Vapor chamber manufacturing process

Abstract

The invention provides a vapor chamber manufacturing process, and relates to the technical field of laser beam processing, and the vapor chamber manufacturing process comprises the following steps: S1, positioning a copper mesh and a lower cover of a vapor chamber, and putting the copper mesh and the lower cover of the vapor chamber into a jig of a laser machine; s2, a laser route of a laser machine is determined, laser etching is carried out, and the copper net and the lower cover of the uniform-temperature plate are bonded together through laser beams; the high temperature emitted by the laser beam changes the roughness of the copper net, and the oxidation effect is achieved. The copper mesh and the lower cover of the vapor chamber are firmly bonded together through laser beams without falling off, and a fixing effect is achieved, so that the copper mesh and the lower cover of the vapor chamber are equivalent to a sintering effect in the prior art; the laser beam is swept on the capillary net, and the emitted high temperature instantaneously changes the roughness of the capillary net, so that the oxidation effect of the original technology is achieved; the time of the laser beam is short, and a single product is expected to be finished within one minute, so that the efficiency is improved, and the production cost is reduced; the temperature difficulty between oxidation and reduction is solved, and the reduction difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the field of laser beam processing technology, in particular to a process for manufacturing a temperature equalizing plate, which is suitable for temperature equalizing plates made of materials such as copper, stainless steel, and copper-steel. Background Art

[0002] The existing manufacturing process of the temperature spreader includes: 1. capillary mesh sintering, the capillary is passed through a high temperature of 500-700℃ for 2 hours to reach the melting point, so that the capillary mesh is bonded to the temperature spreader to generate capillary force, and at the same time the flatness of the temperature spreader meets the requirements; 2. oxidation, the original copper mesh is sealed and baked at a temperature of 200-300℃ for 1 to 2 hours, and a layer of copper oxide will form on the surface of the copper mesh, thereby changing the surface wettability and increasing the surface roughness; 3. The copper oxide on the surface is then reduced through reduction treatment to restore its original performance and appearance, and improve its corrosion resistance, ensuring that the copper mesh can maintain good working condition in various applications.

[0003] The above process has the following problems: sintering and oxidation are time-consuming, and the two process steps take about 8 hours, which is not very timely. Summary of the Invention

[0004] The present invention provides a process for manufacturing a temperature homogenizing plate, which is used to solve the technical problems raised by the above background technology.

[0005] In order to solve the above technical problems, the present invention discloses a process for manufacturing a temperature homogenizing plate, comprising:

[0006] Step S1: Position the copper mesh and the lower cover of the temperature homogenizer and place them in the fixture of the laser machine;

[0007] Step S2: Determine the laser route of the laser machine and perform laser engraving. Use the laser beam to bond the copper mesh to the lower cover of the temperature spreader. The high temperature emitted by the laser beam changes the roughness of the copper mesh, achieving the effect of oxidation.

[0008] Preferably, the material of the temperature equalizing plate is any one of copper, stainless steel, and copper steel.

[0009] Preferably, before step S1, the process further includes: cleaning the copper mesh and the surface of the temperature averaging plate; checking whether the lower cover of the temperature averaging plate is flat, and checking whether the copper mesh and the temperature averaging plate are oxidized.

[0010] Preferably, the laser machine periodically performs a power efficiency evaluation process during the process of repeatedly executing step S2 to determine whether the power efficiency of the laser of the laser machine is normal, and issues an alarm when the power efficiency of the laser of the laser machine is abnormal;

[0011] The power efficiency evaluation process includes:

[0012] Step S201: obtaining the power efficiency of the laser of the laser machine within the latest preset time period before the current time, determining a power efficiency array sorted by time, and determining the latest power efficiency and power efficiency decay rate based on the power efficiency array;

[0013] Step S202: When any one of the following occurs: the latest power efficiency is less than the preset power efficiency, or the power efficiency decay rate is greater than the corresponding preset decay rate, an alarm is issued to indicate that the power efficiency is abnormal.

[0014] Preferably, a welding test process is performed before each batch of copper meshes of the current type and temperature equalizing plates of the current type start to execute step S1 in batches.

[0015] Preferably, the welding test process includes:

[0016] Step S21: obtaining a correlation line between the output power and power density of the laser of the laser machine under standard conditions of the current type of laser machine initially used;

[0017] Step S22: obtaining a target power density range for welding the current type of copper mesh to the current type of temperature vapor chamber, and a target output power range corresponding to the target power density range determined based on a correlation line between the output power and power density of the laser of the laser machine;

[0018] Preferably, when the output power of the laser of the current type of laser machine is the median of the target output power range, the average temperatures of the primary adjacent areas, the secondary adjacent areas, and the tertiary adjacent areas corresponding to the selected route segment of the current type of copper mesh sample and the current type of temperature vapor chamber sample are obtained when the current type of copper mesh sample and the current type of temperature vapor chamber sample are laser welded using the selected route segment in the target welding route under the standard conditions of the current type of laser machine initially used;

[0019] Step S24: obtaining a target oxidation temperature range and a target oxidation time for each area on the copper mesh during the laser welding process between the current type of copper mesh and the current type of temperature averaging plate;

