Preparation method and jig of white-light Mini-LED lamp panel

Abstract

The invention provides a preparation method of a white light Mini-LED lamp panel and a jig, and the preparation method of the white light Mini-LED lamp panel comprises the steps that box dam glue is injected into a glue groove in a bearing platform of the jig, the glue groove is in a grid shape which is communicated with one another, the bearing platform is further provided with a plurality of lamp bead containing grooves, and the lamp bead containing grooves are communicated with the box dam glue. A lamp bead accommodating groove is formed in each grid of the colloid groove; pre-curing the box dam glue; a white light Mini-LED circuit board is arranged on the bearing platform of the jig, a plurality of white light Mini-LED lamp beads fixed to the white light Mini-LED circuit board are correspondingly arranged in the lamp bead containing grooves, and the thickness of the white light Mini-LED lamp beads is smaller than the depth of the colloid groove; enabling the white light Mini-LED circuit board to be in contact with the box dam glue; according to the preparation method of the white light Mini-LED lamp panel, provided by the invention, the prepared box dam glue has relatively large thickness under the condition of relatively narrow width, so that the problems of strip-shaped shadow and light crosstalk of the white light Mini-LED lamp panel are solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and specifically to a method and fixture for preparing a white light Mini-LED lamp panel. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. Due to its advantages such as low energy consumption, small size, long life, good stability, fast response, and stable emission wavelength, it has been widely used in lighting, display, medical treatment, optical communication and other fields.

[0003] Taking the display field as an example, the backlight module of the display device usually uses an LED light board as the backlight source. The LED lamp beads used in the white light Mini-LED light board have a smaller size. Therefore, it is possible to integrate more LED lamp beads and improve the distribution density of LED lamp beads. Then, by combining the driving dimming technology, the display device can achieve a more vivid display effect. In addition, because the LED lamp beads used in the white light Mini-LED light board itself have a color conversion layer, it can directly realize the white light emission of the light board. Compared with the combination structure of the blue light Mini LED light board + quantum dot film shown in the Chinese invention patent application CN202111351994.8, the quantum dot film can be omitted, simplifying the backlight module structure.

[0004] However, a higher density of LED beads also makes it more likely for optical crosstalk to occur between adjacent LED beads. To address this, a light-isolating dam is placed around the LED beads, with the height of the dam greater than the light-emitting surface of the LED.

[0005] The thickness of the dam glue directly affects the height of the dam glue. In other words, the height of the dam glue can be adjusted to be greater than the height of the light-emitting surface of the LED lamp beads. However, during the coating process of the dam glue, the thickness and width of the dam glue are in a certain positive proportional relationship. In other words, if the height of the dam glue coated on the circuit board where the LED lamp beads are located is to be increased, the width of the dam glue will also be increased accordingly. Taking the white light Mini-LED light board and the blue light Mini-LED light board as an example, since the LED lamp beads used in the white light Mini-LED light board have their own color conversion layer, the thickness of its LED lamp beads will be greater than the thickness of the LED lamp beads in the blue light Mini-LED light board that do not have a color conversion layer. Accordingly, in the white light Mini-LED light board, the thickness of the dam glue adapted to the LED lamp beads will be thicker and the width will be wider. However, when the width of the dam glue is too wide, the lighting efficiency of the light board will deteriorate, stripe shadows will be generated, and the material cost will increase. Therefore, how to increase the thickness of the dam glue without increasing the width of the dam glue to improve the stripe shadows and light crosstalk problems of the white light Mini-LED light board is an urgent problem that needs to be solved by technical personnel in this field. Summary of the Invention

[0006] The present application provides a method for preparing a white light Mini-LED lamp board, which can effectively solve the problem in the related art that it is difficult to increase the thickness of the dam glue without increasing the width of the dam glue.

[0007] In a first aspect, the present application provides a method for preparing a white light Mini-LED light panel, comprising: Injecting the dam glue into the colloid groove on the supporting platform of the fixture, wherein the colloid groove is in a grid shape that is interconnected, and the supporting platform is also provided with a plurality of lamp bead receiving grooves, and each grid of the colloid groove is provided with a lamp bead receiving groove; Pre-curing the dam glue; Place a white light Mini-LED circuit board on the supporting platform of the fixture, and place a plurality of white light Mini-LED lamp beads fixed on the white light Mini-LED circuit board in the plurality of lamp bead receiving grooves, wherein the thickness of the white light Mini-LED lamp beads is less than the depth of the colloid groove; Bringing the white light Mini-LED circuit board into contact with the dam glue; The dam glue is cured.

[0008] Optionally, before the step of injecting the dam glue into the colloid tank of the jig, the method further includes: spraying a release agent into the colloid tank of the jig.

[0009] Optionally, the step of pre-curing the dam glue includes: heating the dam glue to pre-curing the dam glue, improving the flatness of the dam glue in the colloid tank, and making the surface of the dam glue flush with the surface of the supporting platform of the fixture.

[0010] Optionally, the step of pre-curing the dam glue includes: heating the dam glue to pre-curing the dam glue, improving the flatness of the dam glue in the colloid tank, and making the surface of the dam glue lower than the surface of the supporting platform of the fixture.

[0011] Optionally, in the step of injecting the dam glue into the colloid groove on the supporting platform of the jig, the jig also includes a positioning frame, which is arranged on the surface of the supporting platform and encloses a closed figure, and the closed figure is adapted to the size of the white light Mini-LED circuit board.

[0012] Optionally, the step of heating the dam glue to pre-curing the dam glue includes: using the heating device in the jig to heat the dam glue in a first stage, and the heating temperature is a first temperature; then using the heating device in the jig to heat the dam glue in a second stage, and the heating temperature is a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is lower than the duration of the second stage.

