure of an embodiment.

[0036] Description of reference numerals:

[0037] 100, server; 10, bottom case; 11, first mounting area; 12, second mounting area; 13, drain port; 14, third mounting area; 20, top cover; 30, first functional module; 31, first motherboard unit; 32, second motherboard unit; 40, second functional module; 41, power module; 42, fan module; 421, mounting box; 422, fan; 4221, handle; 50, liquid cooling module; 51, liquid inlet pipe; 52, liquid outlet tube; 53, first liquid cooling component; 54, second liquid cooling component; 55, first liquid distributor; 56, second liquid distributor; 57, first infusion tube; 57a, second infusion tube; 58, first return liquid tube; 58a, second return liquid tube; 60, first baffle structure; 61, baffle wall; 62, first adhesive; 63, second adhesive; 70, drainage structure; 80, positioning member; 90, snap fastener; 90a, third functional module; 90b, second baffle structure. DETAILED DESCRIPTION

[0038] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0040] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0041] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0044] See Figure 1 , illustrates a server 100 in one embodiment of the present application. For example, server 100 may be, but is not limited to, a 1U server. In a network environment, server 100 is a specific IT device that provides computing power and runs software applications. It provides computing or application services to other clients (such as personal computers, smartphones, ATMs, and other terminal devices) on the network.

[0045] Please continue reading Figures 1 to 3 Exemplarily, the server 100 includes a top cover 20 , a bottom shell 10 , a liquid cooling module 50 and a first partition structure 60 .

[0046] The top cover 20 and bottom shell 10 are assembled to form the outer shell structure of the server 100. The top cover 20 and bottom shell 10 enclose a housing cavity, which serves as a carrier for installing various functional modules; in addition, the outer shell structure also serves as a barrier and protection for the functional modules installed inside it.

[0047] Furthermore, considering that the functional modules continuously generate a large amount of heat when working, in order to dissipate the heat to the external environment in a timely and effective manner, the top cover 20 and / or the bottom shell 10 are provided with heat dissipation holes.

[0048] Preferably, heat dissipation holes are provided at the positions opposite to the top cover 20 and the bottom shell 10 . The heat dissipation holes on both sides are used to form air convection, and the heat is taken out to the outside of the whole machine through the air.

[0049] Of course, other mature heat dissipation technologies may also be used in the server 100 of the present application, and can be flexibly selected according to actual needs, which will not be elaborated here.

[0050] The bottom shell 10 is divided into a first installation area 11 and a second installation area 12 . The first installation area 11 is equipped with a first functional module 30 , and the second installation area 12 is equipped with a second functional module 40 . The bottom shell 10 is also provided with a drain port 13 , which is connected to the first installation area 11 .

[0051] The liquid cooling module 50 is installed and matched with the first functional module 30 to dissipate heat for the first functional module 30 ; the first blocking structure 60 is provided on the bottom shell 10 and separates the first installation area 11 from the second installation area 12 .

[0052] Please continue reading Figure 2 and Figure 4 The bottom shell 10 is further provided with a drainage structure 70 , which is used to guide the leakage generated by the liquid cooling module 50 to flow toward the drain port 13 .

[0053] It can be understood that the first functional module 30 is configured to be able to contact the leaking liquid without affecting normal operation; the second functional module 40 is configured not to be in contact with the leaking liquid, otherwise short circuit, corrosion and other damage problems may occur.

[0054] In summary, the implementation of the technical solution of this embodiment will achieve the following beneficial effects: in the server 100 of this solution, by respectively installing the first functional module 30 and the second functional module 40 in the preset first installation area 11 and the second installation area 12 on the bottom shell 10, and then providing a liquid cooling module 50 for installation in conjunction with the first functional module 30, when the first functional module 30 generates heat during operation, the liquid cooling module 50 can promptly and effectively perform liquid cooling on the first functional module 30, thereby avoiding excessive temperature rise of the first functional module 30 and the server 100 and affecting the working efficiency and reliability; further, by installing the first functional module 30 in the first installation area A first barrier structure 60 is set between 11 and the second installation area 12, and the first barrier structure 60 can separate the first functional module 30 and the liquid cooling module 50 from the second functional module 40. On this basis, even if the liquid cooling module 50 leaks, the leaked liquid is blocked by the first barrier structure 60 and cannot flow into the second installation area 12, and thus cannot contact the second functional module 40. At this time, the leaked liquid is guided by the drainage structure 70 to flow toward the drain port 13 and finally discharged from the drain port 13, thereby avoiding damage to the second functional module 40 due to leakage, eliminating potential safety hazards, and protecting the safety of the server 100.