[0020] Step S25: controlling the current laser machine to use the output power of the laser of the current type of laser machine as the median of the target output power range, laser welding the selected route segment of the target welding route of the current copper mesh sample and the current temperature vapor chamber sample, and determining the average temperatures of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area corresponding to the selected route segment through temperature detection;

[0021] Step S26: determining the temperature difference values ​​of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area based on steps S25 and S23;

[0022] Step S27: determining a first correction coefficient based on the temperature difference value obtained in step S26;

[0023] Step S28: When any of the following occurs: the first correction coefficient is greater than the preset correction coefficient, or the average temperature of the first-level adjacent area obtained in step S25 is not within the corresponding target oxidation requirement temperature range, an alarm is issued.

[0024] Preferably, the welding test process further includes:

[0025] Step S29: determining a second correction coefficient based on the most recently acquired power efficiency and power efficiency decay rate;

[0026] Step S210: determining a first welding input power range corresponding to a current batch of copper meshes of a current type and a current type of vapor chamber based on the first correction coefficient and the second correction coefficient; and generating an alarm if the first welding input power range corresponding to the current batch of copper meshes of a current type and a current type of vapor chamber is not within an allowable input power range of the laser of the current laser machine;

[0027] When the first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature-averaging plate has a target welding input power range that overlaps with the allowable input power range of the laser of the current laser machine, when the batch execution of step S2 for the current batch of the current type of copper mesh and the current type of temperature-averaging plate begins, the actual input power of the laser of the current laser machine is controlled to be the minimum value of the target welding input power range.

[0028] Preferably, the method further includes: step S3: dissipating heat from the product obtained in step S2; in said step S3, the product obtained in step S2 is placed in a heat dissipation rack, and all cooling nozzles on the heat dissipation rack spray cooling medium to dissipate heat from the entire surface of the product obtained in step S2.

[0029] Preferably, before each batch of the current type of copper mesh and the current type of temperature vapor chamber starts batch execution of step S3, samples of the current batch of the current type of copper mesh and the current type of temperature vapor chamber welded according to welding requirements are selected to perform a heat dissipation test step.

[0030] Preferably, the heat dissipation test step includes:

[0031] Step S31: performing temperature detection on the surface of the second sample welded with the copper mesh of the current batch and the temperature equalizing plate of the current type according to the welding requirements before cooling;

[0032] and dividing the surface of the second sample into a plurality of different sub-regions according to the temperature detection results, each sub-region being composed of adjacent surfaces, and the standard deviation of the temperature detection values ​​of all temperature detection points in each sub-region being less than a preset standard deviation;

[0033] Step S32: Determine the required cooling flow rate range of the cooling medium at each temperature stage for each surface of each sub-region according to the required cooling rate range for each temperature stage for each surface of each sub-region of the product obtained in step S2, and determine the first cooling flow rate of the cooling medium at each temperature stage for each sub-region; the surface categories include: temperature averaging plate, copper mesh, and weld; the end temperature of each temperature stage for each surface is within a preset temperature range;

[0034] The first cooling flow rate of the cooling medium in the current temperature stage of the current sub-region is: the value with the smallest standard deviation from the median of the cooling flow rate requirement ranges of the cooling medium of all surfaces corresponding to the current sub-region in the current temperature stage;

[0035] Step S33: Obtain the third sample in which the current type of copper mesh and the current type of temperature equalizer are welded according to the welding requirements, and when performing a cooling test at the first flow rate of the cooling medium in each temperature stage of each cooling nozzle, obtain the actual cooling rate of each surface of each sub-area in each temperature stage, and determine the target flow rate of the cooling medium in each temperature stage corresponding to each cooling nozzle.

[0036] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] 1. Through the laser beam, the copper mesh and the lower cover of the temperature homogenizer are firmly bonded together, preventing them from falling off, which plays a fixing role, thus equivalent to the sintering effect of the original technology;

[0039] 2. The laser beam is swept across the capillary mesh, and the high temperature emitted instantly changes the roughness of the capillary mesh, achieving the effect of oxidation of the original technology;

[0040] 3. The laser beam is very fast. The single-piece product is expected to be completed within 1 minute. The original technology sintering + oxidation is expected to take 8-10 hours, and laser engraving can be completed within 1 minute, which improves efficiency and reduces production costs.

[0041] 4. Solve the temperature difficulty between oxidation and reduction, reduce the difficulty of reduction, and prevent excessive reduction from thinning the oxidized capillaries and resulting in poor performance;

[0042] 5. Reduce the production cycle of a single vapor chamber product. The existing technology takes 2-2.5 hours to oxidize, while laser engraving can be completed in an instant. Currently, the processing time of a vapor chamber product for mobile phones is 10 seconds.