[0013] Optionally, in the step of injecting the dam glue into the colloid tank of the jig, a plurality of vacuum adsorption holes are provided on the supporting platform of the jig, and the number of vacuum adsorption holes in each grid of the colloid tank is the same; the step of bringing the white light Mini-LED circuit board into contact with the dam glue includes: utilizing the vacuum adsorption device in the jig to adsorb and flatten the white light Mini-LED circuit board through the vacuum adsorption holes, and tightly fit it onto the supporting platform, so that the white light Mini-LED circuit board is in contact with the dam glue.

[0014] Optionally, the step of curing the dam glue includes: using a heating device to heat the dam glue in a third stage, the heating temperature is a third temperature, wherein the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

[0015] Optionally, after the step of curing the dam glue, the method further includes: turning off the heating function of the heating device, and after the dam glue cools to a preset temperature, turning off the vacuum adsorption device, and removing the prepared white light Mini-LED lamp board from the fixture.

[0016] In the second aspect, the present application provides a jig, which includes a base, a heating device and a carrying platform stacked in sequence, wherein the carrying platform includes a grid-shaped colloid groove and a plurality of lamp bead accommodating grooves that are interconnected, and a lamp bead accommodating groove is correspondingly arranged in each grid of the grid-shaped colloid groove.

[0017] The present application provides a preparation method and fixture for a white light Mini-LED lamp board, the preparation method of the white light Mini-LED lamp board comprising: injecting dam glue into a colloid groove on a supporting platform of the fixture, wherein the colloid groove is in a grid shape interconnected with each other, and the supporting platform is also provided with a plurality of lamp bead accommodating grooves, and each grid of the colloid groove is provided with a lamp bead accommodating groove; pre-curing the dam glue; setting a white light Mini-LED circuit board on the supporting platform of the fixture, and correspondingly setting a plurality of white light Mini-LED lamp beads fixed on the white light Mini-LED circuit board in a plurality of the lamp bead accommodating grooves, wherein the thickness of the white light Mini-LED lamp beads is less than the depth of the colloid groove; making the white light Mini-LED circuit board contact with the dam glue; and curing the dam glue. The preparation method of the white light Mini-LED lamp board provided in this application can make the prepared dam glue have a larger thickness while having a narrower width, so as to improve the strip shadow and light crosstalk problems of the white light Mini-LED lamp board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0019] Figure 1 A flow chart for preparing white light Mini-LED lamp panels provided in some embodiments of the present application.

[0020] Figure 2 A three-dimensional structural diagram of a fixture for a white light Mini-LED lamp board provided in some embodiments of the present application.

[0021] Figure 3 This is an enlarged view of a local area of ​​the supporting platform of the fixture provided in some embodiments of the present application.

[0022] Figure 4 A schematic structural diagram of the vacuum adsorption device of the jig provided in some embodiments of the present application.

[0023] Figure 5 A side view of a fixture for a white light Mini-LED lamp panel provided in some embodiments of the present application.

[0024] Figure 6This is a schematic structural diagram of the white light Mini-LED module provided in some embodiments of the present application.

[0025] Figure 7 A schematic cross-sectional view of a white light Mini-LED module and dam glue combined in a fixture according to some embodiments of the present application.

[0026] Figure 8 This is a schematic diagram of the structure of the white light Mini-LED lamp panel provided in some embodiments of the present application.

[0027] Description of reference numerals: Base 10; heating device 20; vacuum adsorption device 30; vacuum chamber 31; vacuum interface 32; vacuum pump 33; carrying platform 40; colloid tank 401; lamp bead accommodating tank 402; vacuum adsorption hole 403; positioning frame 50; positioning column 60; dam glue 100; white light Mini-LED module 200; white light Mini-LED circuit board 201; positioning groove 2011; white light Mini-LED lamp bead 202. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0029] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the specified features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0031] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0032] Reference Figure 1 As shown, in the first aspect, an embodiment of the present application provides a method for preparing a white light Mini-LED lamp board, and the method for preparing a white light Mini-LED lamp board includes step S01, step S02, step S03, step S04 and step S05.

[0033] In some embodiments of the present application, step S01, step S02, step S03, step S04 and step S05 are performed sequentially, that is, step S02 is executed after step S01 is completed, step S03 is executed after step S02 is completed, step S04 is executed after step S03 is completed, and step S05 is executed after step S04 is completed.

[0034] In some embodiments of the present application, other process steps may exist between step S01 and step S02, between step S02 and step S03, between step S03 and step S04, and between step S04 and step S05. Taking steps S01 and S02 as an example, after executing step S01, step S02 may be executed directly, or at least one of the other process steps may be executed directly before executing step S02.

[0035] Combine Figures 1 to 8As shown, in some embodiments of the present application, step S01 includes: injecting the dam glue 100 into the colloid tank 401 on the carrier platform 40 of the fixture, wherein the colloid tank 401 is in a grid shape, and the carrier platform 40 is further provided with a plurality of lamp bead accommodating tanks 402, and each grid of the colloid tank 401 is provided with a lamp bead accommodating tank 402; step S02 includes: pre-curing the dam glue 100; step S03 includes: setting the white light Mini-LED circuit board 201 To the supporting platform 40 of the fixture, and the multiple white light Mini-LED lamp beads 202 fixed on the white light Mini-LED circuit board 201 are correspondingly arranged in the multiple lamp bead accommodating grooves 402, wherein the thickness of the white light Mini-LED lamp beads 202 is less than the depth of the colloid groove 401; step S04 includes: making the white light Mini-LED circuit board 201 contact with the dam glue 100; step S05 includes: curing the dam glue 100.

[0036] The preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application utilizes the colloid groove 401 on the supporting platform 40 of the fixture to accommodate the fluid state dam glue 100, and then can limit the fluid state dam glue 100 to a specific width and thickness under the shaping effect of the colloid groove 401, and through the step of curing the dam glue 100, the fluid state dam glue 100 is transformed into a stable dam glue 100 with a specific width and thickness, thereby avoiding the problem of deterioration of the light efficiency of the lamp board due to the excessive width of the dam glue 100 when directly preparing a thicker dam glue 100 that is compatible with the white light Mini-LED lamp beads 202 on the LED circuit board, and reducing the waste of dam glue 100 material and reducing production costs.