[0055] In order to enable the drainage structure 70 to guide the leaked liquid to flow toward the drain port 13 to avoid the accumulation of leaked liquid in the bottom shell 10 and pose a safety hazard, in an optional embodiment, the drainage structure 70 includes a raised structure, which is arranged in the first installation area 11.

[0056] Specifically, the side surface of the bottom housing 10 for mounting the first functional module 30 and the second functional module 40 serves as the mounting surface. The raised structure is raised to a certain height toward the mounting surface. It should be noted that the height of the raised structure is determined so as not to interfere with the installation of the functional modules, the top cover 20, and the like. The shape, size, and number of the raised structures can be flexibly designed based on actual needs and are not specifically limited herein.

[0057] In actual processing, the raised structure can be formed by stamping, extrusion and other processing methods.

[0058] Due to the relative installation positions and size relationships of the functional modules and other components, there may be a considerable distance between the raised structure and the drain port 13. This may not be sufficient to guide the leaked liquid to continue flowing and quickly and effectively reach the drain port 13. To address this, in another optional embodiment, the drainage structure 70 includes a raised structure and a sloped surface, both of which are arranged within the first mounting area 11. The sloped surface has a first side and a second side that are opposite each other, the first side being higher than the second side, the first side being connected to the raised structure, and the second side being connected to the drain port 13.

[0059] When leakage occurs, the raised structure first provides initial kinetic energy for the leaked liquid to flow toward the drain port 13; on this basis, the leaked liquid continues to flow toward the drain port 13 along the slope. The sloped surface superimposed on the gravitational potential energy of the leaked liquid itself allows the leaked liquid to continuously obtain flow kinetic energy, thereby accelerating it to reach the drain port 13, allowing the leaked liquid to be discharged in a timely and effective manner.

[0060] In an optional embodiment, the first partition structure 60 includes a partition wall 61 and a first adhesive 62. The partition wall 61 is arranged on the bottom shell 10. The first adhesive 62 bonds and seals the partition wall 61 to the bottom shell 10, and the first adhesive 62 is arranged in the first installation area 11 or the second installation area 12.

[0061] Please continue reading Figure 6 Alternatively, as an alternative to the above embodiment, the first partition structure 60 may include a partition wall 61, a first adhesive 62 and a second adhesive 63, the partition wall 61 is arranged on the bottom shell 10, the first adhesive 62 bonds and seals the partition wall 61 to the bottom shell 10, and is arranged in the first installation area 11, and the second adhesive 63 bonds and seals the partition wall 61 to the bottom shell 10, and is arranged in the second installation area 12.

[0062] Taking the first adhesive member 62 and the second adhesive member 63 provided simultaneously on opposite sides of the partition wall 61 as an example, on the one hand, the partition wall 61 is bonded and fixed to the bottom shell 10 by the first adhesive member 62 and the second adhesive member 63, and the installation strength and stability are high; on the other hand, the first adhesive member 62 and the second adhesive member 63 after bonding and fixing seal the assembly gap between the partition wall 61 and the bottom shell 10, thereby improving the sealing performance of the first partition structure 60 and ensuring the barrier effect of the first partition structure 60 against liquid leakage.

[0063] For example, the partition wall 61 is constructed of rubber strips to form a fence structure, so as to completely and effectively separate the first installation area 11 from the second installation area 12. The rubber strips have a simple structure, low cost, and good water-blocking effect.

[0064] The first adhesive member 62 and the second adhesive member 63 can be made of any one of glue, tape and the like.

[0065] In the present application, the first functional module 30 includes a mainboard unit, the liquid cooling module 50 includes a liquid cooling component, a liquid inlet pipe 51 and a liquid outlet pipe 52, the liquid cooling module 50 is installed and cooperated with the mainboard unit for dissipating heat from the mainboard unit, the liquid inlet pipe 51 is connected to the liquid inlet of the liquid cooling component, and the liquid outlet pipe 52 is connected to the liquid outlet of the liquid cooling component.