[0043] 6. The capillaries of the copper mesh engraved by the beam laser will not change with the temperature, thus reducing the difficulty of restoration. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0045] Figure 1 is a partial flow chart of the process of the present invention;

[0046] Figure 2 is an overall flow chart of the process of the present invention;

[0047] Figure 3 It is an abbreviated overall flow chart of the existing process;

[0048] Figure 4 Parameters of the existing process Figure 1 ;

[0049] Figure 5 Parameters of the existing process Figure 2 ;

[0050] Figure 6 Parameter diagram of the process of the present invention

[0051] Figure 7 This is a schematic diagram of the division of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area of ​​the present invention;

[0052] Figure 8 Schematic diagram of the heat dissipation rack of the present invention.

[0053] In the figure: 1, heat dissipation rack; 2, cooling nozzle; 3, telescopic rod; 4, product obtained in step S2. DETAILED DESCRIPTION

[0054] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0055] In addition, in the present invention, descriptions such as "first" and "second" are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but this must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0056] The present invention provides the following embodiments:

[0057] The manufacturing process of the existing temperature equalizer is as follows: Figure 3 As shown, it includes: etching parts (VC temperature plate etching parts) → fixing copper mesh → capillary mesh sintering → dispensing and positioning (copper solder paste) → brazing → oxidation → reduction → pipe injection → one-time double removal → sealing welding → cutting and leveling → high temperature aging → surface treatment → nitrogen test → performance test → full appearance inspection;

[0058] The capillary mesh sintering includes: placing the capillary mesh on a graphite fixture, covering it with a temperature plate cover, and combining high temperature sintering to bond the capillary mesh and the temperature plate cover together; the capillary mesh sintering parameters are as follows: Figure 4 As shown;

[0059] The oxidation process includes: placing the product on a jig, combining it with high temperature baking to increase the surface roughness; oxidation parameters such as Figure 5 As shown;

[0060] In summary, sintering and oxidation are time-consuming, and the two process steps take about 8 hours. The timeliness is not high, the process risk factor is high, and there are many uncontrollable factors.

[0061] Example 1: This invention provides a process for manufacturing a temperature-vaporizing plate. Figure 1 、 Figure 2 、 Figure 4 、 Figure 6 Shown, including:

[0062] Step S1: Position the copper mesh (capillary mesh) and the lower cover of the temperature equalizer and place them in the fixture of the laser machine;

[0063] Step S2: Determine the laser route of the laser machine (adjust the scanning path, laser time, and laser power), and perform laser engraving. Through the laser beam, the copper mesh and the lower cover of the temperature plate are bonded together (achieving the effect of the original technology sintering). The laser beam is scanned on the capillary mesh of the copper mesh. The high temperature emitted instantly changes the roughness of the capillary mesh, achieving the effect of oxidation. Step 2 can achieve the effect of the original technology sintering and oxidation; laser parameters such as Figure 6 As shown;

[0064] The copper mesh is fixed in the middle area of ​​the lower cover of the temperature spreader, and then the entire copper mesh surface is engraved with a laser and fixed on the surface of the lower cover of the temperature spreader.

[0065] 1. Before welding (laser engraving), check whether the bottom cover of the temperature equalization plate is flat and free of oxidation, dirt, etc.

[0066] 2. Place the lower cover of the heat spreader into the contour welding fixture (the fixture of the laser machine mentioned above), then place the copper mesh on the lower cover of the heat spreader, start the welding button, and start welding.

[0067] Combination principle:

[0068] The copper mesh is fixed in the middle area of ​​the lower cover of the temperature equalizer. Then the entire copper mesh surface is laser engraved and fixed to the surface of the lower cover.

[0069] The vapor chamber is a vacuum cavity with a microstructured inner wall. The capillary network is a key component in its heat conduction cycle. Through processes such as copper powder sintering or copper mesh weaving, a finely pore copper mesh is created, forming the capillary network structure within the vapor chamber. This capillary network acts like a network of tiny pipes, providing channels for coolant return.

[0070] The working principle and beneficial effects of the above technical solution are:

[0071] 1. Through the laser beam, the copper mesh and the lower cover of the temperature homogenizer are firmly bonded together, preventing them from falling off, which plays a fixing role, thus equivalent to the sintering effect of the original technology;

[0072] 2. The laser beam is swept across the capillary mesh, and the high temperature emitted instantly changes the roughness of the capillary mesh, achieving the effect of oxidation of the original technology;

[0073] 3. The laser beam is very fast. The single-piece product is expected to be completed within 1 minute. The original technology sintering + oxidation is expected to take 8-10 hours, and laser engraving can be completed within 1 minute, which improves efficiency and reduces production costs.

[0074] 4. Solve the temperature difficulty between oxidation and reduction, reduce the difficulty of reduction, and prevent excessive reduction from thinning the oxidized capillaries and resulting in poor performance;

[0075] 5. Reduce the production cycle of a single vapor chamber product. The existing technology takes 2-2.5 hours to oxidize, while laser engraving can be completed in an instant. Currently, the processing time of a vapor chamber product for mobile phones is 10 seconds.

[0076] 6. The capillaries of the copper mesh engraved by the beam laser will not change with the temperature, thus reducing the difficulty of restoration.

[0077] Example 2, based on Example 1, the laser machine periodically performs a power efficiency evaluation process during the process of repeatedly executing step S2 to determine whether the power efficiency of the laser of the laser machine is normal, and issues an alarm when the power efficiency of the laser of the laser machine is abnormal.