[0037] On this basis, the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application is to pre-cure the dam glue 100 before the step of setting the white light Mini-LED circuit board 201 on the supporting platform 40 of the fixture, so that the fluid state dam glue 100 can be fully self-leveled in the interconnected grid-shaped colloid groove 401 through pre-curing, thereby improving the flatness of the dam glue 100 in the colloid groove 401, and improving the high consistency of the dam glue 100 in each area, so that in the subsequent step of contacting the white light Mini-LED circuit board 201 with the dam glue 100, under the premise of controlling various process parameters, the dam glue 100 in each area can be in close contact with the white light Mini-LED circuit board 201, thereby reducing light efficiency loss and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0038] In addition, in the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, the white light Mini-LED circuit board 201 is set on the supporting platform 40 of the jig, and the multiple white light Mini-LED lamp beads 202 fixed on the white light Mini-LED circuit board 201 are correspondingly set in the multiple lamp bead receiving grooves 402. In the step, the white light Mini-LED module 200 composed of the white light Mini-LED circuit board 201 and the multiple white light Mini-LED lamp beads 202 is inverted on the supporting platform 40. Since the multiple white light Mini-LED lamp beads 202 are correspondingly set in the multiple lamp bead receiving grooves 402, the white light Mini-LED lamp beads 202 can be fully protected to prevent the white light Mini-LED lamp beads 202 from being squeezed or contaminated, thereby ensuring the light output effect of the white light Mini-LED lamp board. Moreover, since the thickness of the white light Mini-LED lamp bead 202 is smaller than the depth of the colloid groove 401, the distance between the surface of the dam glue 100 at the bottom of the colloid groove 401 and the white light Mini-LED circuit board 201 can be greater than the distance between the light-emitting surface of the white light Mini-LED lamp bead 202 and the white light Mini-LED circuit board 201. That is, in the white light Mini-LED lamp board prepared subsequently, the height of the dam glue 100 can be greater than the height of the white light Mini-LED lamp bead 202, thereby improving the optical crosstalk problem.

[0039] Secondly, since the white light Mini-LED circuit board 201 is set on the supporting platform 40 of the fixture, and the step of making the white light Mini-LED circuit board 201 contact with the dam glue 100 is located before the step of curing the dam glue 100, the fluidity of the dam glue 100 before curing can be utilized to make the dam glue 100 more fully and closely contact with the white light Mini-LED circuit board 201, further reducing the light efficiency loss and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0040] In some embodiments of the present application, before the step of injecting the dam glue 100 into the colloid tank 401 of the jig, the step further includes: spraying a release agent into the colloid tank 401 of the jig.

[0041] In the preparation method of the white light Mini-LED light board provided in the embodiment of the present application, after completing the step of curing the dam glue 100, the dam glue 100 will be tightly adhered to the white light Mini-LED circuit board 201 of the white light Mini-LED module 200, and the dam glue 100 and the white light Mini-LED module 200 are combined to form a white light Mini-LED light board. At this time, the white light Mini-LED light board needs to be removed from the jig to facilitate the subsequent inspection, packaging and shipment of the white light Mini-LED light board. However, since the dam glue 100 has a certain viscosity, when the dam glue 100 adheres to the inside of the colloid tank 401, it may cause the white light Mini-LED light board to be difficult to separate from the jig. In order to improve this problem, the present application performs the step of spraying a release agent in the colloid tank 401 of the jig before the step of injecting the dam glue 100 into the colloid tank 401 of the jig to form a thin layer of release agent on the inner wall of the colloid tank 401, thereby facilitating the subsequent separation operation of the dam glue 100 and the colloid tank 401.

[0042] In some embodiments of the present application, the thickness of the release agent is a first thickness, the thickness of the white light Mini-LED lamp bead 202 is a second thickness, and the depth of the colloid groove 401 is greater than the sum of the first thickness and the second thickness.

[0043] In the method for preparing a white-light Mini-LED light board provided in an embodiment of the present application, the step of spraying a release agent in the colloid tank 401 of the jig forms a thin layer of release agent on the inner wall of the colloid tank 401. Although the thickness of the release agent is relatively small, it still compresses the space for the dam glue 100 in the colloid tank 401, thereby reducing the thickness of the dam glue 100 and affecting the optical crosstalk effect of the light board. In order to ensure that the height of the dam glue 100 in the subsequently prepared white-light Mini-LED light board is greater than the height of the white-light Mini-LED lamp beads 202, the present application makes the depth of the colloid tank 401 greater than the sum of the thickness of the release agent and the thickness of the white-light Mini-LED lamp beads 202.

[0044] In some embodiments of the present application, the step of pre-curing the dam glue 100 includes: heating the dam glue 100 to pre-curing the dam glue 100, improving the flatness of the dam glue 100 in the colloid tank 401, and making the surface of the dam glue 100 flush with the surface of the supporting platform 40 of the fixture.

[0045] In the preparation method of the white light Mini-LED lamp panel provided in the embodiment of the present application, the pre-curing process is to heat the dam glue 100 to achieve pre-curing. Although the fluidity of the dam glue 100 will decrease at the end of pre-curing, in the early and middle stages of pre-curing, before the temperature of the dam glue 100 reaches the set pre-curing temperature, the fluidity of the dam glue 100 will increase due to heat, so that the dam glue 100 can fully self-level in the colloid tank 401, thereby improving the flatness of the dam glue 100 in the colloid tank 401 and making the surface height of the dam glue 100 in the colloid tank 401 tend to be consistent. On this basis, the present application can control the injection amount of the dam glue 100. For example, based on the volume of the colloid tank 401 and the amount of release agent used, the maximum amount of dam glue 100 to be injected is calculated, and the dam glue 100 is injected into the colloid tank 401 on the supporting platform 40 of the fixture according to the actual injection amount equal to the maximum amount. After the dam glue 100 is fully leveled, the surface of the dam glue 100 is flush with the surface of the supporting platform 40 of the fixture. Since the surface of the dam glue 100 is flush with the surface of the supporting platform 40 of the fixture, the bonding tightness between the dam glue 100 and the white light Mini-LED circuit board 201 can be improved in the subsequent step of bringing the white light Mini-LED circuit board 201 into contact with the dam glue 100, thereby improving the assembly yield, reducing light efficiency loss and light leakage, and improving the light output quality of the white light Mini-LED light board.

