Hard light element damage monitoring method and system, storage medium and computer program product

Abstract

The invention discloses a high-light element damage monitoring method and system, a storage medium and a computer program product, and relates to the technical field of high-energy laser, and the method comprises the steps: starting a laser device to irradiate a to-be-monitored high-light element, the element temperature, the light spot power and the light spot image of the highlight element to be monitored in the irradiation process are acquired through a data acquisition module; generating a light spot analysis diagram, a temperature space distribution diagram and a temperature power time distribution diagram according to the element temperature, the light spot power and the light spot image; and performing damage monitoring on the highlight element to be monitored based on the light spot analysis diagram, the temperature space distribution diagram and the temperature power time distribution diagram. According to the invention, the state of the strong light element under laser irradiation is comprehensively reflected from different angles by simultaneously collecting multiple parameters, and misjudgment or missed judgment possibly caused by single parameter monitoring is avoided, so that the comprehensiveness and accuracy of monitoring are improved.

Description

Technical Field

[0001] The present application relates to the field of high-energy laser technology, and in particular to a method, system, storage medium, and computer program product for monitoring damage to high-intensity light components. Background Art

[0002] High-intensity laser elements are key components in high-energy laser systems. Due to their high manufacturing costs, long processing cycles, and difficulty in testing after system integration, monitoring their performance is crucial. However, current damage monitoring for high-intensity laser elements is mostly limited to a single parameter: temperature. This measurement fails to fully reflect damage characteristics such as beam spot deformation and power fluctuations, making it difficult to accurately determine their real-time status. Furthermore, relying solely on temperature makes it difficult to reveal the synergistic effects of temperature field, beam spot deformation, and power variations, hindering in-depth analysis of damage mechanisms.

[0003] Therefore, how to improve the accuracy and comprehensiveness of the damage status monitoring of strong light components has become an urgent problem to be solved in this application.

[0004] The above content is only used to assist in understanding the technical solution of this application and does not constitute an admission that the above content is prior art. Summary of the Invention

[0005] The main purpose of this application is to provide a method, system, storage medium and computer program product for monitoring damage of strong light components, aiming to improve the accuracy and comprehensiveness of monitoring the damage status of strong light components.

[0006] To achieve the above objectives, the present application proposes a method for monitoring damage to a strong light component, which is applied to a strong light component damage monitoring system. The strong light component damage monitoring system includes a laser, a data acquisition module, and a data analysis module. The method includes: Starting the laser to irradiate the strong light element to be monitored, and collecting the element temperature, spot power and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module; generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image; Damage monitoring is performed on the high-intensity light element to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram.

[0007] In one embodiment, before the step of starting the laser to irradiate the strong light element to be monitored and collecting the element temperature, spot power, and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module, the following steps are further included: Starting the laser according to the preset laser parameters to irradiate the debugging strong light element, and observing the light spot state on the debugging strong light element through a light spot analyzer; A focusing mirror located in front of the laser is adjusted until the light spot state meets a preset light spot quality condition.

[0008] In one embodiment, the data acquisition module includes an infrared thermometer, a spot analyzer provided with an attenuation plate, and an interface-type laser power meter. The step of collecting the component temperature, spot power, and spot image of the high-intensity light component to be monitored during irradiation by the data acquisition module includes: Controlling the infrared thermometer to measure the temperature of the strong light element to be monitored on the central axis of the strong light element to be monitored to obtain the element temperature; Collecting the light spot image of the strong light element to be monitored by the light spot analyzer; The laser power meter on the interface collects the spot power of the strong light element to be monitored.

[0009] In one embodiment, the step of generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image comprises: Performing size calibration on the light spot image according to the photosensitive area and resolution of the light spot analyzer, identifying size parameters of the calibrated light spot image using an image processing algorithm, and extracting light spot intensity distribution data; Comprehensively displaying the size parameters and the spot intensity distribution data on the spot image after identification size calibration to form a spot analysis graph; Mapping the component temperature to a two-dimensional plane where the strong light component to be monitored is located to generate a temperature spatial distribution map; The component temperature and the light spot power are associated with a time axis to generate a temperature-power-time distribution graph.

[0010] In one embodiment, before the step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis graph, the temperature spatial distribution graph, and the temperature-power time distribution graph, the step further includes: Unify the data timestamps of the light spot analysis graph, the temperature space distribution graph, and the temperature power time distribution graph through a time axis linkage control; The light spot analysis diagram, temperature spatial distribution diagram, and temperature power time distribution diagram after the data timestamps are unified are integrated into the same visual interface.

[0011] In one embodiment, the step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis graph, the temperature spatial distribution graph, and the temperature-power time distribution graph includes: Calculating the degree of light spot deformation in the light spot analysis graph based on an ellipse fitting algorithm, and analyzing the degree of matching between the high-temperature area in the temperature spatial distribution graph and the light spot position in the light spot analysis graph; The overall performance status of the high-intensity light element to be monitored is analyzed by comprehensively considering the degree of light spot deformation, the matching degree, and the slope change of the temperature-power-time distribution diagram.

[0012] In one embodiment, after the step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis graph, the temperature spatial distribution graph, and the temperature-power time distribution graph, the step further includes: When any parameter among the component temperature, the light spot power and the light spot image exceeds a preset damage threshold, the laser output of the laser is cut off.

[0013] In addition, to achieve the above-mentioned purpose, the present application also proposes a strong light component damage monitoring system, the strong light component damage monitoring system comprising: Laser, used to irradiate the strong light element to be monitored; A data acquisition module is used to collect the component temperature, spot power and spot image of the strong light component to be monitored during the irradiation process; A data analysis module is used to generate a light spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the light spot power, and the light spot image, and to perform damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram.

[0014] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium. A computer program is stored on the storage medium. When the computer program is executed by the processor, the steps of the high-intensity light element damage monitoring method described above are implemented.

[0015] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program. When the computer program is executed by a processor, it implements the steps of the high-intensity light element damage monitoring method as described above.