[0078] The power efficiency evaluation process includes:

[0079] Step S201: obtaining the power efficiency of the laser of the laser machine within the latest preset time period before the current time, determining a power efficiency array sorted by time, and determining the latest power efficiency and power efficiency decay rate based on the power efficiency array;

[0080] Step S202: When any one of the following occurs: the latest power efficiency is less than the preset power efficiency, or the power efficiency decay rate is greater than the corresponding preset decay rate, an alarm is issued to indicate that the power efficiency is abnormal.

[0081] The power efficiency is the ratio of the output power of the laser of the laser machine to the input power of the laser of the laser machine.

[0082] The power efficiency array is: {A1, A1, A3...A i... A n}, A1, A2, A3...A i... A n are the power efficiencies determined for the 1st, 2nd, 3rd, ..., i...nth time within the latest preset time period; n is the total number of power efficiency determinations (based on detection) within the latest preset time period; A1, A2, A3...A i... A n The corresponding times are from small to large (i.e. after A1 is determined, the next determination is A2);

[0083] The power efficiency decay rate is:

[0084] The latest power efficiency is: A n ;

[0085] The beneficial effects of the above technical solution are:

[0086] Periodic power efficiency evaluation can monitor the laser machine multiple times (or in real time) during repeated operation to understand the laser power efficiency status, detect abnormal trends in time, and avoid long-term operation in an abnormal efficiency state;

[0087] When the latest power efficiency is less than the preset power efficiency or the power efficiency decay rate is greater than the corresponding preset decay rate, an alarm will be issued. This can be done before the laser power efficiency deteriorates significantly but before a complete failure occurs, allowing for measures to be taken in advance to reduce production interruption losses caused by sudden failures.

[0088] Timely detection and handling of power efficiency anomalies can keep the laser in a relatively stable and efficient working state, ensuring the overall operational stability of the laser machine and consistency of processing quality. This is especially important for processing tasks that require high laser power accuracy.

[0089] Example 3: Based on Example 1 or 2, a welding test process is performed before each batch of copper meshes of the current type and temperature vapor chambers of the current type start to execute step S1 in batches.

[0090] The welding test process includes:

[0091] Step S21: obtaining a correlation line between the output power and power density of the laser of the laser machine under standard conditions of the current type of laser machine initially used;

[0092] The standard conditions include: the temperature of the key components of the laser machine meets the corresponding standard temperature range; the various performance of the laser machine are qualified; the laser machine is usually equipped with a heat dissipation system to ensure that the temperature meets the requirements;

[0093] This step S21 is a performance test of the entire type of laser machine before it is put into use in batches. The obtained correlation line between the output power and power density of the laser of the laser machine is expressed based on a coordinate system, with the horizontal axis being the output power of the laser of the laser machine and the vertical axis being the power density of the output laser. Based on memory storage, the present invention retrieves the data from the memory during the process of putting any laser of the type of laser machine into use.

[0094] Step S22: obtaining a target power density range for welding the current type of copper mesh to the current type of temperature vapor chamber, and a target output power range corresponding to the target power density range determined based on a correlation line between the output power and power density of the laser of the laser machine;

[0095] The target power density range may be a power density range obtained through testing / experiments that meets the welding requirements (quality and performance requirements) of the current type of copper mesh and the current type of vapor chamber;

[0096] Step S23: obtaining the average temperatures of the primary adjacent areas, the secondary adjacent areas, and the tertiary adjacent areas corresponding to the selected route segment of the current type of copper mesh sample and the current type of heat spreader sample when the output power of the laser of the current type of laser machine is the median of the target output power range under the standard conditions of the current type of laser machine initially used (in fact, the input power of the laser of the current type of laser machine is the median of the target output power range ÷ the power efficiency of the current type of laser machine initially used under the standard conditions);

[0097] In the present invention, the copper mesh sample is divided into multiple areas (such as Figure 7 As shown, Figure 7 A is the selected route segment), where the area directly adjacent to the area where the selected route segment is located is the first-level adjacent area, the area directly adjacent to the first-level adjacent area is the second-level adjacent area, and the others are the third-level adjacent areas;

[0098] The standard conditions are the same as above. Step S23 is to test / experimentally determine the average temperatures of the primary adjacent area, the secondary adjacent area, and the tertiary adjacent area before the current type of copper mesh sample and the current type of temperature plate are batch welded by the current type of laser machine (the appropriate temperature can meet the oxidation requirements);

[0099] Step S24: obtaining a target oxidation temperature range and a target oxidation time for each area on the copper mesh during the laser welding process between the current type of copper mesh and the current type of temperature averaging plate;

[0100] Step S25: Control the current laser machine to use the output power of the laser of the current type of laser machine as the median of the target output power range (in fact, the input power of the current laser machine is the median of the target output power range ÷ the current power efficiency of the current laser machine), and laser weld the selected route segment (the selected route segment is any route segment in the target welding route) in the target welding route of the current copper mesh sample and the current temperature homogenizer sample, and determine the average temperatures of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area corresponding to the selected route segment through temperature detection; the current copper mesh sample belongs to the current type of copper mesh sample; the current temperature homogenizer sample belongs to the current type of temperature homogenizer; and the current laser machine belongs to the current type of laser machine;

[0101] Step S26: determining the temperature difference values ​​of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area based on steps S25 and S23;

[0102] Step S27: determining a first correction coefficient based on the temperature difference value obtained in step S26;

[0103] Step S28: When any of the following occurs: the first correction coefficient is greater than the preset correction coefficient, or the average temperature of the first-level adjacent area obtained in step S25 is not within the corresponding target oxidation requirement temperature range, an alarm is issued.