[0046] In some embodiments of the present application, the step of pre-curing the dam glue 100 includes: heating the dam glue 100 to pre-curing the dam glue 100, improving the flatness of the dam glue 100 in the colloid tank 401, and making the surface of the dam glue 100 lower than the surface of the supporting platform 40 of the fixture.

[0047] In the preparation method of the white light Mini-LED lamp panel provided in the embodiment of the present application, the pre-curing process is to heat the dam glue 100 to achieve pre-curing. Although the fluidity of the dam glue 100 will decrease at the end of pre-curing, in the early and middle stages of pre-curing, before the temperature of the dam glue 100 reaches the set pre-curing temperature, the fluidity of the dam glue 100 will increase due to heat, so that the dam glue 100 can fully self-level in the colloid tank 401, thereby improving the flatness of the dam glue 100 in the colloid tank 401 and making the surface height of the dam glue 100 in the colloid tank 401 tend to be consistent. On this basis, the present application can control the injection amount of the dam glue 100. For example, based on the volume of the colloid tank 401 and the amount of release agent used, the maximum amount of dam glue 100 to be injected is calculated, and the dam glue 100 is injected into the colloid tank 401 on the jig's supporting platform 40 according to the actual injection amount less than the maximum amount. After the dam glue 100 is fully leveled, the surface of the dam glue 100 is lower than the surface of the jig's supporting platform 40. Since the surface of the dam glue 100 is lower than the surface of the jig's supporting platform 40, the problem of the dam glue 100 overflowing onto the supporting platform 40 due to uncontrollable process factors (such as vibration) and then contaminating the supporting platform 40 and the white light mini-LED lamp beads 202 can be reduced in the subsequent step of placing the white light mini-LED circuit board 201 on the jig's supporting platform 40.

[0048] In addition, in the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, since the actual injection amount of glue is less than the maximum amount, therefore, in the step of injecting the dam glue 100 into the colloid groove 401 on the supporting platform 40 of the fixture, when the fluidity of the dam glue 100 is slightly poor and there are local areas of unevenness in the dam glue 100 in the colloid groove 401, it can be avoided that the dam glue 100 in the local area is too high due to reaching the planned glue amount of the dam glue 100, and the dam glue 100 overflows and contaminates the supporting platform 40.

[0049] An example is given below. When the planned glue amount is equal to the maximum amount of dam glue 100 that needs to be injected, in the step of injecting the dam glue 100 into the colloid tank 401 on the supporting platform 40 of the fixture, since the dam glue 100 has not yet been pre-cured, the dam glue 100 in the colloid tank 401 cannot achieve complete self-leveling and has a low flatness. This will inevitably lead to incomplete filling of the dam glue 100 in the colloid tank 401 in local areas, and further cause the dam glue 100 in the colloid tank 401 in local areas to have to accumulate to a surface higher than the supporting platform 40, thereby causing the dam glue 100 to overflow and contaminate the supporting platform 40. Therefore, the present application can determine that the planned amount of glue itself is less than the maximum amount of the dam glue 100 based on the result that the surface of the dam glue 100 is lower than the surface of the supporting platform 40 of the jig after pre-curing the dam glue 100, and then in the step of injecting the dam glue 100 into the colloid tank 401 on the supporting platform 40 of the jig, the maximum height of the dam glue 100 in the colloid tank 401 can be controlled to be flush with the surface of the supporting platform 40.

[0050] In some embodiments of the present application, in the step of injecting the dam glue 100 into the colloid groove 401 on the supporting platform 40 of the jig, the jig also includes a positioning frame 50, which is arranged on the surface of the supporting platform 40 and encloses a closed figure, and the closed figure is adapted to the size of the white light Mini-LED circuit board 201.

[0051] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, the setting of the positioning frame 50 can, on the one hand, make the alignment of the white light Mini-LED module 200 and the dam glue 100 more precise in the step of setting the white light Mini-LED circuit board 201 on the carrying platform 40 of the jig; on the other hand, the closed positioning frame 50 can also be used to form a negative pressure between the white light Mini-LED circuit board 201 and the carrying platform 40 in the step of setting the white light Mini-LED circuit board 201 on the carrying platform 40 of the jig, thereby allowing the dam glue 100 that is not fully cured and still has a certain fluidity to extend a small distance in the direction close to the white light Mini-LED circuit board 201, thereby being more conducive to the close contact between the dam glue 100 in each area and the white light Mini-LED circuit board 201, thereby reducing the loss of light efficiency and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0052] That is, whether the surface of the dam glue 100 is flush with the surface of the carrying platform 40 of the jig but the white light Mini-LED circuit board 201 is uneven, or the surface of the dam glue 100 is lower than the surface of the carrying platform 40 of the jig, the positioning frame 50 can be used in the step of setting the white light Mini-LED circuit board 201 on the carrying platform 40 of the jig to form a negative pressure between the white light Mini-LED circuit board 201 and the carrying platform 40, so that the dam glue 100 that still has a certain fluidity can extend a small distance in the direction close to the white light Mini-LED circuit board 201, thereby achieving close bonding between the dam glue 100 and the white light Mini-LED circuit board 201.