[0016] One or more technical solutions proposed in this application have at least the following technical effects: The laser is activated to irradiate the high-intensity light component to be monitored. During the irradiation process, a data acquisition module collects the component temperature, spot power, and spot image of the component to be monitored. A spot analysis graph, a temperature spatial distribution graph, and a temperature-power-time distribution graph are generated based on the component temperature, spot power, and spot image. Damage monitoring of the high-intensity light component to be monitored is performed based on the spot analysis graph, temperature spatial distribution graph, and temperature-power-time distribution graph. Component temperature reflects the thermal effect of laser irradiation on the high-intensity light component, spot power reflects the distribution and transmission efficiency of laser energy on the component surface, and the spot image directly reflects surface damage or internal defects. By simultaneously collecting multiple parameters, the status of the high-intensity light component under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or missed detections that may result from monitoring a single parameter, thereby improving the comprehensiveness and accuracy of monitoring. Combining the spot analysis graph, temperature spatial distribution graph, and temperature-power-time distribution graph for comprehensive damage monitoring of the high-intensity light component to be monitored not only improves the accuracy of damage monitoring but also enhances the reliability of the monitoring system. In summary, through multi-parameter data collection, multi-dimensional data analysis and comprehensive damage monitoring, the limitations of single parameter monitoring can be avoided and the accuracy and comprehensiveness of damage status monitoring of strong light components can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 A flowchart of the first embodiment of the method for monitoring damage to a strong light element provided in this application; Figure 2 A flow chart illustrating a second embodiment of the method for monitoring damage to a strong light element according to the present application; Figure 3 This is the light spot analysis diagram under normal conditions; Figure 4 This is the light spot analysis diagram under slight damage state; Figure 5 This is the light spot analysis diagram under obvious damage state; Figure 6 This is a schematic diagram of the strong light component damage monitoring system for this application; Figure 7 This is a schematic diagram of the overall process of the strong light component damage monitoring method of this application; Figure 8 This is a schematic diagram of the module structure of the strong light element damage monitoring device according to an embodiment of the present application; Figure 9 Schematic diagram of the device structure of the hardware operating environment involved in the strong light element damage monitoring method in the embodiment of the present application.

[0020] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0022] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0023] The main solution of the embodiment of the present application is: start the laser to irradiate the strong light element to be monitored, and collect the element temperature, spot power and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module; generate a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the element temperature, the spot power and the spot image; and monitor the damage of the strong light element to be monitored based on the spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram.

[0024] The embodiments of this application take into account that high-intensity laser elements are key components in high-energy laser systems. Due to their high manufacturing costs, long processing cycles, and difficulty in testing after system integration, monitoring their performance is crucial. However, current damage monitoring for high-intensity laser elements is mostly limited to a single parameter: temperature. This measurement cannot fully reflect damage characteristics such as light spot deformation and power fluctuations, making it difficult to accurately determine the real-time status of high-intensity laser elements. Furthermore, relying solely on temperature makes it difficult to reveal the synergistic effects of temperature fields, light spot deformation, and power variations, hindering in-depth analysis of the damage mechanisms of high-intensity laser elements.

[0025] Therefore, the present application provides a solution, which starts the laser to irradiate the high-intensity light element to be monitored, and collects the element temperature, spot power and spot image of the high-intensity light element to be monitored during the irradiation process through a data acquisition module; generates a spot analysis diagram, a temperature spatial distribution diagram, and a temperature-power-time distribution diagram based on the element temperature, the spot power and the spot image; and performs damage monitoring on the high-intensity light element to be monitored based on the spot analysis diagram, the temperature spatial distribution diagram and the temperature-power-time distribution diagram. The element temperature reflects the thermal effect of the high-intensity light element under laser irradiation, the spot power reflects the distribution and transmission efficiency of the laser energy on the element surface, and the spot image is a direct reflection of the surface damage or internal defects of the element. By simultaneously collecting multiple parameters, the state of the high-intensity light element under laser irradiation is fully reflected from different angles, avoiding the misjudgment or missed judgment that may be caused by single parameter monitoring, thereby improving the comprehensiveness and accuracy of monitoring. Combining the spot analysis diagram, the temperature spatial distribution diagram and the temperature-power-time distribution diagram to perform comprehensive damage monitoring on the high-intensity light element to be monitored not only improves the accuracy of damage monitoring, but also enhances the reliability of the monitoring system. In summary, through multi-parameter data collection, multi-dimensional data analysis and comprehensive damage monitoring, the limitations of single parameter monitoring can be avoided and the accuracy and comprehensiveness of damage status monitoring of strong light components can be improved.

[0026] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program execution capabilities, such as a tablet computer, personal computer, mobile phone, etc., or an electronic device capable of performing the aforementioned functions, such as a strong light component damage monitoring system. This embodiment and the following embodiments will be described below using a strong light component damage monitoring system as an example.

[0027] Based on this, the embodiment of the present application provides a method for monitoring damage of a strong light component, which is applied to a strong light component damage monitoring system. The strong light component damage monitoring system includes a laser, a data acquisition module, and a data analysis module. Figure 1 , Figure 1 This is a flow chart of the first embodiment of the method for monitoring damage to a strong light component of the present application.

[0028] In this embodiment, the strong light component damage monitoring method includes steps S10 to S30: Step S10, starting the laser to irradiate the strong light element to be monitored, and collecting the element temperature, spot power and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module; It should be noted that the data acquisition module is a device used to collect the component temperature, spot power and spot image of the high-light component to be monitored during the irradiation process. The component temperature refers to the temperature change on the surface of the high-light component during laser irradiation, which reflects the thermal effect of the component; the spot power refers to the power distribution of the laser spot on the surface of the component, which reflects the transmission efficiency of the laser energy; the spot image refers to the image formed by the laser spot on the surface of the component, which reflects the characteristics of the spot such as shape, size and intensity distribution.

[0029] The laser used to irradiate the high-intensity light component to be monitored is activated to simulate the operating conditions of an actual laser system and apply laser energy to the component. The laser irradiates the component and collects various parameters of the component in real time during the irradiation process, providing a comprehensive understanding of the component's state changes under the influence of the laser. By collecting component temperature, spot power, and spot images, rich data support can be provided for subsequent damage monitoring.

[0030] For example, in one possible implementation, the laser can be set to continuous or intermittent emission mode to simulate different laser operating conditions, thereby more comprehensively evaluating component performance. The laser can be a 300W highly stable continuous laser with an output center wavelength range of 1080±5nm and a beam quality of 1.1.