[0104] The first correction coefficient K is calculated based on the following formula:

[0105] B j The average temperature of the jth adjacent area obtained in step S23; j0 The average temperature of the j-th adjacent area obtained in step S25; is the weight of the j-th level adjacent area (the value is greater than 0 and less than 1; The values ​​can be 0.6, 0.25, and 0.15 respectively);

[0106] The beneficial effects of the above technical solution are:

[0107] By obtaining the correlation line between the laser machine's laser output power and power density (which can be a straight line or a curve), combined with the target power density range for welding the current type of copper mesh and the current type of temperature distribution plate, the corresponding target output power range can be determined, which can accurately match the power of the welding test and ensure the reliability of the welding test.

[0108] The current laser machine performs laser welding on the selected route segment of the target welding route for the current copper mesh sample and the current heat spreader sample. Temperature detection is used to determine the average temperature of the primary, secondary, and tertiary adjacent areas corresponding to the selected route segment. The average temperature of the primary adjacent area is compared with the target oxidation temperature range to effectively monitor the temperature during the welding process. The appropriate temperature meets the oxidation requirement, preventing abnormal temperatures from affecting the oxidation effect and the performance of the weldment, further ensuring welding quality.

[0109] The first correction coefficient is determined based on the temperature difference value obtained from the test, which provides a basis for adjusting the laser power in the subsequent welding process, helps to continuously optimize the welding process parameters, and makes the welding process more scientific and efficient.

[0110] Conduct welding tests before mass production to identify potential problems. If an anomaly is detected during the test using the first correction coefficient and the average temperature of the first-level adjacent area, an alarm can be issued to promptly adjust process parameters or equipment status, avoiding scrap during mass production, reducing production losses, and improving production efficiency.

[0111] By testing the laser machine's performance under standard conditions, you can understand the laser machine's status. This allows for easy comparison during use, allowing you to promptly identify performance changes and providing data support for equipment maintenance and calibration.

[0112] Example 4, based on Example 3, the welding test process further includes:

[0113] Step S29: Determine a second correction coefficient based on the most recently acquired power efficiency and power efficiency decay rate. Specifically, obtain the power efficiency of the laser machine within the most recent preset time period before the current time, determine a power efficiency array sorted by time, and determine the most recent power efficiency and power efficiency decay rate based on the power efficiency array;

[0114] Step S210: determining a first welding input power range corresponding to a current batch of copper meshes of a current type and a current type of vapor chamber based on the first correction coefficient and the second correction coefficient; and generating an alarm if the first welding input power range corresponding to the current batch of copper meshes of a current type and a current type of vapor chamber is not within an allowable input power range of the laser of the current laser machine;

[0115] When the first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature-averaging plate has a target welding input power range that overlaps with the allowable input power range of the laser of the current laser machine, when the batch execution of step S2 for the current batch of the current type of copper mesh and the current type of temperature-averaging plate begins, the actual input power of the laser of the current laser machine is controlled to be the minimum value of the target welding input power range.

[0116] The second correction coefficient W is calculated as follows:

[0117] W=(1-tG2)G1;

[0118] G1 is the latest power efficiency, G2 is the latest power efficiency attenuation rate; t is the theoretical total welding time of the current batch of the current type of copper mesh and the current type of temperature plate.

[0119] The first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature plate P0 is the maximum value of the target output power range determined in step S22; P2 is the median value of the target output power range determined in step S22;

[0120] By using the embodiment of the present invention, the cooling qualification rate of batch cooling is greater than 99.2%;

[0121] The beneficial effects of the above technical solution are:

[0122] The first correction coefficient is determined based on the temperature difference value obtained from the test, and the second correction coefficient is determined based on the latest power efficiency and power efficiency decay rate, so that the welding power adapts to the actual situation of the laser and welding requirements, improves the power control accuracy, and ensures stable welding quality.

[0123] Based on the first correction coefficient and the second correction coefficient, the first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature-averaging plate is determined. Based on the first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature-averaging plate, an alarm coefficient is determined. When the alarm coefficient is less than a preset value (such as 0 or 0.1), an alarm is issued. When the alarm is triggered, a reminder is given to replace other laser machines except the current laser machine, and to repair or replace the laser-related parts of the current laser machine; ensuring the stability of the quality of the batch production of the current batch of the current type of copper mesh and the current type of temperature-averaging plate.