[0053] In some embodiments of the present application, in the step of heating the dam glue 100 to pre-curing the dam glue 100 and improving the flatness of the dam glue 100 in the colloid tank 401 so that the surface of the dam glue 100 is lower than the surface of the supporting platform 40 of the jig, the height of the surface of the dam glue 100 below the surface of the supporting platform 40 of the jig is a, where 0<a≤50 microns.

[0054] In the method for preparing a white-light mini-LED light board provided in the embodiment of the present application, the applicant discovered in actual research that, although negative pressure can be generated between the white-light mini-LED circuit board 201 and the supporting platform 40 to allow the dam glue 100, which still has a certain degree of fluidity, to extend a small distance toward the white-light mini-LED circuit board 201, when the surface of the dam glue 100 is significantly lower than the surface of the supporting platform 40 of the jig, the negative pressure will not be able to regulate the liquid level of the dam glue 100, thereby causing the dam glue 100 to be difficult to tightly bond with the white-light mini-LED circuit board 201. Therefore, the applicant controls the height of the dam glue 100 surface below the surface of the supporting platform 40 of the jig to within 50 microns to ensure that the negative pressure regulates the liquid level of the dam glue 100 during the step of contacting the white-light mini-LED circuit board 201 with the dam glue 100, thereby improving the reliability and production yield of the white-light mini-LED light board.

[0055] In some embodiments of the present application, during the step of injecting the dam glue 100 into the colloid tank 401 on the jig's carrying platform 40, the jig's carrying platform 40 is further provided with at least one positioning post 60. The positioning post 60 is disposed on the surface of the carrying platform 40 to facilitate positioning the white light Mini-LED circuit board 201 on the carrying platform 40. Optionally, the positioning post 60 is located at a corner of the carrying platform 40. For example, if the jig's carrying platform 40 is rectangular, four positioning posts 60 may be provided on the jig's carrying platform 40, with the four positioning posts 60 being disposed at the four corners of the rectangle.

[0056] In some embodiments of the present application, at least one positioning groove 2011 is provided at a corner position of the white light Mini-LED circuit board 201. The positioning groove 2011 corresponds to the position of the positioning column 60 and is adapted in size to facilitate the alignment and assembly of the white light Mini-LED module 200 and the dam glue 100.

[0057] In some embodiments of the present application, the step of heating the dam glue 100 to pre-curing the dam glue 100 includes: using the heating device 20 in the jig to heat the dam glue 100 in a first stage, and the heating temperature is a first temperature; then using the heating device 20 in the jig to heat the dam glue 100 in a second stage, and the heating temperature is a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is lower than the duration of the second stage.

[0058] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, the method of heating the dam glue 100 is to use the heating device 20 in the jig to perform staged heating on the dam glue 100, so as to first improve the flatness of the dam glue 100 in the colloid tank 401, and then achieve pre-curing of the dam glue 100 in the colloid tank 401.

[0059] Specifically, the heating device 20 is disposed below the carrying platform 40 and can heat the dam glue 100 in the colloid tank 401 in the carrying platform 40 by heat conduction to achieve pre-curing of the dam glue 100 . During the pre-curing process of the dam glue 100, by setting a first stage with a shorter duration and lower temperature and a second stage with a longer duration and higher temperature, the fluidity of the dam glue 100 in the colloid tank 401 can be further increased in the first stage, thereby helping to improve the flatness of the dam glue 100 in the colloid tank 401; and the fluidity of the dam glue 100 in the colloid tank 401 can be reduced in the second stage, thereby helping to improve the morphological stability of the dam glue 100 in the colloid tank 401, so that after this step is completed, the dam glue 100 is fully pre-cured and converted into a semi-solid state, and has a surface morphology with higher flatness, which is convenient for the subsequent assembly and combination of the white light Mini-LED circuit board 201 and the dam glue 100.

[0060] In some embodiments of the present application, the duration of the first stage is 40 seconds to 80 seconds, and the first temperature is 55°C to 65°C; the duration of the second stage is 100 seconds to 140 seconds, and the second temperature is 75°C to 85°C.

[0061] In some embodiments of the present application, in the step of injecting the dam glue 100 into the colloid tank 401 of the jig, a plurality of vacuum adsorption holes 403 are provided on the supporting platform 40 of the jig, and the number of vacuum adsorption holes 403 in each grid of the colloid tank 401 is the same; the step of bringing the white light Mini-LED circuit board 201 into contact with the dam glue 100 includes: utilizing the vacuum adsorption device 30 in the jig to adsorb and flatten the white light Mini-LED circuit board 201 through the vacuum adsorption holes 403, and tightly fit it to the supporting platform 40, so that the white light Mini-LED circuit board 201 is in contact with the dam glue 100.

[0062] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, due to the step of injecting the dam glue 100 into the colloid tank 401 of the jig, a plurality of vacuum adsorption holes 403 are provided on the supporting platform 40 of the jig, and the number of vacuum adsorption holes 403 in each grid of the colloid tank 401 is the same. Therefore, when the vacuum adsorption device 30 in the jig is used to adsorb the white light Mini-LED circuit board 201 arranged on the supporting platform 40 through the vacuum adsorption holes 403, it can ensure that the suction force of the white light Mini-LED circuit board 201 is uniform, thereby improving the flatness of the white light Mini-LED circuit board 201 and improving the problem of loose bonding with the dam glue 100 due to the unevenness of local areas of the white light Mini-LED circuit board 201.

[0063] In addition, it should be noted that, since the dam glue 100 has been pre-cured before the step of using the vacuum adsorption device 30 in the jig to adsorb and flatten the white light Mini-LED circuit board 201 through the vacuum adsorption hole 403, it is possible to avoid the dam glue 100 from being sucked into the vacuum adsorption hole 403 as much as possible.