[0031] Step S20, generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image; Generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image refers to utilizing the collected data to generate a diagram for intuitively displaying the component status through data processing and analysis.

[0032] Specifically, the light spot analysis diagram refers to a chart that displays the shape, size, intensity distribution and other characteristics of the light spot, which is used to analyze the quality of the light spot and the optical performance of the component; the temperature spatial distribution diagram refers to a chart that displays the surface temperature distribution of the component, which is used to identify local overheating areas; the temperature power time distribution diagram refers to a chart that displays the trend of temperature and power changes over time, which is used to evaluate the stability and damage degree of the component under long-term irradiation.

[0033] For example, in one specific embodiment, the system generates a temperature spatial distribution diagram using component temperature data collected by an infrared thermometer, a temperature-power time distribution diagram using spot power data collected by a power meter, and a spot analysis diagram using spot images collected by a spot analyzer. These diagrams provide detailed references for subsequent damage monitoring. For example, the spot analysis diagram can indicate whether the spot is uniform, the temperature spatial distribution diagram can identify localized overheating areas, and the temperature-power time distribution diagram can analyze the stability of the component under long-term irradiation.

[0034] Step S30 , performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram.

[0035] Damage monitoring involves analyzing data from charts to determine the presence, location, extent, and type of component damage. Spot analysis charts are used to assess the quality of the spot and the optical performance of the component. Temperature spatial distribution charts are used to identify localized overheating areas and assess the risk of thermal damage. Temperature-power-time distribution charts are used to assess component stability and damage under prolonged irradiation.

[0036] For example, in one specific embodiment, the system analyzes the spot analysis graph to detect spot distortion, combines it with the spatial temperature distribution graph to identify abnormal local temperature increases, and then uses the temperature-power-time distribution graph to identify abnormal trends in temperature and power over time. This comprehensive assessment indicates that the component has experienced thermal damage. The system can then automatically stop the laser's light output to protect the component from further damage. This integrated monitoring approach effectively improves the accuracy and comprehensiveness of damage monitoring.

[0037] This embodiment provides a method for monitoring damage to a high-intensity light component. A laser is activated to irradiate a high-intensity light component to be monitored. A data acquisition module collects the component temperature, spot power, and spot image of the high-intensity light component during irradiation. A spot analysis graph, a temperature spatial distribution graph, and a temperature-power-time distribution graph are generated based on the component temperature, spot power, and spot image. Damage monitoring of the high-intensity light component to be monitored is performed based on the spot analysis graph, temperature spatial distribution graph, and temperature-power-time distribution graph. Component temperature reflects the thermal effect of the high-intensity light component under laser irradiation, spot power reflects the distribution and transmission efficiency of laser energy on the component surface, and the spot image directly reflects surface damage or internal defects. By simultaneously collecting multiple parameters, the state of the high-intensity light component under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or missed detections that may result from monitoring a single parameter, thereby improving the comprehensiveness and accuracy of monitoring. Comprehensive damage monitoring of the high-intensity light component to be monitored is performed by combining the spot analysis graph, temperature spatial distribution graph, and temperature-power-time distribution graph, thereby improving the accuracy of damage monitoring and enhancing the reliability of the monitoring system. In summary, through multi-parameter data collection, multi-dimensional data analysis and comprehensive damage monitoring, the limitations of single parameter monitoring can be avoided and the accuracy and comprehensiveness of damage status monitoring of strong light components can be improved.

[0038] In a feasible embodiment, the data acquisition module includes an infrared thermometer, a spot analyzer provided with an attenuation plate, and an interface-type laser power meter. Step S10 may include steps S11 to S13: Step S11, controlling the infrared thermometer to measure the temperature of the strong light component to be monitored on the central axis of the strong light component to be monitored to obtain the component temperature; It should be noted that this embodiment uses a FOTRIC 600C infrared thermometer, model 626CH. Its parameters are as follows: infrared resolution 384*288, temperature measurement range -20°C-2000°C, and temperature measurement accuracy of ±2°C or ±2%. An LT-500-VIS-NIR spot analyzer is used, with the following parameters: wavelength range 300-1100nm, photosensitive area 8.45mmx7mm, resolution 2448*2048, and camera operating mode CMOS global shutter. A Lynk interface laser power meter is used, with the following parameters: wavelength range 190-1100nm, accuracy ±1.0%, maximum measurement power 600W, and response time 1.5s.

[0039] Position the infrared thermometer directly against the surface of the high-intensity component. Use a mechanical bracket to align its central axis with the center of the laser's irradiation area. Use the laser's coaxial red indicator light to assist in optical alignment, ensuring the temperature measurement area covers the laser spot's irradiation range. You can also adjust the thermometer's focal length and measurement range based on the component's size and shape, or modify the collected temperature data based on the ambient temperature to optimize the measurement.

[0040] Exemplarily, the continuous temperature measurement mode of the infrared thermometer is started, and the system synchronously records the temperature field data to generate a two-dimensional temperature matrix for subsequent spatial distribution map rendering.

[0041] Step S12, collecting the light spot image of the strong light element to be monitored by the light spot analyzer; A spot analyzer is used to image and analyze the laser spot after it passes through the high-power light element to be monitored, obtaining information such as the spot's shape, size, and intensity distribution to form a spot image. It should be noted that to protect the spot analyzer's detector from damage by high-power lasers, an attenuation plate can be installed in front of the spot analyzer to reduce the light intensity entering the detector.

[0042] For example, a standard circular spot calibration analyzer is used to fine-tune the adjustable focusing mirror to maintain a spot diameter error of less than ±2%. After the spot analyzer is debugged and calibrated, the beam is split using a spectroscope to ensure that the spot analyzer receives the reflected light signal. The CMOS global shutter mode is then activated, and the spot image is captured at a frequency of 1 Hz. The system automatically locates the centroid of the spot image.

[0043] Step S13: collecting the spot power of the high-intensity light element to be monitored through the interface laser power meter.