[0124] Example 5, based on any one of Examples 1-4,

[0125] The process also includes: step S3: dissipating heat from the product 4 obtained in step S2; in step S3, the product 4 obtained in step S2 is placed in a heat dissipation rack 1, and all cooling nozzles 2 on the heat dissipation rack 1 spray cooling medium to dissipate heat from the entire surface of the product 4 obtained in step S2. The cooling nozzles 2 can be mounted on the telescopic end of the telescopic rod 3, and the fixed end of the telescopic rod 3 is mounted on the heat dissipation rack 1; specifically, Figure 8 As shown;

[0126] Before each batch of the current type of copper mesh and the current type of temperature spreader starts batch execution of step S3, select the samples of the current batch of the current type of copper mesh and the current type of temperature spreader that have been welded according to the welding requirements (including the second sample and the third sample mentioned below. Because the second sample requires temperature detection, the cooling time may be delayed and the cooling effect cannot be accurately tested, so another sample is selected for testing) to perform the heat dissipation test step.

[0127] Among them, the same type of copper mesh and the same type of temperature plate welded according to welding requirements can also determine the following target flow rate based on only one heat dissipation test step;

[0128] The thermal testing steps include:

[0129] Step S31: performing temperature detection on the surface of the second sample welded to the current type of copper mesh and the current type of temperature absorbing plate according to the welding requirements before cooling; the existing temperature detection method can be used;

[0130] The surface of the second sample (the surface that can be directly swept by the cooling medium) is divided into a number of different sub-regions based on the temperature detection results, each sub-region is composed of adjacent surfaces, and the standard deviation of the temperature detection values ​​of all temperature detection points in each sub-region (based on the existing technology) is less than a preset standard deviation (preset based on product accuracy requirements);

[0131] Step S32: Determine the required cooling flow rate range of the cooling medium at each temperature stage corresponding to each surface of each sub-region of the product 4 obtained in step S2 based on the required cooling rate range for each temperature stage corresponding to each surface of each sub-region (the required cooling flow rate range of the cooling medium at each temperature stage corresponding to each surface of each sub-region is determined in combination with the required cooling rate range for each temperature stage corresponding to each surface of each sub-region and the heat dissipation model, which may be based on the existing heat dissipation model), and determine the first cooling flow rate of the cooling medium at each temperature stage corresponding to each sub-region; the surface categories include: temperature distribution plate, copper mesh, and weld; the end temperature of each temperature stage of each surface is within a preset temperature range;

[0132] The first cooling flow rate of the cooling medium in the current temperature stage of the current sub-region is: within the maximum cooling flow rate requirement range of the cooling flow rate requirement range corresponding to all surfaces of the current sub-region at the current temperature stage, the value having the smallest standard deviation from the median of the cooling flow rate requirement range of the cooling medium of other surfaces (all surfaces in the current sub-region except for the surfaces within the maximum cooling flow rate requirement range of the cooling flow rate requirement range of the cooling medium);

[0133]

[0134] D c 、M c 、m c are respectively the surface area of ​​the cth surface of the current sub-region, the specific heat capacity of the cth surface of the current sub-region, and the mass of the cth surface of the current sub-region (for example, if the cth surface of the current sub-region is the exposed surface of the vapor chamber, the mass is the area of ​​the vapor chamber corresponding to the exposed surface multiplied by the mass corresponding to the thickness); T c 、T 01 are the initial temperature of the current temperature stage of the cth surface of the current sub-region (the first temperature stage is based on the detection in step S31; the other temperature stages are the median of the preset temperature range corresponding to the end temperature of the previous temperature stage) and the temperature of the cooling medium (fixed); H C1 The minimum value of the required cooling flow rate of the cooling medium at the current temperature stage of the cth surface in the current sub-region; H C2 is the maximum value of the cooling flow rate requirement range of the cooling medium at the current temperature stage of the cth surface in the current sub-region; μ is the dynamic viscosity of the cooling medium; P r is the Prandtl number of the cooling medium; τ is the thermal conductivity of the cooling medium; is the Reynolds number (L is the characteristic length, which can be the outlet diameter of the cooling nozzle 2); v c1 、v c2is the minimum and maximum value of the required cooling flow rate range of the cooling medium at the current temperature stage of the c-th surface of the current sub-region;

[0135] Step S33: Obtain a third sample welded between the current type of copper mesh and the current type of temperature vapor chamber according to the welding requirements, and perform a cooling test at the first flow rate of the cooling medium in each temperature stage of each cooling nozzle 2. The actual cooling rate of each surface of each sub-area in each temperature stage is obtained (the first difference between the average temperature detected at the beginning of the temperature stage and the average temperature detected at the end of the temperature stage is divided by the cooling time of the temperature stage to obtain the corresponding actual cooling rate), and determine the target flow rate of the cooling medium in each temperature stage corresponding to each cooling nozzle 2.