[0066] During operation, the motherboard unit generates a large amount of heat. The liquid inlet pipe 51 and the liquid outlet pipe 52 are respectively connected to an external coolant circulation device, so that the coolant flows into the liquid cooling assembly through the liquid inlet pipe 51, absorbs the heat of the motherboard unit through heat exchange, and then flows out of the liquid cooling assembly through the liquid outlet pipe 52, carrying the absorbed heat, and finally flows back to the coolant circulation device. As the coolant continuously flows in the circulation path formed by the coolant circulation device, the liquid inlet pipe 51, the liquid cooling assembly, and the liquid outlet pipe 52, it is ensured that there is always coolant flowing into the liquid cooling assembly to exchange heat with the motherboard unit, thereby achieving continuous cooling of the motherboard unit.

[0067] The liquid cooling component may adopt a mature liquid cooling structure in the prior art, such as a liquid cooling plate, a circular tube, etc., and may be flexibly selected according to actual needs.

[0068] Please continue reading Figure 2 and Figure 4 More specifically, in the present application, there are two mainboard units, namely the first mainboard unit 31 and the second mainboard unit 32, the first mainboard unit 31 and the second mainboard unit 32 are arranged side by side, and there are two liquid cooling components, namely the first liquid cooling component 53 and the second liquid cooling component 54, the first liquid cooling component 53 is installed and cooperated with the first mainboard unit 31, and the second liquid cooling component 54 is installed and cooperated with the second mainboard unit 32. The liquid cooling module 50 also includes a first infusion pipe 57, a second infusion pipe 57a, a first return liquid pipe 58, a second return liquid pipe 58a, a first liquid distributor 55 and a second liquid distributor 56.

[0069] The liquid inlet pipe 51 is connected to the first liquid distributor 55, one end of the first liquid infusion pipe 57 and one end of the second liquid infusion pipe 57a are both connected to the first liquid distributor 55, the other end of the first liquid infusion pipe 57 is connected to the first liquid cooling component 53, the other end of the second liquid infusion pipe 57a is connected to the second liquid cooling component 54, one end of the first liquid return pipe 58 is connected to the first liquid cooling component 53, one end of the second liquid return pipe 58a is connected to the second liquid cooling component 54, the other end of the first liquid return pipe 58 and the other end of the second liquid return pipe 58a are both connected to the second liquid distributor 56, and the second liquid distributor 56 is connected to the liquid outlet pipe 52.

[0070] As will be readily understood, the simultaneous configuration of the first motherboard unit 31 and the second motherboard unit 32 can significantly enhance the computing power and data processing capabilities of the server 100. During operation, the first liquid cooling assembly 53 and the second liquid cooling assembly 54 independently and specifically dissipate heat from the first motherboard unit 31 and the second motherboard unit 32, thereby enabling the coolant to promptly remove heat, thereby preventing abnormal temperature rises in the server 100 that could affect operational efficiency and reliability.

[0071] The first liquid infusion pipe 57, the second liquid infusion pipe 57a, the first liquid return pipe 58, the second liquid return pipe 58a, the first liquid distributor 55 and the second liquid distributor 56 realize the parallel connection of the first liquid cooling component 53 and the second liquid cooling component 54, so that only one liquid inlet pipe 51 and one liquid outlet pipe 52 are configured to simultaneously allow coolant to flow into and out of the first liquid cooling component 53 and the second liquid cooling component 54, reducing the number of pipes used, reducing the difficulty of pipe layout and the occupied installation space, reducing the manufacturing cost of the server 100 and helping to achieve a lightweight design.

[0072] The liquid inlet pipe 51 and the liquid outlet pipe 52 are both designed with a quick-release structure. The quick-plug structure design of the liquid inlet pipe 51 and the liquid outlet pipe 52 can be quickly replaced and supports partial pipe replacement, making it easier to produce, process and maintain.

[0073] Optionally, the liquid inlet pipe 51 and the liquid outlet pipe 52 can be designed in any type of manner, such as a hand-insertion quick connector and a blind-insertion quick connector, so as to meet the diverse usage requirements of different customers under different working conditions.

[0074] To improve installation reliability, the liquid inlet pipe 51 and the liquid outlet pipe 52 are fixed to the bottom shell 10 by a configured support. The support and the bottom shell 10 can be installed in at least one of the following ways: screw connection, clamping connection, bonding, magnetic connection, etc., which can be flexibly selected according to actual needs.

[0075] It should be noted that all of the above-mentioned pipelines use rubber tubes, which are convenient for bending and laying pipes, reduce the difficulty of installation, and avoid affecting the flow of coolant in the pipes.