[0044] An interface-type laser power meter is used to measure the power of the laser spot after it passes through the high-intensity light element to be monitored, thereby obtaining spot power data. For example, a Lynk-type interface laser power meter is installed in the optical path behind the beam splitter to receive the transmitted light signal. The power meter measures the spot power with a response time of 1.5 seconds and an accuracy of ±1.0%. The collected spot power is transmitted in real time to the work computer via a USB interface.

[0045] In a feasible implementation, step S20 may include steps S21 to S24: Step S21, calibrating the size of the spot image according to the photosensitive area and resolution of the spot analyzer, identifying the size parameters of the calibrated spot image using an image processing algorithm, and extracting spot intensity distribution data; Calibration of the spot image based on the spot analyzer's photosensitive area and resolution involves converting pixel coordinates in the spot image to actual physical dimensions by establishing a mapping relationship between pixels and actual physical dimensions. The goal of calibration is to ensure that the dimensional measurements in the spot image are consistent with the actual dimensions, improving measurement accuracy and reliability.

[0046] Image processing algorithms are used to identify the dimensional parameters of the calibrated spot image and extract the spot intensity distribution data. These dimensional parameters include the X / Y diameter and ellipticity (ratio of the major axis to the minor axis), reflecting the shape and size variations of the spot. The spot intensity distribution data is stored as a grayscale matrix for subsequent analysis of spot energy uniformity. In one possible implementation, an edge detection algorithm (such as the Canny operator) can be used to identify the spot edge and calculate the spot diameter and ellipticity. Simultaneously, a grayscale distribution analysis algorithm is used to extract the spot intensity distribution data. If a local hotspot is detected in the spot, an abnormality flag is triggered, indicating a possible abnormal spot distribution.

[0047] Step S22, comprehensively displaying the size parameters and the light spot intensity distribution data on the light spot image after the recognition size calibration to form a light spot analysis diagram; The spot size parameters and intensity distribution data obtained after size calibration are visually integrated to generate an intuitive spot analysis diagram. This diagram displays pseudo-color overlays of intensity contours, annotates the X / Y diameter values ​​and the ellipticity deviation percentage (e.g., "Ellipticity +12%"), and displays the intensity distribution curve in the image sidebar (with the horizontal axis representing the radial distance of the spot and the vertical axis representing the normalized intensity value). This visualization method intuitively demonstrates the shape, size, and intensity distribution characteristics of the spot, facilitating subsequent damage analysis and judgment.

[0048] In addition, it should be noted that the generation of the spot analysis diagram is not only to intuitively display the characteristics of the spot, but also to provide an important basis for subsequent damage monitoring. For example, when the ellipticity exceeds ±10%, the software automatically marks the abnormal area with a red outline in the diagram, indicating that the deformation of the spot may be caused by component damage. In one possible embodiment, the spot analysis diagram can be generated by dedicated image processing software. The software interface provides a variety of visualization options, and the user can adjust the display parameters as needed, such as color mapping, contour line density, etc. The generated spot analysis diagram can be directly used for deformation judgment, providing an intuitive reference for subsequent damage monitoring.

[0049] Step S23, mapping the component temperature to the two-dimensional plane where the strong light component to be monitored is located to generate a temperature spatial distribution map; Each temperature data point is associated with the physical coordinates of the component to generate a temperature spatial distribution map. The temperature spatial distribution map is presented as a pseudo-color heat map, with colors gradually grading from blue (low temperature) to red (high temperature). The spot outlines from the spot analysis map are superimposed to visually show the match between high temperature areas and spot positions.

[0050] In addition, it should be noted that the generation of the temperature spatial distribution map is intended to reveal the thermal distribution characteristics of the component under laser irradiation, help identify local overheating areas, and judge the risk of thermal damage. In one possible embodiment, by calibrating the field of view of the infrared thermometer and the actual size of the component, a mapping relationship between temperature data points and physical coordinates is established. The generated temperature spatial distribution map can not only display the temperature distribution, but also intuitively reflect the temperature changes through color coding. If it is detected that the high temperature area deviates from the center of the spot by more than 15% of the spot diameter, it is determined to be a thermal diffusion anomaly, indicating that there may be a risk of thermal damage. This temperature visualization method can provide important thermal information for subsequent damage monitoring.

[0051] Step S24 : Correlating the component temperature and the light spot power with the time axis to generate a temperature-power-time distribution graph.

[0052] By unifying the time axis, the temperature data recorded by the infrared thermometer and the spot power data collected by the laser power meter are synchronized and aligned. The system automatically interpolates data points with missing timestamps to generate a dual-axis graph. The upper vertical axis of the graph is temperature (unit: °C), plotting the temperature-time curve; the lower vertical axis is power (unit: W), plotting the power-time curve. The two curves share the same horizontal time coordinate, and the time coordinates of the two curves correspond one-to-one. Preset threshold lines (such as a temperature threshold of 100°C) are annotated in the graph. This time distribution graph clearly demonstrates the temporal trends of temperature and power, providing a basis for analyzing the dynamic performance of components under laser irradiation.

[0053] It should also be noted that the generation of temperature-power-time distribution graphs not only demonstrates the temporal changes in temperature and power but also provides a dynamic analysis tool for damage monitoring. In one possible implementation, when any curve exceeds a preset threshold, the system inserts a red vertical line marker at the corresponding time point and associates the spot analysis graph and temperature spatial distribution graph at that moment to form a complete time-series and spatial damage evolution record. This comprehensive analysis method can help users fully understand the damage evolution process of components during laser irradiation and promptly identify potential damage risks.

[0054] Based on the first embodiment of the present application, the second embodiment of the present application is proposed. In the second embodiment of the present application, the same or similar contents as those in the above-mentioned first embodiment can be referred to the above introduction and will not be repeated hereafter.