[0136] If the actual cooling rate of each surface of all sub-regions corresponding to the current cooling nozzle 2 at the current temperature stage is within the corresponding cooling rate requirement range, the first flow rate of the cooling medium at the current temperature stage of the current cooling nozzle 2 is determined as the target flow rate of the cooling medium at the current temperature stage of the current cooling nozzle 2;

[0137] When it is impossible to determine that the first flow rate of the cooling medium in the current temperature stage of the current cooling nozzle 2 is the target flow rate of the cooling medium in the current temperature stage of the current cooling nozzle 2, the second flow rate of the cooling medium in the current temperature stage of the current cooling nozzle 2 is determined according to the actual cooling rate of each surface of each sub-region of the current cooling nozzle 2 in the current temperature stage and the required cooling rate range of each surface of each sub-region in the current temperature stage, and the second flow rate of the cooling medium in the current temperature stage of the current cooling nozzle 2 is determined as the target flow rate of the cooling medium in the current temperature stage of the current cooling nozzle 2;

[0138]

[0139] Wherein, Z is the first flow rate of the cooling medium of the current cooling nozzle 2 at the current temperature stage; Y is the second flow rate of the cooling medium of the current cooling nozzle 2 at the current temperature stage; Q is the total number of sub-areas corresponding to the current cooling nozzle 2; U g is the average value of the correction coefficients of all surfaces of the g-th sub-region corresponding to the current cooling nozzle 2 at the current temperature stage;

[0140] The correction factor for the current temperature segment of the current surface of the current sub-region is: the actual cooling rate of the current temperature segment of the current surface of the current sub-region divided by (the average of the median and maximum values ​​of the required cooling rate range of the current temperature segment of the current surface of the current sub-region);

[0141] When the current batch of the current type of copper mesh and the current type of temperature equalizer start to batch execute step S3, each cooling nozzle 2 is controlled to cool the product 4 obtained in step S2 of each current batch of the current type of copper mesh and the current type of temperature equalizer at the target flow rate of the cooling medium corresponding to each temperature stage.

[0142] The beneficial effects of the above technical solution are:

[0143] By measuring the surface temperature of product 4 obtained in step S2, the temperature standard deviation is used to divide the product into different sub-regions. The required cooling medium flow rate range and the first cooling flow rate are determined based on the cooling rate requirements for each surface and each temperature stage in each sub-region. This allows precise control of the cooling medium flow rate based on the heat dissipation requirements of different parts of the product, avoiding local overheating or overcooling, ensuring uniform heat dissipation, safeguarding the quality of the product after welding, and reducing problems such as deformation and stress concentration caused by uneven heat dissipation.

[0144] The rationality of the first cooling flow rate is determined by cooling test samples. The target flow rate is then determined by comparing the actual cooling rate with the required cooling rate range. This approach, based on actual testing and data comparison, makes the flow rate setting of cooling nozzle 2 more scientific and reasonable, better meeting the product's heat dissipation process requirements, improving the reliability of the heat dissipation effect, and ensuring the high quality and stability of each batch of products.

[0145] Conducting heat dissipation tests on prototypes before mass production can identify potential heat dissipation issues, such as substandard cooling rates. Timely adjustments to the cooling nozzle 2 flow rate parameters can prevent heat dissipation defects in mass production, reduce scrap rates, improve production efficiency, and lower production costs.

[0146] This solution can flexibly adjust heat dissipation parameters based on the welding requirements of different types of copper mesh and vapor chambers, as well as the characteristics of various product parts (such as the different surfaces of the vapor chamber, copper mesh, and welds). This solution can adapt to the heat dissipation requirements of various products, improving the versatility and flexibility of the process.

[0147] By adopting step S3 of the present invention, the cooling qualification rate of batch cooling is greater than 99.3%.

[0148] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A process for manufacturing a temperature-vaporizing plate, characterized in that: include: Step S1: Position the copper mesh and the lower cover of the temperature homogenizer and place them in the fixture of the laser machine; Step S2: Determine the laser route of the laser machine and perform laser engraving. Use the laser beam to bond the copper mesh to the lower cover of the temperature spreader. The high temperature emitted by the laser beam changes the roughness of the copper mesh, achieving the effect of oxidation.

2. The process for manufacturing a temperature vapor chamber according to claim 1, wherein: The material of the temperature equalizing plate is any one of copper, stainless steel, and copper steel.

3. The process for manufacturing a temperature vapor chamber according to claim 1, wherein: Before step S1, the method further includes: cleaning the copper mesh and the surface of the temperature averaging plate; checking whether the lower cover of the temperature averaging plate is flat, and checking whether the copper mesh and the temperature averaging plate are oxidized.

4. The process for manufacturing a temperature vapor chamber according to claim 1, wherein: The laser machine repeatedly performs step S2; periodically performs a power efficiency evaluation process to determine whether the power efficiency of the laser of the laser machine is normal, and issues an alarm when the power efficiency of the laser of the laser machine is abnormal; The power efficiency evaluation process includes: Step S201: obtaining the power efficiency of the laser of the laser machine within the latest preset time period before the current time, determining a power efficiency array sorted by time, and determining the latest power efficiency and power efficiency decay rate based on the power efficiency array; Step S202: When any one of the following occurs: the latest power efficiency is less than the preset power efficiency, or the power efficiency decay rate is greater than the corresponding preset decay rate, an alarm is issued to indicate that the power efficiency is abnormal.