[0076] Please continue reading Figure 4 and Figure 5 In this application, the second functional module 40 includes a power module 41 and a fan module 42. The power module 41 is positioned closer to the first functional module 30 than the fan module 42, allowing the fan module 42 to be positioned at the edge of the bottom housing 10. The power module 41 is positioned closer to the motherboard unit, making it easier to connect wires to power the motherboard unit. The fan module 42 is used to blow air toward heat-generating components such as the power module 41 and the motherboard unit, accelerating air flow and removing the generated heat, thereby achieving air cooling.

[0077] That is, the fan module 42 cooperates with the liquid cooling module 50 to achieve combined air cooling and liquid cooling for the motherboard unit, thereby enhancing the heat dissipation performance.

[0078] In one embodiment, the fan module 42 includes a mounting box 421 and a plurality of fans 422. The mounting box 421 is provided with a plurality of mounting compartments arranged side by side on a side facing away from the power module 41, and the fans 422 are installed in the mounting compartments one by one. The plurality of fans 422 are integrated and installed in the mounting box 421 to achieve a modular design of the fan module 42, facilitating the installation and removal of the fan module 42. Each fan 422 is independently installed in its corresponding mounting compartment, arranged neatly, and not affected by each other. Furthermore, by providing a plurality of fans 422, the amount of air blown toward the motherboard unit per unit time is increased, thereby removing more heat and enhancing the air-cooling effect.

[0079] A positioning member 80 is provided on the mounting box 421 or the bottom housing 10. When in use, the server 100 is installed in a cabinet. A positioning bracket is provided on the busbar protective cover on the cabinet. The positioning bracket has a positioning hole. After the server 100 is pushed into the cabinet, the positioning member 80 automatically inserts into the positioning hole. Simultaneously, the server 100's pins dock with the busbar. The positioning constraint provided by the positioning member 80 and the positioning hole reduces or inhibits relative displacement between the pins and the busbar, effectively alleviating wear on the busbar and thereby improving voltage drop.

[0080] Please continue reading Figure 5 In addition, based on the above embodiment, the fan 422 has a handle 4221, and the liquid inlet pipe 51 and the liquid outlet pipe 52 are both provided with a fastener 90, which is engaged with the handle 4221. By means of the fastener 90 engaging with the handle 4221, the liquid inlet pipe 51 and the liquid outlet pipe 52 can be fastened to the handle 4221, that is, the liquid inlet pipe 51 and the liquid outlet pipe 52 are positioned, while preventing the liquid inlet pipe 51 and the liquid outlet pipe 52 and their joints from being damaged by colliding with other structures.

[0081] Please continue reading Figures 1 to 3 Furthermore, based on any of the above embodiments, the bottom shell 10 is also provided with a third installation area 14, the third installation area 14 is arranged on a side of the first installation area 11 away from the second installation area 12, and a third functional module 90a is arranged in the third installation area 14.

[0082] In addition, a second barrier structure 90 b is provided on the bottom shell 10 , and the second barrier structure 90 b is arranged between the third installation area 14 and the first installation area 11 .

[0083] When liquid leakage occurs in the liquid cooling module 50 , the second barrier structure 90 b is used to prevent the leaked liquid from flowing into the third installation area 14 and contacting the third functional module 90 a to cause damage to the third functional module 90 a .

[0084] For example, the third functional module 90a may include but is not limited to a hard disk module, a front IO module, etc.

[0085] In addition to the above, the present application also provides a cabinet, which includes a cabinet body with an installation cavity formed inside the cabinet body; and multiple servers 100 as described in any of the above embodiments, and the multiple servers 100 are stacked along the height direction of the cabinet body in the installation cavity.

[0086] The cabinet is equipped with an infusion pipeline and a liquid collecting tank. The end of the infusion pipeline away from the liquid collecting tank is connected to the drain port 13, so that the leaked liquid discharged from the drain port 13 in the server 100 can flow into the liquid collecting tank along the infusion pipeline, thereby realizing the safe and centralized recovery of the leaked liquid, so that the subsequent leaked liquid can be centrally processed, and at the same time, the leaked liquid can be prevented from leaking into the cabinet and causing damage to other functional components or electrical components.

[0087] Of course, it is also possible to omit the infusion pipeline and use the leakage discharged from the discharge port 13 to drip directly into the liquid collection tank.