[0055] On this basis, please refer to Figure 2 , Figure 2 A flow chart is provided for the second embodiment of the present application. Before step S10, the strong light element damage monitoring method further includes steps S01 to S02: Step S01, starting the laser according to preset laser parameters to irradiate the debugging strong light element, and observing the light spot state on the debugging strong light element through a light spot analyzer; Starting the laser to irradiate the debugging strong light element according to the preset laser parameters means starting the laser according to the preset laser parameters (such as 300W continuous output, wavelength 1080±5nm) to irradiate the strong light element to be debugged. The preset laser parameters refer to the output power, wavelength and other parameters set before the laser is started, which are used to simulate actual working conditions. The debugging strong light element refers to the strong light element used to debug the optical path and parameters before the system is officially used, and its purpose is to ensure the correctness of the optical path and the accuracy of the parameters. Observing the light spot state on the debugging strong light element by means of a light spot analyzer means using a light spot analyzer to capture the light spot image in real time and analyze parameters such as the size, ellipticity and intensity distribution uniformity of the light spot. The light spot state refers to the shape, size, intensity distribution and other characteristics of the light spot on the surface of the debugging strong light element, which reflects the collimation of the optical path and the performance of the element.

[0056] By starting the laser and observing the state of the light spot with a light spot analyzer, the correctness of the optical path and the accuracy of the parameters are ensured. In one possible embodiment, the optical path is first pre-adjusted by the red indicator light (power 200μW) coaxial with the laser to ensure that the center of the light spot coincides with the target point on the surface of the debugging strong light element. The red indicator light is a low-power visible light used to preliminarily adjust the optical path before starting the high-power laser to ensure the accuracy of the light spot position. Subsequently, the light spot image is captured in real time by the light spot analyzer, and the system automatically analyzes the spot size (X / Y diameter error ±0.1mm), ellipticity (major axis / minor axis ratio) and intensity distribution uniformity (grayscale value standard deviation ≤10%). If the edge of the light spot is blurred or the energy concentration area is offset, it is necessary to pause the irradiation and check the collimation of the optical path to ensure that the light spot quality meets the requirements.

[0057] Step S02: adjusting a focusing mirror located in front of the laser until the light spot state meets a preset light spot quality condition.

[0058] By adjusting the adjustable focusing mirror at the laser output, the focus of the beam is altered, ensuring that parameters such as spot size, ellipticity, and intensity distribution uniformity meet preset quality requirements. The focusing mirror is an optical element used to adjust the focus of the beam. Adjusting its position and angle can change the size and shape of the spot. Preset spot quality requirements refer to the standard values ​​for parameters such as spot size, ellipticity, and intensity distribution uniformity, set during the commissioning process, and are used to determine whether the spot meets the requirements.

[0059] By adjusting the focusing lens, the beam spot quality is adjusted to the preset quality conditions, ensuring the optimal state of the optical path. In one possible implementation, the beam focus is adjusted using a fine-tuning knob, and a spot analyzer continuously provides feedback on the spot parameters. The system displays a dynamic curve of the spot size and ellipticity in real time. When the uniformity of the spot intensity distribution reaches the preset conditions (for example, grayscale value standard deviation ≤ 8%), the focusing lens position is locked, completing the debugging. After debugging, the spot stability must be verified by performing five consecutive light outputs to ensure that the spot center offset is less than 3% of the spot diameter to ensure the stability and reliability of the optical path.

[0060] In this embodiment, the laser is activated by presetting laser parameters and observing the beam state with a spot analyzer to ensure optical path accuracy. Adjusting the focusing lens located before the laser until the beam state meets the preset beam quality requirements optimizes parameters such as spot size, ellipticity, and intensity distribution uniformity. Fine-tuning the beam focus using the fine-tuning knob optimizes beam quality, providing reliable optical path conditions for subsequent damage monitoring of high-intensity light components.

[0061] Based on the first embodiment and / or the second embodiment of the present application, the third embodiment of the present application is proposed. In the third embodiment of the present application, the same or similar contents as those in the above embodiments can be referred to the above introduction and will not be repeated hereafter.

[0062] In this embodiment, before step S30, the strong light component damage monitoring method further includes steps A01 and A02: Step A01, unifying the data timestamps of the light spot analysis graph, the temperature spatial distribution graph, and the temperature power time distribution graph through a time axis linkage control; The built-in timeline linkage control of the high-intensity light component damage monitoring system is used to synchronize the data of the spot analyzer, infrared thermometer, and laser power meter with time stamps, aiming to ensure the consistency and relevance of multi-source data in the time dimension. The timeline linkage control is a software function module used to coordinate and synchronize the time information of different data sources, so that data collected from different devices can be integrated and analyzed within a unified time frame. The spot analyzer, infrared thermometer, and laser power meter are responsible for collecting spot images, temperature fields, and spot power data, respectively. The sampling rates of these data may vary. For example, the sampling rate of spot images and temperature data is 1Hz, while the sampling rate of power data is 0.67Hz.

[0063] Specifically, using the laser startup moment as the reference time (T0), the data is interpolated and aligned according to the sampling rate of each device. For example, the data points collected by the power meter every 1.5 seconds are expanded into a 1Hz sequence through linear interpolation to ensure that the three are strictly matched on the same time axis. This interpolation alignment method can effectively solve the problem of data point mismatch caused by different sampling rates, making the data consistent in the time dimension. The timestamp error is controlled within ±10ms, and the clock offset of each device (such as a 50ms delay for the thermometer) is recorded in the software log and automatically compensated during the data analysis phase. This error control and compensation mechanism can further improve the accuracy of data synchronization and ensure the reliability of subsequent analysis.

[0064] Step A02: Integrate the light spot analysis diagram, temperature spatial distribution diagram, and temperature power time distribution diagram with unified data timestamps into a same visualization interface.

[0065] The purpose of integrating the synchronized multi-parameter data into the same visualization interface is to provide users with an intuitive and comprehensive data analysis platform, which is convenient for observing and analyzing the correlation and changes between the spot, temperature and power data. The visualization interface is a window for users to interact with the data. Through reasonable layout and design, complex data can be presented in an intuitive and easy-to-understand way. The interface adopts a split-screen design. The upper half of the screen displays a spot analysis diagram with an elliptical fitting outline and dimension annotations superimposed. The lower left half of the screen displays a pseudo-color thermal map superimposed with the temperature space distribution diagram of the spot position coordinates. The lower right half of the screen displays a temperature power time distribution diagram of the dual vertical axis curve. In addition, the laser parameter setting function module is also superimposed in the visualization interface, specifically including: laser power setting of the laser, laser light emission time setting, laser light emission interval time setting, and number of tests setting.