[0064] In some embodiments of the present application, the white light Mini-LED circuit board 201 can be a hard printed circuit board (full name in English: Printed Circuit Board, abbreviated as: PCB), or a relatively soft flexible circuit board (full name in English: Flexible Printed Circuit, abbreviated as: FPC), a fiberglass board, etc.

[0065] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, when the white light Mini-LED circuit board 201 is a soft flexible circuit board and a glass fiber board, when performing the steps of placing the white light Mini-LED circuit board 201 on the supporting platform 40 of the fixture and making the white light Mini-LED circuit board 201 contact the dam glue 100, wrinkles often appear on the white light Mini-LED circuit board 201, and the wrinkles are difficult to eliminate by pressing, and may even further cause the white light Mini-L If the ED circuit board 201 is damaged, the present application adopts a vacuum adsorption method to make the white light Mini-LED circuit board 201 contact with the dam glue 100, which can not only reduce the damage probability of the white light Mini-LED circuit board 201, but also make the white light Mini-LED circuit board 201 smoother during the vacuum adsorption process, thereby improving the bonding tightness between the white light Mini-LED circuit board 201 and the dam glue 100, improving the light reflection and anti-crosstalk effects of the dam glue 100, and improving the preparation yield of the white light Mini-LED lamp board.

[0066] In some embodiments of the present application, the dam glue 100 is a white wall glue with light reflection function.

[0067] In some embodiments of the present application, the vacuum adsorption device 30 in the fixture includes a vacuum chamber 31 and a vacuum pump 33. The vacuum chamber 31 is arranged below the supporting platform 40 and is connected to the vacuum adsorption hole 403, that is, the vacuum adsorption hole 403 passes through the supporting platform 40; a vacuum interface 32 is provided on the side of the vacuum chamber 31, and the vacuum pump 33 is connected to the vacuum chamber 31 through the vacuum interface 32.

[0068] In some embodiments of the present application, the heating device 20 is disposed on a side of the vacuum chamber 31 away from the carrying platform 40 .

[0069] In some embodiments of the present application, the step of curing the dam glue 100 includes: using a heating device 20 to heat the dam glue 100 in a third stage, the heating temperature is a third temperature, wherein the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

[0070] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, the dam glue 100 is heated for a longer time and at a higher temperature by using a heating device 20, so that the dam glue 100 in contact with the white light Mini-LED circuit board 201 can be converted from a semi-solid state to a fully solid state, thereby forming a stable solid-state dam glue 100 frame structure on the white light Mini-LED circuit board 201, so that the dam glue 100 has a stable anti-crosstalk effect.

[0071] In some embodiments of the present application, the duration of the third stage is 8 to 12 minutes, and the third temperature is 130° C. to 170° C.

[0072] In some embodiments of the present application, in the step of setting the white light Mini-LED circuit board 201 on the supporting platform 40 of the jig, and correspondingly setting the multiple white light Mini-LED lamp beads 202 fixed on the white light Mini-LED circuit board 201 in the multiple lamp bead receiving grooves 402, the heating device 20 can continue to maintain the heating state, and its heating temperature can be equal to the second temperature.

[0073] In some embodiments of the present application, in the step of bringing the white light Mini-LED circuit board 201 into contact with the dam glue 100 , the heating device 20 may continue to maintain a heating state, and its heating temperature may be equal to the second temperature.

[0074] In some embodiments of the present application, after the step of curing the dam glue 100, it also includes: turning off the heating function of the heating device 20, and after the dam glue 100 is cooled to a preset temperature, turning off the vacuum adsorption device 30, and taking the prepared white light Mini-LED lamp board out of the jig.

[0075] In the preparation method of the white light Mini-LED light board provided in the embodiment of the present application, after the step of curing the dam glue 100, the white light Mini-LED light board needs to be removed from the jig to facilitate the subsequent inspection, packaging and shipment of the white light Mini-LED light board. However, the applicant found in the research that in the step of curing the dam glue 100, in order to facilitate the curing of the dam glue 100, the dam glue 100 will be heated to a higher temperature under the heating action of the heating device 20. If the white light Mini-LED light board is directly taken out of the jig without cooling the dam glue 100, the white light Mini-LED circuit board 201 may warp under the thermal stress of the dam glue 100, thereby causing problems such as reduced light efficiency, reduced reliability, and reduced yield of the white light Mini-LED light board. Therefore, after the step of curing the dam glue 100, the present application will continue to keep the vacuum adsorption device 30 in a working state to maintain the surface flatness of the white light Mini-LED circuit board 201. On this basis, the heating function of the heating device 20 is turned off. After the dam glue 100 cools to a preset temperature and eliminates the risk of thermal stress of the dam glue 100 on the white light Mini-LED circuit board 201, the vacuum adsorption device 30 is turned off again, and the prepared white light Mini-LED lamp board is taken out of the jig, thereby ensuring the surface state of the white light Mini-LED circuit board 201 is stable, improving the warping problem caused by thermal stress, and improving the luminous efficiency, reliability and yield of the white light Mini-LED circuit board 201.

[0076] In some embodiments of the present application, the preset temperature is lower than 40° C. Optionally, the preset temperature may be room temperature.

[0077] In some embodiments of the present application, the white light Mini-LED lamp bead 202 includes a stacked blue light LED chip and a color conversion film. The color conversion film has a multi-layer structure and includes a color conversion layer, which can be a phosphor layer or a quantum dot layer. Optionally, the color conversion film is thicker than the blue light LED chip and includes a first transparent protective layer, a second transparent protective layer, and the color conversion layer disposed between the first and second transparent protective layers.