[0088] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A server, characterized in that: include: A bottom shell, the bottom shell being divided into a first installation area and a second installation area, the first installation area being provided with a first functional module, the second installation area being provided with a second functional module, the bottom shell further being provided with a drain port, the drain port being in communication with the first installation area; a liquid cooling module, the liquid cooling module being installed and matched with the first functional module to dissipate heat for the first functional module; as well as a first barrier structure, the first barrier structure being disposed on the bottom shell and separating the first installation area from the second installation area; The bottom shell is further provided with a drainage structure, and the drainage structure is used to guide the leakage generated by the liquid cooling module to flow toward the drain port.

2. The server according to claim 1, wherein: The drainage structure includes a raised structure, and the raised structure is arranged in the first installation area.

3. The server according to claim 1, wherein: The drainage structure includes a raised structure and a sloped surface, both of which are arranged in the first installation area. The sloped surface has a first side and a second side opposite to each other, the height of the first side is greater than the height of the second side, the first side is connected to the raised structure, and the second side is connected to the drain port.

4. The server according to claim 1, wherein: The first barrier structure includes a barrier wall and a first adhesive member, wherein the barrier wall is provided on the bottom shell, the first adhesive member bonds and seals the barrier wall to the bottom shell, and the first adhesive member is arranged in the first installation area or the second installation area; Alternatively, the first partition structure includes a partition wall, a first adhesive and a second adhesive, the partition wall is arranged on the bottom shell, the first adhesive bonds and seals the partition wall to the bottom shell, and is arranged in the first installation area, and the second adhesive bonds and seals the partition wall to the bottom shell, and is arranged in the second installation area.

5. The server according to claim 1, wherein: The first functional module includes a mainboard unit, and the liquid cooling module includes a liquid cooling component, a liquid inlet pipe and a liquid outlet pipe. The liquid cooling module is installed and cooperated with the mainboard unit to dissipate heat from the mainboard unit. The liquid inlet pipe is connected to the liquid inlet of the liquid cooling component, and the liquid outlet pipe is connected to the liquid outlet of the liquid cooling component.

6. The server according to claim 5, wherein: The motherboard units are provided with two and are respectively a first motherboard unit and a second motherboard unit, the first motherboard unit and the second motherboard unit are arranged side by side, the liquid cooling components are provided with two and are respectively a first liquid cooling component and a second liquid cooling component, the first liquid cooling component is installed and matched with the first motherboard unit, and the second liquid cooling component is installed and matched with the second motherboard unit, the liquid cooling module further includes a first infusion pipe, a second infusion pipe, a first return liquid pipe, a second return liquid pipe, a first liquid distributor and a second liquid distributor; The liquid inlet pipe is connected to the first liquid distributor, one end of the first liquid infusion pipe and one end of the second liquid infusion pipe are both connected to the first liquid distributor, the other end of the first liquid infusion pipe is connected to the first liquid cooling assembly, the other end of the second liquid infusion pipe is connected to the second liquid cooling assembly, one end of the first liquid return pipe is connected to the first liquid cooling assembly, one end of the second liquid return pipe is connected to the second liquid cooling assembly, the other end of the first liquid return pipe and the other end of the second liquid return pipe are both connected to the second liquid distributor, and the second liquid distributor is connected to the liquid outlet pipe; Wherein, the liquid inlet pipe and the liquid outlet pipe both adopt a quick-disassembly structure design.

7. The server according to claim 5, wherein: The second functional module includes a power module and a fan module, and the power module is arranged closer to the first functional module than the fan module, so that the fan module is arranged at the edge of the bottom shell; The fan module includes an installation box and multiple fans. The installation box is provided with multiple installation compartments arranged side by side on a side away from the power module. The fans are installed in the installation compartments one by one. A positioning piece is provided on the installation box or the bottom shell.

8. The server according to claim 7, wherein: The fan has a handle, and both the liquid inlet pipe and the liquid outlet pipe are provided with a fastener, which is engaged with the handle.

9. The server according to claim 1, wherein: The bottom shell is further provided with a third installation area, the third installation area is provided on a side of the first installation area away from the second installation area, and a third functional module is provided in the third installation area; A second barrier structure is provided on the bottom shell, and the second barrier structure is arranged between the third installation area and the first installation area.

10. A cabinet, characterized in that: include: A cabinet body, wherein a mounting cavity is formed inside the cabinet body; as well as A plurality of servers according to any one of claims 1 to 9 are stacked in the installation cavity along the height direction of the cabinet.

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