[0066] For example, the three images are linked through the timeline scroll bar. When the timeline is dragged, the spot image, temperature field and curve are updated synchronously to the corresponding moment. A "superimposition layer" button can also be provided to superimpose the temperature heat map and the spot outline semi-transparently, intuitively showing the correlation between the high temperature area and the spot deformation. This superimposed display method helps to discover the potential connection between temperature changes and spot deformation, and provides richer information for damage analysis. All charts support click interaction. For example, clicking on a high temperature point in the temperature spatial distribution map will pop up an enlarged view of the corresponding area in the spot analysis map at that location. This interactive function enhances the user's ability to explore data, allowing users to gain in-depth understanding of the detailed information of specific data points.

[0067] In this embodiment, the system's built-in timeline linkage control synchronizes data timestamps from the spot analyzer, infrared thermometer, and laser power meter, eliminating inconsistent timestamps and improving the accuracy and reliability of data integration. Integrating synchronized multi-parameter data into a single visualization interface provides users with an intuitive and comprehensive data analysis platform. Users can simultaneously view spot analysis graphs, temperature spatial distribution graphs, and temperature-power time distribution graphs on the same screen, facilitating the observation and analysis of correlations and changes between different parameters.

[0068] Based on the above embodiments of the present application, a fourth embodiment of the present application is proposed. In the fourth embodiment of the present application, the same or similar contents as those of the above embodiments can be referred to the above introduction and will not be repeated hereafter.

[0069] In this embodiment, the step S30 of performing damage monitoring on the to-be-monitored strong light component based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram may include steps S31-S32: Step S31, calculating the degree of light spot deformation in the light spot analysis graph based on an ellipse fitting algorithm, and analyzing the matching degree between the high temperature area in the temperature spatial distribution graph and the light spot position in the light spot analysis graph; The degree of spot deformation in the spot analysis image is quantified using an ellipse fitting algorithm. First, the edge pixels of the spot image are extracted. An optimal ellipse equation is fitted using the least squares method to calculate the ratio of the ellipse's major axis to its minor axis (ellipticity) and the center coordinates. Spot deformation refers to the change in the spot's shape during laser irradiation, typically caused by component damage or thermal effects. The ellipse fitting algorithm quantifies the spot's shape characteristics by fitting the edge pixels of the spot image to an ellipse model. Ellipticity, defined as the ratio of the ellipse's major axis to its minor axis, describes the degree to which the spot's shape deviates from a perfect circle. The center coordinates represent the geometric center of the fitted ellipse.

[0070] For example, refer to Figure 3 , Figure 3The following is a light spot analysis diagram under normal conditions. The light spot analysis diagram under normal conditions is calculated using an ellipse fitting algorithm. The ellipse degree and center coordinates are close to those of a normal circle / ellipse. Figure 4 The light spot analysis diagram in the slightly damaged state and Figure 5 The light spot analysis diagram shown in the obvious damage state shows the calculated ellipticity and the deviation of the center coordinates from the normal circle / ellipse. The basis for distinguishing between minor damage and obvious damage is the degree to which the ellipticity and the center coordinates deviate from the normal circle / ellipse.

[0071] By spatially matching the high-temperature area in the temperature spatial distribution map with the coordinates of the center of the light spot in the light spot analysis map, the offset distance between the center of mass of the high-temperature area and the center of the light spot is calculated. The high-temperature area refers to the area in the temperature spatial distribution map where the temperature is significantly higher than the ambient temperature, which is usually related to the thermal effect caused by laser irradiation. Spatial matching refers to comparing the center of mass position of the high-temperature area with the coordinates of the center of the light spot and calculating the offset distance between the two. If the offset exceeds the preset threshold, which can be set as a percentage of the light spot diameter, it is judged as a thermal diffusion anomaly, and the offset direction and value are marked with a yellow arrow in the temperature distribution map. The matching result is displayed as a percentage, and an alarm is triggered when it is lower than the preset matching threshold. This spatial matching and offset calculation method can effectively identify thermal diffusion anomalies and provide an important basis for damage monitoring.

[0072] Step S32 , analyzing the overall performance status of the high-intensity light element to be monitored by comprehensively considering the degree of light spot deformation, the matching degree, and the slope change of the temperature-power-time distribution diagram.

[0073] Multi-parameter collaborative analysis is performed by combining the degree of spot deformation, temperature matching, and the slope of the temperature-power-time distribution graph. Multi-parameter collaborative analysis combines multiple parameters (such as the degree of spot deformation, temperature matching, temperature rise rate, and power fluctuation) to comprehensively assess the damage state of high-intensity light components. The degree of spot deformation reflects the shape change of the component under laser irradiation, the temperature matching reflects the consistency of the high-temperature area with the spot position, and the slope of the temperature-power-time distribution graph reflects the changing trends of temperature and power over time. By combining these parameters, the degree of component damage can be more accurately determined.

[0074] By setting thresholds and logical conditions, multiple parameters can be collaboratively analyzed. For example, when the spot ellipticity deviation reaches +15%, the high-temperature area matching is less than 80%, and the slope of the temperature-time curve increases sharply (such as 20°C / s), the high-intensity light component is judged to be in a state of obvious damage, the laser output is immediately cut off, and a damage report is generated. The damage report contains quantitative parameters of deformation (such as ellipticity deviation value, high-temperature offset distance), dynamic trends (such as heating rate peak, power fluctuation amplitude) and damage mechanism speculation (such as coating peeling caused by thermal stress). If only a single parameter is abnormal (such as the spot ellipticity deviation is +8% but the temperature matching is 92%), it is marked as a "potential risk" and it is recommended to shorten the monitoring cycle or manually re-inspect. This multi-parameter collaborative analysis method can effectively improve the accuracy and reliability of damage monitoring, and provide strong support for the safe use and maintenance of components.

[0075] In this embodiment, an ellipse fitting algorithm is used to quantify the degree of light spot deformation, enabling precise calculation of the light spot's ellipticity and center coordinates. This method converts light spot deformation into a specific numerical indicator, facilitating subsequent damage assessment. A multi-parameter collaborative analysis, combining the degree of light spot deformation, temperature matching, and the slope of the temperature-power-time distribution graph, enables a more comprehensive assessment of the overall performance of the high-intensity light component. This method avoids potential misjudgments caused by single-parameter analysis and improves the accuracy of damage assessment.