[0078] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, since the white light Mini-LED lamp beads 202 used in the white light Mini-LED lamp board have a structure of stacked blue light LED chips and color conversion films, the white light Mini-LED lamp beads 202 have a thicker thickness, while the conventional Mini-LED light board is a blue light Mini-LED lamp board, and the lamp beads used are blue light Mini-LED lamp beads that do not include color conversion films. That is, when glue is directly dispensed on the white light Mini-LED circuit board 201, when the material of the dam glue 100 remains unchanged, based on the thixotropic properties of the colloid, it is impossible to ensure that the width of the dam glue 100 is the same as the width of the dam glue 100 in the blue light Mini-LED light board, and make the thickness of the dam glue 100 protrude beyond the white light Mini-LED lamp beads 202. That is, the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application can specifically improve the problem that the conventional dam glue 100 dispensing process cannot meet the actual process requirements due to the thick thickness of the Mini-LED lamp beads.

[0079] In a second aspect, an embodiment of the present application provides a jig that can be used in the preparation process of a white light Mini-LED lamp panel.

[0080] Combine Figures 2 to 8 As shown, in some embodiments of the present application, the fixture includes a base 10, a heating device 20 and a carrying platform 40 that are stacked in sequence, wherein the carrying platform 40 includes a grid-shaped colloid groove 401 and a plurality of lamp bead accommodating grooves 402 that are interconnected, and each grid of the grid-shaped colloid groove 401 corresponds to a lamp bead accommodating groove 402.

[0081] In the fixture provided in the embodiment of the present application, the interconnected grid-shaped colloid grooves 401 are used to accommodate the dam glue 100 and realize self-leveling of the dam glue 100, so that the dam glue 100 can have good height consistency, which can improve the problem of excessive thickness of the colloid at the intersection point caused by directly marking and dispensing glue on the circuit board, and improve the problem of point-shaped uneven areas around the intersection point caused by directly dispensing glue on the circuit board; the heating device 20 can heat the dam glue 100 in the colloid groove 401 in the carrying platform 40 to realize pre-curing or curing of the dam glue 100, so that the dam glue 100 in the colloid groove 401 can contact and be fixedly connected with the white light Mini-LED circuit board 201 in the white light Mini-LED module 200.

[0082] In the fixture provided in the embodiment of the present application, the carrying platform 40 can be used to carry the white-light Mini-LED circuit board 201 in the white-light Mini-LED module 200, and the lamp bead receiving grooves 402 can be used to carry the white-light Mini-LED lamp beads 202 in the white-light Mini-LED module 200. Because each grid of the grid-shaped colloid grooves 401 corresponds to a lamp bead receiving groove 402, the dam glue 100 subsequently prepared and formed on the white-light Mini-LED circuit board 201 can form an independent light-emitting space for each white-light Mini-LED lamp bead 202, thereby improving the problem of optical crosstalk.

[0083] In some embodiments of the present application, a plurality of vacuum adsorption holes 403 are provided on the supporting platform 40 of the jig, and the number of vacuum adsorption holes 403 in each grid of the colloid groove 401 is the same. The jig also includes a vacuum adsorption device 30 including a vacuum chamber 31 and a vacuum pump 33. The vacuum chamber 31 is arranged between the supporting platform 40 and the heating device 20 and is connected to the vacuum adsorption holes 403, that is, the vacuum adsorption holes 403 pass through the supporting platform 40; a vacuum interface 32 is provided on the side of the vacuum chamber 31, and the vacuum pump 33 is connected to the vacuum chamber 31 through the vacuum interface 32.

[0084] In the jig provided in the embodiment of the present application, the vacuum adsorption device 30 in the jig can be used to adsorb the white light Mini-LED circuit board 201 set on the carrying platform 40 through the vacuum adsorption hole 403, which can ensure that the suction force is uniform at all parts of the white light Mini-LED circuit board 201, thereby improving the flatness of the white light Mini-LED circuit board 201 and improving the problem of loose bonding with the dam glue 100 caused by the unevenness of local areas of the white light Mini-LED circuit board 201.

[0085] In some embodiments of the present application, the depth of the lamp bead accommodating groove 402 is greater than or equal to the thickness of the white light Mini-LED lamp bead 202 in the white light Mini-LED lamp board.

[0086] In the jig provided in the embodiment of the present application, the depth of the lamp bead accommodating groove 402 is greater than or equal to the thickness of the white light Mini-LED lamp bead 202, so as to avoid the problem of the white light Mini-LED lamp bead 202 being squeezed and damaged when the white light Mini-LED circuit board 201 is set on the supporting platform 40 of the jig.

[0087] In some embodiments of the present application, the depth of the lamp bead accommodating groove 402 is smaller than the depth of the colloid groove 401 .

[0088] In the jig provided in the embodiment of the present application, in the actual preparation process, the depth of the lamp bead accommodating groove 402 is generally similar to the thickness of the white light Mini-LED lamp bead 202. In order to ensure the anti-crosstalk effect of the dam glue 100, it is necessary to make the distance between the dam glue 100 and the white light Mini-LED circuit board 201 greater than the distance between the white light Mini-LED lamp bead 202 and the white light Mini-LED circuit board 201, and then, set the depth of the lamp bead accommodating groove 402 to be less than the depth of the colloid groove 401.

[0089] In some embodiments of the present application, the cross-sectional shape of the colloid groove 401 is arc-shaped, so as to minimize the adhesion risk between the colloid groove 401 and the dam glue 100, save the material of the dam glue 100, and ensure the anti-crosstalk effect of the dam glue 100.

[0090] In some embodiments of the present application, the jig further includes at least one positioning post 60, which is disposed on the surface of the carrying platform 40 to facilitate positioning of the white light Mini-LED circuit board 201 on the carrying platform 40. Correspondingly, the white light Mini-LED circuit board 201 is provided with a positioning groove 2011 adapted to the positioning post 60. Optionally, the positioning post 60 is located at a corner of the carrying platform 40. For example, if the carrying platform 40 of the jig is rectangular, four positioning posts 60 may be provided on the carrying platform 40 of the jig, and the four positioning posts 60 are respectively disposed at the four corners of the rectangle.