5. The process for manufacturing a temperature vapor chamber according to claim 1, wherein: Before each batch of copper meshes of the current type and temperature vapor chambers of the current type start to execute step S1 in batches, a welding test process is performed.

6. The process for manufacturing a temperature vapor chamber according to claim 5, wherein: The welding test process includes: Step S21: obtaining a correlation line between the output power and power density of the laser of the laser machine under standard conditions of the current type of laser machine initially used; Step S22: obtaining a target power density range for welding the current type of copper mesh to the current type of temperature vapor chamber, and a target output power range corresponding to the target power density range determined based on a correlation line between the output power and power density of the laser of the laser machine; Step S23: obtaining the average temperatures of the primary adjacent areas, the secondary adjacent areas, and the tertiary adjacent areas corresponding to the selected route segment of the current type of copper mesh sample and the current type of temperature vapor chamber sample when the current type of copper mesh sample and the current type of temperature vapor chamber sample are laser welded along the selected route segment in the target welding route under the standard conditions of the current type of laser machine initially used, when the output power of the laser of the current type of laser machine is the median of the target output power range; Step S24: obtaining a target oxidation temperature range and a target oxidation time for each area on the copper mesh during the laser welding process between the current type of copper mesh and the current type of temperature averaging plate; Step S25: controlling the current laser machine to use the output power of the laser of the current type of laser machine as the median of the target output power range, laser welding the selected route segment of the target welding route of the current copper mesh sample and the current temperature vapor chamber sample, and determining the average temperatures of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area corresponding to the selected route segment through temperature detection; Step S26: determining the temperature difference values ​​of the first-level adjacent area, the second-level adjacent area, and the third-level adjacent area based on steps S25 and S23; Step S27: determining a first correction coefficient based on the temperature difference value obtained in step S26; Step S28: When any of the following occurs: the first correction coefficient is greater than the preset correction coefficient, or the average temperature of the first-level adjacent area obtained in step S25 is not within the corresponding target oxidation requirement temperature range, an alarm is issued.

7. The process for manufacturing a temperature vapor chamber according to claim 6, wherein: The welding test process also includes: Step S29: determining a second correction coefficient based on the most recently acquired power efficiency and power efficiency decay rate; Step S210: determining a first welding input power range corresponding to a current batch of copper meshes of a current type and a current type of vapor chamber based on the first correction coefficient and the second correction coefficient; and generating an alarm if the first welding input power range corresponding to the current batch of copper meshes of a current type and a current type of vapor chamber is not within an allowable input power range of the laser of the current laser machine; When the first welding input power range corresponding to the current batch of the current type of copper mesh and the current type of temperature-averaging plate has a target welding input power range that overlaps with the allowable input power range of the laser of the current laser machine, when the batch execution of step S2 for the current batch of the current type of copper mesh and the current type of temperature-averaging plate begins, the actual input power of the laser of the current laser machine is controlled to be the minimum value of the target welding input power range.

8. The process for manufacturing a temperature vapor chamber according to claim 1, wherein: Also includes: Step S3: dissipating heat from the product (4) obtained in step S2; in step S3, the product (4) obtained in step S2 is placed in a heat dissipation rack (1), and all cooling nozzles (2) on the heat dissipation rack (1) spray cooling medium to dissipate heat from the entire surface of the product (4) obtained in step S2.

9. The process for manufacturing a temperature vapor chamber according to claim 8, wherein: Before each batch of the current type of copper mesh and the current type of temperature vapor chamber starts to batch execute step S3, the samples of the current batch of the current type of copper mesh and the current type of temperature vapor chamber welded according to the welding requirements are selected to perform the heat dissipation test step.

10. The process for manufacturing a temperature vapor chamber according to claim 9, wherein: The thermal testing steps include: Step S31: performing temperature detection on the surface of the second sample welded with the copper mesh of the current batch and the temperature equalizing plate of the current batch according to the welding requirements before cooling; and dividing the surface of the second sample into a plurality of different sub-regions according to the temperature detection results, each sub-region being composed of adjacent surfaces, and the standard deviation of the temperature detection values ​​of all temperature detection points in each sub-region being less than a preset standard deviation; Step S32: determining a required cooling flow rate range of the cooling medium at each temperature stage corresponding to each surface of each sub-region of the product (4) obtained in step S2, and determining a first cooling flow rate of the cooling medium at each temperature stage corresponding to each sub-region; the surface categories include: a temperature homogenizer, a copper mesh, and a weld; and the end temperature of each temperature stage of each surface is within a preset temperature range; The first cooling flow rate of the cooling medium in the current temperature stage of the current sub-region is: the value with the smallest standard deviation from the median of the cooling flow rate requirement ranges of the cooling medium of all surfaces corresponding to the current sub-region in the current temperature stage; Step S33: Obtain a third sample in which the current type of copper mesh and the current type of temperature equalizing plate are welded according to the welding requirements, and when a cooling test is performed at the first flow rate of the cooling medium in each temperature stage of each cooling nozzle (2), obtain the actual cooling rate of each surface of each sub-area in each temperature stage, and determine the target flow rate of the cooling medium in each temperature stage corresponding to each cooling nozzle (2).

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