[0076] Based on the above embodiments of the present application, a fifth embodiment of the present application is proposed. In the fifth embodiment of the present application, the same or similar contents as those in the above embodiments can be referred to the above introduction and will not be repeated hereafter.

[0077] In this embodiment, after step S30 of performing damage monitoring on the to-be-monitored strong light component based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram, step S40 is further included: Step S40 : When any parameter among the component temperature, the light spot power, and the light spot image exceeds a preset damage threshold, cutting off the laser output of the laser.

[0078] By real-time monitoring of multiple key parameters, we ensure that measures can be taken quickly when parameters are abnormal to protect the strong light components from further damage. Component temperature refers to the surface temperature of the strong light component under laser irradiation, and its preset damage threshold (such as 200°C) is set according to the heat resistance of the component. Spot power refers to the power of the laser spot, and its preset damage threshold (such as power fluctuation ±5% or power value exceeding 600W) is determined based on the design parameters of the laser system and the tolerance of the component. Spot image parameters include spot ellipticity and edge discontinuity, and its preset damage threshold (such as ellipticity deviation ±10% or edge discontinuity >30%) is set according to the spot quality and component performance requirements.

[0079] In practice, once the component temperature exceeds the preset damage threshold, the system immediately sends a shutdown command to the laser, cutting off continuous laser output. Simultaneously, the system locks the current temperature field data and saves it to a local log file for subsequent analysis.

[0080] For example, for the spot power parameters, if the Lynk laser power meter detects that the instantaneous power fluctuation exceeds the preset damage threshold, an emergency shutdown is also triggered, and the abnormal time point is marked in the temperature-power-time distribution diagram. For the spot image parameters, the spot ellipticity is calculated in real time by the ellipse fitting algorithm. If the deviation exceeds the preset damage threshold or the spot is fragmented, and the edge discontinuity is greater than the preset damage threshold, it is judged as an excessive deformation, and the irradiation is automatically stopped and the current spot analysis diagram is saved. The response delay of all shutdown operations is less than 0.5 seconds, and after shutdown, the light path must be recalibrated by the red indicator light before the experiment can be restarted to ensure the safety of subsequent operations.

[0081] In this embodiment, by real-time monitoring of component temperature, spot power, and spot image parameters, the system can quickly respond by shutting off the laser output if any of these parameters exceeds a preset damage threshold. This rapid response mechanism effectively prevents the high-intensity light component from continuing to operate under abnormal conditions, thereby preventing further damage and significantly reducing the risk of damage to the component under abnormal conditions.

[0082] For example, in order to help understand the implementation process of the strong light element damage monitoring method in the above embodiment of the present application, please refer to Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the strong light component damage monitoring system for this application. Figure 7 This is a schematic diagram of the overall process of the strong light component damage monitoring method of this application.

[0083] like Figure 6 As shown in the figure, the strong light component damage monitoring system mainly includes: a laser 1, an infrared thermometer 2, a spot analyzer 3, an interface-type laser power meter 4, 2 / 3 / 4 together form the data acquisition module, and 5 is the working computer, i.e., the data analysis module. In addition, the strong light component damage monitoring system also includes an adjustable focusing lens 6, a beam splitter 8, and an attenuator 9. 7 represents the strong light component to be tested.

[0084] like Figure 7 As shown in the figure, the overall test is divided into two parts, namely the debugging of the monitoring system and the monitoring of the strong light element. The main process of the debugging part is to first place a strong light element for debugging, adjust the position of the focusing mirror, set the laser parameters and start the laser, and use the light spot analysis system to analyze whether the quality of the light spot on the strong light element meets the requirements. If it does not meet the requirements, the light spot is debugged by fine-tuning the focusing mirror. After meeting the requirements, the position of the focusing mirror is fixed.

[0085] The primary process for monitoring a high-intensity light component involves first securing the component to be monitored, setting its damage threshold, and then configuring the laser parameters and starting the laser. At this point, the infrared thermometer, power meter, and spot analyzer begin recording data, sending it to a computer, where temperature and power curves are displayed. If any parameter exceeds the set damage threshold, the computer sends a stop command to the laser, halting operation and stopping data recording.

[0086] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the strong light element damage monitoring method of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.

[0087] This application also provides a strong light element damage monitoring device, please refer to Figure 8 , the strong light element damage monitoring device includes: The laser module 10 is used to irradiate the strong light element to be monitored; The data acquisition module 20 is used to collect the component temperature, spot power and spot image of the strong light component to be monitored during the irradiation process; The data analysis module 30 is used to generate a light spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the light spot power, and the light spot image, and perform damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram.

[0088] The strong light component damage monitoring device provided in this application utilizes the strong light component damage monitoring method described in the above-mentioned embodiment, and can solve the technical problem of strong light component damage monitoring. Compared with the prior art, the beneficial effects of the strong light component damage monitoring device provided in this application are the same as those of the strong light component damage monitoring method described in the above-mentioned embodiment. The other technical features of the strong light component damage monitoring device provided in this application are the same as those disclosed in the above-mentioned embodiment and are not further described here.

[0089] The present application provides a strong light element damage monitoring device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the strong light element damage monitoring method in the above-mentioned embodiment one.

[0090] Reference below Figure 9, which shows a schematic diagram of the structure of a strong light component damage monitoring device suitable for implementing the embodiments of the present application. The strong light component damage monitoring device in the embodiments of the present application can include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), and in-vehicle terminals (such as in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. Figure 9 The strong light element damage monitoring device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0091] like Figure 9 As shown, the strong light component damage monitoring device may include a processing device 1001 (e.g., a central processing unit, graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in a read-only memory 1002 or programs loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the strong light component damage monitoring device. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems may be connected to the input / output interface 1006: an input device 1007 including, for example, a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; a storage device 1003 including, for example, a magnetic tape or hard disk; and a communication device 1009. The communication device 1009 can allow the strong light component damage monitoring device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows a strong light component damage monitoring device with various systems, it should be understood that it is not required to implement or have all of the systems shown. More or fewer systems may be implemented or have alternatively.