[0091] In some embodiments of the present application, the fixture further includes a positioning frame 50 , which is disposed on the surface of the carrying platform 40 and encloses a closed figure that is adapted to the size of the white light Mini-LED circuit board 201 .

[0092] In the preparation method of the white light Mini-LED lamp board provided in the embodiment of the present application, the setting of the positioning frame 50 can, on the one hand, make the alignment of the white light Mini-LED module 200 and the dam glue 100 more precise in the step of setting the white light Mini-LED circuit board 201 on the carrying platform 40 of the jig; on the other hand, the closed positioning frame 50 can also be used to form a negative pressure between the white light Mini-LED circuit board 201 and the carrying platform 40 in the step of setting the white light Mini-LED circuit board 201 on the carrying platform 40 of the jig, thereby allowing the dam glue 100 that is not fully cured and still has a certain fluidity to extend a small distance in the direction close to the white light Mini-LED circuit board 201, thereby being more conducive to the close contact between the dam glue 100 in each area and the white light Mini-LED circuit board 201, thereby reducing the loss of light efficiency and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0093] In summary, the present application provides a preparation method and jig for a white light Mini-LED lamp board, the preparation method of the white light Mini-LED lamp board comprising: injecting dam glue into a colloid groove on a supporting platform of the jig, wherein the colloid groove is in a grid shape interconnected with each other, and a plurality of lamp bead accommodating grooves are also provided on the supporting platform, and one lamp bead accommodating groove is provided in each grid of the colloid groove; pre-curing the dam glue; setting a white light Mini-LED circuit board on the supporting platform of the jig, and correspondingly setting a plurality of white light Mini-LED lamp beads fixed on the white light Mini-LED circuit board in a plurality of the lamp bead accommodating grooves, wherein the thickness of the white light Mini-LED lamp beads is less than the depth of the colloid groove; making the white light Mini-LED circuit board contact with the dam glue; and curing the dam glue. The preparation method of the white light Mini-LED lamp board provided in this application can make the prepared dam glue have a larger thickness while having a narrower width, so as to improve the strip shadow and light crosstalk problems of the white light Mini-LED lamp board.

[0094] The above is a detailed introduction to the preparation method and fixture of a white light Mini-LED lamp board provided in the embodiment of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a white light Mini-LED lamp panel, characterized in that: include: Injecting the dam glue into the colloid groove on the supporting platform of the fixture, wherein the colloid groove is in a grid shape that is interconnected, and the supporting platform is also provided with a plurality of lamp bead receiving grooves, and each grid of the colloid groove is provided with a lamp bead receiving groove; Pre-curing the dam glue; Place a white light Mini-LED circuit board on the supporting platform of the fixture, and place a plurality of white light Mini-LED lamp beads fixed on the white light Mini-LED circuit board in the plurality of lamp bead receiving grooves, wherein the thickness of the white light Mini-LED lamp beads is less than the depth of the colloid groove; Bringing the white light Mini-LED circuit board into contact with the dam glue; The dam glue is cured.

2. The method for preparing a white light Mini-LED lamp panel according to claim 1, characterized in that: Before the step of injecting the dam glue into the colloid tank of the jig, the method further includes spraying a release agent into the colloid tank of the jig.

3. The method for preparing a white light Mini-LED lamp panel according to claim 1, characterized in that: The step of pre-curing the dam glue includes: heating the dam glue to pre-curing the dam glue, improving the flatness of the dam glue in the colloid tank, and making the surface of the dam glue flush with the surface of the supporting platform of the fixture.

4. The method for preparing a white light Mini-LED lamp panel according to claim 1, wherein: The step of pre-curing the dam glue includes: heating the dam glue to pre-curing the dam glue, improving the flatness of the dam glue in the colloid tank, and making the surface of the dam glue lower than the surface of the supporting platform of the fixture.

5. The method for preparing a white light Mini-LED lamp panel according to claim 4, characterized in that: In the step of injecting the dam glue into the colloid groove on the supporting platform of the jig, the jig also includes a positioning frame, which is arranged on the surface of the supporting platform and encloses a closed figure, and the closed figure is adapted to the size of the white light Mini-LED circuit board.

6. The method for preparing a white light Mini-LED lamp panel according to claim 3 or 4, characterized in that: The step of heating the dam glue to pre-curing the dam glue includes: using the heating device in the jig to heat the dam glue in the first stage, and the heating temperature is a first temperature; then using the heating device in the jig to heat the dam glue in the second stage, and the heating temperature is a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is lower than the duration of the second stage.

7. The method for preparing a white light Mini-LED lamp panel according to claim 6, characterized in that: In the step of injecting the dam glue into the colloid tank of the jig, a plurality of vacuum adsorption holes are provided on the supporting platform of the jig, and the number of vacuum adsorption holes in each grid of the colloid tank is the same; the step of bringing the white light Mini-LED circuit board into contact with the dam glue includes: utilizing the vacuum adsorption device in the jig to adsorb and flatten the white light Mini-LED circuit board through the vacuum adsorption holes, and tightly attaching it to the supporting platform, so that the white light Mini-LED circuit board is in contact with the dam glue.

8. The method for preparing a white light Mini-LED lamp panel according to claim 7, characterized in that: The step of curing the dam glue includes: using a heating device to heat the dam glue in a third stage, the heating temperature is a third temperature, wherein the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

9. The method for preparing a white light Mini-LED lamp panel according to claim 7, characterized in that: After the step of curing the dam glue, the method further includes: turning off the heating function of the heating device, and after the dam glue cools to a preset temperature, turning off the vacuum adsorption device, and removing the prepared white light Mini-LED lamp board from the fixture.

10. A fixture, characterized in that: The fixture includes a base, a heating device and a carrying platform stacked in sequence, wherein the carrying platform includes a grid-shaped colloid groove and a plurality of lamp bead accommodating grooves that are interconnected, and a lamp bead accommodating groove is correspondingly arranged in each grid of the grid-shaped colloid groove.

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