[0092] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a read-only memory 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are performed.

[0093] The strong light component damage monitoring device provided in this application utilizes the strong light component damage monitoring method described in the above-mentioned embodiment to address the technical issues of strong light component damage monitoring. Compared to the prior art, the beneficial effects of the strong light component damage monitoring device provided in this application are the same as those of the strong light component damage monitoring method described in the above-mentioned embodiment. The other technical features of the strong light component damage monitoring device provided in this application are the same as those disclosed in the above-mentioned embodiment and are not further elaborated here.

[0094] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0095] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

[0096] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, a computer program) stored thereon, and the computer-readable program instructions are used to execute the high-intensity light element damage monitoring method in the above-mentioned embodiment.

[0097] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0098] The computer-readable storage medium may be included in the strong light component damage monitoring device; or it may exist independently without being assembled into the strong light component damage monitoring device.

[0099] The above-mentioned computer-readable storage medium carries one or more programs. When the above-mentioned one or more programs are executed by the strong light element damage monitoring device, the strong light element damage monitoring device: starts the laser to irradiate the strong light element to be monitored, and collects the element temperature, spot power and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module; generates a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the element temperature, the spot power and the spot image; and performs damage monitoring on the strong light element to be monitored based on the spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram.

[0100] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0101] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0102] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0103] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned method for monitoring damage to high-intensity light components. This computer-readable storage medium can address the technical issues surrounding monitoring damage to high-intensity light components. Compared to the prior art, the beneficial effects of the computer-readable storage medium provided in this application are similar to those of the method for monitoring damage to high-intensity light components provided in the aforementioned embodiments, and are not further elaborated here.

[0104] The present application also provides a computer program product, comprising a computer program, which implements the steps of the above-mentioned high-intensity light element damage monitoring method when executed by a processor.

[0105] The computer program product provided in this application can solve the technical problem of monitoring damage to strong light components. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the strong light component damage monitoring method provided in the above embodiment, and will not be repeated here.

[0106] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A method for monitoring damage to a strong light component, applied to a strong light component damage monitoring system, characterized in that: The strong light component damage monitoring system includes a laser, a data acquisition module, and a data analysis module. The strong light component damage monitoring method includes: Starting the laser to irradiate the strong light element to be monitored, and collecting the element temperature, spot power and spot image of the strong light element to be monitored during the irradiation process through the data acquisition module; generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image; Damage monitoring is performed on the high-intensity light element to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram.

2. The method for monitoring damage to a strong light component according to claim 1, wherein: Before the step of starting the laser to irradiate the strong light element to be monitored and collecting the element temperature, light spot power and light spot image of the strong light element to be monitored during the irradiation process through the data acquisition module, the following steps are further included: Starting the laser according to the preset laser parameters to irradiate the debugging strong light element, and observing the light spot state on the debugging strong light element through a light spot analyzer; A focusing mirror located in front of the laser is adjusted until the light spot state meets a preset light spot quality condition.

3. The method for monitoring damage to a strong light component according to claim 1, wherein: The data acquisition module includes an infrared thermometer, a spot analyzer provided with an attenuation plate, and an interface-type laser power meter. The step of collecting the component temperature, spot power, and spot image of the high-intensity light component to be monitored during irradiation by the data acquisition module includes: Controlling the infrared thermometer to measure the temperature of the strong light element to be monitored on the central axis of the strong light element to be monitored to obtain the element temperature; Collecting the light spot image of the strong light element to be monitored by the light spot analyzer; The spot power of the high-light element to be monitored is collected by the interface-type laser power meter.

4. The method for monitoring damage to a strong light component according to claim 1, wherein: The step of generating a spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the spot power, and the spot image comprises: Performing size calibration on the light spot image according to the photosensitive area and resolution of the light spot analyzer, identifying size parameters of the calibrated light spot image using an image processing algorithm, and extracting light spot intensity distribution data; Comprehensively displaying the size parameters and the spot intensity distribution data on the spot image after identification size calibration to form a spot analysis graph; Mapping the component temperature to a two-dimensional plane where the strong light component to be monitored is located to generate a temperature spatial distribution map; The component temperature and the light spot power are associated with a time axis to generate a temperature-power-time distribution graph.

5. The method for monitoring damage to a strong light component according to claim 1, wherein: Before the step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram, the following step is further included: Unify the data timestamps of the light spot analysis graph, the temperature space distribution graph, and the temperature power time distribution graph through a time axis linkage control; The light spot analysis diagram, temperature spatial distribution diagram, and temperature power time distribution diagram after the data timestamps are unified are integrated into the same visual interface.

6. The method for monitoring damage to a strong light component according to claim 1, wherein: The step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram comprises: Calculating the degree of light spot deformation in the light spot analysis graph based on an ellipse fitting algorithm, and analyzing the degree of matching between the high-temperature area in the temperature spatial distribution graph and the light spot position in the light spot analysis graph; The overall performance status of the high-intensity light element to be monitored is analyzed by comprehensively considering the degree of light spot deformation, the matching degree, and the slope change of the temperature-power-time distribution diagram.

7. The method for monitoring damage to a strong light component according to claim 1, wherein: After the step of performing damage monitoring on the high-intensity light component to be monitored based on the light spot analysis graph, the temperature spatial distribution graph, and the temperature power time distribution graph, the following step further comprises: When any parameter among the component temperature, the light spot power and the light spot image exceeds a preset damage threshold, the laser output of the laser is cut off.

8. A strong light component damage monitoring system, characterized in that: The strong light element damage monitoring system comprises: Laser, used to irradiate the strong light element to be monitored; A data acquisition module is used to collect the component temperature, spot power and spot image of the strong light component to be monitored during the irradiation process; A data analysis module is used to generate a light spot analysis diagram, a temperature spatial distribution diagram, and a temperature power time distribution diagram according to the component temperature, the light spot power, and the light spot image, and to perform damage monitoring on the high-intensity light component to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram.

9. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the high-intensity light element damage monitoring method according to any one of claims 1 to 7 are implemented.

10. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the method for monitoring damage of a strong light element according to any one of claims 1 to 7 are implemented.

Images